Highly integrated self-heat-dissipation power module and dual-motor controller

Abstract

The invention relates to the technical field of new energy motor controllers, and discloses a highly integrated self-heat-dissipation power module, which comprises a heat dissipation seat, a cooling liquid channel penetrates through the interior of the heat dissipation seat, and the upper surface and the lower surface of the heat dissipation seat form heat dissipation contact surfaces; the TPAK module is composed of one or more TPAK devices which are linearly arranged in a single row in the axial length direction of the heat dissipation base according to a preset parallel connection mode, the TPAK devices are arranged on the upper surface and the lower surface of the heat dissipation base, and the upper side and the lower side of each TPAK device are connected with the heat dissipation contact face of the heat dissipation base in a welded mode to form a two-way heat conduction path; a current equalizing copper bar; the TPAK device comprises an input power terminal and two groups of output power terminals which are electrically connected with the TPAK device. The objective of the invention is to solve the technical problems of non-uniform heat dissipation caused by insufficient heat dissipation efficiency and complex structural design of an existing power module, and to overcome the problems of poor adaptability in a high-power density scene, insufficient compatibility between devices of different specifications and difficulty in realizing platform universal deployment in a traditional scheme.

Description

Technical Field

[0001] This invention relates to the field of new energy motor controller technology, specifically a highly integrated self-heating power module and a dual-motor controller. Background Technology

[0002] With the rapid development of electric drive technology for new energy vehicles, electric drive systems are gradually showing a trend of multi-functionality, high power and small size. This trend has put forward an urgent need for the high integration and small size design of dual motor controllers. As one of the core components of dual motor controllers, the power module is a high heat generation unit. It is usually installed in the controller housing and uses a pin-fin water cooling structure for heat dissipation.

[0003] However, in traditional layout schemes, power modules are arranged in series on the water channels of the casing. This layout has inherent problems such as low space utilization and low three-dimensional arrangement freedom. These problems not only require customized development for specific application scenarios, which greatly increases the design complexity of electrical connections and cooling channels, but also result in a large system size, increased weight, and increased integration difficulty. Ultimately, this leads to problems such as extended project development cycles and high costs, making it difficult to meet the comprehensive application needs of current electric drive systems. Summary of the Invention

[0004] The purpose of this invention is to solve the technical pain points of insufficient heat dissipation efficiency and uneven heat dissipation caused by complex structural design of existing power modules. At the same time, it overcomes the problems of poor adaptability of traditional solutions in high power density scenarios, insufficient compatibility between different specifications of equipment, and difficulty in achieving platform-based universal deployment. Therefore, a highly integrated self-heating power module and dual motor controller are proposed.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A highly integrated self-heating power module includes: The heat sink has a coolant channel running through it, and both its upper and lower surfaces form heat dissipation contact surfaces. The TPAK module consists of one or more TPAK devices arranged in a single row along the axial length of the heat sink in a preset parallel configuration. The TPAK devices are arranged on the upper and lower surfaces of the heat sink, and their upper and lower sides are welded to the heat dissipation contact surface of the heat sink to form a bidirectional heat conduction path. Current equalization copper busbar; It includes an input power terminal that is electrically connected to the TPAK device and two sets of output power terminals; The two sets of output power terminals are arranged asymmetrically on opposite sides.

[0006] Based on the above technical solution, the present invention can be further improved as follows.

[0007] Furthermore, the heat sink includes: The heat dissipation base has a first cooling water channel inside; The heat dissipation cover has a second cooling water channel inside, which is sealed to the heat dissipation base; the first cooling water channel and the second cooling water channel are connected to each other to form the coolant channel.

[0008] Furthermore, both the heat dissipation base and the heat dissipation cover are provided with multiple Pin-Fin enhanced heat dissipation structures. The Pin-Fin enhanced heat dissipation structures extend from the wall into the coolant channel, and their cross-sections are elliptical with their major axes arranged along the coolant flow direction. A sealing ring is also provided at the mating interface between the heat dissipation cover and the heat dissipation base.

[0009] Furthermore, in the TPAK module, the TPAK device on the upper surface forms a first welding interface with the heat dissipation contact surface of the heat dissipation cover, and the TPAK device on the lower surface forms a second welding interface with the heat dissipation contact surface of the heat dissipation base. The two welding interfaces work together to construct a bidirectional heat dissipation path.

[0010] Furthermore, an insulating film is provided between the heat dissipation base and the TPAK module above it, and between the heat dissipation cover and the TPAK module below it; A perforated window is provided on the insulating film at the corresponding position of the TPAK device, and the TPAK device is directly welded to the heat sink base or heat sink cover through the perforated window for heat transfer.

[0011] Furthermore, the heat dissipation base is provided with a cooling water channel interface, which is connected to the coolant channel and uses a radial sealing structure or an end face sealing structure to achieve fluid sealing.

[0012] Furthermore, the input power terminals include a first phase input terminal, a second phase input terminal, a third phase input terminal, a fourth phase input terminal, a fifth phase input terminal, a sixth phase input terminal, a seventh phase input terminal, an eighth phase input terminal, a ninth phase input terminal, a tenth phase input terminal, an eleventh phase input terminal, and a twelfth phase input terminal, which are sequentially electrically connected to the DC side of multiple TPAK devices, and together they constitute a DC bus input interface.

[0013] Furthermore, the two sets of output power terminals include: The first group of three-phase output terminals consists of the first phase output terminal, the second phase output terminal, and the third phase output terminal, which are sequentially electrically connected to multiple TPAK devices, and corresponds to the first motor drive circuit. The second group of three-phase output terminals consists of the fourth phase output terminal, the fifth phase output terminal, and the sixth phase output terminal, which are sequentially electrically connected to multiple TPAK devices, and corresponds to the second motor drive circuit. The first, second, third, and fourth phase output terminals are arranged on the side of the heat dissipation cover, while the fifth and sixth phase output terminals are arranged on the side of the heat dissipation base.

[0014] Furthermore, the TPAK module adopts a modular and scalable architecture with single to four parallel connections, and the power level can be platform-adapted by increasing or decreasing the number of TPAK devices in parallel along the axial direction.

[0015] A dual-motor controller includes a highly integrated self-heating power module, which is arranged vertically or in a flat position inside the controller housing. The power module enables decoupled drive or cooperative drive control of the two motors through six independent outputs.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial technical effects: The highly integrated self-heating power module and dual-motor controller of the present invention achieves heat dissipation contact surfaces on both the upper and lower surfaces by passing through coolant channels in the heat sink, thus optimizing the heat dissipation path and improving heat dissipation efficiency. This design feature enables the power module to operate stably at higher power densities, significantly reduces the problem of heat accumulation, and thereby improves the overall reliability and safety of the system. In addition, the vertical single-row linear arrangement design of multiple TPAK devices in the TPAK module effectively improves the volume utilization efficiency. Compared with the traditional series flat arrangement, it significantly improves the freedom of three-dimensional arrangement. This arrangement not only simplifies electrical connections and reduces design complexity, but also provides greater flexibility for the arrangement of cooling channels, creating conditions for the miniaturization and weight reduction of the whole machine. Meanwhile, the design of the current-equalizing copper busbar, combined with the asymmetrical layout, allows the power terminals to be distributed on both sides of the device in a more reasonable manner. This ingenious layout improves heat dissipation performance, avoids the generation of additional heat due to redundant electrical connections, and also reduces the problem of tight wiring space caused by traditional designs, further optimizing the actual assembly and interference issues between components. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the exploded connection structure of the present invention; Figure 2 This is a schematic diagram of the connection structure between the heat sink base and the input power terminal of the present invention; Figure 3 This is a schematic diagram of the connection structure between the input power terminal and the output power terminal of the present invention.

[0018] In the diagram: 1. Heat sink; 11. Heat sink base; 12. Heat sink cover; 2. TPAK module; 21. TPAK device; 3. Current sharing copper busbar; 31. Input power terminal; 311. First phase input terminal; 312. Second phase input terminal; 313. Third phase input terminal; 314. Fourth phase input terminal; 315. Fifth phase input terminal; 316. Sixth phase input terminal; 317. Seventh phase input terminal; 318. Eighth phase input terminal; 319. Ninth phase input terminal 3110, 10th phase input terminal; 3111, 11th phase input terminal; 3112, 12th phase input terminal; 32, Output power terminal; 321, 1st phase output terminal; 322, 2nd phase output terminal; 323, 3rd phase output terminal; 324, 4th phase output terminal; 325, 5th phase output terminal; 326, 6th phase output terminal; 4, Pin-Fin enhanced heat dissipation structure; 5, Sealing ring; 6, Insulating film; 61, Hollowed-out window; 7, Cooling water channel interface. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figure 1 , Figure 2 and Figure 3 As shown, this embodiment provides a highly integrated self-heating power module, aiming to solve the problems of low heat dissipation efficiency, large space occupation, and difficult three-dimensional layout of power modules in existing dual-motor controllers. The core architecture of this module includes: heat sink 1, TPAK module 2, and current sharing copper busbar 3.

[0021] Firstly, regarding the module's main heat dissipation structure, the heat sink 1 has a coolant channel running through it, and both its upper and lower surfaces form heat dissipation contact surfaces, thus overcoming the limitations of traditional single-sided heat dissipation. To achieve this structure and ensure the feasibility of fluid sealing and processing, in the specific manufacturing process, the heat sink 1 includes a heat sink base 11 and a heat sink cover 12. The heat sink base 11 has a first cooling water channel inside, while the heat sink cover 12 has a second cooling water channel inside. The two can be sealed together by bolts. After sealing, the first and second cooling water channels are connected, forming a coolant channel, allowing the cooling medium to flow through both the base and the cover simultaneously, carrying away heat from both sides.

[0022] It should be noted that the heat sink is preferably made of aluminum alloy or copper alloy with high thermal conductivity. The heat sink base 11 and the heat sink cover 12 not only form a through-flow coolant channel in terms of structure, but also form a symmetrical or nearly symmetrical thermal capacity and thermal resistance system in terms of thermal level. This allows the heat generated by the TPAK device 21 during operation to diffuse in a more balanced manner in both the upper and lower directions, thereby avoiding the local hot spot problem caused by heat concentration in the traditional single-sided heat dissipation structure. At the same time, this structure of coordinated heat dissipation in the upper and lower directions allows the coolant to form a continuous heat exchange process in different height areas when flowing through the heat sink base 11 and the heat sink cover 12. This is beneficial to improving the average heat exchange efficiency in the entire coolant channel and improving the thermal stability of the module under high load conditions from the system level. To further improve heat transfer efficiency, the boundary layer fluid is disrupted to enhance turbulence, such as... Figure 1 As shown, both the heat sink base 11 and the heat sink cover 12 are equipped with multiple pin-fin enhanced heat dissipation structures 4. These pin-fin enhanced heat dissipation structures 4 extend from the wall into the coolant channel. To reduce flow resistance and optimize the flow field distribution, their cross-section is elliptical, with the major axis of the ellipse arranged along the coolant flow direction. This helps to reduce pressure loss while ensuring sufficient heat dissipation area. Furthermore, to ensure the sealing reliability of the water channel and prevent coolant leakage, a sealing ring 5 is provided at the mating interface between the heat sink cover 12 and the heat sink base 11. The sealing ring material can be high-temperature resistant and corrosion-resistant fluororubber or EPDM rubber.

[0023] In addition to the elliptical shape, the Pin-Fin structure can also be adjusted to a low-flow-resistance shape such as a rhombus, teardrop, or airfoil, based on fluid simulation results, without departing from the concept of this invention. During the flow of coolant, the Pin-Fin enhanced heat dissipation structure 4 not only improves convective heat transfer capacity by increasing the solid-liquid contact area, but its elliptical cross-section and the long axis structure arranged along the flow direction can also effectively disturb the flow state of coolant without significantly increasing flow resistance, so that the coolant forms a micro-scale vortex zone around the Pin-Fin, thereby continuously renewing the boundary layer fluid and further enhancing the heat exchange effect. When this structure is symmetrically or quasi-symmetrically arranged in the heat dissipation base 11 and the heat dissipation cover 12, it can also make the flow velocity distribution of coolant in the upper and lower channels more uniform, reducing the problem of heat transfer efficiency fluctuation caused by excessively high or low local flow velocities.

[0024] In terms of power device layout, this invention employs a linear topology. For example... Figure 1 , Figure 2 and Figure 3As shown, this TPAK module 2 consists of one or more TPAK devices 21 arranged linearly in a single row along the axial length of the heat sink 1 in a preset parallel configuration. Compared to the traditional matrix arrangement, this single-row linear arrangement significantly reduces flow resistance and improves temperature uniformity. The TPAK devices 21 are arranged on the upper and lower surfaces of the heat sink 1, with their upper and lower sides welded to the heat dissipation contact surfaces of the heat sink 1, forming a bidirectional heat conduction path. Specifically, in the TPAK module 2, the TPAK devices 21 located on the upper surface form a first welding interface with the heat dissipation contact surface of the heat sink cover 12, and the TPAK devices 21 located on the lower surface form a second welding interface with the heat dissipation contact surface of the heat sink base 11. The two welding interfaces work together to construct a bidirectional heat dissipation path, thereby significantly reducing the chip junction temperature and increasing power density.

[0025] Regarding the TPAK devices, their internal chip materials can be silicon-based IGBTs or silicon carbide SiCMOSFETs to adapt to different voltage platform requirements. Since the TPAK devices 21 are arranged in a single row linearly along the axial length of the heat sink 1, the electrical connection paths between the devices are relatively simple and their equivalent lengths are close, which helps to reduce the current unevenness between parallel branches. At the same time, this linear arrangement makes the thermal environment conditions of each TPAK device 21 more consistent in the coolant channel, avoiding the temperature difference unevenness caused by proximity to the inlet or outlet in the traditional planar matrix arrangement. This improves the overall thermal and electrical consistency of the module and provides a good foundation for parallel expansion.

[0026] Considering the platform-based application requirements of power modules, TPAK module 2 adopts a modular and scalable architecture with single to four parallel connections. By increasing or decreasing the number of TPAK devices 21 in parallel along the axial direction, platform-based adaptation of power levels can be achieved. For example, a single tube can be connected in parallel for low power requirements, and expanded to four tubes in parallel for high power requirements. There is no need to change the overall mold structure; only the number of devices and the length of the copper busbar need to be adjusted.

[0027] This embodiment employs a refined design to balance electrical insulation and heat conduction. Insulating films 6 are provided between the heat sink base 11 and the TPAK module 2 above it, and between the heat sink cover 12 and the TPAK module 2 below it. These insulating films can be made of high-performance polyimide (PI) film or ceramic composite insulating material. Crucially, the insulating film 6 has a perforated window 61 at the corresponding position of the TPAK device 21, allowing the TPAK device 21 to achieve direct welding and heat transfer connection with the heat sink base 11 or heat sink cover 12 via the perforated window 61. This structure is not simply about opening holes in the insulating layer. Instead, it ensures low thermal resistance direct connection in the critical heat dissipation area of ​​the TPAK device 21 while forming a continuous insulating coverage in the non-welding area through the insulating film 6. This achieves both high-efficiency heat conduction while meeting creepage distance and electrical safety requirements. During long-term operation of the power module, this structure can also effectively suppress the aging of interface materials caused by thermal cycling, improving the reliability and service life of the welding interface. This "direct welding" bypasses the thermal resistance bottleneck of traditional thermal grease and utilizes the high thermal conductivity of solder (such as nano-silver sintering paste or tin-based solder) to achieve extreme heat transfer efficiency while ensuring electrical insulation (creep distance protection is achieved through the non-perforated area of ​​the insulating film).

[0028] like Figure 1 , Figure 2 and Figure 3 As shown, in the electrical connection part of the module, the current sharing copper bus 3 includes an input power terminal 31 and two sets of output power terminals 32 that are electrically connected to the TPAK device 21.

[0029] The current sharing copper busbar can also adopt a laminated busbar process, with insulating paper sandwiched in the middle and formed by hot pressing, in order to further reduce stray inductance.

[0030] For the DC-side input, the input power terminal 31 includes a first-phase input terminal 311, a second-phase input terminal 312, a third-phase input terminal 313, a fourth-phase input terminal 314, a fifth-phase input terminal 315, a sixth-phase input terminal 316, a seventh-phase input terminal 317, an eighth-phase input terminal 318, a ninth-phase input terminal 319, a tenth-phase input terminal 3110, an eleventh-phase input terminal 3111, and a twelfth-phase input terminal 3112, which are sequentially electrically connected to the DC side of multiple TPAK devices 21, forming a DC bus input interface. This multi-point distributed input design effectively reduces parasitic inductance and improves the uniformity of current distribution.

[0031] For the AC side output, in order to accommodate the compact layout of the dual-motor controller and reduce magnetic interference, the two sets of output power terminals 32 are asymmetrically arranged and placed on opposite sides. Specifically, the two sets of output power terminals 32 include: a first set of three-phase output terminals, consisting of a first phase output terminal 321, a second phase output terminal 322, and a third phase output terminal 323, which are sequentially electrically connected to multiple TPAK devices 21, corresponding to the first motor drive circuit; and a second set of three-phase output terminals, consisting of a fourth phase output terminal 324, a fifth phase output terminal 325, and a sixth phase output terminal 326, which are sequentially electrically connected to multiple TPAK devices 21, corresponding to the second motor drive circuit.

[0032] In terms of spatial topology, this embodiment breaks away from the conventional three-phase parallel arrangement and adopts a staggered distribution: the first phase output terminal 321, the second phase output terminal 322, the third phase output terminal 323, and the fourth phase output terminal 324 are concentrated on the side of the heat dissipation cover plate 12, while the fifth phase output terminal 325 and the sixth phase output terminal 326 are arranged on the side of the heat dissipation base 11. This asymmetrical and layered arrangement scheme makes great use of the three-dimensional space around the module, allowing the wiring of the two motors to be independent of each other, while also leaving valuable space for the water channel interface.

[0033] By rationally partitioning and asymmetrically arranging the input power terminals 31 and output power terminals 32, the current sharing copper busbar 3 reduces the circuit area on both the DC and AC sides, while also helping to suppress electromagnetic interference generated during high-frequency switching. Especially in dual-motor drive applications, the two sets of three-phase output power terminals 32 are placed on different sides, which can form a natural electrical isolation area in the structure, reducing the risk of magnetic coupling between phases and between circuits, thereby improving the stability and reliability of system operation.

[0034] In the corresponding fluid interface design, the heat dissipation base 11 is equipped with a cooling water channel interface 7, which is connected to the coolant channel. To adapt to different overall assembly requirements, a radial sealing structure or an end face sealing structure can be used to achieve fluid sealing. In terms of positional layout, the cooling water channel interface 7 is located on the same side as the fifth phase output terminal 325 and the sixth phase output terminal 326. This layout cleverly avoids the dense upper output terminals and optimizes the pipeline routing.

[0035] Because this power module integrates the coolant channels, power device mounting interfaces, and power terminals within the same module, it possesses a high degree of structural independence and interface standardization in overall system applications. In different vehicle models or dual-motor controllers with varying power levels, rapid integration can be achieved simply by adapting the number of parallel connections and terminal connection methods of the TPAK module 2. This modular, self-heating design not only shortens the overall system development cycle but also provides ample room for future platform evolution and technological upgrades. In this embodiment, the overall working principle of the highly integrated self-heating power module is as follows: During system operation, DC power is first introduced through input power terminal 31 and evenly supplied to multiple TPAK devices 21 through current sharing copper bus 3. Each TPAK device 21 works in TPAK module 2 in a preset parallel connection mode to convert DC power into corresponding multiphase AC power, which is then output through two sets of asymmetrically arranged output power terminals 32 to drive dual motor loads. During the conversion of electrical energy, the heat generated by the TPAK device 21 under high frequency and high current conditions is first conducted upward and downward to the heat dissipation cover plate 12 and heat dissipation base 11 through the welding interfaces on its upper and lower sides, respectively. In this process, the insulating film 6 around the TPAK device 21 provides necessary electrical isolation, while the hollow window 61 on it ensures that a direct heat transfer path with low thermal resistance is formed between the device and the heat dissipation base. Subsequently, the heat is further transferred to the coolant channel running through the interior of the heat sink 1. During the flow, the coolant comes into full contact with the Pin-Fin enhanced heat dissipation structure 4 arranged in the channel. Under the effect of enhanced convection heat transfer, the heat is quickly carried away, achieving continuous and efficient cooling of the TPAK module 2. At the same time, a reliable seal is formed between the heat sink 11 and the heat sink cover 12 through the sealing ring 5. The coolant enters and exits through the cooling water channel interface 7 set on the heat sink 11, and completes stable circulation with the cooperation of radial sealing or end face sealing structure. Through the synergistic effect of the aforementioned power conversion path and bidirectional heat dissipation path, this power module effectively suppresses heat accumulation while achieving high power density output, ensuring the overall reliability, safety, and long-term stability of operation.

[0036] Based on the high-performance power module described above, this embodiment also provides a dual-motor controller, including a highly integrated self-heating power module.

[0037] In the overall assembly, the power modules are arranged vertically or horizontally inside the controller housing. Thanks to the integrated heat dissipation channels within the modules themselves, the controller housing no longer requires a complex water channel structure; only mounting brackets and water connection points are needed, significantly reducing the difficulty and cost of housing casting. The controller achieves decoupled or coordinated drive control of the two motors through six independent outputs.

[0038] In practical applications, this dual-motor controller can be widely used in the electric drive systems of pure electric vehicles or hybrid electric vehicles. Thanks to the aforementioned dual-sided heat dissipation and compact stacking design, this controller is significantly smaller than traditional solutions at the same power level, and can withstand higher peak current surges, meeting the stringent requirements of vehicles for high power density and lightweight design.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0040] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A highly integrated self-heating power module, characterized in that, include: The heat sink (1) has a coolant channel running through it, and both its upper and lower surfaces form heat dissipation contact surfaces. The TPAK module (2) is composed of one or more TPAK devices (21) arranged in a single row along the axial length direction of the heat sink (1) in a preset parallel manner. The TPAK devices (21) are arranged on the upper and lower surfaces of the heat sink (1), and their upper and lower sides are welded to the heat dissipation contact surface of the heat sink (1) to form a bidirectional heat conduction path. Current equalization copper busbar (3); It includes an input power terminal (31) electrically connected to the TPAK device (21) and two sets of output power terminals (32). The two sets of output power terminals (32) are arranged asymmetrically on opposite sides.

2. The highly integrated self-heating power module according to claim 1, characterized in that, The heat sink (1) includes: The heat dissipation base (11) has a first cooling water channel inside; The heat dissipation cover (12) has a second cooling water channel inside, which is sealed to the heat dissipation base (11); the first cooling water channel and the second cooling water channel are connected to each other to form the coolant channel.

3. The highly integrated self-heating power module according to claim 2, characterized in that, Both the heat dissipation base (11) and the heat dissipation cover plate (12) are provided with multiple Pin-Fin enhanced heat dissipation structures (4). The Pin-Fin enhanced heat dissipation structure (4) extends from the wall into the coolant channel. Its cross-section is elliptical and its major axis is arranged along the coolant flow direction. A sealing ring (5) is also provided at the mating interface between the heat dissipation cover plate (12) and the heat dissipation base (11).

4. A highly integrated self-heating power module according to claim 2, characterized in that, The TPAK device (21) on the upper surface of the TPAK module (2) forms a first welding interface with the heat dissipation contact surface of the heat dissipation cover plate (12), and the TPAK device (21) on the lower surface forms a second welding interface with the heat dissipation contact surface of the heat dissipation base (11). The two welding interfaces work together to construct a bidirectional heat dissipation path.

5. A highly integrated self-heating power module according to claim 2, characterized in that, An insulating film (6) is provided between the heat sink base (11) and the TPAK module (2) above it, and between the heat sink cover (12) and the TPAK module (2) below it. A perforated window (61) is provided on the insulating film (6) at the corresponding position of the TPAK device (21). The TPAK device (21) is directly welded to the heat sink base (11) or heat sink cover plate (12) through the perforated window (61) for heat transfer.

6. A highly integrated self-heating power module according to claim 2, characterized in that, The heat dissipation base (11) is provided with a cooling water channel interface (7), which is connected to the coolant channel and uses a radial sealing structure or an end face sealing structure to achieve fluid sealing.

7. A highly integrated self-heating power module according to claim 1, characterized in that, The input power terminal (31) includes a first phase input terminal (311), a second phase input terminal (312), a third phase input terminal (313), a fourth phase input terminal (314), a fifth phase input terminal (315), a sixth phase input terminal (316), a seventh phase input terminal (317), an eighth phase input terminal (318), a ninth phase input terminal (319), a tenth phase input terminal (3110), an eleventh phase input terminal (3111), and a twelfth phase input terminal (3112), which are sequentially connected to the DC side of a plurality of TPAK devices (21), and constitute a DC bus input interface.

8. A highly integrated self-heating power module according to claim 2, characterized in that, The two sets of output power terminals (32) include: The first group of three-phase output terminals consists of a first phase output terminal (321), a second phase output terminal (322), and a third phase output terminal (323) that are sequentially electrically connected to multiple TPAK devices (21), corresponding to the first motor drive circuit; The second set of three-phase output terminals consists of the fourth phase output terminal (324), the fifth phase output terminal (325), and the sixth phase output terminal (326) which are connected to multiple TPAK devices (21) in sequence, corresponding to the second motor drive circuit; The first phase output terminal (321), the second phase output terminal (322), the third phase output terminal (323) and the fourth phase output terminal (324) are arranged on the side of the heat dissipation cover plate (12), and the fifth phase output terminal (325) and the sixth phase output terminal (326) are arranged on the side of the heat dissipation base (11).

9. A highly integrated self-heating power module according to claim 1, characterized in that, The TPAK module (2) adopts a modular and scalable architecture with one to four parallel connections. By increasing or decreasing the number of TPAK devices (21) in parallel along the axial direction, the power level can be adapted to the platform.

10. A dual-motor controller, characterized in that, The invention includes the highly integrated self-heating power module as described in any one of claims 1-9, wherein the power module is arranged vertically or in a flat position inside the controller housing, and achieves decoupled drive or cooperative drive control of dual motors through six-phase independent output.

Images