Polishing pad particle control device and method for high-precision mask substrate polishing
By integrating a flexible polishing head assembly and a multi-degree-of-freedom drive mechanism into a polishing pad particle control device, the problem of separating polishing pad cleaning and shaping is solved, achieving efficient and precise particle control and improving the processing quality and efficiency of high-precision mask substrates.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-29
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, the cleaning and shaping functions of polishing pads are separated, resulting in incomplete cleaning, easy damage to the polishing pads during shaping, low equipment integration, and a lack of accurate detection, which affects the processing quality and efficiency of high-precision mask substrates.
By integrating a flexible polishing head assembly, a multi-degree-of-freedom drive mechanism, a precision detection module, and an air circuit protection system, the system achieves efficient cleaning, precise shaping, and comprehensive control of particle residue on the polishing pad. Through the cooperation of the flexible polishing head assembly and the multi-degree-of-freedom drive mechanism, combined with the air circuit system and the detection module, the system enables automated operation and precise pressure control.
It improves the integration of polishing pads, enhances flexibility and adaptability, thoroughly removes particle residues, avoids damage, improves processing accuracy and efficiency, and adapts to the processing needs of substrates of different specifications.
Smart Images

Figure CN121756239A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the fields of precision optical processing and semiconductor manufacturing technology, specifically a polishing pad particle control device and method for high-precision mask substrate polishing, which is particularly suitable for mask substrate polishing processes with extremely high requirements for surface flatness and cleanliness. Background Technology
[0002] High-precision mask substrates are core components in semiconductor manufacturing, optical imaging, and other fields, requiring extremely high flatness and cleanliness of the polished surface. During the polishing process, the surface condition of the polishing pad directly determines the processing accuracy of the substrate, while particle residue and polishing pad wear and deformation are key issues affecting processing quality.
[0003] In existing technologies, the cleaning and shaping functions of polishing pads are usually independent, which has the following shortcomings: First, cleaning devices mostly use a fixed rinsing method, which cannot flexibly adjust the cleaning angle and range according to the surface condition of the polishing pad, resulting in incomplete removal of particle residues; second, shaping devices are mostly rigid structures, which are prone to hard contact with the polishing pad during the shaping process, causing damage to the polishing pad, and the shaping method is limited and difficult to adapt to the processing requirements of substrates of different sizes; third, switching between cleaning and shaping devices is cumbersome, external pipelines are exposed, the equipment integration is low, it occupies a large space, and new contamination can be easily introduced during the switching process; fourth, there is a lack of precise detection of the contact state between the polishing pad and the polishing head, which can easily cause damage to the substrate or polishing pad due to improper pressure control. These problems seriously affect the processing efficiency and finished product quality of high-precision mask substrates, and there is an urgent need for an integrated, flexible, and high-precision particle control device to solve them. Summary of the Invention
[0004] This invention addresses the problems of separation of polishing pad cleaning and shaping functions, incomplete particle control, and low automation in existing technologies. It provides a polishing pad particle control device and method for high-precision mask substrate polishing. By integrating a flexible polishing head assembly, a multi-degree-of-freedom drive mechanism, a precision detection module, and an air path protection system, it achieves efficient cleaning, precise shaping, and comprehensive control of particle residue on the polishing pad, ensuring high-precision polishing of the mask substrate.
[0005] Technical solution of the present invention On one hand, the present invention provides a polishing pad particle control device for high-precision mask substrate polishing, characterized in that it includes: The mounting bracket is a hollow frame structure with an internal wiring cavity and external reinforcing ribs. The wiring cavity is used to integrate and arrange pipes and cables. A flexible projectile assembly, movably connected to the lower part of the mounting bracket, includes: - The airbag-type flexible projectile head mounting base is installed inside the projectile head fixing base, and its interior is equipped with an air-filled chamber; - Replaceable functional head, which is detachably connected to the bottom working end of the airbag flexible blasting head mounting base via a quick-change structure, for performing cleaning or shaping operations; - The projectile mounting base is fixedly connected to the output end of the multi-degree-of-freedom drive mechanism, serving as the mounting base and power input interface for the entire flexible projectile assembly 2.
[0006] When the air system fills the inflation chamber with gas, the airbag expands and drives the bottom working surface of the replaceable functional head to press against the polishing pad surface; when the air system discharges gas from it, the airbag contracts and lifts the replaceable functional head away from the polishing pad surface. A multi-degree-of-freedom drive mechanism is mounted on the mounting bracket, and its output end is connected to the polishing head mounting base to drive the flexible polishing head assembly to perform rotational motion about its own axis and / or oscillating motion in a plane parallel to the surface of the polishing pad. The detection module includes a distance sensor located under the polishing head mounting base for detecting the distance or contact state between the working end of the replaceable functional head and the surface of the polishing pad, a conveyor belt status sensor for monitoring whether the synchronous belt of the rotary drive unit 31 is broken or severely slipping, and a swing arm angle positioning sensor for monitoring whether the swing arm angle is in place. The gas system has its pipeline passing through the wiring cavity of the mounting bracket and communicating with the inflation chamber of the replaceable functional head. It is used to adjust the shape and downforce of the replaceable functional head by filling or venting gas into the inflation chamber. The control unit is located inside the host computer and is electrically connected to the multi-degree-of-freedom drive mechanism, the detection module, and the pneumatic system. Based on the gap signal between the working end of the replaceable functional head and the surface of the polishing pad detected in real time by the distance sensor, the control unit controls the inflation / deflation operation of the pneumatic system on the inflation chamber to adjust the deformation degree of the airbag-type flexible polishing head, thereby indirectly controlling the downward pressure and adhesion state of the replaceable functional head on the polishing pad.
[0007] Furthermore, the airbag-type flexible polishing head mounting base is configured such that when the pressure inside its inflation chamber changes, the working surface at its bottom can produce adaptive multi-degree-of-freedom deformation, so as to achieve surface contact and avoid rigid damage when the replaceable functional head contacts the polishing pad surface.
[0008] Furthermore, the replaceable functional head includes at least one of a cleaning brush head and a sub-diameter shaping head; wherein, the quick-change structure is a threaded quick-change structure, which enables the replaceable functional head to be quickly installed, removed, and precisely positioned on the airbag-type flexible blasting head.
[0009] Furthermore, the multi-degree-of-freedom drive mechanism includes: a rotary drive unit for driving the flexible projectile assembly to rotate around its own axis; and a swing drive unit for driving the flexible projectile assembly to swing; wherein, the swing drive unit includes a hollow reducer, and the hollow reducer integrates an angle positioning module for precise control and limitation of the swing angle; the outputs of the rotary drive unit and the swing drive unit are transmitted to the airbag-type flexible projectile mounting base after being combined through the hollow reducer.
[0010] Furthermore, the mounting bracket is a hollow frame structure with reinforcing ribs; the drive motor of the rotary drive unit is fixed to the top of the mounting bracket, and its power is transmitted to a vertically arranged rotating shaft via a reducer and a synchronous belt; the drive motor of the swing drive unit is mounted on the side of the rotating shaft, and its power is transmitted to the hollow reducer via a transmission gear set; the rotating shaft is hollow inside, allowing the pipelines of the air circuit system generating components to pass through.
[0011] Furthermore, the distance sensor is an inductive proximity sensor, and its probe is pointed at the upper surface of the working end of the replaceable functional head at a perpendicular incident angle.
[0012] On the other hand, the present invention also provides a method for polishing pad treatment using the above-mentioned polishing pad particle control device, characterized in that it includes the following steps: According to the target operation type, the corresponding replaceable functional head is installed onto the airbag-type flexible throwing head through the quick-change structure; The operation parameters are set by the host computer, and the operation parameters include at least the rotation speed, swing angle and frequency, airbag target pressure and operation time. The host computer controls the multi-degree-of-freedom drive mechanism to move the flexible polishing head assembly, which is equipped with the replaceable functional head, to the target area of the polishing pad; The host computer controls the air circuit system to inflate the air chamber, causing the airbag-type flexible polishing head mounting seat to expand and press down until the replaceable functional head adheres to the surface of the polishing pad at the set target pressure. The detection module provides real-time feedback of the pressure value and the host computer performs closed-loop adjustment. The host computer activates the multi-degree-of-freedom drive mechanism to drive the flexible throwing head assembly to perform operations according to the set motion mode; during cleaning operations, nitrogen protection is activated simultaneously, and cleaning fluid is applied to the work area; during shaping operations, the corresponding swing angle is set according to the size of the shaping area. Once the set operation time or target is reached, the host computer controls the air circuit system to stop supplying air and start vacuuming, causing the replaceable functional head to retract and lift. Then, the host computer controls the multi-degree-of-freedom drive mechanism to move the flexible throwing head assembly back to its initial position.
[0013] Furthermore, by replacing different replaceable functional heads and adjusting operating parameters, particle cleaning and local sub-diameter shaping operations of the polishing pad can be achieved on the same device; in the sub-diameter shaping operation, the swing angle is set to match the size of the local wear area of the polishing pad.
[0014] Due to the adoption of the above technical solution, the beneficial effects of the present invention are: High degree of integration: The polishing pad cleaning and shaping functions are integrated into one unit. The internal piping design reduces the exposure of external pipes, reduces the space occupied by the equipment, and improves the aesthetics and practicality of the equipment. High flexibility and adaptability: The airbag-type flexible polishing head has multi-directional degree of freedom adjustment capability, which can adapt to the surface angle of the polishing pad. Combined with precise pressure control, it avoids damage to the polishing pad or substrate caused by hard contact and ensures processing accuracy. Thorough particle control: The cleaning process employs a combined brushing and rinsing method, along with nitrogen protection, to thoroughly remove particle residues from the surface of the polishing pad and inside the device, while preventing contamination from seeping into the dressing arm and improving the cleanliness of the processing environment. Automated operation: Through the coordinated action of the detection module and the control unit, the positioning, pressure regulation and motion control of the blasting head are automated, replacing manual operation, reducing the risk of human error and improving processing efficiency; Excellent functional expandability: The replaceable functional head design can adapt to various needs such as cleaning and sub-aperture shaping without replacing the entire device, and can be adapted to polishing of high-precision mask substrates of different specifications. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the mounting bracket in this invention; Figure 2 This is a schematic diagram of the flexible slingshot head in this invention; Figure 3 This is a schematic diagram of the multi-degree-of-freedom drive mechanism in this invention; Figure 4 This is a schematic diagram of the detection module in this invention; Figure 5 This is a schematic diagram of the gas path system in this invention; Figure 6 This is a schematic diagram of an embodiment of the polishing pad particle control device for high-precision mask substrate polishing of the present invention; In the diagram: 1 - Mounting bracket; 2-Flexible projectile assembly, 21-Airbag-type flexible projectile mounting base, 22-Replaceable functional head, 23-Projectile fixing base; 3-Multi-degree-of-freedom drive mechanism, 31-Rotary drive unit, 32-Oscillating drive unit, 33-Rotary shaft, 34-Hollow reducer; 4-Detection module, 41-Distance sensor, 42-Conveyor belt status sensor, 43-Swing arm angle positioning sensor. Detailed Implementation
[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0017] The polishing pad particle control device of the present invention, such as Figure 6 As shown, the assembly includes a mounting bracket 1, a flexible polishing head assembly 2, a multi-degree-of-freedom drive mechanism 3, a detection module 4, and an air and liquid circuit system 5. These components work together to achieve the particle control function of the polishing pad. The specific structure is as follows: like Figure 1 As shown, mounting bracket 1 has a hollow structure with pre-reserved air and electrical channels inside for integrating the piping and electrical cables of the air system 5. Reinforcing ribs are provided on the surface of the bracket to enhance the overall structural strength and stability. Mounting bracket 1 is typically fixed to the polishing machine's worktable or independent moving slide via mounting holes at its bottom, providing stable support and precise positioning reference for all components above it.
[0018] like Figure 2 As shown, the flexible polishing head assembly 2 is movably connected to the lower part of the mounting bracket 1 for cleaning, brushing, or reshaping the polishing pad, including: The airbag-type flexible polishing head 21 is mounted on the polishing head fixing seat 23 via a connecting flange. It has an internal inflation chamber, which can be pressurized or evacuated via an air system to adjust the polishing head height and contact pressure. The airbag-type flexible polishing head is made of highly elastic and wear-resistant material, possessing multi-directional adjustment capabilities. It can adapt to the surface angle of the polishing pad, avoiding damage caused by hard contact.
[0019] The replaceable functional head 22 includes a flexible polishing head, a cleaning brush head, and a sub-diameter shaping head, and can be quickly disassembled and assembled through a quick-change structure and an airbag-type flexible polishing head mounting base 21 to adapt to different processing needs. The top of the projectile mounting base 23 is fixedly connected to the output end of the multi-degree-of-freedom drive mechanism 3, serving as the mounting base and power input interface for the entire flexible projectile assembly 2.
[0020] like Figure 3 As shown, the multi-degree-of-freedom drive mechanism 3 is mounted on the mounting bracket 1, and its output end drives the flexible polishing head assembly 2 to perform rotational motion about its own axis and / or oscillating motion in a plane parallel to the surface of the polishing pad; specifically including: The rotary drive unit 31 drives the flexible polishing head assembly 2 to rotate around its own axis. It consists of a rotary drive motor, a reducer, a gear set, and a synchronous belt. The rotary drive motor is fixed to the upper part of the mounting bracket. The motor output power is transmitted through the reducer, gear set, and synchronous belt, thereby driving the flexible polishing head assembly to rotate, adapting to the surface requirements of the polishing pad to achieve circumferential brushing or shaping.
[0021] The swing drive unit 32 is used to drive the flexible polishing head assembly 2 to swing. It consists of a swing motor, a transmission gear set and a hollow reducer. The swing motor is installed on one side of the rotating shaft 33. The power is transmitted to the hollow reducer through the transmission gear set. The output end of the reducer drives the entire polishing head assembly to swing on the polishing pad surface. The hollow reducer 34 has its outer shell connected to the fixed bracket. The input shaft is connected to the swing motor via a spur gear. The rotating shaft 33 passes through the middle of the hollow reducer. After receiving power from the rotating motor through the gear at the lower end, it drives the drive wheel connected at the upper end and transmits the power to the polishing head through a synchronous belt. Its built-in angle positioning module typically uses a high-precision encoder to detect and feedback the swing angle of the output shaft for precise control and limit, ensuring that the range of motion is fully adapted to the polishing pad area.
[0022] The rotating shaft 33 has through holes machined inside, and the hollow reducer 34 also has corresponding channels inside. This allows the pipeline of the air circuit system 5 to pass through the wiring cavity of the mounting bracket 1 from top to bottom through the rotating shaft 33 and the hollow reducer 34, and finally connect to the flexible throwing head 22, realizing the "coaxial" integration of power transmission and media transportation, greatly reducing external wiring and improving reliability.
[0023] like Figure 4 As shown, the detection module 4 includes a distance sensor 41, a conveyor belt status sensor 42, and a swing arm angle positioning sensor 43. The distance sensor 41 is mounted on the lower surface of the throwing head mounting base 23, with its probe pointing at a certain tilt angle (vertically downwards) towards the upper surface of the throwing head or a small area directly below it. It is used for non-contact detection of the gap between the bottom surface of the functional head and the throwing head below. When the gap decreases to a set threshold, the distance sensor 41 changes state, and the signal is fed back to the control system to determine the contact state and as indirect feedback for closed-loop air pressure regulation, thus replacing the easily contaminated and worn direct contact pressure sensor. The conveyor belt status sensor 42, in this embodiment, uses a photoelectric sensor or a microswitch to monitor whether the synchronous belt of the rotary drive unit 31 has broken or severely slipped, ensuring reliable rotational power. The swing arm angle positioning sensor 43, in this embodiment, uses a photoelectric through-beam or Hall effect sensor, set near the extreme position of the swing, serving as a redundant check or hardware limit for the internal angle encoder of the hollow reducer 34, providing double protection for swing safety.
[0024] The air system 5, with its tubing passing through the wiring cavity of the mounting bracket 1 and communicating with the inflation chamber of the airbag-type flexible throwing head mounting base 21, is used to adjust the shape and downward pressure of the airbag-type flexible throwing head mounting base 21 by filling or discharging gas into the inflation chamber. Figure 5 As shown.
[0025] The gas system includes a nitrogen storage tank, an inflation pipe, an exhaust pipe, and a solenoid valve. One end of the inflation pipe is connected to the nitrogen storage tank, and the other end passes through the mounting bracket and connects to the inflation chamber of the airbag-type flexible throwing head mounting base. It is used to inflate the airbag with gas to achieve pressurization or vacuuming, and at the same time, to flush in nitrogen to prevent cleaning fluid from seeping into the trimming arm. The solenoid valve is installed on the inflation pipe and its switch and flow rate are controlled by the control unit.
[0026] Example 1: Polishing Particle Cleaning Operation 1) Device installation and preparation: Fix the device of the present invention to one side of the working platform of the polishing equipment using the mounting bracket, and connect it to the air circuit system; 2) Functional head replacement: Select the cleaning brush head as the replaceable functional head, and install it under the airbag flexible shredder head through the quick-change structure to ensure a secure connection; 3) Parameter settings: Set cleaning parameters on the touch screen of the host computer, including the rotation speed of the rotary motor, the swing angle and swing frequency of the swing motor, the airbag pressurization pressure, and the cleaning time. 4) Cleaning operation execution: The device is activated, and the swing motor drives the swing arm to swing above the polishing pad. The distance sensor detects the signal, and the polishing head is in the raised state. The rotary motor starts, driving the cleaning brush head to rotate at a set speed, while the swing motor drives the swing arm to swing back and forth within a set range. The solenoid valve of the air circuit system opens, filling the replaceable flexible polishing head with gas. The pressure sensor monitors the pressure in real time and provides feedback. The control unit adjusts the air volume and maintains the pressure. The polishing head is pressed down to fit the polishing pad. 5) End of work and inspection: After the cleaning time is up, the airbag is depressurized, the air circuit system is evacuated, the blast head is raised, and the distance sensor resumes signal; the swing motor drives the swing arm to reset, and the rotary motor stops.
[0027] Example 2: Sub-caliber repair operation 1) Trimming head installation: Install the sub-diameter trimming head below the replaceable flexible blasting head via a quick-change structure; 2) Parameter settings: Set the rotation speed of the rotary motor, the swing angle of the swing motor (to match the size of the wear area), the airbag pressurization pressure, and the shaping time; 3) Reshaping work execution: The host computer starts the drive mechanism, and the rotary motor and the swing motor work together to move the sub-diameter trimming head above the wear area; The air system is inflated, the shaping head is pressed down to fit the polishing pad, and the pressure sensor provides feedback on the pressure data to maintain the air pressure. A rotary motor drives the shaping head to rotate, and a swing motor drives the swing arm to swing within a set range to shape the worn area. 4) Post-shaping inspection: After the shaping is completed, the surface flatness of the polishing pad is inspected using testing equipment to ensure that the shaping requirements are met.
Claims
1. A polishing pad particle control device for high-precision mask substrate polishing, characterized in that, include: The mounting bracket (1) is a hollow frame structure with an internal wiring cavity and an external reinforcing rib. The wiring cavity is used to integrate and arrange pipes and cables. A flexible projectile assembly (2), movably connected to the underside of the mounting bracket (1), includes: - Airbag-type flexible throwing head mounting base (21) is installed inside the throwing head fixing base (23), and its interior is provided with an air-filled chamber; - Replaceable functional head (22) is detachably connected to the bottom working end of the airbag flexible throwing head mounting base (21) via a quick-change structure for performing cleaning or shaping operations; - The ball head mounting base (23) is fixedly connected to the output end of the multi-degree-of-freedom drive mechanism (3) and serves as the mounting base and power input interface for the entire flexible ball head assembly 2. When the air system (5) fills the air chamber with gas, the airbag expands and drives the bottom working surface of the replaceable functional head (22) to press against the polishing pad surface; when the air system (5) discharges gas from it, the airbag contracts and drives the replaceable functional head (22) to lift away from the polishing pad surface. A multi-degree-of-freedom drive mechanism (3) is mounted on the mounting bracket (1), and its output end is connected to the polishing head fixing seat (23) to drive the flexible polishing head assembly (2) to perform rotational motion around its own axis and / or oscillating motion in a plane parallel to the surface of the polishing pad. The detection module (4) includes a distance sensor (41) installed on the polishing head fixing seat (23) for detecting the distance or contact state between the working end of the replaceable functional head (22) and the surface of the polishing pad, a conveyor belt status sensor (42) for monitoring whether the synchronous belt of the rotary drive unit 31 is broken or severely slipped, and a swing arm angle positioning sensor (43) for monitoring whether the swing arm angle is in place. The gas system (5) has its pipeline passing through the wiring cavity of the mounting bracket (1) and communicating with the inflation chamber of the replaceable functional head (22), and is used to adjust the shape and downpressure of the replaceable functional head (22) by filling or discharging gas into the inflation chamber. The control unit is located inside the host computer and is electrically connected to the multi-degree-of-freedom drive mechanism (3), the detection module (4), and the air circuit system (5). Based on the gap signal between the working end of the replaceable functional head (22) and the surface of the polishing pad detected in real time by the distance sensor (41), the control unit controls the air circuit system (5) to perform inflation / deflation operations on the inflation chamber to adjust the deformation degree of the airbag flexible polishing head (21), thereby indirectly controlling the downward pressure and adhesion state of the replaceable functional head (22) on the polishing pad.
2. The polishing pad particle control device for high-precision mask substrate polishing according to claim 1, characterized in that, The airbag-type flexible polishing head mount (21) is configured such that when the pressure inside its air chamber changes, the working surface at its bottom can produce adaptive multi-degree-of-freedom deformation to achieve surface contact and avoid rigid damage when the replaceable functional head (22) contacts the polishing pad surface.
3. The polishing pad particle control device for high-precision mask substrate polishing according to claim 1 or 2, characterized in that, The replaceable functional head (22) includes at least one of a cleaning brush head and a sub-diameter shaping head; wherein the quick-change structure is a threaded quick-change structure, which enables the replaceable functional head (22) to be quickly installed, removed and precisely positioned on the airbag-type flexible throwing head mounting base (21).
4. The polishing pad particle control device for high-precision mask substrate polishing according to claim 1, characterized in that, The multi-degree-of-freedom drive mechanism (3) includes: a rotation drive unit (31) for driving the flexible throwing head assembly (2) to rotate around its own axis; and a swing drive unit (32) for driving the flexible throwing head assembly (2) to swing; wherein, the swing drive unit (32) includes a hollow reducer (34), and the hollow reducer (34) integrates an angle positioning module for precisely controlling and limiting the swing angle; the outputs of the rotation drive unit (31) and the swing drive unit (32) are transmitted to the airbag flexible throwing head (21) after being combined through the hollow reducer (34).
5. The polishing pad particle control device for high-precision mask substrate polishing according to claim 4, characterized in that, The mounting bracket (1) is a hollow frame structure with reinforcing ribs; the drive motor of the rotary drive unit (31) is fixed to the top of the mounting bracket (1), and its power is transmitted to a vertically arranged rotating shaft (33) via a reducer and a synchronous belt; the drive motor of the swing drive unit (32) is installed on the side of the rotating shaft (33), and its power is transmitted to the hollow reducer (34) via a transmission gear set; the rotating shaft (33) is hollow inside, allowing the pipeline of the air circuit system (5) generating component to pass through.
6. The polishing pad particle control device for high-precision mask substrate polishing according to claim 1, characterized in that, The distance sensor (41) is an inductive proximity sensor, and its probe is pointed at the working end surface of the replaceable functional head (22) at a vertically downward angle.
7. A method for treating a polishing pad using the polishing pad particle control device according to any one of claims 1-6, characterized in that, Includes the following steps: According to the target operation type, the corresponding replaceable functional head (22) is installed onto the airbag flexible throwing head mounting base (21) through the quick-change structure; The operation parameters are set by the host computer, and the operation parameters include at least the rotation speed, swing angle and frequency, airbag target pressure and operation time. The host computer controls the multi-degree-of-freedom drive mechanism (3) to move the flexible polishing head assembly (2) with the replaceable functional head (24) installed to the target area of the polishing pad; The host computer controls the air circuit system (5) to inflate the air chamber, causing the airbag flexible polishing head (21) to expand and press down until the replaceable functional head adheres to the surface of the polishing pad at the set target pressure. The detection module (4) provides real-time feedback of the pressure value and the host computer performs closed-loop adjustment. The host computer starts the multi-degree-of-freedom drive mechanism (3) and drives the flexible throwing head assembly (2) to perform operations according to the set motion mode; during cleaning operations, nitrogen protection is activated simultaneously and cleaning fluid is applied to the work area; during shaping operations, the corresponding swing angle is set according to the size of the shaping area. After the set operation time or operation target is reached, the host computer controls the air circuit system (5) to stop the air supply and start the vacuum pumping, so that the replaceable functional head (22) retracts and lifts, and then controls the multi-degree-of-freedom drive mechanism (3) to move the flexible throwing head assembly (2) back to the initial position.
8. The method for processing a polishing pad using the polishing pad particle control device according to claim 7, characterized in that, By changing different replaceable functional heads and adjusting the operating parameters, particle cleaning and local sub-diameter shaping operations of the polishing pad can be achieved on the same device; in the sub-diameter shaping operation, the swing angle is set to match the size of the local wear area of the polishing pad.