Efficient semiconductor laser pumping module

Abstract

The invention provides an efficient semiconductor laser pumping module, and relates to the technical field of semiconductor lasers. The module comprises a liquid cooling radiator and a bar subassembly, a first chamber and a second chamber are sequentially arranged in the liquid cooling radiator in the direction away from a mounting surface, and a plurality of jet holes are formed in a partition wall between the first chamber and the second chamber. The upper end of the liquid cooling radiator is provided with a first water inlet channel communicated with the second cavity, and the lower end of the liquid cooling radiator is provided with a first water outlet channel communicated with the first cavity. The mounting surface of the liquid cooling radiator comprises two symmetrically arranged bar mounting parts, the bar mounting parts are obliquely arranged, and the two bar mounting parts jointly form an angular structure with an opening back on to one side of the liquid cooling radiator. The bar subassembly comprises two bar parts, and the two bar parts are arranged on the two bar installation parts respectively. The module can effectively improve the heat dissipation efficiency and reduce the complexity of an optical system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser technology, and more specifically to a high-efficiency semiconductor laser pumping module. Background Technology

[0002] Semiconductor lasers possess excellent characteristics such as high efficiency, compact structure, wide wavelength range, low cost, and high reliability. In recent years, with the advancement of high-power semiconductor technology and the rapid development of the laser application market, high-power semiconductor laser pump sources have shown extremely broad application prospects and enormous application value in fields such as materials processing, intelligent manufacturing, and national defense.

[0003] With fierce competition in the laser pump market, higher requirements are being placed on the cost, size, weight, and reliability of laser pump sources. Existing laser pump modules mainly employ two heat dissipation methods: conductive cooling and liquid cooling, and achieve beam homogenization through multi-stage optical systems. For example, CN223039387U discloses a dual-row packaged semiconductor laser, which is mainly used in the medical aesthetics field. Internally, heat dissipation is enhanced through heat dissipation teeth, slow axis is compressed using lenses, and beam homogenization is achieved through a light-guiding crystal.

[0004] However, when faced with high-power pump modules, the above products have low heat dissipation efficiency, and it is difficult for the modules to achieve higher power under high heat flux density conditions. At the same time, the optical system is complex, and the modules are large in size and heavy. Summary of the Invention

[0005] To address the aforementioned issues, this application provides a high-efficiency semiconductor laser pumping module that can effectively improve heat dissipation efficiency and reduce the complexity of the optical system, thereby reducing the overall size and weight of the module.

[0006] The technical solution adopted by this invention to solve its technical problem is: A high-efficiency semiconductor laser pumping module includes a liquid-cooled heat sink and a bar assembly disposed on the mounting surface of the liquid-cooled heat sink. The liquid-cooled heat sink has a first chamber and a second chamber arranged sequentially in a direction away from the mounting surface, and a plurality of jet holes are evenly distributed on the partition wall between the first chamber and the second chamber. The upper end of the liquid-cooled radiator is provided with a first water inlet channel communicating with the second chamber, and the lower end of the liquid-cooled radiator is provided with a first water outlet channel communicating with the first chamber. The cooling medium in the second chamber is sprayed through the jet holes and impacts the heat source side of the first chamber; The mounting surface of the liquid cooler includes two symmetrically arranged bar mounting portions, which are inclined and together form an angular structure with the opening facing away from the liquid cooler. The beam assembly includes two beam components, which are respectively disposed on two beam mounting parts. The beams output by the two beam components are combined in space to compensate for the inherent difference in beam quality between the fast and slow axes. A cylindrical lens is provided on the light-emitting side of the laser bar component.

[0007] Furthermore, the heat source side of the first chamber is provided with an irregularly shaped microstructure.

[0008] Furthermore, both ends of the cylindrical lens are connected to the liquid-cooled radiator via lens brackets. The lens brackets include a middle bracket and an end bracket. The middle bracket is located between the two bar components, and a third recess is provided in the middle of the middle bracket.

[0009] Furthermore, it also includes a packaging base, which is provided with a second water inlet channel and a second water outlet channel. The second water inlet channel is connected to the first water inlet channel, and the second water outlet channel is connected to the first water outlet channel. The inlet of the second water inlet channel and the outlet of the second water outlet channel are both located on the lower side of the packaging base.

[0010] Furthermore, the encapsulation base is detachably fixedly connected to the liquid cooling radiator, and a first sealing ring surrounding the water inlet channel and a second sealing ring surrounding the water outlet channel are provided between the liquid cooling radiator and the encapsulation base.

[0011] Furthermore, a cover is provided on the side of the encapsulation base facing the liquid cooling heat sink, and the cover and the encapsulation base together form a cavity. An optical opening is provided on the light-emitting side of the bar assembly on the cover, and an optical dustproof window is provided at the optical opening.

[0012] Furthermore, the inner and outer sides of the optical dustproof window are respectively coated with a film layer, and the film layer has high transmittance to the wavelength of the working band.

[0013] Furthermore, the outer film layer reflects light beams in non-working wavelength bands.

[0014] Furthermore, the laser bar component includes a substrate, on which a plurality of first heat sinks are arranged vertically along the side facing away from the liquid cooler, and a laser bar is arranged between two adjacent first heat sinks. A first electrode sheet is arranged on the substrate, and the substrates of two laser bar components are connected by connecting electrodes.

[0015] Furthermore, the substrate includes a main board body, a first metal layer is provided on the side of the main board body facing the laser bar, the first metal layer is provided with disconnection areas corresponding to the laser bar, a second metal layer is provided on the side of the main board body facing away from the laser bar, and the substrate is fixedly connected to the liquid cooling heat sink by solder sintering.

[0016] The beneficial effects of this invention are: 1. The high-efficiency semiconductor laser pump module provided in this application adopts a liquid-cooled heat exchanger, and combined with its internal porous jet structure and irregular microstructure on the back of the heat source, it can enable the cooling medium to directly impact the surface of the heat source, which greatly improves the heat transfer efficiency and ensures effective heat dissipation of the bar array under high power operation.

[0017] 2. The mounting surface of the liquid-cooled heat exchanger of the high-efficiency semiconductor laser pump module provided in this application embodiment is designed with a specific V-shaped angle, so that the light spots of the two rows of bars can be superimposed. This structural design not only effectively reduces the adverse effects caused by the excessive difference between the divergence angles of the fast axis and the slow axis of the laser, but also uniformly fills the dark area of ​​the light spot between the two bar arrays, thereby effectively improving the quality of the output light spot.

[0018] 3. The high-efficiency semiconductor laser pump module provided in this application creatively combines optical design with structural design, and partially internalizes the beam combining and homogenization functions that are traditionally completed by external complex optical systems into the mechanical structure of the pump module, thereby achieving high-quality output spot while realizing the compact size of the laser system.

[0019] 4. The optical dustproof window used in the high-efficiency semiconductor laser pump module provided in this application embodiment not only plays a basic dustproof and sealing role, but is also coated with a film layer. The film layer can not only ensure that the beam in the working band can pass smoothly to reduce laser loss, but also effectively reflect the beam in the non-working band. It can reflect stray pump light that may damage the bar cavity surface back, providing dual protection for the core device and further improving the efficiency and reliability of the module. Attached Figure Description

[0020] Figure 1 A three-dimensional structural schematic diagram of a high-efficiency semiconductor laser pumping module provided for an embodiment of this application; Figure 2 A front view of a high-efficiency semiconductor laser pumping module provided in an embodiment of this application; Figure 3 for Figure 2 AA section view in the middle; Figure 4 for Figure 3 A magnified structural diagram of part A in the middle; Figure 5 for Figure 2 BB section view in the middle; Figure 6 for Figure 5 A magnified structural diagram of part B in the middle section; Figure 7 for Figure 2 CC section view in the middle; Figure 8 for Figure 7 A magnified structural diagram of section C; Figure 9 An explosion view of a high-efficiency semiconductor laser pumping module provided in this application embodiment Figure 1 ; Figure 10 for Figure 9 A magnified structural diagram of section D; Figure 11 An explosion view of a high-efficiency semiconductor laser pumping module provided in this application embodiment Figure 2 ; Figure 12 A three-dimensional structural diagram of the bar assembly; Figure 13 An explosion of a liquid-cooled radiator Figure 1 ; Figure 14 An explosion of a liquid-cooled radiator Figure 2 ; Figure 15 This is a three-dimensional structural diagram of the packaging base.

[0021] In the diagram: 1. Liquid-cooled radiator; 11. Radiator body; 111. Second chamber; 112. Jet hole; 113. First water inlet channel; 114. First water outlet channel; 115. Second recess; 116. First sealing groove; 117. Second sealing groove; 118. Seventh recess; 12. Front cover plate; 121. Bar mounting part; 122. First recess; 123. Fourth recess; 124. Fifth recess; 13. First chamber; 14. Sixth recess; 2. Laser bar assembly; 21. Laser bar component; 211. Substrate; 2111. Main board; 2112. First metal layer; 2113. Second metal layer; 212. First heat sink; 213. Laser bar; 214. First electrode sheet; 215. Second heat sink; 22. Connecting electrode; 3. Cylindrical lens; 41. Intermediate support; 411. Third recess; 42. End support; 5. Encapsulation base; 51. Second water inlet channel; 52. Second water outlet channel; 53. Clearance hole; 61. First sealing ring; 62. Second sealing ring; 7. Housing; 71. Optical opening; 72. Optical dustproof window; 8. Electrical interface; 81. Second electrode plate; 9. Third electrode plate. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings. The described embodiments are merely a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort should fall within the protection scope of this application.

[0023] To facilitate understanding of the specific embodiments of this application, a coordinate system is now defined as follows: Figure 1 As shown, the left and right directions are horizontal, the front and back directions are vertical, and the up and down directions are vertical.

[0024] like Figure 1 and Figure 3 As shown, a high-efficiency semiconductor laser pumping module includes a liquid-cooled heat sink 1, and a bar assembly 2 is provided on the mounting surface of the liquid-cooled heat sink 1. According to... Figure 1 In the coordinate system shown, the front side of the liquid cooler 1 is the mounting surface, and the bar assembly 2 is fixedly installed on the front side of the liquid cooler 1.

[0025] like Figure 3 and Figure 4 As shown, the liquid-cooled radiator 1 has a first chamber 13 and a second chamber 111 arranged sequentially along a direction perpendicular to the mounting surface, and a plurality of jet holes 112 are evenly distributed on the partition wall between the first chamber 13 and the second chamber 111. The upper end of the liquid-cooled radiator 1 is provided with a first water inlet channel 113 communicating with the second chamber 111, and the lower end of the liquid-cooled radiator 1 is provided with a first water outlet channel 114 communicating with the first chamber 13. After the cooling medium enters the second chamber 111 through the first water inlet channel 113, it is sprayed through the jet holes 112 between the first chamber 13 and the second chamber 111 and impacts the front wall (i.e., the heat source side) of the first chamber 13, thereby carrying away the heat transferred from the bar assembly 2 to the front wall of the first chamber 13, achieving timely and efficient heat dissipation for the bar assembly 2. Then the cooling medium in the first chamber 13 will flow out through the first water outlet channel 114. In practical applications, the working pressure of the cooling medium can be adjusted so that the cooling medium can be sprayed evenly onto the front wall of the first chamber 13.

[0026] By setting the jet hole 112, the cooling medium can be evenly sprayed onto the heat source side, which can not only effectively improve the heat dissipation efficiency, but also reliably ensure the uniformity of heat dissipation and avoid the problem of local overheating.

[0027] like Figure 12 As shown, the bar assembly 2 includes two identical and symmetrically arranged bar components 21. Each bar component 21 includes a substrate 211. Multiple first heat sinks 212 are evenly distributed vertically on the side of the substrate 211 facing away from the liquid-cooled radiator 1, and a laser bar 213 is positioned between adjacent first heat sinks 212. The heat sinks are made of tungsten copper or copper-diamond composite material, and their coefficient of thermal expansion matches that of the laser bar 213 to reduce thermal stress. A first electrode plate 214 is disposed on the substrate 211. The substrate 211, first heat sinks 212, laser bar 213, and first electrode plate 214 are packaged into a single unit using a soldering process. For example, the soldering process employs a highly reliable hard soldering technique, and the solder used can include high-temperature eutectic solders such as AuSn or AuGe.

[0028] The substrates 211 of the two laser bar components 21 are connected by connecting electrodes 22, thereby making the two laser bar arrays 213 connected in series and conductive.

[0029] like Figure 5 and Figure 11 As shown, the mounting surface of the liquid-cooled radiator 1 includes two symmetrically arranged bar mounting portions 121, according to... Figure 1 In the coordinate system shown, the two aforementioned bar mounting portions 121 are arranged symmetrically to the left and right. The bar mounting portions 121 are arranged at an angle, and the two aforementioned bar mounting portions 121 together form an opening facing away from the liquid-cooled radiator 1 (according to...). Figure 1 The coordinate system shown is the front side) of the angular structure (i.e., V-shaped). The included angle β between the two bar mounting parts 121 is confirmed by simulation through an optical scheme.

[0030] The two bar components 21 of the bar assembly 2 are respectively disposed on the two bar mounting portions 121. The bar assembly 2 is in an inclined state, and the two bar assemblies 2 together form an opening facing away from the liquid cooler 1 (according to...). Figure 1 The coordinate system shown is a front-side angular structure (i.e., a V-shaped angle). The two laser bar arrays 213 are designed with a specific V-shaped angle to allow the beams output from the two laser bar arrays 213 to be spatially combined, thereby compensating for the inherent difference in beam quality between the fast and slow axes.

[0031] like Figure 8 and Figure 10Each laser bar 213 has a cylindrical lens 3 on its light-emitting side. The cylindrical lens 3 is parallel to the corresponding laser bar 213, and both ends of the cylindrical lens 3 are connected to the liquid-cooled heat sink 1 through lens brackets. The cylindrical lens 3 is used to independently shape the beam along the fast axis, compress the fast axis divergence angle, and ensure excellent consistency of the output beam.

[0032] Furthermore, the front sidewall of the first chamber 13 is provided with irregular microstructures, which can increase the surface area of ​​the front sidewall of the first chamber 13, thereby increasing the contact area with the cooling medium and improving the heat dissipation efficiency.

[0033] The combined effect of jet structure and irregular microstructure can significantly improve the convective heat transfer coefficient and overall heat dissipation capacity.

[0034] As one specific implementation method, such as Figure 4 and Figure 14 As shown, the irregular microstructure described in this embodiment is a plurality of first recesses 122 evenly distributed on the front sidewall of the first chamber 13. For example, the first recesses 122 are spherical structures.

[0035] As one specific implementation method, such as Figure 13 As shown, the liquid-cooled radiator 1 in this embodiment includes a radiator body 11 and a front cover plate 12. A second recess 115 is provided on the front side of the radiator body 11, and the second recess 115 is blocked by the front cover plate 12, thereby forming the first chamber 13. The second chamber 111 is located inside the radiator body 11. The first water inlet channel 113 is located at the upper end of the radiator body 11 and communicates with the second chamber 111. The first water outlet channel 114 is located at the lower end of the second recess 115 and penetrates the radiator body 11 in the front-rear direction. The front side of the front cover plate 12 is the mounting surface. Exemplarily, the front cover plate 12 is fixedly connected to the radiator body 11 by welding.

[0036] Furthermore, such as Figure 5 , Figure 10 and Figure 11As shown, the lens support includes a middle support 41 and two end supports 42. The middle support 41 is located between two bar components 21, and the two end supports 42 are located on the outer sides of the bar components 21 (with the opposite side of the two bar components 21 as the inner side). The outer end of the cylindrical lens 3 (with the opposite side of the two bar components 21 as the inner side) overlaps between the ends and is fixedly connected to the end supports 42 by means of adhesive bonding or the like; the inner end of the cylindrical lens 3 (with the opposite side of the two bar components 21 as the inner side) overlaps on the middle support 41 and is fixedly connected to the middle support 41 by means of adhesive bonding or the like, that is, the inner ends of the two rows of cylindrical lenses 3 share the middle support 41.

[0037] Furthermore, a third recess 411 is provided at the middle position of the intermediate support 41. For example, the cross-section of the third recess 411 is arc-shaped and extends through the intermediate support 41 in the vertical direction.

[0038] A third recess 411 is provided on the intermediate support 41. On the one hand, it can serve as a marker, so that when placing the cylindrical lens 3, we know roughly where to place it. Otherwise, it is easy for one side to overlap more and the other side to overlap less. On the other hand, it is also an overflow groove, so that when applying glue for curing after shaping, excess glue can flow into it, while increasing the adhesion.

[0039] Furthermore, such as Figure 10 and Figure 13 As shown, a fourth recess 123 for accommodating the intermediate bracket 41 is provided on the mounting surface between the two bar mounting portions 121, and a fifth recess 124 for accommodating the end bracket 42 is provided at the left and right ends of the mounting surface, and the fourth recess 123 and the fifth recess 124 penetrate the liquid cooler 1 in the vertical direction.

[0040] Furthermore, such as Figure 6 and Figure 8 As shown, the substrate 211 includes a main body 2111, which is made of a high thermal conductivity ceramic material (such as aluminum nitride with a thermal conductivity ≥230W / (m·K), or higher performance silicon carbide, gallium nitride, etc.). A first metal layer 2112 is provided on the side of the main body 2111 facing the laser bar 213. The first metal layer 2112 has disconnection areas corresponding to the laser bars 213. The laser bars 213 are located within their corresponding disconnection areas and are attached and fixed to the main body 2111. By precisely planning the first metal layer 2112 into disconnection areas with specific intervals, and accurately corresponding to the number and spacing of the laser bars 213, an optimized configuration of electrical interconnection and insulation is achieved.

[0041] Furthermore, a second metal layer 2113 is provided on the side of the motherboard body 2111 facing away from the laser bar 213, and the substrate 211 is fixedly connected to the liquid cooling heat sink 1 by solder sintering. By providing the second metal layer 2113 and fixing it to the liquid cooling heat sink 1 by solder sintering, not only can the reliability of the packaging structure be guaranteed, but also a good thermal conductivity can be ensured.

[0042] Furthermore, such as Figure 3 and Figure 11 As shown, a high-efficiency semiconductor laser pumping module further includes a packaging base 5, which is detachably fixedly connected to the liquid cooling heat sink 1. For example, the packaging base 5 is fixedly connected to the liquid cooling heat sink 1 by a first screw. The packaging base 5 is provided with a second water inlet channel 51 and a second water outlet channel 52. The second water inlet channel 51 is connected to a first water inlet channel 113, and the first water inlet channel 113 and the second water inlet channel 51 form a continuous and complete water inlet channel; the second water outlet channel 52 is connected to a first water outlet channel 114, and the first water outlet channel 114 and the second water outlet channel 52 form a continuous and complete water outlet channel.

[0043] The second water inlet channel 51 includes a horizontal water inlet channel portion. One end of the horizontal water inlet channel portion is connected to the first water inlet channel 113. The other end of the horizontal water inlet channel portion is provided with a vertical water inlet channel portion extending downward perpendicular to the horizontal water inlet channel portion, and the vertical water inlet channel portion penetrates downward through the packaging base 5.

[0044] The second water outlet channel 52 includes a horizontal water outlet channel portion. One end of the horizontal water outlet channel portion is connected to the first water outlet channel 114. The other end of the horizontal water outlet channel portion is provided with a vertical water outlet channel portion extending downward perpendicular to the horizontal water outlet channel portion, and the vertical water outlet channel portion penetrates downward through the encapsulation base 5.

[0045] Furthermore, such as Figure 3 As shown, a first sealing ring 61 surrounding the water inlet channel and a second sealing ring 62 surrounding the water outlet channel are provided between the liquid cooling radiator 1 and the encapsulation base 5. The first sealing ring 61 achieves the connection and sealing between the first water inlet channel 113 and the second water inlet channel 51, and the second sealing ring 62 achieves the connection and sealing between the first water outlet channel 114 and the second water outlet channel 52.

[0046] As one specific implementation method, such as Figure 14As shown, in this embodiment, the radiator body 11 of the liquid-cooled radiator 1 has a first sealing groove 116 for accommodating the first sealing ring 61 on its rear side around the water inlet end of the first water inlet channel 113; the radiator body 11 of the liquid-cooled radiator 1 has a second sealing groove 117 for accommodating the second sealing ring 62 on its rear side around the water outlet end of the first water outlet channel 114.

[0047] Furthermore, a cover 7 is provided on the front side of the encapsulation base 5. The cover 7 and the encapsulation base 5 together form a cavity for accommodating the liquid-cooled heat sink 1, the rotor assembly 2, the cylindrical lens 3, and the lens holder. The cover 7 is detachably fixedly connected to the encapsulation base 5. For example, the cover 7 is fixedly connected to the encapsulation base 5 by a second screw. An optical opening 71 is provided on the cover 7 on the light-emitting side of the rotor assembly 2 to allow the light beam to pass through. An optical dustproof window 72 is provided at the optical opening 71. For example, the optical dustproof window 72 is sealed and fixed at the optical opening 71 by UV-cured adhesive.

[0048] Furthermore, the inner and outer sides of the optical dustproof window 72 are coated with a film layer (not shown in the figure), and the film layer has high transmittance for the wavelength of the working band. The film layer is used to minimize the loss of transmitted light.

[0049] Furthermore, the outer film layer not only has high transmittance for wavelengths in the working band, but also reflects light beams in non-working bands. The reflection of non-working band light beams by the outer film layer can reflect any returning laser light away from the working cavity surface of the bar, providing effective optical protection and improving operational reliability.

[0050] Furthermore, such as Figure 1 and Figure 3 As shown, an electrical interface 8 is provided on the side of the encapsulation base 5 facing away from the liquid cooler 1, and the electrical interface 8 is fixedly connected to the encapsulation base 5 by means of screws or other detachable methods. The two second electrode plates 81 (including a positive electrode and a negative electrode) of the electrical interface 8 extend through the encapsulation base 5 to the side of the encapsulation base 5 facing the liquid cooler 1 (according to...). Figure 1 The coordinate system shown is the front side of the encapsulation base 5, and the two second electrode pieces 81 are respectively connected to the two first electrode pieces 214 of the bar assembly 2, thereby realizing circuit conduction. The encapsulation base 5 is provided with a clearance hole 53 for accommodating the second electrode pieces 81, and the clearance hole 53 penetrates the encapsulation base 5 in the front-back direction.

[0051] As one specific implementation method, such as Figure 10As shown, the first electrode sheet 214 in this embodiment includes a horizontal portion and a vertical portion, which together form an L-shaped structure. The lower end of the vertical portion of the first electrode sheet 214 is connected and fixed to the upper end of the substrate 211 by welding. The horizontal portion is located above the vertical portion and extends towards the packaging base 5. A third electrode sheet 9 is disposed between the corresponding first electrode sheet 214 and second electrode sheet 81. The third electrode sheet 9 has a single-bend structure with a bend angle of 90°. One end of the third electrode sheet 9 is connected to the second electrode sheet 81, and the other end of the third electrode sheet 9 is connected to the first electrode sheet 214. The third electrode sheet 9 and the second electrode sheet 81 can be connected and fixed by welding or by bolt tightening. Similarly, the third electrode sheet 9 and the first electrode sheet 214 can be connected and fixed by welding or by bolt tightening. For example, in this embodiment, the two ends of the third electrode sheet 9 are respectively connected and fixed to the first electrode sheet 214 and the second electrode sheet 81 by welding.

[0052] Furthermore, a sixth recess 14 is provided on the upper end surface of the liquid-cooled radiator 1 for accommodating the horizontal portion of the first electrode plate 214, and a seventh recess 118 is provided on the left and right sides of the upper end of the liquid-cooled radiator 1 for accommodating the vertical portions of the second electrode plate 81 and the third electrode plate 9, respectively.

[0053] Furthermore, a second heat sink 215 is provided on the side of the vertical portion of the first electrode sheet 214 facing away from the substrate 211, and the vertical portion of the first electrode sheet 214 is sandwiched between the substrate 211 and the second heat sink 215. By providing the second heat sink 215, poor soldering can be prevented and good electrical connectivity can be ensured.

[0054] Other embodiments obtained by those skilled in the art based on the embodiments provided in this application by combining, splitting, or reorganizing the embodiments of this application do not exceed the protection scope of this application.

[0055] The above detailed embodiments have provided a detailed explanation of the purpose, technical solutions, and beneficial effects of the embodiments of this application. The above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. That is, any modifications, equivalent substitutions, improvements, etc., made on the basis of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A high-efficiency semiconductor laser pumping module, comprising a liquid-cooled heat sink (1) and a bar assembly (2) disposed on the mounting surface of the liquid-cooled heat sink (1), characterized in that: The liquid-cooled radiator (1) has a first chamber (13) and a second chamber (111) arranged sequentially in the direction away from the mounting surface, and a plurality of jet holes (112) are evenly distributed on the partition wall between the first chamber (13) and the second chamber (111). The upper end of the liquid-cooled radiator (1) is provided with a first water inlet channel (113) that communicates with the second chamber (111), and the lower end of the liquid-cooled radiator (1) is provided with a first water outlet channel (114) that communicates with the first chamber (13). The cooling medium in the second chamber (111) is sprayed through the jet hole (112) and impacts the heat source side of the first chamber (13); The mounting surface of the liquid cooling radiator (1) includes two symmetrically arranged bar mounting parts (121). The bar mounting parts (121) are arranged at an angle, and the two bar mounting parts (121) together form an angular structure with the opening facing away from the liquid cooling radiator (1). The beam assembly (2) includes two beam components (21), which are respectively disposed on two beam mounting parts (121). The beams output by the two beam components (21) are combined in space to compensate for the inherent difference in beam quality between the fast and slow axes. A cylindrical lens (3) is provided on the light-emitting side of the laser bar (213) of the bar component (21).

2. The high-efficiency semiconductor laser pumping module according to claim 1, characterized in that: The heat source side of the first chamber (13) is provided with an irregular microstructure.

3. The high-efficiency semiconductor laser pumping module according to claim 1, characterized in that: The two ends of the cylindrical lens (3) are connected to the liquid cooling radiator (1) through lens brackets. The lens brackets include a middle bracket (41) and an end bracket (42). The middle bracket (41) is located between two bar components (21). A third recess (411) is provided in the middle of the middle bracket (41).

4. The high-efficiency semiconductor laser pumping module according to claim 1, characterized in that: It also includes a packaging base (5), which is provided with a second water inlet channel (51) and a second water outlet channel (52). The second water inlet channel (51) is connected to the first water inlet channel (113), and the second water outlet channel (52) is connected to the first water outlet channel (114). The inlet of the second water inlet channel (51) and the outlet of the second water outlet channel (52) are both located on the lower side of the packaging base (5).

5. The high-efficiency semiconductor laser pumping module according to claim 4, characterized in that: The encapsulation base (5) is fixedly connected to the liquid cooling radiator (1) in a detachable manner. A first sealing ring (61) surrounding the water inlet channel and a second sealing ring (62) surrounding the water outlet channel are provided between the liquid cooling radiator (1) and the encapsulation base (5).

6. The high-efficiency semiconductor laser pumping module according to claim 4, characterized in that: A cover (7) is provided on the side of the encapsulation base (5) facing the liquid cooling heat sink (1). The cover (7) and the encapsulation base (5) together form a cavity. An optical opening (71) is provided on the cover (7) on the light-emitting side of the bar assembly (2). An optical dustproof window (72) is provided at the optical opening (71).

7. A high-efficiency semiconductor laser pumping module according to claim 6, characterized in that: The inner and outer sides of the optical dustproof window (72) are coated with a film layer, and the film layer has high transmittance to the wavelength of the working band.

8. The high-efficiency semiconductor laser pumping module according to claim 7, characterized in that: The outer film layer reflects light beams in non-operating wavelength bands.

9. A high-efficiency semiconductor laser pumping module according to claim 1, characterized in that: The bar component (21) includes a substrate (211), on which a plurality of first heat sinks (212) are arranged vertically on the side facing away from the liquid cooler (1), and a laser bar (213) is arranged between two adjacent first heat sinks (212). A first electrode sheet (214) is arranged on the substrate (211), and the substrates (211) of the two bar components (21) are connected by connecting electrodes (22).

10. A high-efficiency semiconductor laser pumping module according to claim 9, characterized in that: The substrate (211) includes a main body (2111), a first metal layer (2112) is provided on the side of the main body (2111) facing the laser bar (213), the first metal layer (2112) is provided with disconnection areas corresponding to the laser bar (213), a second metal layer (2113) is provided on the side of the main body (2111) away from the laser bar (213), and the substrate (211) is fixedly connected to the liquid cooling heat sink (1) by solder sintering.

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