Micro-nozzle cleaning apparatus and electronic device

Abstract

The invention provides a micro nozzle cleaning apparatus and an electronic device. The micro-nozzle cleaning apparatus includes a cleaning nozzle for spraying an abrasive slurry containing abrasive particles onto a micro-nozzle, where a diameter of the micro-nozzle is 50 [mu] m or less and a concentration of the abrasive particles is 0.1 vol% to 10 vol%.

Description

[0001] This application claims priority to and all benefits arising therefrom of Korean Patent Application No. 10-2024-0131047, filed on September 26, 2024, the contents of which are fully incorporated herein by reference. Technical Field

[0002] The disclosure relates to a micro nozzle cleaning device, a micro nozzle cleaning method, and an electronic device. Background Technology

[0003] Recently, with the increasing interest in information display, research and development of manufacturing equipment for display devices has been ongoing. Summary of the Invention

[0004] The disclosed aspect will provide a micro-nozzle cleaning device and method capable of effectively removing resin foreign matter from micro-nozzles.

[0005] The disclosed aspects are not limited to those described above, and other technical aspects not described will be clearly understood by those skilled in the art from the following description.

[0006] According to a disclosed embodiment, a micro-nozzle cleaning device includes: a cleaning nozzle for spraying an abrasive slurry containing abrasive particles onto the micro-nozzle, wherein the diameter of the micro-nozzle is 50 micrometers (μm) or less, and the concentration of the abrasive particles is from 0.1 volume percentage (vol%) to 10 vol.

[0007] The distance between the end of the micro nozzle and the end of the cleaning nozzle can be from 0.1 mm to 5 mm.

[0008] The diameter of the cleaning nozzle can be from 0.1mm to 2mm.

[0009] The spray pressure of the cleaning nozzle can be 20 bar or greater.

[0010] The micro nozzle cleaning device may also include a nozzle receiving unit positioned below the micro nozzle.

[0011] The nozzle receiving unit may include a splash guard surrounding the cleaning nozzle.

[0012] The nozzle receiving unit may also include a gasket that contacts the lower part of the micro nozzle.

[0013] The micro-nozzle cleaning equipment may also include a storage unit for storing abrasive slurry.

[0014] The average diameter of the abrasive particles can range from submicron (0.1 μm) to 6 μm.

[0015] Abrasive particles can include colloidal inorganic particles.

[0016] Abrasive particles may include at least one of FeO, Fe2O3, Fe3O4, CeO2, SiC, SiO2, ZrO2, and Al2O3.

[0017] Abrasive slurries may include water and / or glycerin.

[0018] Abrasive slurries may also include surfactants and / or dispersants.

[0019] According to the disclosed embodiments, in the micro-nozzle cleaning method, an abrasive slurry containing abrasive particles is sprayed, and resin foreign matter is separated from the end of the micro-nozzle of the spray distributor by the diffused abrasive slurry, so as to remove hardened resin foreign matter from the end of the micro-nozzle in the process of ejecting resin through the micro-nozzle.

[0020] The diameter of the micro-nozzle can be 50 μm or smaller.

[0021] The abrasive slurry can be sprayed within 3 seconds.

[0022] The concentration of abrasive particles can be from 0.1 vol% to 10 vol%.

[0023] The injection pressure of the abrasive slurry can be 20 bar or higher.

[0024] The average diameter of the abrasive particles can range from submicron (0.1 μm) to 6 μm.

[0025] Abrasive particles can include colloidal inorganic particles.

[0026] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0027] According to a disclosed embodiment, an electronic device includes: a processor for providing input image data; and a display device for displaying an image based on the input image data, wherein the display device is manufactured using a jet dispenser including micro-nozzles, and the micro-nozzles are cleaned using a micro-nozzle cleaning device, the micro-nozzle cleaning device including a cleaning nozzle for jetting an abrasive slurry containing abrasive particles onto the micro-nozzles, and the diameter of the micro-nozzles is 50 μm or less, and the concentration of abrasive particles is 0.1 vol% to 10 vol.

[0028] According to the above embodiments, abrasive slurry can be used to clean micro-nozzles.

[0029] The effects of the embodiments are not limited to those illustrated above, and many more effects are included in this specification. Attached Figure Description

[0030] The above and other features of the disclosure will become clearer by referring to the accompanying drawings, in which: Figure 1 This is a side view of the spray dispenser according to an embodiment; Figure 2 This is a plan view of the miniature nozzle according to an embodiment; Figure 3 This is a side view of a miniature nozzle according to an embodiment; Figure 4 This is a side view of a miniature nozzle cleaning device according to an embodiment; Figures 5 to 7 This is a side view of each process step of the micro-nozzle cleaning method according to the embodiment; Figure 8 and Figure 9 This is an exemplary diagram illustrating a micro-nozzle cleaned by a micro-nozzle cleaning apparatus and method according to an embodiment; Figure 10 This is a block diagram of an electronic device according to an embodiment; and Figure 11 Schematic diagrams of various embodiments of the electronic device are shown. Detailed Implementation

[0031] The advantages and features disclosed, as well as methods for implementing them, will become clear from the embodiments described in detail below with reference to the accompanying drawings. However, the disclosure is not limited to the embodiments disclosed below and can be implemented in a variety of different forms.

[0032] The presented embodiments are provided so that the disclosure will be thorough and complete, and that those skilled in the art will fully understand the scope of the disclosure. The disclosure is limited only by the scope of the claims.

[0033] The terminology used in this specification is for describing embodiments and is not intended to limit disclosure. In this specification, the singular form includes the plural form as well as the singular form, unless otherwise stated. "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0034] The terms “comprising” and / or “including” and variations thereof include the described components, steps, operations and / or elements, but do not exclude the presence or addition of one or more other components, steps, operations and / or elements or combinations thereof.

[0035] The terms “combination” or “connection” can collectively refer to a physical combination or connection and / or an electrical combination or connection. This can collectively refer to a direct or indirect combination or connection, as well as a holistic or non-holistic combination or connection.

[0036] The use of the term "on" another element or layer to refer to an element or layer includes cases where the element or layer is directly disposed on the other element or layer, or where there is another element or layer between them. Throughout this specification, the same reference numerals indicate the same components.

[0037] Although terms such as "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, within the spirit of the disclosed art, the first component described below can be the second component.

[0038] Throughout the disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof. The disclosed embodiments are described in detail below with reference to the accompanying drawings.

[0039] Figure 1 This is a side view of the spray dispenser according to an embodiment. Figure 2 This is a plan view of the micro-nozzle according to an embodiment. Figure 3 This is a side view of a miniature nozzle according to an embodiment.

[0040] The spray dispenser 10 is a manufacturing device for the display device, and can be used to discharge and coat a solution (e.g., resin) onto the substrate of the display device.

[0041] The spray dispenser 10 can be used when manufacturing electronic devices (such as smartphones, televisions, laptops, tablet PCs, computing systems, display systems, smart glasses, head-mounted displays (HMDs), or vehicle display devices) in which the display surface is applied to at least one surface.

[0042] Reference Figures 1 to 3 The injection distributor 10 may include a needle 11, a flow path 12, a micro nozzle 13 and / or a piezoelectric element 14.

[0043] The needle 11 can be configured to move up and down. For example, the needle 11 can be repeatedly moved up and down by repeatedly applying and blocking voltages to the piezoelectric element 14 (e.g., repeatedly moving up and down on a third direction DR3 perpendicular to the plane defined by the first direction DR1 and the second direction DR2), and the solution can be discharged according to the number of times the needle 11 moves up and down, wherein the micro-nozzle 13 is disposed on the plane defined by the first direction DR1 and the second direction DR2.

[0044] Needle 11 can discharge the solution filled in flow path 12. Needle 11 can be used to push the solution so that the solution filled in flow path 12 can be discharged through micro nozzle 13.

[0045] According to an embodiment, a sensor module for setting the operating range of the needle 11 can be further provided. The sensor module can determine the maximum operating range when the needle 11 is initially driven and operate the needle 11 within the maximum operating range, thereby preventing the needle 11 from being damaged due to excessive descent and collision with the micro-nozzle 13.

[0046] According to an embodiment, the injection dispenser 10 may further include a conversion member. One side of the conversion member may be disposed on one side of the piezoelectric element 14, and the other side of the conversion member may be disposed on one side of the needle 11.

[0047] When a voltage is applied to the piezoelectric element 14, the piezoelectric element 14 can expand. The direction of the energy generated by the expansion of the piezoelectric element 14 can be converted by the conversion member and transmitted to the needle 11. The needle 11 can descend in the downward direction, and the solution can be discharged through the outlet of the micro nozzle 13.

[0048] When the voltage applied to the piezoelectric element 14 is cut off, the piezoelectric element 14 can retract, and the needle 11 can rise in the upward direction and return to its initial position.

[0049] However, the operation method of the conversion component is not limited to this, and the conversion component can be omitted depending on the arrangement of the piezoelectric element 14 and the needle 11.

[0050] The diameter D1 of the micro-nozzle 13 can be 50 μm or smaller. For fine application, the diameter D1 of the micro-nozzle 13 can be 40 μm or smaller. As described above, the spray dispenser 10 equipped with the micro-nozzle 13 can perform precise fine application, thereby reducing the dead zone of the display device and achieving a high-resolution display device. However, as the diameter of the micro-nozzle 13 decreases, the micro-nozzle 13 may be susceptible to nozzle clogging caused by resin foreign matter and be difficult to clean. Furthermore, when it is impossible to clean the micro-nozzle 13 clogged with resin foreign matter, the yield may decrease (such as causing mass dispersion) until the micro-nozzle 13 is replaced and stabilized. For example, in the case of the micro-nozzle 13, cleaning using a microscope and needle pins is not possible, and cleaning can be performed using resin solvents and ultrasound, but the cleaning effect may be minimal due to the limitation of cleaning capacity. Therefore, the micro-nozzle cleaning apparatus 20 according to the embodiment (see Figure 4 Resin foreign matter in the micro-nozzle 13 can be easily removed in a short time using an abrasive slurry without stopping the operation of the spray dispenser 10. See later. Figures 5 to 9 Describe it in detail.

[0051] According to an embodiment, the spray dispenser 10 may further include a supply unit. The supply unit can supply solution to the flow path 12. The supply unit may be a solution tank in which the solution is filled internally. The solution supplied from the supply unit can fill the flow path 12 and be discharged to the outside through the micro-nozzle 13.

[0052] According to an embodiment, a compressor that generates pressure inside the supply unit may also be provided on the supply unit. For example, the solution filled in the supply unit can be moved by the pressure of the air generated by the compressor to flow path 12, which will be described later. According to an embodiment, the compressor may be omitted.

[0053] The piezoelectric element 14 can contract or expand by an applied voltage. The solution filling the flow path 12 can be discharged to the outside through the outlet of the micro-nozzle 13 due to the contraction or expansion of the piezoelectric element 14.

[0054] According to an embodiment, the jet dispenser 10 may further include a control unit that supplies voltage to the piezoelectric element 14. The control unit can adjust the flow rate of the solution discharged through the micro-nozzle 13 according to the change in length of the piezoelectric element 14 by supplying voltage to the piezoelectric element 14 to cause the piezoelectric element 14 to contract or expand. The jet dispenser 10 described above can achieve rapid response, quantitative discharge, and precise jet rate by utilizing the piezoelectric characteristics of the piezoelectric element 14 (i.e., the characteristic of contracting or expanding when voltage is applied).

[0055] Figure 4 This is a side view of a miniature nozzle cleaning device according to an embodiment.

[0056] Reference Figure 4 The micro nozzle cleaning device 20 may include a cleaning nozzle 21, a pump 22, a storage unit 23 and / or nozzle receiving units 24 and 25.

[0057] The abrasive slurry in storage unit 23 can be supplied by pump 22 and sprayed through cleaning nozzle 21. Cleaning nozzle 21 can spray the abrasive slurry onto micro-nozzle 13 to clean micro-nozzle 13. The abrasive slurry sprayed from cleaning nozzle 21 can directly contact or abrade hardened resin foreign matter at the outlet or end of micro-nozzle 13 to separate the resin foreign matter.

[0058] The diameter D2 of the cleaning nozzle 21 can be 2 mm or smaller. For example, the diameter D2 of the cleaning nozzle 21 can be from 0.1 mm to 2 mm, but it is not limited to this.

[0059] The abrasive slurry may include abrasive particles dispersed in water and / or glycerol. The concentration of abrasive particles in the abrasive slurry may range from 0.1 vol% to 10 vol%. When the concentration of abrasive particles in the abrasive slurry is too low or too high, the cleaning effect may be reduced.

[0060] The average diameter of the abrasive particles can range from submicron (0.1 μm) to 6 μm. When the average diameter of the abrasive particles is too small or too large, the cleaning effect may be minimal and may affect the micro-nozzle 13. However, the concentration and average diameter of the abrasive particles are not limited to these and can be varied within a range that can effectively remove resin foreign matter from the micro-nozzle 13.

[0061] In embodiments, the abrasive particles may be in a colloidal state. For example, the abrasive particles may include colloidal inorganic particles. The abrasive particles may include, but are not limited to, colloidal silica particles. The abrasive particles may include at least one of FeO, Fe2O3, Fe3O4, CeO2, SiC, SiO2, ZrO2, and Al2O3, but are not limited to. According to embodiments, the abrasive slurry may also include surfactants and / or dispersants.

[0062] Nozzle receiving units 24 and 25 may surround the cleaning nozzle 21. Nozzle receiving units 24 and 25 may at least partially surround the pump 22 and / or storage unit 23. Nozzle receiving units 24 and 25 may provide space therein for accommodating the miniature nozzle 13 of the spray dispenser 10. Nozzle receiving units 24 and 25 may be positioned below the miniature nozzle 13. One side of nozzle receiving units 24 and 25 may be adjacent to the storage unit 23. The other side of nozzle receiving units 24 and 25 may be adjacent to the miniature nozzle 13.

[0063] In an embodiment, nozzle receiving units 24 and 25 may include a splash guard 24 and a gasket 25. The splash guard 24 may at least partially surround the cleaning nozzle 21, the pump 22, and / or the storage unit 23. The splash guard 24 may provide space therein for accommodating the miniature nozzle 13 of the spray dispenser 10.

[0064] One side of the splash cover 24 may be adjacent to the storage unit 23. The other side of the splash cover 24 may be connected to the gasket 25. The gasket 25 may be adjacent to the lower part of the micro-nozzle 13. For example, the gasket 25 may contact the lower part of the micro-nozzle 13. The gasket 25 may be fixed to the lower part of the micro-nozzle 13, but is not limited to this.

[0065] Next, a micro-nozzle cleaning method using the micro-nozzle cleaning device 20 according to the above embodiment will be described.

[0066] Figures 5 to 7 This is a side view of each process step of the micro-nozzle cleaning method according to an embodiment. Figures 5 to 7 It is used to describe the use Figure 4 A side view of the micro-nozzle cleaning method of the micro-nozzle cleaning device 20. For ease of description, the micro-nozzle cleaning method is simply shown, and detailed descriptions of the previously described symbols are omitted.

[0067] Reference Figure 5 Firstly, in the process of discharging resin or the like from the micro-nozzle 13, resin may remain in the outlet or end of the micro-nozzle 13. When the resin remaining in the outlet of the micro-nozzle 13 is exposed to a light source, the resin will easily harden. In this case, the outlet of the micro-nozzle 13 may become narrowed due to the hardened resin foreign matter 13R in the outlet of the micro-nozzle 13. Therefore, the fluid discharged from the micro-nozzle 13 may decrease or fluctuate unstablely, which may cause defects. As a result, the outlet of the micro-nozzle 13 may be completely blocked by the resin foreign matter 13R.

[0068] The micro-nozzle cleaning device 20 can be moved to the position of the micro-nozzle 13 blocked by resin foreign matter 13R and positioned below the micro-nozzle 13. The end of the cleaning nozzle 21 can be configured to face the end of the micro-nozzle 13. The end of the cleaning nozzle 21 can face the outlet or end of the micro-nozzle 13 in the vertical direction (e.g., in the third direction DR3). The vertical distance D12 between the end of the cleaning nozzle 21 and the end of the micro-nozzle 13 (e.g., in the third direction DR3) can be from 0.1 mm to 5 mm. However, the distance D12 is not limited to this and can be varied within a range in which the abrasive slurry ejected from the cleaning nozzle 21 can remove the resin foreign matter 13R from the micro-nozzle 13 by contacting or rubbing against it. According to an embodiment, the micro-nozzle cleaning device 20 may also include a height adjustment unit that moves the cleaning nozzle 21 up and down to adjust the vertical distance D12 between the end of the cleaning nozzle 21 and the end of the micro-nozzle 13 (e.g., in the third direction DR3).

[0069] Reference Figure 6 and Figure 7 Subsequently, an abrasive slurry is sprayed to remove the hardened resin foreign matter 13R at the outlet or end of the micro-nozzle 13. The abrasive slurry in the storage unit 23 can be supplied by the pump 22 and sprayed through the cleaning nozzle 21. The resin foreign matter 13R can be separated from the outlet or end of the micro-nozzle 13 and removed by the abrasive slurry sprayed through the cleaning nozzle 21.

[0070] The abrasive slurry may include abrasive particles dispersed in water and / or glycerol. The concentration of abrasive particles in the abrasive slurry may range from 0.1 vol% to 10 vol%. When the concentration of abrasive particles in the abrasive slurry is too low or too high, the cleaning effect may be reduced.

[0071] The average diameter of the abrasive particles can range from submicron (0.1 μm) to 6 μm. When the average diameter of the abrasive particles is too small or too large, the cleaning effect may be minimal and may affect the micro-nozzle 13. However, the concentration and average diameter of the abrasive particles are not limited to these and can be varied within a range that can effectively remove resin foreign matter 13R from the micro-nozzle 13.

[0072] In embodiments, the abrasive particles may be in a colloidal state. For example, the abrasive particles may include colloidal inorganic particles. The abrasive particles may include, but are not limited to, colloidal silica particles. The abrasive particles may include at least one of FeO, Fe2O3, Fe3O4, CeO2, SiC, SiO2, ZrO2, and Al2O3, but are not limited to. According to embodiments, the abrasive slurry may also include surfactants and / or dispersants.

[0073] The spray pressure of the cleaning nozzle 21 can be 20 bar or greater. For example, the spray pressure of the cleaning nozzle 21 can be from 20 bar to 300 bar. However, the spray pressure of the cleaning nozzle 21 is not limited to this and can be varied in various ways within the range in which resin foreign matter 13R can be removed by the abrasive slurry sprayed from the cleaning nozzle 21.

[0074] In an embodiment, the abrasive slurry spraying time of the cleaning nozzle 21 can be within 3 seconds in order to remove resin foreign matter 13R without affecting the micro-nozzle 13. However, the spraying time of the abrasive slurry is not limited to this and can be varied within a range in which resin foreign matter 13R can be removed without affecting the micro-nozzle 13. According to an embodiment, the micro-nozzle cleaning device 20 may also include a control unit for controlling the spraying time point or time of the abrasive slurry.

[0075] exist Figures 5 to 7 The present invention illustrates a method for cleaning the micro-nozzles 13 of the spray distributor 10 using the micro-nozzle cleaning device 20, but the disclosure is not limited thereto and can be applied to all fields in which micro-nozzles are used, such as solenoids, pneumatic distributors and air sprayers.

[0076] According to the micro-nozzle cleaning method described above, by spraying abrasive slurry onto the micro-nozzle 13, resin foreign matter 13R on the micro-nozzle 13 can be removed and cleaned within a short time without stopping the operation of the spray distributor 10. Therefore, since it is not necessary to replace the nozzle and the additional settings required after nozzle replacement can be omitted, the yield can be improved.

[0077] Furthermore, since the micro-nozzle cleaning device 20 according to the embodiment can remove the hardened resin foreign matter 13R at the outlet of the micro-nozzle 13 without a precise alignment device, the device cost can be reduced and the convenience can be improved.

[0078] Figure 8 and Figure 9 This is an exemplary diagram illustrating a micro-nozzle cleaned by a micro-nozzle cleaning apparatus and method according to an embodiment. Figure 8 The image shows a micro-nozzle with a diameter of 35 μm before (A1) and after (A2) cleaning. Figure 9 The image shows a micro-nozzle with a diameter of 50 μm before (B1) and after (B2) cleaning.

[0079] Reference Figure 8 and Figure 9 It can be confirmed that, through the micro-nozzle cleaning device 20 and method according to the embodiment, the resin foreign matter 13R is removed and the micro-nozzle clogging is improved.

[0080] The display device according to the embodiments is applicable to various types of electronic devices. In the embodiments, the electronic device includes the above-described display device, and may also include other modules or devices with additional functions in addition to the display device.

[0081] Figure 10 This is a block diagram of an electronic device according to an embodiment. (Refer to...) Figure 10 The electronic device 100 may include a display module 110, a processor 120, a memory 130, and a power module 140.

[0082] Processor 120 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller. Processor 120 can provide input image data.

[0083] The memory 130 can store data and / or information used to operate the processor 120 or the display module 110. When the processor 120 executes an application stored in the memory 130, image data signals and / or input control signals can be transmitted to the display module 110. The display module 110 can process the provided signals and output image information on the display screen.

[0084] The power module 140 may include a power supply module (such as a power adapter or battery device) and a power conversion module. The power conversion module converts the power supplied by the power supply module and generates power to operate the electronic device 100.

[0085] At least one of the aforementioned components of electronic device 100 may be included in the display device according to the embodiment described above. Furthermore, regarding functionality, some of the modules included in a single module may be included in the display device, while other modules may be separately disposed from the display device. For example, display module 110 is included in the display device, while processor 120, memory 130, and power module 140 are not included in the display device but are separately disposed in electronic device 100.

[0086] Figure 11 Schematic diagrams of various embodiments of the electronic device are shown.

[0087] Reference Figure 11 Various types of electronic devices in embodiments incorporating display devices may include electronic devices for displaying images (such as smartphones 100_1a, tablet PCs 100_1b, laptop computers 100_1c, televisions (TVs) 100_1d, and desktop monitors 100_1e), wearable electronic devices including display modules (such as smart glasses 100_2a, head-mounted displays (HMDs) 100_2b, and smartwatches 100_2c), and automotive electronic devices 100_3 including display modules (such as central information displays (CIDs) and interior mirror displays located on the dashboard, center instrument panel, and dashboard of a vehicle).

[0088] It will be understood by those skilled in the art that the disclosure can be implemented in modified forms without departing from the foregoing essential features. Therefore, the disclosed method should be considered from a descriptive rather than a limiting perspective. The scope of the disclosure is shown in the claims but not in the foregoing description, and all differences within that scope shall be interpreted as included in the disclosure.

Claims

1. A miniature nozzle cleaning device, the miniature nozzle cleaning device comprising: Cleaning nozzles are used to spray abrasive slurry containing abrasive particles onto micro-nozzles. The micro-nozzle has a diameter of 50 μm or less, and The concentration of the abrasive particles is from 0.1 vol% to 10 vol%.

2. The micro-nozzle cleaning device according to claim 1, wherein, The distance between the end of the micro-nozzle and the end of the cleaning nozzle is 0.1 mm to 5 mm.

3. The micro-nozzle cleaning device according to claim 1, wherein, The diameter of the cleaning nozzle is 0.1 mm to 2 mm.

4. The micro-nozzle cleaning device according to claim 1, wherein, The spray pressure of the cleaning nozzle is 20 bar or greater.

5. The micro nozzle cleaning device according to claim 1, further comprising: A storage unit for storing the abrasive slurry.

6. The micro-nozzle cleaning device according to claim 1, wherein, The abrasive particles have an average diameter of 0.1 μm to 6 μm.

7. The micro-nozzle cleaning device according to claim 1, wherein, The abrasive particles include colloidal inorganic particles.

8. The micro-nozzle cleaning device according to claim 1, wherein, The abrasive particles include at least one of FeO, Fe2O3, Fe3O4, CeO2, SiC, SiO2, ZrO2, and Al2O3.

9. The micro-nozzle cleaning device according to claim 1, wherein, The abrasive slurry comprises water and / or glycerin.

10. An electronic device, the electronic device comprising: A processor used to provide input image data; as well as A display device for displaying an image based on the input image. The display device is manufactured using a spray dispenser comprising micro-nozzles, and the micro-nozzles are cleaned using a micro-nozzle cleaning device. The micro-nozzle cleaning device includes: a cleaning nozzle for spraying an abrasive slurry containing abrasive particles onto the micro-nozzle. The micro-nozzle has a diameter of 50 μm or less, and The concentration of the abrasive particles is from 0.1 vol% to 10 vol%.

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