Thick copper PCB (Printed Circuit Board) laminating equipment and process for curing resin through gradient heating

Abstract

The invention relates to the technical field of circuit board laminating equipment, in particular to thick copper PCB laminating equipment and process for curing resin through gradient heating. According to the technical scheme, the device comprises a box body, a guide plate is fixedly connected to one side of the box body, a first sealing door is arranged in the guide plate, the two sides of the box body are sealed through a sealing assembly, then a push plate and multiple sets of extrusion plates are pushed through a first hydraulic rod to jack up, raw materials of a PCB are heated, and therefore the PCB can be heated, and the production efficiency is improved. When the PCB is extruded, the heating is stopped and the temperature required by slow cooling is set until the prepreg of the gradient heating curing resin material is melted, at the moment, the extrusion force can be uniformly dispersed and the heat is uniformly distributed on the extrusion plate through the stabilizing assembly, so that the stress on the PCB during extrusion is reduced, and after the prepreg and other materials of the PCB are mutually fused, the heating can be stopped and the temperature required by slow cooling is set, so that the PCB can be continuously extruded. The PCB is cooled slowly, and the problem that the PCB is affected by stress during lamination processing is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board laminating equipment, and particularly relates to a thick copper PCB board laminating equipment for gradient temperature curing resin and a process. BACKGROUND

[0002] The gradient temperature curing resin is a kind of resin which needs to be cured by gradually increasing the temperature to obtain good performance. In a low temperature state, part of the active groups begin to react slowly. With the increase of temperature, more active groups are activated, the reaction rate is accelerated, and the molecular chain is continuously crosslinked and grown, and finally a three-dimensional network structure is formed to realize curing. Therefore, the gradient temperature curing resin is usually used as a prepreg for PCB processing. The prepreg is fused in the PCB by the laminating equipment to increase the performance of the PCB.

[0003] In the prior art, the PCB is heated during the laminating process. During the heating process, the PCB is composed of a substrate, a copper foil and a prepreg, and the thermal expansion coefficients, thermal conductivities and elastic moduli of different materials are significantly different. Therefore, local stress is generated during the pressing process, and the stress causes damage to the multi-layer structure of the PCB, affecting the quality of the PCB. Therefore, the present application provides a thick copper PCB board laminating equipment for gradient temperature curing resin and a process. SUMMARY

[0004] The purpose of the present application is to solve the problem that the PCB is affected by stress during the laminating process.

[0005] In a first aspect, the present application provides a thick copper PCB board laminating equipment for gradient temperature curing resin, comprising a box body, a guide plate is fixed on one side of the box body, a first closing door is arranged in the inside of the guide plate, a side shell is fixed on the other side of the box body, a first hydraulic rod is fixed on the bottom of the inner wall of the box body, a bottom plate is fixed on the inner wall of the box body, a round rod is fixed on the top end of the bottom plate, a plurality of extrusion plates are slidably connected to the outer wall of the round rod, a push plate is fixed on the output end of the first hydraulic rod, the push plate is fixed on the bottom of the plurality of extrusion plates, and the equipment further comprises a stable assembly, a closing assembly, a cleaning assembly and a fixing assembly. The stable assembly is used to protect the surface of the PCB during the laminating process to prevent the thermal stress from affecting the PCB. The closing assembly is used to close the two sides of the box body, and the closing assembly comprises a guide plate, which is arranged on the side of the box body away from the side shell, and a first closing door is slidably connected to the inner wall of the guide plate. The cleaning assembly is used to clean the resin residues and carbon deposits remaining on the extrusion plates. The fixing component is used to seal and fix the first closed door.

[0006] Optionally, the stabilizing component includes a pressure equalizing plate fixed to the bottom of the extrusion plate, a heat spreader fixed to the bottom of the pressure equalizing plate, multiple sets of circular holes opened at the bottom of the pressure equalizing plate, a connecting block fixed to the top of the heat spreader, the connecting block passing through the circular holes and connecting to the extrusion plate, and a buffer plate fixed to the bottom of the heat spreader, the buffer plate being made of silicone. Two sets of the stabilizing component are provided and symmetrically distributed at the top and bottom of the extrusion plate.

[0007] Optionally, the sealing assembly further includes a sealing gasket, which is fixed to the outer wall of the first sealing door. A connecting rod is fixed to the top of one side of the first sealing door. Two sets of connecting rods are provided and symmetrically distributed on one side of the first sealing door. The two sets of connecting rods are provided on both sides of the extrusion plate. One end of the two sets of connecting rods is fixed to a second sealing door, which is located at the connection between the housing and the side shell.

[0008] Optionally, the cleaning assembly includes a second hydraulic rod fixed to the inner wall of the side shell. The output end of the second hydraulic rod is fixed to a frame plate. A conveyor belt is installed inside the frame plate. Multiple sets of conveyor belts are arranged in parallel inside the frame plate. A connecting frame is installed between the multiple sets of conveyor belts. The height of the conveyor belt is less than the height between two sets of extrusion plates. Multiple sets of scrapers are fixed to the outer wall of the conveyor belt.

[0009] Optionally, the cleaning assembly further includes a short tube fixed to one side of the connecting frame. The outer wall of the connecting frame is provided with multiple sets of round holes. One side of the short tube penetrates the frame plate. A telescopic tube is fixed to the side of the short tube away from the connecting frame. A connecting tube is fixed to one end of the telescopic tube. One end of the connecting tube extends out of the side shell. An air suction tube is fixed to one end of the connecting tube.

[0010] Optionally, the inner wall of the box is fixedly connected to a side plate, the side plate is located at the bottom of the frame plate, the bottom of the frame plate is rotatably connected to a pulley, and the pulley is slidably connected to the top of the side plate.

[0011] Optionally, a mounting block is fixed to one side of the connecting block, and a horizontal frame is fixed to one side of the mounting block. Long grooves are provided at the top and bottom of the horizontal frame. A spring is fixed to the inner wall of the long groove, and a cleaning plate is fixed to the top of the spring. The cleaning plate is attached to the buffer plate.

[0012] Optionally, the fixing assembly includes a third hydraulic rod, which is fixed to the bottom of one side of the housing. An L-shaped plate is fixed to the output end of the third hydraulic rod, and the L-shaped plate is fixed to one side of the first closed door. A fourth hydraulic rod is fixed to one side of the housing, and a square plate is fixed to the output end of the fourth hydraulic rod. A rotating block is rotatably connected to one side of the square plate, and a fixing plate is fixed to one side of the rotating block. The fixing plate is attached to one side of the first closed door.

[0013] Optionally, a collection box is provided at the bottom of the inner wall of the side shell, a buckle groove is provided on one side of the collection box, and a sealing plate is rotatably connected to the bottom of one side of the side shell via a rotating shaft.

[0014] Secondly, a thick copper PCB board lamination process using gradient temperature curing resin is applied to the PCB board lamination equipment described in the first aspect. This process includes the following steps: S1. The etched inner core board is browned to create a micro-rough structure on the copper surface, thereby enhancing the bonding force with the prepreg. The prepreg is then cut to the design size to facilitate its integration onto the circuit board. S2. According to the design requirements, the inner core board, prepreg, copper foil, etc. are stacked in sequence. The positioning pins are used to precisely align each layer. The stacked board is transported until the stacked material is placed on the extrusion plate of the box. The first hydraulic rod pushes the extrusion plate upward to apply pressure to the inside of the board. S3. Start the equipment to preheat, gradually raising the temperature from room temperature to 50-140℃. The heat is evenly transferred to the board through the copper heat spreader, allowing the prepreg to be heated evenly, so that the resin can evenly wet the copper surface. Then continue to raise the temperature to make the resin flow reach its peak, which can fully fill the gaps in the circuit. S4. The pressure is evenly distributed on the PCB board by the pressure equalizing plate, so that the prepreg on the PCB board flows evenly on the PCB board, promoting the full fusion of the prepreg and the PCB board. The resin is cured by applying pressure, and then the temperature is slowly reduced by gradient cooling to prevent the PCB board from warping and deforming. After cooling is completed, the PCB board is removed.

[0015] Compared with the prior art, this application includes at least one of the following beneficial technical effects: This invention seals both sides of the housing using a sealing assembly and fixes both sides of the first sealing door using a fixing assembly. Then, a first hydraulic rod pushes a push plate upwards, which in turn lifts multiple extrusion plates and heats the PCB material until the prepreg of the gradient-curing resin melts. At this point, a stabilizing assembly evenly distributes the extrusion pressure and heat across the extrusion plates, reducing the stress on the PCB during extrusion. After the prepreg and other PCB materials have fused together, heating can be stopped, and a slow-cooling temperature can be set to allow the PCB to cool slowly, thus solving the problem of stress affecting the PCB during lamination. Attached Figure Description

[0016] Figure 1 A schematic diagram of the overall structure of a thick copper PCB lamination equipment and process for gradient temperature curing resin; Figure 2 A schematic cross-sectional view of a thick copper PCB lamination equipment and process for gradient temperature curing resin. Figure 3 for Figure 2 An enlarged structural diagram at point A; Figure 4 for Figure 2 An enlarged structural diagram at point B; Figure 5 for Figure 4 An enlarged structural diagram at point C; Figure 6 This is a schematic diagram of the base plate and the round rod structure; Figure 7 This is a schematic diagram of the stable component structure; Figure 8 This is a schematic diagram of a closed component structure; Figure 9 To clean up the component structure diagram; Figure 10 for Figure 9 An enlarged structural diagram at point D; Figure 11 This is a schematic diagram of the frame plate structure.

[0017] Reference numerals: 1. Box body; 2. First closed door; 3. Side shell; 4. First hydraulic rod; 5. Base plate; 6. Round rod; 7. Extrusion plate; 8. Guide plate; 9. Pressure equalizing plate; 10. Heat equalizing plate; 11. Connecting block; 12. Buffer plate; 13. Sealing gasket; 14. Connecting rod; 15. Second closed door; 16. Second hydraulic rod; 17. Frame plate; 18. Conveyor belt; 19. Scraper; 20. Connecting frame; 21. Short pipe; 22. Telescopic pipe; 23. Connecting pipe; 24. Suction pipe; 25. Side plate; 26. Pulley; 27. Mounting block; 28. Horizontal frame; 29. ​​Spring; 30. Cleaning plate; 31. Third hydraulic rod; 32. L-shaped plate; 33. Fourth hydraulic rod; 34. Rotating block; 35. Fixing plate; 36. Collection box; 37. Sealing plate; 38. Socket. Detailed Implementation

[0018] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] like Figure 1 , Figure 2 and Figure 6 As shown, the present invention proposes a thick copper PCB board laminating device for gradient temperature curing resin, comprising a housing 1, a guide plate 8 fixedly connected to one side of the housing 1, a first sealing door 2 provided inside the guide plate 8, the guide plate 8 being used to limit the first sealing door 2, a side shell 3 fixedly connected to the other side of the housing 1, the side shell 3 being used to install cleaning components, a first hydraulic rod 4 fixedly connected to the bottom of the inner wall of the housing 1, a bottom plate 5 fixedly connected to the inner wall of the housing 1, the bottom plate 5 being used to install a round rod 6, a round rod 6 fixedly connected to the top of the bottom plate 5, an extrusion plate 7 slidably connected to the outer wall of the round rod 6, the extrusion plate 7 being used to perform lamination processing on the PCB board, a push plate fixedly connected to the output end of the first hydraulic rod 4, the push plate being fixedly connected to the bottom of a set of extrusion plates 7, the push plate being used to push the extrusion plates 7.

[0020] It should be noted that, as Figure 3 , Figure 6 and Figure 7As shown, the stabilizing component of the PCB lamination equipment is used to protect the surface of the PCB board during lamination processing, preventing thermal stress from affecting the PCB board. The stabilizing component includes a pressure equalizing plate 9, which is fixed to the bottom of the extrusion plate 7. When the prepreg melts and fills, the pressure equalizing plate 9 can evenly distribute the pressure onto the PCB board, allowing the prepreg to flow evenly on the PCB board and promoting full fusion between the prepreg and the PCB board. A heat spreader 10 is fixed to the bottom of the pressure equalizing plate 9. When heating the prepreg, the copper heat spreader 10 can evenly transfer heat to the PCB board, ensuring that the prepreg is heated evenly. The bottom of the pressure equalizing plate 9 has multiple sets of circular holes. The top of the heat spreader 10 is fixed with a connecting block 11. The connecting block 11 passes through the circular holes and is connected to the extrusion plate 7. The multiple sets of connecting blocks 11 are also made of copper, which can improve heat conduction. The bottom of the heat spreader 10 is fixed with a buffer plate 12. The buffer plate 12 is made of silicone. When the first hydraulic rod 4 pushes the push plate and the multiple sets of extrusion plates 7 to move upward, the buffer plate 12 will contact the PCB board first. The pressure of the protruding part on the PCB board is evenly transferred to the extrusion plate 7 through the flexible buffer plate 12. Two sets of the stabilizing components are provided and are symmetrically distributed on the top and bottom of the extrusion plate 7.

[0021] Furthermore, such as Figure 1 and Figure 8 As shown, the sealing assembly of the PCB board laminating equipment is used to seal both sides of the housing 1. The sealing assembly includes a guide plate 8, which is disposed on the side of the housing 1 away from the side shell 3. A first sealing door 2 is slidably connected to the inner wall of the guide plate 8. When it is necessary to seal both sides of the housing 1, the first sealing door 2 can be pushed upward by the fixing assembly, so that the first sealing door 2 slides within the guide plate 8 and moves to the opening on one side of the housing 1, thereby sealing one side of the housing 1. The sealing assembly also includes a sealing gasket 13. The sealing gasket 13 disposed on the outer wall of the first sealing door 2 can improve the sealing effect. The sealing gasket 13 is fixed to the first sealing door 3. The outer wall of a closed door 2 has a connecting rod 14 fixedly connected to the top of one side of the first closed door 2. There are two sets of connecting rods 14, which are symmetrically distributed on one side of the first closed door 2. When the first closed door 2 moves upward, it will drive the two sets of connecting rods 14 on one side to move together. The two sets of connecting rods 14 are located on both sides of the extrusion plate 7. One end of the two sets of connecting rods 14 is fixedly connected to a second closed door 15. The second closed door 15 is located at the connection between the box body 1 and the side shell 3. When the connecting rod 14 moves, it will drive the second closed door 15 to move upward, thereby simultaneously sealing both sides of the box body 1, which facilitates the sealing effect for PCB board processing.

[0022] In this embodiment, as Figure 4 , Figure 9 ,Figure 10 and Figure 11 As shown, the cleaning component of the PCB board laminating equipment is used to clean the residual resin residue and carbon deposits on the extrusion plates 7. The cleaning component includes a second hydraulic rod 16, which is fixed to the inner wall of the side shell 3. The output end of the second hydraulic rod 16 is fixed to a frame plate 17. After the PCB board is processed, the first hydraulic rod 4 can be retracted to reset the multiple sets of extrusion plates 7 downwards, and the processed PCB board can be removed. At this time, the second hydraulic rod 16 can be activated to push the frame plate 17 into the housing 1. A conveyor belt 18 is installed inside the frame plate 17. Multiple sets of conveyor belts 18 are arranged in parallel inside the frame plate 17. A connecting frame 20 is installed between the multiple sets of conveyor belts 18. The height of the conveyor belt 18 is less than the height between two sets of extrusion plates 7. Multiple sets of... The scraper 19, when the frame plate 17 moves, will drive multiple sets of conveyor belts 18 inside to move together and start the conveyor belts 18, so that the conveyor belts 18 drive multiple sets of scrapers 19 to move. When the scraper 19 contacts the flexible buffer plate 12, it can scrape off the residual resin residue and carbon deposits on the buffer plate 12 to prevent the residue on the buffer plate 12 from affecting the next processing. The inner wall of the box 1 is fixed with a side plate 25. The side plate 25 is set at the bottom of the frame plate 17. By setting the side plate 25 inside the box 1, the bottom of the frame plate 17 can be easily supported by the side plate 25 when the frame plate 17 moves into the box 1. The bottom of the frame plate 17 is rotatably connected to a pulley 26. The pulley 26 is slidably connected to the top of the side plate 25. When the frame plate 17 slides, it can drive the pulley 26 to move together, and the pulley 26 can make the frame plate 17 move more smoothly.

[0023] In this process, such as Figure 4 , Figure 5 , Figure 9 and Figure 11As shown, the cleaning assembly also includes a short pipe 21, which is fixed to one side of the connecting frame 20. The outer wall of the connecting frame 20 has multiple sets of round holes for sucking away residue. One side of the short pipe 21 penetrates the frame plate 17. A telescopic pipe 22 is fixed to the side of the short pipe 21 away from the connecting frame 20. One end of the telescopic pipe 22 is fixed to a connecting pipe 23. When the frame plate 17 moves into the housing 1, it stretches the telescopic pipe 22, maintaining the connection between the connecting pipe 23 and the short pipe 21. Simultaneously, the connecting frame 20 moves together between the two sets of extrusion plates 7. One end of the connecting pipe 23 extends out of the side shell 3. One end of the connecting pipe 23 is fixedly connected to a suction pipe 24. When multiple sets of scrapers 19 scrape away resin residue and carbon deposits, a fan connected externally to the suction pipe 24 can be activated. The fan generates suction inside the suction pipe 24, connecting pipe 23, telescopic pipe 22, short pipe 21, and connecting frame 20. Since the connecting frame 20 has multiple sets of round holes, resin residue and carbon deposits can be sucked into the connecting frame 20 through these holes when scraped off by the scrapers 19. The residue is then collected in a designated container via the suction pipe. One side of the connecting block 11 is fixedly connected to... A mounting block 27 is attached, and a horizontal frame 28 is fixed to one side of the mounting block 27. The top and bottom of the horizontal frame 28 are both provided with elongated grooves. A spring 29 is fixed to the inner wall of the elongated groove, and a cleaning plate 30 is fixed to the top of the spring 29. The cleaning plate 30 is attached to the buffer plate 12. When the frame plate 17 moves between the buffer pads of the two sets of pressing plates 7, the spring 29 can push the cleaning plate 30 out of the elongated groove. The brush at the end of the cleaning plate 30 connects to the two sets of buffer pads. Therefore, when the frame plate 17 moves into the housing 1, the cleaning plate 30 can push the scraped impurities towards one side. The side is pushed out into the box 1, and when the frame plate 17 moves into the side shell 3, the scraped impurities can be brought into the inner wall of the side shell 3 by the two sets of cleaning plates 30. A collection box 36 is provided at the bottom of the inner wall of the side shell 3. By providing a collection box 36 at the bottom of the side shell 3, the impurities scraped off by the cleaning plates 30 can be collected. A buckle groove 38 is provided on one side of the collection box 36. A sealing plate 37 is rotatably connected to the bottom of one side of the side shell 3 through a pivot. The collection box 36 can be taken out for cleaning by flipping the sealing plate 37. The buckle groove 38 provided on the collection box 36 makes it easy to take out the collection box 36.

[0024] Furthermore, such as Figure 1As shown, the fixing assembly of the PCB board laminating equipment is used to seal and fix the first sealing door 2. The fixing assembly includes a third hydraulic rod 31, which is fixed to the bottom of one side of the housing 1. An L-shaped plate 32 is fixed to the output end of the third hydraulic rod 31. The L-shaped plate 32 is fixed to one side of the first sealing door 2. When it is necessary to close both sides of the housing 1, the third hydraulic rod 31 can be activated to push the first sealing door 2 upward until one side of the housing 1 is closed. A fourth hydraulic rod 33 is fixed to one side of the housing 1. The output end of the fourth hydraulic rod 33 is fixedly connected to a square plate. A rotating block 34 is rotatably connected to one side of the square plate. A fixing plate 35 is fixedly connected to one side of the rotating block 34. By rotating the rotating block 34, the side of the rotating block 34 with the fixing plate 35 rotates to the side of the first closed door 2. The fixing plate 35 is attached to the side of the first closed door 2. Then the fourth hydraulic rod 33 can be retracted. The retraction of the fourth hydraulic rod 33 drives the fixing plate 35 to move to one side, so that the fixing plate 35 applies a pushing force to one side to the first closed door 2, maintaining the seal between the first closed door 2 and one side of the box body 1.

[0025] A gradient temperature curing resin lamination process for thick copper PCB boards, applied to the aforementioned gradient temperature curing resin lamination equipment, includes the following steps: S1. The etched inner core board is browned to create a micro-rough structure on the copper surface, thereby enhancing the bonding force with the prepreg. The prepreg is then cut to the design size to facilitate its integration onto the circuit board. S2. According to the design requirements, the inner core board, prepreg, copper foil, etc. are stacked in sequence. The positioning pins are used to precisely align each layer. The stacked board is transported until the stacked material is placed on the extrusion plate 7 of the box 1. The extrusion plate 7 is pushed upward by the first hydraulic rod 4 to apply pressure to the inside of the board. S3. Start the equipment to preheat, gradually raising the temperature from room temperature to 50-140℃. The heat is evenly transferred to the board through the copper heat spreader 10, allowing the prepreg to be heated evenly, so that the resin can evenly wet the copper surface. Then continue to raise the temperature to make the resin flow reach its peak, which can fully fill the gaps in the circuit. S4. The pressure is evenly distributed on the PCB board through the equalizing plate 9, so that the prepreg on the PCB board flows evenly on the PCB board, promoting the full fusion of the prepreg and the PCB board. The resin is cured by applying pressure, and then the temperature is slowly reduced by gradient cooling to prevent the PCB board from warping and deforming. After cooling is completed, the PCB board is removed.

[0026] Working Principle: To address the stress issues affecting PCB boards during lamination, the PCB materials are first stacked according to requirements and transported between two sets of extrusion plates 7. After the raw materials are placed, the third hydraulic rod 31 is activated, pushing the first sealing door 2 upwards. The guide plate 8 limits the first sealing door 2 until it moves to the opening on one side of the housing 1, thus sealing one side of the housing 1. The sealing gasket 13 on the outer wall of the first sealing door 2 improves the sealing effect. When the closed door 2 moves upward, it will drive the two sets of connecting rods 14 on one side to move together. When the connecting rods 14 move, they will drive the second closed door 15 to move upward, so that both sides of the box 1 can be closed at the same time, which will facilitate the sealing effect for PCB board processing. Then, the rotating block 34 can be rotated so that the side of the rotating block 34 with the fixing plate 35 rotates to the side of the first closed door 2. Then, the fourth hydraulic rod 33 can be retracted. The retraction of the fourth hydraulic rod 33 will drive the fixing plate 35 to move to one side, so that the fixing plate 35 applies a pushing force to one side to the first closed door 2, maintaining the seal between the first closed door 2 and one side of the box 1. Subsequently, the first hydraulic rod 4 pushes the push plate upward, and as the push plate moves upward, it lifts up multiple sets of extrusion plates 7. When the first hydraulic rod 4 pushes the push plate and multiple sets of extrusion plates 7 upward, the buffer plate 12 will first contact the PCB board. The flexible buffer plate 12 will evenly transfer the pressure of the protruding part on the PCB board to the extrusion plate 7 and heat the raw material of the PCB board. When heating the prepreg, the heat can be evenly transferred to the PCB board through the copper heat spreader 10, so that the prepreg is evenly heated. The multiple sets of connecting blocks 11 are also made of copper, which can improve the heat conduction until the prepreg of the gradient temperature curing resin material melts. When the prepreg melts and fills, the pressure can be evenly distributed on the PCB board through the pressure equalizing plate 9, so that the prepreg on the PCB board flows evenly on the PCB board, promoting the full fusion of the prepreg and the PCB board. After the prepreg and other materials of the PCB board have fused together, the heating can be stopped, and the temperature required for slow cooling can be set to allow the PCB board to cool slowly. After cooling is complete, the PCB board can be removed.

[0027] By providing a side plate 25 inside the housing 1, the bottom of the frame plate 17 can be easily supported when it moves into the housing 1. When the frame plate 17 slides, it can drive the pulley 26 to move together, which facilitates smoother movement of the frame plate 17. After the cooled PCB board is removed, the first hydraulic rod 4 can be retracted, causing the multiple sets of pressing plates 7 to return to their downward position, and the processed PCB board can be removed. At this time, the second hydraulic rod 16 can be activated to... The frame plate 17 is pushed into the housing 1. As the frame plate 17 moves into the housing 1, it stretches the telescopic tube 22, keeping the connecting tube 23 connected to the short tube 21. Simultaneously, the connecting frame 20 moves into the space between the two sets of extrusion plates 7. The movement of the frame plate 17 drives multiple sets of conveyor belts 18 to move together, activating the conveyor belts 18 and causing multiple sets of scrapers 19 to move. When the scrapers 19 contact the flexible buffer plate 12, they can remove residual resin residue from the buffer plate 12. Carbon deposits are scraped off to prevent residues on the buffer plate 12 from affecting subsequent processing. When the frame plate 17 moves between the buffer pads of the two sets of extrusion plates 7, the cleaning plate 30 can be pushed out of the long groove by the spring 29. The brush plate at the end of the cleaning plate 30 is connected to the two sets of buffer pads. Therefore, when the frame plate 17 moves into the housing 1, the scraped impurities can be pushed to one side into the housing 1 by the cleaning plate 30. When the multiple sets of scrapers 19 scrape off resin residue and carbon deposits, the air supply connected to the external suction pipe 24 can be activated. The machine uses a fan to generate suction inside the suction pipe 24, connecting pipe 23, telescopic pipe 22, short pipe 21, and connecting frame 20. Since the connecting frame 20 is provided with multiple sets of round holes, resin residue and carbon deposits can be sucked into the connecting frame 20 through the round holes when scraped off by the scraper 19. The residues are then sucked into a designated container for collection through the suction pipe. When the frame plate 17 moves into the side shell 3, the scraped impurities can be carried into the inner wall of the side shell 3 by the two sets of cleaning plates 30 and collected by the collection box 36.

[0028] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A thick copper PCB board laminating device for gradient temperature curing resin, comprising a housing (1), a guide plate (8) fixedly connected to one side of the housing (1), a first closed door (2) provided inside the guide plate (8), a side shell (3) fixedly connected to the other side of the housing (1), a first hydraulic rod (4) fixedly connected to the bottom of the inner wall of the housing (1), a bottom plate (5) fixedly connected to the inner wall of the housing (1), a round rod (6) fixedly connected to the top of the bottom plate (5), an extrusion plate (7) slidably connected to the outer wall of the round rod (6), a push plate fixedly connected to the output end of the first hydraulic rod (4), the push plate being fixedly connected to the bottom of a set of extrusion plates (7), characterized in that: It also includes stabilizing components, sealing components, cleaning components, and fixing components; The stabilizing component is used to protect the surface of the PCB board during lamination to prevent thermal stress from affecting the PCB board. The closing assembly is used to close both sides of the box (1). The closing assembly includes a guide plate (8), which is located on the side of the box (1) away from the side shell (3). The inner wall of the guide plate (8) is slidably connected to a first closing door (2). The cleaning assembly is used to clean the resin residue and carbon deposits remaining on the extrusion plate (7); The fixing component is used to seal and fix the first closed door (2).

2. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 1, characterized in that, The stabilizing component includes a pressure equalizing plate (9), which is fixed to the bottom of the extrusion plate (7). A heat equalizing plate (10) is fixed to the bottom of the pressure equalizing plate (9). Multiple sets of circular holes are opened at the bottom of the pressure equalizing plate (9). A connecting block (11) is fixed to the top of the heat equalizing plate (10). The connecting block (11) passes through the circular holes and is connected to the extrusion plate (7). A buffer plate (12) is fixed to the bottom of the heat equalizing plate (10). The buffer plate (12) is made of silicone. Two sets of the stabilizing component are provided and are symmetrically distributed at the top and bottom of the extrusion plate (7).

3. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 2, characterized in that, The sealing assembly also includes a sealing gasket (13), which is fixed to the outer wall of the first sealing door (2). A connecting rod (14) is fixed to the top of one side of the first sealing door (2). Two sets of the connecting rod (14) are provided and are symmetrically distributed on one side of the first sealing door (2). The two sets of the connecting rod (14) are provided on both sides of the extrusion plate (7). One end of the two sets of the connecting rod (14) is fixed to a second sealing door (15). The second sealing door (15) is provided at the connection between the box body (1) and the side shell (3).

4. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 3, characterized in that, The cleaning assembly includes a second hydraulic rod (16), which is fixed to the inner wall of the side shell (3). The output end of the second hydraulic rod (16) is fixed to a frame plate (17). A conveyor belt (18) is installed inside the frame plate (17). Multiple sets of the conveyor belt (18) are arranged in parallel inside the frame plate (17). A connecting frame (20) is installed between the multiple sets of conveyor belts (18). The height of the conveyor belt (18) is less than the height between the two sets of extrusion plates (7). Multiple sets of scrapers (19) are fixed to the outer wall of the conveyor belt (18).

5. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 4, characterized in that, The cleaning assembly also includes a short tube (21), which is fixed to one side of the connecting frame (20). The outer wall of the connecting frame (20) is provided with multiple sets of round holes. One side of the short tube (21) penetrates the frame plate (17). A telescopic tube (22) is fixed to the side of the short tube (21) away from the connecting frame (20). A connecting tube (23) is fixed to one end of the telescopic tube (22). One end of the connecting tube (23) extends out of the side shell (3). An air suction tube (24) is fixed to one end of the connecting tube (23).

6. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 5, characterized in that, The inner wall of the box (1) is fixed with a side plate (25), the side plate (25) is located at the bottom of the frame plate (17), and the bottom of the frame plate (17) is rotatably connected with a pulley (26), the pulley (26) is slidably connected to the top of the side plate (25).

7. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 6, characterized in that, A mounting block (27) is fixed to one side of the connecting block (11), and a horizontal frame (28) is fixed to one side of the mounting block (27). Long grooves are provided at the top and bottom of the horizontal frame (28). A spring (29) is fixed to the inner wall of the long groove. A cleaning plate (30) is fixed to the top of the spring (29). The cleaning plate (30) is attached to the buffer plate (12).

8. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 7, characterized in that, The fixing assembly includes a third hydraulic rod (31), which is fixed to the bottom of one side of the housing (1). An L-shaped plate (32) is fixed to the output end of the third hydraulic rod (31). The L-shaped plate (32) is fixed to one side of the first closed door (2). A fourth hydraulic rod (33) is fixed to one side of the housing (1). A square plate is fixed to the output end of the fourth hydraulic rod (33). A rotating block (34) is rotatably connected to one side of the square plate. A fixing plate (35) is fixed to one side of the rotating block (34). The fixing plate (35) is attached to one side of the first closed door (2).

9. The thick copper PCB board laminating equipment for gradient temperature curing resin according to claim 8, characterized in that, A collection box (36) is provided at the bottom of the inner wall of the side shell (3). A buckle groove (38) is provided on one side of the collection box (36). A sealing plate (37) is rotatably connected to the bottom of one side of the side shell (3) via a rotating shaft.

10. A thick copper PCB board lamination process using gradient temperature curing resin, applied to the PCB board lamination equipment described in claim 9, characterized in that, The process includes the following steps: S1. The etched inner core board is browned to create a micro-rough structure on the copper surface, thereby enhancing the bonding force with the prepreg. The prepreg is then cut to the design size to facilitate its integration onto the circuit board. S2. According to the design requirements, the inner core board, prepreg, copper foil, etc. are stacked in sequence. The positioning pins are used to precisely align each layer. The stacked board is transported until the stacked material is placed on the extrusion plate (7) of the box (1). The extrusion plate (7) is pushed upward by the first hydraulic rod (4) to apply pressure to the inside of the board. S3. Start the equipment to preheat, gradually raise the temperature from room temperature to 50-140℃, and transfer the heat evenly to the board through the copper heat spreader (10) so that the prepreg is heated evenly, so that the resin is evenly wetted on the copper surface. Then continue to raise the temperature so that the resin fluidity reaches the peak and can fully fill the line gap. S4. The pressure is evenly distributed on the PCB board by the equalizing plate (9), so that the prepreg on the PCB board flows evenly on the PCB board, so that the prepreg and the PCB board are fully integrated. The resin is cured by applying pressure, and then the temperature is slowly reduced by gradient cooling to prevent the PCB board from warping and deforming. After cooling, the PCB board is removed.

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