Chip substrate multi-station laser edge sealing equipment based on collaborative feeding structure

Abstract

The invention relates to the technical field of chip substrate processing, in particular to chip substrate multi-station laser edge sealing equipment based on a collaborative feeding structure, which comprises a U-shaped conveying table and annular rails positioned on the inner walls of the two sides of the U-shaped conveying table, and a feeding station used for self-checking a chip substrate placing surface and adsorbing and fixing is arranged between the annular rails; the U-shaped conveying table is provided with a horizontal pushing station cooperating with the feeding station to carry out anti-deviation feeding on the stacked chip substrates and an edge sealing station for carrying out turn-over correction and excessive glue removal on the chip substrates. According to the invention, through cooperation of the loading station and the feeding station, anti-deviation loading of the chip substrate is realized, and the placement state is determined according to the distribution difference of excessive glue on the front and back surfaces; and then automatic negative pressure adsorption and clamping fixation are carried out on the correctly placed substrate through the feeding station, so that laser ablation edge sealing is precisely completed, automatic overturning correction is carried out on the wrongly placed substrate and the linkage edge sealing station, and automatic treatment of deviation-preventing feeding, placement state defining, automatic error correction and precise ablation edge sealing is achieved.

Description

Technical Field

[0001] This invention relates to the field of chip substrate processing technology, and in particular to a multi-station laser edge sealing device for chip substrates based on a collaborative feeding structure. Background Technology

[0002] As the core foundational component that carries the chip, establishes the electrical connection between the chip and external circuits, provides physical support, and performs thermal management, the chip substrate is typically made of ceramic, organic polymer materials, or metal. To meet the demands of high-performance applications, a multi-layer substrate sandwich bonding process is often used to create composite structures during processing. However, this process is susceptible to factors such as deviations in adhesive application control and fluctuations in interlayer bonding pressure, causing adhesive to overflow from the interlayer edges. Overflowing adhesive can interfere with the accuracy and effectiveness of subsequent critical processes such as circuit etching and chip mounting. Therefore, laser ablation edge sealing technology is required to precisely remove overflowing adhesive, ensuring the continuity of chip substrate processing and the quality of the final product.

[0003] For example, the chip position calibration device disclosed in CN119252786A uses push rods in four directions to approach the chip. Although this method can achieve full circumferential clamping and position calibration of the chip, when positioning and fixing a chip substrate with excess adhesive on the edge, it will simultaneously come into contact with the excess adhesive on the edge. Because the amount of excess adhesive on the edge is uncontrollable, it will result in different thicknesses of excess adhesive on the edge. When the push rod directly contacts the entire edge of the chip substrate, it will cause the main body of the chip substrate to shift towards the area with less excess adhesive. This will lead to poor accuracy when the excess adhesive on the edge is subsequently laser-ablated for edge sealing.

[0004] To address the aforementioned technical deficiencies, a solution is proposed. First, by coordinating the loading and feeding stations, the chip substrate is loaded with anti-misalignment measures while the placement status is clearly defined based on the difference in adhesive overflow distribution on the front and back sides. Then, the feeding station uses autonomous negative pressure adsorption and clamping to fix the correctly placed substrate, thereby precisely completing laser ablation edge sealing. For incorrectly placed substrates, the subsequent edge sealing station automatically flips and corrects them. This achieves automated processing from anti-misalignment loading, clarifying the placement status, automatic error correction, and precise ablation edge sealing, improving edge sealing efficiency and processing accuracy. Summary of the Invention

[0005] The purpose of this invention is to provide a multi-station laser edge sealing device for chip substrates based on a collaborative feeding structure, in order to solve the aforementioned technical defects.

[0006] The objective of this invention can be achieved through the following technical solution: a multi-station laser edge sealing device for chip substrates based on a collaborative feeding structure, comprising a U-shaped conveyor table and annular tracks located on the inner walls of both sides of the U-shaped conveyor table. A feeding station for self-inspecting and adsorbing the placement surface of the chip substrate is provided between the annular tracks. The U-shaped conveyor table is provided with a collaborative feeding station for a flat-pushing station for anti-deviation feeding of stacked chip substrates, and an edge sealing station for flipping and correcting the chip substrate and removing excess adhesive. The feeding station includes two sets of L-shaped limiting plates and multiple equally spaced feeding seats, with clamping plate one and clamping plate two located on both sides of the feeding seats.

[0007] Preferably, the U-shaped conveyor table has symmetrical rotating rods on both sides, and synchronous pulleys are fixedly connected to the rotating rods. The two sets of synchronous pulleys are connected by a synchronous belt drive. The feeding seat has movable holes, and the synchronous belt has fixed pins that are movably inserted into the corresponding movable holes. A servo motor that drives the corresponding rotating rod to rotate is installed on the U-shaped conveyor table by bolts.

[0008] Preferably, two sets of rollers that roll against the corresponding annular track are rotatably installed on both sides of the feeding seat. An adsorption chamber is opened on the top of the feeding seat, and a connecting hole is opened through the bottom of the adsorption chamber. An air suction seat is installed inside the U-shaped conveyor table through a horizontal plate, and an air chamber is opened on the top of the air suction seat. An air pipe is fixedly connected to the air suction seat.

[0009] Preferably, a sealing gasket is installed on the top of both the feeding seat and the suction seat, and the bottom of the feeding seat slides against the sealing gasket on the top of the suction seat.

[0010] Preferably, piston chambers are symmetrically provided on both sides of the adsorption chamber, and piston blocks are slidably connected to each piston chamber. A movable plate extending to the outside of the feeding seat and carrying clamp plate one and clamp plate two is fixedly connected to the piston block.

[0011] Preferably, an installation plate is fixedly connected inside the adsorption chamber and between the piston blocks, and a spring is fixedly connected between the installation plate and the piston blocks. An installation groove is opened on the top of a set of movable plates. A rotating block that is rotatably connected to the installation groove is fixedly connected to the first clamping plate, and torsion springs are installed between the two rotating points on both sides of the rotating block and the inner wall of the installation groove. The second clamping plate is fixedly connected to another set of movable plates.

[0012] Preferably, the L-shaped limiting plate is fixedly connected with a plurality of sliding rods that are slidably connected to the U-shaped conveyor table, and a screw rod that is rotatably connected to the U-shaped conveyor table. An infrared transmitter and an infrared receiver are respectively installed on the two sets of L-shaped limiting plates. A chip suction hopper is installed on the L-shaped limiting plate. A gas pressure sensor is installed in the air cavity. A control panel is fixedly installed on the U-shaped conveyor table.

[0013] Preferably, the flat push station includes a fixed frame fixedly installed on one side of the U-shaped conveyor table, and a flat push plate is installed on the top of the fixed frame via an electric push rod. A material placement frame is detachably installed on the fixed frame. A lead screw is rotatably connected to the fixed frame, and a lifting plate is slidably connected to the lead screw and threadedly connected to it. A servo motor for driving the lead screw to rotate is installed on the fixed frame.

[0014] Preferably, the edge sealing station includes an X-axis electric slide fixedly installed on the outer wall of the U-shaped conveyor table, a Y-axis electric slide and an electric push rod II are mounted on the slide of the X-axis electric slide via a bracket, and a fiber laser is mounted on the slide of the Y-axis electric slide.

[0015] Preferably, a U-shaped plate is installed on the piston rod of the electric push rod two, and a movable plate is slidably connected to both sides of the U-shaped plate. An H-shaped plate is installed on the movable plate via a servo motor three. A guide wheel is rotatably connected to the top of the U-shaped plate. A connecting rope guided by the guide wheel is fixedly connected between the two sets of movable plates. An electric push rod three that drives the corresponding movable plate to move is installed on the U-shaped plate.

[0016] The beneficial effects of this invention are as follows: (1) The feeding station of the present invention works in coordination with the L-shaped limiting plate. By adjusting the distance between the two sets of L-shaped limiting plates, it can be adapted to different specifications of chip substrates. When feeding, the chip substrate is guided to be positioned by the inclined surface at the end of the horizontal section of the limiting plate, so as to achieve the initial anti-deviation feeding. At the same time, by utilizing the difference in the distribution of the overflow glue on the front and back edges of the chip substrate, when the front side is facing up, the overflow glue contacts the limiting plate, causing the chip substrate to be lifted and forming a gap with the surface of the feeding seat. Conversely, when the back side is facing up, the front single-layer plate is attached to the sealing gasket of the feeding seat, which clarifies the state when the correct or incorrect placement is made, and serves as the basis for subsequent correct placement adsorption and fixation, and incorrect placement flipping correction. (2) The present invention automatically determines whether the chip substrate is correctly placed by combining the air path of the adsorption cavity and the air intake seat, combined with whether the chip substrate is attached to the sealing gasket of the feeding seat, and the infrared sensor synchronously detects the chip substrate. When the chip substrate is correctly placed (back side up), the substrate is attached to the sealing gasket so that the air path forms a sealed cavity. The negative pressure first drives the clamping plate one and clamping plate two to move relative to each other to clamp the substrate, and then achieves adsorption and fixation, avoiding the overflow of glue burning the sealing edge and the movement of the substrate during the debris suction process. Then, the fiber laser accurately completes the burning sealing of the overflowing glue at the edge, ensuring the accuracy of the burning sealing edge and the cleanliness of the substrate edge. (3) When the chip substrate of the present invention is incorrectly placed (face up), there is a gap between the substrate and the feeding seat. When the monitored negative pressure value is lower than the preset air pressure value, the controller triggers the flipping action of the sealing station. By driving the U-shaped plate to rise and fall, the two sets of H-shaped plates are pushed to flexibly clamp the substrate. Then the H-shaped plate is driven to flip so that the single-layer plate of the front side of the substrate is facing down and attached to the sealing gasket of the feeding seat. The correct placement after flipping is completed, and the adsorption fixation and overflow sealing process are carried out, realizing the full-process automated error correction processing. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings; Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a structural schematic diagram from another perspective of the present invention; Figure 3 This is a schematic diagram of the installation of the feeding component of the present invention; Figure 4 This is a schematic diagram of the interaction between the synchronous belt and the feeder of the present invention; Figure 5 This is a schematic diagram of the feeding base of the present invention; Figure 6 This is a schematic diagram showing the connection between clamping plate one and clamping plate two of the present invention; Figure 7 This is a schematic diagram of the cooperation between the feeding seat and clamping plate one and clamping plate two of the present invention; Figure 8 This is a schematic diagram of the structure of the suction seat of the present invention; Figure 9 This is a schematic diagram of the structure of the L-shaped limiting plate of the present invention; Figure 10 This is a schematic diagram of the structure of the horizontal pushing station of the present invention; Figure 11 This is a schematic diagram of the edge-sealing station of the present invention; Figure 12 This is a schematic diagram of the linkage of the movable plate of the present invention; Figure 13 This is a schematic diagram showing the interaction between the chip substrate of the present invention and the L-shaped limiting plate when the front and back sides are placed.

[0018] Legend: 1. U-shaped conveyor table; 11. Synchronous belt; 12. Fixing pin; 13. Control panel; 2. Feeding station; 21. L-shaped limiting plate; 22. Feeding seat; 23. Clamping plate one; 24. Clamping plate two; 25. Movable hole; 26. Adsorption chamber; 27. Connecting hole; 28. Suction seat; 29. ​​Air chamber; 210. Air pipe; 211. Piston chamber; 212. Piston block; 213. Movable plate; 214. Spring; 215. Screw; 216. Chip suction hopper; 3. Flat push station; 31. Fixed frame; 32. Electric push rod one; 33. Flat push plate; 34. Material placement frame; 35. Lead screw; 36. Lifting plate; 4. Edge sealing station; 41. X-axis electric slide table; 42. Support; 43. Y-axis electric slide table; 44. Electric push rod II; 45. U-shaped plate; 46. Moving plate; 47. H-shaped plate; 48. Guide wheel; 49. Connecting rope; 410. Electric push rod III. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0020] Example 1: Please refer to Figure 1 - Figure 11 and Figure 13 As shown, the existing positioning and fixing will simultaneously abut against the edge of the glue overflow. Due to the different thickness of the glue overflow at the edge, the main body of the chip substrate will shift to the glue overflow area with smaller thickness, resulting in poor precision of subsequent laser ablation edge sealing. The following solution can be used to solve this problem. In this embodiment, a multi-station laser edge sealing device for chip substrates based on a collaborative feeding structure includes a U-shaped conveyor 1 and an annular track located on the inner walls of both sides of the U-shaped conveyor 1. The annular track is used for multiple feeding seats 22 to slide stably horizontally. A feeding station 2 is set between the annular track for self-inspecting the chip substrate placement surface and adsorbing and fixing it. The U-shaped conveyor 1 is provided with a flat pushing station 3 for anti-deviation feeding of stacked chip substrates by the collaborative feeding station 2, and an edge sealing station 4 for flipping and correcting the chip substrate and removing excess glue. The feeding station 2 includes two sets of L-shaped limiting plates 21. The L-shaped limiting plate 21 is used to prevent the chip substrate from sliding off-center. The thickness of the lateral section of the L-shaped limiting plate 21 is less than the thickness of a single substrate. The lateral section of the L-shaped limiting plate 21 abuts against a single substrate to avoid uneven contact thickness and glue overflow causing the overall substrate to shift. There are also multiple equally spaced feeding seats 22. The clamping plates 23 and 24 are located on both sides of the feeding seats 22. The top of the clamping plates 23 and 24 is flush with the top of the lateral section of the L-shaped limiting plate 21, thereby simultaneously preventing contact with glue overflow at the edge of the substrate.

[0021] The U-shaped conveyor table 1 has symmetrical rotating rods on both sides, and synchronous pulleys are fixedly connected to the rotating rods. The two sets of synchronous pulleys are connected by a synchronous belt 11. The feeding seat 22 has a movable hole 25. The synchronous belt 11 is fixedly connected to a fixing pin 12 that is movably inserted into the corresponding movable hole 25. A servo motor is bolted to the U-shaped conveyor table 1 to drive the corresponding rotating rod to rotate. The servo motor drives the corresponding rotating rod to rotate, which in turn drives the synchronous belt 11 to rotate. Combined with the insertion of the fixing pin 12 into the corresponding movable hole 25, multiple feeding seats 22 are driven to move between two sets of circular tracks.

[0022] Two sets of rollers are rotatably installed on both sides of the feeding seat 22 to roll against the corresponding annular track, which is used to achieve smooth sliding of the feeding seat 22, and to slide and insert with the fixed pin 12 through the movable hole 25, so as to prevent the feeding seat 22 from moving from below the rotating rod to above, or from above to below, and to automatically adjust the distance between the local area of ​​the feeding seat 22 and the synchronous belt 11. The top of the feeding seat 22 is provided with an adsorption chamber 26, and the bottom of the adsorption chamber 26 is provided with a connecting hole 27. The inside of the U-shaped conveyor table 1 is equipped with an air suction seat 28 through a horizontal plate, and the top of the air suction seat 28 is provided with an air chamber 29. An air pipe 210 is fixedly connected to the air suction seat 28. The chip substrate is placed with its reverse side facing upwards, meaning the adhesive droplets overflowing from the edge of the chip substrate are facing upwards. The front single-layer plate of the chip substrate contacts the lateral sections of the L-shaped limiting plates 21 on both sides for initial limiting and conveying. The front single-layer plate also contacts the top of the feeding seat 22, which carries the chip substrate horizontally. An external negative pressure device is connected to the air pipe 210 to continuously extract gas from the air chamber 29 of the suction seat 28. When the feeding seat 22 moves to the top of the suction seat 28, the air chamber 29 communicates with the adsorption chamber 26 through the connecting hole 27, forming a negative pressure environment to adsorb and fix the reverse-placed chip substrate.

[0023] Both the top of the feeder 22 and the suction seat 28 are equipped with sealing gaskets. The bottom of the feeder 22 slides against the sealing gasket on the top of the suction seat 28. The sealing gasket on the top of the feeder 22 is used to increase the sealing between the chip substrate placed with its reverse side facing up and the feeder 22. The sealing gasket on the top of the suction seat 28 is used to move the feeder 22 to the top of the suction seat 28 to achieve a sealed connection between the two.

[0024] Piston chambers 211 are symmetrically opened on both sides of the adsorption chamber 26, and piston blocks 212 are slidably connected in both piston chambers 211. A movable plate 213 extending to the outside of the feeding seat 22 and carrying the movement of clamping plate 1 23 and clamping plate 24 is fixedly connected to the piston block 212. The chip substrate is placed on the reverse side of the top of the feeding seat 22. The front single-layer plate contacts the sealing gasket on the top of the feeding seat 22, thereby blocking the opening of the adsorption chamber 26. This causes the adsorption chamber 26, piston chamber 211, connecting hole 27 and gas chamber 29 to form a sealed cavity. The gas in the sealed cavity is reduced, which drives the two sets of piston blocks 212 to move relative to the corresponding movable plates 213. This causes the clamping plates 1 23 and 24 to move relative to each other to clamp the other two sides of the front single-layer plate of the chip substrate, thereby restricting the movement of the piston blocks 212. The sealed cavity forms a negative pressure environment, which adsorbs and fixes the chip substrate placed on the reverse side. Two sets of piston blocks 212 are fixedly connected to opposite sides with toothed plates. Gears that mesh with the two sets of toothed plates are rotatably installed in the adsorption cavity 26. Through the cooperation of the toothed plates and gears, the synchronous relative movement of clamping plate 1 23 and clamping plate 24 is realized, thereby realizing the secondary positioning process of the chip substrate. The toothed plates and gears are not shown in the figure.

[0025] An installation plate is fixedly connected inside the adsorption chamber 26 and between the piston blocks 212. A spring 214 is fixedly connected between the installation plate and the piston blocks 212. The feeding seat 22 moves horizontally and separates from the suction seat 28. The clamping plate 1 23 and clamping plate 24 are separated and reset under the compression force of the spring 214, automatically releasing the adsorption state on the chip substrate. A set of movable plates 213 has an installation groove on its top. A rotating block that is rotatably connected to the mounting groove is fixedly connected to the clamping plate 23. Torsion springs are installed between the two rotating points of the rotating block and the inner wall of the mounting groove. The clamping plate 24 is fixedly connected to another set of movable plates 213. When the chip substrate is horizontally fed from one side of the U-shaped conveyor table 1, during the process of the chip substrate moving to the top of the feeding seat 22, the chip substrate contacts the clamping plate 23 and causes it to deflect, so as to avoid interfering with the feeding process of the chip substrate.

[0026] The L-shaped limiting plate 21 is fixedly connected with multiple sliding rods that are slidably connected to the U-shaped conveyor table 1, and a screw 215 that is rotatably connected to the U-shaped conveyor table 1. According to the size between the two sides of the chip substrate, the screw 215 is rotated to push the L-shaped limiting plate 21 to move, so that the distance between the two sets of L-shaped limiting plates 21 is equal to the size between the two sides of the chip substrate, which is used to realize the anti-deviation conveying and initial positioning of the substrate. Infrared transmitters and infrared receivers are respectively installed on two sets of L-shaped limit plates 21. A chip suction hopper 216 is installed on the L-shaped limit plate 21. A gas pressure sensor is installed in the air chamber 29. A control panel 13 is fixedly installed on the U-shaped conveyor table 1. After the substrate is adsorbed and positioned, the internal negative pressure value is monitored in real time by the gas pressure sensor in the air chamber 29, and the monitored negative pressure value is transmitted to the controller in the control panel 13. When the monitored negative pressure value is equal to or greater than the preset air pressure value, the external negative pressure device is stopped. Then, the chip substrate is detected by the infrared transmitter and infrared receiver on the L-shaped limit plate 21, and the synchronous belt 11 is stopped from rotating, so as to perform laser ablation sealing of the excess glue on the edge of the substrate.

[0027] The flat push station 3 includes a fixed frame 31 fixedly installed on one side of the U-shaped conveyor table 1, and a flat push plate 33 is installed on the top of the fixed frame 31 through an electric push rod 32. A material placement frame 34 is detachably installed on the fixed frame 31. Multiple insertion holes are opened on the fixed frame 31, and multiple insertion rods are installed at the bottom of the material placement frame 34. The insertion holes and corresponding insertion rods are used to achieve the positioning and installation of the material placement frame 34. The insertion holes and insertion rods are not shown in the figure. A lead screw 35 is rotatably connected to the fixed frame 31, and a lifting plate 36 is slidably connected to the lead screw 35 and threadedly connected to it. A servo motor 2 that drives the lead screw 35 to rotate is installed on the fixed frame 31. The placement frame 34 containing stacked chip substrates is installed on the fixing frame 31. After the feed seat 22 moves from below the rotating rod to above it, the synchronous belt 11 stops rotating intermittently. The electric push rod 32 pushes the flat push plate 33 to move, thereby pushing the chip substrate at the top to move horizontally to the top of the corresponding feed seat 22, until the chip substrate is located between the clamping plate 23 and the clamping plate 24. The electric push rod 32 drives the flat push plate 33 to reset. The clamping plate 23 is reset synchronously under the torsional elastic force of the torsion spring, and the chip substrate is placed between the clamping plate 23 and the clamping plate 24. After each loading is completed, the servo motor drives the lead screw 35 to rotate, and the lead screw 35 drives the lifting plate 36 to rise once, causing the stacked chip substrate to move up by the thickness of one chip substrate. Combined with the intermittent rotation of the synchronous belt 11 and the reciprocating motion of the electric push rod 32 pushing the flat plate 33, the anti-deviation loading of multiple chip substrates is completed.

[0028] The edge sealing station 4 includes an X-axis electric slide 41 fixedly installed on the outer wall of the U-shaped conveyor table 1. A Y-axis electric slide 43 and an electric push rod 44 are installed on the slide of the X-axis electric slide 41 via a bracket 42. A fiber laser is installed on the slide of the Y-axis electric slide 43. The controller controls the operation of the X-axis electric slide 41 and the Y-axis electric slide 43, driving the fiber laser to move in multiple directions on the horizontal plane. The fiber laser ablates and seals the excess glue on the edge of the chip substrate. External dust collection equipment is connected to the dust collection hopper 216 to remove the fumes and debris produced during the ablation process, thus completing the excess glue ablation and edge sealing.

[0029] Example 2: Please refer to Figure 9 and Figure 11 - Figure 13As shown, the problem that the chip substrate cannot be adsorbed and fixed when the downward-facing adhesive droplet contacts the L-shaped limiting plate when the chip substrate is placed face down can be solved by the following solution; In this embodiment, the L-shaped limiting plate 21 is fixedly connected with a plurality of sliding rods that are slidably connected to the U-shaped conveyor table 1, and a screw 215 that is rotatably connected to the U-shaped conveyor table 1. The L-shaped limiting plate 21 has an inclined surface one at one end of the transverse section of the flat push station 3, and an inclined surface two is opened at the top corner of the inclined surface one. When the chip substrate is placed with its reverse side facing up, and the front single-layer board of the chip substrate is pushed and fed, the inclined surface of the horizontal section of the L-shaped limiting plate 21 on both sides contacts the edge of the front single-layer board, causing the chip substrate to automatically be positioned between the L-shaped limiting plates 21 to complete the initial positioning. Because the overflowing molding adhesive droplets face upwards, they do not contact the edge of the front single-layer board, thus causing the horizontal section of the L-shaped limiting plate 21 to not contact the adhesive droplets. When the chip substrate is placed with its reverse side facing up, it is carried horizontally by the feeding seat 22. When the chip substrate is placed with its front side facing up and the single-layer board on the back side of the chip substrate is pushed and fed, the chip substrate is automatically positioned between the L-shaped limiting plates 21 by contacting the edge of the single-layer board on the back side through the inclined surface of the horizontal section of the L-shaped limiting plates 21. Furthermore, because the overflowing molding droplets face downwards, they contact the droplets through the inclined surface two. With the help of the L-shaped limiting plate 21, the chip substrate is lifted by the droplets, causing the reverse single-layer plate to not contact the sealing gasket at the top of the feed seat 22. There is a gap between the two, making it impossible to complete the adsorption and secondary positioning fixation. The front of the chip substrate faces upwards, and the clamping plate 23 abuts against the edge of the reverse single-layer plate of the chip substrate, pushing the chip substrate to move horizontally on the L-shaped limiting plate 21.

[0030] The edge sealing station 4 includes an X-axis electric slide 41 fixedly installed on the outer wall of the U-shaped conveyor table 1. A Y-axis electric slide 43 and an electric push rod 44 are installed on the slide of the X-axis electric slide 41 via a bracket 42. A fiber laser is installed on the slide of the Y-axis electric slide 43. The chip substrate is placed face up on the top of the feeding seat 22. The single-layer plate on the back does not contact the sealing gasket on the top of the feeding seat 22 and does not block the opening of the adsorption chamber 26, so adsorption and fixation cannot be completed. The monitored negative pressure value is always less than the preset air pressure value. When the infrared transmitter and infrared receiver on the L-shaped limit plate 21 detect the chip substrate, the synchronous belt 11 stops rotating. The controller controls the X-axis electric slide 41 to run, carrying the U-shaped plate 45 to the top of the chip substrate.

[0031] A U-shaped plate 45 is installed on the piston rod of the electric push rod 44. A vertical rod that is slidably connected to the bracket 42 is installed on the U-shaped plate 45. Moving plates 46 are slidably connected to both sides of the U-shaped plate 45. An H-shaped plate 47 is installed on the moving plate 46 via a servo motor 3. A guide wheel 48 is rotatably connected to the top of the U-shaped plate 45. A connecting rope 49 guided by the guide wheel 48 is fixedly connected between the two sets of moving plates 46. An electric push rod 3 410 that drives the corresponding moving plate 46 to move is installed on the U-shaped plate 45. Electric push rod 44 pushes the U-shaped plate 45 down, and electric push rod 410 pushes the corresponding moving plate 46 to move. During this process, the connecting rope 49 is pulled. Combined with the guide wheel 48 guiding the connecting rope 49, the other set of moving plates 46 are pulled to move relative to each other, so that the two sets of H-shaped plates 47 clamp the chip substrate. With the slight tensile elasticity of the connecting rope 49 itself, the chip substrate is flexibly clamped, avoiding excessive clamping of the adhesive droplets, which would reduce the thickness and increase the area. As a result, after flipping and placing, the adhesive droplets will contact the L-shaped limiting plate 21 and cannot be adsorbed and fixed. Electric push rod 44 pushes U-shaped plate 45 upward, servo motor 3 drives H-shaped plate 47 to deflect the chip substrate by 180°, completing the flipping of the chip substrate. Then electric push rod 44 pushes U-shaped plate 45 downward again, completing the placement of the flipped chip substrate with the front single-layer plate facing down, sealing the opening of the suction cavity 26 at the top of the feed seat 22, and combining the operation of X-axis electric slide 41 and Y-axis electric slide 43 to complete the edge overflow adhesive burning and sealing treatment.

[0032] Example 3: Please refer to Figure 1 - Figure 13 As shown, the present invention also proposes a method for using a multi-station laser edge-sealing equipment for chip substrates based on a collaborative feeding structure, including the following steps: Step 1: The placement frame 34 containing the stacked chip substrates is installed on the fixing frame 31. Based on the dimensions between the two sides of the chip substrate, the screw 215 is rotated to push the L-shaped limiting plate 21 to move, so that the distance between the two sets of L-shaped limiting plates 21 is equal to the dimensions between the two sides of the chip substrate. The servo motor drives the corresponding rotating rod to rotate, which in turn drives the synchronous belt 11 to rotate. Combined with the insertion of the fixing pin 12 and the corresponding movable hole 25, multiple feed seats 22 are driven to move between the two sets of circular tracks. After the feed seat 22 moves from below the rotating rod to above it, the synchronous belt 11 stops rotating intermittently. The electric push rod 32 pushes the flat push plate 33 to move, which in turn pushes the chip substrate at the top to move horizontally to the top of the corresponding feed seat 22. Step 2: During the process of moving the chip substrate to the top of the feeder 22, if the back of the chip substrate is facing up, that is, when the glue droplets overflowing from the edge of the chip substrate are facing up, the chip substrate first contacts the clamping plate 23 and causes it to deflect, without interfering with the feeding process of the chip substrate. Then, the front single-layer plate of the chip substrate contacts the transverse sections of the L-shaped limiting plates 21 on both sides. The inclined surface at the end of the transverse section of the L-shaped limiting plate 21 contacts the edge of the front single-layer plate and does not contact the glue droplets, so that the chip substrate is between the L-shaped limiting plates 21 and the front single-layer plate contacts the sealing gasket at the top of the feeder 22. If the front side of the chip substrate is facing up, that is, when the glue droplets overflowing from the edge of the chip substrate are facing down, the inclined surface of the horizontal section end of the L-shaped limiting plate 21 contacts the edge of the reverse single-layer plate at the same time as the glue droplets. The L-shaped limiting plate 21 lifts the chip substrate in conjunction with the glue droplets, and the reverse single-layer plate does not contact the sealing gasket at the top of the feed seat 22. There is a gap between the two until the chip substrate is located between the clamping plate 1 23 and the clamping plate 24. The electric push rod 1 32 drives the flat push plate 33 to reset. The clamping plate 1 23 is reset synchronously under the torsional elastic force of the torsion spring, and the chip substrate is placed between the clamping plate 1 23 and the clamping plate 24. Step 3: If the chip substrate is facing up, it is carried horizontally by the feeder 22. If the chip substrate is facing up, it is pushed horizontally on the L-shaped limit plate 21 by the clamping plate 23 against the edge of the single-layer board on the back of the chip substrate. After each feeding is completed, the servo motor 2 drives the lead screw 35 to rotate. The lead screw 35 drives the lifting plate 36 to rise once, causing the stacked chip substrates to move up by the thickness of one chip substrate. Combined with the intermittent rotation of the synchronous belt 11 and the reciprocating motion of the electric push rod 32 pushing the flat push plate 33, the anti-deviation feeding of multiple chip substrates is completed. Step 4: The external negative pressure device is connected to the air pipe 210 to continuously extract the gas inside the air chamber 29 of the suction seat 28. When the feeding seat 22 moves to the top of the suction seat 28, the air chamber 29 communicates with the adsorption chamber 26 through the connecting hole 27. If the chip substrate on the top of the feeding seat 22 is placed on the reverse side, the front single-layer plate contacts the sealing gasket on the top of the feeding seat 22, thereby blocking the opening of the adsorption chamber 26. This causes the adsorption chamber 26, piston chamber 211, connecting hole 27 and air chamber 29 to form a sealed cavity. The gas in the sealed cavity is reduced, which drives the two sets of piston blocks 212 to move relative to the corresponding movable plates 213. This causes the clamping plates 1 23 and 24 to move relative to each other to clamp the other two sides of the front single-layer plate of the chip substrate, thereby restricting the movement of the piston blocks 212. The sealed cavity forms a negative pressure environment to adsorb and fix the chip substrate placed on the reverse side. The internal negative pressure value is monitored in real time by the gas pressure sensor in the air chamber 29, and the monitored negative pressure value is transmitted to the controller in the control panel 13. When the monitored negative pressure value is equal to or greater than the preset air pressure value, the external negative pressure device is stopped. Then, the chip substrate is detected by the infrared transmitter and infrared receiver on the L-shaped limit plate 21, and the rotation of the synchronous belt 11 is stopped. The controller controls the operation of the X-axis electric slide 41 and the Y-axis electric slide 43, which drive the fiber laser to move in multiple directions on the horizontal plane. The fiber laser ablates and seals the edge of the chip substrate with excess glue. The external dust collection equipment is connected to the dust collection hopper 216 to suck away the fumes and debris produced during the ablation process. After the excess glue ablation and sealing are completed, the synchronous belt 11 rotates, the suction seat 28 separates from the corresponding feeding seat 22, and the clamping plate 1 23 and clamping plate 24 are separated and reset under the compression force of the spring 214, and the adsorption state on the chip substrate is released. Step 5: If the chip substrate on the top of the feeding seat 22 is placed face up and the single-layer plate on the back does not contact the sealing gasket on the top of the feeding seat 22, the opening of the adsorption chamber 26 is not blocked, and adsorption and fixation cannot be completed. The monitoring negative pressure value is always less than the preset air pressure value, and the infrared transmitter and infrared receiver on the L-shaped limit plate 21 detect the chip substrate, stop the synchronous belt 11 from rotating, and the controller controls the X-axis electric slide 41 to run, carrying the U-shaped plate 45 to the top of the chip substrate. The electric push rod 2 44 pushes the U-shaped plate 45 down, and the electric push rod 3 410 pushes the corresponding moving plate 46 to move. During this process, the connecting rope 49 is pulled, and combined with the guide wheel 48 guiding the connecting rope 49, the other set of moving plates 46 are pulled to move relative to each other, so that the two sets of H-shaped plates 47 clamp the chip substrate. With the help of the slight tensile elasticity of the connecting rope 49 itself, the chip substrate is flexibly clamped. Step Six: Electric push rod 2 44 pushes U-shaped plate 45 upward, servo motor 3 drives H-shaped plate 47 to deflect the chip substrate 180°, completing the flipping of the chip substrate. Then electric push rod 2 44 pushes U-shaped plate 45 downward again, completing the placement of the flipped chip substrate with the front single-layer plate facing down, sealing the opening of the suction cavity 26 at the top of the feeding seat 22, and combining the operation of X-axis electric slide 41 and Y-axis electric slide 43 to complete the edge overflow adhesive burning and sealing treatment.

[0033] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multi-station laser edge sealing device for chip substrates based on a collaborative feeding structure, comprising a U-shaped conveyor table (1) and an annular track located on both sides of the inner wall of the U-shaped conveyor table (1), characterized in that, Between the circular tracks, there is a feeding station (2) for self-testing the chip substrate placement surface and adsorbing and fixing it. The U-shaped conveyor (1) is provided with a collaborative feeding station (2) for pushing the stacked chip substrate to prevent it from deviating, and an edge sealing station (4) for flipping and correcting the chip substrate and removing excess glue. The feeding station (2) includes two sets of L-shaped limiting plates (21) and multiple feeding seats (22) with equal spacing. There are clamping plates one (23) and clamping plates two (24) on both sides of the feeding seats (22).

2. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 1, characterized in that, The U-shaped conveyor table (1) has rotating rods symmetrically connected to both sides, and synchronous pulleys are fixedly connected to the rotating rods. The two sets of synchronous pulleys are connected by a synchronous belt (11). The feeding seat (22) has a movable hole (25). The synchronous belt (11) is fixedly connected to a fixing pin (12) that is movably inserted into the corresponding movable hole (25). The U-shaped conveyor table (1) is equipped with a servo motor that drives the corresponding rotating rod to rotate by bolts.

3. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 1, characterized in that, Two sets of rollers that roll against the corresponding annular track are rotatably installed on both sides of the feeding seat (22). An adsorption chamber (26) is opened on the top of the feeding seat (22), and a connecting hole (27) is opened through the bottom of the adsorption chamber (26). An air suction seat (28) is installed inside the U-shaped conveyor table (1) through a horizontal plate, and an air chamber (29) is opened on the top of the air suction seat (28). An air pipe (210) is fixedly connected to the air suction seat (28).

4. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 3, characterized in that, Both the top of the feeding seat (22) and the suction seat (28) are equipped with sealing gaskets, and the bottom of the feeding seat (22) slides against the sealing gasket on the top of the suction seat (28).

5. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 3, characterized in that, Piston chambers (211) are symmetrically opened on both sides of the adsorption chamber (26), and piston blocks (212) are sealed and slidably connected in both piston chambers (211). A movable plate (213) extending to the outside of the feeding seat (22) and carrying the movement of clamping plate one (23) and clamping plate two (24) is fixedly connected to the piston block (212).

6. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 5, characterized in that, An installation plate is fixedly connected inside the adsorption chamber (26) and between the piston blocks (212). A spring (214) is fixedly connected between the installation plate and the piston blocks (212). An installation groove is provided on the top of a set of movable plates (213). A rotating block that is rotatably connected to the installation groove is fixedly connected to the clamping plate (23). Torsion springs are installed between the two rotating points on both sides of the rotating block and the inner wall of the installation groove. The clamping plate (24) is fixedly connected to another set of movable plates (213).

7. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 3, characterized in that, The L-shaped limiting plate (21) is fixedly connected with multiple sliding rods that are slidably connected to the U-shaped conveyor table (1), and a screw (215) that is rotatably connected to the U-shaped conveyor table (1) by a thread. Infrared transmitters and infrared receivers are respectively installed on the two sets of L-shaped limiting plates (21). A chip suction hopper (216) is installed on the L-shaped limiting plate (21). A gas pressure sensor is installed in the air chamber (29). A control panel (13) is fixedly installed on the U-shaped conveyor table (1).

8. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 1, characterized in that, The flat push station (3) includes a fixed frame (31) fixedly installed on one side of the U-shaped conveyor table (1), and a flat push plate (33) is installed on the top of the fixed frame (31) via an electric push rod (32). A material placement frame (34) is detachably installed on the fixed frame (31). A lead screw (35) is rotatably connected to the fixed frame (31), and a lifting plate (36) is slidably connected to the lead screw (35) and threadedly connected to it. A servo motor (2) that drives the lead screw (35) to rotate is installed on the fixed frame (31).

9. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 1, characterized in that, The edge sealing station (4) includes an X-axis electric slide (41) fixedly installed on the outer wall of the U-shaped conveyor (1). A Y-axis electric slide (43) and an electric push rod (44) are installed on the slide of the X-axis electric slide (41) via a bracket (42). A fiber laser is installed on the slide of the Y-axis electric slide (43).

10. The multi-station laser edge sealing equipment for chip substrates based on a collaborative feeding structure according to claim 9, characterized in that, A U-shaped plate (45) is installed on the piston rod of the electric push rod two (44), and a movable plate (46) is slidably connected to both sides of the U-shaped plate (45). An H-shaped plate (47) is installed on the movable plate (46) via a servo motor three. A guide wheel (48) is rotatably connected to the top of the U-shaped plate (45). A connecting rope (49) guided by the guide wheel (48) is fixedly connected between the two sets of movable plates (46). An electric push rod three (410) is installed on the U-shaped plate (45) to drive the corresponding movable plate (46) to move.

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