Module FOG binding performance detection method

Abstract

The invention discloses a module FOG binding performance detection method, which comprises the following steps: step 1, a contourgraph is adopted to identify the contour of a Panel binding area, a first height curve is obtained, an identification starting area is a Panel left side alignment Mark center, and an identification termination area is a Panel right side Mark center; 2, coating ACF on the Panel, and identifying the contour of the ACF by adopting a contourgraph to obtain a second height curve after the ACF is arranged on the Panel; 3, a contourgraph is adopted to identify a binding area of the FPC, a third height curve including height data of a PAD bound with the FPC is obtained, the second height curve and the third height curve are correspondingly overlapped, and a total thickness curve before pre-pressing and main pressing is obtained; and 4, performing FOG pre-pressing on the module, and identifying an FOG binding area by adopting a contourgraph after the FOG pre-pressing is performed on the module, so as to obtain a final finished product thickness curve. According to the method and the device, the binding effect of the PAD and the binding effect between the PAD and the PAD can be confirmed, so that the binding performance can be more intuitively confirmed.

Description

Technical Field

[0001] This invention relates to the field of display module technology, and in particular to a method for testing the FOG bonding performance of a module. Background Technology

[0002] The bonding performance of Film On Glass (FOG) modules affects key module parameters such as electrical and optical properties. Currently, the bonding effect of FOG modules is mainly confirmed using AOI equipment, with the number of gold spheres and the bursting effect as the main parameters, supplemented by pull-out force testing. The standard for the number of gold spheres is ≥10, but there is no standard for the opening diameter after a single particle bursts. Current testing methods have the following problems: the Y-axis dimension of the panel bonding area is becoming smaller and smaller, making the ≥10 particle number standard less applicable; the opening diameter after a single particle bursts mainly relies on comparing collected images, lacking a standard for opening diameter, making it difficult to determine the particle bursting effect.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for testing the bonding performance of a module FOG. The method uses a profilometer to collect the profile curves of the panel and ACF (anisotropic conductive film) and the single FPC before pre-pressing and post-pressing of the bonding area. The profile curves are then compared with the profile curves of the FOG bonding area after pre-pressing and post-pressing. If the height change between PADs (pads) meets the specifications, the test is considered OK; otherwise, it is considered NG.

[0005] The technical solution of the present invention is as follows: The present invention provides a module FOG binding performance detection method, including: Step 1: Using a profilometer to identify the contour of the Panel binding area and obtain the first height curve, the identification start area is the center of the left alignment mark of the Panel, and the termination area is the center of the right mark of the Panel; Step 2: Coat the Panel with ACF, use a profilometer to identify the ACF profile, and obtain the second height curve after the ACF is applied to the Panel; Step 3: Use a profilometer to identify the bonding area of ​​the FPC and obtain the third height curve, which includes the height data of the FPC bonding PAD. The second and third height curves are superimposed to obtain the total thickness curve before pre-compression and before main compression. Step 4: After FOG pre-compression and main compression of the module, a profilometer is used to identify the FOG bonding area to obtain the final product thickness curve; Step 5: Calculate the final finished product thickness curve and difference corresponding to the total thickness curve to obtain the thickness difference of each PAD before and after pre-pressing and main pressing, as well as the thickness difference between PADs; Step 6: Based on the thickness difference obtained in Step 5, compare the thickness difference between two adjacent PADs. If the thickness difference between all two adjacent PADs is less than or equal to the preset value, the FOG bonding performance is deemed qualified; otherwise, it is deemed unqualified.

[0006] Furthermore, in step 2, the first height curve is subtracted from the second height curve to obtain the ACF coating thickness parameter. When the thickness difference of the ACF coating on ITO is within 2 μm, the ACF coating is deemed qualified; otherwise, the ACF coating is deemed unqualified.

[0007] Furthermore, in step 3, the thickness of each bonding PAD of the FPC and the thickness difference between bonding PADs are obtained through the third height curve. If the thickness of a bonding PAD or the thickness difference exceeds the predetermined requirements, it is judged as unqualified.

[0008] The beneficial effects of the present invention using the above solution are as follows: it can confirm the bonding effect of PADs and the bonding effect between PADs, enabling more intuitive confirmation of bonding performance, and is suitable for projects with Panel ITO Y-direction length ≤ 0.3mm & particle number < 10; it can detect the flatness of ACF coating, avoiding problems of insufficient or excessive ACF in certain areas, helping to identify defects in advance and improve bonding performance; it can detect the uniformity of copper thickness on the PADs of the FPC incoming material, avoiding reliability problems caused by incomplete filling of the gaps between PADs due to copper thickness being greater than or equal to the thickness of the ACF itself, helping to identify defects in advance and improve bonding performance. Detailed Implementation

[0009] The present invention will be described in detail below with reference to specific embodiments.

[0010] This invention provides a method for detecting the FOG bonding performance of modules, comprising the following steps: Step 1: Use a profilometer to identify the contour of the panel binding area and obtain the first height curve with the height data of ITO, ITO and ITO. The identification start area is the center of the alignment mark on the left side of the panel and the termination area is the center of the mark on the right side of the panel. The identified ITO thickness will be used to calculate the ACF coating effect in the second step.

[0011] Step 2: Coat the panel with ACF and use a profilometer to identify the ACF profile, obtaining a second height curve that includes the height data of the combined panel and ACF. Subtract the first height curve obtained in Step 1 from the second height curve obtained in Step 2 to obtain the ACF coating flatness data. If the thickness difference of the ACF coating on ITO is within 2µm, the ACF coating is considered qualified; otherwise, the ACF coating is considered unqualified.

[0012] Step 3: Use a profilometer to identify the FPC bonding pads and obtain a third height curve including the FPC pad height data. This confirms the copper thickness of each pad on the FPC. If the copper thickness difference between pads is ≤4µm and the maximum copper thickness does not exceed the ACF thickness, the copper thickness is acceptable; otherwise, it is unacceptable. Add the second and third height curves to obtain the total thickness curve of the FPC, ACF, and Panel ITO before pre-pressing and final pressing.

[0013] Step 4: After FOG pre-compression and main compression, use a profilometer to identify the height of the FOG binding area, thereby obtaining the final finished product thickness curve of the Panel ITO, AC and FPC PAD combined together.

[0014] Step 5: Subtract the final finished product thickness curve from the total thickness curve to obtain the thickness difference curves of each PAD before and after pre-pressing and main pressing, and between PADs.

[0015] Step 6: Based on the thickness difference curve obtained in Step 2, compare the thickness difference between two adjacent PADs. The difference must be less than or equal to the sum of the thickness difference between adjacent Panel ITO, the thickness difference between adjacent FPC PAD, and the allowable thickness difference of 2um for ACF coating. Then, add the thickness change before and after ACF pre-compression. For example, if the conventional ACF thickness change is ≤5um, and if the thickness difference between ITO PIN1 and PIN2 before pre-compression is 0.2um, the thickness difference of ACF coating is 0.3um, and the thickness difference of FPC PAD is 2um, then after pre-compression and main compression, if the thickness difference between PIN1 and PIN2 is ≤7.5um (0.2+0.3+2+5), then the bonding is considered good and qualified; otherwise, it is considered unqualified.

[0016] In summary, the beneficial effects of this solution are as follows: it can confirm the bonding effect of PADs and the bonding effect between PADs, providing a more intuitive assessment of bonding performance. It is suitable for projects where the Y-direction length of Panel ITO is ≤0.3mm and the particle count is <10. It can detect the flatness of the ACF coating, avoiding issues of insufficient or excessive ACF in certain areas, helping to identify defects early and improve bonding performance. It can detect the uniformity of copper thickness on the PADs in the FPC incoming material, preventing reliability issues caused by incomplete filling of the gaps between PADs due to copper thickness being greater than or equal to the thickness of the ACF itself, helping to identify defects early and improve bonding performance.

[0017] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for detecting performance of module FOG binding, characterized in that, The method comprises the following steps: step 1: using a profiler to identify the contour of the Panel binding area and obtaining a first height curve, and identifying the starting area as the center of the left alignment mark of the Panel and the ending area as the center of the right mark of the Panel; step 2: coating ACF on the Panel, using a profiler to identify the ACF contour, and obtaining a second height curve after the Panel is provided with ACF; step 3: using a profiler to identify the binding area of the FPC and obtaining a third height curve including the height data of the FPC binding PAD, the second height curve and the third height curve are superposed to obtain the total thickness curve before pre-pressing and pressing; step 4: after pre-pressing and pressing of the mold module, using a profiler to identify the FOG binding area to obtain the final product thickness curve; step 5: calculating the difference between the final product thickness curve corresponding to the total thickness curve and the difference to obtain the thickness difference of each PAD and the thickness difference between the PADs before and after pre-pressing and pressing; step 6: comparing the thickness difference of the adjacent two PADs according to the thickness difference obtained in step 5, if the thickness difference of all adjacent two PADs is less than or equal to the preset value, it is determined that the FOG binding performance is qualified, otherwise it is determined as unqualified.

2. The modular FOG binding performance detection method of claim 1, wherein, In the step 2, the second height curve is subtracted from the first height curve to obtain the ACF coating thickness parameter, when the thickness difference of the ACF coated on the ITO is within 2um, it is determined that the ACF coating is qualified, otherwise it is determined that the ACF coating is unqualified.

3. The modular FOG binding performance detection method according to claim 1 or 2, characterized in that, In the step 3, the thickness of each binding PAD of the FPC and the thickness difference between the binding PADs are obtained through the third height curve, when the thickness of the binding PAD or the thickness difference exceeds the predetermined requirement, it is determined as unqualified.