Semiconductor manufacturing apparatus, method for inspecting paste adhesive, and method for manufacturing semiconductor device

Abstract

The invention provides a technology capable of performing appearance inspection corresponding to any elapsed time after mass production and coating. The semiconductor manufacturing apparatus includes: an image capturing device that captures an image of a first paste adhesive applied to a coating surface; and a control device that performs image processing on image data of the first paste adhesive captured by the image capturing device, the control device being configured so as to perform image processing on the image data of the first paste adhesive captured by the image capturing device during a registration operation prior to mass production. The first shape data is calculated by the image processing with respect to a plurality of reference inspection images for each post-application elapsed time of the first paste adhesive captured by the imaging device, and data relating to the post-application elapsed time and the first shape data is registered.

Description

Technical Field

[0001] This disclosure relates to semiconductor manufacturing apparatus, such as a mounting machine capable of applying a paste adhesive. Background Technology

[0002] As part of the semiconductor device manufacturing process, bare chips obtained from wafer dicing are picked up by a semiconductor manufacturing apparatus (e.g., a placement machine), and the picked-up bare chips are mounted onto a substrate. Sometimes, images of the resin paste adhesive (hereinafter referred to as paste adhesive) applied before mass production and images of mass production are compared after the same time interval to perform a visual inspection to determine whether a specified amount has been applied in a specified position and shape (e.g., Japanese Patent Application Publication No. 2021-44466).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-44466 Summary of the Invention

[0006] This disclosure provides a technique for performing visual inspection corresponding to any elapsed time after mass production coating. Other issues and new features can be learned from the description and drawings in this specification.

[0007] A brief summary of the representative content in this disclosure is as follows.

[0008] That is, the semiconductor manufacturing apparatus includes: a camera device for capturing images of a first paste-like adhesive applied to a coating surface; and a control device for performing image processing on image data of the first paste-like adhesive captured by the camera device, wherein the control device is configured to, during a registration operation prior to mass production, calculate the first shape data by performing the image processing on multiple reference inspection images of the first paste-like adhesive taken by the camera device after each coating time elapsed, and register the relevant data of the coating time elapsed and the first shape data.

[0009] Invention Effects

[0010] According to this disclosure, it is possible to perform an appearance inspection corresponding to any elapsed time after mass production coating. Attached Figure Description

[0011] Figure 1 This is a schematic top view showing the placement machine in the embodiment.

[0012] Figure 2 This is to explain from Figure 1 The diagram roughly constructed when viewed from the direction of the middle arrow A.

[0013] Figure 3 It is shown Figure 1 A schematic side view of the preform shown.

[0014] Figure 4 It is shown Figure 1 The diagram shown is a schematic representation of the control system of the placement machine.

[0015] Figure 5 It shows the use Figure 1 The flowchart shows the manufacturing method of semiconductor devices using a mounting machine.

[0016] Figure 6 (a) is a diagram showing an image taken immediately after a paste adhesive has been applied to the surface of the substrate. Figure 6 (b) shows from Figure 6 (a) A photograph of the state after a specified time.

[0017] Figure 7 This is a photographic image showing a paste adhesive applied to the tabs of a substrate arranged in a grid pattern.

[0018] Figure 8 This is a diagram illustrating the registration process prior to mass production in the implementation method.

[0019] Figure 9 This is a flowchart illustrating the method for registering relevant data before mass production in the implementation method.

[0020] Figure 10 This is a graph illustrating the relationship between the coating area calculated from the image before mass production and the time elapsed after coating, as described in the implementation method.

[0021] Figure 11 This is a flowchart illustrating a method for comparing and checking images before and during mass production in an embodiment.

[0022] Figure 12 This is a graph illustrating the comparison between the coating area of ​​the image obtained during mass production based on binarization processing in the implementation method and the coating area of ​​the image before mass production obtained based on binarization processing over the same period of time.

[0023] Figure 13 This is a diagram illustrating the shape data in the modified example, and a diagram showing a binarized image of the applied paste adhesive.

[0024] The reference numerals in the attached figures are explained as follows:

[0025] 1. Placement machine (semiconductor manufacturing equipment)

[0026] 80. Control Unit (Control Device)

[0027] 94 Pre-formed camera (video recording device) Detailed Implementation

[0028] The embodiments are described below using the accompanying drawings. However, in the following description, the same reference numerals are sometimes used to refer to the same constituent elements and repeated descriptions are omitted. It should be noted that, in order to make the description clearer, the width, thickness, shape, etc. of the various parts of the drawings are sometimes schematically shown compared with the actual form, but this is only an example and is not intended to limit the interpretation of this disclosure.

[0029] Regarding the configuration of a placement machine as a type of semiconductor manufacturing apparatus, using Figure 1 , Figure 2 and Figure 3 Please provide an explanation. Figure 1 This is a schematic top view showing the placement machine in the embodiment. Figure 2 This is to explain from Figure 1 The diagram illustrates the approximate composition when viewed in the direction of the middle arrow A. Additionally, Figure 3 It is shown Figure 1 A schematic side view of the preform shown.

[0030] The placement machine 1 generally includes a wafer supply unit 10, a pick-up unit 20, an intermediate stage unit 30, a preforming unit 90, a placement unit 40, a transport unit 50, a substrate supply unit 60, a substrate removal unit 70, and a control unit (control device, controller) 80. The Y2-Y1 direction is the front-to-back direction of the placement machine 1, the X2-X1 direction is the left-to-right direction, and the Z1-Z2 direction is the up-and-down direction. The wafer supply unit 10 is located at the front of the placement machine 1, and the placement unit 40 is located at the rear.

[0031] The wafer supply unit 10 includes a wafer cassette lift 11, a wafer holding stage 12, and a stripping unit 13.

[0032] The wafer cassette lift 11 moves the wafer cassette (not shown) holding multiple wafer rings WR vertically to the wafer transport height. The wafer rings WR supplied from the wafer cassette lift 11 are aligned via a wafer correction slot (not shown). The wafer rings WR are removed from the wafer cassette and supplied to the wafer holding stage 12 using a wafer extractor (not shown), or removed from the wafer holding stage 12 and stored in the wafer cassette.

[0033] A wafer W is bonded (attached) to a dicing tape DT, and the wafer W is divided into multiple bare chips D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the bare chips D are semiconductor chips, glass chips, or MEMS (Micro Electro Mechanical Systems).

[0034] The wafer holding stage 12 moves in the X1-X2 and Y1-Y2 directions via an XY stage (not shown) and a drive unit, moving the picked-up bare die D to the position of the stripping unit 13. The wafer holding stage 12 rotates the wafer ring WR in the XY plane via a drive unit (not shown). The stripping unit 13 moves in the Z1-Z2 direction via a drive unit (not shown). The stripping unit 13 strips the bare die D from the dicing tape DT.

[0035] The pickup unit 20 includes a pickup head 21, a Y-drive unit 23, and a wafer recognition camera 24. The pickup head 21 has a collet 22 that holds the stripped bare die D at its front end. The pickup head 21 picks up the bare die D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y-drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 has various drive units (not shown) that move the pickup head 21 up and down, rotate it, and move it in the X1-X2 direction. The wafer recognition camera 24 monitors the pickup position of the bare die D picked up from the wafer W or performs surface inspection of the bare die D.

[0036] The intermediate stage 30 includes an intermediate stage 31 for mounting a bare chip D and a stage recognition camera 34 for recognizing the bare chip D on the intermediate stage 31. The intermediate stage 31 has a suction hole (not shown) for adsorbing the mounted bare chip D. The mounted bare chip D is temporarily held on the intermediate stage 31.

[0037] The preforming section 90 includes a preforming head 91, a drive unit 93, a preforming camera 94 serving as an imaging device, and a preforming stage 96. The preforming head 91 is composed of a syringe 92 with a nozzle. The syringe 92 is filled with a resin paste (hereinafter referred to as "paste") serving as an adhesive, and the paste is discharged from the nozzle. The preforming head 91 applies the paste to the substrate S, which is conveyed to the preforming stage 96 by the conveying unit 50. The drive unit 93 moves the preforming head 91 in the X1-X2 direction, the Y1-Y2 direction, and the Z1-Z2 direction. The substrate S is, for example, a wiring substrate, a lead frame formed of a thin metal sheet, or a glass substrate.

[0038] The preforming camera 94 confirms the surface to be coated with paste by the preforming head 91 and determines the coating position. The preforming stage 96 rises while coating paste onto the substrate S, supporting the substrate S from below. The preforming stage 96 has suction holes (not shown) for vacuum suction of the substrate S, which can fix the substrate S.

[0039] Additionally, the pre-forming camera 94 and the control unit 80 constitute an inspection device. The pre-forming stage 96 may also be included in the inspection device.

[0040] The placement unit 40 includes a placement head 41, a Y-drive unit 43, a substrate recognition camera 44, and a placement stage 46. The placement head 41 is provided with a collet 42 that holds the bare die D at its front end. The Y-drive unit 43 moves the placement head 41 in the Y1-Y2 direction. The substrate recognition camera 44 captures images of the position recognition marks (not shown) of the packaging area P on the substrate S and determines the placement position. Here, multiple product areas (hereinafter referred to as packaging areas P) that ultimately become a package are formed on the substrate S. The position recognition marks are provided for each packaging area P. The placement stage 46 rises when the bare die D is placed on the substrate S, supporting the substrate S from below. The placement stage 46 has suction holes (not shown) for vacuum suction of the substrate S, enabling it to be fixed. The placement stage 46 has a heating unit (not shown) for heating the substrate S. The placement unit 40 has various drive units (not shown) that move the placement head 41 up and down, rotate, and in the X1-X2 and Y1-Y2 directions.

[0041] Based on this configuration, the placement head 41 corrects the pickup position / posture based on the camera data from the stage recognition camera 34, and picks up the bare chip D from the intermediate stage 31. Then, based on the camera data from the substrate recognition camera 44, the placement head 41 mounts (places and bonds) the bare chip D onto the paste-coated packaging area P of the transported substrate S.

[0042] The transport section 50 has a transport claw 51 for gripping and transporting the substrate S and a pair of transport channels (grooves) 52 for moving the substrate S. The substrate S moves in the X1-X2 direction by driving the nuts (not shown) of the transport claw 51 provided in the transport channel 52 using a ball screw (not shown) provided along the transport channel 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport channel 52 to the mounting position, and after mounting, moves to the substrate removal section 70, where the substrate S is delivered.

[0043] The substrate supply unit 60 removes the substrate S, which has been held and moved in by the transfer jig (not shown), from the transfer jig (not shown) and supplies it to the transfer unit 50. The substrate removal unit 70 holds the substrate S, which has been moved in by the transfer unit 50, in the transfer jig (not shown).

[0044] use Figure 4 Explain the control system of mounting machine 1. Figure 4 It is shown Figure 1 The diagram shown is a schematic representation of the control system of the placement machine.

[0045] The control system 8 includes a control unit 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 generally includes a control / computation unit 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of RAM (Random Access Memory) for storing processing programs, etc. The auxiliary storage device 82b is composed of HDD (Hard Disk Drive), SSD (Solid State Drive), etc., for storing control data, image data, etc., required for control.

[0046] The input / output device 83 includes a monitor 83a displaying the device status and information of the placement machine 1, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor 83a, and an image acquisition device 83d for acquiring image data from the optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the drive units 86 of the XY stage (not shown) of the wafer supply section 10 and the XYZ drive axes of the placement head stage (not shown) of the placement section 40. The I / O signal control device 83f receives signals from or controls the signal unit 87. The signal unit 87 includes switches, knobs, etc., for controlling the brightness of various sensors, lighting devices, etc. The control / computing unit 81 acquires the required data via the bus 84, performs calculations, controls the pickup head 21, etc., and transmits information to the monitor 83a, etc.

[0047] The control / computing unit 81 stores image data captured by the optical system 88 in the storage device 82 via the image acquisition device 83d. The optical system 88 includes a wafer recognition camera 24, a stage recognition camera 34, a substrate recognition camera 44, a preform camera 94, and an illumination device. The cameras used in the optical system 88 quantify light intensity and color. The control / computing unit 81 performs position recognition of the bare die D and the substrate S, inspection of the paste coating pattern, and surface inspection of the bare die D and the substrate S using software programmed based on the stored image data. Based on the calculated positions of the bare die D and the substrate S, the control / computing unit 81 uses software to actuate the drive unit 86 via the motor control device 83e. The control / computing device 81 uses this process to identify the position of the bare chip D on the wafer holding stage 12 and the intermediate stage 31, and the position of the substrate S on the preforming stage 96 and the mounting stage 46. The drive units of the wafer supply unit 10, the pick-up unit 20 and the mounting unit 40 are used to move the bare chip D onto the packaging area P of the substrate S.

[0048] use Figure 5 This describes a part of the manufacturing process of a semiconductor device using mounting machine 1 (a semiconductor device manufacturing method). Figure 5 It shows the use Figure 1 The flowchart illustrates a method for manufacturing semiconductor devices using a placement machine. In the following description, the operation of each component constituting the placement machine 1 is controlled by the control unit 80.

[0049] (Wafer loading process: Process S1)

[0050] A wafer cassette containing wafer rings (WR) is fed into a wafer cassette elevator 11. Wafer rings (WR) are then supplied (moved in) from the fed wafer cassette to the wafer holding stage 12.

[0051] (Substrate handling process: Process S2)

[0052] A transfer jig (not shown) holding substrate S is inserted into substrate supply unit 60. In substrate supply unit 60, substrate S held in transfer jig (not shown) is removed from transfer jig (not shown). Then, it is supplied (moved in) to preforming unit 90 by means of transfer unit 50.

[0053] (Pick-up process: Process S3)

[0054] After process S1, the wafer holding stage 12 is activated to pick up the desired bare die D from the dicing tape DT. The bare die D is photographed by the wafer recognition camera 24 to acquire image data. Image data is processed to calculate the offset (X, Y, θ directions) of the bare die D on the wafer holding stage 12 relative to the bare die position reference point of the placement machine 1, and the die is positioned accordingly. It should be noted that the predetermined position of the wafer holding stage 12 is pre-set as the initial position of the device for the bare die position reference point. Surface inspection of the bare die D is performed by processing the image data.

[0055] The bare chip D is peeled off from the cutting tape DT by the peeling unit 13 and the pick-up head 21. After being peeled off from the cutting tape DT, the bare chip D is adsorbed and held by the clamp 22 provided on the pick-up head 21, and then transported and placed on the intermediate stage 31.

[0056] The bare chip D on the intermediate stage 31 is photographed by the stage recognition camera 34, and image data is acquired through the photograph. Image data is processed to calculate the offset (X, Y, θ directions) of the bare chip D on the intermediate stage 31 relative to the bare chip position reference point of the placement machine 1, and then the chip is positioned. It should be noted that the predetermined position of the intermediate stage 31 is maintained as the initial setting of the device for the bare chip position reference point. Surface inspection of the bare chip D is performed through image data processing.

[0057] The pick-up head 21, which transports the bare die D to the intermediate stage 31, returns to the wafer supply section 10. Following the above steps, the next bare die D is stripped from the dicing tape DT, and thereafter, the bare dies D are stripped from the dicing tape DT one by one according to the same steps.

[0058] (Preforming process: Process S4)

[0059] After process S2, the substrate S is transported to the preforming stage 96 via the transfer unit 50. The surface of the substrate S before coating is photographed by the preforming camera 94, and the coating surface is confirmed based on the image data obtained from the photograph, thus determining the position of the coating paste to be applied. If there are no problems with the surface to be coated, the position of the coating paste on the substrate S supported by the preforming stage 96 is confirmed and positioned.

[0060] The coated paste is photographed using a pre-forming camera 94. Based on the captured image, an inspection (visual inspection) is performed to confirm whether the paste has been correctly coated. Specifically, the visual inspection confirms that the coated paste is applied to a specified location on the substrate S in a specified shape and amount. Inspection items include, for example, the presence or absence of paste, the coating area, and the coating shape (excess or insufficient, overflow).

[0061] (Surface mount process: Process S5)

[0062] If the coating process proceeds without issue, the substrate S is transported to the placement table 46 via the transport unit 50. The substrate S, placed on the placement table 46, is captured by the substrate recognition camera 44, and image data is acquired through this capture. Image processing is performed on the image data to calculate the offset (X, Y, θ directions) of the substrate S relative to the substrate position reference point of the placement machine 1. It should be noted that the predetermined position of the placement unit 40 is maintained as the initial setting of the device regarding the substrate position reference point.

[0063] The placement head 41 is adjusted to adjust its position based on the offset of the bare chip D on the intermediate stage 31 calculated in process S3, so that the bare chip D is picked up by the clamp 42. The bare chip D is then placed onto a predetermined position on the substrate S supported by the placement stage 46 by the placement head 41, which picks up the bare chip D from the intermediate stage 31. The bare chip D mounted on the substrate S is photographed by the substrate recognition camera 44, and based on the image data acquired by the photograph, checks are performed to determine whether the bare chip D has been placed in the desired position.

[0064] After the bare die D is mounted on the substrate S, the mounting head 41 returns to the intermediate stage 31. Following the steps described above, the next bare die D is picked up from the intermediate stage 31 and mounted on the substrate S. This process is repeated to mount bare dies D in all packaging areas P of the substrate S.

[0065] (Substrate removal process: Process S6)

[0066] The substrate S, on which the bare chip D is mounted, is transported from the mounting section 40 to the substrate removal section 70 via the transport section 50. In the substrate removal section 70, the substrate S is removed and stored in a transport jig (not shown) before being removed. The transport jig (not shown) holding the substrate S is then removed from the mounting machine 1.

[0067] As described above, the bare die D is mounted on the substrate S and removed from the mounting machine 1. Then, for example, a transport jig holding the substrate S with the bare die D mounted is transported to the wire bonding process, whereby the electrodes of the bare die D are electrically connected to the electrodes of the substrate S via Au leads or the like. Then, the substrate S is transported to the molding process, where semiconductor packaging is completed by sealing the bare die D and the Au leads with molding resin (not shown).

[0068] use Figure 6 This section explains the issues related to the application of a paste-like adhesive to the substrate. Figure 6 (a) is a diagram showing an image taken immediately after a paste adhesive has been applied to the surface of the substrate. Figure 6 (b) shows from Figure 6 (a) A photograph of the state after a specified time.

[0069] When a paste adhesive PA is applied to the bonding pad TB, which serves as the bare chip mounting area, on the substrate SA, the paste adhesive PA diffuses over time, causing a change in the coating shape. As the coating shape changes, the coating area changes when viewed from above. The lower the viscosity of the paste adhesive PA, the better. Figure 6 The coating shape shown in (b) is more prone to change. However, regardless of how the coating shape changes over time, the elapsed time until the coating area of ​​the paste adhesive PA is calculated is not fixed, and the area calculated at any time point is used as the coating area.

[0070] When performing a visual inspection immediately after applying the paste adhesive PA, the inspection should be completed before the paste adhesive PA has spread. However, if a re-inspection is required for some reason or after a specified period of time, changes in the paste adhesive PA should be considered.

[0071] Here, use Figure 7 This indicates the condition that needs to be checked after a specified time has elapsed since the application of the paste adhesive. Figure 7 This is a photographic image showing a paste adhesive applied to the tabs of a substrate arranged in a grid pattern.

[0072] Starting from the upper right patch TB of the substrate SA, which has patch TBs arranged in a grid pattern as the coating surface, paste adhesive is applied downwards sequentially. After applying paste adhesive PAR from the upper right patch TB starting from the paste adhesive PAS, paste adhesive is applied downwards sequentially from the top of the second column from the right. Then, the third and fourth columns are applied in the same way. As a result, the paste adhesive PAS applied to the top patch TB of the first column has the longest elapsed time after application, while the paste adhesive PAE applied to the bottom patch TB of the fourth column has the shortest elapsed time after application.

[0073] like Figure 7 As shown, when a visual inspection of the paste adhesive applied to all four joint TBs in all four columns is performed after the four columns of coating (i.e., after the paste adhesive PAE has been applied), the degree of diffusion of the paste adhesive PA differs on each joint TB. Since the visual inspection of the paste adhesive is typically performed column by column, the diffusion of the paste adhesive PAS in the first applied joint TB and the paste adhesive PAE in the last applied joint TB in that column differs on each joint.

[0074] When all joints are inspected after coating one or more columns of joints (TBs), the time from coating to inspection varies for each joint (TB), the degree of diffusion of the paste adhesive (PA) varies on each joint, and the inspection results vary according to the position of the joint (TB) and the start time of inspection.

[0075] Next, an outline of the implementation methods for solving the above-mentioned problems will be provided. Figure 8 , 9 This embodiment describes a method for acquiring relevant data based on an image (hereinafter referred to as a reference inspection image) obtained by taking a picture of the first paste adhesive PB coated on the first substrate SB during the registration process before mass production. Figure 8 This is a diagram illustrating the registration process prior to mass production in the implementation method. Figure 9 This is a flowchart illustrating the method for registering relevant data before mass production in the implementation method.

[0076] The mounting machine 1 includes a camera device for capturing images of a first paste adhesive PB coated on a first substrate SB, and a control unit 80 for image processing of the image data of the first paste adhesive PB captured by the camera device. The control unit 80 calculates shape data (hereinafter referred to as first shape data) of the first paste adhesive PB through image processing based on multiple reference inspection images taken at each elapsed time after coating, for example, calculating the coating area, and records this as recording data by the control unit 80. Then, a correlation is established between the elapsed time after coating and the coating area as shape data, and the relevant data is pre-registered as a registration operation before mass production. The coating area is calculated, for example, using the number of pixels.

[0077] Here, use Figure 8 and Figure 9 The method for registering relevant data in the implementation scheme is described.

[0078] (First substrate transfer process: Process S41)

[0079] Similar to the substrate loading (process S2) described above, the first substrate SB for reference inspection image acquisition is fed into the transport section 50 of the mounting machine 1. The first substrate SB is transported to the preforming section 90.

[0080] (First paste adhesive application process: Process S42)

[0081] As described above, the surface of the first substrate SB before coating is photographed by the preforming camera 94 of the preforming section 90 to determine the position of the first paste adhesive PB to be coated. If there are no problems with the surface to be coated, the first paste adhesive PB is coated on the first substrate SB supported by the preforming stage 96, and the first paste adhesive PB is photographed by the preforming camera 94.

[0082] (Time measurement start process: process S43)

[0083] The elapsed time is measured simultaneously with the coating process. At this time, in order to clarify the time after coating when the reference inspection image is acquired (described later), the timestamp is also activated by the control unit 80.

[0084] (Refer to the image acquisition and timestamp acquisition process: process S44)

[0085] A reference inspection image RII of the first paste adhesive PB is acquired using a pre-formed camera 94. Simultaneously, the time t1 at which the image was captured is also recorded as a timestamp.

[0086] (Image processing procedure: Procedure S45)

[0087] The acquired reference inspection image RII is binarized, for example, by the control unit 80. This yields a binarized image BI.

[0088] (First coating area acquisition process: process S46)

[0089] The first shape data is calculated from the acquired binarized image BI and registered in the storage device 82. The first shape data is, for example, the coating area of ​​the first paste adhesive PB, which is represented by the number of pixels. The coating area of ​​the first paste adhesive PB is also called the first coating area.

[0090] After step S46 is completed, the process returns to step S44 after a set time has elapsed, and a reference inspection image RII of the first paste adhesive PB at time t2 after a new time has elapsed is obtained. This process is repeated until the first paste adhesive PB has almost stopped spreading (e.g., up to time t3), and the elapsed time and the first coating area CB are obtained. The result is as follows: Figure 8 As shown, the first coating area CB is calculated using the binarized image BI as B1 at time t1, B2 at time t2, and B3 at time t3.

[0091] (Relationship establishment process: Process S47)

[0092] Here, the relationship between the first coating area CB, calculated based on the reference inspection image RII before mass production, and the time elapsed after coating in the above-described embodiment is explained. Figure 10 This is a graph illustrating the relationship between the coating area calculated from the image before mass production and the time elapsed after coating, as described in the embodiment. After obtaining the first coating area CB for each elapsed time, the control / calculation device 81 of the control unit 80 calculates... Figure 10 The relationship between the elapsed time and the characteristics of the first coating area CB is recorded as relevant data in the storage device 82 of the control unit 80. Figure 10An approximate curve is shown, therefore, for example, even at a time 3.5 seconds after coating, which is different from the timing of acquiring the reference image, 41 pixels of the first coating area CB can be recorded as reference data. On the other hand, after a certain elapsed time (here, 8 seconds or more), the first coating area CB remains unchanged, that is, the first paste adhesive PB is in a state where it no longer diffuses. In other words, after 8 seconds or more, since the first coating area CB has become a fixed first coating area where the first paste adhesive PB has not diffused, it is not necessary to acquire a reference inspection image. On the other hand, if less than 8 seconds have elapsed, the approximate curve can be used as relevant data.

[0093] In this way, since the data is recorded as an approximate curve by the control unit 80, the first coating area CB can be calculated for any elapsed time. For example, even a time like 3.5 seconds, where the first coating area CB is not acquired based on a reference inspection image, can be calculated. Of course, the acquisition time and interval of the reference inspection image can be set arbitrarily.

[0094] Next, use Figure 11 and Figure 12 This describes the inspection method for images (hereinafter referred to as inspection images) acquired during mass production in the implementation method. Figure 11 This is a flowchart illustrating a method for comparing and checking images before and during mass production in an embodiment. Figure 12 This is a graph illustrating the comparison between the coating area of ​​an image during mass production based on binarization processing in the implementation method and the coating area of ​​an image before mass production based on binarization processing after the same time elapsed.

[0095] (Second substrate transfer process: Process S51)

[0096] During mass production, the second substrate SC is fed into the conveying section 50 of the mounting machine 1. The second substrate SC is then conveyed to the preforming section 90.

[0097] (Second paste adhesive application process: Process S52)

[0098] The preforming camera 94 of the preforming section 90 takes a picture of the surface of the second substrate SC before coating to determine the position of the second paste adhesive PC to be coated. If there are no problems with the surface to be coated, the second paste adhesive PC is coated onto the tabs TB of the second substrate SC supported by the preforming stage 96.

[0099] (Process S53: Time measurement begins simultaneously with coating)

[0100] The time elapsed is measured simultaneously with the coating of each TB sheet. At this time, in order to make the elapsed time after coating clear, the timestamp is also activated by the control unit 80, just as it was when the reference inspection image was acquired.

[0101] Repeat steps S52 and S53 to apply the second paste adhesive PC to all the tabs TB of the second substrate SC, and measure the time elapsed after application.

[0102] (Check image acquisition and timestamp acquisition processes: Process S54)

[0103] During the visual inspection timing in mass production, the location of the patch TBs in the second substrate SC varies. A pre-formed camera 94 acquires an inspection image of the second paste adhesive PC for each patch TB and records it in the storage device 82 provided in the control unit 80. Simultaneously, the time of image capture is also recorded as a timestamp. Thus, the elapsed time of the visual inspection timing for all patch TBs during mass production is measured, and an inspection image INI is acquired.

[0104] (Image processing procedure: Procedure S55)

[0105] The acquired inspection image INI is subjected to the binarization process described above by the control unit 80. This yields the binarized image BI.

[0106] (Second coating area acquisition process: process S56)

[0107] Based on the acquired binarized image BI, shape data (hereinafter referred to as second shape data) is calculated through image processing and recorded in the storage device 82 of the control unit 80. The second shape data is, for example, the coating area (CC) of the second paste adhesive PC expressed in pixels. The coating area of ​​the second paste adhesive PC is also referred to as the second coating area.

[0108] (Comparative inspection process: Process S57)

[0109] The control unit 80 compares and inspects the second coating area CC with the first coating area CB that has been coated for the same amount of time after coating, as recorded in the control unit 80 (visual inspection). More specifically, the second coating area CC (here, the second coating area CC is denoted as C2) at the time elapsed (time t2) after the second coating area CC is obtained is compared with the first coating area CB (B2) as follows, and it is determined that the first coating area CB (B2) is the coating area that has been coated for the same amount of time after coating. Figure 10 The relationship between the first coating area CB and the time elapsed after coating is shown, extracted from the time elapsed from the application of the second paste adhesive PC to the time when the second paste adhesive PC is photographed (time t2). For example, in mass production, the first coating area CB is photographed 3 seconds after coating. Figure 11 When the second coating area CC is calculated using the process shown, the calculated second coating area CC is compared with 38 pixels of the first coating area CB 3 seconds after the first paste adhesive PB is applied.

[0110] Since the change in the first coating area CB based on the elapsed time is recorded in the storage device 82 of the control unit 80, it is also possible to perform a comparative inspection of at least two parts of the patch TB initially coated on the second substrate SC and the last coated patch TB during mass production.

[0111] (Judgment process: Process S58)

[0112] Using the comparison results from process S57, the control unit 80 determines whether the second coating area CC during mass production is within the normal range, i.e., whether the coating amount is appropriate. Of course, a threshold can also be set to consider errors in the paste position and sequence based on the second substrate SC.

[0113] If it is within the normal range, proceed to the mounting process of process S5. If it is outside the range, stop the operation of mounting machine 1 and check and adjust the preform part 90 or the second paste adhesive PC or both.

[0114] Alternatively, the determination can also be made by comparing the area ratio, that is, the area of ​​the second paste adhesive PC / the area of ​​the first paste adhesive PB.

[0115] When the time for acquiring inspection images during mass production is fixed, the coating condition of the second paste adhesive PC can be easily determined as the second coating area CC by comparing it with reference inspection image data at the corresponding time. However, in certain situations such as equipment malfunction or re-inspection, inspection images during mass production are sometimes acquired at timed intervals other than the fixed time. In this case, as described above, it is also possible to... Figure 10 The curve of the first coating area CB versus the approximate curve of time is shown to determine the first coating area CB that matches the coating time of the second paste adhesive PC, and can be compared and checked with the second coating area CC.

[0116] The graph is recorded as an approximate curve in the storage device 82 of the control unit 80. Therefore, an approximate value of the second coating area CC can be obtained at any time other than the elapsed seconds used when acquiring the reference inspection image (i.e., the number of seconds in between), such as the aforementioned 3.5 seconds.

[0117] In addition, in the presence of the above Figure 7In the case of multiple coating points, the time elapsed after coating of the initial TB and the final TB will inevitably differ significantly. In this situation, if it is possible to obtain... Figure 10 This correlation between the first coating area CB based on the reference inspection image and the elapsed time allows for easy determination of coating performance for multiple TBs at any elapsed time during the coating process for each TB in mass production. Furthermore, in mass production processes where time is pre-determined from coating to inspection, the coating result can also be determined based on the correlation with the reference inspection image.

[0118] The control unit 80 can also display actual reference inspection images and mass production inspection images, along with related data, on the monitor 83a for direct confirmation by operators. By displaying these results on the monitor 83a, abnormalities in the mounting machine 1, preforming unit 90, or second paste adhesive PC can be detected as early as possible.

[0119] According to this method, one or more of the effects shown below can be obtained.

[0120] Since the image based on the reference inspection image and the data of the first coating area CB are obtained in advance, and the correlation between the first coating area CB and the elapsed time is obtained, it is not necessary to stop the work of the mounting machine 1. That is, it is possible to perform the coating inspection of the second paste adhesive PC during mass production while maintaining the equipment operating rate.

[0121] Because of the correlation between the first coating area CB of the reference inspection image and the elapsed time, as described above, in the inspection image during mass production, the coating judgment of the second substrate SC can be performed only on the first and last bonding TB areas, which helps to improve the operating rate of the equipment.

[0122] Because of the correlation between the first coating area CB of the reference inspection image and the elapsed time, even when there are multiple paste dots within the TB of the splice, the inspection area can be set according to the paste dots. When the difference between the first paste dot and the last paste dot at the coating time is large, the risk of misjudgment can be reduced.

[0123] This method is effective not only for low-viscosity paste adhesives, but also for paste adhesives of other viscosities. In other words, this method is effective for all paste adhesives.

[0124] <Variation Example>

[0125] Hereinafter, several representative variations of the embodiments are illustrated. In the following descriptions of the variations, parts having the same structure and function as those described in the above embodiments can use the same reference numerals as those in the above embodiments. Furthermore, to the extent that there is no technical contradiction, the descriptions of corresponding parts can appropriately refer to the descriptions in the above embodiments. In addition, a part of the above embodiments and all or part of multiple variations can be appropriately combined to the extent that there is no technical contradiction.

[0126] In a modified example, in steps S46 and S56, the method is consistent with that of this embodiment. Figure 9 and Figure 11 The same process is used to obtain coating width, length, etc. as shape data instead of coating area. Figure 13 This is a diagram illustrating the shape data in the modified example, and a diagram showing a binarized image of the applied paste adhesive.

[0127] Similar to the implementation method, the coating widths WB1 and WB2 of the binarized image BI_B of the first paste adhesive PB3 at each elapsed time before mass production are calculated in advance and recorded in the storage device 82 of the control unit 80. On the other hand, after coating, the coating widths WC1 and WC2 of the binarized image BI_C of the second paste adhesive PC3 during mass production are calculated by the control unit 80. Furthermore, the coating widths at the same positions are compared at the same elapsed time to check whether the shape changes after coating are normal.

[0128] Alternatively, the rates of change of each coating width, WC1 / WB1 and WC2 / WB2, can be calculated for comparison and inspection. Furthermore, shapes other than coating width can also be compared; for example, shapes can also be compared... Figure 13 The length LB or angle θB of the first shape data shown is compared with the length LC or angle θC of the second shape data.

[0129] In this way, the inspection can also be performed using data from a binarized image (processed from a reference inspection image into first shape data) and data from a binarized image (processed from an inspection image into second shape data), based on factors such as coating width and length. Furthermore, it is also possible to obtain the data from the implementation method. Figure 10 The data shown is related to the coating width, length, etc., of the first shape data based on the reference inspection image, and the time elapsed after coating. Therefore, even if the time elapsed after coating in mass production is arbitrary, as in the same embodiment, it is possible to compare and inspect using the second shape data and the first shape data.

[0130] In addition, in a modified example based on the comparison of this shape data, the control unit 80 can display the actual reference inspection image and the inspection image during mass production, along with related data, on the monitor 83a, so that the operator can directly confirm them.

[0131] Furthermore, when applying a paste adhesive to a substrate and calculating the first shape data, at least one bonding pad is wasted. Therefore, methods exist, for example, using a temporary coating stage for the paste adhesive made of a transparent material such as glass. The control unit applies the paste to the temporary coating stage using a syringe. A camera is provided below the temporary coating stage to confirm the coating position and area by taking pictures from the back side (below) of the temporary coating stage. During the registration process before mass production using this temporary coating stage, the first shape data can be calculated by image processing from multiple reference inspection images of each paste adhesive coating after time has elapsed (i.e., the first shape data is calculated by image processing based on multiple reference inspection images of each paste adhesive coating after time has elapsed), and the data related to the coating time and the first shape data is registered.

[0132] The present disclosure has been specifically described above based on the embodiments and variations, but the present disclosure is not limited to the above embodiments, and various changes can be made.

[0133] The following example is described in the embodiment: an intermediate stage 30 is provided between the pickup section 20 and the mounting section 40, and the bare chip D picked up from the pickup section 20 by the pickup head 21 is placed on the intermediate stage 31. The bare chip D is picked up from the intermediate stage 31 again by the mounting head 41 and mounted onto the transported substrate S. Alternatively, the bare chip D picked up by the pickup section 20 can be mounted onto the substrate S using the mounting head 41.

[0134] In addition, in this embodiment, one pickup head 21 and one placement head 41 are provided, but there may be two or more of them. Furthermore, in this embodiment, an intermediate platform 31 is provided, but it may not be provided.

[0135] Furthermore, while a semiconductor manufacturing apparatus has been described in the embodiments, it can also be applied to mounting apparatuses for mounting electronic components onto printed circuit boards.

Claims

1. A semiconductor manufacturing apparatus, characterized in that, include: A camera device that captures images of the first paste-like adhesive applied to the coating surface; as well as The control device performs image processing on the image data of the first paste-like adhesive captured by the camera device. The control device is configured such that, In the registration process before mass production For each of the first paste adhesives captured by the camera device after a period of time following application, first shape data is calculated through image processing, and the relevant data of the application time and the first shape data are recorded.

2. The semiconductor manufacturing apparatus according to claim 1, characterized in that, The control device is configured such that, During mass production, For the inspection image obtained by the camera device of the second paste adhesive applied to the second substrate, the second shape data is calculated through image processing. An appearance inspection is performed based on the comparison between the second shape data and the first shape data, which is the same time elapsed from the application of the second paste adhesive to the time until the second paste adhesive is photographed.

3. The semiconductor manufacturing apparatus according to claim 2, characterized in that, The control device is configured such that, For all tabs on the second substrate coated with the second paste adhesive, the time elapsed after the second paste adhesive was applied was measured.

4. The semiconductor manufacturing apparatus according to claim 2, characterized in that, The control device is configured such that, The appearance inspection is performed using the relevant data, which serves as an approximate curve.

5. The semiconductor manufacturing apparatus according to claim 2, characterized in that, The control device is configured such that, The first shape data and the second shape data are calculated using the first coating area and the second coating area, respectively, expressed in pixels.

6. A method for inspecting a paste-like adhesive using an inspection device, characterized in that, The inspection device includes: a camera device for capturing images of a first paste-like adhesive applied to a coating surface; and a control device for image processing of the image data of the first paste-like adhesive captured by the camera device. The control device is configured to, during a registration process prior to mass production, calculate first shape data from multiple reference inspection images of the first paste-like adhesive taken by the camera device after each application and the elapsed time, and register the relevant data related to the elapsed time and the first shape data. The inspection method for the paste adhesive during mass production includes the following steps: For the inspection image obtained by the imaging device of the second paste adhesive applied to the second substrate, second shape data is calculated through image processing; and An appearance inspection is performed based on a comparison between the second shape data and the first shape data after the same elapsed time following coating.

7. The method for inspecting the paste adhesive according to claim 6, characterized in that, The first shape data and the second shape data are calculated using the first coating area and the second coating area, respectively, expressed in pixels.

8. The method for inspecting the paste adhesive according to claim 7, characterized in that, The visual inspection is performed by comparing the first coating area and the second coating area calculated based on the relevant data.

9. A method for manufacturing a semiconductor device using a semiconductor manufacturing apparatus, characterized in that, The semiconductor manufacturing apparatus includes: an imaging device for capturing images of a first paste-like adhesive applied to a coating surface; and a control device for image processing of image data of the first paste-like adhesive captured by the imaging device. The control device is configured to, during a registration process prior to mass production, calculate first shape data from multiple reference inspection images of the first paste-like adhesive taken by the imaging device after each application time, and register related data of the application time and the first shape data. The method for manufacturing the semiconductor device includes the following steps during mass production: The process of calculating second shape data through image processing of an inspection image obtained by the imaging device of the second paste adhesive applied to the second substrate; and An appearance inspection is performed based on a comparison between the second shape data and the first shape data after the same elapsed time following coating.

10. The method for manufacturing a semiconductor device according to claim 9, characterized in that, The first shape data and the second shape data are calculated using the first coating area and the second coating area, respectively, expressed in pixels.

11. The method for manufacturing a semiconductor device according to claim 10, characterized in that, The visual inspection is performed by comparing the first coating area and the second coating area calculated based on the relevant data.

Images