Chip testing method and chip testing equipment

Abstract

The invention discloses a chip test method and chip test equipment, and relates to the related technical field of chip tests.The chip test equipment comprises an on-off base, connecting columns are connected to the four corners of the lower end of the on-off base, the on-off base is connected with a mounting base through the connecting columns and bolts penetrating through the connecting columns, a chip test base is clamped in the upper end of the on-off base, and the chip test base is connected with the chip test equipment. According to the invention, when the to-be-tested chip is pressed down, the electric connection contacts of the to-be-tested chip are firstly contacted with the upper telescopic pins, the lower telescopic pins are driven by the linkage ejector pins to be automatically connected with the pin seats, and after the test is completed, the to-be-tested chip is automatically connected with the pin seats. The lower telescopic pin is automatically disconnected with the pin seat through the lower telescopic electrode plate, and then the electric connection contact of the chip to be tested is disconnected with the upper telescopic pin, so that the electric connection in the test process is automatically controlled, and the electric spark and the melting damage of the electric connection contact of the chip to be tested caused by large resistance due to direct plugging and unplugging are avoided.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip testing, and particularly relates to a chip testing method and a chip testing device. BACKGROUND

[0002] In the field of chip testing technology, when the conventional testing device establishes electrical connection with the chip to be tested, the electrical connection and disconnection are directly performed between the electrical connection contact at the lower end of the chip to be tested and the testing device, so that the direct electrical connection and disconnection operation is prone to generate electric sparks and contact resistance, which not only may damage the precise electrical connection contact of the chip, but also has certain safety hazards.

[0003] In view of the above problems, the present application provides a chip testing device capable of indirect electrical connection and automatic control of electrical connection and disconnection, so as to solve the above technical problems. SUMMARY

[0004] The present application aims to provide a chip testing method and a chip testing device to solve the problem of direct electrical connection and disconnection between the conventional testing device and the electrical connection contact at the lower end of the chip to be tested, which is prone to generate electric sparks and contact resistance and cause damage to the chip.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a chip testing device, comprising a connection and disconnection base, the lower end of the connection and disconnection base is connected with a connecting column at each corner, and an installation seat is connected through the connecting column and the screw inside the connecting column, the upper end of the connection and disconnection base is internally clamped with a chip testing seat, and the upper end of the chip testing seat is internally clamped with a chip to be tested provided with a plurality of electrical connection contacts at the lower end, the upper end of the chip to be tested is externally sleeved with a limiting gland clamped at the upper end of the chip testing seat, a positioning connection assembly is arranged between the connection and disconnection base and the chip testing seat, and the positioning connection assembly is installed and positioned through positioning connection, a plurality of electrical connection pin assemblies are arranged inside the connection and disconnection base, and the electrical connection pin assemblies are electrically connected with the testing device, a plurality of self-connection and disconnection pin assemblies are arranged inside the chip testing seat, and the self-connection and disconnection pin assemblies automatically control the electrical connection between the chip to be tested and the plurality of electrical connection pin assemblies.

[0006] Preferably, the positioning connection assembly comprises a positioning clamping seat, the connection and disconnection base is connected with a positioning clamping seat at each corner, and the four connecting columns are respectively connected at the lower end of the four positioning clamping seats.

[0007] Preferably, a fixed frame connected outside the chip testing seat is arranged on the upper end of the connection and disconnection base and fixed through a screw, and the four positioning clamping seats are internally clamped with positioning clamping columns connected at the four corners of the lower end of the chip testing seat.

[0008] Preferably, the self-on-off needle assembly comprises a telescopic cavity, a plurality of telescopic cavities are arranged in the chip test seat, and a fixed electrode sheet is clamped at the middle position of the plurality of telescopic cavities.

[0009] Preferably, the upper end of the fixed electrode sheet is connected with an upper telescopic electrode sheet arranged in the telescopic cavity, and the upper end of the upper telescopic electrode sheet is connected with an upper telescopic needle extending to the inside of the upper end of the chip test seat, and the lower end of the upper telescopic needle is connected with a position adjusting sliding groove.

[0010] Preferably, the fixed electrode sheet and the upper telescopic electrode sheet are internally provided with a linkage ejector pin, the lower end of the position adjusting sliding groove penetrates into the linkage ejector pin, and a lower telescopic electrode sheet arranged in the telescopic cavity is connected, the lower telescopic electrode sheet is located at the lower end of the fixed electrode sheet, and the lower end of the lower telescopic electrode sheet is connected with a lower telescopic needle slidingly connected in the inside of the chip test seat.

[0011] Preferably, the electrically connected needle assembly comprises a needle slot, a plurality of needle slots are arranged in the inside of the lower end of the on-off base, and a needle seat is clamped in the inside of the upper end of each of the plurality of needle slots.

[0012] Preferably, the lower end of each of the plurality of needle slots is inserted with an electrically connected sleeve connected with the test wire harness, and the plurality of electrically connected sleeves are respectively sleeved at the lower end of the plurality of needle seats.

[0013] Preferably, the outside of each of the plurality of electrically connected sleeves is sleeved with an insulating sleeve inserted in the inside of the needle slot, and the lower end of each of the plurality of insulating sleeves is wrapped at the outside of the plurality of test wire harnesses.

[0014] A chip test method, the steps are as follows:

[0015] Step one: equipment installation, the on-off base is installed on the upper end of the mounting seat through the connecting column and the bolt, the mounting seat is installed on the test operation table through the bolt, the chip test seat is installed in the inside of the upper end of the on-off base through the positioning connection assembly and the bolt, and the limiting gland is installed on the test lifting mechanism through the bolt;

[0016] Step two: test wire harness connection, according to the position and number of the electrically connected contact points arranged at the lower end of the to-be-tested chip, the test wire harness is connected at the lower end of the electrically connected needle assembly at the corresponding position, and the test wire harness is electrically connected with the test equipment;

[0017] Step three: start detection, the to-be-tested chip is grabbed by the test machine and clamped into the inside of the upper end of the chip test seat, then the limiting gland is clamped to the upper end of the chip test seat by the test lifting mechanism, and the to-be-tested chip is firmly pressed into the inside of the chip test seat for power-on test.

[0018] Compared with the prior art, the chip test method and the chip test equipment have the following beneficial effects:

[0019] 1、The on-off base of the application is installed and positioned through the positioning clamping seat at the four corners and the positioning clamping column at the lower end of the four corners of the chip test seat, and is fixed through the fixed frame and the bolt, so as to ensure the accurate alignment between the self-on-off pin component inside the chip test seat and the electrically connected pin component inside the on-off base, and one-to-one correspondence, providing a basis for subsequent accurate testing and safe on-off.

[0020] 2、When the to-be-tested chip is pressed down, the electrically connected contact of the to-be-tested chip will first contact the upper retractable pin, and the lower retractable pin is connected with the pin seat automatically through the linkage ejector pin, after the test is completed, the lower retractable pin is automatically disconnected with the pin seat through the lower retractable electrode sheet, and the electrically connected contact of the to-be-tested chip is disconnected with the upper retractable pin, so as to automatically control the electrical connection in the test process, avoid the electric spark and large resistance caused by direct plugging, and prevent the electrically connected contact of the to-be-tested chip from melting and damaging.

[0021] 3、The pin seat and the lower retractable pin of the self-on-off pin component are connected, and the selective connection can be made according to the position and number of the electrically connected contact at the lower end of the to-be-tested chip, so that the test wire harness can be flexibly configured according to the position and number of the electrically connected contact of different to-be-tested chips, avoiding power supply to the position where there is no electrically connected contact, so as to ensure the safety and accuracy of the test process. DETAILED DESCRIPTION

[0022] Figure 1 It is a three-dimensional structure schematic diagram of the test equipment of the application.

[0023] Figure 2 It is a connection structure schematic diagram of the electrically connected pin component and the self-on-off pin component of the application.

[0024] Figure 3 It is a structure schematic diagram of the self-on-off pin component of the application.

[0025] Figure 4 It is a Figure 3 enlarged schematic diagram of A in the middle.

[0026] Figure 5 It is a fixed electrode sheet connection structure schematic diagram of the application.

[0027] Figure 6 It is a linkage ejector pin connection structure schematic diagram of the application.

[0028] Figure 7 It is a structure schematic diagram of the electrically connected pin component of the application.

[0029] Figure 8 It is a Figure 7 enlarged schematic diagram of B in the middle.

[0030] In the figure: 1, on-off base; 2, connecting column; 3, mounting seat; 4, chip test seat; 5, chip to be tested; 6, limiting gland; 7, positioning card seat; 8, fixed frame; 9, positioning card column; 10, telescopic cavity; 11, fixed electrode sheet; 12, upper telescopic electrode sheet; 13, upper telescopic needle foot; 14, position adjusting sliding groove; 15, linkage ejector pin; 16, lower telescopic electrode sheet; 17, lower telescopic needle foot; 18, needle foot groove; 19, needle foot seat; 20, electric connection sleeve; 21, insulating sleeve. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0032] The present application provides a kind of chip testing device, including base, and be connected to the base, including the following components: Figures 1-8The chip testing device shown includes an on-off base 1, a connecting column 2 is connected at the lower end of each corner of the on-off base 1, and a mounting seat 3 is connected through the connecting column 2 and the screw inside the connecting column 2, an internal chip testing seat 4 is clamped at the upper end of the on-off base 1, a to-be-tested chip 5 provided with a plurality of electrical contact points at the lower end is clamped at the upper end of the chip testing seat 4, an external limiting gland 6 is clamped at the upper end of the to-be-tested chip 5, a plurality of positioning clamping grooves and a plurality of positioning clamping jaws are arranged between the chip testing seat 4 and the limiting gland 6, and the chip testing seat 4 and the limiting gland 6 are fixed and positioned through clamping between the plurality of positioning grooves and the plurality of positioning clamping jaws, the plurality of positioning clamping grooves are arranged on the outside of the upper side of the chip testing seat 4, the plurality of positioning clamping jaws are connected to the outside of the lower end of the limiting gland 6, a positioning connecting assembly is arranged between the on-off base 1 and the chip testing seat 4, and the on-off base 1 and the chip testing seat 4 are installed and positioned through positioning connection, a plurality of electrical connecting pin assemblies are arranged inside the on-off base 1, and the on-off base 1 is electrically connected with a testing device through the plurality of electrical connecting pin assemblies, a plurality of self-on-off pin assemblies are arranged inside the chip testing seat 4, and the electrical connection between the to-be-tested chip 5 and the plurality of electrical connecting pin assemblies is automatically controlled through the self-on-off pin assemblies, in the process of testing the to-be-tested chip 5, the mounting seat 3 is installed on a testing operation table through a screw, the on-off base 1 and the connecting column 2 are installed on the upper end of the mounting seat 3 through a screw, the test harness is connected between the electrical connecting pin assemblies at the corresponding positions inside the lower end of the on-off base 1 and the testing device according to the positions and the number of the electrical contact points arranged at the lower end of the to-be-tested chip 5, the chip testing seat 4 is installed inside the upper end of the on-off base 1 through the positioning connecting assembly and the screw, and the limiting gland 6 is installed on a testing lifting mechanism through a screw, at this time, the testing machine grasps the to-be-tested chip 5, clamps it inside the upper end of the chip testing seat 4, then the testing lifting mechanism drives the limiting gland 6 to press down the to-be-tested chip 5 and clamp it to the upper end of the chip testing seat 4, and the lower end of the to-be-tested chip 5 is completely pressed to the inside of the upper end of the chip testing seat 4 for power-on testing.

[0033] Further, when the lower end of the to-be-tested chip 5 is completely pressed to the inside of the upper end of the chip testing seat 4, the electrical contact points at the lower end of the to-be-tested chip 5 can be electrically connected with the electrical connecting pin assemblies at the corresponding positions through the self-on-off pin assemblies, and electrically connected with the external testing device through the electrical connecting pin assemblies and the test harness, so as to perform power-on testing.

[0034] Among them, the testing device applies a predetermined electrical signal to the to-be-tested chip 5, and analyzes the response by monitoring the parameter changes such as voltage, current, timing waveform and the like output by the to-be-tested chip 5, so as to judge whether there is a defect and verify whether the performance meets the design standard, the testing lifting mechanism is a hydraulic lifting machine, and the testing device and the testing lifting mechanism are both known existing public technologies, which will not be described in detail here.

[0035] Preferably, the positioning connection assembly includes positioning brackets 7. Positioning brackets 7 are connected to all four corners of the switching base 1, and four connecting posts 2 are respectively connected to the lower ends of the four positioning brackets 7. A fixing frame 8 is provided on the outer side of the upper end of the switching base 1, connected to the outside of the chip test socket 4, and fixed to the fixing frame 8 with bolts. Positioning posts 9 connected to the four corners of the lower end of the chip test socket 4 are snapped into the four positioning brackets 7 inside the four positioning brackets 7. During the installation of the chip test socket 4, the chip test socket 4 is positioned by inserting the positioning posts 9 at the four corners of the lower end into the positioning brackets 7 at the four corners of the switching base 1, and fixed by the fixing frame 8 and bolts. This ensures that the lower end of the chip test socket 4 can be accurately inserted into the upper end of the switching base 1, and that the multiple self-switching pin assemblies inside the lower end of the chip test socket 4 are aligned with the multiple electrical connection pin assemblies inside the switching base 1, ensuring that the self-switching pin assemblies can accurately control the electrical connection between the electrical connection contacts at the lower end of the chip under test 5 and the electrical connection pin assemblies.

[0036] Preferably, the self-connecting pin assembly includes a telescopic cavity 10. Multiple telescopic cavities 10 are formed inside the chip test socket 4, and a fixed electrode plate 11 is engaged at the middle of each telescopic cavity 10. An upper telescopic electrode plate 12 located inside the telescopic cavity 10 is connected to the upper end of the fixed electrode plate 11. An upper telescopic pin 13 extending into the upper part of the chip test socket 4 is connected to the upper end of the upper telescopic electrode plate 12. An adjustment groove 14 is connected to the lower end of the upper telescopic pin 13. A linkage pin 15 is formed inside the fixed electrode plate 11 and the upper telescopic electrode plate 12. The lower end of the adjustment groove 14 passes through the linkage pin 15 and is connected to a lower telescopic electrode plate 16 located inside the telescopic cavity 10. The lower telescopic electrode plate 16 is located below the fixed electrode plate 11, and a lower telescopic pin 17 slidably connected inside the chip test socket 4 is connected to the lower telescopic electrode plate 16. The chip 5 under test is then subjected to pressure by the limiting cover 6. During the pressing process, since the upper end of the upper telescopic pin 13 extends into the chip test socket 4 and slides in connection with the chip test socket 4, and the lower end of the lower telescopic pin 17 retracts into the lower end of the chip test socket 4 and slides in connection with the chip test socket 4, when the chip under test 5 is pressed into the chip test socket 4 by the limiting cover 6, the electrical contact at the lower end of the chip under test 5 will contact the upper telescopic pin 13 at the corresponding position, and squeeze the upper telescopic pin 13 into the chip test socket 4. The upper telescopic pin 13 compresses the upper telescopic electrode plate 12. At the same time, the upper telescopic pin 13 drives the linkage pin 15 to slide downward in the adjustment groove 14, so that the linkage pin 15 drives the lower telescopic electrode plate 16 to slide downward in the telescopic cavity 10. The lower telescopic electrode plate 16 drives the lower telescopic pin 17 to slide downward in the chip test socket 4 and contact the electrical contact pin assembly.

[0037] Furthermore, when the lower end of the chip under test 5 is fully pressed into the upper end of the chip test socket 4, the upper telescopic pin 13 is fully retracted into the chip test socket 4 and tightly adheres to the electrical connection contact at the lower end of the chip under test 5 through the elastic action of the upper telescopic electrode 12. At the same time, the lower telescopic pin 17 is tightly adhered to the electrical connection pin assembly under the squeezing of the linkage pin 15 and the elastic action of the lower telescopic electrode 16, thereby making an electrical connection between the chip under test 5 and the electrical connection pin assembly through the self-connecting pin assembly.

[0038] Furthermore, after the chip under test 5 is tested, the limit cover 6 is separated from the chip test socket 4 by the test lifting mechanism, and the chip under test 5 is picked up by the test machine. At this time, the upper telescopic pin 13 loses the pressure of the chip under test 5 and slides back into the chip test socket 4 under the action of the upper telescopic electrode plate 12. It also drives the linkage pin 15 to slide upward, releasing the pressure on the lower telescopic electrode plate 16. The lower telescopic electrode plate 16 drives the lower telescopic pin 17 to retract into the lower end of the chip test socket 4, disconnecting the electrical connection with the electrical connection pin assembly. Thus, the electrical connection between the chip under test 5 and the electrical connection pin assembly is disconnected by the self-connecting pin assembly.

[0039] Therefore, during the testing phase, the chip under test 5 will first be stably connected to the self-connecting pin assembly inside the chip test socket 4 through the upper telescopic pin 13, and then be stably electrically connected to the electrical connection pin assembly through the self-connecting pin assembly, and electrically connected to the external test equipment through the test harness. Conversely, after the chip under test 5 is tested, the electrical connection between the self-connecting pin assembly and the electrical connection pin assembly will be disconnected first, and then the connection between the chip under test 5 and the self-connecting pin assembly will be disconnected. This ensures the safety of the electrical connection and prevents the electrical connection contacts at the lower end of the chip under test 5 from generating sparks and large resistance during direct electrical connection and disconnection, which could cause the electrical connection contacts to melt and be damaged.

[0040] Preferably, the electrical connection pin assembly includes pin slots 18. The lower end of the switching base 1 has multiple internally connected pin slots 18, and each pin slot 18 has a pin holder 19 snapped into its upper end. Each pin slot 18 has an electrical connection sleeve 20 inserted into its lower end for connection to the test wiring harness. The multiple electrical connection sleeves 20 are respectively fitted onto the lower ends of the multiple pin holders 19. Each electrical connection sleeve 20 has an insulating sleeve 21 inserted into the pin slot 18, and the lower ends of the multiple insulating sleeves 21 respectively wrap around the multiple test wiring harnesses. During the connection of the electrical connection pins to the test wiring harness, the test wiring harness can selectively connect according to the position and number of contacts at the lower end of the chip under test 5, electrically connecting the corresponding electrical connection pin assembly to the test equipment. This avoids energizing positions without electrical connection contacts, ensuring the safety of the electrical connection of the chip under test 5, preventing damage to the chip under test 5, and ensuring the accuracy of the test.

[0041] The electrical connector assembly is electrically connected to the lower telescopic pin 17 via the pin seat 19 and to the test harness via the electrical connector sleeve 20. The electrical connector sleeve 20 and the test harness are externally insulated by the insulating sleeve 21 and are engaged with the pin groove 18 via the insulating sleeve 21 to ensure a stable connection between the pin seat 19 and the electrical connector sleeve 20.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip testing device, comprising an on-off base (1), a connecting column (2) is connected to each of the four corners of the lower end of the on-off base (1), and a mounting seat (3) is connected through the connecting column (2) and a bolt inside the connecting column (2), a chip testing seat (4) is clamped inside the upper end of the on-off base (1), and a chip to be tested (5) provided with a plurality of electrical contact points at the lower end is clamped inside the upper end of the chip testing seat (4), and a limiting gland (6) is sleeved outside the upper end of the chip to be tested (5) and clamped on the upper end of the chip testing seat (4), characterized in that: a positioning and connecting assembly is arranged between the on-off base (1) and the chip testing seat (4), and installation and positioning are carried out through positioning and connecting; a plurality of electrical connecting pin assemblies are arranged inside the on-off base (1), and electrical connection is carried out with the testing device through the plurality of electrical connecting pin assemblies; a plurality of self-on-off pin assemblies are arranged inside the chip testing seat (4), and automatic control is carried out on the electrical connection between the chip to be tested (5) and the plurality of electrical connecting pin assemblies through the self-on-off pin assemblies. The positioning and connecting assembly comprises a positioning clamping seat (7), the on-off base (1) is connected with the positioning clamping seat (7) at each of the four corners, and the four connecting columns (2) are respectively connected to the lower ends of the four positioning clamping seats (7).

2. A chip testing apparatus as claimed in claim 1, characterized in that A fixing frame (8) is arranged outside the chip testing seat (4) on the outer side of the upper end of the on-off base (1) and is fixed through a bolt and the fixing frame (8), and the four positioning clamping seats (7) are clamped with positioning clamping columns (9) connected to the four corners of the lower end of the chip testing seat (4) inside.

3. A chip testing apparatus as claimed in claim 2, characterized in that The self-on-off pin assembly comprises a telescopic cavity (10), a plurality of telescopic cavities (10) are arranged inside the chip testing seat (4), and a fixed electrode sheet (11) is clamped at the middle position of the plurality of telescopic cavities (10).

4. The chip testing apparatus of claim 1, wherein The fixed electrode sheet (11) is connected with an upper telescopic electrode sheet (12) inside the telescopic cavity (10), and the upper telescopic electrode sheet (12) is connected with an upper telescopic pin (13) extending to the inside of the upper end of the chip testing seat (4), and the lower end of the upper telescopic pin (13) is connected with a position adjusting sliding groove (14).

5. A chip testing apparatus as claimed in claim 4, characterized in that The fixed electrode sheet (11) and the upper telescopic electrode sheet (12) are provided with a linkage ejector pin (15) inside, the lower end of the position adjusting sliding groove (14) penetrates inside the linkage ejector pin (15), and a lower telescopic electrode sheet (16) is connected and arranged inside the telescopic cavity (10), the lower telescopic electrode sheet (16) is located at the lower end of the fixed electrode sheet (11), and the lower end of the lower telescopic electrode sheet (16) is connected with a lower telescopic pin (17) slidingly connected inside the chip testing seat (4).

6. A chip testing apparatus as claimed in claim 5, characterized in that The electrical connecting pin assembly comprises a pin slot (18), a plurality of pin slots (18) are arranged inside the lower end of the on-off base (1), and a pin seat (19) is clamped inside the upper end of each of the plurality of pin slots (18).

7. The chip testing apparatus of claim 1, wherein A plurality of electrical connecting clamping sleeves (20) connected with the testing wire harness are inserted inside the lower end of each of the plurality of pin slots (18), and the plurality of electrical connecting clamping sleeves (20) are respectively sleeved outside the lower ends of the plurality of pin seats (19).

8. A chip testing apparatus as claimed in claim 7, characterized in that ​ 9. A chip testing apparatus as claimed in claim 8, characterized in that The multiple electric ferrules (20) are externally sleeved with insulating ferrules (21) which are inserted into the needle slot (18), and the lower ends of the multiple insulating ferrules (21) are respectively wrapped outside the multiple test wire harnesses.

10. A method of testing a chip, applied to the chip testing apparatus according to any one of claims 1 to 9, characterized by, The method comprises the following steps: Step one: equipment installation, install the on-off base (1) on the upper end of the mounting seat (3) through the connecting column (2) and the bolt, install the mounting seat (3) on the test operation table through the bolt, install the chip test seat (4) in the upper end of the on-off base (1) through the positioning connection assembly and the bolt, and install the limiting gland (6) on the test lifting mechanism through the bolt; Step two: test wire harness connection, connect the test wire harness to the lower end of the electric contact pin assembly at the corresponding position according to the position and number of the electric contact pins arranged at the lower end of the chip to be tested (5), and electrically connect the test wire harness with the test equipment; Step three: start detection, grab the chip to be tested (5) by the test machine, and clamp it to the upper end of the chip test seat (4), then drive the limiting gland (6) to clamp to the upper end of the chip test seat (4) through the test lifting mechanism, and firmly press the chip to be tested (5) into the chip test seat (4) for power-on test.

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