Thin film deposition device

Abstract

The thin film deposition device comprises a deposition box, a heating part, a transfer part, a power box and a power sealing part, the deposition box comprises a box body and a box cover, a vacuum cavity is defined by the box body and the box cover, an air injection disc is arranged at the upper end in the box cover, and a first mounting hole is formed in the lower end in the box body; the heating part comprises a heating disc; the transfer part comprises a mounting body, and the lower end of the mounting body extends into the first mounting hole; the power box is located below the deposition box, the power sealing part is installed on the power box, and the upper end of the power sealing part is connected with the lower end of the installation body in the first installation hole. The lower end of the supporting column is fixedly arranged on the power box, and the upper end of the supporting column sequentially penetrates through the power sealing part and the through hole in the middle of the mounting body upwards into the vacuum cavity and abuts against the lower end in the box cover. According to the thin film deposition device, the supporting columns are independently arranged, so that the parallelism of the air spraying disc on the box cover and the wafer on the heating disc can be kept, the uniformity of air flow sprayed to the wafer through the spraying plate is improved, and the uniformity of wafer thin film deposition is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a thin film deposition apparatus. Background Technology

[0002] A wafer is a substrate used to fabricate semiconductor devices. To fabricate semiconductor devices (such as integrated circuits, semiconductor light-emitting devices, etc.), wafers need to be placed in a semiconductor processing vacuum chamber for heating and deposition processes (such as chemical vapor deposition (CVD) and plasma-enhanced chemical vapor deposition (PECVD).

[0003] However, as the number of wafers processed simultaneously in the vacuum chamber increases, the volume of the vacuum chamber also increases. However, the chamber cover is more prone to bending and deformation under vacuum force, which affects the parallelism between the jet disk at the chamber cover and the wafer, thus affecting the uniformity of thin film deposition. Summary of the Invention

[0004] This invention provides a thin film deposition apparatus that maintains the parallelism between the jet plate on the cover and the wafer on the heating plate by independently setting support columns to support the cover, thereby improving the uniformity of the airflow sprayed onto the wafer through the spray plate and ensuring the uniformity of wafer thin film deposition.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A thin film deposition apparatus includes a deposition chamber, a heating section, a transfer section, a power unit, and a power sealing section. The deposition chamber includes a chamber body and a chamber cover, which together form a vacuum chamber. A first mounting hole is provided at the lower end of the chamber body. The heating unit includes a heating plate disposed inside the vacuum cavity for placing and heating the wafer; The transfer unit is used to transfer the wafer onto the heating plate, and it includes a mounting body, the lower end of which extends into the first mounting hole; The power box is located below the sedimentation tank. The power sealing part is installed in the power box, and its upper end is connected to the lower end of the mounting body in the first mounting hole and abuts against the lower end face of the box body to seal the first mounting hole. It also includes a support column, the lower end of which is fixed to the power box, and the upper end of which passes through the power sealing part and the through hole in the middle of the mounting body and into the vacuum cavity. The upper end of the support column abuts against the lower end of the box cover.

[0006] Preferably, the central axes of the first mounting hole, the vacuum chamber, the box cover, and the support column are aligned.

[0007] Preferably, the support column is configured as a conductor and is grounded.

[0008] Preferably, the support column includes a column body and an annular buffer and an elastic conductive element disposed on the upper end face of the column body. The elastic conductive element is disposed inside the annular buffer, and both the annular buffer and the elastic conductive element abut against the lower end of the inner side of the box cover. The column body is grounded.

[0009] Preferably, the power sealing part includes a power part and a sealing part. The power part is disposed in the power box, and the sealing part is sealed between the power part and the first mounting hole. The upper end of the sealing part is connected to the lower end of the mounting body in the first mounting hole. The power box has an opening at the top, and the lower end of the sealing part is connected to the opening at the top of the power box to seal the opening.

[0010] Preferably, the sealing part includes an outer support plate, a middle rotating plate, and an inner support plate, which are sequentially sleeved from the outside to the inside; Magnetic fluid is provided in the sealed space between the outer support plate and the inner support plate and the middle rotating plate, and sealed bearings are provided above and below the magnetic fluid. The upper and lower ends of the outer support plate are respectively connected to the housing and the power box; The upper end of the rotary plate extends into the first mounting hole and is fixedly connected to the lower end of the transfer part located in the first mounting hole, and the lower end is fixedly connected to the output end of the power part. The inner support plate is connected to the support column.

[0011] Preferably, the support column includes a first column, a second column, and a third column from bottom to top, wherein the first column is fixedly connected to the second column, and the lower end of the second column is detachably fixedly connected to the third column; The first column passes through the power unit, the second column passes through the sealing unit, and the third column passes through the mounting body into the vacuum chamber.

[0012] Preferably, a first hole is vertically provided in the middle of the power sealing part, the lower part of the first column is located in the first hole, and it can be detached from the bottom of the power box; A fixing post is sleeved on the lower outer periphery of the first column. The fixing post is located inside the first hole and fixedly connected to the bottom of the power box. The inner side of the fixing post abuts against the outer side of the first column. The fixing post is spaced apart from the first hole.

[0013] Preferably, the heating section further includes a first lifting section and a second lifting section; The first lifting part includes a first lifting component, a first lifting column, and a first elastic sealing component. The first lifting component is located below the housing. The lower end of the first lifting column is connected to the first lifting component, and the upper end passes through the housing and is connected to the heating plate inside the vacuum chamber. The upper and lower ends of the first elastic sealing component are respectively connected to the lower end of the housing and the first lifting component. The first elastic sealing component is sleeved on the outer periphery of the first lifting column. The second lifting part includes a second lifting member, a second lifting column, a second elastic seal, a mounting plate, and a lifting pin. The second lifting member is located below the housing. The lower end of the second lifting column is connected to the second lifting member, and the upper end passes through the housing and is connected to the mounting plate inside the vacuum chamber. The lower end of the lifting pin is connected to the mounting plate, and the upper end can pass upward through the mounting plate and is located above the mounting plate. The upper and lower ends of the first elastic seal are respectively connected to the lower end of the housing and the first lifting member. The first elastic seal is sleeved on the outer periphery of the first lifting column.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. By setting a support column independent of the transfer section and the power sealing section, the upper end of the support column can abut against the lower end face of the box cover, which can support the box cover from below, so that the box cover can obtain external support force and have the ability to resist downward bending deformation, ensuring the parallelism between the jet disk installed on the box cover and the wafer below, so that the thin film deposition on the wafer is uniform.

[0015] 2. The support column extends upward through the through hole in the middle of the power seal and the mounting body to the vacuum chamber. By occupying the space in the middle of the power seal and the mounting body, it obtains an independent installation space, making the overall structure more compact and smaller in size.

[0016] 3. The ring-shaped buffer piece set at the top of the inner column of the support column supports the box cover, avoiding direct contact between the two metal parts of the box cover and the column, which could cause scratches and generate particulate contamination of the cavity; the elastic conductive piece set at the top of the inner column of the support column maintains a reliable elastic contact with the box cover, ensuring reliable grounding.

[0017] 4. The support column is located in the center of the deposition tank and contacts the center of the tank cover. This allows for faster and more uniform discharge of the charge from the large tank cover without affecting the stability of the electric field inside the chamber. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a cross-sectional view of a thin film deposition apparatus according to an embodiment of the present invention; Figure 2 This is a cross-sectional view of the deposition tank, heating section, and transfer section according to an embodiment of the present invention; Figure 3 This is a cross-sectional view of the power box, support column, and sealing part in an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Deposition chamber; 11. Chamber body; 111. First mounting hole; 112. Second mounting hole; 113. Third mounting hole; 12. Chamber cover; 13. Jet plate; 14. Vacuum chamber; 2. Heating section; 21. Heating plate; 22. First lifting section; 221. First lifting component; 222. First lifting column; 223. First elastic seal; 23. Second lifting section; 231. Second lifting component; 232. Second lifting column; 233. Second elastic seal; 234. Mounting plate; 235. Lifting pin; 3. Transfer section; 31. Transfer gripper; 32. Mounting body; 321. Third hole; 4. Power box; 5. Power unit; 51. Power component; 52. Annular drive plate; 53. First hole; 6. Sealing part; 61. Outer support plate; 62. Middle rotating plate; 63. Inner support plate; 631. Second hole; 64. Magnetofluid; 65. Sealed bearing; 7. Support column; 71. Annular buffer; 72. Elastic conductive element; 73. First column; 74. Second column; 75. Third column; 8. Fixed column. Detailed Implementation

[0021] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0024] This invention provides a thin film deposition apparatus, such as... Figures 1-3 As shown, the system specifically includes a deposition chamber 1, a heating section 2, a transfer section 3, a power unit 4, and a power sealing section 6. The deposition chamber 1 includes a chamber body 11 and a cover 12, forming a vacuum chamber 14. A jet disk 13 is installed on the upper surface of the cover 12, and the jet disk 13 is connected to an external gas pipe to spray gas into the vacuum chamber 14. A first mounting hole 111, communicating with the vacuum chamber 14, is provided on the lower surface of the chamber body 11 for placing and connecting the transfer section 3 and the power sealing section 6. Multiple heating sections 2 are provided, evenly distributed around the first mounting hole 111. Each heating section 2 includes a heating plate 21 located within the vacuum chamber 14 for placing and heating the wafer. The transfer section 3 includes a mounting body 32 and a transfer gripper 31, which is mounted on the mounting body. The upper part of the body 32 is located on the outer periphery of the vacuum chamber 14 and is used to transfer the wafer to the heating plate 21. The specific external transport mechanism transports the wafer to one of the heating plates 21. The transfer gripper 31 transfers the wafer on this heating plate 21 to other heating plates 21 by rotation, so that each heating plate 21 is equipped with a wafer, so that multiple wafers can be deposited in the vacuum chamber 14. The power box 4 is located below the deposition box 1, and the power sealing part 6 is installed on the power box 4. The upper end of the power sealing part 6 is connected to the lower end of the transfer part 3 in the first mounting hole 111 to drive the transfer part 3 and the transfer gripper 31 to rotate circumferentially. The upper end of the power sealing part 6 abuts against the lower end of the box body 11 to seal the first mounting hole 111, thereby sealing the vacuum chamber 14 to ensure the wafer deposition environment.

[0025] To ensure uniform film deposition on the wafer, the parallelism between the jet disk 13 on the cover 12 and the wafer must be guaranteed. The reactive gas ejected by the jet disk 13 must be uniformly distributed to the wafer surface to react and deposit a uniform film. If the reactive gas on the wafer surface is not uniform, the surface of the deposited film formed by the reaction between the wafer and the reactive gas will naturally not be uniform. Therefore, it is necessary to ensure the parallelism of the cover 12. However, the parallelism of the cover 12 will be affected by external pressure or bending deformation due to force when the vacuum chamber 14 is evacuated. Consequently, the parallelism between the jet disk 13 on the cover 12 and the wafer will also be affected, thus affecting the uniformity of film deposition on the wafer.

[0026] To address the aforementioned problems, in this embodiment, as follows: Figure 1 and Figure 3 As shown, the thin film deposition apparatus also includes a vertically arranged support column 7, wherein the lower end of the support column 7 is fixedly mounted on the power box 4, and the upper end is located in the vacuum chamber 14. The upper end of the support column 7 abuts against the lower inner surface of the box cover 12, which can support the box cover 12 from below, so that the box cover 12 receives external support force and has the ability to resist downward bending deformation, ensuring the parallelism between the jet disk 13 mounted on the box cover 12 and the wafer below, so that the thin film deposition on the wafer is uniform. Furthermore, the support column 7 extends into the vacuum chamber 14 by passing through the power sealing part 6 and the through hole in the middle of the mounting body 32 in sequence. On the one hand, the support column 7 is set independently and will not interfere with the power sealing part 6 driving the transfer part 3 to rotate to realize the transfer of the wafer. Moreover, the support column 7 passes through the mounting body 32 in the first mounting hole 111, so that the sealing part 6 does not seal the side end of the first mounting hole 111 and the vacuum chamber 14. On the other hand, the support column 7 obtains installation space by occupying part of the volume of the power sealing part 6 and the mounting body 32, making the overall structure more compact.

[0027] Specifically, in order to improve the support of the cover 12 and ensure that the axes of the first mounting hole 111, the vacuum chamber 14, the cover 12 and the column are aligned, the support column 7 is located at the center of the vacuum chamber 14 and the first mounting hole 111. This will not affect the reaction of the wafers on the heating plates 21 located around the first mounting hole 111. At the same time, it supports the center of the cover 12, so that the support force on the cover 12 is uniform and the deformation resistance is better.

[0028] During the thin film deposition process, charges accumulate on the cavity cover. If the charges on both sides of the cavity cover's central axis are uneven, an asymmetric electric field will be formed (especially in plasma processes such as PEALD and PECVD). This will also affect the trajectory of thin film ions generated by the reaction between the wafer and the reactive gas, resulting in uneven thin film deposition on the wafer surface. Therefore, in this embodiment, the support pillar 7 is set as a conductor, and the lower end of the support pillar 7 is grounded, so that the cover 12 is indirectly grounded, making it an equipotential body. This avoids the accumulation of charges in a certain place in the cover 12, thus preventing the formation of an asymmetric electric field. Furthermore, the support pillar 7 abuts against the center of the cover 12, which can ground the large cover 12 from the middle, improve the charge transfer efficiency at various points on the cover 12, further improve the uniformity of the electric field, and make the plasma density formed on the wafer more uniform, resulting in more uniform thin film deposition on the wafer.

[0029] Specifically, such as Figure 3 As shown, the support column 7 includes a column body, an annular buffer 71, and an elastic conductive element 72. The lower end of the column body is fixed to the power box 4, and the upper end extends vertically upward through the power sealing part 6 and the through hole in the middle of the mounting body 32 to the vacuum chamber 14. The column body is made of metal and grounded. The annular buffer 71 and the elastic conductive element 72 are installed on the upper end face of the column body. Both the annular buffer 71 and the elastic conductive element 72 abut against the lower end of the inner surface of the cover 12. The annular buffer 71 is used to separate the upper end face of the column body from the lower end face of the inner surface of the cover 12, preventing the two end faces from directly abutting and moving relative to each other, thus avoiding the generation of particulate matter. The elastic conductive element 72 is used to indirectly abut the cover of the chamber and the column body, forming a... The electrical connection path allows the charge on the cover 12 to be indirectly connected to the ground through the elastic conductive element 72 and the column. This avoids the generation of particulate matter and ensures a stable electrical connection between the cover 12 and the ground. The annular buffer 71 also acts as a buffer, reducing the downward impact force on the cover 12 to ensure the thin film deposition of the wafer in the vacuum chamber 14. Furthermore, the annular buffer 71 is located on the outer periphery of the elastic conductive element 72 to protect the elastic conductive element 72 from adhering to the outer surface of the elastic conductive element 72 and affecting its conductivity. The elastic conductive element 72 is configured as an annular contact spring.

[0030] Specifically, such as Figure 3As shown, the power sealing part 6 includes a power part 5 and a sealing part 6. The power part 5 is installed inside the power box 4, and the sealing part 6 is sealed between the power part 5 and the first mounting hole 111. The upper end of the power part 5 is connected to the lower end of the sealing part 6, and the upper end of the sealing part 6 is connected to the lower end of the mounting body 32 inside the first mounting hole 111. Thus, the power part 5 can drive the mounting body 32 and the transfer gripper 31 to rotate circumferentially through the sealing part 6 to rotate the wafer. The upper end of the sealing part 6 abuts against the lower outer surface of the box 11 to seal the first mounting hole 111, thereby sealing the vacuum chamber 14. The power box 4 has an opening at the upper end, and the lower end of the sealing part 6 can be connected to the opening at the upper end of the power box 4 to act as the top cover of the power box 4 to seal its opening, making the connection structure more compact.

[0031] Specifically, such as Figure 3 As shown, the sealing part 6 includes an outer support plate 61, a middle rotating plate 62, and an inner support plate 63, which are sequentially arranged from the outside to the inside. The inner support plate 63 and the outer support plate 61 form inner and outer sealing spaces with the middle rotating plate 62, respectively. Magnetorheological fluid 64 is disposed in both the inner and outer sealing spaces, and sealing bearings 65 are provided at the upper and lower parts of the inner and outer sealing spaces to seal the magnetorheological fluid 64 within the sealing spaces, forming a double magnetorheological fluid 64 sealing structure to seal the vacuum chamber 14. The limiting structure of the sealing bearings 65 is not described in detail here, but can be achieved by setting an outer support plate and providing annular limiting protrusions at the upper and lower parts of the outer support plate 61, the middle rotating plate 62, and the inner support plate 63. The lower end of the middle rotating plate 62 is connected to the output end of the power unit 5, and the upper end of the middle rotating plate 62 extends into the first mounting hole 111 and connects to the lower end of the mounting body 32, so that the power unit 5 can drive the mounting body 32 and the transfer gripper through the middle rotating plate 62. The cylinder rotates 31 circumferentially; the inner support plate 63 is snapped and fixed to the middle section of the column for support. It should be noted that the inner magnetic fluid 64 structure formed between the inner support plate 63 and the middle rotating plate 62 corresponds to the inner mounting gap between the outer side of the upper column and the inner side of the mounting body 32. The inner magnetic fluid 64 structure can seal the inner mounting gap and the vacuum cavity 14. The lower end of the outer support plate 61 is fixed to the opening of the power box 4 to seal the opening. The upper end face is located on the outer periphery of the middle rotating plate 62 and the first mounting hole 111 and abuts against the lower outer end face of the box 11 to seal the entire edge of the first mounting hole 111. It should be noted that the outer magnetic fluid 64 structure formed between the outer support plate 61 and the middle rotating plate 62 corresponds to the outer mounting gap between the inner side of the upper first mounting hole 111 and the outer side of the mounting body 32. The outer magnetic fluid 64 structure and the outer support plate 61 can seal the outer mounting gap and the vacuum cavity 14.

[0032] Specifically, the power unit 5 includes a power component 51 and an annular drive plate 52 connected to the output end of the power component 51. The annular drive plate 52 is fixedly connected to the intermediate rotating plate 62, so that the power component 51 drives the intermediate rotating plate 62 to rotate circumferentially through the annular drive plate 52.

[0033] Specifically, such as Figure 3 As shown, the aforementioned column includes a first column 73, a second column 74, and a third column 75 from bottom to top. The power unit 5 has a first hole 53 at its central axis, and the sealing part 6 has a second hole 631 at its central axis (i.e., the inner support plate 63 forms the second hole 631). The mounting body 32 has a third hole 321 at its central axis. The lower end of the first column 73 is located within the first hole 53 and connected to the lower end face of the power box 4. The first column 73 passes upward through the first hole 53 and is fixedly connected to the lower end face of the second column 74, specifically by welding. To increase the overall strength of the first column 73 and the second column 74, the second column 74 passes upward through the second hole 631 and is detachably and fixedly connected to the lower end of the third column 75. The third column 75 passes upward through the third hole 321 and is located in the vacuum chamber 14. Specifically, a stud is provided on the second column 74 and a threaded hole is provided on the lower end face of the third column 75. The stud and the threaded hole are connected to each other so that the second column 74 and the third column 75 can be detachably and fixedly connected to facilitate the replacement of the third column 75.

[0034] Specifically, the first column 73 is fixed by external bolts passing through the lower outer end face of the power box 4 and threaded to the lower end face of the first column 73. In order to make the fixation of the first column 73 more stable, a fixing column 8 is sleeved on the lower outer periphery of the first column 73. The fixing column 8 is also located in the first through hole and fixedly connected to the lower inner end face of the power box 4. The inner side of the fixing column 8 abuts against the outer side of the first column 73 to fix the first column 73 vertically. The fixing column 8 and the first hole 53 are spaced apart to prevent the slight vibration of the power unit 5 from being transmitted to the first column 73 and the box 11 through the fixing column 8.

[0035] Specifically, such as Figure 2 As shown, the heating part 2 also includes a first lifting part 22 and a second lifting part 23. The first lifting part 22 is used to lift the heating plate 21, and the second lifting part 23 is used to lift the wafer in the vertical direction, so that the wafer can be unloaded from the transfer gripper 31, or to lift the wafer to the transfer gripper 31 so that the wafer can be gripped.

[0036] The first lifting part 22 specifically includes a first lifting member 221, a first lifting column 222, and a first elastic sealing member 223. The first lifting member 221 is located below the housing 11. The lower end of the first lifting column 222 is connected to the first lifting member 221, and the upper end passes through the second mounting hole 112 provided in the housing 11 and is fixedly connected to the heating plate 21 in the vacuum chamber 14. Thus, the first lifting member 221 can drive the heating plate 21 to move up and down through the first lifting column 222. The upper and lower ends of the first elastic sealing member 223 are respectively connected to the lower outer end face of the housing 11 and the first lifting member 221, and the first elastic sealing member 223 is sleeved on the outer periphery of the first lifting column 222 to seal the second mounting hole 112. The first lifting member 221 can be a cylinder, and the first elastic sealing member 223 can be a bellows.

[0037] The second lifting section 23 includes a second lifting member 231, a second lifting column 232, a second elastic seal 233, a mounting plate 234, and a lifting pin 235. The second lifting member 231 is located below the housing 11. The lower end of the second lifting column 232 is connected to the second lifting member 231, and the upper end passes through the third mounting hole 113 provided in the housing 11 and is connected to the mounting plate 234 in the vacuum chamber 14. The lower end of the lifting pin 235 is connected to the mounting plate 234, and the upper end can pass upward through the mounting plate 234 and be located above the mounting plate 234, so that the second lifting member 231 can pass through the second lifting column. 232 drives the mounting plate 234 to move up and down, and the mounting plate 234 drives the lifting pin 235 to move up and down, so that the wafer is unloaded from the transfer gripper 31, or the wafer is lifted to the transfer gripper 31 so that the wafer can be gripped. The upper and lower ends of the first elastic seal 223 are connected to the lower outer end of the housing 11 and the first lifting member 221, respectively. The first elastic seal 223 is sleeved on the outer periphery of the first lifting column 222 to seal the third mounting hole 113. The second lifting member 231 can be a cylinder, and the second elastic seal 233 can be a bellows.

[0038] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A thin film deposition apparatus, characterized in that, Includes sedimentation tank, heating unit, transfer unit, power unit, and power sealing unit: The deposition chamber includes a chamber body and a chamber cover, which together form a vacuum chamber. The bottom of the vacuum chamber is provided with a first mounting hole. The heating unit includes a heating plate disposed inside the vacuum cavity for placing and heating the wafer; The transfer unit is used to transfer the wafer onto the heating plate, and it includes a mounting body, the lower end of which extends into the first mounting hole; The power box is located below the sedimentation tank. The power sealing part is installed in the power box, and its upper end is connected to the lower end of the mounting body in the first mounting hole and abuts against the lower end face of the box body to seal the first mounting hole. It also includes a support column, the lower end of which is fixed to the power box, and the upper end of which passes through the power sealing part and the through hole in the middle of the mounting body and into the vacuum cavity. The upper end of the support column abuts against the lower end of the box cover.

2. The thin film deposition apparatus according to claim 1, characterized in that, The central axes of the first mounting hole, the vacuum chamber, the box cover, and the support column are aligned.

3. The thin film deposition apparatus according to claim 1, characterized in that, The support column is configured as a conductor and is grounded.

4. The thin film deposition apparatus according to claim 3, characterized in that, The support column includes a column body and an annular buffer and an elastic conductive element disposed on the upper end face of the column body. The elastic conductive element is disposed inside the annular buffer. Both the annular buffer and the elastic conductive element abut against the lower end of the inner side of the box cover. The column body is grounded.

5. The thin film deposition apparatus according to claim 1, characterized in that, The power sealing part includes a power part and a sealing part. The power part is disposed inside the power box. The sealing part is sealed between the power part and the first mounting hole. The upper end of the sealing part is connected to the lower end of the mounting body inside the first mounting hole. The power box has an opening at the top, and the lower end of the sealing part is connected to the opening at the top of the power box to seal the opening.

6. The thin film deposition apparatus according to claim 5, characterized in that, The sealing part includes an outer support plate, a middle rotating plate and an inner support plate, which are sequentially sleeved from the outside to the inside. Magnetic fluid is provided in the sealed space between the outer support plate and the inner support plate and the middle rotating plate, and sealed bearings are provided above and below the magnetic fluid. The upper and lower ends of the outer support plate are respectively connected to the housing and the power box; The upper end of the rotary plate extends into the first mounting hole and is fixedly connected to the lower end of the transfer part located in the first mounting hole, and the lower end is fixedly connected to the output end of the power part. The inner support plate is connected to the support column.

7. The thin film deposition apparatus according to claim 5, characterized in that, The support column includes a first column, a second column, and a third column from bottom to top. The first column is fixedly connected to the second column, and the lower end of the second column is detachably fixedly connected to the third column. The first column passes through the power unit, the second column passes through the sealing unit, and the third column passes through the mounting body into the vacuum chamber.

8. The thin film deposition apparatus according to claim 7, characterized in that, The power sealing part has a first hole vertically arranged in the middle, the lower part of the first column is located in the first hole, and can be detached from the bottom of the power box; A support column is sleeved on the lower outer periphery of the first column. The support column is located inside the first hole and fixedly connected to the bottom of the power box. The inner side of the support column abuts against the outer side of the first column. The support column is spaced apart from the first hole.

9. The thin film deposition apparatus according to claim 1, characterized in that, The heating section further includes a first lifting section and a second lifting section; The first lifting part includes a first lifting component, a first lifting column, and a first elastic sealing component. The first lifting component is located below the housing. The lower end of the first lifting column is connected to the first lifting component, and the upper end passes through the housing and is connected to the heating plate inside the vacuum chamber. The upper and lower ends of the first elastic sealing component are respectively connected to the lower end of the housing and the first lifting component. The first elastic sealing component is sleeved on the outer periphery of the first lifting column. The second lifting part includes a second lifting member, a second lifting column, a second elastic seal, a mounting plate, and a lifting pin. The second lifting member is located below the housing. The lower end of the second lifting column is connected to the second lifting member, and the upper end passes through the housing and is connected to the mounting plate inside the vacuum chamber. The lower end of the lifting pin is connected to the mounting plate, and the upper end can pass upward through the mounting plate and is located above the mounting plate. The upper and lower ends of the first elastic seal are respectively connected to the lower end of the housing and the first lifting member. The first elastic seal is sleeved on the outer periphery of the first lifting column.

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