Semiconductor panel-level forming method and system

Abstract

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor panel-level forming method and a semiconductor panel-level forming system, which can realize synchronous transfer of a release film and resin into a lower mold cavity. The method comprises the following steps: S1, flatly laying a release film, and adsorbing and fixing the release film on the surface of a tray; s2, the release film is covered with a tray cover, and a groove for containing resin is formed between an inner cavity of a frame body of the tray cover and the release film; s3, uniformly spreading the resin in the groove; s4, the tray cover, the release film and the resin scattered in the groove are integrally transferred to a forming lower mold of a forming device, the release film and the resin sink into a lower mold cavity under the action of vacuumizing, and the release film is attached to the inner wall and the bottom wall of the cavity; s5, the tray cover is moved out; and S6, a to-be-packaged chip is carried on the carrier plate and is adsorbed and fixed in the forming device in advance in the state that the carrier plate faces upwards and the chip faces downwards, after the resin is heated to a molten state, the chip is soaked in the resin, the resin is cooled, and packaging is completed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically to a semiconductor panel-level molding method and system. Background Technology

[0002] In the semiconductor packaging field, with the continuous improvement of chip integration and the rapid development of package size towards miniaturization and thinning, panel-level packaging technology has become one of the core development directions of high-end semiconductor packaging due to its advantages in mass production and its ability to effectively reduce unit packaging costs. As a key process in the packaging process, panel-level molding aims to achieve electrical insulation, physical protection, and structural fixation of the chip through resin encapsulation, directly affecting the reliability, production efficiency, and manufacturing cost of packaged products.

[0003] In the panel-level packaging process, a release film needs to be attached to the lower mold cavity of the molding mold (i.e., the packaging mold). The release film adheres to the inner wall and bottom wall of the cavity under the vacuum of the lower mold. Then, resin is added to the cavity where the release film is attached. That is, in the prior art, the release film and resin are transferred to the lower mold cavity in steps.

[0004] To this end, we propose a semiconductor panel-level molding method and system that enables the simultaneous transfer of release film and resin to the lower mold cavity. Summary of the Invention

[0005] This invention provides a semiconductor panel-level molding method and system to solve the above-mentioned problems in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A semiconductor panel-level molding method, characterized by comprising the following steps:

[0008] S1. Lay the release film flat and fix it to the surface of the tray;

[0009] S2. Cover the release film with a tray cover, and a groove for receiving resin is formed between the inner cavity of the tray cover frame and the release film;

[0010] S3. Spread the resin evenly in the groove;

[0011] S4. Transfer the tray cover, release film and resin spread in the groove as a whole to the lower mold of the molding device. The spread resin is aligned with the cavity of the lower mold. Under the action of vacuum, the release film and resin are embedded in the cavity, and the release film adheres to the inner wall and bottom wall of the cavity.

[0012] S5. Remove the tray cover;

[0013] S6. The chip to be packaged is carried on a carrier board and pre-adsorbed and fixed in the molding device with the carrier board facing up and the chip facing down. After the resin is heated to a molten state, the chip is immersed in the resin, the resin is cooled, and the packaging is completed.

[0014] A semiconductor panel-level molding system includes a molding apparatus, the molding apparatus comprising a molding die and a press for driving the molding die to open and close, characterized in that:

[0015] Includes pallets, pallet covers, pallet transfer devices, pallet cover transfer devices, and film application devices;

[0016] The tray is used to hold the release film and tray cover, and to work with the vacuum generator to adsorb and fix the release film.

[0017] The tray cover is a frame with openings at the top and bottom, and a vacuum adsorption structure is provided at the bottom of the tray cover;

[0018] The pallet transfer device is used to repeatedly transfer the pallet between the film application station and the pallet cover positioning station.

[0019] The pallet cover transfer device is used to position the pallet cover on the release film pre-supported on the upper surface of the pallet. The lower opening of the inner cavity of the pallet cover frame is sealed by the release film to form a groove for accommodating resin. It is used to move the pallet cover and the release film as a whole into and out of the molding mold, and to connect the vacuum gas connector connected to the vacuum generator to the pallet cover and communicate with its vacuum adsorption structure.

[0020] The film-applying device is used to apply the release film to the surface of the tray. Preferably, the film-applying device is also used to cut and separate the release film of a preset length from the roll.

[0021] Furthermore, the system also includes a resin feeding device for uniformly distributing resin into the groove.

[0022] Furthermore, the pallet transfer device includes a pallet lifting assembly, a first pallet cover fixture, and a pallet conveying mechanism; the pallet lifting assembly includes a pallet vertical drive component (specifically a pallet cylinder), and the pallet is mounted on the pallet vertical drive component (and its circumferential direction is vertically guided and engaged with the pallet plate (via linear bearings and guide pillars) at the output end of the pallet conveying mechanism); the first pallet cover fixture includes several first grippers surrounding the outer periphery of the pallet and a first gripper drive unit that drives the first grippers to retract inward to clamp the pallet cover; the pallet conveying mechanism is used to drive the pallet lifting assembly and the first pallet cover fixture to move in the front-back direction and the left-right direction;

[0023] The pallet cover transfer device includes a second pallet cover fixture and a pallet cover conveying mechanism, wherein the pallet cover conveying mechanism is used to drive the second pallet cover fixture to move in the front-back direction and the left-right direction;

[0024] Specifically, the first gripper drive unit includes a first drive ring, inner support and limiting posts of the drive ring, a first drive plate, a first linear guide rail unit, and a first drive component (specifically, a first drive cylinder). Several inner support and limiting posts of the drive ring are distributed inside the first drive ring and supported on the pallet at the output end of the pallet conveying mechanism. The sidewalls of the inner support and limiting posts of the drive ring have limiting notches. The inner side of the first drive ring extends into the limiting notches. The upper wall, lower wall, and inner sidewall of the limiting notches are rotatably supported by rollers that abut against the upper wall, lower wall, and inner sidewall of the first drive ring, respectively. Several through-holes of the first drive ring are provided on the first drive ring. Several first drive plates are distributed below the first drive ring. The lower side of the first drive plate is slidably supported on the pallet through the first linear guide rail unit, and the first guide shaft connected to its upper side is inserted into the first drive guide notch. The end of the first drive plate extends out of the pallet and is connected to a first gripper. The output end of the first drive component is rotatably connected to the first drive connecting arm fixed to the outside of the first drive ring, and its other end away from the output end is rotatably connected to the pallet.

[0025] Furthermore, the pallet transfer device includes a top-feeding unit. The pins of the top-feeding unit can pass upward through the pallet under the drive of the top plate drive. Specifically, the top-feeding unit includes a pin, a top plate, a top plate drive (specifically a top plate cylinder), and a cylinder mounting plate. Several pins are supported on the top plate. The top plate is located below the pallet and supported on the top plate drive. The top plate drive is mounted on the cylinder mounting plate. The cylinder mounting plate (which is annular for the pallet cylinder to pass through) is circumferentially equipped with several connecting rods. The connecting rods pass through the top plate and are fixedly connected to the pallet.

[0026] Furthermore, the pallet cover conveying mechanism includes a primary pallet cover left and right conveying mechanism, a secondary pallet cover left and right conveying mechanism, and a pallet cover front and rear conveying mechanism. The primary pallet cover left and right conveying mechanism is driven by the secondary pallet cover left and right conveying mechanism to move horizontally in the left and right direction. The secondary pallet cover left and right conveying mechanism is installed at the output end of the pallet cover front and rear conveying mechanism.

[0027] Furthermore, the second pallet cover fixture includes a support plate, an upper linkage plate, a lower linkage plate, and a base plate arranged in parallel from top to bottom. The support plate and the upper linkage plate, the upper linkage plate and the base plate, and the lower linkage plate and the base plate are respectively guided and fitted vertically by linear bearings and guide posts. The upper linkage plate and the lower linkage plate, and the support plate and the lower linkage plate are respectively driven and connected by vertical driving components. The lower linkage plate has a circular opening at its center, and a second driving disk is provided at the circular opening. The second driving disk is installed at the output end of the rotary driving component, and the rotary driving component is installed on the base plate. The second drive disc is provided with an arc-shaped guide groove. One end of the transmission connecting rod slides in the arc-shaped guide groove through a guide rod, and the other end is connected to the second lower drive plate through a vertical connecting plate that penetrates the lower linkage plate. The second lower drive plate is slidably supported on the base plate by the second linear guide unit. The lower linkage plate is slidably supported by the second upper drive plate through the second linear guide unit. The second upper drive plate is synchronously connected to the second lower drive plate along the extension direction of the second linear guide through a pair of vertically arranged guide posts and can move downward relative to the second lower drive plate.

[0028] The outer edge of the second lower drive plate is connected to an outer upper clamping plate, and the outer edge of the second upper drive plate is installed with an outer lower clamping plate. The outer lower clamping plate is provided with a clamping part that is bent and extends to the lower part of the outer upper clamping plate. The clamping part and the outer upper clamping plate cooperate to clamp the release film. An inner clamping block is installed on the inner side of the outer upper clamping plate. The inner clamping block can be embedded in the clamping groove on the outer side of the tray cover.

[0029] Furthermore, the film-applying device includes a front-end film clamping mechanism, a film cutting mechanism, a rear-end film clamping mechanism, and a film feeding mechanism arranged sequentially along the release film conveying direction, as well as a film pulling mechanism.

[0030] Furthermore, the film feeding mechanism includes a support roller, a guide roller, and a film roll driving unit. The support roller and the guide roller are supported on the film application bracket, and the film roll driving unit is used to drive the support roller to rotate.

[0031] The film-pulling mechanism is used to drive the front-end film clamping mechanism to move forward (i.e., move away from the rear-end film clamping mechanism, so that the release film is laid flat above the tray).

[0032] The front-end clamping mechanism includes a front-end clamping unit and a clamping translation drive unit. The front-end clamping unit includes a front upper clamping plate, a front lower clamping plate, and a front clamping drive component. The front upper clamping plate is installed on the rear side of the front clamping mounting plate and extends downward. The front lower clamping plate is installed on the output end of the front clamping drive component and is vertically guided and cooperated with the front clamping mounting plate through the front clamping guide post assembly. The front clamping drive component is installed on the front clamping mounting plate. The bottom of the front lower clamping plate is provided with a clamping part extending to the rear side. The clamping part cooperates with the front upper clamping plate to clamp the release film. The clamping translation drive unit is used to drive the front-end clamping unit to translate in the front-back direction.

[0033] The rear-end film clamping mechanism includes an upper rear-end film clamping plate, a lower rear-end film clamping plate, and a rear-end film clamping drive. The rear side plate of the film-applying bracket has a film inlet. The upper rear-end film clamping plate and the lower rear-end film clamping plate are distributed from top to bottom and are located inside the film inlet. The upper rear-end film clamping plate is installed at the output end of the rear-end film clamping drive and is vertically guided and engaged with the rear side plate of the film-applying bracket through the rear-end film clamping guide post assembly. The rear-end film clamping drive is installed on the rear side plate of the film-applying bracket, and the lower rear-end film clamping plate is installed at the lower edge of the film inlet.

[0034] The film cutting mechanism is spaced apart from the rear lower clamping plate. The film cutting mechanism includes a blade, a mounting base, and a blade driver. The blade is mounted on the mounting base, and the mounting base is mounted on the output end of the blade driver. The blade driver is used to drive the blade to move horizontally to cut the release film. There is a pair of blades. The mounting base includes a movable mounting base and a fixed mounting base. The pair of blades is mounted on the movable mounting base. The movable mounting base is slidably supported on the output end of the blade driver and elastically connected to the fixed mounting base. The fixed mounting base is fixedly mounted on the output end of the blade driver.

[0035] This invention provides a semiconductor panel-level molding method and system, which has the following beneficial effects:

[0036] 1. A groove for accommodating resin is formed between the inner cavity of the tray cover frame and the release film. The resin is evenly distributed in the groove. The tray cover and the release film are clamped and fixed at the same time by the tray cover transfer device, so that the release film and resin can be transferred as a whole to the lower mold of the molding device.

[0037] 2. The release film is laid flat and vacuum-adsorbed onto the tray, which can keep the release film flat during the resin spreading process. The vacuum adsorption structure at the bottom of the tray cover, together with the upper and lower clamping plates on the outside of the tray cover transfer device, can keep the release film flat during the transfer of release film and resin, that is, in a horizontally stretched state, avoiding local slippage, and thus maintaining accurate positioning after being transferred to the lower mold cavity of the molding mold. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the first-view structure of the present invention;

[0039] Figure 2 This is a schematic diagram of the second perspective structure of the present invention;

[0040] Figure 3 This is a first-view structural schematic diagram of the pallet transfer device in this invention;

[0041] Figure 4 This is a schematic diagram of the pallet transfer device in this invention from a second perspective;

[0042] Figure 5 This is a second-view exploded structural diagram of the pallet transfer device in this invention;

[0043] Figure 6 This is a cross-sectional view of the pallet transfer device in this invention.

[0044] Figure 7 for Figure 6 A magnified structural diagram of point A in the middle;

[0045] Figure 8 This is a schematic diagram of the pallet cover transfer device in this invention;

[0046] Figure 9 This is a schematic diagram of the pallet cover transfer device of the present invention after omitting the pallet cover conveying mechanism;

[0047] Figure 10 for Figure 9 A magnified structural diagram of section B in the middle;

[0048] Figure 11 This is a cross-sectional view of the pallet cover transfer device in this invention from a first perspective.

[0049] Figure 12 for Figure 11 A magnified structural diagram of section C in the middle;

[0050] Figure 13 for Figure 11 A magnified structural diagram of section D in the middle;

[0051] Figure 14 This is a cross-sectional view of the tray cover transfer device in this invention from a second perspective.

[0052] Figure 15 for Figure 14 A magnified structural diagram of part E in the middle;

[0053] Figure 16This is a schematic diagram of the film-applying device from a first-view perspective.

[0054] Figure 17 This is a schematic diagram of the film-applying device from a second perspective in this invention;

[0055] Figure 18 This is a cross-sectional view of the film-applying device of the present invention;

[0056] Figure 19 For the present invention Figure 18 A magnified structural diagram of section F in the middle;

[0057] Figure 20 For the present invention Figure 18 A magnified structural diagram of section G in the middle.

[0058] In the picture:

[0059] 10. Film application device;

[0060] 11. Film feeding mechanism;

[0061] 111. Release film roll;

[0062] 112. Support roller;

[0063] 113. Guide roller;

[0064] 114. Membrane roll drive unit;

[0065] 12. Front-end membrane clamping mechanism;

[0066] 121. Front-end membrane mounting plate;

[0067] 122. Front-end membrane guide post assembly;

[0068] 123. Front-end membrane clamping drive component;

[0069] 124. Front-end lower clamping plate;

[0070] 125. Front-end upper clamping plate;

[0071] 13. Rear end membrane clamping mechanism;

[0072] 131. Rear end membrane clamping drive component;

[0073] 132. Rear end membrane guide post assembly;

[0074] 133. Rear end membrane clamping plate;

[0075] 134. Rear end lower clamping plate;

[0076] 14. Film cutting mechanism;

[0077] 141. Blade;

[0078] 142. Movable mounting base;

[0079] 143. Fixed mounting base;

[0080] 144. Spring;

[0081] 145. Blade drive unit;

[0082] 15. Membrane support;

[0083] 16. Membrane stretching mechanism;

[0084] 20. Resin feeding device;

[0085] 30. Pallet cover transfer device;

[0086] 31. Second tray cover fixture;

[0087] 3111, Load-bearing plate;

[0088] 3112. Upper linkage plate;

[0089] 3113. Lower linkage plate;

[0090] 3114. Base plate;

[0091] 3115. Second outer drive component;

[0092] 3116. Second upper drive board;

[0093] 3117. Second linear guide unit;

[0094] 3118. Second lower drive board;

[0095] 3119. Lower outer side plate;

[0096] 3120. Upper outer side panel;

[0097] 3121. Inner clamping block;

[0098] 3122. Vertical connecting plate;

[0099] 3123. Transmission connecting rod;

[0100] 3124. Second drive disc;

[0101] 31241. Arc-shaped guide groove;

[0102] 3125. Guide rod;

[0103] 3126. Guide connecting plate;

[0104] 3127, Guide Post;

[0105] 3128. Rotary drive component;

[0106] 3129. Vacuum gas connector;

[0107] 32. Pallet cover conveying mechanism;

[0108] 321. Primary pallet cover left and right conveying mechanism;

[0109] 322. Secondary pallet cover left and right conveying mechanism;

[0110] 40. Pallet transfer device;

[0111] 41. Pallet;

[0112] 42. Tray lid;

[0113] 43. Pallet conveying mechanism;

[0114] 421. Internal airways;

[0115] 422. Adhesive strips;

[0116] 4221. External air tank;

[0117] 44. First pallet cover fixture;

[0118] 411. Vacuum adsorption pores;

[0119] 412. Top slab;

[0120] 413. Threshold pin;

[0121] 414. Pallet vertical drive component;

[0122] 415. Top plate cylinder;

[0123] 416. Cylinder mounting plate;

[0124] 431. Pallet;

[0125] 441. First gripper;

[0126] 442. First guide shaft;

[0127] 443. First driving ring;

[0128] 444. First drive board;

[0129] 445. First linear guide unit;

[0130] 446. Inner support limit post of the drive ring;

[0131] 447. First drive connecting arm;

[0132] 448. First driving component;

[0133] 4431. First drive guide perforation;

[0134] 4461. Limiting gap;

[0135] 421. Clamping slot;

[0136] 50. Molding device. Detailed Implementation

[0137] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0138] See attached document Figures 1-20 A semiconductor panel-level molding system includes: a molding device 50, a tray 41, a tray cover 42, a tray transfer device 40, a tray cover transfer device 30, and a film application device 10.

[0139] The molding device 50 includes a molding die and a press for driving the molding die to open and close (wherein, the molding die and the press are both existing technologies).

[0140] The tray is rectangular and is used to support the release film and tray cover, as well as to work with the vacuum generator to adsorb and fix the release film. The upper surface of the tray has vacuum adsorption holes 411. The size of the release film is larger than the tray, that is, after the release film is laid flat and adsorbed and fixed on the tray, the edges of the release film should be exposed on the tray.

[0141] The tray cover is a rectangular frame with openings at the top and bottom;

[0142] The tray cover transfer device 30 is used to position the tray cover on the release film pre-supported on the upper surface of the tray. The lower opening of the inner cavity of the tray cover is sealed by the release film to form a groove for accommodating resin. It is also used to move the tray 431 cover and the release film as a whole into and out of the molding mold. It is also used to connect the vacuum gas connector 3129 connected to the vacuum generator to the tray cover and communicate with its vacuum adsorption structure to achieve adsorption and fixation of the release film during the transfer process.

[0143] The film-applying device 10 is used to apply a release film of a preset length to the surface of the tray, and to cut and separate the release film from the release film roll.

[0144] The pallet transfer device 40 is used to transfer the pallet back and forth between the film application station and the pallet cover positioning station.

[0145] In this embodiment, the system also includes a resin feeding device 20 (which is prior art). The resin feeding device 20, together with the pallet transfer device 40, quantitatively and evenly distributes the resin into the groove. Specifically, with the resin discharge port fixed, the pallet transfer device 40 drives the pallet to move horizontally back and forth and left and right to achieve uniform distribution of the resin.

[0146] In this embodiment, the pallet transfer device 40 includes a pallet lifting assembly, a first pallet cover fixture 44, and a pallet conveying mechanism 43. The pallet lifting assembly includes a pallet vertical drive component 414 (specifically, a pallet cylinder). The pallet is mounted on the pallet vertical drive component 414 (and the pallet circumferentially engages with the pallet plate 431 at the output end of the pallet conveying mechanism 43 via linear bearings and guide pillars for vertical guidance). For example, at the film application station, the release film is kept horizontal under the clamping action of the front clamping mechanism 12 and the rear clamping mechanism 13, and there will be a certain vertical gap between it and the pallet. The pallet is lifted up to fit with the release film by the action of the pallet vertical drive component. The first pallet cover fixture 44 includes four pairs of first grippers 441 distributed on the outer periphery of the pallet and a first gripper 441 drive unit that drives the first grippers 441 to retract inward to clamp the pallet cover. The pallet conveying mechanism 43 is used to drive the pallet lifting assembly and the first pallet cover fixture 44 to move in the front-back direction and the left-right direction.

[0147] The pallet cover transfer device 30 includes a second pallet cover fixture 31 and a pallet cover conveying mechanism 32. The second pallet cover fixture 31 includes four pairs of outer upper clamping plates 3120, outer lower clamping plates 3119, and four inner clamping blocks 3121. The outer upper clamping plates 3120 and outer lower clamping plates 3119 cooperate to clamp the edge of the release film. The outer lower clamping plate 3119 is used to clamp the clamping groove on the outside of the pallet cover. The pallet cover conveying mechanism 32 is used to drive the second pallet cover fixture 31 to move in the front-back direction and the left-right direction.

[0148] Specifically, the first gripper 441 driving unit includes a first driving ring 443, driving ring inner support and limiting posts 446, a first driving plate 444, a first linear guide rail unit 445, and a first driving member 448. A plurality of driving ring inner support and limiting posts 446 are distributed inside the first driving ring 443 and supported on the pallet 431 at the output end of the pallet conveying mechanism 43. Limiting notches 4461 are formed on the sidewalls of the driving ring inner support and limiting posts 446. The inner side of the first driving ring 443 extends into the limiting notches 4461. The upper wall, lower wall, and inner sidewall of the limiting notches 4461 are rotatably supported by rollers that abut against the upper wall, lower wall, and inner sidewall of the first driving ring 443, respectively. A plurality of vertically penetrating parts are formed on the first driving ring 443. The first drive guide hole 4431 is provided. Four first drive plates 444 are distributed below the first drive ring 443 and correspond to each pair of first grippers 441. The lower side of the first drive plate 444 is slidably supported on the tray 431 by the first linear guide rail unit 445. The first guide shaft 442 connected to its upper side is inserted into the first drive guide hole 4431 (preferably, the first guide shaft 442 is fitted with rollers). The end of the first drive plate 444 extends out of the tray and is connected to a pair of first grippers 441. The output end of the first drive member 448 (specifically, a first drive cylinder) is rotatably connected to the first drive connecting arm 447 fixed to the outside of the first drive ring 443, and its other end opposite to the output end is rotatably connected to the tray 431. That is, the first drive member 448 drives the first drive ring 443 to rotate, thereby driving the first drive plate 444 to move back and forth along the first linear guide rail to achieve the clamping and releasing of the tray cover.

[0149] In this embodiment, the pallet transfer device 40 includes a top-feeding unit. The ejector pins 413 of the top-feeding unit can pass upward through the pallet under the drive of the top plate drive member 415 (specifically, a top plate cylinder). Specifically, the top-feeding unit includes ejector pins 413, a top plate 412, a top plate drive member 415 (specifically, a top plate cylinder), and a cylinder mounting plate 416. A plurality of ejector pins 413 are supported on the top plate 412. The top plate 412 is located below the pallet and supported on the top plate drive member 415. The top plate drive member 415 is mounted on the cylinder mounting plate 416. The cylinder mounting plate 416 (which is annular for the pallet cylinder 414 to pass through) is circumferentially equipped with a plurality of connecting rods. The connecting rods pass through the top plate 412 and are fixedly connected to the pallet.

[0150] In this embodiment, the pallet cover conveying mechanism 32 includes a primary pallet cover left and right conveying mechanism 321, a secondary pallet cover left and right conveying mechanism 322, and a pallet cover front and rear conveying mechanism. The primary pallet cover left and right conveying mechanism 321 is driven by the secondary pallet cover left and right conveying mechanism 322 in the front and rear direction. The secondary pallet cover left and right conveying mechanism 322 is installed at the output end of the pallet cover front and rear conveying mechanism.

[0151] In this embodiment, the second tray cover fixture 31 includes a support plate 3111, an upper linkage plate 3112, a lower linkage plate 3113, and a base plate 3114 arranged in parallel from top to bottom. The support plate 3111 and the upper linkage plate 3112, the upper linkage plate 3112 and the base plate 3114, and the lower linkage plate 3113 and the base plate 3114 are respectively guided and fitted vertically by linear bearings and guide posts. The upper linkage plate 3112 and the lower linkage plate 3113, and the support plate 3111 and the lower linkage plate 3113 are respectively connected vertically by a second outer driving member 3115 (specifically a linkage plate driving cylinder). The lower linkage plate 3113 has a circular opening at its center, and a second driving disc 3124 is provided at the circular opening. The second driving disc 3124 is installed at the output end of a rotary driving member 3128 (specifically a rotary cylinder). Component 3128 is mounted on base plate 3114. The second drive disc 3124 is provided with an arc-shaped guide groove 31241. One end of the transmission connecting rod 3123 is slidably engaged with the arc-shaped guide groove 31241 through guide rod 3125, and the other end is connected to the second lower drive plate 3118 through a vertical connecting plate 3122 that penetrates the lower linkage plate 3113 downward. The second lower drive plate 3118 is slidably supported on base plate 3114 through second linear guide rail unit 3117. The lower linkage plate 3113 is slidably supported by the second upper drive plate 3116 through the second linear guide rail unit 3117. The guide connecting plate 3126 installed on the outer edge of the second upper drive plate 3116 is synchronously connected to the second lower drive plate 3118 along the extension direction of the second linear guide rail through a pair of vertically arranged guide posts 3127 and can be translated downward relative to the second lower drive plate 3118.

[0152] The outer edge of the second lower drive plate 3118 is connected to the outer upper clamping plate 3120, and the outer edge of the second upper drive plate 3116 is installed with the outer lower clamping plate 3119 through the guide connecting plate 3126. The outer lower clamping plate 3119 is provided with a clamping part that is bent and extends to the lower part of the outer upper clamping plate 3120. The clamping part and the outer upper clamping plate 3120 cooperate to clamp the release film. An inner clamping block 3121 is installed on the inner side of the outer upper clamping plate 3120. The inner clamping block 3121 can be embedded in the clamping groove 421 on the outer side of the tray cover.

[0153] The rotary drive unit drives the second drive disk to rotate. The second drive disk drives the transmission connecting rod, the second lower drive plate, the second upper drive plate, the inner clamping block, the outer upper clamping plate, and the outer lower clamping plate to move outward or inward synchronously through the cooperation of the arc-shaped guide groove and the guide rod. When moving inward, the inner clamping block is embedded in the clamping groove of the tray cover to fix the tray cover. The clamping parts of the outer upper clamping plate and the outer lower clamping plate are located on the upper and lower sides of the release film edge. Subsequently, the outer lower clamping plate is lifted up under the action of the corresponding outer drive unit, and its clamping part cooperates with the outer upper clamping plate to clamp the edge of the release film.

[0154] The base plate 3114 is equipped with a vacuum gas connector 3129, which is connected to a vacuum generator. When the second tray cover fixture 31 clamps the tray cover, the vacuum gas connector 3129 can be inserted and engaged with the tray cover and communicate with the internal air passage 421 of the tray cover (the bottom of the tray cover is embedded with a rubber strip 422, the bottom of the rubber strip 422 is provided with an external air groove 4221, and the inside of the strip is provided with an air hole that connects the internal air passage 421 and the external air groove 4221).

[0155] In this embodiment, the film application device 10 includes a front-end film clamping mechanism 12, a film cutting mechanism 14, a rear-end film clamping mechanism 13 and a film feeding mechanism 11 arranged sequentially along the release film conveying direction, as well as a film pulling mechanism 16.

[0156] The film feeding mechanism 11 includes a support roller 112, a guide roller 113, and a film roll driving unit 114. The support roller 112 and the guide roller 113 are supported on the film application bracket 15. The film roll driving unit 114 (which uses a belt pulley transmission mechanism and a geared motor) is used to drive the support roller 112 and the release film roll 111 fixed on the support roller 112 to rotate synchronously.

[0157] The film pulling mechanism 16 is used to drive the front film clamping mechanism 12 to move forward (i.e. move away from the rear film clamping mechanism 13, so that the release film is laid flat above the tray).

[0158] The front-end clamping mechanism 12 includes a front-end clamping unit and a clamping translation drive unit. The front-end clamping unit includes a front-end upper clamping pressure plate 125, a front-end lower clamping pressure plate, and a front-end clamping drive component 123 (specifically, a front-end clamping cylinder). The front-end upper clamping pressure plate 125 is installed on the rear side of the front-end clamping mounting plate 121 and extends downward. The front-end lower clamping pressure plate 124 is installed on the output end of the front-end clamping drive component 123 and is vertically guided and cooperated with the front-end clamping mounting plate 121 through the front-end clamping guide post assembly 122. The front-end clamping drive component 123 is installed on the front-end clamping mounting plate 121. The bottom of the front-end lower clamping pressure plate 124 is provided with a pressure plate clamping part extending to the rear side. This pressure plate clamping part cooperates with the front-end upper clamping pressure plate 125 to clamp the release film. The clamping translation drive unit is used to drive the front-end clamping unit to translate in the front-back direction.

[0159] The rear-end film clamping mechanism 13 includes a rear upper film clamping plate 133, a rear lower film clamping plate 134, and a rear film clamping drive component 131 (specifically, a rear film clamping cylinder). The rear side plate of the film-applying bracket 15 has a film inlet. The rear upper film clamping plate 133 and the rear lower film clamping plate 134 are distributed from top to bottom and are arranged inside the film inlet. The rear upper film clamping plate 133 is installed on the output end of the rear film clamping drive component 131 and is vertically guided and cooperated with the rear side plate of the film-applying bracket 15 through the rear film clamping guide post assembly 132. The rear film clamping drive component 131 is installed on the rear side plate of the film-applying bracket 15, and the rear lower film clamping plate 134 is installed at the lower edge of the film inlet.

[0160] The film cutting mechanism 14 is spaced apart from the rear lower clamping plate 134. The film cutting mechanism 14 includes a blade 141, a mounting base, and a blade drive 145 (specifically, a blade drive linear module). The blade is mounted on the mounting base, and the mounting base is mounted on the output end of the blade drive 145. The blade drive 145 is used to drive the blade to move horizontally to cut the release film. There is a pair of blades. The mounting base includes a movable mounting base 142 and a fixed mounting base 143. The pair of blades are mounted on the movable mounting base 142. The movable mounting base 142 is slidably supported on the output end of the blade drive 145 and elastically connected to the fixed mounting base 143 through a spring 144. The movable mounting base 142 is equipped with a rod, and the fixed mounting base 143 is equipped with a position sensor that cooperates with the rod. The fixed mounting base is fixedly mounted on the output end of the blade drive 145. The blade of the film cutting mechanism 14 moves along the width direction of the release film under the action of the blade drive 145 to cut the release film. If the blade becomes dull after long-term use, the resistance during cutting will increase. Then, the insertion rod installed on the movable mounting base 142 will insert the position sensor and send a message to replace the blade.

[0161] A semiconductor panel-level molding method, performed using the above-mentioned apparatus, includes the following steps:

[0162] S1. The film feeding device of the film applicator 10 starts feeding film, and the front clamping mechanism 12 simultaneously pulls the end of the release film forward until the release film covers the tray and the front end of the release film is exposed on the tray. Then, the tray is lifted up by the vertical drive of the tray to fit with the release film. The tray starts vacuum adsorption to adsorb and fix the release film. The film cutting mechanism 14 cuts the release film, thereby realizing the release film being laid flat and fixed on the surface of the tray.

[0163] S2. The tray cover is positioned on the release film carried above the tray under the action of the tray cover transfer device 30, and a groove for accommodating resin is formed between the inner cavity of the tray cover frame and the release film.

[0164] S3. The resin feeding device 20 evenly spreads the resin in the groove. Specifically, the film-coating station and the resin feeding station overlap. At the film-coating station (that is, the resin feeding station), the resin discharge port is fixed. The pallet is moved back and forth and left and right by the pallet transfer device 40 to achieve even spreading of the resin, so as to achieve quantitative and even spreading of the resin in the groove.

[0165] S4. The tray cover transfer device 30 transfers the tray cover, release film, and resin spread in the groove as a whole to the lower mold of the molding device 50. The tray cover releases the clamping and vacuum adsorption (from the vacuum adsorption on the upper side of the release film). Under the action of vacuuming in the lower mold (from the vacuum adsorption on the lower side of the release film), the release film, together with the resin carried above, falls into the lower mold cavity. The lower mold is assisted by heating to make the release film better fit the bottom wall and side wall of the lower mold cavity, thus isolating the resin from the cavity.

[0166] S5. The pallet cover is moved out of the forming mold under the action of the pallet cover transfer device 30;

[0167] S6. The chip to be packaged is carried on the carrier plate and pre-adsorbed and fixed in the molding device 50 with the carrier plate facing up and the chip facing down. After the resin is heated to a molten state, the chip is immersed in the resin, the resin is cooled, and the packaging is completed.

[0168] S7. Manually remove the tray cover, the packaged carrier plate and the release film as a whole, and manually peel off the release film.

[0169] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0170] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor panel-level molding method, characterized in that, Includes the following steps: S1. Lay the release film flat and fix it to the surface of the tray; S2. Cover the release film with a tray cover, and a groove for receiving resin is formed between the inner cavity of the tray cover frame and the release film; S3. Spread the resin evenly in the groove; S4. Transfer the tray cover, release film and resin spread in the groove as a whole to the lower mold of the molding device. The spread resin is aligned with the cavity of the lower mold. Under the action of vacuum, the release film and resin are embedded in the cavity, and the release film adheres to the inner wall and bottom wall of the cavity. S5. Remove the tray cover; S6. The chip to be packaged is carried on a carrier board and pre-adsorbed and fixed in the upper mold of the molding device with the carrier board facing up and the chip facing down. After the resin is heated to a molten state, the chip is immersed in the resin, the resin is cooled, and the packaging is completed.

2. A semiconductor panel-level molding system for performing the method of claim 1, the system comprising a molding apparatus, the molding apparatus including a molding die and a press for driving the molding die to open and close, characterized in that: The system also includes a pallet, a pallet cover, a pallet transfer device, a pallet cover transfer device, and a film application device; The tray is used to hold the release film and tray cover, and to work with the vacuum generator to adsorb and fix the release film. The tray cover is a frame with openings at the top and bottom, and a vacuum adsorption structure is provided at the bottom of the tray cover; The pallet transfer device is used to transfer the pallet from the film application station and the pallet cover positioning station. The pallet cover transfer device is used to position the pallet cover on the release film pre-supported on the upper surface of the pallet. The lower opening of the inner cavity of the pallet cover frame is sealed by the release film to form a groove for accommodating resin. It is used to move the pallet cover and the release film as a whole into and out of the molding mold, and to connect the vacuum gas connector connected to the vacuum generator to the pallet cover and communicate with its vacuum adsorption structure. The film-applying device is used to apply a release film of a preset length to the surface of the tray. Preferably, the film-applying device is also used to cut and separate the release film from the roll.

3. The semiconductor panel-level molding system as described in claim 2, characterized in that: The system also includes a resin feeding device for evenly distributing resin into the groove.

4. The semiconductor panel-level molding system as described in claim 2, characterized in that: The pallet transfer device includes a pallet lifting assembly, a first pallet cover fixture, and a pallet conveying mechanism; the pallet lifting assembly includes a pallet vertical drive component, and the pallet is mounted on the pallet vertical drive component; the first pallet cover fixture includes a plurality of first grippers surrounding the outer periphery of the pallet and a first gripper drive unit that drives the first grippers to retract inward to clamp the pallet cover; the pallet conveying mechanism is used to drive the pallet lifting assembly and the first pallet cover fixture to move in the front-back direction and the left-right direction; The pallet cover transfer device includes a second pallet cover fixture and a pallet cover conveying mechanism, wherein the pallet cover conveying mechanism is used to drive the second pallet cover fixture to move in the front-back direction and the left-right direction.

5. A semiconductor panel-level molding system as described in claim 4, characterized in that: The first gripper drive unit includes a first drive ring, inner support and limiting posts of the drive ring, a first drive plate, a first linear guide rail unit, and a first drive component. A plurality of inner support and limiting posts of the drive ring are distributed inside the first drive ring and supported on the pallet at the output end of the pallet conveying mechanism. The sidewalls of the inner support and limiting posts of the drive ring have limiting notches. The inner side of the first drive ring extends into the limiting notches. The upper wall, lower wall, and inner sidewall of the limiting notches are respectively rotatably supported by rollers that abut against the upper wall, lower wall, and inner sidewall of the first drive ring. A plurality of vertically penetrating first drive guide holes are provided on the first drive ring. A plurality of first drive plates are distributed below the first drive ring. The lower side of the first drive plate is slidably supported on the pallet through the first linear guide rail unit, and the upper side of the first drive plate is connected to the first drive guide hole. The end of the first drive plate extends out of the pallet and is connected to a first gripper. The output end of the first drive component is rotatably connected to the first drive connecting arm fixed to the outside of the first drive ring, and the other end of the first drive component opposite to the output end is rotatably connected to the pallet.

6. The semiconductor panel-level molding system as described in claim 5, characterized in that: The pallet transfer device includes a top-feeding unit. The top-feeding unit's ejector pins can pass upward through the pallet under the drive of the top plate drive. The top-feeding unit includes ejector pins, a top plate, a top plate drive, and a cylinder mounting plate. A plurality of ejector pins are supported on the top plate. The top plate is located below the pallet and supported on the top plate drive. The top plate drive is mounted on the cylinder mounting plate. A plurality of connecting rods are circumferentially mounted on the cylinder mounting plate. The connecting rods pass through the top plate and are fixedly connected to the pallet.

7. A semiconductor panel-level molding system as described in claim 4, characterized in that: The pallet cover conveying mechanism includes a primary pallet cover left and right conveying mechanism, a secondary pallet cover left and right conveying mechanism, and a pallet cover front and rear conveying mechanism. The primary pallet cover left and right conveying mechanism is driven by the secondary pallet cover left and right conveying mechanism to move horizontally in the left and right direction. The secondary pallet cover left and right conveying mechanism is installed at the output end of the pallet cover front and rear conveying mechanism.

8. A semiconductor panel-level molding system as described in claim 7, characterized in that: The second pallet cover fixture includes a support plate, an upper linkage plate, a lower linkage plate, and a base plate arranged in parallel from top to bottom. The support plate and the upper linkage plate, the upper linkage plate and the base plate, and the lower linkage plate and the base plate are vertically guided and fitted by linear bearings and guide posts, respectively. The upper linkage plate and the lower linkage plate, and the support plate and the lower linkage plate are driven and connected by vertical driving components. The lower linkage plate has a circular opening at its center, and a second driving disk is located at the circular opening. The second driving disk is mounted on the output end of a rotary driving component, which is mounted on the base plate. The second drive disc is provided with an arc-shaped guide groove. One end of the transmission connecting rod slides in the arc-shaped guide groove through a guide rod, and the other end is connected to the second lower drive plate through a vertical connecting plate that penetrates the lower linkage plate. The second lower drive plate is slidably supported on the base plate by the second linear guide rail unit. The lower linkage plate is slidably supported by the second upper drive plate through the second linear guide rail unit. The second upper drive plate is synchronously connected to the second lower drive plate along the extension direction of the second linear guide rail by a pair of vertically arranged guide posts and can move downward relative to the second lower drive plate. The outer edge of the second lower drive plate is connected to an outer upper clamping plate, and the outer edge of the second upper drive plate is installed with an outer lower clamping plate. The outer lower clamping plate is provided with a clamping part that is bent and extends to the lower part of the outer upper clamping plate. The clamping part and the outer upper clamping plate cooperate to clamp the release film. An inner clamping block is installed on the inner side of the outer upper clamping plate. The inner clamping block can be embedded in the clamping groove on the outer side of the tray cover.

9. A semiconductor panel-level molding system as described in claim 2, characterized in that: The film-applying device includes a front-end film clamping mechanism, a film cutting mechanism, a rear-end film clamping mechanism, and a film feeding mechanism arranged sequentially along the release film conveying direction, as well as a film pulling mechanism.

10. A semiconductor panel-level molding system as described in claim 9, characterized in that: The film feeding mechanism includes a support roller, a guide roller, and a film roll driving unit. The support roller and the guide roller are supported on the film application bracket, and the film roll driving unit is used to drive the support roller to rotate. The film-pulling mechanism is used to drive the front-end film-clamping mechanism to move forward sideways. The front-end clamping mechanism includes a front-end clamping unit and a clamping translation drive unit. The front-end clamping unit includes a front upper clamping plate, a front lower clamping plate, and a front clamping drive component. The front upper clamping plate is installed on the rear side of the front clamping mounting plate and extends downward. The front lower clamping plate is installed on the output end of the front clamping drive component and is vertically guided and cooperated with the front clamping mounting plate through the front clamping guide post assembly. The front clamping drive component is installed on the front clamping mounting plate. The bottom of the front lower clamping plate is provided with a clamping part extending to the rear side. The clamping part cooperates with the front upper clamping plate to clamp the release film. The clamping translation drive unit is used to drive the front-end clamping unit to translate in the front-back direction. The rear-end film clamping mechanism includes an upper rear-end film clamping plate, a lower rear-end film clamping plate, and a rear-end film clamping drive. The rear side plate of the film-applying bracket has a film inlet. The upper rear-end film clamping plate and the lower rear-end film clamping plate are distributed from top to bottom and are located inside the film inlet. The upper rear-end film clamping plate is installed at the output end of the rear-end film clamping drive and is vertically guided and engaged with the rear side plate of the film-applying bracket through the rear-end film clamping guide post assembly. The rear-end film clamping drive is installed on the rear side plate of the film-applying bracket, and the lower rear-end film clamping plate is installed at the lower edge of the film inlet. The film cutting mechanism is spaced apart from the rear lower clamping plate. The film cutting mechanism includes a blade, a mounting base, and a blade driver. The blade is mounted on the mounting base, and the mounting base is mounted on the output end of the blade driver. The blade driver is used to drive the blade to move horizontally to cut the release film. There is a pair of blades. The mounting base includes a movable mounting base and a fixed mounting base. The pair of blades is mounted on the movable mounting base. The movable mounting base is slidably supported on the output end of the blade driver and elastically connected to the fixed mounting base. The fixed mounting base is fixedly mounted on the output end of the blade driver.

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