Membrane mirror and membrane mirror array

Abstract

The application discloses a MEMS micro-mirror and a MEMS micro-mirror array, and belongs to the technical field of micro-electro-mechanical systems. The MEMS micro-mirror comprises a mirror surface, a driving assembly for driving the mirror surface to move, a regular hexagonal outer frame provided with a cavity for accommodating the mirror surface and used for supporting the driving assembly, and a conductive connecting piece arranged on the regular hexagonal outer frame and electrically connected with the driving assembly, used for receiving an external driving signal and transmitting the driving signal to the driving assembly. The regular hexagonal outer frame is matched with the honeycomb-like dense arrangement to improve wafer utilization, reduce manufacturing cost and mass production risk, the conductive connecting piece on the outer frame is used for conveniently adjusting the number of mirror surfaces in the array, and the overall design does not need to be reconfigured, the driving structure does not need to be redesigned, and the overall design does not need to be changed, so that the production economy, mass production stability and structural adjustment flexibility are considered.

Description

Technical Field

[0001] This invention relates to the field of microelectromechanical systems (MEMS) technology, and more particularly to a MEMS micromirror and a MEMS micromirror array. Background Technology

[0002] Currently, micro-electro-mechanical systems (MEMS) micromirrors are widely used in fields such as lidar, image projection, augmented reality (AR) / virtual reality (VR), and optical communication. MEMS micromirrors are characterized by low cost, high reliability, miniaturization, and fast scanning speed.

[0003] Traditional MEMS micromirror structures often employ square or rectangular designs. When laying them out on a wafer, the spacing between micromirror structures and unused areas at the wafer edges result in low placement efficiency, significant material waste, and high production costs. Furthermore, increasing the number of mirrors in existing micromirror array devices to improve system performance often requires redesigning a larger array structure. This introduces problems such as significant wiring redesign, driver structure redesign, and reduced wafer edge utilization due to the increased mirror count, further increasing R&D iteration costs and mass production risks.

[0004] Therefore, there is an urgent need for a new type of MEMS micromirror and array structure to optimize overall application performance, improve usage limitations, and enhance structural adaptability and adjustment flexibility. Summary of the Invention

[0005] This invention proposes a MEMS micromirror and a MEMS micromirror array. By using a regular hexagonal outer frame and a honeycomb-shaped dense arrangement, the wafer utilization rate is improved, the manufacturing cost and mass production risk are reduced, and the number of mirrors in the array can be easily adjusted by using conductive connectors on the outer frame. This eliminates the need to reconstruct wiring, redesign the drive structure and modify the overall design, effectively solving the problems of existing technologies and taking into account production economy, mass production stability and structural adjustment flexibility.

[0006] Firstly, a MEMS micromirror is provided, comprising: Mirror surface; A driving component for driving the mirror movement; The frame is a regular hexagon, with a cavity for accommodating the mirror and for supporting the drive assembly; A conductive connector is disposed on the regular hexagonal outer frame and electrically connected to the drive assembly, for receiving external drive signals and transmitting the drive signals to the drive assembly.

[0007] Optionally, the conductive connector includes a first pad disposed on the hexagonal frame, one end of the first pad being electrically connected to the driving component, and a through hole being provided on the hexagonal frame corresponding to the position of the first pad. A conductive material is formed in the through hole, one end of the conductive material being electrically connected to the other end of the first pad, and the other end of the conductive material being electrically connected to a control lead. The first pad is used to be electrically connected to an external device through the conductive material in the through hole and the control lead to receive the driving signal.

[0008] Optionally, the conductive connector includes a first pad and at least two second pads disposed on the hexagonal frame. One end of the first pad is electrically connected to the drive component, and the other end of the first pad is electrically connected to a control lead or a cascade lead. One end of each of the at least two second pads is electrically connected, and the other end of each of the at least two second pads is electrically connected to the control lead or the cascade lead. Wherein, the first pad is used to be electrically connected to an external device through the control lead to receive the drive signal, or the first pad is used to be electrically connected to a second pad of an adjacent MEMS micromirror through the cascading lead to realize the cascading between two MEMS micromirrors to receive the drive signal received by the other second pad of the adjacent MEMS micromirror through the control lead.

[0009] Optionally, the mirror surface is circular, elliptical, or polygonal.

[0010] Optionally, the driving component includes: A driving element, disposed around the mirror surface, is used to provide driving force based on the driving signal; A rotating shaft, one end of which is connected to the driving component and the other end of which is connected to the mirror surface, is used to drive the mirror surface to move under the action of the driving force; The electrode is electrically connected to the driving element and the conductive connector, and is used to receive the driving signal and transmit the driving signal to the driving element.

[0011] Optionally, the MEMS micromirror further includes: A rotation angle measuring element is mounted on the rotation axis and is used to measure the torsion or bending angle of the mirror surface.

[0012] Optionally, the MEMS micromirror may further include a mirror support located on the back of the mirror.

[0013] Optionally, the MEMS micromirror further includes: Multiple segmented connectors are disposed on the regular hexagonal outer frame for connection with the regular hexagonal outer frames of other MEMS micromirrors, and each segmented connector has a dicing channel.

[0014] Optionally, the segmented connector has a connecting portion and a segmenting portion, the connecting portion being used to connect with the regular hexagonal outer frame, the thickness of the connecting portion being greater than the thickness of the segmenting portion, and the slicing channel being located on the segmenting portion.

[0015] In a second aspect, a MEMS micromirror array is provided, comprising a plurality of MEMS micromirrors arranged in a honeycomb pattern as described in the first aspect.

[0016] The technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages: This invention provides a MEMS micromirror and MEMS micromirror array. By setting a regular hexagonal frame to form a regular hexagonal micromirror chip, combined with a honeycomb-like dense arrangement, compared with the traditional square or rectangular structure, more micromirror chips can be densely arranged on a single wafer without reducing the size of the mirror surface. This significantly reduces the spacing between micromirrors and the unused area at the wafer edge, significantly improving wafer utilization and layout efficiency, reducing material consumption and lowering the unit chip manufacturing cost, and avoiding the mass production risks caused by the decrease in wafer edge utilization. At the same time, the conductive connectors set on the regular hexagonal frame can form pre-set fixed wiring and a unified external interface. There is no need to change the overall design of the micromirror array due to the increase in the number of mirrors, significantly reconstruct the wiring, and redesign the driving structure. Only the conductive connectors connected to the corresponding micromirrors need to be selected according to the requirements, and the number of mirrors in the array can be easily increased, decreased, and adjusted. This effectively reduces the R&D iteration cost, takes into account the production economy, mass production stability, and structural adjustment flexibility, and solves the problems of low layout efficiency, cumbersome wiring and driving structure reconstruction, and high R&D and mass production risks in the prior art.

[0017] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a schematic diagram of the structure of a MEMS micromirror provided in an embodiment of the present invention; Figure 2 This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention; Figure 3This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention; Figure 4 This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention; Figure 5 This is a partial top view of a MEMS micromirror provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of a MEMS micromirror cascade provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of a MEMS micromirror array provided in an embodiment of the present invention. Detailed Implementation

[0019] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings.

[0020] The accompanying drawings illustrate various structural schematics according to embodiments of the present disclosure. These drawings are not to scale, and some details have been enlarged for clarity, and some details may have been omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate from reality due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed.

[0021] In the context of this disclosure, when a layer / component is referred to as being "above" another layer / component, that layer / component may be directly above the other layer / component, or there may be an intermediate layer / component between them. Additionally, if a layer / component is "above" another layer / component in one orientation, then when the orientation is reversed, that layer / component may be "below" the other layer / component. In the context of this disclosure, similar or identical components may be denoted by the same or similar reference numerals.

[0022] To better understand the above technical solutions, the following will describe the above technical solutions in detail with reference to specific implementation methods. It should be understood that the embodiments of this disclosure and the specific features in the embodiments are detailed descriptions of the technical solutions of this application, rather than limitations on the technical solutions of this application. In the absence of conflict, the embodiments of this application and the technical features in the embodiments can be combined with each other.

[0023] Figure 1 This is a schematic diagram of the structure of a MEMS micromirror provided in an embodiment of the present invention, as shown below. Figure 1 As shown, each MEMS micromirror 10 includes a mirror 11, a driving assembly 12, a regular hexagonal frame 13, and a conductive connector 14.

[0024] The drive assembly 12 is used to drive the mirror 11 to move. The regular hexagonal frame 13 has a cavity for accommodating the mirror 11 and for supporting the drive assembly 12. The conductive connector 14 is disposed on the regular hexagonal frame 13, electrically connected to the drive assembly 12, for receiving external drive signals and transmitting drive signals to the drive assembly 12.

[0025] The hexagonal frame 13 is structurally designed to match the functional partitioning of the die, and its overall outline corresponds to the hexagonal die shape of the MEMS micromirror chip. The mirror 11 is the core component of the MEMS micromirror, typically made of metal or optical glass. Its main function is to reflect light, controlling the optical path and imaging the sample by rotating or oscillating at different angles. The hexagonal frame 13 is a structural component that supports and protects the mirror 11 and the drive assembly 12. It ensures that the mirror 11 can rotate or oscillate stably under the action of the drive assembly 12, while preventing damage to the mirror 11 and the drive assembly 12 from the external environment.

[0026] The conductive connector 14 is disposed on the regular hexagonal outer frame 13. It plays a core role in electrical connection and signal transmission, forming a stable electrical connection with the drive component 12. It can receive external drive signals (such as drive current or drive voltage) and efficiently transmit the drive signals to the drive component 12, providing a power signal guarantee for the movement of the micromirrors. It can also serve as a pre-set unified external interface, forming a fixed wiring channel. There is no need to reconstruct the wiring due to the adjustment of the number of mirrors in the array. At the same time, its layout is adapted to the structural characteristics of the regular hexagonal outer frame 13, without affecting the dense arrangement of micromirrors, and taking into account both signal transmission stability and structural adaptability.

[0027] Figure 2 This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention, as shown below. Figure 2 As shown, the regular hexagonal frame 13 includes a frame body 131 and a thickened layer 132. The frame body 131 has a supporting surface S1 and a bottom surface S2. The driving component 12 is located on the supporting surface S1, and the thickened layer 132 protrudes from the bottom surface S2. By setting the thickened layer, the regular hexagonal frame with the thickened layer area can be clamped by the process equipment during the transfer process, realizing automated transfer of the micromirror without manual transfer. This not only improves the product yield of MEMS micromirrors during the fabrication process and reduces damage to the mirror surface, but also reduces labor costs and improves production efficiency, thereby realizing the mass automated production of MEMS micromirrors.

[0028] Optionally, the mirror 11 can be circular, elliptical, or polygonal. Since the overall shape of the micromirror is mainly determined by the shape of the outer frame, the mirror in this embodiment can be set to any shape as needed, and the cavity on the frame for accommodating the mirror can also match the shape of the mirror. This invention does not limit this.

[0029] For example, the mirror 11 is elliptical to facilitate angle adjustment. The major axis of the elliptical mirror ranges from 2-20mm, and the minor axis diameter ranges from 1-15mm to facilitate angle adjustment. In actual products, the size and shape of the mirror can also be flexibly set according to the application scenario requirements, and this invention does not limit this.

[0030] Optionally, such as Figure 1 and Figure 2 As shown, the drive assembly 12 includes a drive element 121, a rotating shaft 122, and an electrode 123. The drive element 121 is arranged around the mirror surface 11 and is used to provide driving force based on a drive signal. One end of the rotating shaft 122 is connected to the regular hexagonal outer frame 13, and the other end is connected to the mirror surface 11, for driving the mirror surface 11 to move under the action of the driving force. The electrode 123 is electrically connected to the drive element 121 and the conductive connector 14, for receiving the drive signal and transmitting the drive signal to the drive element.

[0031] It should be noted that in the actual product, the drive component 121 may be partially located on the back of the mirror 11 to optimize the overall structural layout and reduce the horizontal space occupied. It is positioned and supported by the rotating shaft 122 and moves synchronously with the rotating shaft 122. One end of the rotating shaft 122 is connected to the regular hexagonal outer frame 13 by a torsion beam or hinge, so that the rotating shaft can be twisted, bent or translated under the driving force provided by the drive component 121, thereby driving the mirror 11 to achieve reciprocating or unidirectional movement within a certain range to meet the accuracy requirements of optical path control.

[0032] In this embodiment, depending on the driving principle, the driving component can employ common MEMS driving structures such as electrostatic combs, electromagnetic coils, or piezoelectric sheets. The driving method can be electrostatic driving, electromagnetic driving, piezoelectric driving, or thermal driving. Electromagnetic driving devices require the introduction of current into the driving device, utilizing the interaction between the applied magnetic field and the current to generate force or torque, thereby driving the mirror surface to move. Electrostatic driving devices utilize the Coulomb attraction between opposite charges to drive the mirror surface. Electrothermal and piezoelectric driving devices respectively utilize the mechanical deformation generated by the thermal expansion of materials and the piezoelectric effect to drive the mirror surface.

[0033] Optionally, the MEMS micromirror 10 also includes a rotation angle measuring device (not shown in the figure). The rotation angle measuring device is mounted on the rotation shaft 122 and is used to measure the torsional or bending angle of the mirror surface 11. The drive unit 121 can be connected to the rotation angle measuring device, and use the actual torsional or bending angle of the mirror surface 11 measured by the rotation angle measuring device as feedback to drive the mirror surface to move to a set angle, thereby improving the driving accuracy.

[0034] Optional, such as Figure 1As shown, the MEMS micromirror 10 also includes multiple dividing connectors 15 disposed on the hexagonal outer frame 13 for connection with the regular hexagonal outer frames of other MEMS micromirrors. Each dividing connector 15 has a dicing channel P. By providing multiple dividing connectors 15, it is convenient to divide multiple MEMS micromirrors along the dicing channel using laser or mechanical methods, enabling chip separation by automated mechanical equipment without the need for manual chip division. This also helps improve the structural stability between the micromirrors.

[0035] Optional, such as Figure 2 As shown, the dividing connector 15 has a connecting portion 151 and a dividing portion 152. The connecting portion 151 is used to connect with the regular hexagonal outer frame 13. The thickness of the connecting portion 151 is greater than the thickness of the dividing portion 152. The slicing channel P is located on the dividing portion 152. In other implementations of this embodiment, the dividing connector 15 may also have other shapes, and the present invention does not limit this.

[0036] It should be noted that in actual products, the above-mentioned dividing connector 15 may not be set. Instead, a dicing channel P is reserved between the regular hexagonal frames of adjacent MEMS micromirrors. The width of the dicing channel P can be set according to the dicing process requirements, which can also meet the requirements of laser or mechanical dicing to separate chips. The specific setting method can be flexibly adjusted according to the actual mass production requirements.

[0037] Optionally, such as Figure 2 As shown, the MEMS micromirror 10 also includes a mirror support 16 located on the back of the mirror 11 for supporting the mirror 11.

[0038] For example, the mirror support 16 is a patterned structure on the back side of the mirror 11, which can be fabricated from an SOI wafer. The mirror support 16 can move with the mirror 11.

[0039] Optionally, the hexagonal outer frame 13, multiple segmented connectors 15, and mirror support 16 of the MEMS micromirror 10 can all be formed by etching silicon-on-insulator (SOI) wafers.

[0040] Optionally, such as Figure 2 As shown, the support surface S1 of the regular hexagonal frame 13 for supporting the drive assembly 12 has a dielectric layer 17. The dielectric layer 17 can be an insulating layer, located between the regular hexagonal frame 13 and the drive assembly 12 to provide insulation.

[0041] In some embodiments, a functional area is defined within the regular hexagonal frame 13, which is generally defined by the diameter D of the inscribed circle of the regular hexagon, and a connection area (the area where the conductive connector 14 is located) is arranged around the functional area. The mirror 11 and the drive assembly 12 are both integrated within the functional area, and the mirror 11 is connected to the drive component of the drive assembly 12 via a rotation shaft. The electrodes 123 of the drive assembly 12 are also synchronously arranged within the functional area and electrically connected to the drive component 121, ensuring a compact layout and stable operation of the core functional structure. The conductive connector 14 is correspondingly arranged within the connection area outside the functional area, specifically in the edge region of the regular hexagonal frame 13.

[0042] The above configuration allows the core structures such as the mirror 11 and drive component 12 within the functional area to maintain layout integrity and operational independence, avoiding interference with external interconnection structures. The conductive connector 14 outside the functional area is electrically connected to the electrodes of the drive component 12 through a standardized interface. This not only enables stable reception of external drive signals and transmission to the drive component 12, but also avoids interference from the wiring and connection structure of the conductive connector 14 on the optical performance of the mirror 11 (such as reflection accuracy and optical path integrity) and the drive force output and flexible movement of the rotation axis of the drive component 12 through physical partitioning and isolation. At the same time, it conforms to the design principle of defining the functional area envelope of the regular hexagonal grain and keeping the core structure unchanged, laying the foundation for the subsequent splicing of multiple grains in a honeycomb manner to form an array module.

[0043] In some embodiments, such as Figure 1 As shown, the conductive connector 14 includes a first pad 141 disposed on a hexagonal outer frame 13, one end of which is electrically connected to the drive assembly 12 (not shown in the figure).

[0044] Figure 3 This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention, combined with... Figure 3 A through-hole 13a is provided on the regular hexagonal outer frame 13 at the position corresponding to the first pad 141. A conductive material is formed in the through-hole 13a. One end of the conductive material is electrically connected to the other end of the first pad 141, and the other end of the conductive material is electrically connected to the control lead P1. The first pad 141 is used to electrically connect to an external device through the conductive material in the through-hole 13a and the control lead P1 to receive drive signals.

[0045] For example, one end of the first pad 141 is electrically connected to the electrode 123 of the drive assembly 12 via a metal trace. The via 13a can be a through-silicon via (TSV), and the via 13a is filled with a conductive material such as copper, tungsten, or doped polysilicon. One end of the conductive material makes ohmic contact with the other end of the first pad 141, and the other end extends to the bottom surface S2 of the regular hexagonal frame 13 and is electrically connected to the control lead P1 of the bottom surface S2 of the regular hexagonal frame 13.

[0046] In this implementation, the first pad 141 serves as the connection structure between the front functional area and the through-silicon via (TSV). It can be connected to external devices via the bottom control lead P1, transmitting the drive signals required by the drive assembly 12 through the bottom control lead P1, conductive material, and the first pad 141. This design avoids the front leads obstructing the optical area of ​​the mirror 11, while utilizing the vertical conductivity of the TSV to reduce the footprint of the interconnect structure, thus adapting to the compact layout requirements of the hexagonal frame.

[0047] In other embodiments, such as Figure 1 As shown, the conductive connector 14 includes a first pad 141 and at least two second pads 142 disposed on a hexagonal frame 13. One end of the first pad 141 is electrically connected to the drive assembly 12 (not shown in the figure).

[0048] Figure 4 This is a partial cross-sectional schematic diagram of a MEMS micromirror provided in an embodiment of the present invention. Figure 5 This is a partial top view of a MEMS micromirror provided in an embodiment of the present invention, combined with... Figure 4 and Figure 5 As shown, the other end of the first pad 141 is electrically connected to the control lead P1 or the cascade lead P2, one end of at least two second pads 142 is electrically connected through the same preset fixed lead, and the other end of at least two second pads 142 is electrically connected to the control lead P1 or the cascade lead P2.

[0049] Among them, such as Figure 5 As shown, the first pad 141 is used for electrical connection to an external device via control lead P1 to receive drive signals. Alternatively, as... Figure 4 As shown, the first pad 141 is used to be electrically connected to a second pad 142 of an adjacent MEMS micromirror via a cascaded lead P2, thereby realizing the cascading between the two MEMS micromirrors. This allows the first pad 141 to receive the drive signal received by the other second pad 142 of the adjacent MEMS micromirror (i.e., another second pad 142 connected to the aforementioned second pad 142 of the adjacent MEMS micromirror via a pre-set fixed lead) via the control lead P1.

[0050] It should be noted that, Figure 5 The 20 second pads 142 shown, and the 10 pre-set fixed leads connecting each pair of second pads 142, are for illustrative purposes only. In actual applications, the number of second pads 142 and the number of pre-set leads connecting the second pads 142 can vary, and the arrangement of the second pads 142 and the pre-set fixed leads can also be flexibly changed according to the application scenario, as long as their number and arrangement do not affect the core function of the micromirror.

[0051] For example, one end of the first pad 141 is electrically connected to the electrode 123 of the drive assembly 12 via a metal trace, and the other end can be selectively connected to a control lead or a cascaded lead. Figure 4 As shown, Figure 4 At least two second pads 142 of the MEMS micromirror 2 are electrically connected at one end via pre-installed fixed leads inside the hexagonal outer frame 13. The other ends of the at least two second pads 142 are electrically connected to a control lead P1 and a cascaded lead P2, respectively. The control lead P1 is used to receive external drive signals, while the cascaded lead P2 is used to establish a connection with the first pad 141 of the adjacent micromirror. At this time, the drive signal of the MEMS micromirror 1 can be received by another second pad 142 of the adjacent MEMS micromirror 2 through the control lead P1, and then transmitted to the first pad 141 of the MEMS micromirror 1 via the second pad 142 connected by the pre-installed fixed leads inside and the cascaded lead P2.

[0052] Since actual products typically require the formation of a MEMS array consisting of multiple MEMS micromirrors arranged in a honeycomb pattern, the first pad 141 of the MEMS micromirror located at the edge of the array can be directly connected to the control lead P1, establishing an electrical connection with the external device through the control lead P1. In this case, the drive signal output by the external device can be transmitted sequentially through the control lead P1, the first pad 141, and the electrode 123 to the drive assembly 12, achieving independent driving of a single MEMS micromirror.

[0053] However, for MEMS micromirrors located in the middle of the array, if the control lead P1 is directly led out for it, the trace needs to be extended from the middle to the edge of the array. This will not only lead to a significant increase in the length of the control lead, but also interfere with the functional area layout of adjacent micromirrors due to issues such as trace crossing and space occupation, thus reducing the overall reliability of the array.

[0054] Therefore, the first pad 141 of the MEMS micromirror located in the middle can be electrically connected to the second pad 142 of the adjacent MEMS micromirror via a cascaded lead P2. Then, the second pad 142 of the adjacent micromirror is connected to another second pad 142 of the micromirror via a pre-installed fixed lead inside. Finally, it is connected to an external device via the control lead P1 of the second pad 142 (extending to the edge of the array). Through this cascaded link of the middle micromirror, adjacent micromirrors, and edge micromirrors, the drive signal can be input from the control lead P1 of the edge micromirror, transmitted through the second pad 142, the fixed trace, and the cascaded lead P2, to the first pad 141 of the middle micromirror, and finally transmitted to its drive assembly 12.

[0055] Furthermore, this cascaded solution can also achieve synchronous or collaborative driving of multiple micromirrors. By simply connecting the first pads 141 of multiple MEMS micromirrors to the same set of second pads 142 (sharing the control lead P1 of the edge micromirrors) through the cascaded lead P2, the same driving signal output by the external device can be synchronously transmitted to these cascaded micromirrors, realizing synchronous angle adjustment or collaborative scanning of multiple micromirrors.

[0056] Figure 6 This is a schematic diagram of a MEMS micromirror cascade provided in an embodiment of the present invention, as shown below. Figure 6 As shown, for the micromirror MEMS1 located in the middle, its first pad pin11 is connected to the second pad pin22 of micromirror MEMS2, the second pad pin32 of micromirror MEMS3, the second pad pin42 of micromirror MEMS4, and the second pad pin52 of micromirror MEMS5 through cascaded leads P2, and finally connected to the control lead P11 through the second pad pin52 of micromirror MEMS5.

[0057] For the micromirror MEMS2 located in the middle, its first pad pin 21 is connected to the second pad pin 33 of micromirror MEMS3, the second pad pin 43 of micromirror MEMS4, and the second pad pin 53 of micromirror MEMS5 through cascaded leads P2, and finally connected to the control lead P12 through the second pad pin 53 of micromirror MEMS5.

[0058] For the micromirror MEMS4, its first pad pin41 is connected to the second pad pin62 of the micromirror MEMS6 via cascaded leads P2, and finally connected to the control lead P13 via the second pad pin62 of the micromirror MEMS6.

[0059] By cascading the first and second pads of each micromirror, the external wiring of the honeycomb MEMS array can be greatly simplified. There is no need to bring out control leads for each MEMS micromirror separately. Only a few second pads need to be set in the MEMS micromirrors at the edge of the array to connect each control lead P1, which can realize the signal transmission of the large-scale array. This reduces the space occupied by the leads, reduces the wiring complexity and packaging cost of the array, and improves the consistency of signal transmission.

[0060] It should be noted that in actual products, electrode 123 and the first pad 141 can be structurally merged according to process requirements, eliminating the need for separate electrode and pad structures. The drive signal can directly enter the device from the pad and be transmitted directly to the drive component 121 through the core wiring, simplifying the overall structural design and process steps, and reducing process complexity. This merged design is suitable for the compact layout of the regular hexagonal frame, while not affecting the stability of signal transmission, further improving the integration and mass production feasibility of the micromirror array.

[0061] The MEMS micromirrors provided in this invention can be applied in fields such as radar, image projection, augmented reality (AR) / virtual reality (VR) and optical communication.

[0062] Based on the same inventive concept, this embodiment of the invention also provides a MEMS micromirror array, comprising a plurality of MEMS micromirrors arranged in a honeycomb pattern as described in the above embodiments. Figure 7 This is a schematic diagram of a MEMS micromirror array provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the multiple MEMS micromirrors 10 are hexagonal in shape and arranged in a honeycomb pattern. The specific structure of the multiple MEMS micromirrors 10 can be found in the relevant description of the above embodiments, and will not be repeated here.

[0063] This MEMS micromirror array boasts high design flexibility, allowing the number of mirrors within the array to be freely increased or decreased by cutting scribe channels P at different positions. This eliminates the need to redesign the internal wiring structure, driving structure, and frame adaptation of the micromirror array device, effectively avoiding the drawbacks of traditional arrays requiring overall redesign for size adjustments, and significantly reducing R&D and mass production iteration costs. Furthermore, even after increasing or decreasing the number of mirrors, the array can still utilize the aforementioned vertical interconnection method of through-silicon vias + back-side wiring, or the horizontal cascading method of first and second pads with cascaded leads. This ensures that each mirror can achieve independent drive signal transmission and precise control, balancing the flexibility of the array structure with the independence of individual micromirror control, adapting to array size and functional requirements in different scenarios.

[0064] The technical solutions described in the embodiments of this application have at least the following technical effects or advantages: This invention provides a MEMS micromirror and MEMS micromirror array. By setting a regular hexagonal frame to form a regular hexagonal micromirror chip, combined with a honeycomb-like dense arrangement, compared with the traditional square or rectangular structure, more micromirror chips can be densely arranged on a single wafer without reducing the size of the mirror surface. This significantly reduces the spacing between micromirrors and the unused area at the wafer edge, significantly improving wafer utilization and layout efficiency, reducing material consumption and lowering the unit chip manufacturing cost, and avoiding the mass production risks caused by the decrease in wafer edge utilization. At the same time, the conductive connectors set on the regular hexagonal frame can form pre-set fixed wiring and a unified external interface. There is no need to change the overall design of the micromirror array due to the increase in the number of mirrors, significantly reconstruct the wiring, and redesign the driving structure. Only the conductive connectors connected to the corresponding micromirrors need to be selected according to the requirements, and the number of mirrors in the array can be easily increased, decreased, and adjusted. This effectively reduces the R&D iteration cost, takes into account the production economy, mass production stability, and structural adjustment flexibility, and solves the problems of low layout efficiency, cumbersome wiring and driving structure reconstruction, and high R&D and mass production risks in the prior art.

[0065] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0066] Similarly, it should be understood that, in order to simplify this disclosure and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this method of disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0067] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in a claim. The word "a" or "an" preceding a component does not exclude the presence of a plurality of such components. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A MEMS micromirror, characterized in that, include: Mirror surface; A driving component for driving the mirror movement; The frame is a regular hexagon, with a cavity for accommodating the mirror and for supporting the drive assembly; A conductive connector is disposed on the regular hexagonal outer frame and electrically connected to the drive assembly, for receiving external drive signals and transmitting the drive signals to the drive assembly; The conductive connector includes a first pad and at least two second pads disposed on the hexagonal outer frame. One end of the first pad is electrically connected to the drive component, and the other end of the first pad is electrically connected to a control lead or a cascade lead. One end of each of the at least two second pads is electrically connected, and the other end of each of the at least two second pads is electrically connected to the control lead or the cascade lead. Wherein, the first pad is used to be electrically connected to an external device through the control lead to receive the drive signal, or the first pad is used to be electrically connected to a second pad of an adjacent MEMS micromirror through the cascading lead to realize the cascading between two MEMS micromirrors to receive the drive signal received by the other second pad of the adjacent MEMS micromirror through the control lead.

2. The MEMS micromirror according to claim 1, characterized in that, The conductive connector includes a first pad disposed on the hexagonal outer frame. One end of the first pad is electrically connected to the driving component. A through-hole is provided on the hexagonal outer frame corresponding to the position of the first pad. A conductive material is formed in the through-hole. One end of the conductive material is electrically connected to the other end of the first pad, and the other end of the conductive material is electrically connected to a control lead. The first pad is used to electrically connect to an external device through the conductive material in the through-hole and the control lead to receive the driving signal.

3. The MEMS micromirror according to claim 1, characterized in that, The mirror surface can be circular, elliptical, or polygonal.

4. The MEMS micromirror according to claim 1, characterized in that, The driving component includes: A driving element, disposed around the mirror surface, is used to provide driving force based on the driving signal; A rotating shaft, one end of which is connected to the regular hexagonal outer frame and the other end of which is connected to the mirror surface, is used to drive the mirror surface to move under the action of the driving force; The electrode is electrically connected to the driving element and the conductive connector, and is used to receive the driving signal and transmit the driving signal to the driving element.

5. The MEMS micromirror according to claim 4, characterized in that, The MEMS micromirror also includes: A rotation angle measuring element is mounted on the rotation axis and is used to measure the torsion or bending angle of the mirror surface.

6. The MEMS micromirror according to claim 1, characterized in that, The MEMS micromirror also includes a mirror support located on the back of the mirror surface.

7. The MEMS micromirror according to claim 1, characterized in that, The MEMS micromirror also includes: Multiple segmented connectors are disposed on the regular hexagonal outer frame for connection with the regular hexagonal outer frames of other MEMS micromirrors, and each segmented connector has a dicing channel.

8. The MEMS micromirror according to claim 7, characterized in that, The segmented connector has a connecting part and a segmenting part. The connecting part is used to connect with the regular hexagonal outer frame. The thickness of the connecting part is greater than the thickness of the segmenting part. The slicing channel is located on the segmenting part.

9. A MEMS micromirror array, characterized in that, It includes a plurality of MEMS micromirrors arranged in a honeycomb pattern as described in any one of claims 1 to 8.

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