Composition for heat transfer fluid, heat transfer device, and heat transfer method

Abstract

The present invention provides a composition for a heat transfer fluid, the composition containing a hexafluoropropylene tripolymer represented by C9F18, and further containing a fluorine-containing polymer represented by C9F18, and a fluorine-containing polymer represented by C9F18. (i) CmF2m and / or CnF (2n-2) (In the formula, m is an integer from 4 to 12 (inclusive) and does not include 9. And n is an integer from 4 to 12 (inclusive). ); (ii) water (wherein the content of the water is 0.0001-0.1 parts by mass per 100 parts by mass of the total amount of the hexafluoropropylene tripolymer represented by C9F18); and / or (iii) fluoride ions (wherein the content of the fluoride ions is 0.0000001-5 parts by mass per 100 parts by mass of the total amount of the hexafluoropropylene tripolymer represented by C9F18).

Description

Technical Field

[0001] This invention relates to compositions for heat transfer fluids, apparatuses for heat transfer, and methods for heat transfer. Background Technology

[0002] It is known that the trimer of hexafluoropropylene (HFP) can be used as a composition for heat transfer fluid (Patent Document 1).

[0003] HFP trimers have low global warming potential (GWP) and low toxicity, thus attracting attention as an alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs).

[0004] Existing technical documents Patent documents Patent Document 1: International Publication No. 2018 / 172919 Summary of the Invention

[0005] The technical problem that the invention aims to solve In view of the above facts, the object of the present invention is to provide a composition for heat transfer fluid as a novel mixture.

[0006] Technical solutions for solving technical problems In order to solve the above-mentioned technical problems, the inventors of the present invention conducted careful research and found that by coexisting a specified amount of fluorocarbon with HFP trimer, a specified amount of water, and / or a specified amount of fluoride ions, it is possible to provide a composition for heat transfer fluid as a novel mixture.

[0007] That is, the present invention includes the following methods.

[0008] [Item 1] A composition for heat transfer fluid, comprising: C9F 18 The hexafluoropropylene trimer shown; (i) C m F 2m and / or C n F （2n－2） [In the formula, m is an integer greater than 4 and less than 12, excluding 9. n is an integer greater than 4 and less than 12.]; (ii) water (wherein, relative to the above C9F) 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the water content is 0.0001 to 0.1 parts by mass; and / or (iii) fluoride ions (wherein, relative to C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the content of the fluoride ion is 0.0000001 to 5 parts by mass.

[0009] [Item 2] The heat transfer fluid composition as described in Item 1, wherein the hexafluoropropylene trimer comprises at least one compound selected from the compounds shown in formulas (I) to (III) below. .

[0010] [Item 3] The heat transfer fluid composition as described in Item 2, wherein the compound represented by formula (I) is 85% by mass or more relative to the total amount of hexafluoropropylene trimer.

[0011] [Item 4] The heat transfer fluid composition as described in Item 2, wherein the compound represented by formula (I) is less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

[0012] [Item 5] The heat transfer fluid composition as described in Item 2, wherein the compound represented by formula (I) is 50% by mass or more and less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

[0013] [Item 6] The heat transfer fluid composition as described in Item 1, which contains C9F 18 The hexafluoropropylene trimer and (i)C shown m F 2m and / or C n F （2n－2） [In the formula, m is an integer greater than or equal to 4 and less than or equal to 12, excluding 9. n is an integer greater than or equal to 4 and less than or equal to 12.]

[0014] [Item 7] The heat transfer fluid composition as described in Item 1, wherein m is an integer of 6 to 11 excluding 9, and n is an integer of 6 to 11.

[0015] [Item 8] The heat transfer fluid composition as described in Item 1, wherein, relative to C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, C m F 2m and / or C n F （2n－2） The content is 0.0001 to 10 parts by mass.

[0016] [Item 9] The heat transfer fluid composition as described in Item 1, which contains C9F 18 The hexafluoropropylene trimer and (ii) water are shown.

[0017] [Item 10] The heat transfer fluid composition as described in Item 1, which contains C9F 18 The hexafluoropropylene trimer and (iii) fluoride ions are shown.

[0018] [Item 11] The heat transfer fluid composition as described in Item 1, further comprising C 12 F 24The hexafluoropropylene tetramer shown has a content of 80% by mass or more of the hexafluoropropylene trimer and the hexafluoropropylene tetramer combined.

[0019] [Item 12] The heat transfer fluid composition as described in Item 11, wherein the content of the hexafluoropropylene trimer is 90% by mass or more and 99.99% by mass or less, relative to the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer.

[0020] [Item 13] The heat transfer fluid composition as described in Item 11, wherein the hexafluoropropylene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0021] [Item 14] The heat transfer fluid composition as described in Item 1 further contains a conductive substance, wherein the content of the conductive substance is less than 100 ppm by mass.

[0022] [Item 15] The heat transfer fluid composition as described in Item 1 further contains a conductive substance, wherein the content of insoluble matter larger than 5 μm is less than 10 particles / mL.

[0023] [Item 16] A heat transfer fluid comprising the heat transfer fluid composition described in item 1 or 2.

[0024] [Item 17] Use of the heat transfer fluid composition described in item 1 or 2 as a heat transfer fluid.

[0025] [Item 18] A heat transfer apparatus having a device and a mechanism containing a heat transfer fluid composition as described in item 1 or 2, the mechanism being used to transfer heat to or from the device.

[0026] [Item 19] A heat transfer method comprising: a step of preparing a device; and a step of transferring heat to or from the device using the heat transfer fluid composition described in Item 1 or 2.

[0027] Invention Effects The composition described above, as described in this invention, can provide a heat transfer fluid composition as a novel mixture. Detailed Implementation

[0028] In this specification, "containing" includes the concepts of "comprise," "consist essentially of," and "consist of." Additionally, in this specification, when using "A~B" to represent a numerical range, it means above A and below B.

[0029] (1. Composition for heat transfer fluids) The heat transfer fluid composition of the present invention contains: (i) C m F 2m and / or C n F （2n－2） [In the formula, m is an integer greater than 4 and less than 12, excluding 9. n is an integer greater than 4 and less than 12.]; (ii) water (wherein, relative to the above C9F) 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the water content is 0.0001 to 0.1 parts by mass; and / or (iii) fluoride ions (wherein, relative to C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the content of the fluoride ion is 0.0000001 to 5 parts by mass.

[0030] As a hexafluoropropylene trimer, C9F can be widely used. 18 The known compounds shown are not specifically limited.

[0031] Specifically, the hexafluoropropylene trimer can be exemplified by a trimer comprising at least one of the compounds selected from the following formulas (I) to (III). In this specification, unless otherwise specified, the compound represented by formula (I) above includes both the diastereomer E-body and the diastereomer Z-body.

[0032] The hexafluoropropylene trimer contained in the heat transfer fluid composition of the present invention may contain only one of the compounds shown in formulas (I) to (III) above, or may be a mixture containing two or three of these compounds.

[0033] Regarding the proportion of the compound shown in formula (I) in the total amount of HFP trimer (that is, the total of the compounds shown in formulas (I), (II), and (III)), relative to the total amount of HFP trimer, it is preferably 1% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and particularly preferably 50% by mass or more. Furthermore, relative to the total amount of HFP trimer, the compound shown in formula (I) may also be 85% by mass or more. In this case, the viscosity of the HFP trimer mixture becomes lower. Additionally, relative to the total amount of HFP trimer, the compound shown in formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, even more preferably 85% by mass or less (or less), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less. Regarding the coordination ratio of the compound shown in formula (I) above, relative to the total amount of HFP trimer, it can be, for example, 10% by mass or more and less than 90% by mass, 30% by mass or more and less than 90% by mass, 10% by mass or more and less than 85% by mass, 35% by mass or more and less than 85% by mass, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, and 40% by mass or more and less than 85% by mass. The content is 80% or less by mass, 55% or more by mass and 80% or less by mass, 60% or more by mass and 75% or less by mass, 65% or more by mass and 70% or less by mass, 35% or more by mass and 60% or less by mass, 50% or more by mass and 60% or less by mass, preferably 30% or more by mass and 90% or less by mass, preferably 40% or more by mass and less than 85% by mass, more preferably 40% or more by mass and 80% or less by mass, even more preferably 45% or more by mass and 70% or less by mass, and even more preferably 50% or more by mass and 60% or less by mass.

[0034] Similarly, regarding the coordination rate of the compound shown in formula (II), relative to the total amount of HFP trimer, it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more. In addition, relative to the total amount of HFP trimer, the compound shown in formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0035] Similarly, regarding the coordination percentage of each compound represented by formula (III), relative to the total amount of HFP trimer, it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more. Furthermore, the compound represented by formula (III) is preferably 70% by mass or less in 100% of the total amount of HFP trimer, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0036] In the heat transfer fluid composition of the present invention, the mass ratio of the compound shown in formula (II) to the compound shown in formula (III) is not particularly limited, and can be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4 or 4.5:5.5 to 5.5:4.5.

[0037] The compounds shown in formulas (I) to (III) above can be manufactured using common methods, such as those described in International Publication No. 2018 / 172919, but are not limited thereto. Alternatively, they can be obtained by trimerization using HFP as a starting material, but are not limited thereto, as long as widely known methods are employed.

[0038] The heat transfer fluid composition of the present invention may also contain C9F other than the compounds shown in formulas (I) to (III). 18 The hexafluoropropylene trimer shown.

[0039] The heat transfer fluid composition of the present invention may also contain hexafluoropropylene dimer.

[0040] Hexafluoropropylene dimers can contain (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0041] In one embodiment, the heat transfer fluid composition of the present invention may also contain hexafluoropropylene tetramer.

[0042] Hexafluoropropylene tetramers can contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0043] In the heat transfer fluid composition of the present invention, the content of hexafluoropropylene trimer may be 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, for example 95% by mass or more, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more, relative to the total of hexafluoropropylene trimer and hexafluoropropylene tetramer.

[0044] In the heat transfer fluid composition of the present invention, the content of hexafluoropropylene trimer is preferably 99.999% by mass or less, more preferably 99.99% by mass or less, relative to the total of hexafluoropropylene trimer and hexafluoropropylene tetramer, and for example, it can be 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less.

[0045] In the heat transfer fluid composition of the present invention, the content of hexafluoropropylene trimer is preferably 80% by mass or more and 99.999% by mass or less, more preferably 85% by mass or more and 99.99% by mass or less, for example, 90% by mass or more and 99.99% by mass or less, 95% by mass or more and 99.99% by mass or less, 99% by mass or more and 99.99% by mass or less, or 99% by mass or more and 99.99% by mass or less.

[0046] The combined amount of hexafluoropropylene trimer and hexafluoropropylene tetramer in the heat transfer fluid composition is preferably 80% by mass or more, more preferably 85% by mass or more, further preferably 90% by mass or more, and even more preferably 95% by mass or more, for example, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more. The combined amount of hexafluoropropylene trimer and hexafluoropropylene tetramer in the heat transfer fluid composition can also be substantially 100% by mass. In other words, the heat transfer fluid composition of the present invention can be a mixture of hexafluoropropylene trimer and hexafluoropropylene tetramer.

[0047] (1-1. C) m F 2m and / or C n F （2n－2） ) In one embodiment, the heat transfer fluid composition of the present invention may contain C9F. 18 The hexafluoropropylene (HFP) trimer shown, and C m F 2m and / or C n F （2n－2） [In the formula, m is an integer greater than or equal to 4 and less than or equal to 12, excluding 9. n is an integer greater than or equal to 4 and less than or equal to 12.]

[0048] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Additionally, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9. Furthermore, m is particularly preferably 8.

[0049] n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Alternatively, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0050] C m F 2m It can be a chain compound or a cyclic compound that can have substituted structures. Chain compounds can be so-called alkenes, and can be straight-chain or branched.

[0051] C n F （2n－2） It can be a chain compound or a cyclic compound with substituted structures. Chain compounds can be dienes or alkynes, and can be straight-chain or branched.

[0052] This invention is based on making C m F 2m and / or C n F （2n－2） This invention was made possible by the discovery that compositions formed in coexistence with HFP trimers surprisingly function as heat transfer fluids. Furthermore, the heat transfer fluid compositions of this invention contain C... m F 2m and / or C n F （2n－2） The stability of HFP trimer is improved.

[0053] Furthermore, compared to the overall heat transfer fluid composition of the present invention, C m F 2m and / or C n F （2n－2） The preferred content is 0.0001% by mass or more.

[0054] On the other hand, relative to the overall heat transfer fluid composition of the present invention, C m F 2m and / or C n F （2n－2） The content of [the substance] is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less.

[0055] In one embodiment, in the composition for heat transfer fluids, C, relative to a total of 100 parts by mass of HFP trimer, m F 2m and / or C n F （2n－2） The content is preferably 0.0001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more.

[0056] On the other hand, in the composition for heat transfer fluids, relative to a total of 100 parts by mass of HFP trimer, C m F 2m and / or C n F （2n－2） The content of [the substance] is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less.

[0057] In addition, in the presence of multiple C m F 2m and / or C n F （2n－2） In this case, the above content refers to their total quantity.

[0058] By making C m F 2m and / or C n F （2n－2） When the content of [certain substances] falls within the aforementioned range, it can inhibit C9F. 18 The decomposition of the HFP trimer shown can thus suppress the increase of fluoride ions and the rise in acidity.

[0059] (1-2. Water) In one embodiment, the heat transfer fluid composition of the present invention may contain water. The water content in the heat transfer fluid composition may be 1 ppm by mass or more, preferably 5 ppm by mass or more. By ensuring the water content is at least 1 ppm by mass, it is possible to suppress the composition from becoming charged due to a decrease in stability. Furthermore, the water content in the heat transfer fluid composition is at least 1000 ppm by mass, preferably 500 ppm by mass or less, more preferably 100 ppm by mass or less, and even more preferably 20 ppm by mass or less. By ensuring the water content is at least 1000 ppm by mass or less, it is possible to suppress C9F during heating. 18 The decomposition of the HFP trimer shown can thus suppress the excessive increase of fluoride ions and the rise in acidity.

[0060] In one approach, relative to C9F 18 Of the total 100 parts by mass of the compound shown, the water content is preferably 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more.

[0061] On the other hand, compared to C9F 18 Of the total 100 parts by mass of the compound shown, the water content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less.

[0062] The heat transfer fluid composition of the present invention improves insulation strength by containing a specified amount of water. The insulation strength of the heat transfer fluid composition of the present invention is preferably 40 kV or higher, preferably 50 kV or higher, and more preferably 60 kV or higher.

[0063] (1-3. Fluoride ions) In one embodiment, the heat transfer fluid composition of the present invention may contain 0.0000001% by mass or more of fluoride ions relative to the total composition. The amount of fluoride ions is preferably 0.000001% by mass or more, more preferably 0.0001% by mass or more, and even more preferably 0.001% by mass or more, relative to the total composition. By maintaining a fluoride ion concentration of 0.0000001% by mass or more, the stability of the heat transfer fluid composition can be maintained, and the charging of the composition can be suppressed.

[0064] Furthermore, relative to the overall composition, the amount of fluoride ions contained in the heat transfer fluid composition of the present invention is 5% by mass or less, preferably 1% by mass or less, and more preferably 0.1% by mass or less. By making the fluoride ions 5% by mass or less, C9F can be suppressed even when heated. 18 The decomposition of the compound shown.

[0065] In one approach, relative to C9F 18 The total mass of the compound shown is 100 parts by mass, and the amount of fluoride ions is preferably 0.0000001 parts by mass or more, more preferably 0.000001 parts by mass or more, even more preferably 0.0001 parts by mass or more, and even more preferably 0.001 parts by mass or more.

[0066] On the other hand, compared to C9F 18 Of the total 100 parts by mass of the compound shown, the amount of fluoride ions is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less.

[0067] Regarding the amount of fluoride ions, for example, add one volume (by weight) of distilled water to the sample, shake to mix for about 20 seconds, and extract F ions from the aqueous layer. Then, use a dropper to aspirate 2.5–3.0 mL of the aqueous layer, mix it with twice the volume of TISAB solution (total ionic strength adjusting buffer solution), and use the resulting liquid as the sample for determination using a fluoride ion meter.

[0068] As a fluoride ion source, widely known fluoride ion sources can be used without particular limitation. Examples include ions of hydrogen fluoride, sodium fluoride, sodium bifluoride, potassium fluoride, potassium bifluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. These compounds may contain only one or more. Hydrogen fluoride is preferred as the fluoride ion source.

[0069] (1-4. Other components) In addition to containing hexafluoropropylene trimer, the heat transfer fluid composition of the present invention may also contain perfluorotripropylamine. The heat transfer fluid composition containing hexafluoropropylene trimer and perfluorotripropylamine can be an azeotropic liquid. Because the heat transfer fluid composition is an azeotropic liquid, even if the heat transfer fluid composition vaporizes, the composition changes little, making it easy to handle.

[0070] Among them, azeotropic liquids refer to liquids in which the difference in mole fraction between the gas phase and liquid phase of each component is within 10%.

[0071] Perfluorotripropylamine, also known as tri(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, is derived from the general formula: N(CF2CF2CF3). a (CF(CF3)CF3) 3－a (where a is an integer from 0 to 3). Perfluorotripropylamine may contain only one or more of the compounds shown in the above general formula. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3)3 may also be included as an impurity. a (CF(CF3)CF3) 3－a (a is an integer from 0 to 2). Specific examples include product names such as "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0072] The heat transfer fluid composition of the present invention may also contain a mixture of perfluoropolyether and methoxytridecylfluoroheptene isomers, perfluorotributylamine, etc.

[0073] Perfluoropolyethers are preferably derived from the general formula: RO-Rf 1 -R' indicates that, in the formula, R and R' are the same or different, and the value is -C. m F 2m＋1 The monovalent group shown is where m is an integer from 1 to 8, and Rf 1 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units, wherein the repeating units are composed of: (i) -CFXO-, (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v)-CF2CF2CF2CF2O- indicates, or Rf 1 for: (vi) - (CF2) n -CFY-O- (where n is an integer from 0 to 3, Y is the general formula -ORf) 2 Z represents a monovalent group, where Rf 2 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units as shown in -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, wherein each X may be the same or different, and can be F or CF3, and Z is a monovalent C. 1－5 (Perfluoroalkyl) is a divalent group.

[0074] Specific examples of perfluoropolyethers include GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by SOLVAY).

[0075] The mixture of methoxytridecylfluoroheptene isomers specifically includes methyl-perfluoroheptene ether (MPHE) (C7F 13 OCH3). Specific examples include product names such as "Opteon SF10" (manufactured by Chemours).

[0076] In the case where the heat transfer fluid composition of the present invention contains a mixture of perfluorotripropylamine, perfluoropolyether, and methoxytridecylfluoroheptene isomers, since these substances are compatible with C9F... 18 The compounds shown have similar properties as heat transfer fluids, therefore, regardless of the proportions of these substances, the overall properties of the heat transfer fluid composition remain essentially unchanged. Therefore, in this case, the heat transfer fluid composition of the present invention preferably contains 40% to 99.9% by mass of C9F relative to the overall heat transfer fluid composition. 18 The compound shown is more preferably contained in 60% to 99.9% by mass, and even more preferably in 80% to 99.9% by mass.

[0077] (1-5. Impurities) The heat transfer fluid composition of the present invention may contain a conductive substance. The content of the conductive substance is 100 ppm by mass or less, preferably 75 ppm by mass or less, more preferably 50 ppm by mass or less, and even more preferably 10 ppm by mass or less. Among them, substances that have the potential to cause short circuits due to the intrusion of conductive substances from device gaps are particularly metals and metal ions. Therefore, the content of the conductive substance of the present invention may also be studied as needed, focusing on "at least one of metals and metal ions".

[0078] In another embodiment, the content of insoluble matter larger than 5 μm (including solid components such as resin flakes of the container, dust mixed in from the air, etc., regardless of whether it is conductive) in the heat transfer fluid composition of the present invention is preferably 10 particles / mL or less, more preferably 5 particles / mL or less, and even more preferably 3 particles / mL or less.

[0079] (1-6. Methods for manufacturing compositions for heat transfer fluids with reduced impurities) This invention provides a method for manufacturing a heat transfer fluid composition with reduced impurities. The method includes a step of refining a composition containing a heat transfer fluid compound and a conductive substance to obtain a heat transfer fluid composition with reduced conductivity from the composition. The method is characterized by: (1) The above heat transfer fluid compound contains a compound selected from C9F. 18 At least one of the compounds shown, perfluoroolefin ethers, and perfluoropolyethers, (2) The above-mentioned refining process is a process using at least one of the following: filter, ion exchange resin, metal ion removal filter, metal ion removal agent, distillation, rectification, centrifugation and electrostatic adsorption.

[0080] In this invention, "reduction" in refining refers to reducing the proportion of conductive substances in the above composition.

[0081] According to the inventors' research, currently known heat transfer fluids contain conductive substances (metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances are not only unavoidably mixed in during the manufacturing process of the heat transfer fluid, but also include substances that are mixed in after manufacturing and use. When these heat transfer fluids are used to transfer heat to or from devices, short circuits may occur due to the intrusion of conductive substances through device gaps.

[0082] Furthermore, repeated use of the heat transfer fluid may cause blockage in the piping of the circulating heat transfer fluid. Regarding the presence of conductive substances, currently known heat transfer fluids can also be described as "compositions containing heat transfer fluid and conductive substances." The method for manufacturing the heat transfer fluid composition of the present invention is characterized in that the composition containing heat transfer fluid and conductive substances (hereinafter also referred to as "pre-refining composition") is subjected to a specific refining process to obtain a heat transfer fluid composition with reduced conductivity.

[0083] (1-6-1) A composition containing a heat-transferring fluid compound and a conductive substance (composition before purification) The composition before refining may contain a heat transfer fluid compound and a conductive substance. The heat transfer fluid compound contains a compound selected from C9F. 18 At least one of the compounds shown, perfluoroolefin ethers, and perfluoropolyethers.

[0084] (1-6-2)C9F 18 The compound shown C9F 18 The compound shown is the hexafluoropropylene trimer described above.

[0085] (1-6-3) Perfluoroolefin ethers Perfluoroolefin ethers are preferably well-known compounds represented by the following formula (V). C7F 13 OR (V) [Where R stands for Me or Et.]

[0086] As a perfluoroolefin ether represented by the above formula (V), examples may include those selected from CF3 (CF2). x CF = CFCF (OR) (CF2) y CF3, CF3 (CF2) x C(OR) = CFCF2(CF2) y CF3, CF3CF=CFCF(OR)(CF2) x (CF2) y CF3 and CF3 (CF2) x CF = C(OR)CF2(CF2) y At least one unsaturated fluoroether of CF3 [where R is Me or Et, and x and y are independently 0, 1, 2, or 3, and x + y = 1, 2, or 3].

[0087] Examples of perfluoroolefin ethers represented by formula (V) above include 5-methoxyperfluoro-3-heptene, 3-methoxyperfluoro-3-heptene, 4-methoxyperfluoro-2-heptene, 3-methoxyperfluoro-2-heptene, 4-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-2-pentene, 3-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-3-pentene, cis- and trans-2-methoxyperfluoro-2-octene, and 2-methoxyperfluoro-3-octene.

[0088] The preferred structure of the perfluoroolefin ether shown in formula (V) above is methylperfluoroheptene ether. This methylperfluoroheptene ether may also comprise a mixture of two or more structures and / or stereoisomers. As a specific example, methylperfluoroheptene ether may include a mixture of about 48 to about 52% by mass of 5-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 3-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 4-methoxyperfluoro-2-heptene, and about 6 to about 10% by mass of 4-methoxyperfluoro-3-heptene.

[0089] Perfluoroolefin ethers specifically include methyl-perfluoroheptenyl ether (MPHE) (C7F 13 OCH3). Specific examples include products like "Opteon SF10" (manufactured by Chemours).

[0090] (1-6-4) Perfluoropolyether Perfluoropolyether (PFPE) is preferably represented by the following formula (IV). RO-Rf 1 -R' (IV) In the formula, R and R' are the same or different, and the value is -C. m F 2m +1 represents a monovalent group, where m is an integer from 1 to 8, and Rf 1 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units, wherein the repeating units are composed of: (i) -CFXO-, (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v)-CF2CF2CF2CF2O- indicates, or Rf 1 : (vi) - (CF2) n-CFY-O- (where n is an integer from 0 to 3, Y is the general formula -ORf) 2 Z represents a monovalent group, where Rf 2 It is a divalent fluorinated polyoxyalkylene group containing 2 to 20 repeating units as shown in -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, wherein each X may be the same or different, and can be F or CF3, and Z is a monovalent C. 1－5 A divalent group (represented by perfluoroalkyl). Among these, well-known compounds can be widely used as PFPE as shown in formula (IV).

[0091] Regarding the preferred structure of the PFPE shown in equation (IV) above, m is an integer from 1 to 3, and Rf is selected from the following: (1)-(CF2O) a - (CF2CF2O) b -(CF2-(CF2) z’ -CF2O) c (In the formula, a, b, and c are integers less than 100. z' is an integer of 1 or 2. a≥0, b≥0, c≥0, a+b>0. In this condition, it is particularly preferred that a, b, and c are integers less than 50, a and b are both >0, and b / a is included in the range of 0.1 to 10.) (2) - (C3F6O) c’ - (C2F4O) b — (CFXO) t —(In the formula, X is independently selected from -F and -CF3 each time it appears. b, c', and t are integers less than 100, c' > 0, b ≥ 0, and t ≥ 0. In this condition, it is particularly preferred that b and t > 0, c' / b is between 0.2 and 5.0, and (c' + b) / t is between 5 and 50.); or (3)-(C3F6O) c’ — (CFXO) t —(In the formula, X is independently selected from -F and -CF3 each time it appears. c' and t are integers less than 100, c' > 0, and t ≥ 0. In this condition, it is particularly preferred that t > 0, and c' / t is preferably contained in the range of 5 to 50.)

[0092] Specific examples of perfluoropolyethers include GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by SOLVAY).

[0093] (1-6-5) may contain additional heat transfer fluid compounds. The heat transfer fluid of the present invention may also contain the three components mentioned above (selected from C9F).18 The compounds shown, at least one of perfluoroolefin ethers and perfluoropolyethers, are collectively referred to as "the three components of the present invention." Different additional heat transfer fluid compounds (also referred to as "additional components"). Additional components can be one or more, and examples of additional components include, for example, hexafluoropropylene dimer, hexafluoropropylene tetramer, perfluorotripropylamine, perfluorotributylamine, etc.

[0094] Hexafluoropropylene dimers can contain (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0095] Hexafluoropropylene tetramers can contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0096] Perfluorotripropylamine, also known as tri(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, is derived from the general formula: N(CF2CF2CF3). n (CF(CF3)CF3) 3－n (n is an integer from 0 to 3). Perfluorotripropylamine may contain only one or more of the compounds shown in the above general formula. N(CF2CF2CF3)3 is preferred, and as an impurity, N(CF2CF2CF3)3 may be included. n (CF(CF3)CF3) 3－n (n is an integer from 0 to 2). Specific examples include product names such as "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0097] When the heat transfer fluid composition of the present invention contains the three components of the present invention and the additional components, it is preferable to contain 80% by mass or more of the three components of the present invention relative to the overall heat transfer fluid; more preferably, it contains 85% by mass or more; further preferably, it contains 90% by mass or more; and most preferably, it contains 95% by mass or more. In the manufacturing method of the present invention, the kinematic viscosity, freezing point, and boiling point characteristics of the composition containing the heat transfer fluid compound and the conductive substance (the composition before purification) affect the efficiency of removing the conductive substance from the composition before purification depending on the relationship with the prescribed purification treatment (using at least one of a filter, ion exchange resin, metal ion removal filter, metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption). Therefore, it is preferable that the heat transfer fluid compound is substantially composed only of the three components of the present invention. When the additional components are contained, as described above, it is preferable to contain 80% by mass or more of the three components of the present invention relative to the overall heat transfer fluid.

[0098] In addition to the three components of the present invention, in both cases with and without additional components, for example as a composition containing a heat transfer fluid compound and a conductive substance (pre-refining composition), the synthetic or commercially available products of each of the three components of the present invention as described above, and / or articles obtained by using these components as heat transfer fluids for a certain period of time and then subsequently mixing them with a conductive substance, can be widely used.

[0099] (1-6-6) Conductive materials Examples of conductive materials include at least one selected from metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When a heat transfer fluid containing a conductive material is used to transfer heat to or from a device, short circuits may occur due to the conductive material seeping into the gaps between the devices. Furthermore, repeated use of the heat transfer fluid may cause blockages in the piping of the circulating heat transfer fluid. Therefore, it is important to reduce the content of these conductive materials to improve the performance of the heat transfer fluid. The shape and size of the conductive material vary depending on the type of conductive material, typically ranging from about 0.001 to 10 μm.

[0100] Metals, metal ions, metal oxides, and metal nitrides that are conductive materials include, for example, Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, and Zn.

[0101] Metals, as conductive materials, can be elemental or alloys. Typically, they exist in the form of particulate matter.

[0102] Ions that act as conductive materials include all ionic forms obtainable from various metals. Ions that act as conductive materials can exist in the form of dissolved ions with any valence, or they can exist as ions within a substance, such as in a coordinated form.

[0103] Metal oxides, as conductive materials, can be oxides of a single metal or oxides of multiple metals (i.e., composite oxides).

[0104] Metal nitrides, as conductive materials, can be nitrides of a single metal or nitrides of multiple metals (i.e., complex nitrides).

[0105] Carbon, as a conductive material, can be exemplified by carbon black.

[0106] Examples of conductive polymers that are conductive materials include polyacetylene and polythiophene.

[0107] The content of conductive substances in the composition before purification is not limited, but when it is, for example, 150 ppm by mass or more (more preferably 500 ppm by mass or more), the content of conductive substances can be effectively reduced in the manufacturing method of the present invention. Furthermore, the content of conductive substances can be determined using an inductively coupled plasma mass spectrometer (ICP-MS) as described in the examples.

[0108] Furthermore, regardless of whether the composition before purification is conductive, if it contains insoluble solids such as resin flakes from the container, dust mixed in from the air, etc., and for example, the content of insoluble solids larger than 5 μm is 50 particles / mL or more (further, 100 particles / mL or more), the content of insoluble solids can be effectively reduced simultaneously during the purification process of the present invention, which reduces the content of conductive substances. The number of insoluble conductive solids (particles) contained in the composition can be determined using a liquid particle counter, as described in the examples.

[0109] (1-6-7) Physical properties of the composition before purification The composition prior to purification is a composition containing a heat transfer fluid and a conductive substance, and in the manufacturing method of the present invention, it is supplied for purification treatment using at least one selected from filters, ion exchange resins, metal ion removal filters, metal ion removal agents, distillation, rectification, centrifugation, and electrostatic adsorption.

[0110] When the content of conductive material in the pre-refined composition is reduced through the above-described refining process, from the viewpoint of refining efficiency, it is preferable that the pre-refined composition has a low kinematic viscosity, a low freezing point, and a high boiling point. By using the three components of the present invention described above as the main components of the heat transfer fluid (preferably 80% by mass or more), the pre-refined composition readily possesses the physical properties of low kinematic viscosity, low freezing point, and high boiling point.

[0111] The kinematic viscosity of the composition before purification at -40°C is preferably 15 cSt or less, more preferably 10 cSt or less, and even more preferably 7 cSt or less. By having a kinematic viscosity as low as 15 cSt or less, filterability is improved, thus particularly enhancing the efficiency of purification processes using filters, metal ion removal filters, etc. The method for determining the kinematic viscosity at -40°C in this invention is the method described in the examples.

[0112] The freezing point of the composition before refining is preferably below -35°C, more preferably below -50°C, further preferably below -70°C, and most preferably below -100°C. By having a freezing point as low as -35°C, refining can be performed at low temperatures, thus reducing heat transfer fluid loss due to evaporation and improving the efficiency of the refining process. The method for determining the freezing point of this invention is the method described in the examples.

[0113] The boiling point of the composition before refining is preferably 90°C or higher, more preferably 95°C or higher, and even more preferably 105°C or higher. By having a boiling point as high as 90°C or higher, for the same reasons as a low freezing point, it is possible to reduce the loss of heat transfer fluid due to evaporation, etc., and improve the efficiency of the refining process. The boiling point determination method of the present invention is the method described in the examples.

[0114] (1-6-8) Refining treatment of the composition before refining In the manufacturing method of the present invention, the pre-refining composition is subjected to a refining treatment using at least one selected from filters, ion exchange resins, metal ion removal filters, metal ion removal agents, distillation, rectification, centrifugation and electrostatic adsorption.

[0115] These refining methods can be applied using conventional methods. In the manufacturing method of this invention, the refining process using a filter is particularly preferred. When using a filter, there is no limitation on the upper or lower limit of the filter pore size. For example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. Conversely, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0116] As the aforementioned ion exchange resin, either a cation exchange resin or anion exchange resin can be used. For example, an ion exchange resin having amino and / or quaternary ammonium groups as functional groups can be used. A strongly basic anion exchange resin is preferred. The basicity of the anion exchange resin can be set in various ways depending on the polymer backbone and / or the type of functional groups. Commercially available anion exchange resins can also be used, such as the "Diaion (registered trademark) SA" series manufactured by Mitsubishi Chemical Corporation, the "A200" series manufactured by Purolite, and the "AMBERLITE (registered trademark)" series manufactured by Organo. As a cation exchange resin, for example, an ion exchange resin having carboxylic acid groups and / or sulfonic acid groups as functional groups can be used. The acidity of the cation exchange resin can be set in various ways depending on the polymer backbone and / or the type of functional groups. Commercially available cation exchange resins can be used, such as the "Diaion (registered trademark) SK" series manufactured by Mitsubishi Chemical Corporation, the "C100" series manufactured by Purolite Corporation, and the "AMBERLITE (registered trademark)" series manufactured by Organo Corporation.

[0117] Examples of metal ion removal agents include chelating agents and activated carbon. Chelating agents include, for example, CRB03, CRB05, CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, Si-PHI (all manufactured by SiliCycle), MuromacXMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, IRC747UPS (all manufactured by Organo), S910 (manufactured by Purolite), and MPA (manufactured by Reaxa QuadraPure). Examples of activated carbon include "Hakuhei (registered trademark)" manufactured by Osaka Gas Chemical Co., Ltd., "Filtrasorb (registered trademark) CAL", "Diahope (registered trademark)" and "Diasorb (registered trademark)" manufactured by Calgon Carbon Japan Co., Ltd., and the "Evadia (registered trademark)" series manufactured by Swing Corporation.

[0118] By performing the above-described refining process, a heat transfer fluid composition with reduced conductive material content (refined composition) can be obtained.

[0119] The above manufacturing method includes the above-mentioned refining process, and may also include a process of adding additives such as stabilizers to the heat transfer fluid composition, and other processes.

[0120] (2. Heat transfer fluid) The heat transfer fluid composition of the present invention can be used in combination with components other than the heat transfer fluid composition (hereinafter, a fluid containing the heat transfer fluid composition and components other than the heat transfer fluid composition is referred to as a heat transfer fluid). The heat transfer fluid of the present invention contains, in addition to the compounds shown in formulas (I) to (III) above, and C... m F 2m and / or C n F （2n－2） In addition to water and / or fluoride ions, it may contain any additives other than those for the heat transfer fluid composition, to the extent that it does not impair its effects and purpose. Examples of such additives include stabilizers.

[0121] Stabilizers function as acid absorbers or antioxidants by exerting a stabilizing effect. Their stabilizing effects can be exemplified by: preventing the decomposition of HFP trimers by capturing free radicals generated within the system; and preventing further decomposition of HFP trimers due to acid by capturing acids generated within the system.

[0122] Well-known stabilizers can be widely used as such stabilizers. Among them, from the viewpoint of effectively inhibiting the corrosion of metals due to the composition, it is preferable to use one or more stabilizers selected from unsaturated alcohol stabilizers, nitro stabilizers, amine stabilizers, phenol stabilizers and epoxy stabilizers.

[0123] As an unsaturated alcohol stabilizer, a wide range of well-known compounds can be used. For example, one or more compounds selected from 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0124] As nitro stabilizers, widely known compounds can be used. Examples of aliphatic nitro compounds include nitromethane, nitrobenzene, 1-nitropropane, and 2-nitropropane. Examples of aromatic nitro compounds include one or more selected from nitrobenzene, o-dinitrobenzene, m-dinitrobenzene or p-dinitrobenzene, o-nitrotoluene, m-nitrotoluene or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-nitrophenol, m-nitrophenol or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole.

[0125] As amine stabilizers, widely known compounds can be used. For example, one or more compounds selected from pentamidine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, n-propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tripentylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxyamine can be used.

[0126] As phenolic stabilizers, well-known compounds can be widely used. For example, one or more of the following can be used: 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzene glycol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol.

[0127] As epoxy stabilizers, well-known compounds can be widely used. For example, one or more selected from epoxide, 1,2-epoxide, 1,2-epoxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxide-3-phenoxypropane can be used.

[0128] Considering the rationale that by combining stabilizers with different stabilizing effects, it is more effective to prevent the decomposition of HFP trimer caused by various reasons, it is preferable to use an epoxy stabilizer as described above, and one or more stabilizers selected from unsaturated alcohol stabilizers, nitro stabilizers and phenol stabilizers.

[0129] From the viewpoint of effectively suppressing free acid from the aforementioned HFP trimer and suppressing metal corrosion caused by the liquid composition, the content of the stabilizer is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more, relative to the overall heat transfer fluid. On the other hand, considering the avoidance of adverse changes in the physical properties of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer is preferably 10% by mass or less, and more preferably 5% by mass or less, relative to the overall heat transfer fluid.

[0130] (3. Use of the heat transfer fluid composition or heat transfer fluid) The heat transfer fluid composition or heat transfer fluid of the present invention is used to absorb heat from or supply heat to various objects to which heat is transferred. The objects to which heat is transferred according to the present invention are articles, apparatuses, or atmospheres that are cooled, heated, or maintained at a desired controlled temperature. Examples of such objects include electrical components, mechanical components, and optical components, as well as their processed and assembled products. Specific examples of the objects to which heat is transferred according to the present invention are not particularly limited, but include wafers used in the manufacture of semiconductor devices, microprocessors, power control semiconductors, electrical switchgear, power transformers, circuit boards, multi-chip modules, assembled and unassembled semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile components, etc.

[0131] The heat transfer fluid composition or heat transfer fluid of the present invention can also be used as a two-phase liquid immersion cooling fluid, a cooling fluid, or a Rankine cycle working fluid.

[0132] The heat transfer fluid composition or heat transfer fluid of the present invention can be used in machines designed to use them to transfer heat, replacing the heat transfer fluid currently used in the aforementioned equipment.

[0133] The heat transfer fluid composition or heat transfer fluid of the present invention can perform simple (dropin), nearly simple (nealy dropin), or retrofit replacement of the heat transfer fluid in use. "Simple replacement" means replacement can be performed without any changes to the equipment. "Nearly simple replacement" means replacement can be performed with almost no changes to the equipment. "Retrofit replacement" means replacement can be performed with minimal changes to the equipment (not with significant changes). Preferably, the heat transfer fluid composition or heat transfer fluid of the present invention can perform simple or nearly simple replacement of the aforementioned heat transfer fluid.

[0134] Whether a simple substitution, near-simple substitution, or updated substitution can be performed can be determined by whether all of the following conditions are met.

[0135] (i) The boiling point of the heat transfer fluid is at least about 80% of the boiling point of the heat transfer fluid before the exchange, preferably at least about 85%.

[0136] (ii) The pour point of the heat transfer fluid is the same as or below the pour point of the heat transfer fluid before the exchange.

[0137] (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% of the kinematic viscosity of the heat transfer fluid before the exchange, preferably at least about 150%.

[0138] (iv) The heat transfer fluid is miscible with the heat transfer fluid before the exchange in any proportion.

[0139] By making the boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention at at least about 80%, preferably at least about 85%, of the boiling point of the heat transfer fluid before the exchange, cavitation and device leakage can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited; for example, it can be at least about 130% of the boiling point of the heat transfer fluid before the exchange.

[0140] By making the pour point of the heat transfer fluid composition or heat transfer fluid of the present invention equal to or lower than the pour point of the heat transfer fluid before the exchange, it can be used even below the existing operating temperature, and the operating temperature range can be expanded. There is no particular upper limit to the pour point of the heat transfer fluid; for example, it can be a temperature 30°C or lower than the pour point of the heat transfer fluid before the exchange.

[0141] By making the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present invention at at least about 200%, preferably at least about 150%, of the kinematic viscosity of the heat transfer fluid before exchange, it is possible to suppress the increase in power consumption or reduce power consumption. The kinematic viscosity is preferably compared with the kinematic viscosity at the operating temperature, but is not limited thereto. For example, it can be compared with the kinematic viscosity at any temperature from -20°C to -40°C, specifically at -20°C.

[0142] The heat transfer fluid composition or heat transfer fluid of the present invention is miscible with the heat transfer fluid before the exchange in any proportion, making the replacement operation easy.

[0143] Furthermore, the heat transfer fluid composition or heat transfer fluid of the present invention is more suitable for simple substitution, near-simple substitution or newer substitution if it meets the following conditions.

[0144] (v) The heat transfer fluid composition or heat transfer fluid of the present invention is 120% or less of the dielectric constant of the heat transfer fluid prior to the exchange.

[0145] (vi) The heat transfer fluid composition or heat transfer fluid of the present invention has an insulation strength of 90% or more of the heat transfer fluid before the exchange.

[0146] (vii) The heat transfer fluid composition or heat transfer fluid of the present invention has a specific heat of 90% or more of the heat transfer fluid before the exchange.

[0147] (viii) The heat transfer fluid composition or heat transfer fluid of the present invention has a thermal conductivity of 90% or more of the heat transfer fluid before the exchange.

[0148] By making the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention less than 120% of the dielectric constant of the heat transfer fluid before the exchange, it can be suitably used as an alternative composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited; for example, it can be more than 80% of the dielectric constant of the heat transfer fluid before the exchange.

[0149] By making the insulation strength of the heat transfer fluid composition or heat transfer fluid of the present invention reach 90% or more of the insulation strength of the heat transfer fluid before the exchange, it can be suitably used as an alternative composition. There is no particular upper limit to the insulation strength of the heat transfer fluid; for example, it can be 120% or less of the insulation strength of the heat transfer fluid before the exchange.

[0150] By making the specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention more than 90% of the specific heat of the heat transfer fluid before the exchange, it can be suitably used as an alternative composition. There is no particular upper limit to the specific heat of the heat transfer fluid; for example, it can be less than 120% of the specific heat of the heat transfer fluid before the exchange.

[0151] By making the thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention 90% or more of the thermal conductivity of the heat transfer fluid before the exchange, it can be suitably used as an alternative composition. There is no particular upper limit to the thermal conductivity of the heat transfer fluid; for example, it can be 120% or less of the thermal conductivity of the heat transfer fluid before the exchange.

[0152] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 105°C or higher, more preferably 108°C or higher. Furthermore, the upper limit of the boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and may be, for example, 150°C or lower, 130°C or lower, or 120°C or lower.

[0153] The pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably -80°C or lower, more preferably -100°C or lower, and even more preferably -110°C or lower. Furthermore, the lower limit of the pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited; for example, it can be -180°C or higher, or -160°C or higher.

[0154] The kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 6.0 cSt or less at -20°C, more preferably 5.0 cSt or less, even more preferably 4.0 cSt or less, and even more preferably 3.5 cSt or less. Furthermore, the lower limit of the kinematic viscosity of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 1.0 cSt or more.

[0155] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Furthermore, the lower limit of the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 1.1 or more.

[0156] The insulation strength of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 40 kV or more, more preferably 50 kV or more. Furthermore, the upper limit of the insulation strength of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 150 kV or less or 100 kV or less.

[0157] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 800 J / kg·K or more at 30°C, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more. Furthermore, the upper limit of the specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 2000 J / kg·K or less or 1500 J / kg·K or less.

[0158] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention is preferably 0.055 W / mK or higher at 30°C, more preferably 0.060 W / mK or higher, and even more preferably 0.065 W / mK or higher. Furthermore, the upper limit of the thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention is not particularly limited, and for example, it can be 0.090 W / mK or lower, or 0.080 W / mK or lower.

[0159] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present invention is obtained by observing the endothermic peak using DSC (differential operating calorimetry) when the temperature is increased from 25°C at a rate of 5°C / minute.

[0160] The pour point of the heat transfer fluid composition or heat transfer fluid of the present invention is obtained by observing the endothermic peak when the temperature is increased by 5°C / min after cooling to below the freezing point using liquid nitrogen using DSC.

[0161] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present invention is obtained by observing the value at a frequency of 1 kHz in an environment with a temperature of 25°C and a humidity of 60% using the electrostatic capacitance method.

[0162] The kinematic viscosity and density of the heat transfer fluid composition or heat transfer fluid of the present invention are values ​​measured using an Anton Paar SVM3001 kinematic viscometer.

[0163] The insulation strength of the heat transfer fluid composition or heat transfer fluid of the present invention is the insulation breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a specified interval, and the voltage is increased at a certain rate. The measurement conditions are as follows.

[0164] Electrode shape: spherical (φ12.5mm); Electrode spacing: 2.5mm; Voltage boost rate: 2kV / second; Measurement atmosphere: air (22℃, 57%RH).

[0165] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present invention is a value obtained using DSC under the following conditions.

[0166] Measuring apparatus: Perkin-Elmer DSC8500 differential scanning calorimeter; Heating rate: 10℃ / minute; Standard sample: Sapphire (-Al2O3); Atmosphere: In a dry nitrogen stream; Sample container: Aluminum sealed container.

[0167] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present invention is a value measured using the transient hot wire method.

[0168] The compatibility of the heat transfer fluid composition or heat transfer fluid of the present invention can be determined by whether it is miscible after being mixed with the solvent to which it is intended. Miscibility means that the two are mixed in a homogeneous state, i.e., no phase separation occurs.

[0169] (4. Heat transfer device) The present invention also discloses a heat transfer device having a device and a mechanism containing the above-mentioned heat transfer fluid composition, the mechanism being used to transfer heat to or from the device.

[0170] Examples of devices include computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; network-connected storage; storage communication systems; workstations; routers; electrical communication infrastructure / switches; wired, optical and wireless communication devices; cell processing devices; printers; power supply devices; displays; optical devices; measurement systems including handheld systems; military electronic equipment, etc.

[0171] Semiconductor components are heat-generating components mounted on devices, such as CPUs, GPUs, and SSDs. These semiconductor components are composed of single-element silicon, germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0172] In the case of a server computer, one or more logic boards are configured within the internal space. Each logic board contains multiple heat-generating electronic components, including at least one processor such as a CPU or GPU. In addition, other heat-generating computer components may be used, such as chipsets; memory, graphics card chips, network chips, RAM, power supplies, daughter cards; and storage drives such as solid-state drives and hard disk drives.

[0173] A heat transfer device is used to move heat between a heat transfer fluid and an object to which heat is transferred. Heat is transferred through thermal contact with the object. For example, it acts as cooling when absorbing heat from the object and as heating when supplying heat. Different mechanisms may be used depending on the specific circumstances, but a single heat transfer device can provide both cooling and heating.

[0174] As a heat transfer device, there are no particular limitations; examples include pumps, valves, fluid closed systems, pressure control systems, coolers, heat exchangers, heat sources, heat dissipation components, refrigeration systems, active temperature control systems, passive temperature control systems, etc.

[0175] More specifically, examples include temperature-controlled wafer chucks in plasma-enhanced chemical vapor deposition (PECVD) tools, temperature-controlled test heads for mold performance testing, temperature-controlled work areas in semiconductor process equipment, thermal shock test baths, and constant temperature baths.

[0176] The object to which a heat transfer device comes into thermal contact is an article, apparatus, or atmosphere that is cooled, heated, or maintained at a controlled temperature. Examples of such objects include electrical components, mechanical components, and optical components, as well as their processed and assembled products. Specific examples of objects to which the present invention is made include microprocessors, wafers for manufacturing semiconductor devices, power control semiconductors, electrical switchgear, power transformers, circuit boards, multi-chip modules, assembled and unassembled semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components, but are not limited to these examples.

[0177] (5. Heat transfer methods) The present invention also discloses a heat transfer method, comprising: a step of preparing a device; and a step of transferring heat to or from the device using the aforementioned heat transfer fluid composition. Heat can be transferred by arranging the heat transfer device in thermal contact with the device. When the heat transfer device is arranged in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0178] The embodiments of the present invention have been described above, but the present invention is not limited to such examples in any way, and can be implemented in various ways without departing from the spirit of the present invention.

[0179] Example The embodiments of the present invention will be described in more detail below, but the present invention is not limited to these embodiments.

[0180] (Manufacturing Example 1) The HFP trimer was obtained according to the method described in Chem Bar (1973), Vol. 106, pp. 2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropylene dimers and tetramers. Then, the purified HFP trimer was separated into compounds of formulas (I), (II), and (III) by distillation. The separated HFP trimers were then dehydrated using silica gel.

[0181] The compounds represented by formulas (I), (II) and (III) obtained above are mixed such that the proportions of the compounds represented by formulas (I), (II) and (III) are as shown in the table below, to obtain trimer mixtures 1 to 4.

[0182] [Table 1] (Manufacturing Example 2) Based on the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp. 1064-1067, C9F was synthesized. 16 .

[0183] (Manufacturing Example 3) C8F was purchased as a reagent manufactured by Wako Pure Chemical Industries, Ltd. 16 .

[0184] (Examples 1-43) The trimer mixtures 1 to 4 and C9F as an additive in Manufacturing Example 2 were used. 16 Or manufacturing Example 3 of C8F 16 The heat transfer fluid compositions of Examples 1 to 43 were obtained by mixing them according to the proportions shown in the table below.

[0185] (Stability test) The resulting heat transfer fluid composition was placed in an SUS autoclave and sealed, and heated and held under the conditions shown in the table below.

[0186] (Determination of fluoride ion concentration) Add an equal volume (by weight) of distilled water to the sample and mix by shaking for approximately 20 seconds to extract F ions from the aqueous layer. Next, use a dropper to pipette 2.5–3.0 mL of the aqueous layer and mix it with twice the volume of TISAB solution (total ionic strength adjusting buffer: manufactured by HORIBA) to form a sample. Measure the fluoride ion concentration using a fluoride ion meter (manufactured by HORIBA). The fluoride ion concentration is calculated as three times the measured value after dilution with TISAB solution. The results are shown in the table below.

[0187] [Table 2] [Table 3] Based on the above results, it contains C9F 16 Or C8F 16 Examples 1-43 showed no increase in fluorine concentration even after long-term storage at high temperatures, confirming their stability.

[0188] <Determination of Boiling Point, Pour Point and Dielectric Constant> The boiling point of the trimer mixture was determined using DSC (Differential Operating Calorimetry) by observing the endothermic peak as the temperature increased from 25°C at a rate of 5°C / min. The pour point was determined using DSC, after cooling to below the freezing point with liquid nitrogen, by observing the endothermic peak as the temperature increased at a rate of 5°C / min. The dielectric constant was determined using capacitance at a frequency of 1 kHz at 25°C and 60% humidity.

[0189] <Determination of Kinematic Viscosity and Density> The kinematic viscosity and density of the trimer mixture were determined using an Anton Paar SVM3001 kinematic viscometer.

[0190] <Specific Heat Determination> The specific heat of the trimer mixture was determined using DSC. The determination conditions are as follows.

[0191] Measuring apparatus: Perkin-Elmer DSC8500 differential scanning calorimeter; Heating rate: 10℃ / minute; Standard sample: Sapphire (-Al2O3); Atmosphere: In a dry nitrogen stream; Sample container: Aluminum sealed container.

[0192] <Determination of Thermal Conductivity> The thermal conductivity of the trimer mixture was determined using the transient hot wire method.

[0193] <Compatibility> The compatibility of the trimer mixtures was evaluated by mixing each trimer mixture with equal amounts of the following three solvents.

[0194] Galden HT135 (manufactured by Solvay) SF-10 (manufactured by Chemours) FC3283 (manufactured by 3M) [Table 4] (Examples 44-59) Trimer mixtures 1 to 4 and water were mixed in the amounts shown in the table below to obtain the compositions of Examples 44 to 59.

[0195] [Table 5] (Stability test) The compositions of Examples 44-59 and Comparative Examples 3-6 were placed in an SUS autoclave and sealed, and heated and maintained under the conditions shown in the table below.

[0196] (Insulation strength measurement) A liquid sample is immersed between spherical electrodes spaced at a specified interval. The voltage is increased at a certain rate, and this voltage is used as the insulation breakdown voltage. The insulation strength is then measured. The detailed measurement conditions are as follows.

[0197] Electrode shape: spherical (φ12.5mm); Electrode spacing: 2.5mm; Voltage boost rate: 2kV / second; Measurement atmosphere: air (22℃, 57%RH).

[0198] [Table 6] Based on the above results, no increase in fluoride concentration was observed in Examples 44-59 containing the specified amount of water even after long-term storage at high temperatures, confirming their stability. The high insulation strength of Examples 44-59 was also confirmed.

[0199] (Examples 60-83) Anhydrous hydrofluoric acid was added to trimer mixtures 1 to 4 to prepare a reference solution, which was then diluted with each trimer mixture to obtain compositions of Examples 60 to 83 with fluoride ion concentrations as shown in the table below.

[0200] (Stability test) The sample was placed in an SUS autoclave and sealed, and heated and held under the conditions shown in the table below.

[0201] (Determination of the purity of hexafluoropropylene trimer) The purity of hexafluoropropylene trimer before and after the stability test was determined by gas chromatography.

[0202] [Table 7] [Table 8] Based on the above results, it was confirmed that Examples 60-83, which contained a specified amount of fluoride ions, maintained high purity of hexafluoropropylene trimer even after long-term storage at high temperatures.

[0203] The compounds represented by formulas (I), (II) and (III) obtained above are mixed such that the proportions of the compounds represented by formulas (I), (II) and (III) are as shown in the table below, to obtain a trimer mixture 5 to 6.

[0204] [Table 9] (Manufacturing of hexafluoropropylene tetramer) (Manufacturing Example 4) Based on the method described in Tetrahedron Lett. 1974, 24, 2129-2132, hexafluoropropylene tetramer was obtained.

[0205] The heat transfer fluid of the present invention can be obtained by mixing trimer mixture 5 or 6 with the hexafluoropropylene tetramer obtained in manufacturing example 4.

[0206] <Evaluation Methods> (Boiling point) Using DSC, when the temperature is increased from 25°C to 5°C / minute, the endothermic peak is observed and taken as the observed temperature to determine the boiling point.

[0207] (Kinematic viscosity) Regarding kinematic viscosity, the value was measured at 25°C using an Uberloud viscometer based on JIS K 2283.

[0208] (Dielectric constant) Regarding the dielectric constant, the value at a frequency of 1 kHz was determined using the capacitance method under conditions of 25°C and 60% humidity.

[0209] (Examples 84-85) The trimer mixture 5:hexafluoropropylene tetramer = 91:9 (Example 84) and the trimer mixture 6:hexafluoropropylene tetramer = 91:9 (Example 85) were mixed by weight. The physical properties were measured and the results are shown in Table 2.

[0210] [Table 10] <Examples 86-87> In Examples 86-87, a pre-refining composition (composition 1 containing a heat transfer fluid and a conductive substance; 6FT) was prepared for use in the refining process. Specifically, 750g of DMF and 7.2g of cesium fluoride were placed in an SUS-made autoclave and sealed. After vacuum degassing of the autoclave, 2268g of hexafluoropropylene was added over 4.5 hours while maintaining the temperature inside the autoclave at 70-110°C. The lower layer was separated from the resulting reaction solution and washed with ultrapure water to obtain 2219g of a composition containing HFP trimer (composition 1 as the pre-refining composition). GCFID and GC-MS analysis were performed, and the area percentage method confirmed that the HFP trimer contained 87% by mass in 100% of the total composition, and the compounds represented by formulas (I), (II), and (III) described in this specification contained 78%, 9%, and 13% by mass, respectively, in 100% of the total HFP trimer.

[0211] <Example 88> Perform the same operation as in Examples 86-87, separating the compounds shown in formulas (I), (II), and (III), and mixing the compounds shown in formulas (I), (II), and (III) in a manner of 55% by mass, 15% by mass, and 30% by mass, respectively, to prepare a composition of 2200g.

[0212] <Example 89> Perform the same operation as in Examples 86-87, separate the compounds shown in formulas (I), (II), and (III), and mix the compounds shown in formulas (I), (II), and (III) in amounts of 3%, 33%, and 64% by mass, respectively, to prepare 2200g of composition.

[0213] <Example 90> Perform the same operation as in Examples 86-87, separate the compounds shown in formulas (I), (II), and (III), and mix the compounds shown in formulas (I), (II), and (III) in a manner of 90% by mass, 5% by mass, and 5% by mass, respectively, to prepare 2200g of composition.

[0214] (Determination of metal and metal ion content in the composition before purification) The content of conductive substances (especially metals and metal ions in this embodiment) in the unrefined composition was determined using the following steps with an inductively coupled plasma mass spectrometer (ICP-MS) (the same procedure applies to the refined composition). The measured values ​​are shown in Table 1 below.

[0215] (1) Pour 2000g of the unrefined composition into a beaker made of polytetrafluoroethylene (PTFE), place the beaker on a heating plate at 250°C to allow the volatile components to evaporate.

[0216] (2) Dilute 70% nitric acid for micro-precision analysis (manufactured by Wako Pure Chemical Industries) with ultrapure water to obtain nitric acid with a concentration of about 4% by mass, and add about 50 mL of it to a beaker made of PTFE.

[0217] (3) Place the PTFE beaker on a heating plate at 150°C for 1 hour to dissolve the residual metal in the beaker.

[0218] (4) Use ICP-MS to determine the amount of metal ions dissolved in nitric acid. Calculate the content of metals and metal ions in the solution using the amount of metal ions in nitric acid, the amount of nitric acid, and the amount of solution that has evaporated.

[0219] (5) All the above measurements were carried out by setting up a Table KOACH manufactured by Xingyan Co., Ltd. in a Class 10,000 clean room to make the working environment equivalent to Class 1.

[0220] (Determination of the number of insoluble matter (particles) in the composition before purification) The number of particles with a diameter of 5.0 μm or larger, particles with a diameter of 1.0 μm or larger but smaller than 5.0 μm, particles with a diameter of 0.5 μm or larger but smaller than 1.0 μm, and particles with a diameter of 0.3 μm or larger but smaller than 0.5 μm in the unrefined composition were measured using a liquid particle counter (RION KL-22) at a temperature of 23°C (the same procedure was followed in the refined composition). All measurements were performed in a Class 1 cleanroom using a Table KOACH manufactured by Koken Co., Ltd., to achieve a Class 1 equivalent environment.

[0221] (Determination of boiling point, freezing point and kinematic viscosity of the composition before purification) Boiling point was determined using DSC, with the temperature observed from the endothermic peak as the temperature increased from 25°C at a rate of 5°C / min. Freezing point was determined using DSC, with the temperature observed from the endothermic peak as the temperature was increased from 5°C / min after cooling to below -150°C (the temperature at which a solid can be confirmed) using liquid nitrogen. Kinematic viscosity was measured using an Uberloud viscometer based on JIS K 2283. The measured values ​​are shown in Table 1 below.

[0222] (Refined processing) As a filtration device, for each filter, a unit is prepared to be made by placing one filter in a container, and a multi-stage filtration device is prepared by connecting the necessary number of these units in series.

[0223] The unrefined composition was placed in a pressurized container and cooled to below -5°C. Under a high-purity argon atmosphere, the composition was filtered using the aforementioned filtration apparatus at a pressure of 0.02 MPa to obtain the refined composition. The filters used in each unit of the aforementioned filtration apparatus were as described in Table 1. The results are shown in Table 1.

[0224] • Filter A (IonKleen SL manufactured by PALL Corporation, Japan; filtration area: 0.58m²) 2 ); • Filter B (Ultipleat P-Nylon manufactured by PALL Corporation, Japan; pore size: 0.15μm; filtration area: 1.2m²) 2 );and • Filter C (Ultipleat P-Nylon manufactured by PALL Corporation, Japan; pore size: 40nm; filtration area: 1.2m²) 2 ).

[0225] As shown in Table 1, by subjecting the pre-refining composition to a specified refining process, the content of conductive substances (especially metals and metal ions) can be reduced.

[0226] [Table 11] [Table 12]

Claims

1. A composition for a heat transfer fluid, characterized in that: Contains C9F 18 The hexafluoropropylene trimer shown also contains: (i)C m F 2m and / or C n F （2n－2） In the formula, m is an integer greater than or equal to 4 and less than or equal to 12, excluding 9, and n is an integer greater than or equal to 4 and less than or equal to 12. (ii) Water, wherein, relative to the C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the water content is 0.0001 to 0.1 parts by mass; and / or (iii) Fluoride ions, wherein, relative to C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, and the content of the fluoride ion is 0.0000001 to 5 parts by mass.

2. The composition for heat transfer fluid as claimed in claim 1, characterized in that: The hexafluoropropylene trimer comprises at least one compound selected from the compounds shown in formulas (I) to (III) below. 。 3. The composition for heat transfer fluid as described in claim 2, characterized in that: The compound shown in formula (I) accounts for more than 85% by mass relative to the total amount of hexafluoropropylene trimer.

4. The composition for heat transfer fluid as described in claim 2, characterized in that: The compound shown in formula (I) is less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

5. The composition for heat transfer fluid as described in claim 2, characterized in that: The compound shown in formula (I) is more than 50% by mass and less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

6. The composition for heat transfer fluid as claimed in claim 1, characterized in that, contain: C9F 18 The hexafluoropropylene trimer shown; and (i)C m F 2m and / or C n F （2n－2） In the formula, m is an integer greater than or equal to 4 and less than or equal to 12, excluding 9, and n is an integer greater than or equal to 4 and less than or equal to 12.

7. The composition for heat transfer fluid as claimed in claim 1, characterized in that: m is an integer greater than or equal to 6 and less than or equal to 11, excluding 9, and n is an integer greater than or equal to 6 and less than or equal to 11.

8. The composition for heat transfer fluid as claimed in claim 1, characterized in that: Compared to C9F 18 The total mass of the hexafluoropropylene trimer shown is 100 parts by mass, C m F 2m and / or C n F （2n－2） The content is 0.0001 to 10 parts by mass.

9. The composition for heat transfer fluid as claimed in claim 1, characterized in that: Contains C9F 18 The hexafluoropropylene trimer and (ii) water are shown.

10. The composition for heat transfer fluid as claimed in claim 1, characterized in that: Contains C9F 18 The hexafluoropropylene trimer and (iii) fluoride ions are shown.

11. The composition for heat transfer fluid as claimed in claim 1, characterized in that: It also contains C 12 F 24 The hexafluoropropylene tetramer shown has a content of 80% by mass or more, relative to the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer.

12. The composition for heat transfer fluid as claimed in claim 11, characterized in that: The content of the hexafluoropropylene trimer is more than 90% by mass and less than 99.99% by mass relative to the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer.

13. The composition for heat transfer fluid as claimed in claim 11, characterized in that: The hexafluoropropylene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

14. The composition for heat transfer fluid as claimed in claim 1, characterized in that: It also contains a conductive substance, the content of which is less than 100 ppm by mass.

15. The composition for heat transfer fluid as claimed in claim 1, characterized in that: It also contains conductive substances, and the content of insoluble matter larger than 5μm is less than 10 particles / mL.

16. A heat transfer fluid, characterized in that: A composition containing the heat transfer fluid as described in claim 1 or 2.

17. Use of the heat transfer fluid composition according to claim 1 or 2 as a heat transfer fluid.

18. A heat transfer device, characterized in that: A device and a mechanism comprising a heat transfer fluid composition according to claim 1 or 2, the mechanism being used to transfer heat to or from the device.

19. A heat transfer method, characterized in that, include: The process of preparing components; and The process of transferring heat to or from the device using the heat transfer fluid composition according to claim 1 or 2.

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