Thermal diffuser
By introducing a thermally conductive heat diffuser layer and an interface layer into the package, and utilizing a combination of insulation and conduction components, the problem of uneven heat distribution on the outer surface of the package is solved, achieving uniform temperature distribution and improved safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2026-03-24
AI Technical Summary
In the prior art, the heat generated by the circuit system is unevenly distributed on the outer surface of the package, leading to the formation of hot spots that may exceed the touch temperature limits required by safety and regulations, and pose a risk of thermal throttling.
The design employs a thermally conductive heat diffuser layer and an interface layer. By combining the insulating and conductive parts, the direct transfer of heat to the outer layer is reduced. Distributed heat transfer is achieved through thermally conductive channels and heat collection sections, ensuring that heat is kept away from the area of the thermoelectric components. Furthermore, the design of the interface layer reduces the possibility of hot spots forming.
It achieves uniform temperature distribution on the outer surface of the package, reduces the risk of hot spot formation, ensures that the outer surface temperature is within safety and regulatory requirements, and reduces or eliminates thermal throttling.
Smart Images
Figure CN121729992A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a heat diffuser, and more particularly to a heat diffuser located inside a device housing. Summary of the Invention
[0002] According to this disclosure, a package and a method of manufacturing the same are provided to improve heat distribution on the outer surface of the outer layer of the package. The package may include multiple layers, including an outer layer, an interface layer, a heat diffuser layer, and a circuit system, each layer arranged to improve heat distribution from the circuit system to the outer layer. The package and method of manufacturing the same disclosed herein facilitate distributed heat transfer from thermoelectric components of the circuit system to the outer layer to reduce any non-uniform temperature distribution (hereinafter referred to as hot spots) on the outer surface of the outer layer. The circuit system of the package is arranged facing the inner surface of the heat diffuser layer, and the circuit system also includes at least one thermoelectric component, a portion of which is in thermal contact with the at least one thermoelectric component. The heat diffuser layer is thermally conductive and is arranged throughout the package to allow heat generated from the thermoelectric component to be transferred along the heat diffuser layer away from the area of the package where the at least one thermoelectric component is located. The interface layer of the package has conductive portions arranged along the edge of the package to ensure heat transfer from the heat diffuser layer to the outer layer. Additionally, the interface layer includes an insulating portion located between (a) the portion of the heat diffuser layer that is in thermal contact with the thermoelectric component and (b) the outer layer to reduce the likelihood of hot spot formation. The packages and methods disclosed herein are provided to improve the thermal distribution of heat generated by at least one thermoelectric component of a circuit system. The improved thermal distribution ensures that the surface temperature of the outer layer remains below the safety and regulatory-required touch temperature limits and reduces or eliminates any opportunity for thermal throttling of the circuit system within the package.
[0003] In some embodiments, the package (e.g., a solid-state storage device package) is provided with a circuit system (e.g., a solid-state storage device) facing the inner surface of the heat diffuser layer. The interface layer includes an inner surface of the interface layer that contacts the outer surface of the heat diffuser layer and an outer surface of the interface layer that contacts the inner surface of the outer layer. In some embodiments, the package includes a housing, wherein the housing includes an outer layer, and the outer surface of the outer layer is the outer surface of the package or the housing. Attached Figure Description
[0004] The following description includes a discussion of figures illustrating examples of implementations through embodiments of this disclosure. The figures should be understood by way of example rather than by way of limitation. As used herein, references to one or more “embodiments” are to be understood as describing a particular feature, structure, and / or characteristic included in at least one implementation. Therefore, phrases such as “in one embodiment” or “in an alternative embodiment” appearing herein describe various embodiments and implementations and do not necessarily all refer to the same embodiment. However, they are not necessarily mutually exclusive.
[0005] Figure 1 An illustrated exploded view of a package having a heat diffuser layer according to some embodiments of the present disclosure is shown; Figure 2 An illustrative cross-sectional view of a package having a heat diffuser layer according to some embodiments of the present disclosure is shown; Figure 3 Similar to some embodiments of the present disclosure are shown. Figure 2 A schematic plan view of the package; Figure 4 An illustrated exploded view of another embodiment of an encapsulation having a heat diffuser layer according to some embodiments of the present disclosure is shown; Figure 5 A schematic diagram illustrating the temperature distribution along the outer layer of an encapsulation without a heat diffuser layer, according to some embodiments of the present disclosure; Figure 6 An illustrative diagram showing the temperature distribution along the outer layer of an encapsulation having a heat diffuser layer according to some embodiments of the present disclosure; Figure 7 A flowchart illustrating illustrative steps for manufacturing an encapsulation having a heat diffuser layer according to some embodiments of the present disclosure is shown; Figure 8 A flowchart illustrating illustrative steps for arranging a heat diffuser layer for an encapsulation according to some embodiments of the present disclosure is shown; and Figure 9 Examples of embodiments according to this disclosure are shown. Figure 7 The flowchart illustrates the steps of the sub-processes used to lay out the interface layer, as shown in the diagram. Detailed Implementation
[0006] According to this disclosure, a package and a method of manufacturing thereof are provided for improving heat distribution on the outer surface of an outer layer. The package disclosed herein includes an outer layer comprising an outer surface and an inner surface. In some embodiments, the outer layer may be part of a housing encapsulating the layers disclosed herein. The package disclosed herein can be any suitable package that shaped the electrical components to any suitable form factor. For example, the package may be a housing containing one or more integrated circuits or dies. In some embodiments, the package itself may be an integrated circuit or a closed die. In some embodiments, the outer layer is thermally conductive to act as a heat sink, thereby dissipating heat generated from the circuit system. Any heat generated by the circuit system can refer to the heat output of thermoelectric components of the circuit system (e.g., a high-performance integrated circuit chip or core).
[0007] The package includes an interface layer having an outer surface that contacts an inner surface of an outer layer. In some embodiments, the interface layer includes at least one insulating portion and at least one conductive portion. Each insulating portion is positioned to contact a portion of the heat-generating electrical components of the heat diffuser layer and the circuitry. The insulating portion can be any thermally insulating material. The insulating portion is arranged to reduce heat transfer from the heat-generating electrical components to the outer layer by insulating the portion of the heat diffuser layer in contact with the heat-generating electrical components, thus preventing it from contacting a portion of the outer layer that is typically susceptible to hot spots. With the insulating portion arranged, heat generated from the heat-generating electrical components is laterally transferred along the heat diffuser layer toward each of the conductive portions of the interface layer. The conductive portions are thermally conductive to transfer heat from the heat diffuser layer to the outer layer, in certain areas away from the heat-generating electrical components. In some embodiments, the conductive portions are arranged within the interface layer along the edge of the package to improve heat distribution throughout the outer surface of the outer layer. This improved heat distribution to different portions of the outer layer reduces the likelihood of hot spots forming on the outer surface of the outer layer.
[0008] The heat diffuser layer of the package is arranged such that the outer surface of the heat diffuser contacts the inner surface of the interface layer. The heat diffuser layer can be segmented into three types of features: heat-conducting plates, heat-conducting channels, and heat-collecting sections. Each of the heat-conducting plates is arranged to have thermal contact with a corresponding thermoelectric component of the circuit system and to insulate the inner surface of the outer layer through an insulating portion of the interface layer. Each channel of the heat diffuser layer has thermal contact with at least one heat-conducting plate and at least one heat-collecting section to transfer heat from the heat-conducting plate to the heat-collecting section along the channel. In some embodiments, each corresponding channel is positioned around an electrical component of the circuit system to prevent heat transfer from that channel to the electrical component, which may reduce or eliminate a certain amount of thermal throttling of the electrical component. In some embodiments, the heat-collecting sections of the heat diffuser layer are positioned along the edge of the package, wherein at least one channel transfers heat to each heat-collecting section to divert heat away from the thermoelectric component. The heat-collecting sections have thermal contact with a conductive portion of the interface layer to transfer heat from each heat-collecting section to the inner surface of the outer layer.
[0009] The circuit system is arranged facing the inner surface of the heat diffuser and includes electrical components, at least one of which is a thermoelectric component. The thermoelectric component can be any suitable high-performance electrical component (e.g., an integrated circuit device, such as an application-specific integrated circuit (ASIC) device). In some embodiments, the circuit system includes a printed circuit board (PCB) on which the electrical components can be mounted, the PCB including multiple dielectric layers. In some embodiments, the TIM may be positioned between the respective thermoelectric component and a corresponding heat-conducting plate of the heat diffuser layer.
[0010] In some embodiments, the package includes multiple interface layers and multiple heat diffuser layers. For example, the package may include a second interface layer and a second heat diffuser layer. In this example, the second interface layer and the second heat diffuser layer are disposed between a first heat diffuser layer (previously referred to as a heat diffuser layer) and a circuit system. Similar to the first interface layer, the second interface layer includes a second interface layer outer surface arranged to contact an inner surface of the first heat diffuser layer. The second heat diffuser layer includes a second heat diffuser outer surface and a second heat diffuser inner surface. The second heat diffuser outer surface is arranged to contact the second interface layer inner surface, and the circuit system is arranged to approach and face the second heat diffuser inner surface. In some embodiments, there are more than two interface layers and more than two heat diffuser layers. In this embodiment, no corresponding interface layer is arranged to contact another interface layer, and no corresponding heat diffuser layer is arranged to contact another heat diffuser layer.
[0011] For the purposes of brevity and clarity, the features of this disclosure described herein are in the context of a package having an outer layer, an interface layer, a heat diffuser layer, and a circuit system. However, the principles of this disclosure can be applied to any other suitable context in which a housing for a circuit system is used.
[0012] In particular, this disclosure provides a package and a method of manufacturing the same, wherein the package has improved thermal distribution to reduce the likelihood of hot spots on the outer surface of the outer layer. The provided package and method of manufacturing the same include arranging a heat diffuser layer and an interface layer to reduce or eliminate uneven thermal distribution on the outer layer of the package. This also ensures that the surface temperature of the outer layer remains below the safety and regulatory required touch temperature limits and reduces or eliminates any opportunity for thermal throttling of the circuitry within the package.
[0013] In some embodiments, the circuitry of the package may include any suitable processing circuitry, which may include any suitable processing chip (e.g., an application-specific integrated circuit (ASIC) chip) or processing core.
[0014] In some embodiments, the package and the method for manufacturing the package disclosed herein may include a circuit system used as a storage device system (e.g., an SSD storage system) that includes storage devices (such as solid-state drive devices).
[0015] SSDs are data storage devices that use integrated circuit components as memory to persistently store data. SSDs have no moving mechanical parts, a feature that distinguishes them from traditional electromechanical disks (ECDs), such as hard disk drives (HDDs) or floppy disks, which contain rotating disks and removable read / write heads. Compared to ECDs, SSDs are generally more resistant to physical shocks, operate quietly, have shorter access times, and lower latency.
[0016] Many types of SSDs use NAND-based flash memory, which retains data without power and incorporates a type of non-volatile storage technology. The Quality of Service (QoS) of an SSD can be correlated with the predictability of low latency and consistency across high input / output operations per second (IOPS) when servicing read / write input / output (I / O) workloads. This means that latency, or I / O command completion times, need to be within specified ranges without unexpected outliers. Throughput, or I / O rate, may also need to be tightly tuned without causing sudden drops in performance levels.
[0017] For reference Figure 1-9 To better understand the subject matter of this disclosure.
[0018] Figure 1An illustrated exploded view of a package 100 having a heat diffuser layer 108 according to some embodiments of the present disclosure is shown. The package 100 includes an outer layer 102, a heat diffuser layer 108, and an interface layer 105 having at least one insulating portion 104 and at least one conductive portion 106. The outer layer 102 defines an outer outer surface and an inner outer surface. The interface layer 105 may be defined by an inner interface surface and an outer interface surface, the outer interface surface contacting the inner outer surface of the outer layer 102. The heat diffuser layer 108 may define an inner heat diffuser surface and a thermal layer outer surface, the outer thermal layer contacting the inner interface surface of the interface layer 105. The package 100 also includes a circuitry (not shown) arranged close to and facing the inner heat diffuser surface of the heat diffuser layer 108.
[0019] In some embodiments, the circuit system includes at least one electrical component, any one of which may generate heat during operation. A heat diffuser layer 108 is arranged in thermal contact with the heat-generating electrical component to allow heat to be transferred along the heat diffuser layer 108 away from the heat-generating electrical component. In some embodiments, a thermal interface material (TIM) is disposed between the heat-generating electrical component of the circuit system and the inner surface of the heat diffuser layer 108.
[0020] Each of the heat diffuser layer 108 and the outer layer 102 is thermally conductive. The heat diffuser layer 108 is thermally conductive to facilitate heat transfer away from at least one heat-generating electrical component during operation, thereby reducing the likelihood of hot spots on the outer layer 102. The outer layer 102 is thermally conductive to dissipate heat generated from the at least one electrical component during operation. An interface layer 105 is disposed between the outer layer 102 and the heat diffuser layer 108 to facilitate heat transfer in such a manner as to reduce the likelihood of hot spots on the outer layer 102.
[0021] Insulating portions 104 of the interface layer 105 are disposed between the heat diffuser layer 108 and the outer layer 102. Each insulating portion 104 is configured to be in thermal contact with a portion of the heat diffuser layer 108, which in turn is in thermal contact with one of the at least one thermoelectric generating components. The insulating portions 104 can be any thermally insulating material (e.g., an air bladder). The insulating portions 104 are arranged to reduce direct heat transfer from each thermoelectric generating component by preventing it from being in thermal contact with a portion of the outer layer 102 that is typically susceptible to hot spots through the insulating heat diffuser layer 108. With the insulating portions 104 disposed, heat generated from the at least one thermoelectric generating component can be laterally transferred along the heat diffuser layer 108 toward each of the at least one conductive portion 106 of the interface layer 105. The conductive portions 106 of the interface layer 105 are coplanar with and laterally disposed from the insulating portions 104. The conductive portions 106 are thermally conductive, and in some embodiments, each of the conductive portions 106 may be a thermal interface material (TIM) to provide heat transfer from the heat diffuser layer 108 to the outer layer 102. In some embodiments, the interface layer 105 omits the conductive portions 106 and relies on thermal radiation through the airbag disposed between the heat diffuser layer 108 and the outer layer 102. The conductive portions 106 are disposed within the interface layer 105 along the edge of the package 100 to transfer heat generated from the at least one thermoelectric component away from the area of the package adjacent to the thermoelectric component. This allows heat to be distributed to different portions of the outer layer 102, thereby reducing the likelihood of hot spots forming on the outer layer 102.
[0022] It will be understood that although package 100 depicts an embodiment in which the circuitry is encapsulated by outer and other layers according to this disclosure, any other suitable thermally conductive housing can be implemented in a similar manner. Additionally, although package 100 depicts an embodiment in which an interface layer 105 and a heat diffuser layer 108 are present, package 100 may include more than one interface layer 105 and more than one heat diffuser layer 108, such that the number of interface layers 105 disposed within package 100 is the same as the number of heat diffuser layers 108 disposed within package 100.
[0023] This disclosure is provided in the context of providing the package 100 and its manufacture, for purposes of clarity and brevity and not in a limiting manner, and to provide the features and functions disclosed herein. Package 100 may be implemented, at least in part, as a server device or a storage device.
[0024] Figure 2A schematic cross-sectional view of a package 200 having a heat diffuser layer 108 according to some embodiments of the present disclosure is shown. The package 200 includes a printed circuit board (PCB) 202 and a circuit system 204. In some embodiments, the PCB 202 may be referred to as part of the circuit system 204. The circuit system 204 includes at least one electrical component, wherein the at least one electrical component is a heat-generating electrical component. The circuit system 204 is arranged such that the at least one heat-generating component is in thermal contact with the inner surface of the heat diffuser layer of the heat diffuser layer 108. In some embodiments, a thermal interface material (TIM) 206 may be disposed between the heat diffuser layer 108 and each of the at least one heat-generating electrical component of the circuit system 204. In some embodiments, the TIM 206 may be any suitable thermally conductive material to facilitate heat transfer from the at least one heat-generating electrical component of the circuit system 204 to the heat diffuser layer 108.
[0025] The outer surface of the heat diffuser layer 108 contacts the inner surface of the interface layer 105. As discussed above, the interface layer 105 includes at least one insulating portion 104, which is configured to contact the outer surface of the heat diffuser layer above the at least one thermoelectric component of the circuit system 204. The interface layer 105 also includes at least one conductive portion, which is coplanar with and laterally positioned from the at least one insulating portion 104. The conductive portion 106 is disposed along the edge of the package 200 away from the region adjacent to the at least one thermoelectric component. In some embodiments, the conductive portion 106 may be any suitable thermally conductive material (e.g., thermal interface material (TIM)) to provide heat transfer from the heat diffuser layer 108 to the outer layer 102.
[0026] The outer surface of interface layer 105 may contact the inner surface of outer layer 102. Outer layer 102 is made of a thermally conductive material (e.g., aluminum) to serve as a heat sink for heat generated by circuit system 204. Outer layer 102 is arranged such that heat dissipation occurs from the outer surface of outer layer 102.
[0027] Figure 3 Similar to some embodiments of the present disclosure are shown. Figure 2 A schematic plan view of package 300 of package 200. Package 300 includes an outer layer 102 having an outer outer surface and an inner outer surface. The outer layer 102 of package 300 is thermally conductive to dissipate heat generated from circuit system 204 (specifically, any thermoelectric component). In some embodiments, the outer layer 102 may be part of a housing encapsulating the layers disclosed herein (e.g., interface layer 105, heat diffuser layer 108, and circuit system 204).
[0028] An interface layer is arranged such that its outer surface contacts the inner surface of an outer layer. The interface layer includes at least one insulating portion 104 and at least one conductive portion 106. Each insulating portion is configured to contact a conductive plate 306 of a heat diffuser layer, which is in thermal contact with one of the thermoelectric components of the circuit system 204. The arranged insulating portion facilitates the lateral thermal transfer of heat generated from that thermoelectric component along at least one thermally conductive channel 302 toward a corresponding heat collection section 304 of the heat diffuser layer. The conductive portion 106 of the interface layer is coplanar with and laterally disposed from the insulating portion. Each conductive portion 106 is thermally conductive, and in some embodiments, each of the conductive portions 106 may be a TIM (thermal inductance) to provide heat transfer from the heat collection section 304 to the outer layer 102. The conductive portions 106 are disposed within the interface layer along the edge of the package 300 to transfer heat generated from the thermoelectric component away from the area of the package 300 adjacent to the thermoelectric component. This allows heat to be distributed to different parts of the outer layer 102, thereby reducing the likelihood of hot spots forming on the outer surface of the outer layer.
[0029] A heat diffuser layer is arranged such that its outer surface contacts the inner surface of the interface layer. The heat diffuser layer includes at least one heat-conducting plate 306, at least one heat-conducting channel 302, and at least one heat-collecting section 304. Each of the heat-conducting plates 306 is arranged to have thermal contact with a heat-generating electrical component of the circuit system 204 and is insulated from the inner surface of the outer layer via an insulating portion 104 of the interface layer. Each channel 302 is arranged to have thermal contact with at least one of the heat-conducting plates 306 and at least one heat-collecting section 304 to transfer heat from the heat-conducting plate 306 to the heat-collecting section 304 along the channel 302. The layout of each respective channel 302 is arranged to prevent heat transfer from the respective channel 302 to any of the at least one electrical component of the circuit system 204 to avoid thermal throttling of the electrical component. Each heat-collecting section 304 of the heat diffuser layer is arranged along an edge of the package 300, wherein at least one channel 302 transfers heat to the heat-collecting section 304. Each of the heat collection sections 304 is in thermal contact with the conductive portion 106 of the interface layer, wherein the conductive portion 106 enables heat transfer from the heat collection section 304 to the outer layer 102.
[0030] Figure 4 An illustrated exploded view of another embodiment of the package 400 having a heat diffuser layer 105 is shown, the package being similar to Figure 1Encapsulation 100. This embodiment of encapsulation 400 includes a heat diffuser layer 105 arranged with at least one conductive plate 306, at least one heat collection section, and heat pipes 402 providing heat transfer from the respective conductive plate 306 to the respective heat collection section 304. The heat pipes 402 can be arranged in any suitable encapsulation (e.g., encapsulation 400) to replace, for example, Figure 1-3 The at least one channel seen herein. Each of the heat pipes 402 is disposed in the heat diffuser layer to reduce heat transfer from the respective heat pipe 402 to any of the electrical components of the circuit system, thereby avoiding thermal throttling of the electrical components.
[0031] Similar to Figure 1 The package 100 and package 400 include an outer layer 102, a heat diffuser layer 108, and an interface layer 105, the interface layer having at least one insulating portion 104 and at least one conductive portion 106. Package 400 also includes a circuit system (not shown) arranged close to and facing the inner surface of the heat diffuser layer 108.
[0032] An insulating portion 104 of the interface layer 105 is disposed between the heat diffuser layer 108 and the outer layer 102, each insulating portion 104 being configured to contact a corresponding conductive plate 306. With the insulating portions 104 disposed, heat generated from the at least one thermoelectric component can be laterally transferred along the heat pipe 402 toward each heat collection section 304 that is in thermal contact with a corresponding conductive portion 106 of the interface layer 105. The conductive portions 106 of the interface layer 105 are coplanar with and laterally disposed from the insulating portions 104. The conductive portions 106 are thermally conductive, and in some embodiments, each of the conductive portions 106 may be a thermal interface material (TIM) to provide heat transfer from the heat collection section 304 to the outer layer 102.
[0033] Figure 5 A schematic diagram illustrating the temperature distribution along the outer layer 102 of a package 500 without a heat diffuser layer, according to some embodiments of the present disclosure. A first region 502 of the package 500 includes hot spots, such that the surface temperature of the outer layer 102 is 75.4°C, while a second region 504 has a surface temperature of 58.0°C. This difference in the corresponding surface temperatures of the first region 502 and the second region 504 indicates that the package 500 provides poor thermal distribution of heat generated within the package 500. The hot spots at the first region 502 can indicate the area where a source of heat is generated within the package.
[0034] Figure 6A schematic diagram of the temperature distribution along the outer layer 102 of a package 600 having a heat diffuser layer, according to some embodiments of the present disclosure, is shown. The respective external temperature of each of the first region 602 and the second region 604 is 65°C, which shows an improved heat distribution along the outer layer 102 when compared to the heat distribution of the package 500.
[0035] Figure 7 A flowchart illustrating the illustrative steps of a process 700 for manufacturing an encapsulation having a heat diffuser layer according to some embodiments of the present disclosure is shown. In some embodiments, the referenced outer layer, interface layer, heat diffuser layer, circuit system, insulation portion, conductive portion, heat-conducting plate, heat-conducting channel, and heat-collecting section may be implemented as outer layer 102, interface layer 105, heat diffuser layer 108, circuit system 204, insulation portion 104, conductive portion 106, heat-conducting plate 306, heat-conducting channel 302, and heat-collecting section 304, respectively. In some embodiments, process 700 may be modified, for example, by rearranging, changing, adding, and / or removing steps.
[0036] At step 702, an outer layer is disposed, the outer layer including an outer surface and an inner surface. The outer layer of the package is thermally conductive to dissipate heat generated from the circuitry (specifically, any thermoelectric components). In some embodiments, the outer layer may be part of a housing encapsulating the layers disclosed herein.
[0037] At step 704, an interface layer is arranged such that its outer surface contacts the inner surface of the outer layer. The interface layer includes at least one insulating portion and at least one conductive portion. Each insulating portion is configured to contact a portion of the heat diffuser layer, which in turn has thermal contact with one of at least one thermoelectric component of the circuit system. The insulating portion can be any thermally insulating material. The insulating portion is arranged to reduce direct heat transfer from each thermoelectric component by avoiding thermal contact with a typically hot spot portion of the outer layer through the insulating heat diffuser layer. With the insulating portion arranged, heat generated from the at least one thermoelectric component can be laterally transferred along the heat diffuser layer toward each of the at least one conductive portion of the interface layer. The conductive portion is coplanar with and laterally disposed from the insulating portion. Each conductive portion is thermally conductive, and in some embodiments, each of the conductive portions can be a TIM (thermal insulating material) to provide heat transfer from the heat diffuser layer to the outer layer. The conductive portion is disposed within the interface layer along the edge of the package to transfer heat generated from the at least one thermoelectric component away from the area of the package adjacent to the thermoelectric component. This allows heat to be distributed to different parts of the outer layer, thereby reducing the likelihood of hot spots forming on the outer layer.
[0038] At step 706, a heat diffuser layer is arranged such that the outer surface of the heat diffuser contacts the inner surface of the interface layer. The arranged heat diffuser layer includes at least one heat-conducting plate, at least one heat-conducting channel, and at least one heat-collecting section. Each of the heat-conducting plates is arranged to have thermal contact with a heat-generating electrical component of the circuit system and to be insulated from the inner surface of the outer layer through an insulating portion of the interface layer. Each channel of the heat diffuser layer has thermal contact with at least one and at least one heat-collecting section in the heat-conducting plate to transfer heat from the heat-conducting plate to the heat-collecting section along the channel. Each corresponding channel is disposed in the heat diffuser layer to prevent heat transfer from the corresponding channel to any of the at least one electrical component of the circuit system, thereby avoiding thermal throttling of the electrical component. Each heat-collecting section of the heat diffuser layer is arranged along the edge of the package, wherein at least one channel transfers heat to each heat-collecting section. Each heat-collecting section has thermal contact with a conductive portion of the interface layer, wherein the conductive portion enables heat transfer from the heat-collecting section to the outer layer.
[0039] At step 708, the circuit system is arranged close to and facing the inner surface of the heat diffuser. The arranged circuit system includes at least one electrical component, wherein at least one of these electrical components is a heat-generating electrical component. The heat-generating electrical component can be any suitable high-performance electrical component (e.g., an integrated circuit device, such as an application-specific integrated circuit (ASIC) device). The circuit system includes a printed circuit board (PCB) on which the at least one electrical component can be mounted, and the PCB may include multiple dielectric layers. In some embodiments, the TIM may be disposed between the respective heat-generating electrical component and a respective heat-conducting plate of the heat diffuser layer. In some embodiments, the layout design of the heat-conducting channels for the heat diffuser layer depends on the arranged electrical components of the circuit system. The at least one channel is arranged to reduce the amount of heat transfer from the respective channel to any of the at least one electrical component of the circuit system.
[0040] In some embodiments, process 700 may include additional steps for arranging a plurality of interface layers and a plurality of heat diffuser layers. For example, a second interface layer and a second heat diffuser layer are disposed between a first heat diffuser layer (previously referred to as a heat diffuser layer) and a circuit system. The outer surface of the second interface layer is arranged to contact the inner surface of the first heat diffuser layer. Additionally, the outer surface of the second heat diffuser is arranged to contact the inner surface of the second interface layer. The circuit system is then arranged to approach and face the inner surface of the second heat diffuser. In some embodiments, there are more than two interface layers and more than two heat diffuser layers. In this embodiment, no corresponding interface layer is arranged to contact another interface layer, and no corresponding heat diffuser layer is arranged to contact another heat diffuser layer.
[0041] Figure 8A flowchart illustrating the illustrative steps of a process 800 for arranging a heat diffuser layer of an encapsulation according to some embodiments of the present disclosure is shown. In some embodiments, the referenced outer layer, interface layer, heat diffuser layer, circuit system, insulation portion, conductive portion, heat-conducting plate, heat-conducting channel, and heat-collecting section may be implemented as outer layer 102, interface layer 105, heat diffuser layer 108, circuit system 204, insulation portion 104, conductive portion 106, heat-conducting plate 306, heat-conducting channel 302, and heat-collecting section 304, respectively. In some embodiments, process 800 may be modified, for example, by rearranging, changing, adding, and / or removing steps.
[0042] At step 802, at least one thermally conductive channel is arranged to transfer heat along the at least one channel. The channel is arranged to facilitate distributed heat transfer throughout the package to reduce or eliminate the possibility of hot spots appearing on the outer surface of the outer layer.
[0043] At step 804, at least one electrical component is arranged such that at least one channel is not arranged above the at least one electrical component to prevent heat transfer from the at least one channel to the at least one electrical component. The electrical component is part of the circuit system of the package. In some embodiments, the circuit system includes a PCB on which the at least one electrical component can be mounted, the PCB including multiple dielectric layers. In some embodiments, channels of a heat diffuser layer are arranged around the electrical components of the circuit system to reduce the amount of heat transfer from the respective channels to any one of the at least one electrical component of the circuit system.
[0044] At step 806, at least one heat-conducting plate is arranged in thermal contact with at least one heat-conducting channel, each respective heat-conducting plate being disposed above a respective thermoelectric component. In some embodiments, a heat-conducting plate (TIM) is disposed between the respective thermoelectric component and the respective conductive plate to ensure thermal contact and heat transfer from the respective thermoelectric component and the respective conductive plate. The heat transferred from the thermoelectric component continues along the at least one heat-conducting channel in thermal contact with the conductive plate.
[0045] At step 808, at least one heat collection segment is arranged to be in thermal contact with at least one heat-conducting plate, each heat collection segment being positioned close to the edge of the package. Each of the heat collection segments is in thermal contact with at least one conductive plate via at least one heat-conducting channel. Heat transferred from the conductive plate along the respective channel continues to the corresponding heat collection segment, which is in thermal contact with the conductive portion of the interface layer. Additionally, each heat collection segment of the heat diffuser layer is arranged along the edge of the package to provide improved heat distribution to the outer layer.
[0046] Figure 9 Examples of embodiments according to this disclosure are shown. Figure 7The flowchart illustrates the steps of the subprocess 900 for arranging the interface layer as shown at step 704. In some embodiments, the referenced outer layer, interface layer, heat diffuser layer, circuit system, insulation portion, conductive portion, heat-conducting plate, heat-conducting channel, and heat collection section may be implemented as outer layer 102, interface layer 105, heat diffuser layer 108, circuit system 204, insulation portion 104, conductive portion 106, heat-conducting plate 306, heat-conducting channel 302, and heat collection section 304, respectively. In some embodiments, the subprocess 900 may be modified, for example, by rearranging, changing, adding, and / or removing steps.
[0047] At step 902, at least one insulating portion is arranged, each corresponding insulating portion disposed between each corresponding heat-conducting plate and the inner surface of the outer layer. Each insulating portion has any suitable thermal insulation material, including but not limited to insulation forms, air pockets, or flowable air channels. The insulating portions are arranged to prevent direct heat transfer from the conductive plates to the outer layer, these conductive plates being positioned in thermal contact with the corresponding thermoelectric components. This arrangement of the insulating portions facilitates heat transfer from each corresponding conductive plate along any channel in thermal contact with each corresponding conductive plate. Lateral heat transfer through the channels of the heat diffuser layer continues to at least one heat collection section.
[0048] At step 904, at least one conductive portion coplanar with the insulating portion is arranged, each corresponding conductive portion disposed between each corresponding heat collection section and the inner surface of the outer layer. In some embodiments, one or more conductive portions of the interface layer may be omitted. In this embodiment, an airbag may be disposed between the heat diffuser layer and the outer layer, and heat is transferred from the heat diffuser layer to the outer layer by thermal radiation through the airbag. Each conductive portion of the interface layer has any suitable thermally conductive material, including but not limited to TIM. The conductive portions are arranged to allow heat transfer directly from the heat collection section to the outer layer. Each of the heat collection sections is a portion of the heat diffuser layer that receives heat from the thermoelectric generating component via conductive plates and channels. In some embodiments, each of the heat collection sections is positioned along the edge of the package away from the area adjacent to the at least one thermoelectric generating component. This arrangement ensures improved heat distribution throughout the package to reduce the likelihood of hot spots appearing on the outer surface of the outer layer.
[0049] Unless otherwise expressly specified, the terms “an embodiment,” “an embodiment,” “multiple embodiments,” “the embodiment,” “these embodiments,” “one or more embodiments,” “some embodiments,” and “an embodiment” mean “one or more (but not all) embodiments.”
[0050] Unless otherwise expressly specified, the terms “including,” “comprising,” “having,” and their variations mean “including but not limited to.”
[0051] Unless otherwise explicitly stated, the enumerated list of items does not imply that any or all items are mutually exclusive.
[0052] Unless otherwise expressly specified, the terms “a,” “an,” and “the” mean “one or more.”
[0053] Unless otherwise expressly specified, devices communicating with each other do not need to communicate continuously. Furthermore, devices communicating with each other may communicate directly or indirectly through one or more intermediaries.
[0054] The description of an embodiment having several components that communicate with each other does not imply that all such components are required. Instead, various optional components are described to illustrate a wide range of possible embodiments. Furthermore, while process steps, method steps, algorithms, etc., may be described in a sequential order, such processes, methods, and algorithms may be configured to operate in an alternating order. In other words, any order or sequence of steps that can be described does not necessarily indicate a requirement to perform these steps in that order. The steps of the process described herein may be performed in any actual order. Furthermore, some steps may be performed simultaneously.
[0055] When a single device or article is described herein, it will be readily apparent that more than one device / article (whether or not they cooperate) may be used in place of the single device / article. Similarly, when more than one device or article (whether or not they cooperate) is described herein, it will be readily apparent that a single device / article may be used in place of the more than one device or article, or that a different number of devices / articles may be used in place of the number of devices or programs shown. The function and / or features of a device may alternatively be embodied by one or more other devices that are not explicitly described as having such function / features. Therefore, other embodiments do not need to include the device itself.
[0056] The figures illustrate at least some of the operations, showing certain events occurring in a specific order. In alternative embodiments, certain operations may be performed, modified, or removed in a different order. Furthermore, steps may be added to the logic described above and still conform to the described embodiments. Further, the operations described herein may occur sequentially, or some operations may be processed in parallel. Still further, operations may be performed by a single processing unit or by distributed processing units.
[0057] The foregoing description of various embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or limiting to the precise forms disclosed. In view of the above teachings, many modifications and variations are possible.
Claims
1. A package comprising multiple layers, said layers comprising: The outer layer includes the outer surface and the inner surface of the outer layer; An interface layer includes an outer surface and an inner surface, wherein the outer surface of the interface layer is in contact with the inner surface of the outer layer. A heat diffuser layer, comprising an outer surface and an inner surface of a heat diffuser, wherein the outer surface of the heat diffuser contacts the inner surface of the interface layer; and The circuit system is arranged close to and facing the inner surface of the heat diffuser.
2. The packaging component according to claim 1, wherein, Each of the outer layer and the thermal expander layer includes a thermally conductive material.
3. The package according to claim 1, wherein, The heat diffuser layer further includes at least one heat-conducting channel to transfer heat along the at least one channel.
4. The package according to claim 3, wherein, The circuit system includes at least one electrical component, and at least one channel is not arranged above the at least one electrical component to prevent heat transfer from the at least one channel to the at least one electrical component.
5. The package according to claim 1, wherein, The thermal expander layer further includes at least one heat-conducting plate in thermal contact with at least one heat-conducting channel, each corresponding heat-conducting plate being disposed above the corresponding thermoelectric component.
6. The package according to claim 5, wherein, The interface layer further includes: At least one insulating component, each corresponding insulating component being disposed between each corresponding heat-conducting plate and the inner surface of the outer layer; and At least one conductive portion coplanar with the insulating portion, each corresponding conductive portion being disposed between each corresponding heat collection section and the inner surface of the outer layer.
7. The package according to claim 1, wherein, The heat diffuser layer further includes: At least one heat-conducting plate; and At least one heat collection section; wherein: Each heat collection section is in thermal contact with at least one heat-conducting plate, and each heat collection section is positioned close to the edge of the package.
8. The package according to claim 7, further comprising at least one thermally conductive channel, wherein, Each heat conduction channel is in thermal contact with at least one heat conduction plate and at least one heat collection section.
9. The package of claim 1, further comprising a thermal interface material (TIM) disposed between the circuit system and the inner surface of the heat diffuser.
10. The package according to claim 1, wherein, The circuit system includes a printed circuit board (PCB).
11. The package of claim 1, further comprising a housing encapsulating the plurality of layers, the housing including the outer layer.
12. The package according to claim 1, wherein, The temperature of the outer layer is kept below the safety and regulatory limits for touch temperature.
13. The package according to claim 1, further comprising: The second interface layer includes an outer surface of the second interface layer and an inner surface of the second interface layer, wherein the outer surface of the second interface layer is in contact with the inner surface of the heat diffuser layer. as well as The second heat diffuser layer includes a second heat diffuser outer surface and a second heat diffuser inner surface, the second heat diffuser outer surface being arranged to contact the second interface layer inner surface, and the circuit system being close to and facing the second heat diffuser inner surface.
14. A method for manufacturing a package, the method comprising: An outer layer is provided, the outer layer comprising an outer surface and an inner surface; An interface layer is arranged such that the outer surface of the interface layer is in contact with the inner surface of the outer layer; Arrange the heat diffuser layer so that the outer surface of the heat diffuser is in contact with the inner surface of the interface layer; as well as Arrange the circuit system close to and facing the inner surface of the thermal diffuser.
15. The method for manufacturing a package according to claim 14, wherein, Each of the outer layer and the thermal expander layer includes a thermally conductive material.
16. The method for manufacturing a package according to claim 14, wherein, Arranging the heat diffuser layer includes: arranging at least one heat-conducting channel to transfer heat along the at least one channel.
17. The method for manufacturing a package according to claim 16, wherein, The circuit system includes: arranging at least one electrical component, and not arranging at least one channel above the at least one electrical component to prevent heat transfer from the at least one channel to the at least one electrical component.
18. The method for manufacturing a package according to claim 14, wherein, Arranging the heat expander layer includes: arranging at least one heat-conducting plate in thermal contact with at least one heat-conducting channel, with each corresponding heat-conducting plate positioned above a corresponding thermoelectric component.
19. The method for manufacturing a package according to claim 18, wherein, The interface layer layout includes: At least one insulating component is arranged, each corresponding insulating component being disposed between each corresponding heat-conducting plate and the inner surface of the outer layer; and At least one conductive portion is arranged coplanarly with the insulation portion, and each corresponding conductive portion is disposed between each corresponding heat collection section and the inner surface of the outer layer.
20. The method for manufacturing a package according to claim 14, wherein, Arranging the heat diffuser layer includes: Arrange at least one heat-conducting plate; and At least one heat collection section is arranged to be in thermal contact with at least one heat-conducting plate, and each heat collection section is positioned close to the edge of the package.
21. The method for manufacturing a package according to claim 20, the method further comprising: At least one heat conduction channel is arranged, wherein each channel is arranged to be in thermal contact with at least one heat conduction plate and at least one heat collection section.
22. The method for manufacturing a package according to claim 14, further comprising: Thermal interface material (TIM) is applied between the circuit system and the inner surface of the thermal diffuser.
23. The method for manufacturing a package according to claim 14, further comprising: Laying out printed circuit board (PCB) layers, and The circuit system is mounted onto the PCB layer.
24. The method for manufacturing a package according to claim 14, further comprising: The package is enclosed in a housing, wherein the housing includes the outer layer.
25. The method for manufacturing a package according to claim 14, further comprising: A second interface layer is arranged such that the outer surface of the second interface layer contacts the inner surface of the heat diffuser layer; as well as A second heat diffuser layer is arranged such that the outer surface of the second heat diffuser contacts the inner surface of the second interface layer, and the circuit system is close to and faces the inner surface of the second heat diffuser.
26. A housing comprising: A housing, wherein the housing encapsulates multiple layers, the multiple layers comprising: The outer layer includes the outer surface and the inner surface of the outer layer; An interface layer includes an outer surface and an inner surface, wherein the outer surface of the interface layer is in contact with the inner surface of the outer layer. A heat diffuser layer, comprising an outer surface and an inner surface of a heat diffuser, wherein the outer surface of the heat diffuser contacts the inner surface of the interface layer; and The circuit system is arranged close to and facing the inner surface of the heat diffuser.