AOB framework active phased-array antenna microsystem for low-altitude monitoring
By using the AOB architecture active phased array antenna microsystem and multi-layer PCB substrate integration technology, the problems of large profile height and weight in existing systems are solved, achieving low profile, lightweight and low cost high-density integration, improving the system's reliability and ease of processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-02-03
- Publication Date
- 2026-03-27
AI Technical Summary
In existing low-altitude surveillance systems, active phased array antennas have large profile height and weight, high interconnection losses in connectors, high costs, and are difficult to integrate at high density and be easily manufactured.
The active phased array antenna microsystem adopts the AOB architecture and integrates the array antenna, TR component, feed network, wave control module, heat dissipation structure and power module through a multi-layer PCB carrier. It achieves high-density integration by using RF vertical interconnect technology and performs electrical interconnection through metallized vias, microstrip lines and striplines to reduce the use of connectors.
This resulted in an active phased array antenna with low profile, lightweight, low cost, and high reliability, reducing interconnection losses and improving system integration and ease of fabrication.
Smart Images
Figure CN121748795A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of antenna technology, and in particular to an AOB architecture active phased array antenna microsystem for low-altitude surveillance. Background Technology
[0002] Low-altitude economic safety is paramount. Before embarking on large-scale low-altitude flights, the primary focus of low-altitude economic development must be addressing low-altitude flight safety. Low-altitude surveillance, as a crucial guarantee of low-altitude flight safety, ensures the safe and efficient operation of aircraft at low altitudes. Low-altitude active phased array radar surveillance systems offer all-weather, all-time scanning of the low-altitude airspace without blind spots, boasting advantages such as long detection range, high positioning accuracy, and strong environmental adaptability. They have become an indispensable and vital surveillance device for low-altitude flight activities. Active phased array antennas are a crucial component of low-altitude active phased array radar surveillance systems, and their importance is self-evident. Summary of the Invention
[0003] This invention discloses an AOB architecture active phased array antenna microsystem for low-altitude surveillance. The system includes a multi-layer PCB carrier board, on which an array antenna, a TR component, a feed network, a beam control module, a heat dissipation structure, and a power supply module are integrated. The array antenna is used to receive and transmit Ku-band electromagnetic wave signals; The TR component is used to perform low-noise amplification, power amplification, and amplitude and phase control on the transmitted and received signals; The power supply network includes a power divider network and a sum-difference network, which are used to perform power division and synthesis of the transmitted and received signals, and to form the sum-difference signals, respectively. The beam control module is used to issue amplitude and phase modulation control commands for the transmitted and received signals; The heat dissipation structure is used for heat conduction in the overall structure; The power module is used to provide operating power.
[0004] Furthermore, the multilayer PCB carrier is formed by mixing and pressing 7 PCB boards and 6 prepreg sheets (PP); The first PCB board is topped by layer L1, below layer L2, below layer L2 is the first pre-cured sheet (PP), below layer PP is the second PCB board, below layer L3 is the second pre-cured sheet (PP), below layer L3 is the second pre-cured sheet (PP), below layer PP is the L4, below layer L4 is the third PCB board, below layer L3 is the third pre-cured sheet (PP), below layer PP is the fourth PCB board, below layer L5 is the fourth pre-cured sheet (PP), below layer L5 is the fourth pre-cured sheet (PP), below layer L6 is the fourth pre-cured sheet (PP), below layer L6 is the fifth PCB board, below layer L7 is the fifth pre-cured sheet (PP), below layer L7 is the fifth pre-cured sheet (PP), below layer L8 is the fifth PCB board, below layer L8 is the sixth PCB board, below layer L9 is the sixth pre-cured sheet (PP), below layer L9 is the seventh PCB board, below layer L10 is the seventh PCB board. The array antenna, TR component, feed network, beam control module, heat dissipation structure and power module are distributed in layers L1 to L10.
[0005] Furthermore, the array antenna, TR component, and feed network are electrically interconnected through metallized vias, microstrip lines, and striplines within the multilayer hybrid PCB board; The wave control module and the TR component transmit commands via microstrip lines or striplines; the power supply module supplies power to the TR component and the wave control module via microstrip lines or striplines. The TR component and wave control module dissipate heat through a contact structure.
[0006] Furthermore, the antenna array includes 48 microstrip antenna elements, with each set of four microstrip antenna elements connected to a TR component.
[0007] Furthermore, the sum-difference network is used to send the Ku-band radio frequency excitation signal from the integrated processing unit to the power divider network via the sum channel during the transmit state; during the receive state, the four azimuth and elevation subarray radio frequency received signals output by the sum-difference network are processed to form an array sum signal, an azimuth difference signal, and an elevation difference signal. The power divider network is used to distribute the input radio frequency signal to each TR channel in the transmit state; and to synthesize the received signal in the receive state, with each four receive channels synthesized to output one signal.
[0008] Furthermore, the TR component includes a TR component chip and a transceiver switch; The transceiver switch is used to switch between the transmit channel and the receive channel; In the transmit state, the TR component chip modulates and phases the input low-power radio frequency excitation signal, amplifies it into a high-power radio frequency signal, and then radiates it into space through the antenna. In the receiving state, the TR component chip amplifies the received signal with low noise, performs secondary amplification, amplitude modulation, and phase modulation, and then synthesizes it through a power divider network.
[0009] Furthermore, the first PCB board, the second PCB board, and the third PCB board all use RO-4350B double-sided core board; The fourth, fifth, and sixth PCB boards all use FR4 single-sided core boards. The seventh PCB board uses RO-5880 double-sided core board.
[0010] Furthermore, the L1 layer is equipped with an array antenna and a power divider network; L2 layer is the GND layer of the array antenna; The L3 layer is a sum-difference network layer; L4 and L6 are GND layers; L5 is the power layer, isolated by GND from L4 and L6. Layers L7 and L8 are control signal layers; L9 layer is the GND layer; Layer L10 is the soldering layer for TR components, power modules, and wave controller modules.
[0011] Furthermore, the sum-difference network of layer L3 forms a stripline structure through the GND of layers L2 and L4.
[0012] Due to the adoption of the above technical solutions, this application has the following beneficial effects: This antenna microsystem is based on an antenna-on-board (AOB) active phased array architecture. Through RF vertical interconnect technology and multi-layer PCB hybridization, it achieves high-density integration of the array antenna, multi-functional TR components, feed network, wave control module, heat dissipation structure, and power module. Utilizing AOB active phased array architecture technology, the functional circuits are arranged horizontally and integrated vertically, resulting in a profile height of only 3.67mm and a weight of less than 180g, achieving low profile and lightweight design compared to similar systems. By selecting multi-channel, multi-functional, and highly integrated TR RF chips, an average of only 0.25 RF chips per channel is used, effectively reducing costs while improving system reliability compared to similar systems. This antenna microsystem features high integration, high density, low profile, lightweight design, low cost, simple structure, ease of fabrication, and suitability for automated mass production, demonstrating good practical value and application prospects in the field of low-altitude economic and safety sensing.
[0013] Other advantages, objectives, and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination, or may be learned from practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description
[0014] The accompanying drawings of this invention are described below.
[0015] Figure 1 This is a schematic diagram of the structure of the present invention.
[0016] Figure 2 This is a schematic diagram illustrating the working principle of the present invention.
[0017] Figure 3 This is a diagram of the stacked topology of the present invention. Detailed Implementation
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0019] An AOB architecture active phased array antenna microsystem for low-altitude surveillance, such as Figure 1 As shown, the system includes a multi-layer PCB carrier board, on which an array antenna, TR component, feed network, wave control module, heat dissipation structure and power module are integrated. The array antenna is used to receive and transmit Ku-band electromagnetic wave signals; The TR component is used to perform low-noise amplification, power amplification, and amplitude and phase control on the transmitted and received signals; The power supply network includes a power divider network and a sum-difference network, which are used to perform power division and synthesis of the transmitted and received signals, and to form the sum-difference signals, respectively. The beam control module is used to issue amplitude and phase modulation control commands for the transmitted and received signals; The heat dissipation structure is used for heat conduction in the overall structure; The power module is used to provide operating power.
[0020] It should be noted that this application differs from the modular design approach of traditional brick-type and tile-type phased array antennas. This antenna microsystem adopts an AOB-based active phased array antenna, integrating the Ku-band array antenna, multi-functional TR component, feed network, beam control module, and power module into a single multi-layer PCB substrate with high density. The TR component is automatically surface-mounted onto the PCB substrate. The array antenna, TR component, and feed network are electrically interconnected without connectors through metallized vias, microstrip lines, and striplines within the multi-layer hybrid PCB. The beam control module and power module are both fixed to the PCB substrate with screws. The beam control module and multi-functional TR component transmit commands via microstrip lines / striplines. The power module supplies power to the TR component and beam control module via microstrip lines / striplines. The TR component and beam control module dissipate heat through a contact structure. This antenna microsystem effectively reduces the profile height and weight of the entire active phased array antenna while minimizing interconnection losses caused by connectors, saving costs, and improving reliability.
[0021] In one embodiment, the array antenna has a scale of 2×24, totaling 48 elements. Each set of four elements is equipped with a four-channel TR component chip, for a total of 12 TR component chips. The working principle block diagram is shown below. Figure 2 As shown.
[0022] In transmit mode, the Ku-band RF excitation signal from the integrated processing unit is sent to the feed network via the sum channel of the sum and difference network, and then fed to each four-channel TR component chip via the feed network. The TR component chip contains a corresponding power divider network, which distributes the input RF signal to each TR channel. The transmit channel is selected by the transmit switch within the TR channel. The transmit channel modulates and phases the input low-power RF excitation signal, amplifies it into a high-power RF signal, and then radiates it into space via the antenna. Finally, the 48 transmit signals are beamformed in space to form a specific beam direction.
[0023] In receiving mode, the radar echo signal is transmitted via the antenna radiating element to each four-channel TR module chip. Within the TR module chip, the receiving channel is selected by a transceiver switch, and then subjected to low-noise amplification, secondary amplification, amplitude modulation, and phase modulation. The signal is then synthesized by the power divider network within the TR module chip, with each of the four receiving channels synthesizing one signal, resulting in a total of 12 synthesized RF signals. These are sent to the feed network, which outputs four azimuth and elevation subarray RF receiving signals. These signals are then processed by a sum-difference network to form the array sum signal, azimuth difference signal, and elevation difference signal, which are then sent to the integrated processing unit. The beam control module transmits amplitude and phase commands via microstrip / stripline lines for configuring the amplitude and phase of the TR module channels.
[0024] In one embodiment, the multilayer PCB carrier is formed by pressing together 7 PCB boards and 6 prepreg sheets (PP). The antenna microsystem has an overall thickness of 3.67 mm and a total of 10 pattern layers, as shown below. Figure 3 As shown.
[0025] The first PCB board is topped by layer L1, below layer L2, below layer L2 is the first pre-cured sheet (PP), below layer PP is the second PCB board, below layer L3 is the second pre-cured sheet (PP), below layer L3 is the second pre-cured sheet (PP), below layer PP is the L4, below layer L4 is the third PCB board, below layer L3 is the third pre-cured sheet (PP), below layer PP is the fourth PCB board, below layer L5 is the fourth pre-cured sheet (PP), below layer L5 is the fourth pre-cured sheet (PP), below layer L6 is the fourth pre-cured sheet (PP), below layer L6 is the fifth PCB board, below layer L7 is the fifth pre-cured sheet (PP), below layer L7 is the fifth pre-cured sheet (PP), below layer L8 is the fifth PCB board, below layer L8 is the sixth PCB board, below layer L9 is the sixth pre-cured sheet (PP), below layer L9 is the seventh PCB board, below layer L10 is the seventh PCB board. Layer L1 houses the array antenna and power divider network; layer L2 is the array antenna GND layer; layer L3 is the sum and difference network layer; layers L4 and L6 are GND layers; layer L5 is the power layer, isolated by the GND layers of layers L4 and L6; layers L7 and L8 are control signal layers; layer L9 is a GND layer; and layer L10 is the soldering layer for the TR components, power module, and beam control module. The sum and difference network of layer L3 forms a stripline structure through the GND layers of layers L2 and L4.
[0026] The first, second, and third PCB boards all use RO-4350B double-sided core boards; the fourth, fifth, and sixth PCB boards all use FR4 single-sided core boards; and the seventh PCB board uses RO-5880 double-sided core boards.
[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.
Claims
1. A microsystem of AOB architecture active phased array antenna for low-altitude surveillance, characterized in that, The system includes a multi-layer PCB carrier board, on which an array antenna, TR component, feed network, wave control module, heat dissipation structure and power module are integrated; The array antenna is used to receive and transmit Ku-band electromagnetic wave signals; The TR component is used to perform low-noise amplification, power amplification, and amplitude and phase control on the transmitted and received signals; The power supply network includes a power divider network and a sum-difference network, which are used to perform power division and synthesis of the transmitted and received signals, and to form the sum-difference signals, respectively. The beam control module is used to issue amplitude and phase modulation control commands for the transmitted and received signals; The heat dissipation structure is used for heat conduction in the overall structure; The power module is used to provide operating power.
2. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 1, characterized in that, The multilayer PCB carrier is formed by pressing together 7 PCB boards and 6 prepreg sheets (PP). The first PCB board is topped by layer L1, below layer L2, below layer L2 is the first pre-cured sheet (PP), below layer PP is the second PCB board, below layer L3 is the second pre-cured sheet (PP), below layer L3 is the second pre-cured sheet (PP), below layer PP is the L4, below layer L4 is the third PCB board, below layer L3 is the third pre-cured sheet (PP), below layer PP is the fourth PCB board, below layer L5 is the fourth pre-cured sheet (PP), below layer L5 is the fourth pre-cured sheet (PP), below layer L6 is the fourth pre-cured sheet (PP), below layer L6 is the fifth PCB board, below layer L7 is the fifth pre-cured sheet (PP), below layer L7 is the fifth pre-cured sheet (PP), below layer L8 is the fifth PCB board, below layer L8 is the sixth PCB board, below layer L9 is the sixth pre-cured sheet (PP), below layer L9 is the seventh PCB board, below layer L10 is the seventh PCB board. The array antenna, TR component, feed network, beam control module, heat dissipation structure and power module are distributed in layers L1 to L10.
3. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 2, characterized in that, The array antenna, TR component and feed network are electrically interconnected through metallized vias, microstrip lines and striplines inside the multilayer hybrid PCB board; The wave control module and the TR component transmit commands via microstrip lines or striplines; the power supply module supplies power to the TR component and the wave control module via microstrip lines or striplines. The TR component and wave control module dissipate heat through a contact structure.
4. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 1, characterized in that, The antenna array comprises 48 microstrip antenna elements, with each set of four microstrip antenna elements connected to a TR component.
5. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 1, characterized in that, The sum-difference network is used to send the Ku-band radio frequency excitation signal from the integrated processing unit to the power divider network via the sum channel during the transmit state; during the receive state, the four azimuth and elevation subarray radio frequency received signals output by the sum-difference network are processed to form the array sum signal, azimuth difference signal and elevation difference signal. The power divider network is used to distribute the input radio frequency signal to each TR channel in the transmit state; and to synthesize the received signal in the receive state, with each four receive channels synthesized to output one signal.
6. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 1, characterized in that, The TR component includes a TR component chip and a transceiver switch; The transceiver switch is used to switch between the transmit channel and the receive channel; In the transmit state, the TR component chip modulates and phases the input low-power radio frequency excitation signal, amplifies it into a high-power radio frequency signal, and then radiates it into space through the antenna. In the receiving state, the TR component chip amplifies the received signal with low noise, performs secondary amplification, amplitude modulation, and phase modulation, and then synthesizes it through a power divider network.
7. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 2, characterized in that, The first PCB board, the second PCB board, and the third PCB board all use RO-4350B double-sided core board; The fourth, fifth, and sixth PCB boards all use FR4 single-sided core boards. The seventh PCB board uses RO-5880 double-sided core board.
8. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 2, characterized in that, The L1 layer is equipped with array antennas and a power divider network; L2 layer is the GND layer of the array antenna; The L3 layer is a sum-difference network layer; L4 and L6 are GND layers; L5 is the power layer, isolated by GND from L4 and L6. Layers L7 and L8 are control signal layers; L9 layer is the GND layer; Layer L10 is the soldering layer for TR components, power modules, and wave controller modules.
9. The AOB architecture active phased array antenna microsystem for low-altitude surveillance as described in claim 8, characterized in that, The sum and difference network of layer L3 forms a stripline structure through the GND of layers L2 and L4.