Chip heat dissipation assembly and heat dissipation module

Abstract

The invention discloses a chip heat dissipation assembly and a heat dissipation module. The chip heat dissipation assembly comprises a movable gland used for forming an airflow cavity, a heat conduction substrate used for conducting heat of a chip, a first equal-height screw, a plurality of heat dissipation columns arranged in an array and used for heat dissipation, and a floating unit enabling the heat dissipation columns to move relative to the heat conduction substrate. The movable gland is in floating connection with the heat conduction substrate through first equal-height screws so as to adapt to chips of different heights, the multiple heat dissipation columns are in floating connection with the heat conduction substrate through the floating units so as to compensate planeness errors of the chips, and the heat dissipation columns and the movable gland define a heat dissipation airflow channel. The chip heat dissipation assembly is communicated with an external air channel to form a heat dissipation module. The problems that an existing heat dissipation assembly is poor in universality, chip flatness errors cannot be compensated, and the heat dissipation efficiency is low are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip detection, in particular to a chip heat dissipation assembly and a heat dissipation module. BACKGROUND

[0002] A chip, also known as a microcircuit, microchip or integrated circuit, refers to a silicon wafer containing integrated circuits, which is very small and often a part of a computer or other electronic device. After the production and manufacturing of a chip are completed, the chip needs to be placed in a detection fixture for aging test. The chip heat dissipation assembly in the existing detection fixture is usually connected with a heat dissipation fin of a fixed structure and a heat conduction substrate. This structure has two defects: first, it cannot adapt to chips of different heights, and when chips of different heights are replaced, the entire heat dissipation assembly needs to be replaced, which is poor in versatility and increases the use cost; second, the adhesion of the heat dissipation fin to the surface of the chip is greatly affected by the flatness error of the chip. If the surface of the chip is uneven, a gap will be formed between the heat dissipation fin and the chip, which reduces the heat conduction efficiency and greatly reduces the heat dissipation effect. SUMMARY

[0003] The present application aims to overcome the shortcomings of the prior art and provide a chip heat dissipation assembly and a heat dissipation module to solve the problems of poor versatility, inability to compensate for the flatness error of the chip and low heat dissipation efficiency of the existing heat dissipation assembly.

[0004] The purpose of the present application is achieved by the following technical solutions: A chip heat dissipation assembly includes a movable gland for forming an air flow cavity, a heat conduction substrate for conducting heat of a chip, a first equal-height screw, a plurality of heat dissipation columns arranged in an array and used for heat dissipation, and a floating unit for allowing the heat dissipation columns to displace relative to the heat conduction substrate. The movable gland is floatingly connected to the heat conduction substrate by the first equal-height screw to adapt to chips of different heights. The plurality of heat dissipation columns are floatingly connected to the heat conduction substrate by the floating unit to compensate for the flatness error of the chip. The heat dissipation columns and the movable gland enclose a heat dissipation air flow passage.

[0005] Further, the floating unit includes at least two positioning members and at least one elastic member. The positioning members and the elastic member are arranged on the heat conduction substrate along the displacement direction of the heat dissipation column. The heat dissipation column can slide relative to the heat conduction substrate along the arrangement direction through the positioning members and the elastic member.

[0006] Further, the positioning member is a second equal-height screw, and the elastic member is a floating spring. The number of the floating spring is one, and the number of the second equal-height screw is two and symmetrically distributed on both sides of the floating spring. The elastic force direction of the floating spring is consistent with the displacement direction of the heat dissipation column.

[0007] Furthermore, the bottom end of the heat dissipation column is provided with a mounting part, the mounting part having an elongated slot that mates with the second equal-height screw and a receiving groove that mates with the floating spring. The length of the elongated slot is greater than that of the second equal-height screw, so as to allow the heat dissipation column to move along the length direction of the slot.

[0008] Furthermore, the top of the heat sink is provided with a contact plane for bonding with the chip surface.

[0009] Furthermore, the heat dissipation column has at least two through channels along the axial direction.

[0010] Furthermore, the movable pressure cover has a limiting groove for accommodating the heat-conducting substrate and the heat dissipation column. An airflow gap is reserved between the inner wall of the limiting groove and the heat dissipation column. The side wall of the limiting groove has an air exchange channel and an air outlet communicating with the airflow gap. The air exchange channel and the air outlet are staggered along the airflow direction of the airflow gap.

[0011] Furthermore, the movable pressure cover is also provided with a flange structure for connecting an external fan. The through hole of the flange structure communicates with the limiting groove to guide the external airflow through the heat-conducting substrate.

[0012] Furthermore, the groove wall of the limiting groove is provided with a fastening structure and a hinge structure for fixing external components. The fastening structure is a buckle with a barb, and the hinge structure is a groove that cooperates with the external bracket.

[0013] A heat dissipation module includes the aforementioned chip heat dissipation component, which is connected to at least one external air duct.

[0014] The beneficial effects of this invention are: The movable pressure cap is floatingly connected to the thermally conductive substrate via a first equal-height screw, allowing for flexible adjustment of the distance between them according to the chip height. This eliminates the need to replace the heat dissipation components, making it adaptable to chips of different heights and highly versatile. Multiple heat sinks are floatingly connected to the thermally conductive substrate via floating units. Each heat sink can independently adapt to the unevenness of the chip surface, effectively compensating for chip flatness errors and ensuring a tight fit between the heat sink and the chip surface, reducing contact thermal resistance.

[0015] The array of heat dissipation columns, arranged together with the movable pressure cover, forms an orderly heat dissipation airflow channel. Combined with the axial through-channel of the heat dissipation columns, this increases the heat dissipation surface area and enables full airflow.

[0016] The fastening and hinge structures on the limiting groove wall work together to achieve a stable connection between the heat dissipation components and external components, adapting to different installation scenarios and making installation and disassembly convenient. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the chip heat dissipation assembly of the present invention; Figure 2 This is a schematic diagram of the connection structure between the thermally conductive substrate and the heat dissipation pillar of the present invention; Figure 3 for Figure 2 A schematic diagram of the decomposed structure; Figure 4 for Figure 2 Side view; Figure 5 for Figure 4 A sectional view of section AA; Figure 6 This is a schematic diagram of the heat dissipation module of the present invention; Figure 7 This is an exploded structural diagram of the heat dissipation module of the present invention.

[0018] Explanation of reference numerals in the attached figures: 10-Modible cover; 11-Limiting groove; 12-Ventilation channel; 13-Air outlet; 14-Flange structure; 15-Snap-on structure; 16-Hinged structure; 20 - Thermally conductive substrate; 30 - First level height screw; 40 - Heat dissipation column; 41 - Mounting part; 411 - Long strip slot; 412 - Receiving groove; 42 - Contact plane; 43 - Through-hole; 50 - Floating unit; 51 - Second equal-height screw; 52 - Floating spring; 60 - External air duct. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] In the description of this invention, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0022] like Figures 1 to 5 As shown, this embodiment of the invention provides a chip heat dissipation assembly, including a movable pressure cover 10 for forming an airflow cavity, a thermally conductive substrate 20 for conducting chip heat, a first equal-height screw 30, a plurality of heat dissipation pillars 40 arranged in an array for heat dissipation, and a floating unit 50 for displacing the heat dissipation pillars 40 relative to the thermally conductive substrate 20; the movable pressure cover 10 is floatingly connected to the thermally conductive substrate 20 through the first equal-height screw 30 to adapt to chips of different heights, and the plurality of heat dissipation pillars 40 are all floatingly connected to the thermally conductive substrate 20 through the floating unit 50 to compensate for the flatness error of the chip, and the heat dissipation pillars 40 and the movable pressure cover 10 enclose a heat dissipation airflow channel.

[0023] In this embodiment, as Figure 1 and Figure 7 As shown, the movable pressure cover 10 has a limiting groove 11 for accommodating the heat-conducting substrate 20 and the heat dissipation column 40. An airflow gap is reserved between the inner wall of the limiting groove 11 and the heat dissipation column 40. Air exchange channels 12 communicating with the airflow gap are respectively opened on the two side walls of the limiting groove 11, and an air outlet 13 communicating with the airflow gap is opened on the other side wall of the limiting groove 11. The limiting groove 11 protects and positions the heat-conducting substrate 20 and the heat dissipation column 40. The airflow gap, together with the staggered air exchange channels 12 and the air outlet 13, forms an orderly heat dissipation airflow channel, avoiding airflow short-circuiting and ensuring that the airflow can fully flow over the surface of the heat dissipation column 40 to carry away heat.

[0024] Four first equal-height screws 30 are provided, which are respectively set at the four corners of the limiting groove 11. The heat-conducting substrate 20 is also provided with an elongated slot that cooperates with the first equal-height screws 30, so as to allow the heat-conducting substrate 20 to move along the length of the slot.

[0025] The movable cover 10 is also provided with a flange structure 14 for connecting an external fan. The through hole of the flange structure 14 communicates with the limiting groove 11 to guide the external airflow through the heat-conducting substrate 20. The flange structure 14 facilitates quick connection with the external fan, ensuring that the external airflow can be accurately introduced into the limiting groove 11, thereby improving the airflow introduction efficiency.

[0026] A fastening structure 15 is provided on the groove wall opposite to the air outlet 13 in the limiting groove 11, and a hinge structure 16 is provided on the groove wall opposite to the fastener in the limiting groove 11. The fastening structure 15 is a latch with barbs, and the hinge structure 16 is a groove that cooperates with the external bracket. The fastening structure 15 and the hinge structure 16 cooperate to achieve flexible fixation of the heat dissipation component and the external component, meeting the needs of different installation scenarios. The latch design with barbs can ensure the stability of the connection, and the groove-type hinge structure 16 facilitates installation and disassembly.

[0027] In this embodiment, the floating unit 50 includes two positioning members and one elastic member. The positioning members and the elastic member are arranged on the thermally conductive substrate 20 along the displacement direction of the heat sink 40. The heat sink 40 can slide relative to the thermally conductive substrate 20 along the arrangement direction through the positioning members and the elastic member. The positioning members achieve precise positioning of the displacement direction of the heat sink 40, and the elastic member provides a reset force to ensure that the heat sink 40 is always in close contact with the chip surface.

[0028] The positioning element is a second equal-height screw 51, and the elastic element is a floating spring 52. There are two second equal-height screws 51, which are symmetrically distributed on both sides of the floating spring 52. The direction of the elastic force of the floating spring 52 is consistent with the displacement direction of the heat sink 40. Using the second equal-height screws 51 as the positioning element results in a simple structure and high positioning accuracy. The symmetrical distribution design ensures that the heat sink 40 is subjected to balanced force. The floating spring 52 provides a stable elastic force, ensuring that the heat sink 40 can tightly fit the chip under different flatness conditions.

[0029] The bottom end of the heat dissipation column 40 is provided with a mounting part 41. The mounting part 41 has an elongated slot 411 that mates with the second equal-height screw 51 and a receiving groove 412 that mates with the floating spring 52. The length of the elongated slot 411 is greater than that of the second equal-height screw 51 to allow the heat dissipation column 40 to move along the length of the slot. The mate between the elongated slot 411 and the second equal-height screw 51 enables the sliding guidance of the heat dissipation column 40, and the receiving groove 412 serves to position the floating spring 52, preventing the spring from shifting during the process of being stressed and ensuring the stable transmission of elastic force.

[0030] The top of the heat sink 40 is provided with a contact surface 42 for bonding with the chip surface. The contact surface 42 increases the contact area between the heat sink 40 and the chip, reduces contact thermal resistance, and improves heat conduction efficiency.

[0031] The heat dissipation column 40 has five through channels 43 along its axial direction. The through channels 43 can increase the heat dissipation surface area of ​​the heat dissipation column 40, and at the same time allow the heat dissipation airflow to pass through the interior of the heat dissipation column 40, forming a coordinated heat dissipation inside and outside, which greatly improves the heat dissipation effect.

[0032] like Figure 6 and Figure 7As shown, this embodiment also provides a heat dissipation module, which includes a chip heat dissipation component. The chip heat dissipation component is connected to four external air ducts 60. The external air ducts 60 can be connected to fans and blowers as needed. The four external air ducts 60 are respectively connected to the ventilation channel 12, the air outlet 13 and the flange structure 14. Through the cooperation of the external air ducts 60 and the chip heat dissipation component, the overall heat dissipation capacity is improved.

[0033] The above description merely illustrates preferred technical solutions of the present invention, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and the present invention also intends to include these modifications and variations.

Claims

1. A chip heat dissipation component, characterized in that: The device includes a movable pressure cap for forming an airflow cavity, a thermally conductive substrate for conducting heat from the chip, a first equal-height screw, multiple heat dissipation pillars arranged in an array for heat dissipation, and a floating unit that allows the heat dissipation pillars to be displaced relative to the thermally conductive substrate. The movable pressure cap is floatingly connected to the thermally conductive substrate via the first equal-height screw to adapt to chips of different heights. The multiple heat dissipation pillars are all floatingly connected to the thermally conductive substrate via the floating unit to compensate for the flatness error of the chip. The heat dissipation pillars and the movable pressure cap together form a heat dissipation airflow channel.

2. The chip heat dissipation assembly according to claim 1, characterized in that: The floating unit includes at least two positioning elements and at least one elastic element. The positioning elements and the elastic element are arranged on the heat-conducting substrate along the displacement direction of the heat dissipation column. The heat dissipation column can slide relative to the heat-conducting substrate along the arrangement direction through the positioning elements and the elastic element.

3. The chip heat dissipation assembly according to claim 2, characterized in that: The positioning component is a second equal-height screw, the elastic component is a floating spring, the number of the floating spring is one, the number of the second equal-height screws is two and they are symmetrically distributed on both sides of the floating spring, and the elastic force direction of the floating spring is consistent with the displacement direction of the heat dissipation column.

4. The chip heat dissipation assembly according to claim 3, characterized in that: The bottom end of the heat dissipation column is provided with a mounting part. The mounting part has an elongated slot that mates with the second equal-height screw and a receiving groove that mates with the floating spring. The length of the elongated slot is greater than that of the second equal-height screw, so as to allow the heat dissipation column to move along the length direction of the slot.

5. The chip heat dissipation assembly according to claim 4, characterized in that: The top of the heat sink is provided with a contact plane for bonding with the chip surface.

6. The chip heat dissipation assembly according to claim 4, characterized in that: The heat dissipation column has at least two through channels along its axial direction.

7. The chip heat dissipation assembly according to claim 1, characterized in that: The movable pressure cover has a limiting groove for accommodating the heat-conducting substrate and the heat dissipation column. An airflow gap is reserved between the inner wall of the limiting groove and the heat dissipation column. The side wall of the limiting groove has an air exchange channel and an air outlet that communicate with the airflow gap. The air exchange channel and the air outlet are staggered along the airflow direction of the airflow gap.

8. The chip heat dissipation assembly according to claim 7, characterized in that: The movable cover is also provided with a flange structure for connecting an external fan. The through hole of the flange structure is connected to the limiting groove to guide the external airflow through the heat-conducting substrate.

9. The chip heat dissipation assembly according to claim 7, characterized in that: The groove wall of the limiting groove is provided with a fastening structure and a hinge structure for fixing external components. The fastening structure is a buckle with a barb, and the hinge structure is a groove that cooperates with the external bracket.

10. A heat dissipation module, characterized in that: It includes the chip heat dissipation component according to any one of claims 1 to 9, wherein the chip heat dissipation component is connected to at least one external air duct.

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