Multilayer thin-wall part interconnection structure based on radar

Abstract

The invention belongs to the crossing field of electronic manufacturing and precision machinery, and particularly relates to a radar-based multilayer thin-wall part interconnection structure, which comprises a base, a microstrip plate and a metal cover plate, a first clearance fit surface is arranged between the metal cover plate and the base, a second clearance fit surface is arranged between the base and the microstrip plate, and the first clearance fit surface and the second clearance fit surface are both coated with soldering tin. The connecting structure is a soft soldering structure, and compared with a mechanical fastening structure, the thickness is smaller, the number of used parts is smaller, and the connecting structure is more suitable for installation in a narrow space; the surfaces of the interconnected parts are smooth and flat; the soldering tin is filled among the parts, so that good electrical conduction and electromagnetic shielding can be realized; the product is simple in structure, and high-degree automation can be easily achieved in the part machining, assembling and soft soldering processes; the antenna can be applied to design and manufacturing of radiation antennas; the method can be applied to design and manufacturing of a multi-channel microwave transmission assembly; the method can be applied to design and manufacturing of a power division network.

Description

Technical Field

[0001] This application belongs to the interdisciplinary field of electronic manufacturing and precision machinery, and specifically relates to a multi-layer thin-walled component interconnection structure based on radar. Background Technology

[0002] With the increasing integration of airborne radar antennas, radiating antennas are developing towards lighter weight and smaller size. Their structure is mostly multi-layered, generally consisting of two thin-walled metal parts sandwiching a microwave dielectric substrate part, with each part typically connected by fasteners. The demand for miniaturization and low scattering area is growing stronger, requiring increasingly stringent requirements for thinner thickness, lighter weight, and smoother outer surfaces. This necessitates a new method for interconnecting multi-layered thin-walled parts. Summary of the Invention

[0003] The purpose of this application is to provide a radar-based multi-layer thin-walled component interconnection structure to solve the problem that existing thin-walled component interconnection structures cannot meet the requirements of miniaturization and low scattering area.

[0004] The technical solution of this application is: a multi-layer thin-walled component interconnection structure based on radar, including a base, a microstrip board and a metal cover plate; a first clearance mating surface is provided between the metal cover plate and the base, and a second clearance mating surface is provided between the base and the microstrip board, and both the first clearance mating surface and the second clearance mating surface are coated with solder.

[0005] Preferably, the base has a plurality of grooves arranged on it that can mate with the microstrip board. The inside of the grooves and the contact surface of the grooves are plated with a first solderable coating. A power supply cover plate is also provided inside the grooves. A first shallow groove is provided on the side of the grooves. A boss is manufactured in the first shallow groove. The top of the boss is plated with a second solderable coating. The first solderable coating and the second solderable coating form a second clearance mating surface.

[0006] Preferably, a third solderable coating is plated at the gap surface between the metal cover plate and the base; the metal cover plate includes a base plate, and a second shallow groove is formed on the surface of the base plate that overlaps with the first shallow groove. The surface of the second shallow groove is plated with a non-solderable coating, and the third solderable coating and the non-solderable coating form a first gap mating surface.

[0007] Preferably, a through-hole is provided in the middle of the second shallow groove.

[0008] Preferably, the microstrip board includes a metal layer and a dielectric material; there are two metal layers, and the dielectric material is sandwiched between the two metal layers, with a first microstrip line in the middle of the dielectric material; a stepped groove is formed at the end of the metal layer, and a second microstrip line is installed in the stepped groove; a two-sided metal layer window is formed at the end of the metal layer away from the second microstrip line; the shape of the metal cover plate is the same as the annular structure formed by the stepped groove.

[0009] Preferably, one end of the base is connected to a plurality of radio frequency connectors, and the clearance mating surfaces of the radio frequency connectors and the base are coated with solder; the radio frequency connectors include a center conductor and a connector housing; the center conductor and the connector housing are coaxially connected, and the overlapping parts of the center conductor and the microstrip line are coated with solder.

[0010] The radar-based multi-layer thin-walled component interconnection structure of this application has the following advantages:

[0011] The connection structure is a soft solder structure, which is thinner and uses fewer parts compared to mechanical fastening structures, making it more suitable for installation in narrow spaces;

[0012] The interconnected parts have smooth and flat surfaces;

[0013] Solder filling the spaces between components helps to achieve good electrical conductivity and electromagnetic shielding;

[0014] The product has a simple structure, and the parts processing, assembly, and soldering processes can all be easily automated to a high degree.

[0015] It can be applied to the design and manufacture of radiating antennas;

[0016] It can be applied to the design and manufacturing of multi-channel microwave transmission components;

[0017] It can be applied to the design and manufacturing of power splitting networks. Attached Figure Description

[0018] To more clearly illustrate the technical solutions provided in this application, the accompanying drawings will be briefly described below. Obviously, the drawings described below are merely some embodiments of this application.

[0019] Figure 1 This is a schematic diagram of the overall structure of this application;

[0020] Figure 2 This is a schematic diagram of the structure with the metal cover removed in this application;

[0021] Figure 3 This is a schematic diagram of the base structure of this application;

[0022] Figure 4 for Figure 3 Schematic diagram of section AA;

[0023] Figure 5 This is a schematic diagram of the metal cover plate structure of this application;

[0024] Figure 6 This is a schematic diagram of the microstrip feed conductor of this application;

[0025] Figure 7 This is a schematic diagram of the RF connector structure of this application;

[0026] Figure 8 This is a schematic diagram of the tinning of the components in this application;

[0027] Figure 9 This is a schematic diagram showing the welding fixture and connector relative to each other in this application.

[0028] 1. Base; 2. Microstrip board; 3. Metal cover plate; 4. RF connector; 5. Power supply cover plate; 6. Groove; 7. RF connector mounting structure; 8. First shallow groove; 9. Boss; 10. Base plate; 11. Second shallow groove; 12. Vent hole; 13. Dielectric material; 14. First microstrip line; 15. Second microstrip line; 16. Step groove; 17. Center conductor; 18. Connector housing; 19. Solder. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] A radar-based multi-layer thin-walled component interconnection structure, such as... Figure 1 It includes a base 1, a microstrip board 2, and a metal cover plate 3; a first clearance mating surface is provided between the metal cover plate 3 and the base 1, and a second clearance mating surface is provided between the base 1 and the microstrip board 2; both the first clearance mating surface and the second clearance mating surface are coated with solder 19 (for bonding). Figure 9 All areas coated with solder 19 have a solderable plating.

[0031] Compared to traditional fastener installation methods, by coating the first and second gap mating surfaces with solder 19 to form a soft solder structure, the structure is thinner and uses fewer parts than mechanical fastening structures, making it more suitable for installation in narrow spaces. Furthermore, the interconnected metal cover plate 3, base plate 10, and microstrip plate 2 have smoother and flatter surfaces.

[0032] Solder 19 fills the spaces between components, which is beneficial for achieving good electrical conductivity and electromagnetic shielding; the product structure is simple, and the parts processing, assembly, and soft soldering processes can be easily automated to a high degree.

[0033] Combination Figures 2-4Preferably, the base 1 has a plurality of grooves 6 arranged on it that can mate with the microstrip plate 2. The inside of the grooves 6 and the contact surface of the grooves 6 are plated with a first solderable coating. A power supply cover plate 5 is also provided inside the grooves 6. A first shallow groove 8 is provided on the side of the grooves 6. A boss 9 is manufactured in the first shallow groove 8. The top of the boss 9 is plated with a second solderable coating. The first solderable coating and the second solderable coating form a second clearance mating surface.

[0034] One side of the base 1 uses general technology to design and manufacture an RF connector mounting structure 7; the other side of the base 1 is made into a corresponding feed shape according to the antenna performance requirements.

[0035] By providing the groove 6, the microstrip board 2 can be placed within the space filled by the solder 19. The second gap mating surface, formed by two layers of solderable plating, makes the fixation between the base 1 and the microstrip board 2 more stable.

[0036] Combination Figure 5 Preferably, a third weldable coating is plated at the gap between the metal cover plate 3 and the base 1; the metal cover plate 3 includes a base plate 10, and a second shallow groove 11 is formed on the surface of the base plate 10 that overlaps with the first shallow groove 8. The surface of the second shallow groove 11 is plated with a non-weldable coating, and the third weldable coating and the non-weldable coating form a first gap mating surface. This allows the base plate 10 to be snapped into and welded to the second shallow groove 11, preventing misalignment and further improving the strength of the fixation.

[0037] Solderable plating is generally a one- or multi-layer structure composed of materials such as copper, tin, gold, nickel, and palladium; non-solderable plating is generally an oxide layer or a coating layer. If a metal that does not wet the solder is used, the non-solderable plating can be made of the metal body material.

[0038] Solder 19 is applied to the mating surfaces of the intermediate part and the bottom surface of the groove 6 of the base part using common tinning techniques such as stencil printing or coating. Solder 19 is also applied to the solderable surfaces of the top cover part using stencil printing or coating methods.

[0039] Preferably, a through vent 12 is provided in the middle of the second shallow groove 11. The vent 12 can remove air bubbles between the bottom plate 10 and the metal cover plate 3, thereby improving flatness.

[0040] Combination Figure 6Preferably, the microstrip board 2 includes a metal layer and a dielectric material 13; the metal layer has two layers, with the dielectric material 13 sandwiched between the two metal layers, and a first microstrip line 14 is provided in the middle of the dielectric material 13; a stepped groove 16 is formed at the end of the metal layer, and a second microstrip line 15 is installed in the stepped groove 16; a two-sided metal layer window is formed at the end of the metal layer away from the second microstrip line 15; the shape of the metal cover plate 3 is the same as the annular structure formed by the stepped groove 16. This allows the metal cover plate 3 to be inserted into the stepped groove 16 for assembly without tilting, ensuring stable fixation.

[0041] The assembled parts are held in place by a welding fixture, which can apply a certain force perpendicular to the surface of the base 1 to the cover plate; the assembled radiator and the fixture are then placed in a reflow oven for welding; the welding fixture is removed after welding is completed.

[0042] During installation, solder 19 is applied to the overlapping area of ​​the center conductor 17 and the microstrip line. After installation, the installed component is clamped tightly with a fixture and sent into the reflow oven. After soldering, the soldering effect is checked with X-ray.

[0043] Combination Figure 7 Preferably, one end of the base 1 is connected to a plurality of RF connectors 4, and the clearance mating surfaces of the RF connectors 4 and the base 1 are coated with solder 19. The RF connector 4 includes a center conductor 17 and a connector housing 18; the center conductor 17 and the connector housing 18 are coaxially connected, and the overlapping part of the center conductor 17 and the microstrip line is coated with solder 19 to achieve fixed installation.

[0044] In summary, it has the following advantages:

[0045] Each component is thin and light; by stacking multiple layers of components, the required strength can be achieved while maintaining a thin and light profile.

[0046] Interconnection via soldering not only achieves structural rigidity but also enables electrical interconnection and electromagnetic sealing.

[0047] The product has a simple structure, and both the processing of parts and the soldering process can be easily automated to a high degree.

[0048] Using soldering as the integration method eliminates the need for fasteners, produces a smooth surface, and is suitable for confined spaces.

[0049] The structure is compact, and the relative positions of the components are stable after welding. The electrical properties are stable in a vibration environment.

[0050] As one specific implementation method, combined with Figures 8-9 The welding process for interconnecting multi-layer thin-walled parts is as follows:

[0051] Step 1: Apply solder 19 to the contact surface between the microstrip board 2 and the bottom surface of the groove 6 using stencil printing and solder paste application methods, apply solder 19 to the base surface between the RF connector 4 and the base 1, and apply solder 19 to the contact surface between the metal cover plate 3 and the base 1 and the contact surface between the metal cover plate 3 and the microstrip board 2.

[0052] Step 2: Install the microstrip board 2 into the groove 6, with the side with solder 19 in close contact with the bottom of the groove 6;

[0053] Step 3: Install the RF connector 4, which has been coated with solder paste, into the base 1, and apply solder 19 to the overlapping part of the center conductor 17 and the microstrip line;

[0054] Step 4: Install the power supply cover 5 into the stepped groove 16, with the metal side of the power supply cover 5 facing the metal cover 3.

[0055] Step 5: Install the metal cover plate 3 onto the base 1, with the side with solder 19 facing the base 1 and the microstrip line;

[0056] Step 6: Use a clamp to hold the assembled components on both sides and then put them into a reflow oven for soldering.

[0057] Step 7: After welding, remove the fixture and inspect using X-ray. Finally, it should be noted that the accompanying drawings of the embodiments disclosed in this invention only involve structures relevant to the embodiments of this disclosure. Other structures can refer to common designs. Where there is no conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0058] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A radar-based multi-layer thin-walled part interconnect structure, characterized by: The base (1), the microstrip board (2) and the metal cover plate (3) are included; the first gap fit surface is arranged between the metal cover plate (3) and the base (1), the second gap fit surface is arranged between the base (1) and the microstrip board (2), and the solder tin (19) is coated on the first gap fit surface and the second gap fit surface.

2. The radar-based multi-layer thin-walled part interconnect structure of claim 1, wherein: A plurality of grooves (6) capable of cooperating with the microstrip board (2) are arranged on the base (1), the first solderable plating layer is plated on the inside of the groove (6) and the contact surface of the groove (6), and the feed cover plate (5) is further arranged in the groove (6); the first shallow groove (8) is arranged on the side of the groove (6), the boss (9) is manufactured in the first shallow groove (8), the second solderable plating layer is plated on the top of the boss (9), and the first solderable plating layer and the second solderable plating layer constitute the second gap fit surface.

3. The radar-based multi-layer thin-walled part interconnect structure of claim 2, wherein: The third solderable plating layer is plated on the gap surface of the metal cover plate (3) and the base (1); the metal cover plate (3) includes the bottom plate (10), the second shallow groove (11) is arranged on the coincident surface of the bottom plate (10) and the first shallow groove (8), the non-solderable plating layer is plated on the surface of the second shallow groove (11), and the third solderable plating layer and the non-solderable plating layer constitute the first gap fit surface.

4. The radar-based multi-layer thin-walled part interconnect structure of claim 3, wherein: The through air hole (12) is arranged in the middle of the second shallow groove (11).

5. The radar-based multi-layer thin-walled part interconnect structure of claim 3, wherein: The microstrip board (2) includes the metal layer and the dielectric material (13); the metal layer has two layers, and the dielectric material (13) is clamped between the two metal layers, the first microstrip line (14) is arranged in the dielectric material (13); the step groove (16) is arranged at the end of the metal layer, the second microstrip line (15) is installed in the step groove (16), the metal layer opening window is arranged on the end of the metal layer away from the second microstrip line (15), and the shape of the metal cover plate (3) is the same as the annular structure surrounded by the step groove (16).

6. The radar-based multi-layer thin-walled part interconnect structure of claim 3, wherein: The base (1) is connected with a plurality of radio frequency connectors (4), the gap fit surface of the radio frequency connector (4) and the base (1) is coated with the solder tin (19); the radio frequency connector (4) includes the center conductor (17) and the connector shell (18); the center conductor (17) is coaxially connected with the connector shell (18), and the solder tin (19) is coated on the coincident part of the center conductor (17) and the microstrip line.

Images