Wafer surface detection control method, device, system and storage medium thereof

Abstract

This invention discloses a wafer surface inspection control method, apparatus, system, and storage medium thereof. The method includes controlling an optical scanning device to scan the wafer twice, according to a first preset scanning path and a second preset scanning path, while a clamping mechanism is clamping the wafer to be inspected at a designated position. During the two scans, the clamping mechanism is controlled to perform an avoidance action, obtaining a first front image, a first back image, a second front image, and a second back image, respectively. The first and second front images are then stitched together, as are the first and second back images, to generate a complete front image and a complete back image, respectively. This invention achieves automatic wafer surface inspection, improves the automation level of wafer surface inspection, and solves the problems of existing technologies that cannot avoid clamping interference and cannot efficiently obtain complete front and back images of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and specifically to a wafer surface inspection and control method, apparatus, system, and storage medium thereof. Background Technology

[0002] In semiconductor manufacturing, the wafer serves as the substrate for integrated circuits, and its surface quality directly affects the performance and yield of the final chip. Therefore, rigorous non-destructive testing of the wafer is required at multiple stages, including before, during, and after the manufacturing process, to identify surface defects such as dirt, scratches, particles, and patterns.

[0003] Existing wafer inspection technologies typically employ optical imaging systems. A common approach is to use an area scan camera in conjunction with a motion platform to photograph the wafer in sections. However, this method suffers from low efficiency, difficulty in image stitching, and susceptibility to interference from clamping mechanisms in edge areas. Another approach uses a line scan camera, which performs scanning imaging through the relative uniform motion between the wafer and the camera. This method is more efficient, but it also faces challenges in preventing clamping mechanisms (such as grippers) from entering the imaging field of view during the full scan, and in efficiently and comprehensively acquiring complete images of both the front and back sides of the wafer.

[0004] Specifically, during the scanning process, the grippers used to hold the wafer may obstruct some areas or generate reflections (or glare, referring to interfering light during imaging), interfering with image quality and causing missing or abnormal areas in the image, affecting the accurate judgment of wafer surface defects. Furthermore, since both the front and back sides of the wafer need to be inspected, achieving efficient and comprehensive image acquisition requires a well-designed scanning path and imaging strategy. If the scanning path is not properly planned, duplicate scanning or missed scans may occur, wasting inspection time and failing to guarantee comprehensive inspection. In addition, the existing loading / unloading and scanning processes lack coordination, resulting in long waiting times and disjointed automated processes, limiting the improvement of overall inspection efficiency.

[0005] Therefore, there is an urgent need in this field for a wafer inspection technology solution that is highly automated, can effectively avoid clamping interference, and can efficiently acquire complete, high-quality images of the front and back sides of the wafer. Summary of the Invention

[0006] In view of this, the present invention provides a wafer surface inspection control method, apparatus, system and its storage medium to solve the problems of low automation, inability to avoid clamping interference and inability to efficiently acquire complete images of the front and back sides of the wafer in existing wafer inspection technologies.

[0007] This invention provides a wafer surface inspection control method, the method comprising:

[0008] When the clamping mechanism clamps the wafer to be inspected at a designated position, the optical scanning device is controlled to scan the wafer twice according to a first preset scanning path and a second preset scanning path. During the two scans, the clamping mechanism is controlled to perform an avoidance action, thereby obtaining a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected, respectively. The second preset scanning path is different from the first preset scanning path.

[0009] The first front image and the second front image are stitched together, and the first back image and the second back image are stitched together to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0010] Optionally, during the two scanning processes, the clamping mechanism is controlled to perform an avoidance action, including:

[0011] During the two scans, the avoidance trigger signal was acquired;

[0012] In response to the avoidance trigger signal, an avoidance drive command is generated;

[0013] According to the avoidance drive command, the clamping mechanism is controlled to perform an avoidance action, so that the avoidance part of the clamping mechanism avoids the scanning field of view of the optical scanning device during scanning.

[0014] Optionally, the avoidance action includes translational or rotational movement of the avoidance portion on the plane of the wafer to be inspected, wherein the translational or rotational movement causes the avoidance portion to undergo temporary displacement, and the temporary displacement causes the avoidance portion to avoid the scanning field of view of the optical scanning device during scanning.

[0015] Optionally, the specified position is specifically a first scan start position; the first preset scan path includes the first scan start position, the first scan end position, and the first scan direction; the second preset scan path includes a second scan start position, a second scan end position, and a second scan direction; the first scan direction is different from the second scan direction;

[0016] The optical scanning device is controlled to perform two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path, including:

[0017] When the clamping mechanism clamps the wafer to be inspected at the first scan start position, a first scan command is generated;

[0018] According to the first scanning command, the first line scanning camera and the second line scanning camera are respectively controlled to move to the first scanning start position;

[0019] When both the first line scan camera and the second line scan camera are located at the first scan start position, a second scan command is generated;

[0020] According to the second scanning command and in accordance with the first scanning direction, the first line scan camera is controlled to perform the first scan on the front side of the wafer under inspection from the first scanning start position until the first line scan camera moves to the first scanning end position; simultaneously, the second line scan camera is controlled to perform the first scan on the back side of the wafer under inspection from the first scanning start position until the second line scan camera moves to the first scanning end position.

[0021] When both the first line scan camera and the second line scan camera are at the first scan end position, a third scan command is generated;

[0022] According to the third scanning command, the first line scanning camera and the second line scanning camera are respectively controlled to move to the second scanning start position;

[0023] When both the first line scan camera and the second line scan camera are at the second scan start position, a fourth scan command is generated;

[0024] According to the fourth scanning command, and in accordance with the second scanning direction, the first line scan camera is controlled to perform a second scan on the front side of the wafer under inspection from the second scanning start position until the first line scan camera moves to the second scanning end position; simultaneously, the second line scan camera is controlled to perform a second scan on the back side of the wafer under inspection from the second scanning start position until the second line scan camera moves to the second scanning end position.

[0025] Optionally, controlling the optical scanning device to perform two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path respectively further includes:

[0026] Real-time acquisition of the first position feedback information of the optical scanning device;

[0027] Based on the first position feedback information, it is determined whether the optical scanning device has moved into position.

[0028] Optionally, controlling the optical scanning device to perform two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path respectively further includes:

[0029] Based on the feedback information from the first position, a scan trigger pulse signal is generated;

[0030] Based on the scan trigger pulse signal, the first line scan camera and the second line scan camera are synchronously controlled to perform scanning operations.

[0031] Optionally, the optical scanning device is equipped with a front light source and a back light source;

[0032] The method further includes:

[0033] Based on the feedback information from the first position, a light source control signal is generated;

[0034] When the first line scan camera and the second line scan camera are synchronously controlled to perform scanning operations according to the scan trigger pulse signal, the front light source is synchronously controlled to illuminate the scanning field of view of the first line scan camera and the back light source is synchronously controlled to illuminate the scanning field of view of the second line scan camera according to the light source control signal.

[0035] Optionally, the method further includes:

[0036] Acquire the detection trigger signal;

[0037] In response to the detection trigger signal, the clamping mechanism is controlled to move to the designated position;

[0038] When the clamping mechanism is in the designated position, a clamping command is generated;

[0039] According to the clamping command, the clamping mechanism is controlled to clamp the wafer to be inspected at the designated position.

[0040] Optionally, the method further includes:

[0041] Real-time acquisition of the second position feedback information of the clamping mechanism;

[0042] Based on the second position feedback information, it is determined whether the clamping mechanism has moved into place.

[0043] Optionally, the designated location is provided with a testing chamber for placing the wafer to be inspected;

[0044] Before controlling the clamping mechanism to move to the designated position, the method further includes:

[0045] In response to the detection trigger signal, the door of the detection chamber is controlled to open.

[0046] Furthermore, the present invention also provides a wafer surface inspection and control device, applied in the aforementioned wafer surface inspection and control method, the device comprising:

[0047] A scanning control module is used to control an optical scanning device to scan the wafer under inspection twice, according to a first preset scanning path and a second preset scanning path, when the clamping mechanism clamps the wafer under inspection at a designated position. This results in a first front image and a first back image of the wafer under inspection during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer under inspection, respectively. The second preset scanning path is different from the first preset scanning path.

[0048] An avoidance control module is used to control the clamping mechanism to perform avoidance actions during two scanning processes;

[0049] The image stitching module is used to stitch together the first front image and the second front image, and to stitch together the first back image and the second back image, to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0050] In addition, the present invention also provides a wafer surface inspection and control system, the system including a main controller, a clamping mechanism, an optical scanning device and an image processor;

[0051] The main controller is communicatively connected to the clamping mechanism, the optical scanning device, and the image processor, and is used to send corresponding control commands to the clamping mechanism, the optical scanning device, and the image processor, respectively.

[0052] The clamping mechanism is used to clamp the wafer to be inspected at a designated position;

[0053] The optical scanning device is configured to, when the clamping mechanism clamps the wafer to be inspected at the designated position, perform two scans on the wafer to be inspected according to the corresponding control command issued by the main controller, following a first preset scanning path and a second preset scanning path respectively, to obtain a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan; wherein, the optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected respectively; the second preset scanning path is different from the first preset scanning path;

[0054] The clamping mechanism is also used to perform an avoidance action according to the corresponding control command issued by the main controller during the two scanning processes;

[0055] The image processor is also communicatively connected to the optical scanning device, and is used to acquire the first front image, the first back image, the second front image, and the second back image collected by the optical scanning device according to the corresponding control command issued by the main controller; to stitch the first front image and the second front image together, and to stitch the first back image and the second back image together, to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0056] In addition, the present invention also provides a computer storage medium comprising: at least one instruction that, when executed by a computer, implements the method steps of the aforementioned wafer surface inspection and control method.

[0057] The beneficial effects of this invention are as follows: During wafer surface inspection, using a clamping mechanism to hold the wafer under inspection at a designated position ensures the stability of the wafer during scanning, thus improving the accuracy and reliability of wafer surface inspection. When the clamping mechanism holds the wafer under inspection, controlling the optical scanning device to scan the wafer twice according to different preset scanning paths allows for the scanning and inspection of both sides of the wafer from different angles through reasonable scanning path planning. This results in a more comprehensive and complete wafer image, reducing omissions that may occur due to a single scanning path. This method not only streamlines the inspection process but also avoids repeated scanning. Furthermore, it ensures comprehensive inspection while saving time and improving overall efficiency, enabling highly efficient scanning. During both scans, the clamping mechanism is controlled to perform avoidance maneuvers, effectively preventing interference such as obstruction of the scanning field of view or glare (reflection), thus ensuring image quality and improving the accuracy of wafer surface defect assessment. By stitching together the different front and back images obtained from the scans, complete front and back wafer images can be generated, providing a more reliable basis for subsequent wafer surface quality evaluation.

[0058] The wafer surface inspection control method, apparatus, system, and storage medium of the present invention realize automatic wafer surface inspection, improve the automation level of wafer surface inspection, and solve the problems of existing technologies that cannot avoid clamping interference and cannot efficiently obtain complete images of the front and back sides of the wafer. It provides an efficient, accurate, and reliable solution for wafer inspection in the semiconductor manufacturing field, helps to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry. Attached Figure Description

[0059] The features and advantages of the invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the invention in any way. In the drawings:

[0060] Figure 1 A flowchart of a wafer surface inspection and control method according to Embodiment 1 of the present invention is shown;

[0061] Figure 2 This diagram illustrates the interaction process between the gripper mechanism and the entire control system in Embodiment 1 of the present invention.

[0062] Figure 3 This diagram illustrates the scanning path of the three cameras in the first line scan camera of the present invention scanning the front side of the wafer to be inspected during two scanning processes.

[0063] Figure 4 This diagram illustrates the interaction process between the first line scan camera and the entire control system in Embodiment 1 of the present invention.

[0064] Figure 5 A structural diagram of a wafer surface inspection and control device according to Embodiment 2 of the present invention is shown;

[0065] Figure 6 A structural diagram of a wafer surface inspection and control system according to Embodiment 3 of the present invention is shown;

[0066] Figure 7 The actual design diagram of the wafer surface inspection and control system in Embodiment 3 of the present invention is shown.

[0067] Explanation of reference numerals in the attached figures:

[0068] 1. Wafer to be inspected; 2. Clamping mechanism; 3. Inspection chamber; 4. First line scan camera; 5. Second line scan camera; 6. Drive assembly; 21. Gripper; 100. Scanning path of the first camera in the first line scan camera during the first scan; 200. Scanning path of the second camera in the first line scan camera during the first scan; 300. Scanning path of the third camera in the first line scan camera during the first scan; 400. Scanning path of the first camera in the first line scan camera during the second scan; 500. Scanning path of the second camera in the first line scan camera during the second scan; 600. Scanning path of the third camera in the first line scan camera during the second scan. Detailed Implementation

[0069] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0070] In this embodiment of the invention, the term "and / or" describes the relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following associated objects have an "or" relationship.

[0071] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0072] In this embodiment of the invention, the term "multiple" refers to two or more, and other quantifiers are similar.

[0073] Example 1

[0074] This embodiment provides a wafer surface inspection and control method, such as... Figure 1 As shown, the method includes:

[0075] S1: When the clamping mechanism clamps the wafer to be inspected at a designated position, the optical scanning device is controlled to scan the wafer twice according to a first preset scanning path and a second preset scanning path. During the two scans, the clamping mechanism is controlled to perform an avoidance action, thereby obtaining a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected, respectively. The second preset scanning path is different from the first preset scanning path.

[0076] S2: The first front image and the second front image are stitched together, and the first back image and the second back image are stitched together to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0077] During wafer surface inspection, using a clamping mechanism to hold the wafer under inspection at a designated position ensures the stability of the wafer during scanning, contributing to improved accuracy and reliability of wafer surface inspection. When using the clamping mechanism to hold the wafer, controlling the optical scanning device to scan the wafer twice according to different preset scanning paths allows for two-way scanning of the wafer. Firstly, through reasonable scanning path planning, both sides of the wafer are scanned from different angles, resulting in more comprehensive and complete wafer images. This reduces missed detections that might occur with a single scanning path and avoids duplicate scanning. Secondly, it saves inspection time while ensuring comprehensive inspection, improving overall inspection efficiency and enabling high-efficiency scanning. Controlling the clamping mechanism to perform avoidance actions during both scans effectively prevents the clamping mechanism from obstructing the scanning field of view or generating interference factors such as reflections (glare), ensuring image quality and improving the accuracy of wafer surface defect judgment. Stitching the different front and back images obtained from the scans generates complete front and back images of the wafer, providing a more reliable basis for subsequent wafer surface quality evaluation.

[0078] The wafer surface inspection control method of this embodiment realizes automatic wafer surface inspection, improves the automation level of wafer surface inspection, and solves the problems of existing technologies that cannot avoid clamping interference and cannot efficiently obtain complete images of the front and back sides of the wafer. It provides an efficient, accurate and reliable solution for wafer inspection in the semiconductor manufacturing field, which helps to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry.

[0079] The following provides a detailed description of each step in the wafer surface inspection and control method of this embodiment.

[0080] Preferably, before step S1, the method further includes:

[0081] S3: Control the clamping mechanism to clamp the wafer to be inspected at the designated position.

[0082] Furthermore, step S3 specifically includes:

[0083] S31: Acquire the detection trigger signal;

[0084] S32: In response to the detection trigger signal, control the clamping mechanism to move to the designated position;

[0085] S33: When the clamping mechanism is in the designated position, a clamping command is generated;

[0086] S34: According to the clamping command, control the clamping mechanism to clamp the wafer to be inspected at the designated position.

[0087] By controlling the clamping mechanism as described above, it is ensured that the clamping mechanism moves to the required position (i.e., the designated position) and stably clamps the wafer, thus laying a good foundation for subsequent scanning and inspection work. Only when the wafer to be inspected is firmly clamped can it be guaranteed that there will be no displacement or shaking during the scanning process, thereby ensuring the accuracy and reliability of the acquired images.

[0088] Specifically, in step S31, the detection trigger signal can be generated manually by the operator, such as by pressing the start button on the control panel, to trigger the device to generate the detection trigger signal; or it can be automatically generated by the system according to a preset detection time interval, and the system will automatically issue the detection trigger signal when the set time is reached. In practical applications, the generation method of the detection trigger signal can be flexibly selected according to different production needs and detection scenarios.

[0089] Upon receiving the detection trigger signal, the system proceeds to step S32. In this step, the system responds to the detection trigger signal and, based on pre-set motion parameters and path planning, controls the clamping mechanism to move towards the designated position. The designated position can be a pre-set receiving position.

[0090] In step S33, once the clamping mechanism has moved to the designated position, the system quickly generates a clamping command. This command may include precise parameters such as clamping force and action time to ensure that the clamping mechanism can stably and appropriately clamp the wafer to be inspected at the designated position. The appropriate clamping force can be selected or adjusted according to the actual situation. If the force is too large, it may damage the wafer; if the force is too small, the stability of the wafer during the scanning process cannot be guaranteed.

[0091] Finally, in step S34, after receiving the clamping command, the clamping mechanism immediately executes the clamping action according to the parameters in the command. During the clamping process, the system can also continuously monitor the magnitude of the clamping force and provide real-time feedback of the clamping force information through a force sensor to ensure that the clamping force is always kept within a suitable range. If an abnormality in the clamping force is detected, the system will make timely adjustments to ensure stable clamping of the wafer and provide reliable conditions for subsequent optical scanning inspection.

[0092] By controlling the clamping mechanism before the two scans, the wafer under inspection can be stably clamped before scanning, providing a solid foundation for subsequent optical scanning inspection. With stable clamping, the optical scanning device can accurately and efficiently scan the wafer according to the preset scanning path, thereby precisely capturing detailed information on the wafer surface and improving the accuracy and reliability of wafer surface inspection.

[0093] Furthermore, before generating the clamping instructions, step S3 also includes:

[0094] S35: Obtain the second position feedback information of the clamping mechanism in real time;

[0095] S36: Based on the second position feedback information, determine whether the clamping mechanism has moved into place.

[0096] Before generating the clamping command, the system accurately determines whether the clamping mechanism has moved to the designated position using real-time second position feedback information. If the second position feedback indicates that the clamping mechanism has not moved into place, the system can promptly adjust the movement path and speed of the clamping mechanism to ensure it reaches the designated position as quickly and accurately as possible, avoiding situations where the wafer cannot be effectively clamped due to inaccurate clamping mechanism positioning. The system only generates the clamping command after determining that the clamping mechanism has moved into place. This effectively avoids issuing erroneous clamping commands when the clamping mechanism is not in position, thus ensuring the accuracy and stability of the entire inspection process.

[0097] For example, the coordinates of a specified position are precise three-dimensional coordinates (X1, Y1, Z1). Real-time acquired second position feedback information reveals the actual coordinates of the clamping mechanism (X2, Y2, Z2). The system can compare these two sets of coordinates to calculate the deviation. If the deviation is within the allowable error range, the clamping mechanism is considered to have moved into position. If the deviation exceeds the error range, the system will control the clamping mechanism to continue moving and adjusting its position until the required position is achieved. During the judgment process, the system can also set a short time interval for acquiring and judging the second position feedback information, further improving the accuracy and timeliness of the judgment. Simultaneously, the system can use multiple sensors to collect position information and perform comprehensive analysis and processing of the collected information to avoid inaccurate position feedback information caused by external interference during movement, ensuring the reliability of the acquired second position feedback information. This maximizes the accuracy of the clamping mechanism's movement to the specified position, thereby achieving stable clamping of the wafer under inspection and providing reliable assurance for subsequent wafer surface inspection.

[0098] Specifically, the sensor that acquires the second position feedback information can be of various types, such as laser displacement sensors and encoders. Laser displacement sensors determine the position of an object by emitting a laser beam and measuring the time or angle of the reflected light. They are characterized by high precision and high speed, enabling real-time and accurate acquisition of the position information of the clamping mechanism. They can be installed on key components of the clamping mechanism to precisely capture its position changes. Encoders, on the other hand, can be installed on the drive shaft of the clamping mechanism. By measuring the shaft's rotation angle and number of revolutions, they calculate the position of the clamping mechanism, offering a simple structure and high reliability.

[0099] In practical applications, the appropriate sensor can be selected based on specific detection needs and scenarios. For example, for detection scenarios with extremely high positional accuracy requirements, laser displacement sensors can be prioritized; while for scenarios where cost is more sensitive and positional accuracy requirements are not particularly stringent, encoders can be prioritized. Of course, multiple sensors can also be used in combination to mutually verify and supplement the collected information.

[0100] In this embodiment, the clamping mechanism includes grippers, gripper motors, gripper drivers, and gripper controllers. There are multiple grippers, which can be three, four, or more evenly distributed along the outer periphery of the wafer to be inspected. These grippers can stably clamp the wafer from multiple directions, maintaining its balance and stability during scanning. The gripper motors provide power for the movement of the grippers. The gripper drivers receive instructions from the gripper controllers and drive the gripper motors accordingly. The gripper controllers receive instructions from the entire control system and coordinate the gripper movements according to the overall control logic of the system. Each gripper may also be equipped with a position sensor and a force sensor. The position sensor provides real-time feedback on the position of the corresponding gripper (i.e., second position feedback information), and the force sensor provides real-time feedback on the clamping force on the corresponding gripper.

[0101] During wafer surface inspection, when the control system issues a clamping command, the gripper controller generates a pulse signal based on the parameters in the command. This pulse signal, via the gripper driver, controls the gripper motor to gradually close and clamp the wafer to be inspected. During clamping, the gripper controller also incorporates clamping force information from a force sensor to adjust the gripper motor's operation in real time, ensuring the clamping force remains within a suitable range. Simultaneously, a position sensor collects second-position feedback information in real time, ensuring the gripper moves accurately to the designated position and stably clamps the wafer to be inspected.

[0102] The gripper material needs to possess a certain degree of hardness and wear resistance to ensure good performance after multiple gripping operations. The shape and size of the gripper also need to be optimized according to the specifications of the wafer to be inspected to ensure good contact with the wafer surface and achieve stable gripping. In practical applications, various gripper specifications can be designed according to different wafer types and inspection requirements to improve the versatility and adaptability of the gripping mechanism. This embodiment does not impose specific limitations on the material, shape, and size of the gripper described above.

[0103] In this embodiment, the interaction process between the gripper mechanism and the entire control system is as follows: Figure 2 As shown.

[0104] Preferably, the designated location is provided with a testing chamber for placing the wafer to be inspected;

[0105] Before controlling the clamping mechanism to move to the designated position, the method further includes:

[0106] S4: In response to the detection trigger signal, control the door of the detection chamber to open.

[0107] Opening the inspection chamber door creates conditions for the subsequent clamping mechanism to smoothly enter the designated position and clamp the wafer to be inspected. Only after confirming that the chamber door is fully open, the internal environment is stable, and there are no abnormalities will the system control the clamping mechanism to begin moving to the designated position according to the pre-set motion parameters and path planning.

[0108] In practical applications, parameters such as the opening speed and angle of the door are preset according to the requirements of the detection process. After the door opens, the control system can also monitor the opening status of the door in real time. Specifically:

[0109] Real-time acquisition of the third position feedback information of the compartment door;

[0110] Based on the feedback information from the third location, determine whether the compartment door is fully opened.

[0111] Similarly, third-position feedback information can be obtained by setting up devices such as position sensors. Only after confirming that the door is fully open will the system continue to control the clamping mechanism to move to the designated position, in order to avoid the clamping mechanism colliding with the door when it is not fully open, which could cause damage to the equipment.

[0112] Furthermore, once the wafer door is fully open, the wafer robot can load and unload the wafers to be inspected. After the clamping mechanism clamps the wafers to be inspected at the designated position, the method also includes:

[0113] S5: Control the door of the detection chamber to close.

[0114] Step S5 specifically includes:

[0115] S51: When the clamping mechanism clamps the wafer to be inspected at the designated position, a door closing command is generated;

[0116] S52: Control the closing of the detection chamber door according to the chamber door closing command.

[0117] After the clamping mechanism holds the wafer to be inspected, closing the inspection chamber door ensures a relatively closed and stable inspection environment, providing favorable conditions for subsequent optical scanning. Optical scanning in this stable environment effectively reduces interference from external factors, further improving the accuracy and reliability of wafer surface inspection. Simultaneously, closing the chamber door helps protect operator safety, preventing accidents during the inspection process.

[0118] Specifically, in step S51, the door closing command includes parameters such as the door closing speed and force to ensure smooth and safe closure. In step S52, after receiving the closing command, the door will execute the closing action according to the parameters in the command. During the closing process, the system will also continuously monitor the door's position, using real-time feedback information from the position sensor to ensure the door closes accurately. If an abnormality is detected during the door closing process, such as encountering an obstacle and being unable to close properly, the system will promptly issue an alarm and take corresponding measures, such as stopping the closing action or opening the door, to ensure the safety of the equipment and wafers.

[0119] In this embodiment, the designated position is specifically a first scan start position; the first preset scan path includes the first scan start position, the first scan end position, and the first scan direction; the second preset scan path includes a second scan start position, a second scan end position, and a second scan direction; the first scan direction is different from the second scan direction;

[0120] In step S1, the optical scanning device is controlled to perform two scans on the wafer to be inspected according to the first preset scanning path and the second preset scanning path, including:

[0121] S11: When the clamping mechanism clamps the wafer to be inspected at the first scanning start position, a first scanning command is generated;

[0122] S12: According to the first scanning command, control the first line scanning camera and the second line scanning camera to move to the first scanning start position respectively;

[0123] S13: When both the first line scan camera and the second line scan camera are located at the first scan start position, a second scan command is generated;

[0124] S14: According to the second scanning instruction, and in accordance with the first scanning direction, control the first line scan camera to perform the first scan on the front side of the wafer to be inspected from the first scanning start position until the first line scan camera moves to the first scanning end position; simultaneously control the second line scan camera to perform the first scan on the back side of the wafer to be inspected from the first scanning start position until the second line scan camera moves to the first scanning end position.

[0125] S15: When both the first line scan camera and the second line scan camera are at the first scan end position, a third scan command is generated;

[0126] S16: According to the third scanning command, control the first line scanning camera and the second line scanning camera to move to the second scanning start position respectively;

[0127] S17: When both the first line scan camera and the second line scan camera are located at the second scan start position, a fourth scan command is generated;

[0128] S18: According to the fourth scanning instruction, and in accordance with the second scanning direction, control the first line scan camera to perform a second scan on the front side of the wafer under inspection from the second scanning start position until the first line scan camera moves to the second scanning end position; simultaneously control the second line scan camera to perform a second scan on the back side of the wafer under inspection from the second scanning start position until the second line scan camera moves to the second scanning end position.

[0129] Steps S11-S14 constitute the first scanning process, and steps S15-S18 constitute the second scanning process. In both scanning processes, according to the corresponding scanning commands (specifically, the first and third scanning commands), the two line scan cameras are first moved to their corresponding starting positions (specifically, the first and second scanning starting positions), ensuring accurate positioning of the two line scan cameras during both scanning processes. Then, according to subsequent scanning commands (specifically, the second and fourth scanning commands), the front and back sides of the wafer are scanned simultaneously in different scanning directions (specifically, the first and second scanning directions) until the corresponding ending positions are reached (specifically, the first and second scanning ending positions). By scanning the wafer twice from different directions according to different scanning commands in the two scanning processes, more comprehensive detailed information of the wafer surface can be captured. Different scanning directions allow the scan to cover a larger area, reducing blind spots and increasing the probability of detecting defects on the wafer surface.

[0130] Specifically, the first scan command in step S11 and the third scan command in step S15 can be pulse signal commands. Each command contains parameters such as the speed, acceleration, and movement time required for the line scan camera to move to the corresponding starting position. By sending these pulse signal commands to the line scan camera's drive mechanism, the system can precisely control its movement. For example, the system calculates the trajectory and time required to move from the current position to the first scan starting position based on a preset algorithm, and then converts this information into pulse signals to drive the line scan camera to accurately move to the target position.

[0131] The second scan command in step S13 and the fourth scan command in step S17 focus on controlling the scanning process. These can also be pulse signal commands, which include key parameters such as scan speed, scan resolution, and exposure time. Scan speed determines the movement speed of the line scan camera during the scan process; a suitable scan speed ensures efficient and high-quality image acquisition. Scan resolution determines the clarity of the acquired image; higher resolution captures richer details of the wafer surface. Exposure time directly affects the brightness and contrast of the image; a reasonable exposure time allows the acquired image to accurately reflect the true condition of the wafer surface.

[0132] Different scanning directions can be set to inspect the wafer surface from multiple angles. For example, by establishing a planar coordinate system with the plane of the wafer, the first scanning direction can be the x-direction of this coordinate system, the second scanning direction can be the y-direction, and the third scanning direction can also be the -x-direction. All of these scanning directions can comprehensively cover the wafer surface, detecting more defects of different types and directions. Furthermore, during the scanning process, the line scan camera can quickly and accurately capture the light information reflected or transmitted from the wafer surface, converting it into electrical signals. These signals are then processed by subsequent image processing and analysis algorithms to identify potential surface defects such as scratches, cracks, and impurities.

[0133] In this embodiment, both the first and second line scan cameras include multiple cameras, each responsible for image acquisition in a different area. Taking three cameras as an example, the layout and cooperation of the three cameras in the first and second line scan cameras enable more efficient coverage of the wafer surface during scanning. During scanning, the three cameras start synchronously and acquire images systematically according to the corresponding scanning instructions. Specifically, the first camera in each line scan camera can be responsible for acquiring image information of the central area of ​​the wafer surface. Since the central area plays an important role in the entire wafer and may contain key circuits and patterns, this camera has higher requirements in terms of resolution and sensitivity, and can accurately capture minute defects and details. The second and third cameras can focus on scanning different edge areas of the wafer. The edge parts are easily affected by external factors, resulting in defects such as chipping and scratches, and can comprehensively detect various edge conditions.

[0134] In this embodiment, a planar coordinate system is established using the plane where the wafer is located. The first scanning direction is the x-direction of this planar coordinate system. After the first scan is completed, the first and second line scan cameras translate a certain distance along the y-direction, so that the first and second line scan cameras are located at the starting position of the second scan. Then, the second scanning direction is the -x-direction of this planar coordinate system, and the scan proceeds from the starting position of the second scan to the ending position of the second scan. Taking three cameras as an example for both the first and second line scan cameras, the scanning paths of the three cameras in the first line scan camera during the two scans are as follows: Figure 3 As shown. In Figure 3 In the diagram, 1 refers to the wafer under inspection. Paths 100, 200, and 300 are the scanning paths of the three cameras in the first line scan camera during the first scan. Paths 400, 500, and 600 are the scanning paths of the three cameras in the second line scan camera during the second scan. The scanning paths of the three cameras in the second line scan camera during the two scans of the reverse side of the wafer are similar and will not be shown here.

[0135] During the two scanning processes, the image data acquired by the three cameras in the two line scan cameras are transmitted to the image processing system in real time. In this embodiment, the line scan cameras have high sensitivity, high resolution, fast data acquisition capabilities, and good anti-interference capabilities to ensure accurate capture of image information on the wafer surface during high-speed scanning and to effectively resist the influence of external light, electromagnetic interference, and other factors.

[0136] Preferably, in step S1, controlling the optical scanning device to perform two scans on the wafer to be inspected according to a first preset scanning path and a second preset scanning path respectively further includes:

[0137] S19: Real-time acquisition of the first position feedback information of the optical scanning device;

[0138] S110: Based on the first position feedback information, determine whether the optical scanning device has moved into position.

[0139] During the two scans performed by the optical scanning device along the first and second preset scanning paths, precise control and real-time monitoring of its position ensure the integrity and accuracy of the scan. By continuously acquiring and judging the first position feedback information, it can be ensured that the line scan camera always moves along the preset path during the scanning process, thereby comprehensively and accurately acquiring image information of the wafer surface. The acquired image data provides a reliable basis for subsequent image processing and defect analysis, further improving the accuracy and efficiency of wafer surface inspection.

[0140] The aforementioned first position feedback information can be obtained by installing a high-precision position sensor on the optical scanning device. This position sensor can accurately sense the positional changes of the optical scanning device in all directions and feed this information back to the control system in real time. After receiving the first position feedback information, the control system compares it with a pre-set target position. If they match, it indicates that the optical scanning device has moved into position; if there is a deviation, the control system will quickly adjust the control commands to the optical scanning device to correct its position and ensure that it moves accurately to the designated position.

[0141] It should be understood that the steps for determining whether the optical scanning device has moved into position (i.e., steps S19-S110) are performed in real time during both scans. More specifically, after step S12 and before step S13, steps S19-S110 are required to determine whether both the first and second line scanning cameras have moved to the first scan start position based on the real-time first position feedback information; after step S15 and before step S16, steps S19-S110 are required to determine whether both the first and second line scanning cameras have moved to the first scan end position based on the real-time first position feedback information; similarly, after step S16 and before step S17, and after step S18 and before step S19, steps S19-S110 are required to determine whether the device has moved to the second scan start position and the second scan end position, respectively.

[0142] Preferably, in step S1, controlling the optical scanning device to perform two scans on the wafer to be inspected according to a first preset scanning path and a second preset scanning path respectively further includes:

[0143] S111: Generate a scan trigger pulse signal based on the first position feedback information;

[0144] S112: Based on the scan trigger pulse signal, synchronously control the first line scan camera and the second line scan camera to perform scanning operations.

[0145] The scanning trigger pulse signal is generated based on the first position feedback information. This ensures that the two line scan cameras start operating at the precise moment they reach the preset scanning position. For example, when the first and second line scan cameras move to the first or second scan start position respectively, the control system generates a scanning trigger pulse signal based on the precise first position feedback information, immediately controlling the cameras to begin scanning. Furthermore, this scanning trigger pulse signal carries not only the precise command to start scanning (i.e., parameters such as the signal trigger time and intensity), but also information such as the pulse signal period and frequency. Based on this information, the scanning frequency can be controlled, allowing the two line scan cameras to stably and efficiently acquire image information from the wafer surface at the specified operating frequency when scanning begins. Therefore, throughout the scanning process, the control system continuously monitors the first position feedback information to ensure that the line scan cameras always move along the preset path and accurately trigger scanning at the appropriate position and operating frequency.

[0146] The scanning trigger pulse signal generation and transmission mechanism in this embodiment also ensures the synchronization of the two line scan cameras. Whether in the first or second scan, the first and second line scan cameras can start scanning simultaneously at precise times and the same scanning frequency, thereby achieving synchronous detection of the front and back sides of the wafer. Based on this synchronous scanning method, not only is detection efficiency improved, but the temporal and spatial consistency of the acquired front and back image information is also guaranteed, providing more reliable data support for subsequent image processing and defect analysis.

[0147] Specifically, the optical scanning device in this embodiment includes two line scanning cameras, as well as camera motors, camera motor drivers, camera controllers, and camera position sensors corresponding to each line scanning camera. The camera motors drive the movement of the two line scanning cameras, enabling them to move precisely along a preset scanning path. The camera motor drivers provide appropriate drive signals and power support to the camera motors, ensuring stable and accurate operation. The camera controller, as the core control component of the entire optical scanning device, is responsible for receiving various instructions from the entire control system and processing various instructions and feedback information. The camera position sensor, responsible for collecting first position feedback information, can be integrated into the camera motor.

[0148] The camera controller receives scanning commands from the control system and position feedback information from the camera position sensor. After analyzing and processing this information, it sends control signals to the camera motor driver to adjust parameters such as the camera motor's speed and direction, ensuring the line scan camera accurately reaches the designated position. Simultaneously, the camera controller generates a scan trigger pulse signal based on the initial position feedback information and transmits it to the line scan camera, triggering it to begin scanning. Furthermore, the camera controller strictly controls the simultaneous start and stop of scanning by both line scan cameras based on the scan trigger pulse signal, ensuring they operate at the same scanning frequency and maintaining synchronization during the scanning process. Through the precise control and coordination of the camera controller, the entire optical scanning device can efficiently and stably complete two scans of the wafer surface, providing high-quality image data for subsequent wafer surface inspection.

[0149] Taking the first-line scanning camera as an example, its interaction process with the entire control system is as follows: Figure 4 As shown, the interaction process of the second line scan camera is similar and will not be shown here.

[0150] Preferably, the optical scanning device is equipped with a front light source and a back light source;

[0151] In S1, controlling the optical scanning device to perform two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path, further includes:

[0152] S113: Generate a light source control signal based on the first position feedback information;

[0153] S114: When the first line scan camera and the second line scan camera are synchronously controlled to perform scanning work according to the scan trigger pulse signal, the front light source is synchronously controlled to illuminate the scanning field of view of the first line scan camera and the back light source is synchronously controlled to illuminate the scanning field of view of the second line scan camera according to the light source control signal.

[0154] During the two scans conducted by the two line scan cameras, in addition to controlling the scanning operation of the line scan cameras, a light source control signal is generated using the first position feedback information to control the operation of the light sources (including the front light source and the back light source). This ensures that during the scanning process, parameters such as the on / off state of the light sources and the light intensity are precisely matched with the scanning actions of the line scan cameras. Thus, synchronous control of the two light sources is achieved not only of the line scan cameras but also of the line scan cameras themselves. The front light source provides sufficient and uniform illumination to the scanning field of view of the first line scan camera, clearly highlighting surface defects such as scratches and cracks that may exist on the front side of the wafer under inspection, helping the line scan camera accurately capture these subtle features. The back light source illuminates the scanning field of view of the second line scan camera, providing a clear image of the back side of the wafer under inspection, allowing the inspector to fully understand the condition of both sides of the wafer. By synchronously controlling the illumination of the front and back light sources, it is ensured that the front and back sides of the wafer under inspection are always under optimal illumination conditions during the scanning process. In this way, the line scan camera can always obtain high-quality and clear image information when acquiring image data, providing a more reliable basis for subsequent image processing and defect analysis, and further improving the accuracy and efficiency of wafer surface inspection.

[0155] Preferably, in S1, during the two scanning processes, controlling the clamping mechanism to perform an avoidance action includes:

[0156] S115: Acquire the avoidance trigger signal during the two scans;

[0157] S116: In response to the avoidance trigger signal, generate an avoidance drive command;

[0158] S117: According to the avoidance drive command, control the clamping mechanism to perform an avoidance action, so that the avoidance part of the clamping mechanism avoids the scanning field of view of the optical scanning device during scanning.

[0159] During wafer surface inspection, the control system analyzes and processes the avoidance trigger signal upon receiving it, generating an avoidance drive command. This command contains detailed information about the clamping mechanism, such as the direction, distance, and speed of the avoidance action. These parameters are precisely determined based on the scanning range and requirements of the optical scanning device to ensure that the avoidance mechanism accurately avoids the scanning field of view, preventing interference with the scanning process.

[0160] When the clamping mechanism receives an avoidance drive command, its internal drive system responds immediately, driving the avoidance part of the clamping mechanism to move according to the command. For example, if the scanning path of the optical scanning device is about to pass through a certain part of the clamping mechanism (such as one of the grippers), that part is the avoidance part. The clamping mechanism will quickly move that part (such as the gripper) away to ensure the smooth progress of the scanning process. Throughout the entire avoidance action, the control system also monitors the position and status of the clamping mechanism in real time to ensure that it accurately executes the avoidance action and can promptly return to its original position after scanning is completed, so as to perform subsequent wafer clamping and operations.

[0161] This embodiment, through the aforementioned obstacle avoidance control method, effectively controls the clamping mechanism to perform obstacle avoidance actions during the two scanning processes. This prevents the clamping mechanism from obstructing or interfering with the scanning of the optical scanning device, ensuring the continuity and accuracy of the scanning work. Simultaneously, the automation and precise control of the entire obstacle avoidance process also improves the efficiency and reliability of wafer surface inspection, providing strong support for quality control during wafer manufacturing.

[0162] Specifically, in step S115, the avoidance trigger signal can be generated by various different conditions. For example, in one optional embodiment, when the optical scanning device approaches the clamping mechanism to a certain distance, a distance sensor installed on the optical scanning device or the clamping mechanism will detect the change in distance and generate an avoidance trigger signal. This distance sensor can be an infrared sensor, a laser sensor, etc., all of which can accurately measure the distance between the two and promptly issue a signal when a preset safe distance is reached.

[0163] In another alternative implementation, when the scanning path of the optical scanning device changes and is about to enter the area where the clamping mechanism is located, the control system can predict potential interference in advance based on the preset scanning path and the position information of the clamping mechanism, and generate a corresponding avoidance trigger signal. This path planning-based triggering method can provide early warning, giving the clamping mechanism sufficient time to respond and ensuring the smooth progress of the scanning operation.

[0164] In both of the above implementations, the avoidance trigger signal is determined by the distance information collected by the distance sensor.

[0165] Furthermore, in the third embodiment, the avoidance trigger signal can also be manually triggered by the operator. In certain special circumstances, the operator may determine that the clamping mechanism needs to avoid a collision based on the actual situation. In this case, the operator can send an avoidance trigger signal to the control system through the operating interface or control buttons. This manual triggering method increases operational flexibility and can cope with some emergencies or special needs.

[0166] By generating avoidance trigger signals in multiple ways, various factors that may affect the scanning process can be perceived comprehensively and in a timely manner, ensuring that the clamping mechanism performs avoidance actions at the appropriate time, thereby further improving the quality and efficiency of wafer surface inspection.

[0167] Specifically, in step S116, the avoidance drive command can include various control parameters to ensure that the gripping mechanism can accurately execute the avoidance action. These parameters may include the speed, direction of rotation, and running time of the gripper drive motor. The speed control of the gripper drive motor can be precisely set according to the actual requirements of the distance and time of the avoidance action. The direction parameter determines the direction of movement of the avoidance part of the gripping mechanism, and precisely determines whether to move left, right, up, or down based on the scanning path of the optical scanning device and the positional relationship of the gripping mechanism. The running time parameter specifies the time required for the gripping mechanism to complete the avoidance action, ensuring that the gripping mechanism can avoid the scanning field of view in a timely and stable manner during scanning.

[0168] When generating avoidance drive commands, the control system dynamically adjusts these parameters based on the type and specific circumstances of the avoidance trigger signal. For example, when the avoidance trigger signal is generated by a distance sensor detecting the approach of an optical scanning device, the control system quickly calculates the appropriate rotation speed, steering direction, and running time based on the real-time distance and relative position between the two devices, generating precise avoidance drive commands. If the avoidance trigger signal is determined in advance based on a preset scanning path plan, the control system optimizes the parameters of the drive command by combining the moving speed and direction of the optical scanning device with the initial position of the clamping mechanism to achieve the best avoidance effect.

[0169] Specifically, in step S117, the generated avoidance drive command is transmitted to the drive system of the clamping mechanism. The drive system can employ different drive methods such as electric, hydraulic, or pneumatic. Taking an electric drive system as an example, the drive command is converted into a corresponding current or voltage signal, driving the motor to rotate, thereby moving the avoidance part of the clamping mechanism. During the drive process, the drive system provides real-time feedback on the motion status of the clamping mechanism, such as position and speed, so that the control system can make real-time adjustments and optimizations to ensure that the clamping mechanism can accurately execute the avoidance action.

[0170] In step S117, the clearance part of the clamping mechanism refers to components such as grippers and support arms that directly contact the wafer or may enter the scanning field of view.

[0171] Furthermore, the avoidance action includes translational or rotational movement of the avoidance portion on the plane where the wafer to be inspected is located. The translational or rotational movement causes the avoidance portion to undergo temporary displacement, and the temporary displacement causes the avoidance portion to avoid the scanning field of view of the optical scanning device during scanning.

[0172] When performing the avoidance action, the avoidance part of the clamping mechanism can flexibly adjust its position without affecting the normal testing of the wafer by translating or rotating on the plane where the wafer to be tested is located.

[0173] Translational motion can quickly and directly change the position of the avoidance part, especially when a large movement is required to avoid the scanning field of view. Translation can efficiently achieve avoidance. This motion enables components such as grippers or support arms to move quickly to the appropriate position, ensuring the smooth progress of the scanning operation. For example, when the gripper may enter the scanning field of view, it can be moved out of the scanning range by translating along the plane of the wafer to be inspected.

[0174] During translational movement, the avoidance drive command generated by the control system includes information such as the translation distance and direction. Based on this command, the avoidance component moves along the predetermined direction. Simultaneously, position sensors monitor the position of the avoidance component in real time to ensure it accurately reaches the designated location. If a deviation occurs during movement, the control system adjusts the drive signal promptly to correct it.

[0175] Rotation, on the other hand, is more flexible. In situations where space is limited, rotation can adjust the position of the avoidance part within a small range, avoiding impact on surrounding equipment or other components. For example, when the support arm might interfere with scanning in a confined space, rotating it at a certain angle can cleverly avoid the scanning area without colliding with surrounding equipment.

[0176] During rotational motion, the control system generates avoidance drive commands that include the rotation angle and direction. Based on these commands, the avoidance mechanism rotates, and sensors provide real-time feedback on the rotation angle and speed. This precise control and feedback mechanism ensures the accuracy and stability of the rotational motion.

[0177] Whether it's translational or rotational motion, the clearance section of the clamping mechanism needs to return to its original position promptly after scanning. The control system generates a recovery drive command based on previously recorded original position information the instant the scan ends or when the clearance section is unobstructed. This command includes the motion parameters required for the clearance section to return to its initial position, such as the reverse translation distance and the reverse rotation angle. Upon receiving the recovery drive command, the drive system drives the clearance section to move in the reverse direction as required by the command until it returns to its original position. During the recovery process, position and angle sensors continuously monitor the position and angle of the clearance section to ensure it accurately returns to its initial state, preparing it for the next wafer clamping and inspection operation.

[0178] Through the flexible translation and rotation avoidance movements and precise recovery mechanism of this embodiment, the clamping mechanism can effectively avoid the scanning field of view without affecting wafer inspection, ensuring the smooth progress of the scanning work. At the same time, it improves the stability and reliability of the entire wafer surface inspection system, providing a solid guarantee for high-quality control of wafer production.

[0179] Furthermore, to further improve scanning efficiency, the control system can optimize the avoidance action of the clamping mechanism. For example, between two scans, when the optical scanning device switches from the first preset scanning path to the second preset scanning path, since both paths are pre-planned, the time it takes for the optical scanning device to reach the avoidance section can be calculated. The control system can then plan the avoidance action of the clamping mechanism in advance based on this time, ensuring the clamping mechanism completes the avoidance before the optical scanning device arrives, thereby reducing waiting time and improving the efficiency of the entire detection process.

[0180] This embodiment, through the complete steps S1 described above, can obtain the front and back images of the wafer under inspection during two scanning processes, namely, the first front image and the first back image obtained in the first scanning process, and the second front image and the second back image obtained in the second scanning process. Then, in step S2, by stitching the two front images and the two back images respectively, complete front and back images of the wafer under inspection (i.e., complete front image and complete back image) can be obtained. Through subsequent image processing and defect analysis, image processing technology can be used to accurately identify various defects existing on the wafer surface, realizing wafer surface inspection and providing strong support for wafer quality assessment and production process optimization.

[0181] The specific operation method for image stitching can adopt existing image processing technology, and this embodiment does not impose any restrictions.

[0182] Example 2

[0183] This embodiment provides a wafer surface inspection and control device, such as... Figure 5 As shown, in the wafer surface inspection and control method of Application Example 1, the device includes:

[0184] A scanning control module is used to control an optical scanning device to scan the wafer under inspection twice, according to a first preset scanning path and a second preset scanning path, when the clamping mechanism clamps the wafer under inspection at a designated position. This results in a first front image and a first back image of the wafer under inspection during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer under inspection, respectively. The second preset scanning path is different from the first preset scanning path.

[0185] An avoidance control module is used to control the clamping mechanism to perform avoidance actions during two scanning processes;

[0186] The image stitching module is used to stitch together the first front image and the second front image, and to stitch together the first back image and the second back image, to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0187] In this embodiment, during wafer surface inspection, the clamping mechanism holds the wafer to be inspected at a designated position, ensuring the stability of the wafer during scanning and improving the accuracy and reliability of wafer surface inspection. When the clamping mechanism holds the wafer, the scanning control module controls the optical scanning device to perform two scans of the wafer according to different preset scanning paths. This allows for reasonable scanning path planning, enabling scanning and inspection of both the front and back sides of the wafer from different angles, resulting in a more comprehensive and complete wafer image. This reduces the possibility of missed detections due to a single scanning path and avoids... The elimination of repeated scanning not only ensures comprehensive inspection but also saves inspection time and improves overall inspection efficiency, enabling high-efficiency scanning. During both scans, the avoidance control module controls the clamping mechanism to perform avoidance actions, effectively preventing the clamping mechanism from obstructing the scanning field of view or causing interference factors such as reflections (glare), ensuring image quality and thus improving the accuracy of wafer surface defect judgment. Finally, the image stitching module stitches the different front and back images obtained from the scans to generate complete front and back images of the wafer, providing a more reliable basis for subsequent evaluation of wafer surface quality.

[0188] The wafer surface inspection control device in this embodiment realizes automatic wafer surface inspection, improves the automation level of wafer surface inspection, and solves the problems of existing technologies that cannot avoid clamping interference and cannot efficiently obtain complete images of the front and back sides of the wafer. It provides an efficient, accurate and reliable solution for wafer inspection in the semiconductor manufacturing field, which helps to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry.

[0189] The functions of each module in the wafer surface inspection and control device described in this embodiment are the same as the method steps of the wafer surface inspection and control method described in Embodiment 1. Therefore, for details not covered in this embodiment, please refer to Embodiment 1 and... Figures 1 to 4 The specific details will not be repeated here.

[0190] Example 3

[0191] This embodiment provides a wafer surface inspection and control system, such as Figure 6 As shown, the system includes a main controller, a clamping mechanism, an optical scanning device, and an image processor;

[0192] The main controller is communicatively connected to the clamping mechanism, the optical scanning device, and the image processor, and is used to send corresponding control commands to the clamping mechanism, the optical scanning device, and the image processor, respectively.

[0193] The clamping mechanism is used to clamp the wafer to be inspected at a designated position;

[0194] The optical scanning device is configured to, when the clamping mechanism clamps the wafer to be inspected at the designated position, perform two scans on the wafer to be inspected according to the corresponding control command issued by the main controller, following a first preset scanning path and a second preset scanning path respectively, to obtain a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan; wherein, the optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected respectively; the second preset scanning path is different from the first preset scanning path;

[0195] The clamping mechanism is also used to perform an avoidance action according to the corresponding control command issued by the main controller during the two scanning processes;

[0196] The image processor is also communicatively connected to the optical scanning device, and is used to acquire the first front image, the first back image, the second front image, and the second back image collected by the optical scanning device according to the corresponding control command issued by the main controller; to stitch the first front image and the second front image together, and to stitch the first back image and the second back image together, to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

[0197] The wafer surface inspection and control system described in this embodiment realizes automatic wafer surface inspection, improves the automation level of wafer surface inspection, and solves the problems of existing technologies that cannot avoid clamping interference and cannot efficiently obtain complete images of the front and back sides of the wafer. It provides an efficient, accurate and reliable solution for wafer inspection in the semiconductor manufacturing field, which helps to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry.

[0198] Specifically, in this embodiment, the actual design diagram of the wafer surface inspection and control system is as follows: Figure 7 As shown, in Figure 7 In the diagram, 1 is the wafer to be inspected, 2 is the clamping mechanism, 21 is the gripper in the clamping mechanism, 3 is the inspection chamber, 4 is the first line scan camera (including 3 cameras) in the optical scanning device, 5 is the second line scan camera (including 3 cameras) in the optical scanning device, and 6 is the driving component that drives the first and second line scan cameras. The main controller and image processor of the system are not shown in the diagram.

[0199] Similarly, for details not covered in this embodiment, please refer to Embodiment 1, Embodiment 2, and... Figures 1 to 6 The specific details will not be repeated here.

[0200] Example 4

[0201] This embodiment provides another wafer surface inspection and control device, including a processor, a memory, and a computer program stored in the memory and executable on the processor. When the computer program is executed, it implements the method steps in the wafer surface inspection and control method of Embodiment 1.

[0202] By using a computer program stored in memory and running on a processor, automatic wafer surface inspection is achieved, improving the automation level of wafer surface inspection. This solves the problems of unavoidable clamping interference and inefficient acquisition of complete images of both sides of the wafer in existing technologies. It provides an efficient, accurate, and reliable solution for wafer inspection in the semiconductor manufacturing field, helping to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry.

[0203] The processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor. The processor is the control center of the computer device, connecting all parts of the computer device through various interfaces and lines.

[0204] Memory can be used to store computer programs and / or models. The processor performs various functions of the computer device by running or executing the computer programs and / or models stored in the memory, and by accessing data stored in the memory. Memory can primarily include a program storage area and a data storage area. The program storage area can store the operating system and at least one application program required for a function (e.g., sound playback, image playback, etc.); the data storage area can store data created based on the use of the mobile phone (e.g., audio data, video data, etc.). Furthermore, memory can include high-speed random access memory, and can also include non-volatile memory, such as hard disks, RAM, plug-in hard disks, SmartMedia Cards (SMC), Secure Digital (SD) cards, Flash Cards, at least one disk storage device, flash memory device, or other volatile solid-state storage devices.

[0205] It should be understood that each block of a flowchart and / or block diagram, and combinations of blocks in a flowchart and / or block diagram, can be implemented by a computer program. These computer programs can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing device to produce a machine, such that instructions executable by the processor of the computer or other programmable data processing device generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0206] These computer programs may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0207] These computer programs may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0208] This embodiment also provides a computer storage medium, the computer storage medium including: at least one instruction, which, when executed by a computer, implements the method steps in the wafer surface inspection and control method of Embodiment 1.

[0209] By executing a computer storage medium containing at least one instruction, automatic wafer surface inspection is achieved, improving the automation level of wafer surface inspection. This solves the problems of unavoidable clamping interference and inefficient acquisition of complete images of both sides of the wafer in existing technologies. It provides an efficient, accurate, and reliable solution for wafer inspection in the semiconductor manufacturing field, helping to improve the efficiency and quality of wafer inspection in the semiconductor manufacturing process, thereby improving the performance and yield of the final chip, reducing production costs, and promoting the development of the semiconductor manufacturing industry.

[0210] Similarly, for details not covered in this embodiment, please refer to Embodiment 1, Embodiment 2, Embodiment 3, and... Figures 1 to 7 The specific details will not be repeated here.

[0211] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A wafer surface inspection and control method, characterized in that, The method includes: When the clamping mechanism clamps the wafer to be inspected at a designated position, the optical scanning device is controlled to scan the wafer twice according to a first preset scanning path and a second preset scanning path. During the two scans, the clamping mechanism is controlled to perform an avoidance action, thereby obtaining a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected, respectively. The second preset scanning path is different from the first preset scanning path. The first front image and the second front image are stitched together, and the first back image and the second back image are stitched together to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

2. The wafer surface inspection and control method according to claim 1, characterized in that, During the two scanning processes, the clamping mechanism is controlled to perform an avoidance action, including: During the two scans, the avoidance trigger signal was acquired; In response to the avoidance trigger signal, an avoidance drive command is generated; According to the avoidance drive command, the clamping mechanism is controlled to perform an avoidance action, so that the avoidance part of the clamping mechanism avoids the scanning field of view of the optical scanning device during scanning.

3. The wafer surface inspection and control method according to claim 2, characterized in that, The avoidance action includes translational or rotational movement of the avoidance part on the plane of the wafer to be inspected. The translational or rotational movement causes the avoidance part to undergo temporary displacement, and the temporary displacement causes the avoidance part to avoid the scanning field of view of the optical scanning device during scanning.

4. The wafer surface inspection and control method according to claim 1, characterized in that, The designated position is specifically a first scan start position; the first preset scan path includes the first scan start position, the first scan end position, and the first scan direction; the second preset scan path includes a second scan start position, a second scan end position, and a second scan direction; the first scan direction is different from the second scan direction; The optical scanning device is controlled to perform two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path, including: When the clamping mechanism clamps the wafer to be inspected at the first scan start position, a first scan command is generated; According to the first scanning command, the first line scanning camera and the second line scanning camera are respectively controlled to move to the first scanning start position; When both the first line scan camera and the second line scan camera are located at the first scan start position, a second scan command is generated; According to the second scanning command and in accordance with the first scanning direction, the first line scan camera is controlled to perform the first scan on the front side of the wafer under inspection from the first scanning start position until the first line scan camera moves to the first scanning end position; simultaneously, the second line scan camera is controlled to perform the first scan on the back side of the wafer under inspection from the first scanning start position until the second line scan camera moves to the first scanning end position. When both the first line scan camera and the second line scan camera are at the first scan end position, a third scan command is generated; According to the third scanning command, the first line scanning camera and the second line scanning camera are respectively controlled to move to the second scanning start position; When both the first line scan camera and the second line scan camera are at the second scan start position, a fourth scan command is generated; According to the fourth scanning command, and in accordance with the second scanning direction, the first line scan camera is controlled to perform a second scan on the front side of the wafer under inspection from the second scanning start position until the first line scan camera moves to the second scanning end position; simultaneously, the second line scan camera is controlled to perform a second scan on the back side of the wafer under inspection from the second scanning start position until the second line scan camera moves to the second scanning end position.

5. The wafer surface inspection and control method according to claim 4, characterized in that, The control optical scanning device performs two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path, and also includes: Real-time acquisition of the first position feedback information of the optical scanning device; Based on the first position feedback information, it is determined whether the optical scanning device has moved into position.

6. The wafer surface inspection and control method according to claim 5, characterized in that, The control optical scanning device performs two scans on the wafer under inspection according to a first preset scanning path and a second preset scanning path, and also includes: Based on the feedback information from the first position, a scan trigger pulse signal is generated; Based on the scan trigger pulse signal, the first line scan camera and the second line scan camera are synchronously controlled to perform scanning operations.

7. The wafer surface inspection and control method according to claim 6, characterized in that, The optical scanning device is equipped with a front light source and a back light source; The method further includes: Based on the feedback information from the first position, a light source control signal is generated; When the first line scan camera and the second line scan camera are synchronously controlled to perform scanning operations according to the scan trigger pulse signal, the front light source is synchronously controlled to illuminate the scanning field of view of the first line scan camera and the back light source is synchronously controlled to illuminate the scanning field of view of the second line scan camera according to the light source control signal.

8. The wafer surface inspection and control method according to claim 1, characterized in that, The method further includes: Acquire the detection trigger signal; In response to the detection trigger signal, the clamping mechanism is controlled to move to the designated position; When the clamping mechanism is in the designated position, a clamping command is generated; According to the clamping command, the clamping mechanism is controlled to clamp the wafer to be inspected at the designated position.

9. The wafer surface inspection and control method according to claim 8, characterized in that, The method further includes: Real-time acquisition of the second position feedback information of the clamping mechanism; Based on the second position feedback information, it is determined whether the clamping mechanism has moved into place.

10. The wafer surface inspection and control method according to claim 8, characterized in that, The designated location is equipped with a testing chamber for placing the wafer to be tested; Before controlling the clamping mechanism to move to the designated position, the method further includes: In response to the detection trigger signal, the door of the detection chamber is controlled to open.

11. A wafer surface inspection and control device, characterized in that, The apparatus, used in the wafer surface inspection and control method according to any one of claims 1 to 10, comprises: A scanning control module is used to control an optical scanning device to scan the wafer under inspection twice, according to a first preset scanning path and a second preset scanning path, when the clamping mechanism clamps the wafer under inspection at a designated position. This results in a first front image and a first back image of the wafer under inspection during the first scan, and a second front image and a second back image during the second scan. The optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer under inspection, respectively. The second preset scanning path is different from the first preset scanning path. An avoidance control module is used to control the clamping mechanism to perform avoidance actions during two scanning processes; The image stitching module is used to stitch together the first front image and the second front image, and to stitch together the first back image and the second back image, to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

12. A wafer surface inspection and control system, characterized in that, The system includes a main controller, a clamping mechanism, an optical scanning device, and an image processor; The main controller is communicatively connected to the clamping mechanism, the optical scanning device, and the image processor, and is used to send corresponding control commands to the clamping mechanism, the optical scanning device, and the image processor, respectively. The clamping mechanism is used to clamp the wafer to be inspected at a designated position; The optical scanning device is configured to, when the clamping mechanism clamps the wafer to be inspected at the designated position, perform two scans on the wafer to be inspected according to the corresponding control command issued by the main controller, following a first preset scanning path and a second preset scanning path respectively, to obtain a first front image and a first back image of the wafer to be inspected during the first scan, and a second front image and a second back image during the second scan; wherein, the optical scanning device includes a first line scan camera and a second line scan camera located on the front and back sides of the wafer to be inspected respectively; the second preset scanning path is different from the first preset scanning path; The clamping mechanism is also used to perform an avoidance action according to the corresponding control command issued by the main controller during the two scanning processes; The image processor is also communicatively connected to the optical scanning device and is used to acquire the first front image, the first back image, the second front image, and the second back image captured by the optical scanning device according to the corresponding control command issued by the main controller. The first front image and the second front image are stitched together, and the first back image and the second back image are stitched together to generate a complete front image and a complete back image of the wafer to be inspected, respectively.

13. A computer storage medium, characterized in that, The computer storage medium includes at least one instruction that, when executed by a computer, implements the method steps of the wafer surface inspection and control method as described in any one of claims 1 to 10.

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