Artificial Environmentally Friendly Zero-Crystallization Silica Stone Heat Transfer Process and Manufacturing Equipment

Abstract

This invention relates to the field of artificial stone surface processing technology, specifically to a heat transfer process and manufacturing equipment for artificial environmentally friendly zero-crystallization silica quartz stone. The manufacturing equipment includes a machine base, linear guide rails, and a support slide. A cleaning station and a heat transfer station are sequentially arranged along the feed direction. The cleaning station is equipped with a visual scanning unit and a high-frequency ultrasonic adsorption cleaning unit. The heat transfer station is equipped with an infrared preheater, a hot-pressing transfer head, a slab clamping unit, and a thermal management unit. The slab clamping unit employs multiple independent clamping modules integrating piezoelectric ceramic micro-motion parts, providing macroscopic clamping and high-frequency micro-amplitude anti-slip vibration. The thermal management unit cools the back of the slab through an active cooling channel inside the support platform and coordinates the control of each unit through a central controller, achieving intelligent cleaning, dynamic slip suppression, and precise control of the gradient temperature field, effectively improving the pattern accuracy, adhesion quality, and yield of heat transfer on high-end quartz stone slabs.

Description

Technical Field

[0001] This invention relates to the field of artificial stone surface processing technology, specifically to the heat transfer process and manufacturing equipment for artificial environmentally friendly zero-crystallization silica quartz stone. Background Technology

[0002] Artificial quartz stone, a high-performance composite material made from quartz crystal particles, resin, and pigments through vacuum vibration pressing, is widely used in kitchen countertops, laboratory countertops, wall decorations, and furniture finishes due to its excellent properties such as hardness, wear resistance, corrosion resistance, rich colors, and non-radioactivity. Heat transfer printing technology is a key surface processing technique for giving artificial quartz stone slabs complex wood grain, stone grain, patterns, or personalized decorative effects. It uses a transfer film with ink to precisely and firmly transfer the pattern onto the slab surface under heat and pressure.

[0003] With the market's increasing demands for decorative effects and environmental performance, a new generation of "artificial environmentally friendly zero-crystallization silica quartz stone" slabs has emerged. These slabs, through improved formulations and processes, significantly reduce the risk of crystalline silica precipitation that may exist in traditional quartz stone, while also possessing higher density and surface smoothness. However, this improvement in material performance also presents more stringent technical challenges to the heat transfer printing process. Existing conventional heat transfer equipment and processes exhibit the following prominent defects when processing such high-end slabs:

[0004] 1. Incomplete surface pretreatment affects the integrity of the transfer: The surface of zero-crystallinity silicon substrates is extremely dense and smooth, and microscopic dust, oil films, and other contaminants adhere firmly. Existing equipment mostly uses high-pressure air blowing or ordinary brush rolling for cleaning, which is difficult to completely remove submicron-level dust, especially the micro-dust adsorbed by electrostatics on the substrate. Incomplete cleaning directly leads to microscopic isolation points between the transfer film and the substrate surface, causing localized missing transfer patterns, reduced adhesion, and defects such as "white spots" or "virtual prints".

[0005] 2. Difficulty in suppressing micro-slippage of the sheet material during hot pressing: When the heat transfer head applies high temperature (usually exceeding 150℃) and pressure to a localized area of ​​the sheet material, the sheet material expands unevenly due to heating, generating complex micro-stress between it and the supporting platform below. Existing equipment generally uses four-sided mechanical pressure plates or vacuum adsorption for fixation, but the static friction provided by these methods is insufficient to completely offset this heat-induced shear stress, resulting in micro-slippage of tens to hundreds of micrometers that is imperceptible to the naked eye during production. This cumulative slippage effect directly causes serious precision problems such as misalignment of continuous patterns, ghosting of lines, and misregistration, which is a fatal flaw for the transfer of large-size, high-precision patterns.

[0006] 3. Inadequate control of thermal stress deformation caused by single-sided heating: The essence of heat transfer printing is localized, instantaneous heating of the upper surface of the substrate. The strong temperature gradient causes the upper surface of the substrate to expand rapidly, while the temperature change on the lower surface and inside lags behind. The resulting enormous thermal stress easily leads to warping, torsional deformation, and even the formation of microcracks within the substrate. Existing technologies mainly mitigate this by optimizing the heating curve, using insulation pads, or implementing limited thermal balance design on the worktable. However, these are all passive or localized adjustment methods and cannot actively and precisely control the temperature field distribution along the thickness direction of the substrate. For substrates with low porosity and high elastic modulus, such as zero-crystallinity silicon, the problem of thermal stress deformation is particularly sensitive, severely affecting product flatness and yield.

[0007] Therefore, existing heat transfer equipment has technical shortcomings in the three key aspects of cleaning, positioning and clamping, and thermal management. Furthermore, each aspect often operates independently, lacking systematic coordination, making it difficult to meet the extremely high requirements of "zero-defect" transfer for high-end environmentally friendly quartz stone slabs. Therefore, there is an urgent need to develop an integrated manufacturing equipment and process that can achieve intelligent surface treatment, dynamic anti-slip clamping, and active gradient thermal management in synergy to overcome the aforementioned technical bottlenecks. Summary of the Invention

[0008] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to provide a synthetic environmentally friendly zero-crystallization silica quartz heat transfer process and its manufacturing equipment that integrates intelligent cleaning, dynamic anti-slip clamping and gradient thermal management.

[0009] To achieve the above objectives, the technical solution adopted by this invention is as follows: A synthetic environmentally friendly zero-crystallization silica quartz hot transfer printing manufacturing equipment includes a machine base, on which a linear guide rail is mounted, and a load-bearing slide is slidably connected to the linear guide rail. Cleaning stations and hot transfer printing stations are linearly arranged sequentially along the linear guide rail in the material feeding direction. The manufacturing equipment also includes:

[0010] A cleaning module, located at the cleaning station, includes a visual scanning unit and a high-frequency ultrasonic adsorption cleaning unit; the high-frequency ultrasonic adsorption cleaning unit includes a movable cleaning head, which integrates a piezoelectric ceramic vibrator that generates ultrasonic vibrations and a microporous ceramic plate with a negative pressure adsorption channel.

[0011] A heat transfer module, located at the heat transfer station, includes an infrared preheater, a hot press transfer head, a sheet clamping unit, and a thermal management unit. The sheet clamping unit includes a drive frame and at least two independent clamping modules. Each independent clamping module includes a servo drive unit, a piezoelectric ceramic micro-motion unit, and a pressure foot, which are coaxially and rigidly connected from top to bottom. The thermal management unit includes an active cooling channel located inside the heat transfer station's support platform to control the thermal deformation of the sheet.

[0012] The central controller is signal-connected to the visual scanning unit, the high-frequency ultrasonic adsorption cleaning unit, the infrared preheater, the hot pressing head, the plate clamping unit, and the thermal management unit, and is configured to perform coordinated control.

[0013] Furthermore, the collaborative control includes planning and controlling the movement path and cleaning parameters of the cleaning head based on the recognition results of the visual scanning unit; during the hot pressing transfer process, controlling at least one of the piezoelectric ceramic micro-movement parts to generate high-frequency micro-amplitude vibrations to suppress plate slippage based on the pressure feedback signal from the presser foot and / or a preset anti-slip program; and collaboratively controlling the preheating power of the infrared preheater, the heating temperature and pressure of the hot pressing transfer head, and the cooling medium parameters flowing through the cooling channel to form and maintain a preset temperature gradient field in the thickness direction of the plate.

[0014] Furthermore, the high-frequency ultrasonic adsorption cleaning unit also includes a multi-dimensional drive mechanism for driving the movement of the cleaning head; the multi-dimensional drive mechanism includes support frames symmetrically mounted on the machine base, crossbeams connected to the top of the two support frames, a lead screw mounted on the crossbeam and driven by a drive motor, a slider threaded to the lead screw and sliding along the crossbeam, and a drive cylinder mounted on the slider; the piston rod end of the drive cylinder is connected to the cleaning head, and the cleaning head is driven to move in the horizontal and vertical directions through the cooperation of the drive motor and the drive cylinder.

[0015] Furthermore, the working surface where the microporous ceramic plate contacts the substrate is a flexible surface or is covered with a flexible layer.

[0016] Furthermore, the visual scanning unit is a visual sensor installed above the cleaning station to identify the dust distribution on the surface of the quartz slab; the central controller plans the cleaning path of the high-frequency ultrasonic adsorption cleaning unit based on the identification results of the visual scanning unit.

[0017] Furthermore, the bottom surface of the presser foot is provided with anti-slip texture or anti-slip pad, and a pressure sensor is embedded therein.

[0018] Furthermore, the cooling channel is connected to an external cooling system via a rotary joint, which is used to actively cool the back of the quartz slab during the heat transfer process.

[0019] Furthermore, a displacement sensor is also provided on the heat transfer station to monitor the positional changes of the upper surface of the quartz slab in real time during the heat transfer process; the central controller is further configured to dynamically adjust the downward pressure of the servo drive unit or the vibration parameters of the piezoelectric ceramic micro-motion unit according to the monitoring signal of the displacement sensor.

[0020] The artificial environmentally friendly zero-crystal silica quartz heat transfer process, utilizing the aforementioned artificial environmentally friendly zero-crystal silica quartz heat transfer manufacturing equipment, includes the following steps:

[0021] S1. Visual-guided cleaning: The visual scanning unit identifies the distribution of contaminants on the surface of the board, plans the cleaning path, and drives the cleaning head, which integrates an ultrasonic vibration generator and a negative pressure adsorption channel, to clean the surface of the board.

[0022] S2. Preheating and Dynamic Anti-slip Clamping: The cleaned sheet material is preheated using an infrared preheater; the sheet material is pressed onto the support platform by multiple independent pressing modules; during the subsequent hot pressing transfer process, the piezoelectric ceramic micro-motion part is selectively activated to generate high-frequency micro-amplitude vibration according to real-time process parameters to suppress sheet material slippage.

[0023] S3, Gradient thermal transfer: While the hot press head locally heats and pressurizes the board, the back of the board is actively cooled through the cooling channel of the thermal management unit, so that the board forms and maintains a predetermined temperature gradient in the thickness direction, and the transfer pattern is cured.

[0024] Furthermore, in step S2, selectively activating the piezoelectric ceramic micro-motion part to generate high-frequency micro-amplitude vibration according to the real-time process status includes: judging the slippage risk based on the feedback signal of the pressure sensor, or predicting the slippage area based on the position information of the hot press head, thereby triggering the piezoelectric ceramic micro-motion part of the corresponding pressing unit to work.

[0025] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0026] 1. Thorough and non-damaging cleaning: Visual guidance enables adaptive and path-optimized cleaning of contaminated areas. Combining high-frequency ultrasonic vibration (which removes dust) with negative pressure adsorption from microporous ceramic plates (instantly removing dust) avoids secondary pollution, and the flexible contact surface protects the brittle quartz stone surface.

[0027] 2. Effectively suppresses plate slippage: The servo drive provides a stable macroscopic clamping force, while the piezoelectric ceramic micro-motion part generates high-frequency micro-amplitude vibration, which breaks the static friction state between the plate and the carrier table contact interface and transforms it into dynamic and controllable micro-friction conditions. This effectively suppresses the macroscopic slippage of the plate caused by the movement of the hot press head or uneven thermal expansion, and ensures the positional accuracy of the transferred pattern.

[0028] 3. Precise control of thermal deformation: Through the coordinated operation of the infrared preheater, the hot-press transfer head, and the active cooling channel inside the bearing platform, a set temperature gradient field can be actively constructed and maintained in the thickness direction of the sheet material. This gradient field can counteract the thermal stress generated by the instantaneous high temperature on the surface, significantly reducing the risk of warping deformation and internal microcracks in the sheet material.

[0029] 4. High intelligence and collaboration: The central controller integrates multi-source information such as visual perception, pressure sensing, and displacement monitoring. Based on preset models and algorithms, it performs closed-loop collaborative control of multiple execution units such as cleaning, clamping, heating, and cooling, making the entire equipment an intelligent organic whole, which greatly improves process stability and product consistency. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of the artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment in a preferred embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the cleaning station in a preferred embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the heat transfer station in a preferred embodiment of the present invention;

[0033] Figure 4 This is a partial cross-sectional view of the heat transfer station in a preferred embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the structure of the independent pressing module in a preferred embodiment of the present invention;

[0035] Figure 6 This is a cross-sectional view of the independent clamping module in a preferred embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the thermal management unit in a preferred embodiment of the present invention;

[0037] Figure 8 This is a block diagram of the collaborative control logic of the central controller in a preferred embodiment of the present invention;

[0038] Figure 9 This is a flowchart of the thermal transfer process for artificial environmentally friendly zero-crystallization silica quartz in a preferred embodiment of the present invention.

[0039] Reference numerals: 1. Machine base; 101. Linear guide rail; 102. Load-bearing slide;

[0040] 2. Cleaning station; 201. Vision scanning unit; 202. High-frequency ultrasonic adsorption cleaning unit; 203. Cleaning head; 204. Piezoelectric ceramic transducer; 205. Microporous ceramic plate; 206. Support frame; 207. Drive cylinder; 208. Crossbeam; 209. Lead screw; 210. Drive motor; 211. Slider;

[0041] 3. Heat transfer station; 301. Infrared preheater; 302. Heat transfer head; 303. Sheet clamping unit; 304. Drive frame; 305. Independent clamping module; 306. Servo drive unit; 307. Piezoelectric ceramic micro-motion unit; 308. Presser foot; 309. Pressure sensor; 310. Thermal management unit; 311. Support platform; 312. Active cooling channel; 313. Rotary joint; 314. Displacement sensor;

[0042] 4. Central controller. Detailed Implementation

[0043] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0044] Reference Figures 1-7 As shown in the preferred embodiment of the present invention, the artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment mainly includes a machine base 1, a support slide 102, a cleaning station 2, a heat transfer station 3, and a central controller 4.

[0045] A linear guide rail 101 is installed on the machine base 1, and a carrying slide 102 is slidably connected to it to carry quartz stone slabs through each station in sequence. Along the feeding direction of the slabs, a cleaning station 2 and a heat transfer station 3 are linearly arranged on the linear guide rail 101 in sequence.

[0046] The cleaning module is located at cleaning station 2. This module includes a visual scanning unit 201 and a high-frequency ultrasonic adsorption cleaning unit 202. The visual scanning unit 201 is mounted above cleaning station 2 and is used to acquire images of the board surface, identifying the distribution, type, and area of ​​contaminants such as dust and oil stains. The high-frequency ultrasonic adsorption cleaning unit 202 is used to perform the cleaning operation.

[0047] Combination Figure 2 The high-frequency ultrasonic adsorption cleaning unit 202 includes a movable cleaning head 203. The cleaning head 203 integrates a piezoelectric ceramic transducer 204 as an ultrasonic vibration generator, and a microporous ceramic plate 205 is mounted below it. The microporous ceramic plate 205 has a negative pressure adsorption channel inside, which is connected to an external vacuum generator via a pipeline. The bottom working surface of the microporous ceramic plate 205 is preferably a flexible surface, or made of a porous flexible material, to ensure contact with the plate surface while avoiding scratches. The cleaning head 203 is moved by a multi-dimensional drive mechanism. In this embodiment, the mechanism includes support frames 206 symmetrically mounted on the machine base 1, with a crossbeam 208 fixedly connected between the tops of the two support frames 206, forming a stable portal frame structure spanning the entire cleaning area.

[0048] A precision linear guide and groove extending along the length of the crossbeam 208 (typically the Y-axis, perpendicular to the plate feed direction) are provided on the side of the crossbeam 208 facing the working area. A lead screw 209 is installed parallel to the groove, one end of which is connected to a drive motor 210 via a coupling. The drive motor 210 is fixedly mounted on the support frame 206. A slider 211 forms a threaded pair with the lead screw 209 through an internal ball nut, and the slider 211 slides in engagement with the linear guide on the crossbeam 208. When the drive motor 210 operates, the slider can be precisely controlled to perform horizontal reciprocating linear motion along the crossbeam 208 by rotating the lead screw 209.

[0049] A drive cylinder 207 is fixedly mounted on the slider 211, with its piston rod extending vertically downwards (in the Z-axis direction). The cleaning head 203 is rigidly mounted on the end of the piston rod of the drive cylinder 207 via a connector.

[0050] Through the above structure, the screw drive mechanism controlled by the drive motor 210 is responsible for driving the entire vertical drive assembly and the cleaning head 203 to be precisely positioned in the horizontal direction (Y-axis). The drive cylinder 207 is responsible for controlling the lifting and lowering movement of the cleaning head 203 in the vertical direction (Z-axis) to complete a series of actions such as approaching the board, contacting for cleaning, or lifting away. The central controller 4, through coordinated control of the drive motor 210 and the drive cylinder 207, can realize the required two-dimensional (or three-dimensional, if considering the X-axis feed of the supporting slide 102) movement of the cleaning head 203 in the working plane, thereby efficiently and accurately completing the cleaning operation on any area of ​​the board surface.

[0051] The heat transfer module is located at heat transfer station 3. This module includes an infrared preheater 301, a hot-press transfer head 302, a board clamping unit 303, and a thermal management unit 310. The infrared preheater 301 is located above the entrance of heat transfer station 3 and is used to perform non-contact, uniform preheating of the incoming board. The hot-press transfer head 302 can move under program control and apply high temperature and pressure to a designated area of ​​the board to complete the transfer.

[0052] The sheet metal clamping unit 303 is used to hold the sheet metal during the heat transfer process. It includes a drive frame 304 spanning the heat transfer station, and at least two independent clamping modules 305 mounted on the drive frame 304. Figure 5 As shown, each independent clamping module 305 is rigidly connected coaxially from top to bottom, including a servo drive unit 306, a piezoelectric ceramic micro-motion unit 307, and a clamping foot 308. The servo drive unit 306 provides a stable and adjustable macroscopic downward pressure. The piezoelectric ceramic micro-motion unit 307 can generate high-frequency, micro-amplitude precision vibrations under the drive of an electrical signal. The bottom surface of the clamping foot 308 is provided with anti-slip textures or anti-slip pads, and a pressure sensor 309 is embedded therein for real-time monitoring of the clamping force.

[0053] The thermal management unit 310 is used to control the thermal deformation of the sheet metal. For example... Figure 7 As shown, the support platform 311 of the heat transfer station 3 has an active cooling channel 312 internally machined. This active cooling channel 312 is connected to an external cooling system via a rotary joint 313, forming a closed-loop cooling circuit. During the heat transfer process, the cooling medium continuously flows through the active cooling channel 312 to actively cool the back of the board.

[0054] To monitor board deformation, a displacement sensor 314 can also be installed on the heat transfer station 3 for non-contact real-time measurement of the position and height changes of the upper surface of the board.

[0055] Central controller 4 is the control core of the entire equipment. For example... Figure 8 As shown in the logic block diagram, the central controller 4 is connected to all sensing and execution units, including the visual scanning unit 201, the drive motor 210 of the high-frequency ultrasonic adsorption cleaning unit 202, the vacuum generator, the infrared preheater 301, the hot press transfer head 302, the servo drive unit 306, the piezoelectric ceramic micro-motion unit 307, the pressure sensor 309, the cooling system control valve, and the displacement sensor 314, via signal lines.

[0056] Central controller 4 is programmed to implement the following core collaborative control functions:

[0057] Cleaning Control: The system receives image data from the vision scanning unit 201, identifies contaminants using image processing algorithms, and plans an efficient cleaning path. It then controls the drive cylinder 207 and drive motor 210 to move the cleaning head 203 along the planned path. Simultaneously, it controls the piezoelectric ceramic vibrator 204 to generate ultrasonic vibration and activate vacuum adsorption, achieving synchronous cleaning.

[0058] Dynamic anti-slip control: When the hot press transfer head 302 is working, the central controller 4 receives signals from the pressure sensors 309 on each pressure foot 308 in real time, and / or predicts the area where the board may slip based on the current position, moving speed and preset thermo-mechanical coupling model of the hot press transfer head 302. Once it is determined that there is a risk of slippage in a certain area, a specific drive signal is immediately sent to the piezoelectric ceramic micro-motion part 307 of the independent pressing module 305 at the corresponding position, so that it generates high-frequency micro-amplitude vibration, thereby actively suppressing slippage.

[0059] Gradient thermal management control: The central controller 4 presets a temperature gradient field based on process parameters such as the material, thickness, and target transfer pattern of the board. During the process, it coordinates the power of the infrared preheater 301, the heating temperature and pressure of the hot press transfer head 302, and the parameters of the external cooling system to ensure the cooling effect on the back of the board through the active cooling channel 312, thereby dynamically maintaining the preset temperature gradient in the thickness direction of the board.

[0060] like Figure 9 As shown, the artificial environmentally friendly zero-crystallization silica quartz heat transfer process using the above-mentioned equipment includes the following steps:

[0061] S1. Visual-guided cleaning: The support slide 102 delivers the sheet material to the cleaning station 2. The visual scanning unit 201 scans the surface, and the central controller 4 plans the cleaning path. The cleaning head 203 moves along the path, completing adaptive cleaning under the combined action of ultrasonic vibration and negative pressure adsorption.

[0062] S2. Preheating and Dynamic Anti-slip Clamping: The cleaned sheet material enters the heat transfer station 3. An infrared preheater 301 preheats it. After preheating, the servo drive units 306 of all independent clamping modules 305 descend, pressing the sheet material onto the support table 311 via the pressure feet 308. During the subsequent operation of the heat transfer head 302, the central controller 4 selectively activates the piezoelectric ceramic micro-motion units 307 in the corresponding areas based on feedback from the pressure sensor 309 and / or the position information of the heat transfer head, achieving dynamic anti-slip.

[0063] S3. Gradient Thermal Transfer: The hot press transfer head 302 heats and pressurizes the designated area of ​​the board according to the program for transfer. At the same time, the central controller 4 controls the operation of the cooling system, and the cooling medium continuously flows through the active cooling channel 312 in the support platform 311 to synchronously cool the back of the board. Throughout the process, the central controller 4 adjusts the heating and cooling parameters to ensure that a target temperature gradient is formed and maintained inside the board to suppress deformation until the transferred pattern is completely cured.

[0064] In a preferred embodiment of step S2, the specific logic for selective activation may be: when the pressure sensor 309 of a certain pressure foot 308 detects an abnormal fluctuation in the pressure value, or when the hot press transfer head 302 moves to a specific range from a certain pressing point, the central controller 4 immediately triggers the piezoelectric ceramic micro-motion part 307 corresponding to that point to work.

[0065] Without causing conflict, those skilled in the art can freely combine and use the above-mentioned additional technical features.

[0066] It is understood that the present invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, under the teachings of the present invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present invention.

Claims

1. A heat transfer printing manufacturing equipment for artificial environmentally friendly zero-crystallization silica quartz, comprising a machine base, wherein a linear guide rail is mounted on the machine base, and a load-bearing slide is slidably connected to the linear guide rail, characterized in that: Cleaning stations and heat transfer stations are linearly arranged on the linear guide rail along the sheet material feeding direction; the manufacturing equipment also includes: A cleaning module, located at the cleaning station, includes a visual scanning unit and a high-frequency ultrasonic adsorption cleaning unit; the high-frequency ultrasonic adsorption cleaning unit includes a movable cleaning head, which integrates a piezoelectric ceramic transducer that generates ultrasonic vibrations and a microporous ceramic plate with a negative pressure adsorption channel. A heat transfer module, located at the heat transfer station, includes an infrared preheater, a hot press transfer head, a sheet clamping unit, and a thermal management unit. The sheet clamping unit includes a drive frame and at least two independent clamping modules. Each independent clamping module includes a servo drive unit, a piezoelectric ceramic micro-motion unit, and a pressure foot, which are coaxially and rigidly connected from top to bottom. The thermal management unit includes an active cooling channel located inside the support platform of the heat transfer station for controlling the thermal deformation of the sheet. The central controller is signal-connected to the visual scanning unit, the high-frequency ultrasonic adsorption cleaning unit, the infrared preheater, the hot pressing head, the plate clamping unit, and the thermal management unit, and is configured to perform coordinated control. The coordinated control includes planning and controlling the movement path and cleaning parameters of the cleaning head based on the recognition results of the visual scanning unit; during the hot pressing transfer process, controlling at least one of the piezoelectric ceramic micro-movement parts to generate high-frequency micro-amplitude vibration to suppress plate slippage based on the pressure feedback signal from the presser foot and the preset anti-slip program; and coordinating the preheating power of the infrared preheater, the heating temperature and pressure of the hot pressing transfer head, and the cooling medium parameters flowing through the cooling channel to form and maintain a preset temperature gradient field in the thickness direction of the plate.

2. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The high-frequency ultrasonic adsorption cleaning unit further includes a multi-dimensional drive mechanism for driving the movement of the cleaning head; the multi-dimensional drive mechanism includes support frames symmetrically mounted on the machine base, crossbeams connected to the top of the two support frames, a lead screw mounted on the crossbeam and driven by a drive motor, a slider threaded to the lead screw and sliding along the crossbeam, and a drive cylinder mounted on the slider; the piston rod end of the drive cylinder is connected to the cleaning head, and the cleaning head is driven to move in the horizontal and vertical directions through the cooperation of the drive motor and the drive cylinder.

3. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The working surface of the microporous ceramic plate that contacts the plate is a flexible surface or is covered with a flexible layer.

4. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The visual scanning unit is a visual sensor installed above the cleaning station to identify the dust distribution on the surface of the quartz stone slab; the central controller plans the cleaning path of the high-frequency ultrasonic adsorption cleaning unit based on the identification results of the visual scanning unit.

5. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The bottom surface of the presser foot is provided with anti-slip texture or anti-slip pad, and a pressure sensor is embedded therein.

6. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The cooling channel is connected to an external cooling system via a rotary joint, and is used to actively cool the back of the quartz slab during the heat transfer process.

7. The artificial environmentally friendly zero-crystallization silica quartz heat transfer manufacturing equipment according to claim 1, characterized in that: The heat transfer station is also equipped with a displacement sensor to monitor the positional changes of the upper surface of the quartz slab in real time during the heat transfer process; the central controller is also configured to dynamically adjust the downward pressure of the servo drive or the vibration parameters of the piezoelectric ceramic micro-motion part according to the monitoring signal of the displacement sensor.

8. A heat transfer process using artificial, environmentally friendly, zero-crystallization silica quartz, characterized in that... The manufacturing equipment for thermal transfer printing of artificial environmentally friendly zero-crystallization silica as described in any one of claims 1-7 includes the following steps: S1. Visual-guided cleaning: The visual scanning unit identifies the distribution of contaminants on the surface of the board, plans the cleaning path, and drives the cleaning head, which integrates an ultrasonic vibration generator and a negative pressure adsorption channel, to clean the surface of the board. S2. Preheating and Dynamic Anti-slip Clamping: The cleaned sheet material is preheated using an infrared preheater; the sheet material is pressed onto the support platform by multiple independent pressing modules; during the subsequent hot pressing transfer process, the piezoelectric ceramic micro-motion part is selectively activated to generate high-frequency micro-amplitude vibration according to real-time process parameters to suppress sheet material slippage. S3, Gradient thermal transfer: While the hot press head locally heats and pressurizes the board, the back of the board is actively cooled through the cooling channel of the thermal management unit, so that the board forms and maintains a predetermined temperature gradient in the thickness direction, and the transfer pattern is cured.

9. The artificial environmentally friendly zero-crystallization silica quartz hot transfer process according to claim 8, characterized in that: In step S2, selectively activating the piezoelectric ceramic micro-motion part to generate high-frequency micro-amplitude vibration according to the real-time process status includes: judging the slip risk based on the feedback signal of the pressure sensor, or predicting the slip area based on the position information of the hot press head, thereby triggering the piezoelectric ceramic micro-motion part of the corresponding position pressing module to work.

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