Microphone module, speaker module, and communication device

Abstract

A microphone module comprises a bearing structure and a microphone assembly. The bearing structure comprises a bearing part and two supporting parts, and the two supporting parts are connected to the bearing part. The microphone assembly comprises a microphone body part and two hanging parts, the microphone body part is hung on the bearing part, and the two hanging parts are connected to the two opposite sides of the microphone body part respectively and hung on the two supporting parts respectively. In addition, a loudspeaker module and a communication device are also provided.

Description

Technical Field

[0001] This invention relates to an acoustic module and a communication device having the same, and particularly to a microphone module, a speaker module and a communication device having the same. Background Technology

[0002] Telephones, conference machines, and other communication devices include microphones and speakers. While the microphone's pickup quality and the speaker's playback quality can be adjusted and optimized through software, the impact of speaker vibration on pickup and playback quality can only be suppressed through structural design. However, current communication devices on the market do not adequately address this vibration problem through structural design. Summary of the Invention

[0003] This invention provides a microphone module, a speaker module, and a communication device, which can effectively suppress the impact of speaker vibration on sound reception and broadcast quality.

[0004] The microphone module of the present invention includes a support structure and a microphone assembly. The support structure includes a support portion and two support portions connected to the support portion. The microphone assembly includes a microphone body portion and two mounting portions, the microphone body portion being suspended from the support portion, and the two mounting portions being respectively connected to opposite sides of the microphone body portion and respectively mounted on the two support portions.

[0005] In one embodiment of the present invention, each of the above-mentioned support portions has a limiting recess, and each hanging portion is limited within the limiting recess of the corresponding support portion.

[0006] In one embodiment of the present invention, each of the above-mentioned hanging parts has two stop flanges, and each support part is stopped between the two stop flanges of the corresponding hanging part.

[0007] In one embodiment of the present invention, the microphone body includes a housing and a microphone, with two mounting parts connected to opposite sides of the housing, and the microphone disposed inside the housing.

[0008] In one embodiment of the present invention, the two mounting parts described above are integrally formed and connected to the housing.

[0009] In one embodiment of the present invention, a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the vertical direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone.

[0010] In one embodiment of the present invention, a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the front-rear direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone body portion.

[0011] In one embodiment of the present invention, the microphone module further includes a sealing member and a covering structure. The sealing member is compressed between the covering structure and the support portion and defines a sealing area, and the microphone assembly is located within the sealing area.

[0012] The loudspeaker module of the present invention includes a support structure, a loudspeaker assembly, and a locking accessory. The support structure includes a support portion and an assembly portion, the assembly portion being connected to the support portion. The loudspeaker assembly is disposed on the support portion and includes a loudspeaker body portion and a buffer structure. The buffer structure includes a buffer portion located on a first surface of the loudspeaker body portion, and the assembly portion passes through the buffer portion. The locking accessory is locked to the assembly portion, and the buffer portion is sandwiched between the locking accessory and the first surface of the loudspeaker body portion.

[0013] In one embodiment of the present invention, there are multiple assembly parts, buffer parts and locking accessories, with the assembly parts respectively passing through the buffer parts and the locking accessories respectively locking the assembly parts.

[0014] In one embodiment of the present invention, the above-mentioned buffer structure includes a buffer layer, which is located on a second surface of the speaker body relative to the first surface and connected to the buffer portion, and is sandwiched between the second surface of the speaker body and the support portion.

[0015] In one embodiment of the present invention, the periphery of the speaker body has an assembly notch, and the buffer portion and the buffer layer are connected to each other through the assembly notch.

[0016] In one embodiment of the present invention, the speaker module further includes a cover structure and an annular sealing structure. The support portion has an annular flange that defines a sound cavity region. The speaker assembly is located within the sound cavity region. The annular sealing structure has a groove, and the annular flange is embedded in the groove. The annular sealing structure is compressed between the cover structure and the annular flange.

[0017] In one embodiment of the present invention, the speaker module further includes a covering structure, a rear acoustic cavity is formed between the covering structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and the support portion.

[0018] The communication device of the present invention includes a first cover, a microphone module, and a speaker module. The microphone module includes a support structure and a microphone assembly. The support structure is formed on the first cover and includes a support portion and two support portions connected to the support portion. The microphone assembly includes a microphone body portion and two hanging portions. The microphone body portion is suspended from the support portion, and the two hanging portions are respectively connected to opposite sides of the microphone body portion and respectively hung on the two support portions. The speaker module includes another support structure, a speaker assembly, and a locking attachment. The other support structure is formed on the first cover and includes another support portion and an assembly portion connected to the other support portion. The speaker assembly is disposed on the other support portion and includes a speaker body portion and a buffer structure. The buffer structure includes a buffer portion located on a first surface of the speaker body portion. The assembly portion passes through the buffer portion, and the locking attachment is locked to the assembly portion. The buffer portion is sandwiched between the locking attachment and the first surface of the speaker body portion.

[0019] In one embodiment of the present invention, the communication device further includes a second cover assembled on the first cover, and the microphone module further includes a seal and a covering structure formed on the second cover. The seal is compressed between the covering structure and the support portion and defines a sealing area, and the microphone assembly is located within the sealing area.

[0020] In one embodiment of the present invention, the speaker module described above is located outside the sealed area.

[0021] In one embodiment of the present invention, the communication device further includes a second cover assembled on the first cover. The speaker module further includes a covering structure and an annular sealing structure. The covering structure is formed on the second cover. The supporting portion has an annular flange that defines a sound cavity region. The speaker assembly is located within the sound cavity region. The annular sealing structure has a groove, and the annular flange is embedded in the groove. The annular sealing structure is compressed between the covering structure and the annular flange.

[0022] In one embodiment of the present invention, the microphone module described above is located outside the acoustic cavity region.

[0023] In one embodiment of the present invention, the communication device further includes a second cover assembled on the first cover, and the speaker module further includes a covering structure formed on the second cover. A rear acoustic cavity is formed between the covering structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and another support portion.

[0024] Based on the above, in the microphone module of the present invention, the microphone body is suspended from the support portion by two opposing mounting portions, creating a gap between the microphone body and the support portion. This reduces the contact area between the microphone body and the support portion, thereby suppressing vibrations transmitted from the support portion to the microphone body. Furthermore, in the speaker module of the present invention, the buffer portion of the buffer structure is sandwiched between the locking accessory and the speaker body and adjacent to the assembly portion, allowing vibrations transmitted from the speaker body to the locking accessory and the assembly portion to be suppressed by the buffering effect of the buffer portion. Accordingly, the impact of speaker module vibration on sound reception and playback quality can be effectively suppressed. Attached Figure Description

[0025] Figure 1 This is a perspective view of a communication device according to an embodiment of the present invention.

[0026] Figure 2 yes Figure 1 An exploded view of the communication device.

[0027] Figure 3 yes Figure 2 A partial bottom view of some components of a communication device.

[0028] Figure 4 yes Figure 3 A partial enlarged view of the communication device.

[0029] Figure 5 yes Figure 4 Front view of the microphone module.

[0030] Figure 6 yes Figure 5 A 3D view of the microphone assembly.

[0031] Figure 7 yes Figure 1 A cross-sectional view of the communication device along line II.

[0032] Figure 8 yes Figure 4 A perspective view of the microphone module.

[0033] Figure 9 yes Figure 3 A partial 3D view of the communication device.

[0034] Figure 10 Show Figure 9 The partial structure of the speaker module.

[0035] Figure 11 yes Figure 9 A three-dimensional view of the speaker assembly.

[0036] Figure 12 yes Figure 11 The bottom view of the buffer structure.

[0037] Figure 13 yes Figure 12 A side view of the buffer structure.

[0038] Figure 14 yes Figure 1 A cross-sectional view of the communication device along line II-II.

[0039] Figure 15 and Figure 16 yes Figure 14 A three-dimensional view of a partial structure of the speaker module.

[0040] Figure 17 yes Figure 15 A partial cross-sectional enlarged view of the speaker module.

[0041] Figures 18A to 18C yes Figure 1 The audio playback effect test diagram of the communication device.

[0042] Figure 18D and Figure 18E yes Figure 1 A test diagram of the radio reception performance of a communication device.

[0043] Figures 18F to 18H yes Figure 1 The diagram shows the test results of the communication device's sound reception and broadcasting effects.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100: Communication device

[0046] 110: First cover

[0047] 120: Second cover

[0048] 130: Microphone Module

[0049] 132: Load-bearing structure

[0050] 1321: Bearing section

[0051] 1322: Support section

[0052] 1322a: Limiting notch

[0053] 134: Microphone assembly

[0054] 1341: Microphone body section

[0055] 1341a: Shell

[0056] 1341b: Microphone

[0057] 1342: Department of Installation

[0058] 1342a: Stop flange

[0059] 136: Seals

[0060] 138, 148: Covering structure

[0061] 140: Speaker Module

[0062] 140a: Rear acoustic cavity

[0063] 140b: Front acoustic chamber

[0064] 142: Load-bearing structure

[0065] 1421: Bearing section

[0066] 1421a: Annular flange

[0067] 1422: Assembly Department

[0068] 144: Speaker assembly

[0069] 1441: Speaker body section

[0070] 1441a: First surface

[0071] 1441b: Second surface

[0072] 1441c: Assembly notch

[0073] 1442: Buffer Structure

[0074] 146: Lock accessories

[0075] 1461: Locking Part

[0076] 1462: Head

[0077] 149: Annular sealing structure

[0078] 1491: Trench

[0079] A: Horizontal axis

[0080] C1, C2: Geometric centers

[0081] D1: Forward and backward direction

[0082] D2: Width direction

[0083] D3: up and down direction

[0084] G: Gap

[0085] H: Through hole

[0086] R1: Sealed area

[0087] R2: Acoustic cavity area

[0088] S: Contact surface Detailed Implementation

[0089] Figure 1 This is a perspective view of a communication device according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded view of the communication device. Figure 3 yes Figure 2 A partial lower view of some components of the communication device. Please refer to... Figures 1 to 3 The communication device 100 of this embodiment includes a first cover 110, a second cover 120, a microphone module 130, and a speaker module 140. The second cover 120 and the first cover 110 are assembled together to form the outer shell of the communication device 100, which is used to house the microphone module 130 and the speaker module 140.

[0090] Figure 4 yes Figure 3 A partial enlarged view of the communication device. Figure 5 yes Figure 4 Front view of the microphone module. Figure 6 yes Figure 5 A 3D diagram of the microphone assembly. Please refer to... Figures 3 to 6 The microphone module 130 of this embodiment includes a support structure 132 and a microphone assembly 134. The support structure 132 is integrally formed on the first cover 110, that is, the support structure 132 is a part of the first cover 110. The support structure 132 includes a support portion 1321 and two support portions 1322, which are integrally formed and connected to the support portion 1321. The microphone assembly 134 includes a microphone body portion 1341 and two hanging portions 1342, which are respectively connected to opposite sides of the microphone body portion 1341 and respectively hung on the two support portions 1322, so that the microphone body portion 1341 is suspended on the support portion 1321.

[0091] Figure 7 yes Figure 1 A cross-sectional view of the communication device along line II. As described above, in the microphone module 130 of this embodiment, the microphone body 1341 is suspended from the support portion 1321 by two opposing hanging portions 1342, such that the microphone body 1341 and the support portion 1321 are as follows: Figure 5 and Figure 7 The gap G shown reduces the contact area between the microphone body 1341 and the support portion 1321, thereby suppressing vibrations transmitted from the support portion 1321 to the microphone body 1341. This effectively suppresses the impact of speaker module 140 vibration on the sound reception quality of the microphone module 130.

[0092] In detail, each support portion 1322 in this embodiment is as follows: Figure 4 The device shown has a limiting notch 1322a, and each mounting portion 1342 is limited within the limiting notch 1322a of the corresponding support portion 1322. Accordingly, each support portion 1322, by limiting the mounting portion 1342 with its limiting notch 1322a, fixes the microphone assembly 134 in the front-rear direction D1. Furthermore, in this embodiment, each mounting portion 1342 is as follows... Figure 4 The device shown has two stop flanges 1342a, and each support portion 1322 is stopped between the two stop flanges 1342a of the corresponding mounting portion 1342. Accordingly, each support portion 1322 fixes the microphone assembly 134 in the width direction D2 by means of the stop flanges 1342a.

[0093] Figure 8 yes Figure 4 A perspective view of the microphone module. Please refer to... Figure 5 , Figure 7 and Figure 8 In this embodiment, the microphone body 1341 includes a housing 1341a and a microphone 1341b. Two mounting portions 1342 are integrally formed and connected to opposite sides of the housing 1341a, and the microphone 1341b is disposed within the housing 1341a. A horizontal axis A passes through the two mounting portions 1342 along the width direction D2 of the microphone assembly 134. In the vertical direction D3 of the microphone assembly 134, the horizontal axis A is as follows: Figure 8 The diagram shows the geometric center C1 of the microphone 1341b, which is not located there. Furthermore, in the front-rear direction D1 of the microphone assembly 134, the horizontal axis A is as shown... Figure 5 The image shows the geometric center C2 of the microphone body 1341.

[0094] Please refer to Figure 2 , Figure 3 and Figure 7 Furthermore, the microphone module 130 of this embodiment also includes a sealing member 136 and a covering structure 138. The sealing member 136 is made of, for example, ethylene-vinyl acetate copolymer (EVA) or other suitable sealing materials. The covering structure 138 is integrally formed on the second cover 120, that is, the covering structure 138 is part of the second cover 120. The covering structure 138 is used to stop and fix the microphone assembly 134 in the vertical direction D3. The sealing member 136 is compressed between the covering structure 138 and the support portion 1321 and defines a sealing area R1 (marked in...). Figure 3The microphone assembly 134 is located inside the sealed area R1, and the speaker module 140 is located outside the sealed area R1. This prevents the microphone assembly 134 from receiving external noise.

[0095] Figure 9 yes Figure 3 A partial 3D view of the communication device. Figure 10 Show Figure 9 The partial structure of the speaker module. Figure 11 yes Figure 9 A perspective view of the speaker assembly. Please refer to... Figure 3 , Figure 9 and Figure 10 The speaker module 140 of this embodiment includes a support structure 142, a speaker assembly 144, and a plurality of locking accessories 146. The support structure 142 is integrally formed on the first cover 110, that is, the support structure 142 is a part of the first cover 110. The support structure 142 includes a support portion 1421 and a plurality of assembly portions 1422, the assembly portions 1422 being connected to the support portion 1421.

[0096] Figure 12 yes Figure 11 The bottom view of the buffer structure. Figure 13 yes Figure 12 A side view of the buffer structure. Please refer to... Figures 9 to 13 The speaker assembly 144 is disposed on the support portion 1421 and includes a speaker body portion 1441 and a buffer structure 1442. The periphery of the speaker body portion 1441 has a first surface 1441a and a second surface 1441b opposite to each other and has a plurality of assembly recesses 1441c. The buffer structure 1442 is made of, for example, rubber or other suitable buffering material and includes a plurality of buffer portions 1442a and a buffer layer 1442b. The buffer portions 1442a are located on the first surface 1441a of the speaker body portion 1441, and the buffer layer 1442b is located on the second surface 1441b of the speaker body portion 1441 and is integrally connected to the buffer portions 1442a through the assembly recesses 1441c. The periphery of the speaker body portion 1441 is sandwiched between the buffer portions 1442a and the buffer layer 1442b. The buffer layer 1442b is sandwiched between the second surface 1441b of the speaker body portion 1441 and the support portion 1421.

[0097] The buffer structure 1442 has multiple through holes H, which extend from the buffer portions 1442a to the buffer layer 1442b. The assembly portions 1422 are inserted into the through holes H and pass through the buffer portions 1442a. The locking portions 1461 of the locking attachments 146 are locked to the assembly portions 1422. The buffer portions 1442a are sandwiched between the head 1462 of the locking attachments 146 and the first surface 1441a of the speaker body portion 1441.

[0098] As described above, in the speaker module 140 of this embodiment, the buffer portion 1442a of the buffer structure 1442 is sandwiched between the locking attachment 146 and the speaker body portion 1441 and adjacent to the assembly portion 1422, so that the vibration transmitted from the speaker body portion 1441 to the locking attachment 146 and the assembly portion 1422 can be suppressed by the buffering effect of the buffer portion 1442a. Furthermore, the buffer layer 1442b of the buffer structure 1442 is sandwiched between the speaker body portion 1441 and the support portion 1421, thus providing an airtight effect. Accordingly, the impact of the vibration of the speaker body portion 1441 on the sound reception quality of the microphone module 130 and the sound playback quality of the speaker module 140 can be effectively suppressed.

[0099] Figure 14 yes Figure 1 A cross-sectional view of the communication device along line II-II. Please refer to... Figure 14 In detail, the speaker module 140 of this embodiment further includes a cover structure 148, which is integrally formed on the second cover 120, that is, the cover structure 148 is a part of the second cover 120. A rear acoustic cavity 140a is formed between the cover structure 148 and the buffer structure 1442, and a front acoustic cavity 140b is formed between the buffer structure 1442 and the support portion 1421. Through the airtight effect provided by the buffer layer 1442b of the buffer structure 1442, the rear acoustic cavity 140a and the front acoustic cavity 140b are independent of each other. As described above, the rear acoustic cavity 140a and the front acoustic cavity 140b are separated in the speaker module 140 by the buffer structure 1442, and the effective volume of the rear acoustic cavity 140a and the front acoustic cavity 140b can be accurately optimized according to the acoustic design requirements. Furthermore, by using the covering structure 148 integrally formed on the second cover 120 and the supporting portion 1421 integrally formed on the first cover 110 to define the rear sound cavity 140a and the front sound cavity 140b as described above, there is no need to design an additional sound cavity shell, thus saving manufacturing and assembly costs.

[0100] Figure 15 and Figure 16 yes Figure 14 A three-dimensional view of a partial structure of the speaker module. Figure 17 yes Figure 15 A partially enlarged cross-sectional view of the speaker module. Please refer to... Figure 2 , Figure 3 and Figures 15 to 17 The speaker module 140 in this embodiment also includes an annular sealing structure 149. The carrier portion 1421 has an annular flange 1421a, which defines a sound cavity region R2 (marked as...). Figure 2 and Figure 3The speaker assembly 144 is located within the acoustic cavity region R2, and the microphone module 130 is located outside the acoustic cavity region R2. That is, the speaker assembly 144 is located inside and surrounded by the annular flange 1421a, and the microphone module 130 is located outside the annular flange 1421a. The annular sealing structure 149 is made of, for example, rubber or other suitable sealing material and has a groove 1491 (marked in...). Figure 17 An annular flange 1421a is embedded in a groove 1491, and an annular sealing structure 149 is compressed between the covering structure 148 and the annular flange 1421a. Accordingly, the annular sealing structure 149 and the annular flange 1421a have three contact surfaces S (indicated in...). Figure 17 They are in contact with each other, so that the rear acoustic cavity 140a and the front acoustic cavity 140b can be well sealed in the acoustic cavity region R2.

[0101] Figures 18A to 18C yes Figure 1 The audio playback effect test diagram of the communication device. Figure 18D and Figure 18E yes Figure 1 A test diagram of the radio reception performance of a communication device. Figures 18F to 18H yes Figure 1 The diagram shows the test results of the communication device's sound reception and playback performance. Figure 18A As shown, taking the SPK FR of speaker module 140 as an example, the curve is smooth from 300Hz to 1.5kHz and there is no obvious dip after 7kHz. Figure 18B As shown, taking the SPK THD of speaker module 140 as an example, it significantly and effectively suppresses vibration, especially with a significant reduction in distortion in the 1-3kHz range. Figure 18C As shown, taking the SPK R&B of speaker module 140 as an example, it significantly and effectively suppresses vibration, with an overall reduction in vibration from 100Hz to 700Hz (most noticeable at 600Hz). Figure 18D As shown, taking the MIC FR of microphone module 130 as an example, the overall curve is smooth, with no obvious dips or peeks after 2kHz. Figure 18E As shown, the MIC THD of microphone module 130 significantly and effectively suppresses vibration, especially with a substantial reduction in distortion at 3-4kHz. Figure 18F As shown, the Echo FR curve for speaker module 140 and microphone module 130 is smooth and has no obvious dips or peeks. For example... Figure 18G As shown, the Echo THD of speaker module 140 and microphone module 130 effectively suppresses vibration, and the overall distortion is significantly reduced in the mid-frequency range. Figure 18H As shown, the Echo R&B of speaker module 140 and microphone module 130 is significantly and effectively suppressed, and the overall R&B is significantly reduced.

[0102] In summary, in the microphone module of the present invention, the microphone body is suspended from the support portion by two opposing mounting portions, creating a gap between the microphone body and the support portion. This reduces the contact area between the microphone body and the support portion, thereby suppressing vibrations transmitted from the support portion to the microphone body. Furthermore, the buffer layer of the buffer structure is sandwiched between the speaker body and the support portion, providing an airtight effect. Additionally, in the speaker module of the present invention, the buffer portion of the buffer structure is sandwiched between the locking accessory and the speaker body and adjacent to the assembly portion, allowing vibrations transmitted from the speaker body to the locking accessory and the assembly portion to be suppressed by the buffering effect of the buffer portion. Accordingly, the impact of speaker module vibration on sound reception and playback quality can be effectively suppressed.

Claims

1. A microphone module, comprising: A load-bearing structure includes a load-bearing part and two support parts, wherein the two support parts are connected to the load-bearing part; as well as A microphone assembly includes a microphone body and two mounting parts, wherein the microphone body is suspended from the support part, and the two mounting parts are respectively connected to opposite sides of the microphone body and respectively mounted on the two support parts.

2. The microphone module as claimed in claim 1, wherein each of the support portions has a limiting notch, and each of the hanging portions is limited within the limiting notch of the corresponding support portion.

3. The microphone module as claimed in claim 1, wherein each of the mounting portions has two stop flanges, and each of the support portions is stopped between the two stop flanges of the corresponding mounting portion.

4. The microphone module as claimed in claim 1, wherein the microphone body includes a housing and a microphone, the two mounting portions are connected to opposite sides of the housing, and the microphone is disposed within the housing.

5. The microphone module as claimed in claim 4, wherein the two mounting portions are integrally formed and connected to the housing.

6. The microphone module as claimed in claim 4, wherein a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the vertical direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone.

7. The microphone module as claimed in claim 1, wherein a horizontal axis passes through the two mounting portions along the width direction of the microphone assembly, and in the front-rear direction of the microphone assembly, the horizontal axis does not pass through the geometric center of the microphone body portion.

8. The microphone module of claim 1, further comprising a seal and a cover structure, wherein the seal is compressed between the cover structure and the carrier and defines a sealed area, the microphone assembly being located within the sealed area.

9. A speaker module, comprising: A load-bearing structure includes a load-bearing part and an assembly part, wherein the assembly part is connected to the load-bearing part; A loudspeaker assembly, disposed on the support portion and including a loudspeaker body and a buffer structure, wherein the buffer structure includes a buffer portion located on a first surface of the loudspeaker body, and the assembly portion passes through the buffer portion; and A locking accessory is attached to the assembly, wherein the buffer portion is sandwiched between the locking accessory and the first surface of the speaker body.

10. The speaker module of claim 9, wherein there are multiple assembly parts, buffer parts, and locking accessories, the assembly parts are respectively disposed on the buffer parts, and the locking accessories are respectively locked to the assembly parts.

11. The speaker module of claim 9, wherein the buffer structure includes a buffer layer located on a second surface of the speaker body relative to the first surface and connected to the buffer portion, the buffer layer being sandwiched between the second surface of the speaker body and the support portion.

12. The speaker module of claim 11, wherein the periphery of the speaker body has an assembly notch, and the buffer portion and the buffer layer are interconnected through the assembly notch.

13. The loudspeaker module of claim 9, further comprising a cover structure and an annular sealing structure, wherein the carrier portion has an annular flange defining a acoustic cavity region, the loudspeaker assembly is located within the acoustic cavity region, the annular sealing structure has a groove, the annular flange is embedded in the groove, and the annular sealing structure is compressed between the cover structure and the annular flange.

14. The loudspeaker module of claim 9 further includes a cover structure, wherein a rear acoustic cavity is formed between the cover structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and the support portion.

15. A communication device, comprising: The first cover body; A microphone module includes a support structure and a microphone assembly. The support structure is formed on the first cover and includes a support portion and two support portions connected to the support portion. The microphone assembly includes a microphone body portion and two mounting portions. The microphone body portion is suspended from the support portion, and the two mounting portions are respectively connected to opposite sides of the microphone body portion and respectively mounted on the two support portions. A loudspeaker module includes another support structure, a loudspeaker assembly, and a locking attachment. The other support structure is formed on the first cover and includes another support portion and an assembly portion connected to the other support portion. The loudspeaker assembly is disposed on the other support portion and includes a loudspeaker body portion and a buffer structure. The buffer structure includes a buffer portion located on a first surface of the loudspeaker body portion. The assembly portion passes through the buffer portion. The locking attachment is locked to the assembly portion. The buffer portion is sandwiched between the locking attachment and the first surface of the loudspeaker body portion.

16. The communication device of claim 15, further comprising a second cover, wherein the second cover is assembled to the first cover, the microphone module further comprising a seal and a covering structure formed in the second cover, the seal being compressed between the covering structure and the carrier and defining a sealed area, the microphone assembly being located within the sealed area.

17. The communication device of claim 16, wherein the speaker module is located outside the sealed area.

18. The communication device of claim 15, further comprising a second cover, wherein the second cover is assembled to the first cover, the speaker module further comprising a covering structure and an annular sealing structure, the covering structure being formed in the second cover, the support portion having an annular flange defining a sound cavity region, the speaker assembly being located in the sound cavity region, the annular sealing structure having a groove, the annular flange being embedded in the groove, and the annular sealing structure being compressed between the covering structure and the annular flange.

19. The communication device of claim 18, wherein the microphone module is located outside the acoustic cavity region.

20. The communication device of claim 15, further comprising a second cover, wherein the second cover is assembled to the first cover, and the speaker module further comprising a covering structure formed on the second cover, wherein a rear acoustic cavity is formed between the covering structure and the buffer structure, and a front acoustic cavity is formed between the buffer structure and the other support portion.

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