Integrated CVD upper cavity structure

Abstract

The invention discloses an integrated CVD (Chemical Vapor Deposition) upper cavity structure which comprises a gas mixing tank used for mixing and conveying process gas; the clean gas conveying structure is used for conveying clean gas; the electromagnetic energy source is used for exciting the process gas to form plasma, the electromagnetic energy source comprises a radio frequency power supply distributor, and the radio frequency power supply distributor is provided with a space capable of accommodating part of the clean gas conveying structure; the gas conveying device can be connected with the gas mixing tank and the clean gas conveying structure in parallel, and a space defined by the gas conveying device and the clean gas conveying structure can contain the gas mixing tank. The radio frequency power supply distributor is provided with the space for accommodating part of the clean gas conveying structure, and the gas conveying device and the clean gas conveying structure define the space capable of accommodating the gas mixing tank, so that on the basis of guaranteeing the normal functions of equipment, the space utilization efficiency is practically improved, and the size of the upper cavity structure is reduced; therefore, the miniaturization of the equipment size is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical vapor deposition equipment, in particular to an integrated CVD upper cavity structure. BACKGROUND

[0002] In the semiconductor production process, the plasma chemical vapor deposition equipment (PECVD) belongs to the equipment that promotes the chemical reaction and deposits the thin film material by means of the radio frequency power source to cause the ionization of the specific component of the gaseous material and then form the plasma.

[0003] In the actual production process, the larger the overall size of the chemical vapor deposition equipment is, the more difficult it is to control the cleanliness of the equipment. At the same time, due to the relatively high construction cost of the clean room for storing the chemical vapor deposition equipment, the larger the size of the chemical vapor deposition equipment is, the more space the clean room occupies. How to achieve the miniaturization of the equipment size under the premise of ensuring the normal operation of the equipment has become a problem to be solved. SUMMARY The present application provides an integrated CVD upper cavity structure to overcome the above technical problems.

[0004] In order to achieve the above purpose, the technical scheme of the present application is as follows: An integrated CVD upper cavity structure, comprising: A gas mixing tank for mixing and conveying process gas; A clean gas conveying structure for conveying clean gas; An electromagnetic energy source for exciting the process gas to form plasma, the electromagnetic energy source comprising a radio frequency power source distributor, the radio frequency power source distributor being provided with a space capable of accommodating part of the clean gas conveying structure; A gas conveying device capable of connecting the gas mixing tank and the clean gas conveying structure, the space surrounded by the gas conveying device and the clean gas conveying structure being capable of accommodating the gas mixing tank. Further, the gas mixing tank comprises a main body, the main body being provided with a cavity capable of connecting a reaction chamber, the main body being provided with a first connector and a second connector, the inlets of the first connector and the second connector being connected with a first gas source and a second gas source respectively, and the outlets of the first connector and the second connector being located in the cavity; The end of the first connector provided with the outlet extends towards the end of the second connector provided with the outlet to form a first cover body, and the end of the second connector provided with the outlet extends towards the end of the first connector provided with the outlet to form a second cover body, the first cover body and the second cover body surrounding a premixing cavity, and the premixing cavity being provided with a premixing chamber communicating with the cavity.

[0005] Further, the cleaning gas delivery structure comprises a delivery pipe and a plurality of distribution pipes uniformly distributed on one end of the delivery pipe; a stepped hole is arranged in the delivery pipe, and the transition of the stepped hole is connected and matched by a slope to form an inverted conical hole, and the small-diameter hole of the stepped hole is close to the distribution pipe.

[0006] Further, the delivery pipe comprises a main body and a distribution disc fixed on the main body. The stepped hole is arranged in the main body, and a plurality of distribution flow channels are radially arranged in the distribution disc, one end of the distribution flow channel is communicated with the small-diameter hole of the stepped hole, and the other end of the distribution flow channel is communicated with the distribution pipe.

[0007] Further, the RF current sensor for detecting whether the electromagnetic energy source is working normally comprises a copper bar, a clamp and a current sensor for detecting whether current passes through the copper bar, and the clamp and the current sensor are arranged on the copper bar. The clamp is provided with a clamping hole for allowing the spray head air inlet pipe to be inserted, the clamping hole is vertically arranged, and the clamp can clamp and release the spray head air inlet pipe located in the clamping hole.

[0008] Further, the remote plasma source is connected to the cleaning gas delivery structure for exciting the cleaning gas to form plasma.

[0009] Further, the electromagnetic energy source further comprises an RF power supply, a high-frequency matching device and a low-frequency matching device, and the RF power supply is electrically connected to the RF power supply distributor through the high-frequency matching device and the low-frequency matching device.

[0010] Further, the RF power supply distributor is in the form of a ring structure, and the delivery pipe passes through the center hole of the ring structure.

[0011] Further, the upper cavity housing is used for accommodating the gas mixing tank, the cleaning gas delivery structure, the RF power supply distributor and the gas delivery device, and the upper cavity housing is provided with an access door.

[0012] Further, the gas delivery device comprises a tee joint, two interfaces of the tee joint are connected to the cleaning gas delivery structure and the gas mixing tank respectively, and the remaining one interface can be connected to the spray head air inlet pipe.

[0013] Beneficial effects: The integrated CVD upper cavity structure provided by the application sets a space for accommodating part of the cleaning gas delivery structure on the RF power supply distributor, and the space for accommodating the gas mixing tank is surrounded by the gas delivery device and the cleaning gas delivery structure, so that the space utilization efficiency is improved, the volume of the upper cavity structure is reduced, and the size of the equipment is miniaturized. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of an integrated CVD upper cavity structure disclosed in this invention; Figure 2 This is a schematic diagram of an integrated CVD upper cavity structure with the outer shell removed, as disclosed in this invention. Figure 3 This is a schematic diagram of the integrated CVD upper cavity structure mixing tank, clean gas delivery structure, radio frequency power distributor, and three-way valve disclosed in this invention. Figure 4 This is a front view schematic diagram of an integrated CVD upper cavity structure mixing tank, a clean gas delivery structure, an RF power distributor, and a three-way valve disclosed in this invention. Figure 5 for Figure 4 A schematic diagram of the AA section; Figure 6 This is a schematic diagram of the structure of a gas mixing tank with an integrated CVD upper cavity structure disclosed in this invention; Figure 7 This is a schematic diagram of the tank cover of an integrated CVD upper cavity structure mixing tank disclosed in this invention. Figure 8 This is a front view schematic diagram of the tank cover of a gas mixing tank with an integrated CVD upper cavity structure disclosed in this invention; Figure 9 This is a schematic diagram of the structure of a gas mixing tank with an integrated CVD upper cavity structure disclosed in this invention. Figure 10 This is a front view schematic diagram of the mixing tank body of an integrated CVD upper cavity structure disclosed in this invention; Figure 11 This is a front view schematic diagram of the main body of the gas mixing tank of an integrated CVD upper cavity structure disclosed in this invention; Figure 12 for Figure 11 BB cross-section diagram; Figure 13 for Figure 11 CC section diagram; Figure 14This is a schematic diagram of the clean gas delivery structure of an integrated CVD upper cavity structure disclosed in this invention, connected to a remote plasma source. Figure 15 This is a schematic diagram of a clean gas delivery structure for an integrated CVD upper cavity structure disclosed in this invention. Figure 16 This is a schematic diagram of the delivery pipe of a clean gas delivery structure for an integrated CVD upper cavity structure disclosed in this invention; Figure 17 This is a front view schematic diagram of the delivery pipe of a clean gas delivery structure for an integrated CVD upper cavity structure disclosed in this invention; Figure 18 for Figure 17 DD cross-section diagram; Figure 19 for Figure 17 EE cross-section diagram; Figure 20 This is a schematic diagram of the structure of an integrated CVD upper cavity structure radio frequency current sensor disclosed in this invention. Figure 1 ; Figure 21 This is a schematic diagram of the structure of an integrated CVD upper cavity structure radio frequency current sensor disclosed in this invention. Figure 2 ; Figure 22 This is a front view schematic diagram of the assembly of an integrated CVD upper cavity structure radio frequency current sensor and a spray head, as disclosed in this invention. Figure 23 This is a schematic diagram of the assembly of an integrated CVD upper cavity structure radio frequency current sensor and a spray head, as disclosed in this invention. Figure 24 This is a top view schematic diagram of the assembly of an integrated CVD upper cavity structure radio frequency current sensor and a spray head disclosed in this invention. Figure 25 This is a schematic diagram of the electrical connection between the current sensor and the electrical signal detection device of an integrated CVD upper cavity structure radio frequency current sensor disclosed in this invention. Figure 26 This is a schematic diagram of an integrated CVD upper cavity structure radio frequency power distributor disclosed in this invention; Figure 27 This is a bottom view of an integrated CVD upper cavity structure radio frequency power distributor disclosed in this invention, with the bottom housing removed.

[0015] In the picture: 5-1. Mixing tank; 5-1-1. First connector; 5-1-2. Second connector; 5-1-3. Main body; 5-1-4. Gas outlet pipe; 5-1-5. Gas outlet hole; 5-1-6. Premixed gas outlet hole; 5-1-7. Tank cover; 5-1-8. Tank body; 5-1-9. Sealing ring groove; 5-1-10. Sealing ring; 5-1-11. First cover; 5-1-12. Second cover; 5-1-13. Premixing chamber; 5-1-14. Connecting pipe; 5-1-15. Base; 5-2 Clean gas delivery structure; 5-2-1 Main body; 5-2-2 Distribution pipe; 5-2-3 Cooling device; 5-2-4 Stepped hole; 5-2-5 Inverted conical hole; 5-2-6 Remote plasma source; 5-2-7 Electric valve; 5-2-8 Distribution plate; 5-2-9 Distribution channel; 5-3, Radio Frequency Current Sensor; 5-3-1, Current Sensor; 5-3-1-1, Coil; 5-3-1-2, Insulating Substrate; 5-3-2, Copper Busbar; 5-3-2-1, Connecting Part; 5-3-2-2, Extension Part; 5-3-2-3, Main Body; 5-3-3, Clamp; 5-3-3-1, Fixed Clamping Block; 5-3-3-2, Movable Clamping Block; 5-3-4, Socket; 5-3-5, Bracket; 5-3-5-1, Mounting Part; 5-3-5-2, Support Part; 5-4. Upper cavity shell; 5-5, RF power splitter; 5-5-1, connector; 5-5-2, L3 inductor; 5-6. High-frequency matching unit; 5-7. Low-frequency matching unit; 5-8. Inspection door; 5-9, T-junction; 2-6. Sprinkler heads; 20. Electrical signal detection device. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example 1 This embodiment provides an integrated CVD upper cavity structure, such as Figures 1 to 5 As shown, it includes: Mixing tank 5-1, used for mixing and conveying process gases; Clean gas delivery structure 5-2 is used to deliver clean gas; Electromagnetic energy is used to excite the process gas to form plasma. The electromagnetic energy includes a radio frequency power distributor 5-5, which has a space that can accommodate part of the clean gas delivery structure 5-2. The gas delivery device 5-9 can be connected in parallel to the gas mixing tank 5-1 and the clean gas delivery structure 5-2, and the space enclosed by the gas delivery device and the clean gas delivery structure 5-2 can accommodate the gas mixing tank 5-1.

[0018] This embodiment provides an integrated CVD upper cavity structure. By setting a space on the radio frequency power distributor 5-5 to accommodate part of the clean gas delivery structure 5-2, and by forming a space that can accommodate the gas mixing tank 5-1 through the gas delivery device and the clean gas delivery structure 5-2, the space utilization efficiency is effectively improved and the volume of the upper cavity structure is reduced while ensuring the normal function of the equipment, so as to achieve the miniaturization of the equipment size. Specifically, such as Figures 1 to 5 As shown, it also includes a remote plasma source 5-2-6, which is connected to the clean gas delivery structure 5-2 and is used to excite the clean gas to form plasma.

[0019] Specifically, the electromagnetic energy source also includes a radio frequency power supply, a high-frequency matching unit 5-6, and a low-frequency matching unit 5-7. The radio frequency power supply includes one high-frequency power supply and one low-frequency power supply. The high-frequency power supply and the low-frequency power supply are electrically connected to the radio frequency power distributor 5-5 through the high-frequency matching unit 5-6 and the low-frequency matching unit 5-7, respectively. The radio frequency power supply is effectively distributed and transmitted through the radio frequency power distributor 5-5.

[0020] Specifically, the RF power distributor 5-5 has a ring structure, and the delivery pipe passes through the central hole of the ring structure. In this embodiment, the RF power distributor 5-5 has six branches corresponding to the six spray heads 2-6 below. Its main structure and working principle are similar to a power distribution device for PECVD described in existing patent CN220685240U. The main difference between it and CN220685240U is that its low-frequency input board and first high-frequency busbar both have through holes in their centers, allowing the main body 5-2-1 of the clean gas delivery structure 5-2 to pass through, thus creating a space in the center of the RF power distributor 5-5 to accommodate part of the clean gas delivery structure 5-2. Furthermore, a connector 5-5-1 is fixed to the L3 inductor 5-5-2 for easy and quick wiring.

[0021] Specifically, it also includes an upper cavity shell 5-4, which is used to house the mixing tank 5-1, the clean gas delivery structure 5-2, the radio frequency power distributor 5-5, and the gas delivery device. The upper cavity shell 5-4 is provided with an inspection door 5-8, which has a handle. The inspection door 5-8 has two forms: One type of inspection door 5-8 is fixed to the upper cavity shell 5-4 by screws and can be disassembled as a whole; another type of inspection door 5-8 is connected to the upper cavity shell 5-4 at one end by a hinge and fixed at the other end by screws. After removing the screws, the inspection door 5-8 can be rotated to perform internal inspection of the upper cavity.

[0022] Specifically, such as Figures 2 to 5 As shown, the gas delivery device includes a three-way valve 5-9. Two ports of the three-way valve 5-9 are connected to the clean gas delivery structure 5-2 and the mixing tank 5-1 respectively via quick-connect clamps. The remaining port can be connected to the air inlet pipe of the spray head 2-6 via a quick-connect clamp.

[0023] Example 2 This embodiment provides an integrated CVD upper cavity structure. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows: In the wafer deposition process of chemical vapor deposition (CVD) equipment, poor film uniformity or discontinuity is a common problem. The uniformity of the reactant gases significantly impacts film uniformity, which is primarily determined by the mixing tank. Existing mixing tanks have relatively simple inlet structures, typically featuring only two ports connecting two separate process gas streams. This prevents the two gas streams from mixing thoroughly within the tank, resulting in uneven gas flow into the reaction chamber. Consequently, this leads to poor wafer film uniformity within the chamber and significant waste of process gases.

[0024] In this embodiment, as Figure 6 As shown, the mixing tank 5-1 includes: a main body 5-1-3, the main body 5-1-3 having a cavity that can connect to the reaction chamber, a first connector 5-1-1 and a second connector 5-1-2 fixed on the main body 5-1-3, the inlets of the first connector 5-1-1 and the second connector 5-1-2 being connected to a first gas source and a second gas source respectively through corresponding connecting pipes 5-1-14, and the outlets of the first connector 5-1-1 and the second connector 5-1-2 being located inside the cavity; like Figure 7 and Figure 8 As shown, the end of the first connector 5-1-1 with an outlet extends toward the end of the second connector 5-1-2 with an outlet to form a first cover 5-1-11, as... Figure 9As shown, the second connector 5-1-2 extends from the end with the outlet toward the end with the outlet of the first connector 5-1-1 to form a second cover 5-1-12, as shown. Figure 12 As shown, the first cover 5-1-11 and the second cover 5-1-12 form a premixing cavity 5-1-13, and the premixing cavity 5-1-13 is provided with a premixing chamber that communicates with the cavity.

[0025] The different process pipelines supplying different gases in the gas box are combined to form pipeline A and pipeline B, which facilitates the separate management of hazardous gases or gases that are prone to premature reactions. Depending on different process requirements, pipeline A can supply NH3, SiH4, and N2, while pipeline B can supply N2, O2, N2O, NF3, He, and Ar. In this embodiment, the first connector 5-1-1 and the second connector 5-1-2 are connected to pipeline A and pipeline B respectively through connecting pipe 5-1-14 (pipeline A serves as the first gas source, and pipeline B serves as the second gas source). This embodiment provides a gas mixing tank, which connects to a first gas source and a second gas source through the inlet of the first connector 5-1-1 and the second connector 5-1-2 on the main body 5-1-3. Different process gases enter the premixing cavity 5-1-13 formed by the first cover 5-1-11 and the second cover 5-1-12 for preliminary mixing, and then enter the cavity from the premixing cavity 5-1-13 for further mixing. This makes the mixing of different gases more uniform, improves the uniformity of gas mixing, and thus makes the film growth on the wafer in the reaction chamber more uniform, improving the uniformity of coating. Specifically, such as Figure 11 As shown, the main body 5-1-3 has several air outlets 5-1-5 that communicate with the cavity. The air outlets 5-1-5 are connected to the reaction chamber by air outlet pipes 5-1-4 that are welded and fixed to the main body 5-1-3 (the cavity is connected to the air inlet pipe of the spray head 2-6 via the air outlet pipes 5-1-4 and the tee 5-9, so that the process gas can enter the cavity). When there are multiple air outlets 5-1-5, the multiple outlets are evenly distributed on the main body 5-1-3.

[0026] In practical applications, the exhaust pipe 5-1-4 is connected to the shower head 2-6 via a pipeline, through which process gas is introduced into the reaction chamber. In this embodiment, the reaction chamber is provided with six wafer stages, and the main body 5-1-3 is provided with six exhaust holes 5-1-5, corresponding to the shower heads 2-6 which are arranged opposite to the wafer stages.

[0027] Specifically, such as Figure 12As shown, the premixed cavity 5-1-13 is provided with a plurality of premixed air outlets 5-1-6 that communicate with the cavity; when there are multiple premixed air outlets 5-1-6, the multiple premixed air outlets 5-1-6 are evenly distributed on the premixed cavity 5-1-13.

[0028] Preferably, such as Figure 12 As shown, the cavity is cylindrical and the premixing cavity is spherical to improve the uniformity of the gas mixture.

[0029] Preferably, such as Figure 13 As shown, the axes of the air outlet 5-1-5 and the premixed air outlet 5-1-6 do not coincide, so as to prolong the residence time of the process gas in the cavity and improve the uniformity of the gas mixture.

[0030] Preferably, such as Figure 13 As shown, the axis of the premixed gas outlet 5-1-6 is located on the angle bisector of the angle formed by the axes of its two adjacent gas outlets 5-1-5, ensuring that the uniformity of the process gas discharged from each gas outlet 5-1-5 remains consistent.

[0031] Specifically, such as Figure 11 and Figure 12 As shown, the main body 5-1-3 includes a can lid 5-1-7 and a can body 5-1-8 that are detachably connected by screws, as... Figure 10 As shown, the vent pipe 5-1-4 is welded and fixed to the tank body 5-1-8; as Figure 9 As shown, the tank body 5-1-8 is provided with a sealing ring groove 5-1-9, such as Figure 12 As shown, a sealing ring 5-1-10 is provided in the sealing ring groove 5-1-9. After tightening the screw, the can lid 5-1-7 is pressed onto the sealing ring 5-1-10 to form a sealed connection.

[0032] Specifically, such as Figure 10 As shown, the second connector 5-1-2 has a base 5-1-15 at one end away from the first connector 5-1-1. The mixing tank is supported by the base 5-1-15. The base 5-1-15 has bolt holes to facilitate the installation of the base 5-1-15 on the PECVD equipment.

[0033] Example 3 This embodiment provides an integrated CVD upper cavity structure. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows: PECVD equipment needs to promptly remove residual deposits in the reaction chamber. Typically, a remote plasma source (RPS) is used to ionize the cleaning gas, causing the cleaning gas to react with the residual deposits, thereby removing the residual deposits.

[0034] The ionized clean gas needs to be transported to the reaction chamber through a delivery pipe. The delivery pipe has stepped orifices; the change in diameter of these orifices increases the gas flow rate. In actual production, it was found that the electric valves near the delivery pipe frequently malfunction, significantly shortening their service life, severely affecting equipment stability, and increasing maintenance costs. In this embodiment, the clean gas delivery structure 5-2 is as follows: Figure 14 and Figure 15 As shown, it includes a conveying pipe and multiple distribution pipes 5-2-2 evenly distributed at one end of the conveying pipe; a cooling device 5-2-3 is provided on the outer periphery of the conveying pipe, such as... Figure 18 As shown, the conveying pipe is provided with a stepped hole 5-2-4. The transition of the stepped hole 5-2-4 is connected by an inclined surface to form an inverted conical hole 5-2-5. The small diameter hole of the stepped hole 5-2-4 is close to the distribution pipe 5-2-2.

[0035] This embodiment provides a clean gas delivery structure that uses a cooling device 5-2-3 on the outer periphery of the delivery pipe to cool the pipe, thereby suppressing the significant impact of heat radiation on surrounding electric valves. Furthermore, compared to conventional delivery pipes with stepped holes 5-2-4 that do not have an inverted conical orifice 5-2-5 transition, the gas no longer flows through a right-angle step, preventing turbulence caused by fluid separation from the orifice wall. The inclined surface of the inverted conical orifice 5-2-5 guides the fluid to achieve a smooth acceleration, avoiding flow separation and thus ensuring smoother gas flow. This prevents excessive heat accumulation at the transition point, thus suppressing the significant impact of heat radiation on surrounding electric valves 5-2-7.

[0036] In this embodiment, the cooling device 5-2-3 is located between the delivery pipe and the radio frequency power distributor 5-5 to reduce the mutual thermal influence between the two (the clean gas delivery structure 5-2 generates heat when delivering the gas ionized by the remote plasma source 5-2-6, and the radio frequency power distributor 5-5 also generates heat when it is working).

[0037] Specifically, such as Figure 15 As shown, the cooling device 5-2-3 is a cooling coil, which is connected to a water cooling system.

[0038] Preferably, such as Figure 16 and Figure 17 As shown, the outer circumference of the conveying pipe is provided with a spiral groove, and the cooling coil is wound around the spiral groove. On the one hand, the spiral groove reduces the wall thickness of the conveying pipe and reduces the heat accumulated by the conveying pipe itself. On the other hand, the spiral groove increases the contact area between the cooling coil and the conveying pipe, thereby effectively improving the heat exchange efficiency.

[0039] Specifically, such as Figure 14As shown, the end of the delivery pipe away from the distribution pipe 5-2-2 is connected to the remote plasma source 5-2-6, and the clean gas (NF3 and Ar) is introduced into the delivery pipe after passing through the remote plasma source 5-2-6.

[0040] Specifically, such as Figure 15 As shown, the end of the distribution pipe 5-2-2 away from the delivery pipe is equipped with an electric valve 5-2-7. The opening and closing of the electric valve 5-2-7 controls whether the distribution pipe 5-2-2 is connected to the reaction chamber (the delivery pipe is connected to the air inlet pipe of the spray head 2-6 via the distribution pipe 5-2-2, the electric valve 5-2-7 and the tee 5-9, so that the clean gas can enter the cavity).

[0041] Preferably, such as Figure 15 As shown, the distribution pipe 5-2-2 is a finned pipe. The fins improve the heat dissipation efficiency of the distribution pipe 5-2-2, avoid heat accumulation and excessive temperature, and reduce the thermal impact of the distribution pipe 5-2-2 on the electric valve 5-2-7.

[0042] Specifically, such as Figure 16 As shown, the conveying pipe includes a main body 5-2-1 and a distribution plate 5-2-8 fixed on the main body 5-2-1. The stepped hole 5-2-4 is disposed in the main body 5-2-1. The distribution plate 5-2-8 is provided with multiple radially distributed distribution channels 5-2-9. One end of the distribution channel 5-2-9 is connected to the small diameter hole of the stepped hole 5-2-4, and the other end of the distribution channel 5-2-9 is connected to the distribution pipe 5-2-2 (a threaded connection can be used, with the distribution channel 5-2-9 having internal threads and the distribution pipe 5-2-2 having external threads).

[0043] In practical applications, the electric valve 5-2-7 is connected to the shower head 2-6 via a pipeline, through which clean gas is introduced into the reaction chamber. In this embodiment, the reaction chamber is provided with six wafer stages, and the distribution plate 5-2-8 is provided with six distribution channels 5-2-9 to correspond to the shower heads 2-6 which are positioned opposite to the wafer stages.

[0044] Preferably, the diameter of the distribution channel 5-2-9 is smaller than the diameter of the small-diameter hole of the stepped hole 5-2-4, so as to increase the flow rate of the clean gas.

[0045] Example 4 This embodiment provides an integrated CVD upper cavity structure. The main structure of this embodiment is similar to that of Embodiment 1. The differences between this embodiment and Embodiment 1 are as follows: In the wafer fabrication process using plasma-enhanced chemical vapor deposition (PECVD), the spray heads 2-6 serve as one of the electrodes, working in conjunction with the underlying wafer substrate. A radio frequency (RF) power supply is needed to output current to the spray heads, generating uniform plasma to drive the chemical reaction. If the RF circuit malfunctions, the process cannot proceed normally; therefore, sensors are required to monitor the spray head's energization in real time.

[0046] Given the extremely limited operating space inside the upper cavity where the sensors are installed, subsequent adjustments become extremely difficult once the sensor wiring positions are determined. Furthermore, the distance between the spray head and the lower process fit must be precisely determined according to process requirements, necessitating repeated adjustments to the spray head height during the commissioning phase. Consequently, the sensors used to detect whether the spray head is energized also need to be changed, leading to frequent changes in wiring positions, making commissioning operations extremely inconvenient.

[0047] In this embodiment, the radio frequency current sensor 5-3 is as follows: Figure 20 As shown, it includes: a copper busbar 5-3-2, a clamp 5-3-3, and a current sensor 5-3-1 for detecting whether current flows through the copper busbar 5-3-2. The clamp 5-3-3 and the current sensor 5-3-1 are mounted on the copper busbar 5-3-2. The clamp 5-3-3 is provided with a clamping hole that allows the air inlet pipe of the spray head 2-6 to be inserted. The clamping hole is arranged vertically, such as... Figures 22 to 24 As shown, the clamp 5-3-3 is capable of clamping and releasing the air inlet pipe of the spray head 2-6 located in the clamping hole.

[0048] This embodiment provides a radio frequency current sensor. The current sensor 5-3-1 is connected to a clamp 5-3-3 via a copper busbar 5-3-2, and then connected to the air inlet pipe of the spray head 2-6 via the clamp 5-3-3. Vertical clamping holes on the clamp 5-3-3 ensure that the spray head 2-6 can be adjusted vertically without obstruction. After adjustment, the air inlet pipe of the spray head 2-6 is clamped by the clamp 5-3-3, establishing an electrical connection between the copper busbar 5-3-2 and the spray head 2-6. This allows the position of the current sensor 5-3-1 to remain fixed, eliminating the need for adjustment with the spray head 2-6 and thus eliminating the need to change the wiring.

[0049] Specifically, such as Figure 25 As shown, the current sensor 5-3-1 includes an insulating substrate 5-3-1-1 and a coil 5-3-1-2. The coil 5-3-1-2 is disposed inside the insulating substrate 5-3-1-1, and the insulating substrate 5-3-1-1 is disposed on the copper busbar 5-3-2. The two ends of the coil 5-3-1-2 can be electrically connected to the electrical signal detection device 20. In this embodiment, the current sensor 5-3-1 further includes a female connector fixed on the insulating substrate 5-3-1-1, the two ends of the coil 5-3-1-2 are electrically connected to the female connector, and the electrical signal detection device 20 is electrically connected to the female connector through a cable with a male connector.

[0050] When the copper busbar 5-3-2 is energized, it will generate a magnetic field. The current output from the radio frequency power supply to the copper busbar 5-3-2 through the connector 5-5-1 of the radio frequency power distributor 5-5 is alternating current. Therefore, the magnetic field changes periodically. The magnetic field is cut by the coil 5-3-1-2 to generate current. The current is detected by the electrical signal detection device 20, thereby determining whether the spray head 2-6 is energized by checking whether the copper busbar 5-3-2 is energized.

[0051] Specifically, such as Figure 21 As shown, the copper busbar 5-3-2 includes a connecting part 5-3-2-1, an extension part 5-3-2-2, and a main body 5-3-2-3; The current sensor 5-3-1 is mounted on the main body 5-3-2-3. One end of the extension 5-3-2-2 is fixedly connected to the main body 5-3-2-3, and the other end of the extension 5-3-2-2 is fixedly connected to the connecting part 5-3-2-1. The connecting part 5-3-2-1 is detachably connected to the clamp 5-3-3. In this embodiment, the connecting portion 5-3-2-1, the extension portion 5-3-2-2, and the main body 5-3-2-3 are integrally formed, and the connecting portion 5-3-2-1, the extension portion 5-3-2-2, and the main body 5-3-2-3 are perpendicular to each other, as shown below. Figure 24 As shown, the vertically arranged main body 5-3-2-3 can reduce the overall area occupied by the copper busbar 5-3-2, and facilitate the layout of other components inside the upper cavity. The extension 5-3-2-2 at the bottom of the main body 5-3-2-3 is used to avoid the position adjuster that can adjust the height of the spray head 2-6 inside the upper cavity. The connecting part 5-3-2-1 is provided with bolt holes, and can be detachably connected to the clamp 5-3-3 through the screws in the bolt holes.

[0052] Specifically, such as Figure 21 As shown, the clamp 5-3-3 includes a fixed clamping block 5-3-3-1 and a movable clamping block 5-3-3-2. The fixed clamping block 5-3-3-1 and the movable clamping block 5-3-3-2 are provided with grooves at their adjacent ends, and the two oppositely arranged grooves form a clamping hole. The fixed clamping block 5-3-3-1 is fixed to the copper busbar 5-3-2 by screws. The fixed clamping block 5-3-3-1 is provided with a threaded hole, and an adjusting bolt is provided in the threaded hole. The movable clamping block 5-3-3-2 is provided with a through hole, and the movable clamping block 5-3-3-2 is sleeved on the adjusting bolt through the through hole. Tighten the adjusting bolt, and the clamp 5-3-3 can clamp the air inlet pipe of the spray head 2-6 located in the clamping hole; By loosening the adjusting bolt, the clamp 5-3-3 can release the air inlet pipe of the spray head 2-6 located in the clamping hole, so that the position adjustment of the spray head 2-6 is not obstructed.

[0053] Specifically, such as Figure 20 As shown, it also includes a socket 5-3-4, which is electrically connected to the copper busbar 5-3-2. In this embodiment, the output end of the socket 5-3-4 is soldered to the copper busbar 5-3-2, and the current output by the RF power supply through the RF power distributor 5-5 is input to the input end of the socket 5-3-4 via a connector with a plug.

[0054] Specifically, such as Figure 20 As shown, it also includes a bracket 5-3-5, and the socket 5-3-4 is disposed on the bracket 5-3-5, as shown. Figure 21 As shown, the bracket 5-3-5 includes a support part 5-3-5-2 and a mounting part 5-3-5-1 vertically fixed on the support part 5-3-5-2. The mounting part 5-3-5-1 is provided with a receiving hole, and the socket 5-3-4 is disposed in the receiving hole. The outer shell of the socket 5-3-4 is made of metal and is spot-welded to the bracket 5-3-5. The support part 5-3-5-2 is provided with bolt mounting holes, and the socket 5-3-4 is fixed in the upper cavity by screws in the bolt mounting holes. The upper cavity is grounded, so that the outer shell of the socket 5-3-4 can be connected to the upper cavity through the bracket 5-3-5 to achieve grounding protection.

[0055] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated CVD upper cavity structure, characterized in that, include: Mixing tank (5-1), used for mixing and conveying process gases; Clean gas delivery structure (5-2) is used to deliver clean gas; Electromagnetic energy is used to excite the process gas to form plasma. The electromagnetic energy includes a radio frequency power distributor (5-5), which has a space to accommodate part of the clean gas delivery structure (5-2). The gas delivery device (5-9) is capable of connecting the gas mixing tank (5-1) and the clean gas delivery structure (5-2) in parallel, and the space enclosed by the gas delivery device and the clean gas delivery structure (5-2) is capable of accommodating the gas mixing tank (5-1).

2. The integrated CVD upper cavity structure according to claim 1, characterized in that, The mixing tank (5-1) includes: a main body (5-1-3), the main body (5-1-3) having a cavity that can connect to a reaction chamber, the main body (5-1-3) having a first connector (5-1-1) and a second connector (5-1-2), the inlets of the first connector (5-1-1) and the second connector (5-1-2) being connected to a first gas source and a second gas source respectively, and the outlets of the first connector (5-1-1) and the second connector (5-1-2) being located within the cavity; The first connector (5-1-1) extends towards the second connector (5-1-2) to form a first cover (5-1-11), and the second connector (5-1-2) extends towards the first connector (5-1-1) to form a second cover (5-1-12). The first cover (5-1-11) and the second cover (5-1-12) together form a premixing cavity (5-1-13), and the premixing cavity (5-1-13) is provided with a premixing chamber that communicates with the cavity.

3. The integrated CVD upper cavity structure according to claim 1, characterized in that, The clean gas delivery structure (5-2) includes a delivery pipe and a plurality of distribution pipes (5-2-2) evenly distributed at one end of the delivery pipe; the delivery pipe is provided with a stepped hole (5-2-4), and the transition of the stepped hole (5-2-4) is connected by a bevel to form an inverted conical hole (5-2-5), and the small diameter hole of the stepped hole (5-2-4) is close to the distribution pipe (5-2-2).

4. The integrated CVD upper cavity structure according to claim 3, characterized in that, The conveying pipe includes a main body (5-2-1) and a distribution plate (5-2-8) fixed on the main body (5-2-1). The stepped hole (5-2-4) is disposed inside the main body (5-2-1), and the distribution plate (5-2-8) is provided with multiple radially distributed distribution channels (5-2-9). One end of the distribution channel (5-2-9) is connected to the small diameter hole of the stepped hole (5-2-4), and the other end of the distribution channel (5-2-9) is connected to the distribution pipe (5-2-2).

5. The integrated CVD upper cavity structure according to claim 1, characterized in that, It also includes a radio frequency current sensor (5-3) for detecting whether the electromagnetic energy is working properly. The radio frequency current sensor (5-3) includes: a copper busbar (5-3-2), a clamp (5-3-3), and a current sensor (5-3-1) for detecting whether current flows through the copper busbar (5-3-2). The clamp (5-3-3) and the current sensor (5-3-1) are disposed on the copper busbar (5-3-2). The clamp (5-3-3) is provided with a clamping hole that allows the spray head air inlet pipe to be inserted. The clamping hole is vertically arranged, and the clamp (5-3-3) can clamp and release the spray head air inlet pipe located in the clamping hole.

6. The integrated CVD upper cavity structure according to claim 1, characterized in that, It also includes a remote plasma source (5-2-6), which is connected to the clean gas delivery structure (5-2) and is used to excite the clean gas to form plasma.

7. The integrated CVD upper cavity structure according to claim 1, characterized in that, The electromagnetic energy source also includes a radio frequency power supply, a high-frequency matching unit (5-6), and a low-frequency matching unit (5-7). The radio frequency power supply is electrically connected to the radio frequency power distributor (5-5) through the high-frequency matching unit (5-6) and the low-frequency matching unit (5-7).

8. The integrated CVD upper cavity structure according to claim 3, characterized in that, The radio frequency power distributor (5-5) has a ring structure, and the delivery tube passes through the central hole of the ring structure.

9. The integrated CVD upper cavity structure according to claim 1, characterized in that, It also includes an upper cavity shell (5-4), which is used to house the mixing tank (5-1), the clean gas delivery structure (5-2), the radio frequency power distributor (5-5), and the gas delivery device. The upper cavity shell (5-4) is provided with an inspection door (5-8).

10. An integrated CVD upper cavity structure according to claim 1, characterized in that, The gas delivery device includes a three-way valve (5-9), two of which are connected to the clean gas delivery structure (5-2) and the mixing tank (5-1) respectively, and the remaining one is connected to the air inlet pipe of the spray head.

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