Lighting device and headlamp

Abstract

A lighting device according to an embodiment includes: a heat sink including a recessed portion; a circuit board disposed in the recessed portion and having a pad; a light source portion disposed on the heat dissipation plate and including a bonding pad and a light emitting device; a connecting member connecting the pad of the circuit board and the bonding pad of the light source portion to each other; and a sealing portion disposed on the connecting member, in which the sealing portion includes a first sealing portion forming an outer edge and a second sealing portion disposed inside the outer edge, and the first sealing portion and the second sealing portion include the same resin composition.

Description

Technical Field

[0001] The embodiments relate to a lighting device and a headlight having the lighting device. Background Technology

[0002] Lighting applications include automotive lights and backlighting for displays and signage. Compared to conventional light sources such as fluorescent and incandescent lamps, light-emitting devices (such as light-emitting diodes (LEDs)) offer advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These LEDs are used in a variety of display devices and various lighting fixtures, such as indoor or outdoor lights.

[0003] Recently, light-emitting diodes (LEDs) have been proposed as light sources for vehicles. Compared to incandescent bulbs, LEDs have the advantage of lower power consumption. However, because the emission angle of light emitted from LEDs is small, the luminous area of ​​the lamp needs to be increased when LEDs are used as vehicle lights. LEDs offer greater design freedom due to their small size and are also economically advantageous due to their semi-permanent lifespan. However, because the emission angle of light emitted from LEDs is small, the luminous area of ​​the lamp needs to be increased when LEDs are used as vehicle lights. Background technology for lighting devices is disclosed in Korean Patent Publication No. KR10-2023-0010550 (January 19, 2023). Summary of the Invention

[0004] Technical Purpose

[0005] Embodiments of the present invention provide a lighting device with improved reliability. One embodiment provides a headlight having a lighting device.

[0006] Technical solution

[0007] The lighting device according to an embodiment of the present invention includes: a heat sink including a recessed portion; a circuit board disposed in the recessed portion and having pads; a light source portion disposed on the heat sink and including bonding pads and a light-emitting device; a connecting member connecting the pads of the circuit board and the bonding pads of the light source portion; and a sealing portion disposed on the connecting member, wherein the sealing portion includes a first sealing portion forming an outer periphery and a second sealing portion disposed inside the outer periphery, wherein the first sealing portion and the second sealing portion may include the same resin composition.

[0008] According to embodiments of the present invention, the resin composition comprises a base resin and a filler. The base resin comprises oligomers, monomers, and a photoinitiator. The content of the oligomers is 45 wt% to 65 wt% of the total weight of the resin composition, the content of the monomers is 30 wt% to 50 wt% of the total weight of the resin composition, the content of the photoinitiator is 1 wt% to 5 wt% of the total weight of the resin composition, and the content of the filler is 2 wt% to 10 wt% of the total weight of the resin composition. The modulus of the cured resin composition can be in the range of 100 MPa to 8000 MPa. The thixotropic properties of the resin composition before curing can be in the range of 2 to 4. The particle size of the filler can be in the range of 5 μm to 30 μm.

[0009] According to an embodiment of the present invention, the connecting member includes one end connected to a bonding pad of the light source portion, the other end connected to a pad of the circuit board, and a central portion extending from one end toward the other end, wherein the first sealing portion includes a first sealing portion 1-1 disposed near the one end, a first sealing portion 1-2 disposed near the other end, and a first sealing portion 1-3 connecting the first sealing portion 1-1 and the first sealing portion 1-2, wherein the first sealing portion 1-1, the first sealing portion 1-2, and the first sealing portion 1-3 can be integrally formed.

[0010] According to an embodiment of the present invention, the maximum height of the second sealing portion can be in the range of 1 to 5 times greater than the maximum height of the first sealing portion.

[0011] According to an embodiment of the present invention, the maximum height of the first-2 sealing portion can be greater than or equal to the maximum height of the first-1 sealing portion. The maximum height of the first-2 sealing portion can be in the range of 1 to 2.5 times the maximum height of the first-1 sealing portion.

[0012] According to an embodiment of the present invention, the second sealing portion and the connecting member are spaced apart by a first distance, which is defined as the distance between the maximum height of the connecting member and the second sealing portion, and the first distance may be in the range of 100 μm to 200 μm.

[0013] According to an embodiment of the present invention, the first sealing portion and the light-emitting device are spaced apart by a second distance, and the second distance may be in the range of 0.8 mm to 1 mm.

[0014] According to an embodiment of the present invention, the light emitted from the light-emitting device forms a first angle with the first sealing portion, the light emitted from the light-emitting device forms a second angle with the second sealing portion, and at least one of the first angle and the second angle may be 30° or less.

[0015] According to an embodiment of the present invention, the connecting member includes one end connected to a bonding pad of the light source portion, the other end connected to a pad of the circuit board, and a central portion extending from the first end toward the other end. The first sealing portion includes a first sealing portion 1-1 disposed near the first end, a first sealing portion 1-2 disposed near the other end, and a first sealing portion 1-3 connecting the first sealing portion 1-1 and the first sealing portion 1-2. The first sealing portion 1-1 includes a first sealing portion 1-1a and a first sealing portion 1-1b, the first sealing portion 1-1a being disposed closer to the first end than the first sealing portion 1-1b. The first sealing portion 1-2 includes a first sealing portion 1-2a and a first sealing portion 1-2b, the first sealing portion 1-2a being disposed closer to the other end than the first sealing portion 1-2b. The first sealing portion 1-1 may include a first sealing portion 1-3a and a first sealing portion 1-3b. According to an embodiment of the present invention, the first-1a sealing portion, the first-2a sealing portion and the first-3a sealing portion form a first outer periphery, and the first-1b sealing portion, the first-2b sealing portion and the first-3b sealing portion form a second outer periphery, and the first outer periphery and the second outer periphery may be spaced apart from each other.

[0016] According to an embodiment of the present invention, the second sealing portion may be disposed inside the first outer periphery. The height of the first outer periphery may be greater than or equal to the height of the second outer periphery.

[0017] According to an embodiment of the present invention, a headlight includes: a housing; and a light source module disposed inside the housing, wherein the light source module may include the aforementioned lighting device.

[0018] Beneficial effects

[0019] The lighting device according to an embodiment of the present invention includes a sealing portion. The sealing portion protects the connecting member connected to the light source portion and can prevent the connecting member from being damaged by external impacts. This improves the reliability of the lighting device.

[0020] The sealing portion includes a first sealing portion and a second sealing portion. The first sealing portion forms the outer periphery of the sealing portion. The second sealing portion is disposed within the outer periphery. The first and second sealing portions are formed of a resin composition. The resin composition includes oligomers, monomers, photoinitiators, and fillers. The oligomers, monomers, photoinitiators, and fillers are included in a set weight percentage. Therefore, the thixotropic properties and elasticity of the resin composition can be controlled. Specifically, the resin composition can meet the thixotropic properties required for the first sealing portion. Furthermore, the resin composition can meet the elasticity required for the second sealing portion. Therefore, the first and second sealing portions can be formed using the same resin composition. Moreover, the first and second sealing portions can be formed using the same process. Therefore, the process efficiency of forming the sealing portion is improved.

[0021] The heights of the first sealing portion and the second sealing portion are predetermined, and the first sealing portion protects the surface of the light-emitting device and suppresses optical interference. The second sealing portion covers the surface of the connecting member and protects the connecting member. Therefore, the reliability of the lighting device can be improved and its size can be reduced. Attached Figure Description

[0022] Figure 1 This is a perspective view of a lighting device according to an embodiment, showing a connecting member disposed between the light source portion and the circuit board.

[0023] Figure 2 It has a sealed part Figure 1 A side sectional view of the lighting device.

[0024] Figure 3 yes Figure 1 A partial enlarged view of the lighting device, showing the light source, circuit board, and connecting components.

[0025] Figure 4 It has a sealed part Figure 3 A plan view of the lighting fixtures.

[0026] Figure 5 It has multiple sealing parts. Figure 3 A plan view of the lighting fixtures.

[0027] Figure 6 It shows that Figure 5 A side sectional view of the light source, connecting components, and heat sink connection of the lighting device.

[0028] Figure 7 yes Figure 6 A magnified view of region A.

[0029] Figure 8 These are photographs of the light source portion, connecting member, and heat sink of the lighting device according to an embodiment.

[0030] Figure 9 It is shown Figure 9 A view showing the thickness ratio of the sealed portion in region A-A'.

[0031] Figure 10 yes Figure 3 Another plan view of the lighting fixture.

[0032] Figure 11 It shows that Figure 10 A side sectional view of the connection between the light source, connecting components, and heat sink of the lighting device.

[0033] Figure 12 yes Figure 11 A magnified view of region B.

[0034] Figure 13 This is a perspective view of a headlight using the lighting device according to the embodiment. Detailed Implementation

[0035] Best mode

[0036] Preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. The spirit of the invention is not limited to some of the described embodiments, but can be implemented in various different forms, and one or more of its components may be selectively combined and substituted if within the scope of the inventive concept. Furthermore, unless explicitly defined and described, the terminology used in the embodiments of the invention (including technical and scientific terms) can be interpreted in the sense that would be commonly understood by one of ordinary skill in the art to which this invention pertains, and commonly used terms (e.g., terms defined in dictionaries) should be interpretable in the context of the relevant art.

[0037] The terminology used in the embodiments of this invention is for describing embodiments and is not intended to limit the invention. In this specification, singular forms may also include plural forms unless explicitly stated otherwise in the phrase, and in describing at least one (or more) of A and / or B, C, at least one of all combinations of A, B, and C may be included. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of embodiments of this invention. These terms are used only to distinguish components from other components and may not be determined by the nature, order, or sequence of these terms.

[0038] Furthermore, when a component is described as “connected,” “joined,” or “combined” to another component, the description may include not only direct connection, joining, or attachment to another component, but also connection, joining, or combination through another component between the component and other components.

[0039] Furthermore, when each component is described as being formed or positioned "above" or "below", "above" or "below" includes not only two components in direct contact with each other, but also the formation or placement of one or more components between the two components. Moreover, when expressed as "above" or "below", it can include the meaning of an upward direction relative to a component, as well as the meaning of a downward direction.

[0040] In the following description, a lighting device according to an embodiment will be described with reference to the accompanying drawings.

[0041] Reference Figures 1 to 9The lighting device according to the embodiment may include a heat sink 101, a circuit board 110 disposed on the heat sink 101, a light source portion 130 disposed on the heat sink 101 and including a light-emitting device 131, connecting members 141 and 142 connecting the light source portion 130 and the circuit board 110, and a sealing portion 200 sealing the connecting members 141 and 142.

[0042] Lighting devices can be applied to a wide variety of lighting applications. For example, they can be used in automotive lights, household lighting, and industrial lighting. Specifically, they can be used in headlights, side mirrors, side marker lights, fog lights, taillights, brake lights, daytime running lights, interior lighting, door sill lights, rear combination lights, and reversing lights. Lighting devices can also be used in indoor or outdoor advertising displays, displays, and electric vehicles.

[0043] Heat sink 101 supports circuit board 110. Heat generated by circuit board 110 can be dissipated through heat sink 101. Heat sink 101 comprises metal. For example, heat sink 101 can be formed as a stacked structure of multiple metal layers. Heat sink 101 can be formed as a single layer or multiple layers. Heat sink 101 can include ceramic materials, AlN, or aluminum with an anodized surface layer. The metal layers can include at least one of Al, Ni, Mo, Cu, Cu alloy, Cu-W, Ag, or Au. Heat sink 101 includes a heat dissipation portion 102 and a side portion 103. Heat dissipation portion 102 includes a recessed portion 108. Circuit board 110 is disposed in the recessed portion 108. The area of ​​heat dissipation portion 102 can be larger than the area of ​​circuit board 110. Side portion 103 bends rearward from the edge of heat dissipation portion 102. One or more side portions 103 can be disposed along the outer side of heat dissipation portion 102. An empty space 109 may be provided on the inner side of the side portion 103 and the lower side of the heat dissipation portion 102, or other structures may be combined with it. The heat dissipation plate 101 may be a support plate.

[0044] A recessed portion 108 is formed at a predetermined depth on the upper surface of the heat dissipation portion 102 of the heat sink 101. The depth of the recessed portion 108 may be equal to or different from the thickness of the circuit board 110. For example, the depth of the recessed portion 108 may be less than the thickness of the circuit board 110. The top view shape of the recessed portion 108 may be the same as the top view shape of the circuit board 110. For example, the top view shape of the recessed portion 108 may include a polygonal shape.

[0045] The circuit board 110 is inserted into the recess 108. The bottom surfaces of the circuit board 110 and the recess 108 can be joined by an adhesive member 155. The adhesive member 155 may include a thermally conductive adhesive. The upper surface of the circuit board 110 may be arranged on the same plane as the upper surface of the heat sink 101. As another example, the upper surface of the circuit board 110 may be arranged higher than the upper surface of the heat sink 101. Figure 6 As shown, the adhesive member 155 is disposed around the outer periphery of the recessed portion 108. Therefore, the surface of the heat dissipation portion 102 can be bonded to the circuit board 110.

[0046] The circuit board 110 may comprise resin or metal materials. For example, the circuit board 110 may comprise any of a ceramic-based PCB, a MCPCB (metal-core PCB), a flexible PCB (FPCB), and a resin-based PCB. The circuit board 110 may comprise a metal layer on the bottom, a circuit layer with pads on the top, a protective layer made of insulating material to protect the upper circuit layer, and an insulating layer between the metal layer and the circuit layer. The circuit board 110 may be configured as an MCPCB with a metal layer on the bottom. Furthermore, the circuit board 110 can transfer heat to the heat sink 101.

[0047] The circuit board 110 can be fastened to the heat dissipation portion 102 by a fastening device 119. The fastening device 119 may include one or more screws. The circuit board 110 and the heat dissipation portion 102 can be fastened and tightly joined by screws. When the circuit board 110 is fixed by the fastening device 119, the adhesive member 155 can be removed. Therefore, the circuit board 110 can be easily separated.

[0048] Circuit board 110 may include multiple pads. Pads 111 and 112 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 can be connected to a connector 115 disposed on the upper part of circuit board 110 via a circuit layer of circuit board 110. Connector 115 can receive drive signals and power from the outside. Pads 111 and 112 and connector 115 may be disposed on two edges of circuit board 110. Fastening device 119 may be disposed in the area between pads 111 and 112 and connector 115. The first pad 111 and the second pad 112 are configured to be adjacent to one side of circuit board 110. Pads 111 and 112 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au and optional alloys thereof.

[0049] A light source portion 130 may be disposed on a heat dissipation portion 102. The light source portion 130 may be adjacent to a recessed portion 108. The light source portion 130 may be adjacent to one side of a circuit board 110. One side of the circuit board 110 may be disposed between pads 111 and 112 and the light source portion 130. The light source portion 130 may include a support member 133 and at least one light-emitting device 131 disposed on the support member 133. Multiple light-emitting devices 131 may be sealed by a resin member 132. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may support multiple light-emitting devices 131. Furthermore, the support member 133 may include conductive patterns. Multiple light-emitting devices 131 may be electrically connected via conductive patterns. The support member 133 may electrically connect each of the multiple light-emitting devices 131 to bonding pads 134 and 135. The anode and cathode terminals of each of the multiple light-emitting devices 131 may be electrically connected to the first bonding pad 134 and the second bonding pad 135.

[0050] A protective element (not shown) may be disposed on the support member 133 to protect the light-emitting device 131. The protective element may be implemented as a thyristor, Zener diode, or transient voltage suppressor (TVS). This protects the light-emitting device 131 from electrostatic discharge (ESD). The support member 133 may be formed of a ceramic material or an MCPCB material. The light source portion 130 may transfer heat generated by the light-emitting device 131 to the heat sink 101 via the support member 133. The support member 133 and the heat sink 101 may be bonded using an adhesive. The adhesive 138 may include a thermally conductive adhesive containing metal powder or inorganic powder within a resin material. For example, the adhesive 138 may include a thermal interface material (TIM).

[0051] Adhesive 138 may be disposed along the lower surface and lower portion of the side surface of support member 133. Adhesive 138 is disposed on the outer side of support member 133 and may contact each side of support member 133.

[0052] Light-emitting devices 131 are arranged in multiple directions or in at least one row. Multiple light-emitting devices 131 may be connected in series. Multiple light-emitting devices 131 may include at least one blue, green, or red LED chip. Multiple light-emitting devices 131 may be flip-chip or wire-bonded. Light-emitting devices 131 may include multiple semiconductor layers composed of compound semiconductors of Group II and Group VI elements and / or compound semiconductors of Group III and Group V elements. At least one or all of the multiple semiconductor layers may include compound semiconductors such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AlInGaP, InP, or the InGaAs series.

[0053] The resin component 132 may include silicone resin or epoxy resin. The resin component 132 may include a transparent layer and / or a phosphor layer (not shown) on the light-emitting device 131. A reflective wall (not shown) may be included around the transparent layer and / or the phosphor layer. The resin component 132 may also include a convex lens (not shown). The phosphor layer may include at least one, two, or more of yellow, green, blue, and red phosphors. When the phosphor layer is disposed on the light-emitting device 131, the phosphor layer may be exposed on the upper surface of the light source portion 130. The light source portion 130 may emit white light.

[0054] Reference Figures 3 to 5 The light-emitting device 131 is disposed on the upper part of one side of the support member 133. Bonding pads 134 and 135 are exposed on the upper side of the other side of the support member 133. Bonding pads 134 and 135 may include a first bonding pad 134 connected to the cathodes of the plurality of light-emitting devices 131 and a second bonding pad 135 connected to the anodes of the plurality of light-emitting devices 131. The first bonding pad 134 may have color-coded markings and serve as a cathode terminal, while the second bonding pad 135 may serve as an anode terminal. The first bonding pad 134 and the second bonding pad 135 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof.

[0055] First bonding pad 134 and first pad 111 are connected by a first connecting member 141, and second bonding pad 135 and second pad 112 are connected by a second connecting member 142. The first connecting member 141 and second connecting member 142 may be formed of wire. The first connecting member 141 and second connecting member 142 may include at least one of Au, Al, Ag, and Ni. The first connecting member 141 and second connecting member 142 have one end 41 respectively bonded to the first bonding pad 134 and the second bonding pad 135, and another end 43 respectively bonded to the first pad 111 and the second pad 112. The first connecting member 141 and second connecting member 142 include a central portion 42 extending from one end 41 toward the other end 43. The central portion 42 may extend from the other end of the light source portion 130 to one side of the circuit board 110. The central portion 42 may extend onto the recessed portion 108 between the circuit board 110 and the heat dissipation portion 102. The height of one end 41 may be greater than the height of the other end 43. The height of the central part 42 can be higher than that of one end 41.

[0056] The light source portion 310 and the circuit board 110 are electrically connected via a first connecting member 141 and a second connecting member 142. Connecting members 141 and 142 include lines whose width is greater than their thickness, i.e., strip lines. Therefore, connecting members 141 and 142 may be damaged by external impacts. Furthermore, if connecting members 141 and 142 are exposed to the outside, they may react with substances in the air and be corroded. Therefore, the electrical connection characteristics between the light source portion 310 and the circuit board 110 may deteriorate. To prevent the above problems, the lighting device according to the embodiment includes a sealed portion.

[0057] Reference Figures 4 to 7 The lighting device according to an embodiment includes a sealing portion 200. The sealing portion 200 is disposed on connecting members 141 and 142. The sealing portion 200 surrounds the connecting members 141 and 142. The sealing portion 200 includes a resin composition. Specifically, the sealing portion 200 includes a base resin and a plurality of fillers disposed within the base resin. The base resin may include an acrylic resin. The base resin may include a photocurable resin. The base resin may include oligomers, monomers, and a photoinitiator. The resin composition can be cured by reacting the oligomers, monomers, and photoinitiator. The oligomers may include polyurethane acrylates, and the additive monomers may include acrylates. Furthermore, the photoinitiator may include photoinitiators known for UV curing. The fillers are disposed within the base resin. The fillers are dispersed within the base resin. The fillers may include particles having a spherical or (nano)linear shape. The particle size of the fillers may be 5 μm or larger. Specifically, the particle size of the fillers may be from 5 μm to 30 μm. The fillers may include metals or non-metals. For example, the fillers may include aluminum (Al) or silicon dioxide (Si). Oligomers, monomers, and fillers may be included in a set weight percentage relative to the total weight percentage of the resin composition.

[0058] The weight of oligomers, monomers, and fillers relates to the thixotropic properties (TI), elasticity, viscosity, and adhesive strength of the resin composition. Specifically, the thixotropic properties of the resin composition before curing, and the elasticity and viscosity of the resin composition after curing, can vary depending on the weight range of the oligomers, monomers, and fillers. The oligomer content can be at least 40 wt% relative to the total weight of the resin composition (100 wt%). Specifically, the oligomer content can be from 45 wt% to 65 wt% relative to the total weight percentage of the resin composition. Because the oligomer content is within the above weight percentage range, the viscosity of the resin composition decreases and the elasticity increases after curing. The monomer content can be at least 30 wt% relative to the total weight percentage of the resin composition. Specifically, the monomer content can be from 30 to 50 wt% based on the total weight of the resin composition. Because the monomer content is within the above weight percentage range, the viscosity of the resin composition decreases after curing. Furthermore, the adhesion between the sealing portion and the heat sink 101 and the circuit board 110 increases.

[0059] Based on the total weight of the resin composition, the filler content can be at least 1 wt%. Specifically, based on the total weight of the resin composition, the filler content can be at least 2 to 10 wt%. Because the filler content is within the above weight percentage range, the thixotropic properties of the resin composition before curing are increased. This facilitates the manufacturing process of the sealed portion. Furthermore, the viscosity of the resin composition decreases after curing.

[0060] The photoinitiator content can be at least 1 wt% based on the total weight of the resin composition. Specifically, the photoinitiator content can be at least 1 wt% based on the total weight of the resin composition. The properties of the resin composition are controlled by the weight ratio of oligomers, monomers, fillers, and photoinitiators.

[0061] In detail, the thixotropic properties of the resin composition before curing are controlled. Specifically, the thixotropic properties of the resin composition before curing are between 2 and 4. Because the thixotropic properties meet the above range, it is easy to form a sealing portion. This will be described in detail below. The elasticity of the resin composition after curing is controlled. Specifically, the modulus of the cured resin composition can be 100 MPa or greater. More specifically, the modulus of the cured resin composition can be from 100 MPa to 8000 MPa. This prevents the sealing portion from being damaged by external impacts.

[0062] Reference Figure 4The sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 is disposed at the edge of the sealing portion 200. The first sealing portion 210 may form the outer periphery of the sealing portion 200. The sealing portion 200 may form an inner region in which the second sealing portion 220 is disposed through the first sealing portion 210. The first sealing portion 210 is divided into a first-1 sealing portion 211, a first-2 sealing portion 212, and a first-3 sealing portion 213 according to its position.

[0063] The first sealing portion 211 is disposed near the light source portion 130. The first sealing portion 211 is disposed near the end 41. The first sealing portion 212 is disposed near the circuit board 110. The first sealing portion 213 is positioned near the other end 43. The first sealing portion 213 connects the first sealing portion 211 and the first sealing portion 212. The first sealing portion 211, the first sealing portion 212, and the first sealing portion 213 are distinguished by their positions and are integrally formed. The first sealing portion 211, the first sealing portion 212, and the first sealing portion 213 form the outer periphery of the sealing portion 200. Therefore, the first sealing portion 210 can be used as a barrier for the sealing portion 200.

[0064] The first sealing portion 210 comprises a resin composition. Specifically, the first sealing portion 210 is formed by curing the resin composition. The resin composition has the aforementioned physical properties. Specifically, the resin composition has thixotropic properties within a set range. Therefore, the flowability of the first sealing portion 210 can be controlled before curing the first sealing portion. Therefore, after the second sealing portion 220 is disposed inside the first sealing portion 210, the first sealing portion 210 and the second sealing portion 220 can be cured simultaneously. Furthermore, the material of the first sealing portion 210 and the material of the second sealing portion 220 can be used as the same material. Therefore, the process efficiency of forming the sealing portion 200 can be improved.

[0065] If the thixotropy of the resin composition is 2 or less, the first sealing portion 210 can be pushed outward when the second sealing portion 220 is disposed inside the first sealing portion 210. Therefore, the first sealing portion 210 may be difficult to use as a barrier. Thus, a separate curing process is required for the first sealing portion 210. Alternatively, a process is needed to increase the height of the first sealing portion 210. Therefore, the efficiency of the process for forming the sealing portion 200 may be reduced. Furthermore, if the thixotropy of the resin composition exceeds 4, the viscosity and modulus of the cured resin composition may change. Therefore, the sealing portion 200 may be damaged by external impacts.

[0066] The second sealing portion 220 is disposed inside the sealing portion 200. Specifically, the second sealing portion 220 is disposed within the internal region of the first sealing portion 210. The first sealing portion 210 forms the outer periphery of the sealing portion 200. The second sealing portion 220 is disposed inside the outer periphery. The second sealing portion 220 may be a protective layer protecting the connecting members 141 and 142. The second sealing portion 220 is configured to surround the connecting members 141 and 142. This prevents the connecting members 141 and 142 from being damaged by external impacts. The second sealing portion 220 comprises a resin composition. Specifically, the second sealing portion 220 is formed by curing the resin composition. Specifically, the resin composition forming the second sealing portion 220 is the same as the resin composition forming the first sealing portion 210.

[0067] The resin composition possesses the aforementioned physical properties. Specifically, the resin composition has a viscosity and modulus within a set range. More specifically, the modulus of the second sealing portion 220 formed by curing the resin composition can be from 100 MPa to 8000 MPa. Therefore, the elasticity of the second sealing portion can be controlled. Thus, connecting members 141 and 142 can be protected by the sealing portion 200. That is, since the sealing portion 200 is protected from external impacts, connecting members 141 and 142 can be easily protected by the sealing portion 200. The first sealing portion 210 and the second sealing portion 220 are formed from the same resin composition. Specifically, the resin composition has thixotropic properties, viscosity, and modulus within a set range. Therefore, the resin composition can simultaneously satisfy both the physical properties required for the first sealing portion 210 and the physical properties required for the second sealing portion 220. Specifically, the resin composition satisfies the thixotropic properties required for the first sealing portion 210. Furthermore, the resin composition satisfies the modulus required for the second sealing portion 220.

[0068] Therefore, the first sealing portion 210 and the second sealing portion 220 can be formed using the same resin composition in the same process. For example, the first sealing portion 210 is applied to form the outer periphery of the sealing portion 200. Subsequently, the second sealing portion 220 is applied to the interior of the outer periphery. Next, the first sealing portion 210 and the second sealing portion 220 can be cured simultaneously. Therefore, the process time for forming the sealing portion 200 is shortened. Thus, process efficiency is improved.

[0069] The first sealing portion 210 and the second sealing portion 220 may have a set height relative to the upper surface of the circuit board 110 or the upper surface of the heat sink 101. The height of the first sealing portion 210 may be defined by the thickness of the first sealing portion 210. Furthermore, the height of the second sealing portion 220 may be defined by the thickness of the second sealing portion 220. The height H2 of the first sealing portion 210 and the height H2 of the second sealing portion 220 may be different. Specifically, the height H2 of the second sealing portion 220 relative to the upper surface of the circuit board 110 or the upper surface of the heat sink 101 is greater than the height of the first sealing portion 210. Specifically, the maximum height of the second sealing portion 220 is greater than the maximum height of the first sealing portion 210. The height H2 of the second sealing portion may be 2, 3, or 4 times or more the height of the first sealing portion 210. Specifically, the height H2 of the second sealing portion 220 may be 1 to 5 times the height of the first sealing portion 210.

[0070] If the height H2 of the second sealing portion is 1 or less than the height of the first sealing portion, then the second sealing portion 220 may not completely surround the connecting members 141 and 142. Therefore, the connecting members 141 and 142 may be exposed outside the sealing portion 200. Alternatively, if the height H2 of the second sealing portion 220 is less than or equal to twice the height of the first sealing portion 210, then the distance between the connecting members 141 and 142 and the second sealing portion 220 may be reduced. Therefore, external impacts may be transmitted to the connecting members 141 and 142. Consequently, the connecting members 141 and 142 may be damaged by external impacts. The heights H1-1 of the first-1 sealing portion and H1-2 of the first-2 sealing portion may be the same or different. For example, the height H1-2 of the first-2 sealing portion may be greater than or equal to the height H1-1 of the first-1 sealing portion. That is, the height H1-2 of the first-2 sealing portion may be equal to or greater than the height H1-1 of the first-1 sealing portion. Specifically, the height H1-2 of the first-second sealing portion can be 1 to 1.5 times, 1 to 2 times, or 1 to 2.5 times the height H1-1 of the first-first sealing portion. When the heights H1-1 and H1-2 of the first-first sealing portion are formed to be the same or similar, it facilitates the process of forming the first sealing portion 210. When the height H1-2 of the first-second sealing portion is greater than the height H1-1 of the first-first sealing portion, the height deviation of the second sealing portion is reduced. The first-first sealing portion 211 is set higher than the first-second sealing portion 212. Therefore, the second sealing portion 220 can have a step formed in the outer region. Since the height H1-2 of the first-second sealing portion is set greater than the height H1-1 of the first-first sealing portion, the height difference of the second sealing portion 220 can be reduced.

[0071] The second sealing portion 220 and the connecting members 141 and 142 may be spaced apart from each other. The distance between the second sealing portion 220 and the connecting members 141 and 142 may be defined as a first distance G1. The first distance G1 is defined as the distance in the height direction of the second sealing portion 220. The first distance G1 may be defined as the distance between the high point of the connecting members 141 and 142 and the high point of the second sealing portion 220. The first distance G1 may be 100 μm or greater. Specifically, the first distance G1 may be 100 μm to 200 μm, 120 μm to 180 μm, or 140 μm to 160 μm. If the first distance G1 is less than 100 μm, the number of sealing portions provided between the second sealing portion 220 and the connecting members 141 and 142 becomes smaller. Therefore, external impacts may pass through the second sealing portion 220 and be transmitted to the connecting members 141 and 142. Therefore, the reliability of the lighting device may be reduced. If the first distance G1 exceeds 200 μm, the height of the second sealing portion 220 increases. Therefore, the thickness of the lighting device can be increased by the second sealing part 220.

[0072] The first-1 sealing portion 211 and the light-emitting device 131 may be spaced apart from each other. The distance between the first-1 sealing portion 211 and the light-emitting device 131 may be defined as a second distance G2. This distance is defined as the distance between the connecting members 141 and 142 in the longitudinal direction. The second distance G2 may be 0.8 mm or greater. Specifically, the second distance G2 may be from 0.8 mm to 1 mm. When the second distance G2 is less than 0.8 mm, the first-1 sealing portion 211 may also be placed in the area where the light-emitting device 131 is placed during the process of forming the sealing portion. Furthermore, when the second distance G2 exceeds 1 mm, the distance between the light-emitting device 131 and the bonding pads 134 and 135 may increase. Therefore, the size of the light source portion 130 may increase. Therefore, the size of the lighting device may increase.

[0073] The height H2 of the first sealing portion 210 and the second sealing portion 220 is limited by the beam angle of the light-emitting device 131. Specifically, the beam angle of the light-emitting device 131 can be 120° or greater. Therefore, the first angle θ1 formed between the light emitted from the light-emitting device 131 and the first sealing portion 210 can be 30° or less. Furthermore, the second angle θ2 formed between the light emitted from the light-emitting device 131 and the second sealing portion 220 can be 30° or less. Therefore, the Lambertian emission of the light-emitting device 131 is not interfered with by the sealing portion 200. Thus, the brightness and luminous efficiency of the lighting device can be improved.

[0074] Figure 8 and Figure 9This is a view showing the sealing portion of a lighting device according to an embodiment and the thickness profile of the sealing portion.

[0075] Reference Figure 8 and Figure 9 The sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 and the second sealing portion 220 are formed from the same resin composition. However, the first sealing portion 210 and the second sealing portion 220 are applied in a different order. Furthermore, the first sealing portion 210 and the second sealing portion 220 are positioned at different heights. Therefore, they are distinguished by the boundary between the first sealing portion 210 and the second sealing portion 220.

[0076] Reference Figure 9 The maximum height H2 of the second sealing portion 220 is greater than the heights H1-1 and H1-2 of the first sealing portion 210. Specifically, the height of the second sealing portion 220 in contact with the first sealing portion 210 is less than the height of the first sealing portion 210. However, the height of the second sealing portion 220 gradually increases and becomes greater than the height of the first sealing portion 210. The second sealing portion 220 is configured to gradually increase and then decrease in size.

[0077] The first sealing portion 210 is formed of a resin composition. Therefore, the first sealing portion has thixotropic properties within a set range before curing. Therefore, when the second sealing portion is filled, the first sealing portion will not collapse. Therefore, the second sealing portion will not overflow to the outside of the first sealing portion. Therefore, the second sealing portion is not disposed on the outside of the first sealing portion.

[0078] The lighting device according to an embodiment includes a sealing portion 200.

[0079] The sealing portion 200 protects the connecting members 141 and 142. Therefore, it prevents the connecting members 141 and 142 from being damaged by external impacts. This improves the reliability of the lighting device. The sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 forms the outer periphery of the sealing portion 200. The second sealing portion 220 is disposed inside the outer periphery.

[0080] The first sealing portion 210 and the second sealing portion 220 are formed of a resin composition. This resin composition includes oligomers, monomers, photoinitiators, and fillers. The oligomers, monomers, photoinitiators, and fillers are included in a predetermined weight percentage. Therefore, the thixotropic properties and elasticity of the resin composition can be controlled. Specifically, the resin composition can satisfy the required thixotropic properties for the first sealing portion 210. Furthermore, the resin composition can satisfy the required elasticity for the second sealing portion 220. Therefore, the first sealing portion 210 and the second sealing portion 220 can be formed using the same resin composition.

[0081] Furthermore, the first sealing portion 210 and the second sealing portion 220 can be formed using the same process. Therefore, the process efficiency of forming the sealing portion 200 is improved. Additionally, the heights of the first sealing portion 220 and the second sealing portion 220 have predetermined dimensions based on the upper surface of the circuit board 110 or the upper surface of the heat sink 101. Furthermore, the first sealing portion 210 and the light-emitting device 131 can be spaced apart by a predetermined distance, and the second sealing portion 220 can have a distance between the surfaces protecting the connecting members 141 and 142. Therefore, the reliability of the lighting device can be improved, and its size can be reduced.

[0082] In the following text, reference will be made to Figures 10 to 12 A lighting device according to another embodiment is described. Descriptions of elements identical to those described in the lighting device according to the foregoing embodiment will be omitted. Furthermore, identical parts are indicated by the same reference numerals.

[0083] Reference Figures 10 to 12 The lighting device includes a sealing portion 200. The sealing portion 200 includes a first sealing portion 210 and a second sealing portion 220. The first sealing portion 210 is divided into a first-1 sealing portion 211, a first-2 sealing portion 212, and a first-3 sealing portion 213 according to their positions. The first-1 sealing portion 211 is positioned near the light source portion 130. The first-1 sealing portion 211 is positioned near the first end 41. The first-2 sealing portion 212 is positioned near the circuit board 110. The first-2 sealing portion 213 is positioned near the other end 43.

[0084] The first-third sealing portion 213 connects the first-first sealing portion 211 and the first-second sealing portion 212. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 are distinguished by their positions and are integrally formed. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 form the outer periphery of the sealing portion 200. Therefore, the first sealing portion 210 can serve as a barrier for the sealing portion 200. The first-first sealing portion 211, the first-second sealing portion 212, and the first-third sealing portion 213 may each include two sealing portions. For example, the first-first sealing portion 211 may include a first-1a sealing portion 211a and a first-1b sealing portion 211b. The first-1a sealing portion 211a is positioned inward relative to the first-1b sealing portion 211b. Specifically, the first-1a sealing portion 211a is positioned closer to the end 41 than the first-1b sealing portion 211b. Specifically, the first-1b side sealing portion 211b is positioned closer to the light source portion 130 than the first-1a sealing portion 211a.

[0085] Specifically, the first-2 sealing portion 212 may include a first-2a sealing portion 212a and a first-2b sealing portion 221b. The first-2a sealing portion 212a is positioned inward relative to the first-2b sealing portion 212b. Specifically, the first-2a sealing portion 212a is positioned closer to the other end 43 than the first-2b sealing portion 212b.

[0086] The first-3 sealing portion 213 may include the first-3a sealing portion and the first-3b sealing portion. The first-3a sealing portion 213a is positioned inward from the first-3b sealing portion 213b.

[0087] The first sealing portion 210 connects the first-1a sealing portion 211a, the first-2a sealing portion 212a, and the first-3a sealing portion. The first sealing portion 210 forms a first outer periphery through the first-1a sealing portion 211a, the first-2a sealing portion 212a, and the first-3a sealing portion 213a.

[0088] The first sealing portion 210 connects the first-1b sealing portion 211b, the first-2b sealing portion 212b, and the first-3b sealing portion. The first sealing portion 210 forms a second outer periphery through the first-1b sealing portion 211b, the first-2b sealing portion 212b, and the first-3b sealing portion 213b. The first outer periphery and the second outer periphery are spaced apart. The first outer periphery is positioned inward relative to the second outer periphery. That is, the first outer periphery is positioned closer to one end 41 and the other end 43 of the connecting members 141 and 142 than the second outer periphery.

[0089] The second sealing portion 220 is positioned inside the first outer periphery. The first outer periphery prevents the second sealing portion 220 from overflowing to the outside of the first sealing portion 210. The second outer periphery further prevents the second sealing portion 220 from overflowing. When the second sealing portion 220 is applied, an error in the amount of resin composition applied may occur. As a result, the second sealing portion 220 may overflow to the outside of the first outer periphery. The second outer periphery prevents the resin composition that overflows to the outside of the first outer periphery from flowing to the outside of the first sealing portion 210. Therefore, it is possible to prevent the resin composition from flowing into the light source portion 130 during the process.

[0090] The height of sealing portion 211a (1-1a) can be the same as the height of sealing portion 211b (1-1b). The height of sealing portion 212a (1-2a) can be the same as the height of sealing portion 211b (1-2b). The height of sealing portion 213a (1-3a) can be the same as the height of sealing portion 213b (1-3b). As another example, the height of sealing portion 211a (1-1a) can be different from the height of sealing portion 211b (1-1b). Specifically, the height of sealing portion 211a (1-1a) can be greater than the height of sealing portion 211b (1-1b). The height of sealing portion 212a (1-2a) can be different from the height of sealing portion 211b (1-2b). Specifically, the height of sealing portion 212a (1-2a) can be greater than the height of sealing portion 211b (1-2b). The height of sealing portion 213a (1-3a) can be different from the height of sealing portion 213b (1-3b). Specifically, the height of the first-3a sealing portion 213a can be greater than the height of the first-3b sealing portion 213a. That is, the height of the first outer periphery can be greater than the height of the second outer periphery.

[0091] The first outer periphery serves as a primary barrier. Furthermore, the second outer periphery serves as an auxiliary barrier. Therefore, the height of the first outer periphery is increased to prevent overflow of the second sealing portion 220. Furthermore, the height of the second outer periphery is relatively reduced. As a result, overflow of the second sealing portion 220 is further prevented. Additionally, the size of the sealing portion can be reduced. The lighting device according to another embodiment includes multiple outer peripheries. Therefore, overflow of the second sealing portion 220 caused by errors in the applied amount during the process can be prevented. Therefore, the reliability of the lighting device according to another embodiment can be improved.

[0092] Reference Figure 13 A vehicle headlight 90 having a lighting device according to an embodiment includes a light source module 10 and a housing 92. The light source module 10 is positioned inside the housing 92 and radiates light in a lateral direction. The radiated light can be reflected in the emission direction by the inner surface 92A of the housing 92. The light source module 10 includes the lighting device described above. The housing 92 may include a metallic or non-metallic material. The non-metallic material may include a plastic material. The housing 92 may be a reflector for the headlight. The inner surface 92A of the housing 92 may be a surface coated with a highly reflective material, or may include a reflective layer having an anti-reflective (AR) material. For example, the highly reflective material may include at least one metal, such as Al, Ag, or Au. The anti-reflective material may include at least one of MgF2, Al2O3, SiO, SiO2, TiO2+ZrO2, TiO2, or ZrO2. The reflective layer of the inner surface 92A may be a single layer or multiple layers.

[0093] The headlight 90 may include an inner lens and / or an outer lens that projects light emitted through the housing 92. The light distribution pattern of the light emitted from the light source module 10 may be adjusted according to the shape of the inner lens or the number of light source portions. The light source module 10 selectively illuminates the light with a high beam distribution pattern and a low beam distribution pattern. The high beam distribution pattern or the low beam distribution pattern may be automatically turned on and off according to the driving mode or driving conditions.

[0094] The inner surface 92A of the housing 92 may include a partially dome-shaped or partially elliptical parabolic surface. The inner surface 92A may have multiple facets. Facets may be freeform, flat, and / or curved (e.g., concave or convex) members. In some examples, a single facet may have freeform portions, and / or flat portions, and / or curved portions (e.g., any combination thereof). In some embodiments, the facets (or at least the inward-facing surfaces on the facets) may be defined at least approximately or by algebraic equations. For example, the shape of a facet or an inward-facing surface may be represented by one or more fifth-order algebraic equations (although other equations of any order are also possible). In at least one exemplary embodiment, the surface of the facet (or, for example, a coating) has a high reflectivity (e.g., greater than 80%). While other reflective materials may be used, non-limiting examples of facets and / or coatings on facets include aluminum and silver.

[0095] The inner surface 92A of the housing 92 is laterally spaced from the light source module 10, and light emitted from the light source module 10 is reflected by the inner surface 92A and focused toward the outlet side of the housing 92, where the light can be used as high beam or low beam. The exterior of the housing 92 may include various features and accessories for mounting or connecting the headlights 90 to the vehicle interior. Additionally, the exterior of the housing 92 may have an electrical interface, such as a socket, for connecting power and / or signals. The housing 92 and cavity described above are exemplary and can be modified into various shapes. The housing 92 according to this embodiment can be used as a reflector for the left / right headlights 90.

[0096] The features, structures, and effects described in the above embodiments are included in at least one embodiment, but are not limited to a single embodiment. Furthermore, those skilled in the art can combine or modify the features, structures, and effects shown in each embodiment for other embodiments. Therefore, it should be understood that such combinations and modifications fall within the scope of the invention. Moreover, although embodiments have been described above, they are merely examples and do not limit the invention. Those skilled in the art will understand that various modifications and applications not shown above can be made without departing from the basic characteristics of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. Furthermore, it should be understood that differences associated with such modifications and applications are included within the scope of the invention as defined in the following claims.

Claims

1. A lighting device, comprising: Heat sink, including the recessed portion; A circuit board, disposed in the recessed portion and having solder pads; The light source is disposed on the heat sink and includes bonding pads and a light-emitting device; A connecting component that connects the pads of the circuit board to the bonding pads of the light source portion; as well as A sealing portion is provided on the connecting member. The sealing portion includes a first sealing portion forming an outer periphery and a second sealing portion disposed within the outer periphery. The first sealing portion and the second sealing portion comprise the same resin composition.

2. The lighting device according to claim 1, in, The resin composition includes a base resin and fillers. The base resin includes oligomers, monomers, and photoinitiators. The content of the oligomer is 45 wt% to 65 wt% of the total weight of the resin composition. The monomer content is 30 wt% to 50 wt% of the total weight of the resin composition. The photoinitiator is present in an amount of 1 wt% to 5 wt% of the total weight of the resin composition, and The filler content is from 2 wt% to 10 wt% of the total weight of the resin composition.

3. The lighting device according to claim 1, in, The modulus of the cured resin composition is from 100 MPa to 8000 MPa.

4. The lighting device according to claim 3, wherein, The thixotropic properties of the resin composition before curing are 2 to 4.

5. The lighting device according to claim 2, in, The particle size of the filler is from 5 μm to 30 μm.

6. The lighting device according to claim 1, in, The connecting component includes: One end is connected to the bonding pad of the light source portion; The other end is connected to the pads on the circuit board; and The central portion extends from one end toward the other end. The first sealing portion includes a first sealing portion 1-1 disposed near one end, a first sealing portion 1-2 disposed near the other end, and a first sealing portion 1-3 connecting the first sealing portion 1-1 and the first sealing portion 1-2. The first-1 sealing portion, the first-2 sealing portion, and the first-3 sealing portion are integrally formed.

7. The lighting device according to claim 6, in, The maximum height of the second sealing portion is 1 to 5 times the maximum height of the first sealing portion.

8. The lighting device according to claim 6, in, The maximum height of the first-second sealing portion is greater than or equal to the maximum height of the first-first sealing portion.

9. The lighting device according to claim 8, in, The maximum height of the first-second sealing portion is 1 to 2.5 times the maximum height of the first-first sealing portion.

10. The lighting device according to claim 6, in, The second sealing portion and the connecting member are spaced apart by a first distance. Wherein, the first distance is defined as the distance between the maximum height of the connecting member and the second sealing portion. The first distance is 100 μm to 200 μm.

11. The lighting device according to claim 6, in, The first sealing portion and the light-emitting device are spaced apart by a second distance. The second distance is 0.8 mm to 1 mm.

12. The lighting device according to claim 1, in, The light emitted from the light-emitting device forms a first angle with the first sealing portion. Wherein, the light emitted from the light-emitting device forms a second angle with the second sealing portion, and Wherein, at least one of the first angle and the second angle is 30° or less.

13. The lighting device according to claim 1, in, The connecting component includes: One end is connected to the bonding pad of the light source portion; The other end is connected to the pads on the circuit board; and The central portion extends from one end toward the other end. The first sealing portion includes a first sealing portion 1-1 disposed near one end, a first sealing portion 1-2 disposed near the other end, and a first sealing portion 1-3 connecting the first sealing portion 1-1 and the first sealing portion 1-2. The first-1 sealing portion includes a first-1a sealing portion and a first-1b sealing portion. Specifically, the first-1a sealing portion is positioned closer to one end than the first-1b sealing portion. The first-2 sealing portion includes the first-2a sealing portion and the first-2b sealing portion. Wherein, the first-2a sealing portion is positioned closer to the other end than the first-2b sealing portion, and The first sealing portion includes the first-3a sealing portion and the first-3b sealing portion.

14. The lighting device according to claim 13, in, The first-1a sealing portion, the first-2a sealing portion, and the first-3a sealing portion form a first outer peripheral portion; Wherein, the first-1b sealing portion, the first-2b sealing portion, and the first-3b sealing portion form a second outer peripheral portion; and The first outer periphery and the second outer periphery are spaced apart from each other.

15. The lighting device according to claim 14, in, The second sealing portion is located within the first outer periphery.

16. The lighting device according to claim 14, in, The height of the first outer perimeter is greater than or equal to the height of the second outer perimeter.

17. A headlight, comprising: case; as well as The light source module is housed within the casing. The light source module includes a lighting device according to any one of claims 1 to 16.

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