Cover unit and grinding system comprising same

Abstract

One embodiment of the present invention provides a cover unit comprising: a main body part into which a gas is injected; and a gas supply part which is provided on one side of the main body part and supplies gas to the main body part. Wherein, in the interior of the main body part, at least one discharge flow path is formed, and the discharge flow path provides a discharge path through which the gas injected into the main body part is discharged to the bottom surface.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to a cover unit and a grinding system including the same. BACKGROUND

[0002] Recently, as various electronic devices such as mobile phones, PDAs (personal digital assistants), computers, large TVs, etc. are developed, the demand for flat panel displays applicable thereto is gradually increasing.

[0003] The substrate used in such flat panel displays, etc. is generally made of a tempered glass material having enhanced strength, but the strength thereof is decreased due to fine cracks, etc. occurring at a cutting surface due to a mechanical cutting process in a process of cutting a mother glass into independent panels.

[0004] In particular, such fine cracks, etc. mainly occur along the edge line of the cut substrate, and a grinding process is performed on the fine cracks, etc. using a grinder, etc. to enhance the strength of the edge line.

[0005] In the grinding process, the grinding wheel is rotated while maintaining a predetermined rotational speed, and contacts the edge portion of the substrate to perform grinding of the substrate, but in this process, the grinding surface generates high heat due to friction, and when the grinding operation is continuously performed, the grinding surface is cracked, resulting in a decrease in grinding quality.

[0006] In the past, in order to improve the grinding quality, a method of directly spraying grinding water to the grinding point to eliminate heat due to friction and prevent the spattering of byproducts has been proposed, but such a case has a problem in that the yield of the substrate is increased due to the entry of moisture and foreign substances into the inside of the substrate. SUMMARY

[0007] TECHNICAL PROBLEM

[0008] Embodiments of the present application have been developed in order to solve the above problems, and aim to provide a cover unit and a grinding system capable of preventing the flow of moisture and foreign substances into the central portion of a substrate in a grinding process.

[0009] However, this problem is exemplary, and the scope of the present application is not limited thereto.

[0010] TECHNICAL SOLUTION

[0011] One embodiment of the present application provides a cover unit, including: a main body portion into which a gas is injected; and a gas supply portion provided at one side of the main body portion to supply the gas to the main body portion, wherein one or more discharge flow paths are formed inside the main body portion, the discharge flow paths providing a discharge path for the gas injected into the main body portion to be discharged to a bottom surface.

[0012] Another embodiment of the present application provides a polishing system, including: a table unit on which a polishing object is placed; a cover unit configured on the polishing object; and a polishing unit which polishes a side surface of the polishing object protruding to an outside of the cover unit; wherein the cover unit includes: a main body portion into which a gas is injected; and a gas supply portion provided at one side of the main body portion, which supplies the gas to the main body portion; wherein one or more discharge flow paths are formed inside the main body portion, which provide a discharge path for discharging the gas injected into the main body portion to a bottom surface.

[0013] Further aspects, features, and advantages of the present application will become apparent from the following drawings, claims, and detailed description.

[0014] Effects of the Invention

[0015] According to the cover unit and the polishing system of the present embodiment, the moisture or foreign matter can be blocked from flowing into the center portion of the substrate during the edge portion polishing process.

[0016] In addition, the substrate failure rate occurring during the polishing process can be minimized, and the productivity can be improved.

[0017] In addition, by easily adjusting the flow rate and pressure of the first and second spray portions, the polishing system can be applied to various polishing objects, and the polishing quality of the polishing object can be improved.

[0018] Of course, the scope of the present application is not limited by such effects. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 FIG. 1 is a perspective view briefly showing a polishing system according to an embodiment of the present application.

[0020] Figure 2 FIG. 2 is a front view briefly showing a polishing system according to an embodiment of the present application.

[0021] Figure 3 FIG. 3 is a cross-sectional view showing a portion A of FIG. 2 in an enlarged manner. Figure 2

[0022] FIG. 4 is a cross-sectional view showing a portion B of FIG. 2 in an enlarged manner. Figure 4 Figure 3

[0023] Figure 5 FIG. 6 is a view showing a case where foreign matter is blocked when a polishing system according to an embodiment of the present application performs a polishing operation.

[0024] Figure 6 ​​This is a top view used to describe the gas ejected from a grinding system according to an embodiment of the present invention. Detailed Implementation

[0025] The following embodiments are described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding structures are given the same reference numerals, and repeated descriptions of them are omitted.

[0026] Various modifications can be applied to this embodiment, and specific embodiments will be exemplarily shown in the accompanying drawings and described in detail in the summary of the invention. (Referring to the following and attached figures...) Figure 1 As described in the detailed description, the effects, features, and methods of achieving this embodiment will become clear. However, this embodiment is not limited to the embodiments disclosed below and can be implemented in various forms.

[0027] To clearly illustrate the invention in the accompanying drawings, parts unrelated to the description are omitted, and similar reference numerals are used for similar parts throughout the specification.

[0028] In the following embodiments, the terms "first," "second," etc., are not limiting in meaning, but are used to distinguish one structure from other structures.

[0029] In the following embodiments, the singular expression includes the plural expression unless the context explicitly indicates otherwise.

[0030] In the following embodiments, terms such as "including" or "having" mean the presence of the features or structures described in the specification, without pre-excluding the possibility of adding more than one other feature or structure.

[0031] In the following embodiments, when referring to a unit, region, structure, or other part being above or on top of other parts, it includes not only the case where it is immediately above other parts, but also the case where other units, regions, structures, or other parts exist in between.

[0032] In the following embodiments, unless the context explicitly indicates otherwise, terms such as connection or combination do not imply that two components must be directly and / or fixedly connected or combined, and do not exclude the presence of other components between the two components.

[0033] In the accompanying drawings, the dimensions of the structures may be exaggerated or reduced for ease of description. For example, the dimensions and thicknesses of the structures shown in the figures are arbitrarily depicted for ease of description, and therefore the following embodiments are not necessarily limited to what is shown.

[0034] Figure 1 To provide a simplified perspective view of a grinding system 10 according to an embodiment of the present invention, Figure 2 A front view of a grinding system 10 according to an embodiment of the present invention is shown for brevity.

[0035] ReferenceFigure 1 and Figure 2 According to an embodiment of the present invention, the grinding system 10 may include a cover unit 100, a worktable unit 200, and a grinding unit 300. In addition, the grinding system 10 may also include a controller (not shown) that controls the cover unit 100, the worktable unit 200, and the grinding unit 300.

[0036] The grinding system 10 is a system for grinding the side surface, i.e., the edge region, of the object to be ground, M. The grinding object M that the grinding system 10 can grind is not limited to a specific purpose or shape.

[0037] For example, the object to be polished, M, can be a brittle substrate such as a glass substrate, or a mother glass in which light-emitting elements such as OLEDs are formed and a protective film covering the light-emitting elements is attached. Furthermore, the thickness of the object to be polished, M, is not particularly limited; for example, the object to be polished, M, can have a thickness of 0.1 mm or more and 5 mm or less.

[0038] On the other hand, in the accompanying drawings, for ease of description, the grinding object M is shown as a square flat plate, however, the shape and size of the grinding object M are not limited to this, and it can have various shapes and sizes in practice.

[0039] The cover unit 100 can be configured on the upper part of the grinding object M, and can be configured at a predetermined distance from the grinding object M. A space for gas flow can be formed between the cover unit 100 and the upper part of the grinding object M.

[0040] The shroud unit 100 can spray gas from the top of the grinding object M toward the grinding object M. The shroud unit 100 may include a main body 110 and a gas supply unit 120.

[0041] The main body 110 can be configured in a shape corresponding to the object being polished, M. For example, when the object being polished, M, is a substrate with a square flat plate shape, the appearance of the main body 110 can be configured in a box shape. The area of ​​the main body 110 on the plane can be smaller than the area of ​​the object being polished, but it is not limited thereto.

[0042] The main body 110 may have a predetermined height, and an accommodating space may be formed inside the main body 110. The accommodating space formed inside the main body 110 may be a structure that opens toward the bottom surface of the main body 110.

[0043] In one embodiment, the main body 110 may include a first annular main body portion surrounding the receiving space and a second main body portion attached to the upper side of the first main body portion. The second main body portion may be a cover for opening and closing the receiving space.

[0044] The second main body can be made of a transparent material so that the user can see the interior. In this case, the user can directly see the condition of the object being polished M through the second main body so that any defects in the object being polished M can be dealt with quickly.

[0045] The main body 110 can be configured to cover a portion of the object to be ground M. A protective film can be attached to the surface of the object to be ground M, and the area where the protective film is attached can be defined as a protective region CA. The protective region CA can be positioned at the center of the object to be ground M. The main body 110 can be configured to cover the protective region CA of the object to be ground M.

[0046] At this time, the bottom surface of the main body 110 facing the grinding object M can be arranged at a predetermined distance from the grinding object M. The main body 110 is configured to cover a part of the grinding object M, so that the side of the grinding object M that is ground by the grinding unit 300 can protrude to the outside of the main body 110.

[0047] Inside the main body 110, one or more discharge flow paths for gas flow can be formed. A detailed description of the discharge flow paths formed inside the main body 110 will be provided later. Figure 3 and Figure 4 Describe it.

[0048] The gas supply unit 120 can be connected to an external gas storage device (not shown). The gas supply unit 120 can provide gas supplied by the external gas storage device to the discharge flow path formed inside the main body 110.

[0049] When multiple discharge paths are provided, the gas supply unit 120 can supply gas to each discharge path. For example, the gas used by the hood unit 100 can be distributed from an external gas storage device and injected into each discharge path of the main body 110 through multiple pipes included in the gas supply unit 120. The pressure or flow rate of the gas supplied to the discharge path can be independently controlled by a controller.

[0050] In another embodiment, multiple discharge paths formed inside the main body 110 can be connected to an external gas storage device (not shown) via an injection pipe (not shown). In this case, the controller can also control the valves connected to each discharge path to independently control the pressure or flow rate of the gas supplied to each path. For ease of description, the following description focuses on the scenario where each discharge path independently obtains gas from the gas storage device.

[0051] On the other hand, although not shown in the figure, the cover unit 100 may have a movable part (not shown). The movable part can move the cover unit 100 so that the cover unit 100 is positioned on the upper part of the grinding object M.

[0052] The movable unit can adjust the position of the cover unit 100 so that it is positioned at a predetermined interval from the top of the object being ground M. Furthermore, after the object being ground M is finished, the movable unit can move the cover unit 100 to a position that does not interfere with the movement of the object being ground M. The movement of the cover unit 100 via the movable unit can be controlled by a controller.

[0053] The worktable unit 200 may have a mounting surface for placing the grinding object M. After the grinding object M is placed on the mounting surface of the worktable unit 200, an independent fixing member provided on the worktable unit 200 can fix the grinding object M. Therefore, it can prevent the grinding object M from shaking during the process. At this time, in order to grind the side surface, the grinding object M can be configured to protrude from the side surface of the worktable unit 200 by a second distance d2 (refer to...). Figure 3 ).

[0054] In one embodiment, the worktable unit 200 includes a gas jetting section that can jet gas toward the bottom surface of the workpiece M. Specifically, the workpiece M can be fixed at the upper part of the worktable unit 200 at a predetermined distance from the edge of the worktable unit 200, and a space for gas flow can be formed between the edge of the worktable unit 200 and the bottom surface of the workpiece M. The flow rate and pressure of the gas jetted by the worktable unit 200 can be controlled by a controller.

[0055] On the other hand, the worktable unit 200 may be further equipped with a transfer unit (not shown) for transferring the grinding object M. The transfer unit can be used to obtain the grinding object M from other devices before the grinding process begins, or to transfer the ground grinding object M to other devices after the grinding process is completed.

[0056] Alternatively, the transfer unit can also move the grinding object M in one direction while the grinding wheel 310 is in contact with it, so as to start the grinding process. The direction and speed of movement of the grinding object M by the transfer unit can be controlled by a controller.

[0057] The grinding unit 300 may be configured at a position spaced apart from the worktable unit 200. The grinding unit 300 may include a grinding wheel portion 310, a rotating unit 320, and a drive unit 330.

[0058] The grinding wheel 310 can rotate around the rotation axis Ax. The grinding wheel 310 can contact the side of the object to be ground M to grind the edge area of ​​the object to be ground M.

[0059] The rotating unit 320 can rotate the grinding wheel section 310. For example, the rotating unit 320 can be a spindle motor. The rotation speed of the rotating unit can be controlled by a controller.

[0060] The drive unit 330 can drive the grinding wheel 310 to perform linear motion. Specifically, the drive unit 330 can adjust the position of the grinding wheel 310 so that the grinding wheel 310 contacts the side of the object being ground M, allowing the grinding wheel 310 to move along the side of the object being ground M.

[0061] More specifically, the drive unit 330 can control the movement of the grinding wheel 310 so that the contact force between the grinding object M and the grinding wheel 310 remains uniform along the grinding direction.

[0062] Furthermore, the drive unit 330 can adjust the slope of the rotation axis Ax that rotates the grinding wheel section 310. The drive unit 330 can either fix the rotation axis Ax in a state adjusted to a specific slope, or it can be configured to make the slope of the rotation axis Ax variable depending on the usage conditions. The drive unit 330 can be controlled by a controller.

[0063] The following is for reference Figure 3 and Figure 4 The discharge path formed on the cover unit 100 and the gas flow in the grinding system 10 are described in detail.

[0064] Figure 3 To show in magnified form Figure 2 A cross-sectional view of part A. Figure 4 To show in magnified form Figure 3 A cross-sectional view of part B. Figure 5 The figure illustrates a situation where the grinding system 10 according to an embodiment of the present invention blocks foreign objects during grinding operations.

[0065] Reference Figure 3 and Figure 5 Inside the main body 110, one or more discharge flow paths may be formed. For ease of description, the present invention will be described below with an embodiment in which a first discharge flow path 115 and a second discharge flow path 117 are formed inside the main body 110; however, the number of discharge flow paths formed inside the main body is not limited thereto.

[0066] One end of the first discharge passage 115 is open on the bottom surface 118 of the main body 110 and can be connected to the first discharge section 112. The other end of the first discharge passage 115 can be connected to the gas supply section 120. The first discharge passage 115 can serve as a discharge path for the gas inside the main body 110 to be discharged to the outside through the bottom surface 118.

[0067] The diameter of the first discharge flow path 115 can be formed to ensure that the gas ejected from the first discharge section 112 does not damage the grinding object M, for example, it can have a value selected from the range of 0.1 mm or more and 1 mm or less.

[0068] The first discharge path 115 may extend in a direction having a predetermined angle relative to the bottom surface 118. The direction in which the first discharge path 115 extends may be a direction inclined at a first angle θ1 relative to the bottom surface 118. In this case, the first angle θ1 may be a value selected from the range between 0 degrees and 90 degrees.

[0069] Furthermore, the first discharge flow path 115 can be inclined in a direction that moves further and further away from the center of the main body 110 from one end of the first discharge flow path 115 to the other end. Since the first discharge flow path 115 is configured to form a first angle θ1 with respect to the bottom surface 118, the gas ejected from the first discharge section 112 is dispersed in a direction from the center of the bottom surface 118 toward the edge.

[0070] In one embodiment, multiple first discharge channels 115 may be provided, and the multiple first discharge channels 115 may be configured to form a predetermined layout inside the main body 110. Therefore, the first discharge portion 112 connected to the multiple first discharge channels 115 may be arranged along the edge of the bottom surface 118 of the main body 110.

[0071] In one embodiment, a first through flow path 114 may be connected between the first discharge flow path 115 and the gas supply unit 120. The first through flow path 114 can supply gas from the gas supply unit 120 to the first discharge flow path 115.

[0072] The first through flow path 114 may extend at an angle different from the angle formed by the first discharge flow path 115 relative to the bottom surface 118 of the main body 110. As an example, the first through flow path 114 may extend in a direction parallel to the bottom surface 118 of the main body 110.

[0073] The diameter of the first through flow path 114 may be larger than the diameter of the first discharge flow path 115, but is not limited thereto. Multiple first through flow paths 114 may be provided corresponding to the number of first discharge flow paths 115, but are not limited thereto. As another example, the number of first through flow paths 114 may also be less than the number of first discharge flow paths 115, and multiple first discharge flow paths 115 may be connected to one first through flow path 114.

[0074] One end of the second discharge passage 117 may be opened on the bottom surface 118 of the main body 110 to form a second discharge section 113. The second discharge passage 117, together with the first discharge passage 115, can serve as a discharge path for the gas inside the main body 110 to be discharged to the outside through the bottom surface 118.

[0075] The second discharge passage 117 may be configured separately from the first discharge passage 115 along a first direction. The first direction may refer to the direction from the side of the main body 110 toward the center of the main body 110. That is, the second discharge passage 117 may be configured further inside the main body 110 than the first discharge passage 115. Therefore, the second discharge portion 113 connected to the second discharge passage 117 may be configured further inside the bottom surface 118 of the main body 110 than the first discharge portion 112.

[0076] In one embodiment, the length of the second discharge flow path 117 may be shorter than the length of the first discharge flow path 115. However, the present invention is not limited thereto, and the length of the second discharge flow path 117 may also be equal to or greater than the length of the first discharge flow path 115.

[0077] The diameter of the second discharge flow path 117 can be formed to ensure that the gas ejected from the second discharge section 113 does not damage the grinding object M, and for example, it can have a value selected from the range of 0.1 mm or more and 1 mm or less. The diameter of the second discharge flow path 117 can be the same as the diameter of the first discharge flow path 115, but it is not limited thereto.

[0078] In one embodiment, the second discharge flow path 117 may extend along a direction having a predetermined angle relative to the bottom surface 118. The direction in which the second discharge flow path 117 extends may be a direction inclined at a second angle θ2 relative to the bottom surface 118. In this case, the second angle θ2 may be a value selected from the range between 0 degrees and 90 degrees. The inclination direction of the second discharge flow path 117 may be the same as the inclination direction of the first discharge flow path 115.

[0079] The second angle θ2 formed by the second discharge flow path 117 and the bottom surface 118 may be the same as or different from the first angle θ1 formed by the first discharge flow path 115 and the bottom surface 118. For example, the second angle θ2 formed by the second discharge flow path 117 and the bottom surface 118 may be smaller than the first angle θ1 formed by the first discharge flow path 115 and the bottom surface 118. The second discharge flow path 117 has a smaller angle than the first discharge flow path 115 and is inclined towards the inside of the main body 110. Therefore, the gas ejected from the second discharge section 113 disperses a greater force toward the edge of the bottom surface 118 than the gas ejected from the first discharge section 112.

[0080] In one embodiment, multiple second discharge channels 117 may be provided. Multiple second discharge channels 115 may be configured to form a predetermined layout inside the main body 110, and second discharge portions 113 connected to the second discharge channels 117 may be arranged along the edge of the bottom surface 118 of the main body 110.

[0081] In one embodiment, a second through flow path 116 may be connected between the second discharge flow path 117 and the gas supply section 120. This second through flow path 116 extends in a direction different from the extension direction of the second discharge flow path 117. The second through flow path 116 serves to supply gas from the gas supply section 120 to the second discharge flow path 117. As an example, the second through flow path 116 may extend in a direction parallel to the bottom surface 118 of the main body section 110, but is not limited thereto.

[0082] The diameter of the second through flow path 116 may be larger than the diameter of the second discharge flow path 117, but is not limited thereto. In addition, the diameter of the second through flow path 116 may be larger than the diameter of the first through flow path 114, but is not limited thereto, and may be smaller than or equal to the diameter of the first through flow path 114.

[0083] In one embodiment, a plurality of second through flow paths 116 may be provided corresponding to a plurality of second discharge flow paths 117. As another example, the number of second through flow paths 116 may also be less than the number of second discharge flow paths 117, in which case one or more second discharge flow paths 117 may be connected to one second through flow path 116.

[0084] In one embodiment, the second flow path 116 may overlap with the first flow path 114 when viewed in a plane. Here, "when viewed in a plane" can be defined as when viewing the main body 110 from above. That is, the first flow path 114 and the second flow path 116 may be configured to have different heights at their overlapping positions.

[0085] As a specific example, the first height h1 from the bottom surface 118 to the first flow path 114 may be higher than the second height h2 from the bottom surface 118 to the second flow path 116. However, the present invention is not limited thereto; of course, the first height h1 may also be lower than the second height h2, and the first flow path 114 and the second flow path 116 may also be configured at the same height.

[0086] On the other hand, in one embodiment, the other end of the second through flow path 116 connected to the second discharge flow path 117 may be formed by a predetermined inclined surface. For example, the other end of the second through flow path 116 may be equipped with an inclined surface having the same slope as the inclination angle of the second discharge flow path 117. Thus, the second through flow path 116 and the first discharge flow path 115 can be configured adjacent to each other without interfering with each other.

[0087] On the other hand, the first discharge flow path 115 and / or the second discharge flow path 117 may also be directly connected to the gas supply unit 120 without passing through the first through flow path 114 and / or the second through flow path 116.

[0088] The gas pressure in the first discharge path 115 may be the same as or different from the gas pressure in the second discharge path 117. In other words, the pressure of the gas discharged from the second discharge path 117 to the outside through the second discharge section 113 may be the same as or different from the pressure of the gas discharged from the first discharge path 115 to the outside through the first discharge section 112.

[0089] As a specific example, the pressure of the gas discharged from the second discharge path 117 can be greater than the pressure of the gas discharged from the first discharge path 115. In this case, the gas discharged from the second discharge path 117 can more easily push the gas discharged from the first discharge path 115 towards the edge of the bottom surface 118, and can more perfectly block foreign objects flowing into the center of the bottom surface 118.

[0090] On the other hand, a first discharge portion 112 and a second discharge portion 113 may be formed on the bottom surface 118 of the main body portion 110. The first discharge portion 112 and the second discharge portion 113 may be arranged apart by a first distance d1 along a first direction.

[0091] The first discharge portion 112 and the second discharge portion 113 may have a slit shape extending along the edge of the bottom surface 118, but are not limited thereto. For example, the first discharge portion 112 and the second discharge portion 113 may use various hole shapes such as circular holes, elliptical holes, and polygonal holes.

[0092] In the bottom surface 118 of the main body 110, the second discharge section 113 may be disposed further inside than the first discharge section 112. Here, "inner" means closer to the center of the bottom surface 118. Therefore, the gas discharged from the second discharge section 113 can push the gas discharged from the first discharge section 112 toward the edge of the bottom surface 118.

[0093] Specifically, the bottom surface 118 of the main body 110 can be configured to be separated from the grinding object M by a first gap g1. Gases sprayed from the first discharge section 112 and the second discharge section 113 toward the grinding object M move toward the edge of the bottom surface 118 through the first gap g1 and are discharged to the outside.

[0094] Grinding byproducts P and foreign matter such as dust in the air that occur on the grinding surface where the grinding object M contacts the grinding wheel 310 are blocked for the first time by the gas ejected from the first discharge section 112.

[0095] At this time, a portion of the gas ejected from the first discharge section 112 can generate an airflow flowing counter-currently towards the center of the bottom surface 118 on the first interval g1. The cover unit 100 of the present invention also includes a second discharge flow path 117 disposed inside the first discharge flow path 115, thereby blocking foreign objects that were not blocked by the first discharge section 112 for a second time. At this time, the second discharge section 113 can also eject gas at an angle smaller than the gas injection angle of the first discharge section 112 to block the airflow flowing counter-currently towards the center of the bottom surface 118.

[0096] On the other hand, in one embodiment, a groove 119 may be formed on the bottom surface 118 of the main body portion 110, which is further inward than the first discharge flow path 115 and the second discharge flow path 117. That is, the groove 119 may be configured to be closer to the center of the bottom surface 118 than the second discharge portion 113.

[0097] For example, the groove 119 may have a shape that is recessed toward the center of the main body 110; however, the shape of the groove 119 is not limited to this, and a groove shape that is recessed from the bottom surface 118 of the main body 110 may also be used. The groove 119 may extend a predetermined length along the edge of the bottom surface 118. The groove 119 may be formed along the edge of the bottom surface 118 to form a ring, but it is not limited to this, and multiple grooves may be arranged along the edge of the bottom surface 118.

[0098] As a specific example, the groove 119 may have an inclined surface 119-1 that is inclined relative to the bottom surface 118 of the main body 110 and a vertical surface 119-2 connected to the inclined surface 119-1. The inclined surface 119-1 may have an inclination that is recessed towards the center of the main body 110 of the bottom surface 118, and the vertical surface 119-2 may be perpendicular to the bottom surface 118. The vertical surface 119-2 may be disposed further inward than the inclined surface 119-1.

[0099] The groove 119 can function as follows: it blocks the flow of fine water mist particles on the first interval g1, which cannot be removed by the gas sprayed by the first discharge section 112 and the second discharge section 113, into the center direction of the bottom surface 118, that is, the center direction of the grinding object M.

[0100] Specifically, after the fine water mist particles moving towards the center of the object being ground M flow into the tank 119, they can rise along the inclined surface 119-1, and upon encountering the vertical surface 119-2, form droplets and fall onto the object being ground M. Thus, the tank 119 can perfectly prevent water from flowing into the protective area CA of the object being ground M, which is located inside the tank 119.

[0101] As described above, the cover unit 100 includes an inclined discharge flow path inside the main body 110, which can prevent foreign objects from entering the protective area CA of the grinding object M, and has a groove 119 disposed inside the second discharge flow path 117, which can perfectly block fine water mist particles that are difficult to remove.

[0102] Water-sensitive structures such as light-emitting elements can be formed on the surface of the object being polished, and a protective film can be attached to protect it. Therefore, the polishing system 10 can be configured with the cover unit 100 separated from the object being polished by a first interval g1 on the surface of the object being polished, and gas can be sprayed through one or more discharge channels, thereby preventing damage to the structures formed on the surface of the object being polished while preventing moisture and foreign matter from flowing into the interior.

[0103] On the other hand, in one embodiment, the worktable unit 200 can fix the grinding object M and spray gas onto the bottom surface of the grinding object M. Specifically, the edge of the worktable unit 200 can be configured to be separated from the bottom surface of the grinding object M by a second interval g2, and the gas sprayed by the worktable unit 200 can be discharged to the outside through the second interval g2. At this time, the second interval g2 can have a value smaller than the first interval g1, but is not limited thereto.

[0104] As described above, the grinding system 10 of the present invention can block grinding byproducts P and foreign matter such as moisture from both above and below the grinding object M through the cover unit 100 and the worktable unit 200, thereby improving the grinding quality, preventing defects in the grinding object M caused by foreign matter, and thus improving productivity.

[0105] Figure 6 This is a top view used to describe the gas ejected from a grinding system 10 according to an embodiment of the present invention.

[0106] Reference Figure 6 When the object to be ground, M, has a square flat plate shape, the main body 110 can have an exhaust flow path formed inside, so that an airflow is formed along the entire edge corresponding to the four sides of the object to be ground, and discharged to the outside. Therefore, when the grinding wheel 310 moves along the outer periphery of the object to be ground and performs grinding, foreign objects can be prevented from entering the protective area in the center of the object to be ground on all four sides of the object to be ground.

[0107] As another example, the main body 110 may also be configured to discharge gas only in a portion of its edges. For example, the main body 110 may also discharge gas only at three of its four edges.

[0108] On the other hand, the accompanying drawings exemplarily show a case where the grinding object M has a square flat plate shape and the main body 110 has a box shape. However, the present invention is not limited to this, and the shape of the main body 110 can be modified in various ways to correspond to the shape of the grinding object M. For example, when the grinding object M has a circular flat plate shape, the main body 110 can be configured as a cylindrical shape that can cover a part of the grinding object M.

[0109] As described above, the present invention has been described with reference to one embodiment shown in the accompanying drawings, but this is merely exemplary, and it will be understood by those skilled in the art that various modifications and variations of the embodiments can be made therefrom. Therefore, the true scope of protection of the present invention should be determined by the technical concept of the appended claims.

[0110] Figure label:

[0111] 10: Grinding System

[0112] 100: Cover unit

[0113] 110: Main body

[0114] 111: Capacity

[0115] 112: First discharge section

[0116] 113: Second discharge section

[0117] 114: First through flow path

[0118] 115: First discharge flow path

[0119] 116: Second flow path

[0120] 117: Second discharge flow path

[0121] 118: Bottom

[0122] 120: Gas Supply Department

[0123] 200: Workbench Unit

[0124] 300: Grinding Unit

Claims

1. A cover unit, comprising: The main body is supplied with gas. and A gas supply unit, disposed on one side of the main body, supplies gas to the main body; wherein... Inside the main body, one or more discharge channels are formed, which provide a discharge path for the gas injected into the main body to be discharged to the bottom surface.

2. The cover unit according to claim 1, wherein, The discharge path is inclined at a predetermined angle relative to the bottom surface.

3. The cover unit according to claim 1, wherein, Inside the main body, a first discharge flow path and a second discharge flow path are formed, which are separated from each other.

4. The cover unit according to claim 3, wherein, The second discharge path is formed further inside the main body than the first discharge path.

5. The cover unit according to claim 3, wherein, The first discharge path or the second discharge path is inclined at a predetermined angle relative to the bottom surface.

6. The cover unit according to claim 3, wherein, The gas pressure in the first discharge path is the same as the gas pressure in the second discharge path.

7. The cover unit according to claim 3, wherein, The gas pressure in the first discharge path is different from the gas pressure in the second discharge path.

8. The cover unit according to claim 3, wherein, Inside the main body, a first through flow path connected to the first discharge flow path and a second through flow path connected to the second discharge flow path are formed. The first or second flow path extends in a direction parallel to the bottom surface of the main body.

9. The cover unit according to claim 8, wherein, The first flow path and the second flow path overlap when viewed from a plane.

10. The cover unit according to claim 1, wherein, The discharge flow path is equipped with multiple [paths / channels]. One end of each of the plurality of discharge paths forms a predetermined layout in the bottom surface of the main body.

11. The cover unit according to claim 1, wherein, The main body has a groove formed on its bottom surface. The groove is located further inside the main body than the discharge flow path.

12. A grinding system, comprising: A worktable unit, wherein the worktable unit is used to place the object to be ground; A cover unit, wherein the cover unit is disposed on the grinding object body; and A grinding unit that grinds the side surface of the object to be ground, which protrudes to the outside of the cover unit; wherein, The cover unit includes: Main body, wherein gas is injected; and A gas supply unit, disposed on one side of the main body, supplies gas to the main body; wherein... One or more discharge channels are formed inside the main body, which provide a discharge path for the gas injected into the main body to be discharged to the bottom surface.

13. The grinding system according to claim 12, wherein, The discharge path is inclined at a predetermined angle relative to the bottom surface.

14. The grinding system according to claim 12, wherein, A first discharge flow path and a second discharge flow path, which are separated from each other, are formed inside the main body.

15. The grinding system according to claim 14, wherein, The second discharge path is formed further inside the main body than the first discharge path.

16. The grinding system according to claim 14, wherein, The first discharge path or the second discharge path is inclined at a predetermined angle relative to the bottom surface.

17. The grinding system according to claim 14, wherein, The gas pressure in the first discharge path is the same as the gas pressure in the second discharge path.

18. The grinding system according to claim 14, wherein, The gas pressure in the first discharge path is different from the gas pressure in the second discharge path.

19. The grinding system according to claim 14, wherein, A first through-flow path connected to the first discharge flow path and a second through-flow path connected to the second discharge flow path are formed inside the main body. The first or second flow path extends in a direction parallel to the bottom surface of the main body.

20. The grinding system according to claim 12, wherein, The discharge flow path is equipped with multiple [paths / channels]. One end of the plurality of discharge channels forms a predetermined layout on the bottom surface of the main body.

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