Circuit board desmearing method, controller, desmearing device, system and circuit board

Abstract

The application is suitable for the industrial technical field, and provides a circuit board glue removing method, a controller, a glue removing device, a system and a circuit board. The circuit board glue removing method comprises the following steps: after a to-be-processed circuit board is laminated with a polymer material, the contour information of a glue overflow area on the to-be-processed circuit board is detected, and the contour information comprises a global glue overflow width; the glue overflow area is divided into one or more sub-scanning areas, and a laser scanning path corresponding to each sub-scanning area is generated according to the local glue overflow width of the glue overflow area in each sub-scanning area, so that a laser scanning pattern composed of each sub-scanning area is obtained; and a laser glue removing operation is performed on the glue overflow area according to the laser scanning pattern. The embodiment of the application can reduce invalid glue removing areas, and improve the accuracy and efficiency of glue removing.

Description

Technical Field

[0001] This application belongs to the field of industrial technology, and in particular relates to a method for removing adhesive from circuit boards, a controller, adhesive removal equipment, a system, and a circuit board. Background Technology

[0002] Circuit boards (PCBs) are packaging substrates used to carry and interconnect different chips and / or electronic components. During PCB manufacturing, after laminating polymer materials such as ABF (Ajinomoto Build-up Film) or PET (Polyethylene Terephthalate) films onto the circuit layers, irregularly distributed adhesive overflow areas are squeezed out at the board edges due to the fluidity of the polymer materials. The overflowing polymer material can interfere with subsequent processes. Therefore, the adhesive overflow areas need to be cleaned up before laminating the next copper foil layer.

[0003] However, since the distribution of excess adhesive after each pressing is different, when using laser adhesive removal technology to remove excess adhesive, in order to ensure complete coverage of the irregular excess adhesive outline, a regular processing pattern (such as a ring) that can surround the entire excess adhesive area is usually set, and a uniform laser scanning path with fixed density and direction (such as a single parallel straight line scanning trajectory) is used to perform a full-coverage scan within the processing pattern. However, this method has a large ineffective adhesive removal area and low adhesive removal efficiency. Summary of the Invention

[0004] This application provides a method, controller, adhesive removal equipment, system, and circuit board for removing adhesive from a circuit board, which can reduce ineffective adhesive removal areas and improve the accuracy and efficiency of adhesive removal.

[0005] The first aspect of this application provides a method for removing adhesive from a circuit board, comprising: after laminating a polymer material onto the circuit board to be processed, detecting the contour information of an adhesive overflow area on the circuit board to be processed, the contour information including the global adhesive overflow width, the global adhesive overflow width including the adhesive overflow width at each position in the adhesive overflow area; dividing the adhesive overflow area into one or more sub-scanning areas, and generating a laser scanning path corresponding to the sub-scanning area based on the local adhesive overflow width of the adhesive overflow area in each sub-scanning area, thereby obtaining a laser scanning pattern composed of each sub-scanning area, the local adhesive overflow width including the adhesive overflow width at each position in the corresponding sub-scanning area; and performing a laser adhesive removal operation on the adhesive overflow area based on the laser scanning pattern.

[0006] In some embodiments of the first aspect, generating a laser scanning path corresponding to a sub-scanning area based on the local glue overflow width within each sub-scanning area includes: determining the long side direction of each sub-scanning area; and determining a laser scanning path corresponding to the sub-scanning area and scanning along the long side direction of the sub-scanning area based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning.

[0007] In some embodiments of the first aspect, a laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area is determined based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning. This includes: determining the distribution position of the local glue overflow area within each sub-scanning area on the circuit board to be processed; if the distribution position is a corner position of the circuit board to be processed, the local glue overflow area within the sub-scanning area is divided into two sub-regions along the extension line of one side of the lamination area, and a sub-scanning path corresponding to the sub-region and scanning along the long side of the sub-region is determined based on the local glue overflow width and spot size of each sub-region; the sub-scanning paths of each sub-region within the same sub-scanning area are combined to obtain the laser scanning path corresponding to the sub-scanning area; if the distribution position is a non-corner position of the circuit board to be processed, a laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area is determined based on the local glue overflow width and spot size of each sub-scanning area.

[0008] In some embodiments of the first aspect, determining the long side direction of each sub-scanning region includes: determining the distribution position of the local glue overflow region within each sub-scanning region on the circuit board to be processed; if the distribution position is a non-corner position of the circuit board to be processed, then determining the long side direction of each sub-scanning region according to the long side extension direction of the circumscribed rectangle of the local glue overflow region within each sub-scanning region; if the distribution position is a corner position of the circuit board to be processed, then, with the goal of minimizing the number of scan paths within the sub-scanning region, dividing the local glue overflow region into two sub-regions along the extension line of one side of the pressing region, and determining the long side direction of each sub-region according to the long side extension direction of the circumscribed rectangle of the local glue overflow region within each sub-region.

[0009] In some embodiments of the first aspect, the contour information includes the global adhesive overflow thickness, which includes the adhesive overflow thickness at each location in the adhesive overflow area; the circuit board adhesive removal method further includes: determining the laser scanning power corresponding to the sub-scanning area based on the local adhesive overflow thickness of the adhesive overflow area in each sub-scanning area; and performing a laser adhesive removal operation on the adhesive overflow area based on the laser scanning pattern, including: performing a laser adhesive removal operation on the adhesive overflow area in each sub-scanning area based on the corresponding laser scanning power.

[0010] In some embodiments of the first aspect, the sub-scanning regions are arranged adjacently to form a region array distributed in a ring along the outer periphery of the pressing region; dividing the overflow region into one or more sub-scanning regions includes: aligning one side of the region array with one side of the rectangle circumscribed by the overflow region to divide the overflow region into one or more sub-scanning regions; or, dividing the overflow region into one or more sub-scanning regions with the goal of minimizing the local overflow width variation in each sub-scanning region; or, setting the center position of the starting sub-scanning region in the region array with a preset target point on the circuit board to be processed according to a preset relative positional relationship to divide the overflow region into one or more sub-scanning regions.

[0011] In some embodiments of the first aspect, performing laser adhesive removal on the excess adhesive area according to the laser scan pattern includes: sequentially performing laser adhesive removal on the local excess adhesive areas within each sub-scanning area according to the distribution order of each sub-scanning area in a preset direction; or, sorting each sub-scanning area according to the maximum excess adhesive thickness or the maximum excess adhesive width, and sequentially performing laser adhesive removal on the local excess adhesive areas within each sub-scanning area according to the sorting order.

[0012] In some embodiments of the first aspect, detecting the contour information of the adhesive overflow area on the circuit board to be processed includes: during the target positioning process, controlling the contour detection sensor to scan the circuit board to be processed to obtain contour information.

[0013] A second aspect of this application provides a controller, including a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, it implements the steps of the above-described circuit board adhesive removal method.

[0014] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the circuit board adhesive removal method described above.

[0015] The fourth aspect of this application provides a computer program product that, when run, causes the above-described circuit board adhesive removal method to be executed.

[0016] The fifth aspect of this application provides a glue removal device, including: a processing platform, a contour detection sensor, a glue removal laser, and a controller. The processing platform, the contour detection sensor, and the glue removal laser are all connected to the controller. The processing platform is used to carry the circuit board to be processed. The contour detection sensor is used to collect the contour information of the circuit board to be processed. The controller is used to control the glue removal laser to perform laser glue removal operation on the circuit board to be processed based on the method of any one of the first aspects.

[0017] The sixth aspect of this application provides a circuit board processing system, the system including a pressing device and a de-adhesive device as described in the fifth aspect, the pressing device being used to press the circuit board to be processed, causing excess adhesive to form around the periphery of the circuit board to be processed, and the de-adhesive device being used to perform laser de-adhesive removal operation on the circuit board to be processed based on the method described in any one of the first aspects.

[0018] The seventh aspect of this application provides a circuit board, which is manufactured using the circuit board processing system described in the sixth aspect.

[0019] In the embodiments of this application, after laminating polymer materials onto the circuit board to be processed, the contour information of the glue overflow area on the circuit board to be processed is detected, and the glue overflow area is divided into one or more sub-scanning areas. A laser scanning path corresponding to the sub-scanning area is generated according to the local glue overflow width of the glue overflow area in each sub-scanning area, resulting in a laser scanning pattern composed of each sub-scanning area. Based on the laser scanning pattern, a laser glue removal operation is performed on the glue overflow area. This allows the local laser scanning path to match the local glue overflow width. Compared with using a uniform laser scanning path globally, it can reduce the situation where the laser scanning path covers the outside of the glue overflow area, reduce the invalid glue removal area, and improve the accuracy and efficiency of glue removal. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram illustrating the implementation process of a circuit board adhesive removal method provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of the circuit board to be processed provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of detecting the thickness of adhesive overflow provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram illustrating the specific implementation process of determining the laser scanning path provided in the embodiments of this application;

[0025] Figure 5 This is a schematic diagram of the sub-scanning area provided in an embodiment of this application;

[0026] Figure 6This is a schematic diagram of the laser scanning path provided in an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of the structure of a controller provided in an embodiment of this application;

[0028] Figure 8 This is a schematic diagram of the specific structure of the adhesive removal device provided in the embodiments of this application. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are protected by this application.

[0030] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0031] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0032] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0033] Because the distribution of excess adhesive varies after each lamination, related technologies using laser adhesive removal processes typically employ a regular processing pattern (such as a ring) that encompasses the entire excess adhesive area to ensure complete coverage of the irregular adhesive outline. Within this pattern, a standardized laser scanning path (e.g., a single parallel straight-line scanning trajectory) with fixed density and direction is used for full coverage scanning. Specifically, CO2 lasers are often used for adhesive removal. Since the copper foil layer at the bottom of the excess adhesive has extremely low absorption of CO2 laser light, related technologies usually draw the laser scanning pattern according to a uniform excess adhesive width. However, this method results in a large area of ​​ineffective adhesive removal and low removal efficiency. Therefore, this application proposes an adhesive removal method that matches the local laser scanning path to the local excess adhesive width. Compared to using a uniform laser scanning path globally, this reduces the extent to which the laser scanning path covers areas outside the excess adhesive area, decreases the ineffective removal area, and improves the accuracy and efficiency of adhesive removal.

[0034] To illustrate the technical solution of this application, specific embodiments are described below.

[0035] Figure 1 A schematic diagram illustrating the implementation flow of a circuit board adhesive removal method according to an embodiment of this application is shown. This method can be applied to a controller. The controller can be installed on the adhesive removal equipment.

[0036] Specifically, the above-mentioned method for removing adhesive from circuit boards may include the following steps S101 to S103.

[0037] Step S101: After laminating the circuit board to be processed with polymer materials, detect the contour information of the glue overflow area on the circuit board to be processed.

[0038] In the embodiments of this application, the circuit board to be processed is the object of this polymer material lamination and adhesive removal. During the fabrication of multilayer circuit boards, insulating material layers need to be stacked between different signal layers (copper foil layers). During the circuit board fabrication process, the copper foil layers and insulating material layers need to be laminated layer by layer. The insulating material layer uses a polymer material, and when laminating the insulating material layer onto the signal layer, the excess adhesive area exceeding the signal layer's boundaries needs to be removed to avoid adverse effects on subsequent laminations. For example, excess adhesive could cause uneven lamination or air bubbles in the next copper foil layer, affecting the reliability of the signal layer. The polymer material layer includes, but is not limited to, ABF material and PET material. To remove excess adhesive areas, the contour information of the excess adhesive area on the circuit board to be processed can be detected after each polymer material layer lamination.

[0039] like Figure 2As shown, the overflow area refers to the area on the circuit board to be processed where there is overflowing adhesive, located between the lamination area and the board edge area. The lamination area is the area on the circuit board to be processed where the lamination operation of the add-on material layer is performed. The board edge area refers to the area on the bottom material layer of the circuit board where no add-on material layer lamination process is performed. The board edge area is distributed at the outermost edge of the circuit board to be processed and can be cut off after the add-on structure of the circuit board is processed. In the embodiments of this application, the contour information can reflect the edge distribution of the overflow area along the plane of the circuit board and its height along the thickness direction of the circuit board. Specifically, the contour information can include the global overflow width, which includes the overflow width at each position in the overflow area. The overflow width at each position can represent the distance between the edge point of the overflow area and the outer contour of the lamination area, for example... Figure 2 The image shows the glue overflow width at four different locations.

[0040] Step S102: Divide the glue overflow area into one or more sub-scanning areas, and generate a laser scanning path corresponding to the sub-scanning area based on the local glue overflow width of the glue overflow area in each sub-scanning area, so as to obtain a laser scanning pattern composed of each sub-scanning area.

[0041] The sub-scanning area is a basic processing unit area obtained by dividing the entire glue overflow area according to the single effective scanning field range of the beam deflection mechanism (such as a galvanometer) within the glue removal equipment. Specifically, based on the single effective scanning field range of the beam deflection mechanism (such as a galvanometer), the glue overflow area can be divided into one or more sub-scanning areas, so that the sum of all sub-scanning areas can cover the entire glue overflow area. Each sub-scanning area corresponds to one independent positioning and scanning process of the glue removal equipment, and contains a part of the glue overflow area.

[0042] The laser scanning path is a sequence of laser beam motion and control commands generated for a specific sub-scanning area after planning and calculating the local glue overflow width of the glue overflow region at various positions within it. In the embodiments of this application, for a single sub-scanning area, a laser scanning path corresponding to that sub-scanning area can be generated based on the local glue overflow width of the glue overflow region within that sub-scanning area, so that the laser scanning path corresponding to the sub-scanning area is adapted to its local glue overflow width. The local glue overflow width within each sub-scanning area includes the glue overflow width of the glue overflow region at various positions within the corresponding sub-scanning area.

[0043] Subsequently, by combining the various sub-scanning areas and their laser scanning paths, a laser scanning pattern can be obtained. This laser scanning pattern is the final, complete processing pattern generated to complete the laser adhesive removal operation on the entire circuit board to be processed.

[0044] Step S103: Perform laser adhesive removal on the overflow area according to the laser scanning pattern.

[0045] In the embodiments of this application, the adhesive removal equipment can be controlled to perform laser adhesive removal operation according to the laser scanning path corresponding to each sub-scanning area within the laser scanning pattern, so as to remove the adhesive overflow area of ​​the circuit board to be processed.

[0046] In the embodiments of this application, after laminating polymer materials onto the circuit board to be processed, the contour information of the glue overflow area on the circuit board to be processed is detected, and the glue overflow area is divided into one or more sub-scanning areas. A laser scanning path corresponding to the sub-scanning area is generated according to the local glue overflow width of the glue overflow area in each sub-scanning area, resulting in a laser scanning pattern composed of each sub-scanning area. Based on the laser scanning pattern, a laser glue removal operation is performed on the glue overflow area. This allows the local laser scanning path to match the local glue overflow width. Compared with using a uniform laser scanning path globally, it can reduce the situation where the laser scanning path covers the outside of the glue overflow area, reduce the invalid glue removal area, and improve the accuracy and efficiency of glue removal.

[0047] In some embodiments of this application, the contour information of the overflow area may include the global overflow thickness and global overflow width of the overflow area.

[0048] The global adhesive overflow thickness reflects the height of each location in the adhesive overflow area along the depth direction, including the adhesive overflow thickness at each location within the overflow area. In the embodiments of this application, the calculation method for the global adhesive overflow thickness can be selected based on the type of contour detection sensor and the characteristics of the adhesive overflow. Specifically, when the contour detection sensor is a line scan sensor or a point scan sensor, such as... Figure 3 As shown, the global adhesive overflow thickness can be obtained by detecting the height difference between the overflow height and the board edge height. The overflow height is the height of the upper surface of the overflow area, while the board edge height is the height of the bottom surface of the overflow area, i.e., the height of the board edge region. When the contour detection sensor is an image sensor, the global adhesive overflow thickness can also be detected directly. It should be noted that the adhesive overflow thickness at each location in the global adhesive overflow thickness can refer to the average or maximum adhesive overflow thickness within a preset size range centered on that location.

[0049] The global adhesive overflow width reflects the edge contour distribution of the adhesive overflow area within the plane of the circuit board to be processed, including the adhesive overflow width at various locations within the overflow area. The global adhesive overflow width can be calculated based on the distance between the edge location and the lamination area after locating the edge of the overflow area. Similarly, the adhesive overflow width at each location can be defined as the distance from a point on the outer contour line of the lamination area, along the perpendicular direction of the edge of the lamination area containing that point, to the outer edge of the overflow area within the plane of the circuit board to be processed.

[0050] Considering the impact of detection errors and laser control errors, in some implementations, a width correction amount can be preset. The width of the overflow at each position can be corrected by the preset width correction amount. That is, based on the detected width of the overflow, a certain width is added, which can avoid the problem of not cleaning the overflow due to errors in the width of the overflow or deviations in laser control.

[0051] The width correction amount can be determined based on the selected contour detection sensor and / or the spot size during adhesive removal. For example, in a specific embodiment, the spot size of the adhesive removal laser is 300 μm, and the width correction amount can be set to 500 μm.

[0052] Furthermore, the contour information can be detected by a contour detection sensor installed on the adhesive removal equipment. This application does not limit the type of contour detection sensor; for example, the contour detection sensor may be a three-dimensional line scan sensor, a Keyence coaxial displacement meter / point scan sensor, an image sensor, etc.

[0053] In some embodiments of this application, detecting the contour information of the adhesive overflow area on the circuit board to be processed may include: during the target positioning process, controlling the contour detection sensor to scan the circuit board to be processed to obtain contour information.

[0054] Target positioning, also known as target gripping, is used to locate targets on the circuit board to be processed, ensuring the accurate relative positions of various parts of the circuit board during lamination and other processes. The target serves as an identifier on the circuit board and can be a marker point or a target hole. For example... Figure 2 As shown, the circuit board to be processed can be considered as a flat rectangular object, and targets can be set at each corner of the rectangle. During target positioning, the targets at each corner can be detected, and the circuit board to be processed can be positioned based on the target positions. This application does not limit the method of setting the targets; for example, specific materials can be pasted, coated, or embedded at each corner of the circuit board to be processed as markers for target gripping, or target holes can be set on the circuit board to be processed by drilling. In practical applications, any method can be selected according to processing requirements.

[0055] Target identification using optical and mechanical methods can achieve target positioning on the circuit board to be processed. Specifically, when detecting the target position, the relative movement of the circuit board to be processed and the sensor detecting the target can be controlled. For example, controlling the movement of the circuit board to be processed or controlling the movement of the sensor detecting the target can achieve target position detection by changing the relative position of the sensors on the circuit board to be processed and the target. The sensor detecting the target can be the aforementioned contour detection sensor, or it can be other separately established sensors, such as image sensors; this application does not limit this.

[0056] During target localization, a contour detection sensor can be simultaneously controlled to scan the circuit board to be processed to obtain contour information. For example, when detecting the position of a target hole, the sensor detecting the target hole needs to be controlled to scan clockwise along the edge of the circuit board starting from the upper left corner. Simultaneously, the contour detection sensor can also be controlled to scan synchronously at a certain frequency to obtain contour information. In this way, the contour information acquisition process and the target localization process are deeply integrated, which can reduce repeated measurement time and improve the efficiency of adhesive overflow removal.

[0057] In some embodiments of this application, such as Figure 4 As shown, generating a laser scanning path corresponding to the sub-scanning area based on the local glue overflow width of the glue overflow area in each sub-scanning area may include steps S401 to S402.

[0058] Step S401: Determine the direction of the long side of each sub-scanning region.

[0059] Specifically, the long side direction of the sub-scanning region can refer to the long side direction of the smallest bounding rectangle of the local glue overflow area within the sub-scanning region.

[0060] This application does not limit the method of determining the long side direction. In some embodiments of this application, the long side direction of the sub-scanning area can be determined according to the shape of the local glue overflow area within each sub-scanning area. Considering that the long side direction is usually related to the distribution position of the local glue overflow area within the sub-scanning area on the circuit board to be processed, for example, the long side direction of the sub-scanning area located at the upper edge of the lamination area is usually parallel to the upper edge of the lamination area, the long side direction of the sub-scanning area can also be determined according to the distribution position of the local glue overflow area within each sub-scanning area on the circuit board to be processed.

[0061] In some embodiments of this application, determining the long side direction of each sub-scanning region may include: determining the distribution position of the local glue overflow region within each sub-scanning region on the circuit board to be processed; if the distribution position is a non-corner position of the circuit board to be processed, then the long side direction of each sub-scanning region is determined according to the long side extension direction of the circumscribed rectangle of the local glue overflow region within each sub-scanning region; if the distribution position is a corner position of the circuit board to be processed, then with the goal of minimizing the number of scanning paths within the sub-scanning region, the local glue overflow region is divided into two sub-regions along the extension line of one side of the pressing region, and the long side direction of each sub-region is determined according to the long side extension direction of the circumscribed rectangle of the local glue overflow region within each sub-region.

[0062] In this context, a localized adhesive overflow area refers to the portion of the overflow area located within a sub-scanning area. Specifically, if a localized adhesive overflow area within the scanning area is located at a non-corner position of the circuit board to be processed, and its long side has one direction, then the circumscribed rectangle of the localized adhesive overflow area can be determined, and the extension direction of its long side is taken as the long side direction of the corresponding sub-scanning area. If the localized adhesive overflow area within the scanning area is located at a corner position of the circuit board to be processed, since the sub-scanning area needs to be further divided into two sub-regions, each with one long side direction, there are a total of two long side directions. In this case, the circumscribed rectangle of the localized adhesive overflow area can be determined. With the goal of minimizing the number of scan paths within the sub-scanning area, the localized adhesive overflow area is divided into two sub-regions along the extension line of one side of the lamination area. The long side direction of the corresponding sub-region is determined based on the extension direction of the long side of the circumscribed rectangle of the localized adhesive overflow area within each sub-region.

[0063] Step S402: Based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning, determine the laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area.

[0064] The width of the local adhesive overflow in each sub-scanning region determines the total range of the laser scan, while the spot size during laser scanning determines the spacing between adjacent scan paths. Specifically, the spot size can range from 100μm to 300μm; for example, a spot size of 200μm can result in a spacing of 80μm between adjacent scan paths. Based on the local adhesive overflow width of each sub-scanning region and the spot size during laser scanning, the number of scan paths required to cover the total laser scan range can be determined. The larger the maximum adhesive overflow width of the local overflow region within a sub-scanning region, the more scan paths are required for the same spot size. Subsequently, sub-scanning paths extending along the long side, matching the number of scan paths, can be generated. These sub-scanning paths constitute the laser scan path corresponding to the sub-scanning region.

[0065] In some embodiments of this application, determining the laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning can specifically include: determining the distribution position of the local glue overflow area within each sub-scanning area on the circuit board to be processed. If the distribution position is a corner of the circuit board to be processed, the local glue overflow area within the sub-scanning area is divided into two sub-regions along the extension line of one side of the lamination area, and a sub-scanning path corresponding to the sub-region and scanning along the long side of the sub-region is determined based on the local glue overflow width and spot size of each sub-region. The sub-scanning paths of each sub-region within the same sub-scanning area are combined to obtain the laser scanning path corresponding to the sub-scanning area.

[0066] Specifically, after dividing the excess adhesive area into one or more sub-scanning areas, the distribution location of the local excess adhesive area within each sub-scanning area on the circuit board to be processed can be obtained. The distribution location of the local excess adhesive area on the circuit board to be processed can be divided into two types: one is the corner location of the circuit board to be processed, and the other is the non-corner location of the circuit board to be processed.

[0067] Please refer to Figure 5 In (a), if the localized adhesive overflow area is located at a corner of the circuit board to be processed, then this localized adhesive overflow area is essentially composed of two extended portions connected at the corner point: one portion extends mainly along a direction parallel to the first edge of the board, and the other portion extends mainly along a direction parallel to the second edge that intersects (usually perpendicular to) the first edge, thus presenting an overall "L-shaped" or similar multi-directional composite geometric feature. In this case, the localized adhesive overflow area within the sub-scanning region can be divided into two sub-regions along the extension line of one side of the lamination region, so that each sub-region has a relatively singular main extension trend parallel to a certain edge direction. Subsequently, for each sub-region, based on the internal localized adhesive overflow width and spot size, a sub-scanning path corresponding to the sub-region and scanning along the long side direction of the sub-region is determined. Then, the sub-scanning paths of each sub-region within the same sub-scanning region are combined to obtain the laser scanning path corresponding to the sub-scanning region.

[0068] For example, for the first sub-region, a set of laser scanning paths is generated, with the extension direction of these paths parallel to the aforementioned first edge. Similarly, for the second sub-region, another set of laser scanning paths parallel to the second edge is generated. The two sets of laser scanning paths are then combined to form the laser scanning path corresponding to the sub-scanning region.

[0069] Correspondingly, if the distribution location is a non-corner position of the circuit board to be processed, then the local glue overflow area has a relatively simple main extension trend parallel to a certain edge direction. The laser scanning path corresponding to the sub-scanning area and scanning along the long side direction of the sub-scanning area can be determined directly based on the local glue overflow width and spot size of each sub-scanning area.

[0070] Therefore, by distributing the laser scanning path along the long side, the number of deflections required by the galvanometer can be reduced, which helps to reduce processing time and improve processing efficiency.

[0071] In some embodiments of this application, the circuit board adhesive removal method may further include: determining the laser scanning power corresponding to the sub-scanning area based on the local adhesive overflow thickness of the overflow area in each sub-scanning area.

[0072] Specifically, if the local adhesive overflow thickness in the sub-scanning area is greater than a preset thickness threshold, the laser scanning power corresponding to the sub-scanning area can be determined based on the local adhesive overflow thickness and the correspondence between adhesive overflow thickness and laser power.

[0073] If the localized adhesive overflow thickness is less than or equal to a preset thickness threshold, the preset base laser power and base spot size are sufficient to remove the overflow without leaving any residue. If the localized adhesive overflow thickness exceeds the preset thickness threshold, the laser scanning power needs to be selected according to the correlation between adhesive overflow thickness and laser power. In the above correlation between adhesive overflow thickness and laser power, the laser power is positively correlated with the adhesive overflow thickness removed in a single scan. During the adhesive overflow removal process, it is necessary to ensure that the laser power does not exceed the energy damage threshold of the copper foil layer beneath the adhesive overflow. Usually, one laser scan is sufficient, but if the localized adhesive overflow thickness is too high, multiple scans can be performed using a laser power lower than the energy damage threshold of the copper foil layer.

[0074] In some embodiments of this application, multiple preset thickness thresholds can be set, and it can be determined which interval the local adhesive overflow thickness belongs to within the multiple preset thickness thresholds. The laser power corresponding to that interval is then used as the laser scanning power corresponding to the sub-scanning area. When the local adhesive overflow thickness is less than or equal to the minimum preset thickness threshold, the laser scanning power corresponding to the sub-scanning area is the base laser power; when the local adhesive overflow thickness is greater than the maximum preset thickness threshold, the laser scanning power corresponding to the sub-scanning area is the rated power of the laser.

[0075] For example, if the thickness of the local adhesive overflow is H, and the preset thickness thresholds are T, T+A, T+2A, T+3A, etc., then the corresponding laser power includes P, P+C, P+2C, P+3C, etc., where P is the base laser power. In the above example, each letter can be freely selected with a numerical value.

[0076] It should be noted that, in order to ensure the removal rate of excess adhesive, the laser scanning power corresponding to the sub-scanning area can be the same as the laser scanning power corresponding to the maximum thickness of excess adhesive in the local excess adhesive area within the sub-scanning area. In this case, excess adhesive at any location within the sub-scanning area can be removed.

[0077] Accordingly, performing laser adhesive removal on the overflow area based on the laser scan pattern can include: performing laser adhesive removal on the overflow area within each sub-scanning area according to the corresponding laser scan power.

[0078] In some embodiments of this application, the aforementioned sub-scanning regions are arranged adjacently to form a ring-shaped array of regions distributed along the outer periphery of the pressing region. Adjacent sub-scanning regions can be aligned or misaligned; this application does not impose any limitation on this. Furthermore, the sizes of different sub-scanning regions can be the same or different, all being less than or equal to the single effective scan field range of the beam deflection mechanism (such as a galvanometer). For example, Figure 5 (a) shows the case where adjacent sub-scan regions are the same size and aligned. Figure 5 (b) illustrates the case where adjacent sub-scanning areas are of different sizes and are not aligned. Specifically, the size and position of each sub-scanning area can be planned based on the global overflow width of the overflow area, with the goal of minimizing the number of scan paths and the cumulative length of scan paths across all sub-scanning areas, in order to further improve the glue removal efficiency.

[0079] In some embodiments of this application, dividing the adhesive overflow area into one or more sub-scanning areas may include: aligning one side of the area array with one side of the rectangle circumscribed by the adhesive overflow area to divide the adhesive overflow area into one or more sub-scanning areas. For example, aligning one side of the first sub-scanning area in the area array with one side of the rectangle circumscribed by the adhesive overflow area, and then setting the sub-scanning areas to the right and downward according to the scanning range of the beam deflection mechanism to form an area array that is distributed in a ring and covers the entire adhesive overflow area.

[0080] In other embodiments of this application, the adhesive overflow area can be divided into one or more sub-scanning areas with the goal of minimizing the local overflow width variation within each sub-scanning area. Please refer to... Figure 6 In (a), the conventional division method can easily lead to significant differences in the width of the adhesive overflow area within the same sub-scanning region. However, as explained earlier, the final number of scan paths within this sub-scanning region will be determined by the maximum width. This means that even in locations with extremely low adhesive overflow widths, such as... Figure 6 In the second sub-scanning region of (a), the beam deflection mechanism deflects the beam four times during scanning, corresponding to the maximum adhesive overflow width. As the region array moves, the adhesive overflow situation differs within each sub-scanning region. Therefore, a region array exists that minimizes the local adhesive overflow width variation within each sub-scanning region. Dividing the adhesive overflow region into one or more sub-scanning regions according to this region array allows adjacent regions with small differences in adhesive overflow width to be grouped into the same sub-scanning region. Please refer to [reference needed]. Figure 6 In (b), the overflow width of adhesive at each position in the partial sub-scanning area is relatively low, the number of scan paths required is less, the total number of deflections can be reduced, and the processing efficiency can be improved.

[0081] In other embodiments of this application, the center position of the initial sub-scanning region in the region array can be set with a preset relative positional relationship with a preset target point on the circuit board to be processed, so as to divide the glue overflow area into one or more sub-scanning regions. For example, the center position of the initial sub-scanning region can be aligned with the center point of the target.

[0082] Correspondingly, when performing laser adhesive removal on the overflow area based on the laser scanning pattern, the sub-scanning areas can also be scanned in a certain order to complete the laser adhesive removal operation.

[0083] Specifically, based on the laser scan pattern, performing laser adhesive removal on the excess adhesive area can include any of the following:

[0084] 1. According to the distribution order of each sub-scanning area in the preset direction, the laser adhesive removal operation is performed on the local overflow area in each sub-scanning area in sequence. For example, the laser adhesive removal operation is performed in a clockwise direction along the outer edge of the pressing area. In this way, adjacent sub-scanning areas in physical position can be cleaned continuously, which helps to improve the control convenience of the adhesive removal laser.

[0085] 2. Sort the local glue overflow areas in each sub-scanning area according to the maximum glue overflow thickness or the maximum glue overflow width, and perform laser glue removal operation on the local glue overflow areas in each sub-scanning area in the sorting order; that is, the maximum glue overflow thickness or the maximum glue overflow width can be sorted from high to low (or from low to high). In this way, the laser parameters are increased or decreased slowly during the laser glue removal process, which can avoid repeated fluctuations in laser parameters and reduce the complexity of the glue removal laser control.

[0086] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because based on this application, some steps can be performed in other orders.

[0087] like Figure 7 The diagram shown is a schematic of a controller provided in an embodiment of this application. Specifically, the controller 40 may include: a processor 400, a memory 401, and a computer program 402 stored in the memory 401 and executable on the processor 400, such as a glue removal program. When the processor 400 executes the computer program 402, it implements the steps in the above-described circuit board glue removal method embodiments, for example... Figure 1 Steps S101 to S103 are shown.

[0088] The computer program can be divided into one or more modules / units, which are stored in the memory 401 and executed by the processor 400 to complete this application. The one or more modules / units can be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0089] The controller may include, but is not limited to, a processor 400 and a memory 401. Those skilled in the art will understand that... Figure 7 This is merely an example of a controller and does not constitute a limitation on the controller. It may include more or fewer components than illustrated, or combine certain components, or different components. For example, the controller may also include input / output devices, network access devices, buses, etc.

[0090] The processor 400 may be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0091] The memory 401 can be an internal storage unit of the controller, such as the controller's hard drive or memory. The memory 401 can also be an external storage device of the controller, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or FlashCard. Furthermore, the memory 401 can include both internal and external storage units of the controller. The memory 401 is used to store the computer program and other programs and data required by the controller. The memory 401 can also be used to temporarily store data that has been output or will be output.

[0092] It should be noted that, for the sake of convenience and brevity, the structure of the controller described above can also be referred to the specific description of the structure in the method embodiment, which will not be repeated here.

[0093] Specifically, Figure 8This application illustrates a glue removal device, comprising: a processing platform 10, a contour detection sensor 20, a glue removal laser 30, and a controller 40. The processing platform 10, the contour detection sensor 20, and the glue removal laser 30 are all connected to the controller 40.

[0094] The processing platform 10 is used to support the circuit board to be processed;

[0095] The contour detection sensor 20 is used to collect contour information of the circuit board to be processed;

[0096] The controller 40 is used to control the adhesive removal laser 30 to perform laser adhesive removal operation on the circuit board to be processed based on the adhesive removal method provided in this application.

[0097] Specifically, the adhesive removal laser 30 emits a laser beam to the area of ​​excess adhesive on the circuit board to be processed, using the energy contained in the laser beam to remove the adhesive. When the laser beam emitted by the adhesive removal laser 30 irradiates the area of ​​excess adhesive, the adhesive can be removed from the circuit board to be processed.

[0098] In some embodiments of this application, a beam deflection mechanism may be provided between the adhesive removal laser 30 and the circuit board to be processed, for guiding the laser beam to the processing position on the circuit board. This beam deflection mechanism may be a galvanometer. In embodiments of this application, the beam deflection mechanism preferably has a large scanning range. For example, when the pressing area is 500mm × 500mm (the length of one side can be expanded to 400mm-600mm), the scanning range of the beam deflection mechanism can be 0-75mm × 75mm, and in practical applications, 65mm × 65mm can be used.

[0099] In some embodiments of this application, the adhesive removal equipment may further include a positioning device connected to the controller 40. Further, the positioning device may be fixed in a relative position to the contour detection sensor 20 to assist the contour detection sensor 20 in height detection, and may also be used to determine the excess adhesive area of ​​the circuit board to be processed, facilitating the lamination and adhesive removal processes of the circuit board. For example, the positioning device may be a camera.

[0100] This application can also provide a circuit board processing system, which may include a laminating device and the adhesive removal device described in the foregoing embodiments. The laminating device is used to laminate the circuit board to be processed, pressing the raw materials of the circuit board, such as copper foil and carrier board, to form excess adhesive around the periphery of the circuit board to be processed. The adhesive removal device then performs laser adhesive removal on the circuit board to be processed. The laminating device can then re-laminate the circuit board to be processed after adhesive removal, or perform other processing steps.

[0101] It is understood that a circuit board processing system may include an independent processor that can coordinate the laminating equipment and the adhesive removal equipment within the system; alternatively, the controller in the adhesive removal equipment can serve as the overall controller for the circuit board processing system, enabling unified control of both the laminating and adhesive removal equipment. Optionally, the controller may be, but is not limited to, various personal computers, laptops, smartphones, and tablets.

[0102] In one embodiment, this application also describes a circuit board that can be processed based on the circuit board processing system described in the foregoing embodiments. The circuit board has accurate glue removal in the lamination process, which improves the lamination quality and thus enhances the performance of the circuit board.

[0103] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0104] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0105] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for various specific applications, but such implementations should not be considered beyond the scope of this application.

[0106] In the embodiments provided in this application, it should be understood that the disclosed devices / controllers / systems and methods can be implemented in other ways. For example, the device / controller / system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0107] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected based on actual needs to achieve the purpose of this embodiment.

[0108] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0109] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed based on the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, based on legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0110] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for removing adhesive from circuit boards, characterized in that, include: After laminating polymer materials onto the circuit board to be processed, the contour information of the glue overflow area on the circuit board to be processed is detected. The contour information includes the global glue overflow width, which includes the glue overflow width at each position in the glue overflow area. The glue overflow area is divided into one or more sub-scanning areas, and a laser scanning path corresponding to the sub-scanning area is generated according to the local glue overflow width of the glue overflow area in each sub-scanning area, so as to obtain a laser scanning pattern composed of each sub-scanning area. The local glue overflow width includes the glue overflow width of the glue overflow area at each position in the corresponding sub-scanning area. Based on the laser scan pattern, a laser adhesive removal operation is performed on the area of ​​excess adhesive.

2. The method for removing adhesive from circuit boards as described in claim 1, characterized in that, The step of generating a laser scanning path corresponding to each sub-scanning area based on the local glue overflow width of the glue overflow area in each sub-scanning area includes: Determine the direction of the long side of each sub-scan region; Based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning, a laser scanning path is determined that corresponds to the sub-scanning area and scans along the long side of the sub-scanning area.

3. The method for removing adhesive from circuit boards as described in claim 2, characterized in that, The step of determining the laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area based on the local glue overflow width within each sub-scanning area and the spot size during laser scanning includes: Determine the distribution location of local adhesive overflow areas within each sub-scanning area on the circuit board to be processed; If the distribution location is the corner of the circuit board to be processed, the local glue overflow area in the sub-scanning area is divided into two sub-regions along the extension line of one side of the pressing area. Based on the local glue overflow width of each sub-region and the spot size, a sub-scanning path corresponding to the sub-region and scanning along the long side of the sub-region is determined. The sub-scanning paths of each sub-region in the same sub-scanning area are combined to obtain the laser scanning path corresponding to the sub-scanning area. If the distribution location is a non-corner location of the circuit board to be processed, then based on the local overflow width of the adhesive in each sub-scanning area and the size of the light spot, a laser scanning path corresponding to the sub-scanning area and scanning along the long side of the sub-scanning area is determined.

4. The method for removing adhesive from circuit boards as described in claim 2, characterized in that, Determining the direction of the long side of each sub-scan region includes: Determine the distribution location of local adhesive overflow areas within each sub-scanning area on the circuit board to be processed; If the distribution location is a non-corner location of the circuit board to be processed, then the long side direction of each sub-scanning area is determined according to the long side extension direction of the circumscribed rectangle of the local glue overflow area in each sub-scanning area; If the distribution location is the corner of the circuit board to be processed, then with the goal of minimizing the number of scanning paths within the sub-scanning area, the local glue overflow area is divided into two sub-regions along the extension line of one side of the pressing area. The direction of the long side of each sub-region is determined according to the extension direction of the long side of the circumscribed rectangle of the local glue overflow area within each sub-region.

5. The method for removing adhesive from circuit boards as described in any one of claims 1-4, characterized in that, The contour information includes the global glue overflow thickness, which includes the glue overflow thickness at each location in the glue overflow area; The circuit board adhesive removal method further includes: determining the laser scanning power corresponding to the sub-scanning area based on the local adhesive overflow thickness of the overflow area in each sub-scanning area; The step of performing laser adhesive removal on the overflow area according to the laser scanning pattern includes: performing laser adhesive removal on the overflow area in each sub-scanning area according to the corresponding laser scanning power.

6. The method for removing adhesive from circuit boards as described in any one of claims 1-4, characterized in that, Each of the sub-scanning regions is arranged adjacently to form a region array distributed in a ring along the outer periphery of the pressing region; The step of dividing the overflow area into one or more sub-scanning areas includes: Align one side of the region array with one side of the rectangle circumscribed by the glue overflow region to divide the glue overflow region into one or more sub-scanning regions. Alternatively, with the goal of minimizing the local glue overflow width variation within each sub-scanning region, the glue overflow region can be divided into one or more sub-scanning regions; Alternatively, the center position of the starting sub-scanning region in the region array can be set relative to a preset target point on the circuit board to be processed according to a preset relative positional relationship, so as to divide the glue overflow area into one or more sub-scanning regions.

7. The method for removing adhesive from circuit boards as described in any one of claims 1-4, characterized in that, The step of performing laser adhesive removal on the overflow area based on the laser scan pattern includes: According to the distribution order of each sub-scanning area in the preset direction, laser adhesive removal operation is performed on the local overflow areas in each sub-scanning area in turn; Alternatively, the sub-scanning areas can be sorted according to the maximum glue overflow thickness or the maximum glue overflow width, and laser glue removal operations can be performed on the local glue overflow areas within each sub-scanning area in the sorting order.

8. The method for removing adhesive from circuit boards as described in any one of claims 1-4, characterized in that, The detection of the contour information of the adhesive overflow area on the circuit board to be processed includes: During the target localization process, the contour detection sensor is controlled to scan the circuit board to be processed to obtain the contour information.

9. A controller comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the circuit board adhesive removal method as described in any one of claims 1 to 8.

10. A glue removal device, characterized in that, include: The system includes a processing platform, a contour detection sensor, a glue removal laser, and a controller, wherein the processing platform, the contour detection sensor, and the glue removal laser are all connected to the controller. The processing platform is used to support the circuit boards to be processed. The contour detection sensor is used to collect the contour information of the circuit board to be processed; The controller is used to control the adhesive removal laser to perform laser adhesive removal on the circuit board to be processed based on the method described in any one of claims 1 to 8.

11. A circuit board processing system, characterized in that, The circuit board processing system includes a laminating device and the adhesive removal device as described in claim 10; The pressing equipment is used to press the circuit board to be processed, so that there is excess glue around the circuit board to be processed; The adhesive removal equipment is used to perform laser adhesive removal on the circuit board to be processed based on the method described in any one of claims 1 to 8.

12. A circuit board, characterized in that, The circuit board is processed using the circuit board processing system as described in claim 11.

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