Structural lightweight design method and system for structural circuit integrated printing

Abstract

The invention discloses a structural lightweight design method and system for structural circuit integrated printing. The method comprises the following steps: importing a device, a lead and a design space model, voxelizing by utilizing a symbol distance field and distributing an attribute tag, and resolving space conflicts among the models through a priority rule; generating a corresponding bearing structure for the device and the wire according to an integrated printing process requirement, and constructing an agent model of the device; taking the bearing structure as a growth core, and adopting a generative topological optimization algorithm based on sensitivity analysis to iteratively grow a material in a design domain until the material volume constraint is met and an objective function is converged; and finally, carrying out surface smoothing and geometric smoothing treatment on the obtained topological optimization structure, and outputting a lightweight three-dimensional model which can be directly used for integrated printing. The problems of traditional topological optimization in the aspects of multi-material coupling, process constraint integration and structure connectivity guarantee are effectively solved, and the integrated design which can be manufactured, is high in efficiency and is light in weight is achieved.

Description

Technical Field

[0001] This invention relates to the field of lightweight structure technology, specifically to a lightweight structure design method and system for integrated printing of structural circuits. Background Technology

[0002] With the rapid development of additive manufacturing technology, integrated structure-circuit manufacturing technology has gradually become a research hotspot in fields such as aerospace, micro-nano satellites, wearable devices, and precision instruments. This technology breaks through the limitations of traditional separate design of mechanical structures and electronic systems, allowing electronic components and wires to be directly embedded or printed inside the load-bearing structure, thereby greatly improving the space utilization of the system and reducing the overall weight.

[0003] However, existing integrated circuit design methods still face many challenges in practical applications: Structure-circuit integration involves various heterogeneous materials, including substrate materials, conductive materials, and electronic components. Traditional topology optimization methods (such as the SIMP method) are extremely complex in their computational models when dealing with multi-material interfaces and heterogeneous components with significant stiffness differences, such as rigid devices and flexible substrates, and it is difficult to guarantee convergence, resulting in low optimization efficiency.

[0004] Existing lightweight designs often overlook the specific characteristics of printing processes. For example, in a hybrid manufacturing process involving printing, pauses, embedding, and printing again, devices require specific mounting spaces and robotic arm embedding paths; wire printing requires specific support channels; and, if embedded high-power devices lack effective heat dissipation channel design, heat buildup can lead to system damage. Traditional optimization algorithms struggle to automatically generate local microstructures that meet these specific process requirements.

[0005] In complex topology optimization results, how to ensure that dispersed devices and wires can be effectively wrapped and supported by a continuous substrate structure, while also satisfying the optimization of the mechanical transmission path, is a problem that urgently needs to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a lightweight design method and system for integrated printing of structural circuits, in order to solve the problems in the prior art such as complex coupling calculations of heterogeneous components, difficulty in integrating specific printing process characteristics constraints, and inability to ensure that devices and wires are effectively covered and connected by continuous support structures.

[0007] To achieve the above objectives, the technical solution provided by this invention is: a lightweight structural design method for integrated printing of structural circuits, comprising the following steps: S1: Import device model, wire model and design space model; use the symbolic distance field method to convert all model voxels into a set of hexahedral mesh elements, and assign corresponding attribute labels to each mesh element; for mesh elements that have spatial overlap between the device model, wire model and design space model, resolve conflicts according to preset priority rules to obtain an initial voxel model with clear attribute distribution. S2: According to the requirements of the integrated printing process, generate corresponding carrier structures for the mesh cells with attribute labels of device and wire respectively, and update the attribute labels of the mesh cells that have formed the carrier structure to the carrier structure. S3: Construct the device support structure as a proxy model of the device. This proxy model inherits the physical properties and load boundary conditions of the original device. Based on the updated attribute labels, automatically divide the topology optimization domain: set the mesh cells with the attribute label of design space as empty cells of the design domain, set the mesh cells with the attribute label of device and wire as empty cells of non-design domain, and set the mesh cells with the attribute label of device support structure and wire support structure as non-design domain entity cells as growth cores. S4: A generative topology optimization algorithm based on sensitivity analysis is adopted, with the non-design domain entity unit as the initial structure, and iterative growth is performed into the design domain; in each iteration, according to the unit sensitivity information, adjacent empty units or low-density units are selected and filled from the boundary of the current structure to realize material extension and mechanical connection between the load-bearing structures. S5: When the iteration process satisfies the material total volume constraint of the optimized structure and the objective function converges and stabilizes, the iteration stops, and the topology-optimized structure in discrete voxel form is obtained; the topology-optimized structure is subjected to surface smoothing and geometric compliance processing, and a lightweight 3D model for integrated printing of structure and circuit is output.

[0008] To optimize the above technical solution, the specific measures also include: Furthermore, in step S1, the method of using the symbolic distance field to convert all model voxels into a set composed of hexahedral mesh elements is specifically as follows: calculate the distance field from each model to the voxel mesh, and determine the internal and external relationship between the voxel elements and the model by the positive or negative value of the field, thereby realizing the discretization of the model.

[0009] In step S2, the integrated printing process requires that: the device support structure at least meets the positioning function required for the robotic arm embedding and the heat dissipation function required for the device operation; the wire support structure at least meets the function of covering the wire path and the function of mechanical support.

[0010] In step S3, after constructing the proxy model of the device, only the mechanical response of the device's load-bearing structure is calculated during the topology optimization process; the mesh elements corresponding to the original device model do not participate in the assembly of the finite element stiffness matrix, and their loads and boundary conditions are transmitted through the load-bearing structure.

[0011] In step S4, the generative topology optimization algorithm is specifically as follows: During the initialization of the generative topology optimization algorithm, only the density of the non-design domain entity cells is set to entity, and the density of the remaining mesh cells is set to approximately empty; during the iteration process, the sensitivity of the entity cells and their boundary adjacent cells is calculated. Furthermore, if the current structural volume does not meet the target of the total material volume constraint, then at the boundary, the high-sensitivity empty units are converted into solid units according to their sensitivity levels. If the current structural volume has reached the target of the total material volume constraint, then at the boundary, a replacement is performed between solid units and low-sensitivity empty units based on their sensitivity levels.

[0012] Further, in step S5, the iterative process satisfies the material total volume constraint of the optimized structure and the objective function converges and stabilizes, specifically: the iteration stops when the material total volume of the optimized structure is less than or equal to the set percentage of the material total volume and the difference between the objective functions of two adjacent iterations is less than the set threshold; the objective function is optimized by minimizing the derivative compliance of the structural stiffness.

[0013] In step S5, the surface smoothing and geometric compliance processing of the topology optimization structure is specifically performed by: obtaining the data points of each cell in the topology optimization structure through the MC algorithm to draw the edges, thereby obtaining a lightweight 3D model in STL format with a smooth surface.

[0014] As another important technical solution, the present invention also provides a lightweight structural design system for integrated printing of structural circuits, comprising: The model voxelization and initialization module is used to import device models, wire models, and design space models; it uses the signed distance field method to voxelize all models into a set of hexahedral mesh elements and assigns corresponding attribute labels to each mesh element; for mesh elements that have spatial overlap between the device model, wire model, and design space model, it resolves conflicts according to preset priority rules to obtain an initial voxel model with a clear attribute distribution. The load-bearing structure generation module is used to generate corresponding load-bearing structures for mesh cells with attribute labels of device and wire, respectively, according to the requirements of the integrated printing process, and to update the attribute labels of mesh cells that have already formed load-bearing structures to load-bearing structures. The optimization domain configuration module is used to construct the device support structure as a proxy model of the device. This proxy model inherits the physical properties and load boundary conditions of the original device. Based on the updated attribute labels, the topology optimization domain is automatically divided: the grid cells with the attribute label "design space" are set as empty cells in the design domain, the grid cells with the attribute label "device and wire" are set as empty cells in the non-design domain, and the grid cells with the attribute label "device support structure and wire support structure" are set as non-design domain entity cells that serve as the growth core. The topology optimization growth module is used to perform iterative growth into the design domain using a generative topology optimization algorithm based on sensitivity analysis, with the non-design domain entity unit as the initial structure. In each iteration, based on the unit sensitivity information, adjacent empty units or low-density units are selected and filled from the boundary of the current structure to achieve material extension and mechanical connection between the load-bearing structures. The structure generation and output module is used to stop the iteration when the total material volume constraint of the optimized structure is satisfied and the objective function converges and stabilizes, thus obtaining the topology-optimized structure in discrete voxel form; the topology-optimized structure is then subjected to surface smoothing and geometric compliance processing, and a lightweight 3D model for integrated printing of structure and circuit is output.

[0015] The present invention also proposes an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, it implements a lightweight structural design method for integrated printing of structural circuits as described above.

[0016] The present invention also proposes a computer-readable storage medium storing a computer program that enables a computer to execute a lightweight structural design method for integrated printing of structural circuits as described above.

[0017] Compared with the prior art, the beneficial effects of the present invention are: This invention addresses specific needs in integrated circuit printing processes, such as robotic arm embedding, wire printing, and device heat dissipation. It automatically generates a load-bearing structure that combines positioning, covering, and heat dissipation functions, effectively ensuring the manufacturability and functional reliability of the optimized model and overcoming the limitations of traditional methods that ignore process constraints.

[0018] This invention constructs a device-bearing structure as a proxy model and inherits the physical properties and load boundary conditions of the original device. In topology optimization, only the mechanical response of the bearing structure is calculated, which avoids the model complexity and convergence difficulties caused by the direct coupling of multi-material, high-stiffness components, and significantly improves optimization efficiency and numerical stability.

[0019] This invention employs a generative topology optimization algorithm, with the functional load-bearing structure as the growth core. Based on sensitivity information, the material is iteratively extended into the design domain step by step, realizing the natural connection and mechanical path optimization between load-bearing structures. This ensures the integrity of electronic components and supporting structures while achieving the goal of lightweighting.

[0020] This invention uses the symbolic distance field method to uniformly voxelize and assign attribute labels to devices, wires, and design space. Combined with preset priority rules, it automatically resolves spatial conflicts, realizing the standardized and discretized expression of multi-component models and providing a clear and stable input model for subsequent optimization.

[0021] After surface smoothing and geometric compliance processing, the optimization results of this invention can be directly output as a lightweight 3D model in STL format suitable for 3D printing, realizing an integrated process from design to optimization to manufacturing, and significantly improving the degree of design automation and engineering practicality.

[0022] This invention is not only applicable to fields with extremely high requirements for lightweighting and integration, such as aerospace and micro / nano satellites, but its voxel-based and generative optimization framework can also be extended to integrated design scenarios of other multi-material and multi-functional components, and has good promotion and application value. Attached Figure Description

[0023] Figure 1 This is a flowchart illustrating the lightweight design process of the integrated printing technology for structural circuits according to the present invention.

[0024] Figure 2 This is a flowchart of generative topology optimization in an embodiment of the present invention.

[0025] Figure 3 This is a diagram illustrating the design process of the DYT model in an embodiment of the present invention. Detailed Implementation

[0026] The present invention will be further described in detail below through specific embodiments, but it should not be construed as limiting the scope of the subject matter of the present invention to the following embodiments. All technologies implemented based on the above content of the present invention fall within the scope of the present invention.

[0027] In some implementations, such as Figure 1 As shown, this invention provides a lightweight structural design method for integrated printing of structural circuits, comprising the following steps: S1: Import device model, wire model and design space model; use the symbolic distance field method to convert all model voxels into a set of hexahedral mesh elements, and assign corresponding attribute labels to each mesh element; for mesh elements that have spatial overlap between the device model, wire model and design space model, resolve conflicts according to preset priority rules to obtain an initial voxel model with clear attribute distribution. Preferably, the symbolic distance field method is used to convert all model voxels into a set of hexahedral mesh elements. The specific process is as follows: calculate the distance field from each model to the voxel mesh, and determine the internal and external relationship between the voxel elements and the model by the positive or negative value of the field, thereby realizing the discretization of the model.

[0028] In some implementations, the preset priority rules are set as follows: device models and wire models are given the first priority, design space models are given the second priority, and when voxel units are located in different model ranges at the same time, the higher priority model is given the label first.

[0029] S2: According to the requirements of the integrated printing process, generate corresponding carrier structures for the mesh cells with attribute labels of device and wire respectively, and update the attribute labels of the mesh cells that have formed the carrier structure to the carrier structure. In some implementations, the integrated printing process requires that: the device support structure at least meets the positioning function required for the robotic arm embedding and the heat dissipation function required for the device operation; the wire support structure at least meets the function of covering the wire path and providing mechanical support.

[0030] The attribute tag generates the device support structure for the device's mesh cells. The specific process is as follows: using the device's bounding box as the reference size, a rigid covering layer for fixing the device is generated; at the same time, according to the device's heat dissipation power requirements, a porous heat dissipation support structure is generated on the outside or inside of the covering layer by referencing the truss lattice structure.

[0031] Expand the grid cells labeled as wires by the minimum print size.

[0032] S3: Construct a proxy model of the device's supporting structure, which inherits the original device's physical properties and load boundary conditions; automatically divide the topology optimization domain based on the updated attribute labels. Mesh cells labeled "design space" are set as empty design domain cells, serving as variable-density design domains for subsequent sensitivity analysis and cell addition / removal. Mesh cells labeled "devices and wires" are set as empty non-design domain cells with a forced density of 0, representing physical space being occupied but without structural load-bearing capacity. Mesh cells labeled "device support structure" and "wire support structure" are set as solid non-design domain cells serving as growth cores with a forced density of 1, representing solid support structures that must be retained.

[0033] Preferably, the proxy model is constructed to avoid the computational complexity caused by the coupling of multiple components. After constructing the proxy model of the device, only the mechanical response of the device's load-bearing structure is calculated during the topology optimization process. The mesh elements corresponding to the original device model do not participate in the assembly of the finite element stiffness matrix, and their loads and boundary conditions are transmitted through the load-bearing structure.

[0034] In some implementations, such as Figure 2 As shown, S4: A generative topology optimization algorithm based on sensitivity analysis is adopted, with the non-design domain entity unit as the initial structure, and iterative growth is performed into the design domain; in each iteration, according to the unit sensitivity information, adjacent empty units or low-density units are selected and filled from the boundary of the current structure to realize material extension and mechanical connection between the load-bearing structures.

[0035] In some implementations, the generative topology optimization algorithm is an improved version of the Two-Way Structural Asymptotic Optimization (BESO) method, specifically: During the initialization of the generative topology optimization algorithm, only the density of the non-design domain entity elements is set to 1, and the density of the remaining mesh elements is set to 0.001. During the iteration process, the sensitivity of the entity elements and their boundary adjacent elements is calculated. Specifically, the sensitivity is calculated using a formula after calculating the element displacement through finite element analysis. The expression is:

[0036] in, This indicates the differentiation of a function; Indicates the flexibility of each unit; This represents the density of each cell; This represents the displacement of each element; Indicates the force applied to the structure; This indicates the matrix transpose.

[0037] If the current structural volume does not reach the target of the total material volume constraint, then at the boundary, based on the sensitivity level, the high-sensitivity empty unit is converted into a solid unit (material is added). If the current structural volume has reached the target of the total material volume constraint, then at the boundary, based on the sensitivity level, a replacement (material redistribution) is performed between solid units and low-sensitivity empty units.

[0038] S5: When the iteration process satisfies the material total volume constraint of the optimized structure and the objective function converges and stabilizes, the iteration stops, and the topology-optimized structure in discrete voxel form is obtained; the topology-optimized structure is subjected to surface smoothing and geometric compliance processing, and a lightweight 3D model for integrated printing of structure and circuit is output.

[0039] The iteration stops when the total material volume of the optimized structure is less than or equal to a set percentage of the total material volume and the difference between the objective functions of two adjacent iterations is less than a set threshold.

[0040] In some implementations, the objective function is optimized to minimize the compliance of the structure, and is expressed as:

[0041] Where i, j, k represent the indices of the voxel units in three-dimensional coordinates; n represents the maximum value of the three-dimensional coordinates; X represents the unit density; C(x) represents the overall structural flexibility; and F represents the force applied to the structure. U Indicates structural displacement; K Indicates structural stiffness.

[0042] The topology optimization structure is subjected to surface smoothing and geometric compliance processing. Specifically, the data points of each cell in the topology optimization structure are obtained by using the MC algorithm to draw the edges, thereby obtaining a lightweight 3D model in STL format with a smooth surface.

[0043] In some implementations, such as Figure 3 The diagram shown illustrates the design process of this invention for the DYT model. Figure 3 (a) represents the original structure. Figure 3 (b) shows the results of voxelization and labeling. Figure 3 (c) shows the result after generating the load-bearing structure and updating the labels. Figure 3 (d) is a lightweight 3D model.

[0044] In another embodiment of the present invention, a lightweight structural design system for integrated printing of structural circuits is proposed, comprising: The model voxelization and initialization module is used to import device models, wire models, and design space models; it uses the signed distance field method to voxelize all models into a set of hexahedral mesh elements and assigns corresponding attribute labels to each mesh element; for mesh elements that have spatial overlap between the device model, wire model, and design space model, it resolves conflicts according to preset priority rules to obtain an initial voxel model with a clear attribute distribution. The load-bearing structure generation module is used to generate corresponding load-bearing structures for mesh cells with attribute labels of device and wire, respectively, according to the requirements of the integrated printing process, and to update the attribute labels of mesh cells that have already formed load-bearing structures to load-bearing structures. The optimization domain configuration module is used to construct the device support structure as a proxy model of the device. This proxy model inherits the physical properties and load boundary conditions of the original device. Based on the updated attribute labels, the topology optimization domain is automatically divided: the grid cells with the attribute label "design space" are set as empty cells in the design domain, the grid cells with the attribute label "device and wire" are set as empty cells in the non-design domain, and the grid cells with the attribute label "device support structure and wire support structure" are set as non-design domain entity cells that serve as the growth core. The topology optimization growth module is used to perform iterative growth into the design domain using a generative topology optimization algorithm based on sensitivity analysis, with the non-design domain entity unit as the initial structure. In each iteration, based on the unit sensitivity information, adjacent empty units or low-density units are selected and filled from the boundary of the current structure to achieve material extension and mechanical connection between the load-bearing structures. The structure generation and output module is used to stop the iteration when the total material volume constraint of the optimized structure is satisfied and the objective function converges and stabilizes, thus obtaining the topology-optimized structure in discrete voxel form; the topology-optimized structure is then subjected to surface smoothing and geometric compliance processing, and a lightweight 3D model for integrated printing of structure and circuit is output.

[0045] In another embodiment of the present invention, an electronic device is proposed, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, it implements a lightweight structural design method for integrated printing of structural circuits as described above.

[0046] In another embodiment of the present invention, a computer-readable storage medium is provided storing a computer program that causes a computer to execute a lightweight structural design method for integrated printing of structural circuits as described above.

[0047] In the embodiments disclosed in this application, a computer storage medium may be a tangible medium that may contain or store programs for use by or in conjunction with an instruction execution system, apparatus, or device. The computer storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of computer storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0048] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, equivalent substitutions, and improvements made by those skilled in the art to the above embodiments without departing from the scope of the technical solution of the present invention, based on the technical essence of the present invention, shall still fall within the protection scope of the technical solution of the present invention.

Claims

1. A lightweight structural design method for integrated printing of structural circuits, characterized in that, Includes the following steps: S1: Import device models, wire models, and design space models; use the symbolic distance field method to convert all models into voxels of hexahedral mesh elements, and assign corresponding attribute labels to each mesh element; For mesh cells that overlap spatially with the device model, wire model, and design space model, conflict resolution is performed according to preset priority rules to obtain an initial voxel model with a clear attribute distribution. S2: According to the requirements of the integrated printing process, generate corresponding carrier structures for the mesh cells with attribute labels of device and wire respectively, and update the attribute labels of the mesh cells that have formed the carrier structure to the carrier structure. S3: Construct the device support structure as a proxy model of the device. This proxy model inherits the physical properties and load boundary conditions of the original device. Based on the updated attribute labels, automatically divide the topology optimization domain: set the mesh cells with the attribute label of design space as empty cells of the design domain, set the mesh cells with the attribute label of device and wire as empty cells of non-design domain, and set the mesh cells with the attribute label of device support structure and wire support structure as non-design domain entity cells as growth cores. S4: A generative topology optimization algorithm based on sensitivity analysis is adopted, using the non-design domain entity unit as the initial structure, and iteratively growing into the design domain; In each iteration, based on the element sensitivity information, adjacent empty elements or low-density elements are selected and filled from the boundary of the current structure to achieve material extension and mechanical connection between load-bearing structures. S5: Stop the iteration when the iteration process satisfies the material total volume constraint of the optimized structure and the objective function converges and stabilizes, and obtain the topology optimization structure in the form of discrete voxels. The topology optimization structure is surface smoothed and geometrically compliant to output a lightweight 3D model for integrated printing of structural circuits.

2. The lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S1, the method of using the sign distance field to convert all model voxels into a set composed of hexahedral mesh elements is specifically as follows: calculate the distance field from each model to the voxel mesh, and determine the internal and external relationship between the voxel elements and the model by the positive or negative value of the field, thereby realizing the discretization of the model.

3. The lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S2, the integrated printing process requires that: the device support structure at least meets the positioning function required for the robotic arm embedding and the heat dissipation function required for the device operation; the wire support structure at least meets the function of covering the wire path and the function of mechanical support.

4. The lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S3, after constructing the proxy model of the device, only the mechanical response of the device's load-bearing structure is calculated during the topology optimization process; the mesh elements corresponding to the original device model do not participate in the assembly of the finite element stiffness matrix, and their loads and boundary conditions are transmitted through the load-bearing structure.

5. A lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S4, the generative topology optimization algorithm specifically includes: During the initialization of the generative topology optimization algorithm, only the density of the non-design domain entity cells is set to entity, and the density of the remaining mesh cells is set to approximately empty; during the iteration process, the sensitivity of the entity cells and their boundary adjacent cells is calculated. If the current structural volume does not meet the target of the total material volume constraint, then at the boundary, the high-sensitivity empty unit is converted into a solid unit according to the sensitivity level. If the current structural volume has reached the target of the total material volume constraint, then at the boundary, the solid units and the low-sensitivity empty units are replaced according to their sensitivity.

6. The lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S5, the iterative process satisfies the material total volume constraint of the optimized structure and the objective function converges and stabilizes. Specifically, the iteration stops when the material total volume of the optimized structure is less than or equal to the set percentage of the material total volume and the difference between the objective functions of two adjacent iterations is less than the set threshold. The objective function is optimized by minimizing the derivative compliance of the structural stiffness.

7. The lightweight structural design method for integrated printing of structural circuits according to claim 1, characterized in that: In step S5, the surface smoothing and geometric compliance processing of the topology optimization structure is specifically performed by: obtaining the data points of each cell in the topology optimization structure through the MC algorithm to draw the edges, thereby obtaining a lightweight 3D model in STL format with a smooth surface.

8. A lightweight structural design system for integrated printing of structural circuits, characterized in that, include: The model voxelization and initialization module is used to import device models, wire models, and design space models; it uses the signed distance field method to voxelize all models into a set of hexahedral mesh elements and assigns corresponding attribute labels to each mesh element. For mesh cells that overlap spatially with the device model, wire model, and design space model, conflict resolution is performed according to preset priority rules to obtain an initial voxel model with a clear attribute distribution. The load-bearing structure generation module is used to generate corresponding device load-bearing structures and wire load-bearing structures for mesh cells with attribute labels of device and wire, respectively, according to the requirements of the integrated printing process; and to uniformly update the attribute labels of the mesh cells that have already formed the load-bearing structure to the load-bearing structure. The optimization domain configuration module is used to construct the device support structure as a proxy model of the device. This proxy model inherits the physical properties and load boundary conditions of the original device. Based on the updated attribute labels, the topology optimization domain is automatically divided: the grid cells with the attribute label "design space" are set as design domains, the grid cells with the attribute label "device and wire" are set as non-design domain empty cells, and the grid cells with the attribute label "device support structure and wire support structure" are set as non-design domain entity cells as growth cores. The topology optimization growth module is used to perform iterative growth into the design domain using a generative topology optimization algorithm based on sensitivity analysis, with the growth core as the initial structure. In each iteration, based on the element sensitivity information, adjacent empty elements or low-density elements are selected and filled from the boundary of the current structure to achieve material extension and mechanical connection between load-bearing structures. The structure generation and output module is used to stop the iteration when the iterative process satisfies the total material volume constraint of the optimized structure and the objective function converges and stabilizes, thus obtaining the topology optimization structure in the form of discrete voxels. The topology optimization structure is surface smoothed and geometrically compliant to output a lightweight 3D model for integrated printing of structural circuits.

9. An electronic device, characterized in that, include: The invention includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements a lightweight structural design method for integrated printing of structural circuits as described in any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: The computer program causes the computer to execute a lightweight structural design method for integrated printing of structural circuits as described in any one of claims 1 to 7.

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