Heat dissipation device of integrated manifold channel and pin fin composite structure

Abstract

The invention provides a heat dissipation device of an integrated manifold channel and pin fin composite structure, the heat dissipation device comprises an upper cover plate and a lower substrate, the lower substrate is used for bearing an electronic device and receiving heat conducted by the electronic device, the upper cover plate and the lower substrate are connected in a sealed mode, and the upper cover plate and the lower substrate are connected in a sealed mode. A flowing channel for a cooling medium to flow, a manifold shunting and converging structure for shunting and converging the cooling medium, a manifold channel heat exchange area for exchanging heat of the cooling medium and the lower substrate and a pin-fin composite heat exchange structure are arranged in the sealing structure, and the manifold shunting and converging structure is arranged opposite to the manifold channel heat exchange area; a cooling medium inlet is formed in one end of the sealing structure, a cooling medium outlet is formed in the other end of the sealing structure, the cooling medium inlet communicates with the flowing channel, and the flowing channel communicates with the cooling medium outlet; the heat dissipation effect of the electronic device is improved, and the probability that the electronic device is low in reliability and poor in energy efficiency ratio due to the fact that the temperature of the electronic device is too high is reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation device integrating a manifold channel and a pin-rib composite structure. Background Technology

[0002] As intelligent driving technology advances towards L3+ (conditional and highly automated driving), the computing power requirements of domain controllers are growing exponentially. In-vehicle computing platforms need to process fused data from multiple sensors (LiDAR, cameras, millimeter-wave radar, etc.) in real time, run deep learning models and complex decision-making algorithms, consuming hundreds of watts to kilowatts, with heat flux densities exceeding 300 W / cm². However, the in-vehicle environment is limited by space constraints and requires long-term stable operation under high-temperature conditions (≥50℃). High temperatures can easily cause chip frequency reduction, signal delay, and hardware failure. Air-cooling and liquid-cooling solutions in related technologies suffer from insufficient heat dissipation efficiency and poor temperature uniformity, making it difficult to meet the stringent heat dissipation requirements of high-heat-flux-density electronic devices (e.g., devices exceeding 50 W / cm²) such as intelligent driving domain controllers. Therefore, they cannot effectively alleviate the technical problems of poor reliability and energy efficiency caused by the poor heat dissipation capacity of high-heat-flux-density electronic devices.

[0003] Therefore, there is an urgent need for a heat dissipation device that integrates manifold channels and pin-rib composite structures to solve the technical problems of insufficient heat dissipation efficiency, poor temperature uniformity, and poor stability under high-temperature conditions in high-heat-flux-density electronic devices. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, this application provides a heat dissipation device integrating a manifold channel and a pin-rib composite structure to solve the above-mentioned technical problems.

[0005] According to one aspect of the embodiments of this application, a heat dissipation device integrating a manifold channel and a pin-rib composite structure is provided. The heat dissipation device includes: an upper cover plate and a lower substrate plate, the lower substrate plate being used to support electronic devices and receive heat conducted by the electronic devices; the upper cover plate and the lower substrate plate are sealed together to form a sealed structure; the sealed structure is internally provided with a flow channel for cooling medium to flow, a manifold diversion and convergence structure for the cooling medium to divert and converge, a manifold channel heat exchange area for the cooling medium to exchange heat with the lower substrate, and a pin-rib composite heat exchange structure, the manifold diversion and convergence structure being disposed opposite to the manifold channel heat exchange area; one end of the sealed structure is provided with a cooling medium inlet, and the other end of the sealed structure is provided with a cooling medium outlet, the cooling medium inlet being connected to the flow channel, and the flow channel being connected to the cooling medium outlet.

[0006] In one embodiment of this application, the flow channel is a U-shaped groove, which is formed on the lower surface of the upper cover plate. The U-shaped groove is connected to the cooling medium inlet and the cooling medium outlet.

[0007] In one embodiment of this application, the manifold branching and merging structure includes: a protrusion, the lower surface of which contacts the upper surface of the lower substrate; the lower surface of the protrusion is provided with a plurality of branching manifolds and a plurality of merging manifolds, the plurality of branching manifolds and the plurality of merging manifolds being arranged alternately; each branching manifold is connected to the heat exchange area of ​​the manifold channel, each branching manifold is connected to the flow channel, each merging manifold is connected to the heat exchange area of ​​the manifold channel, and each merging manifold is connected to the flow channel.

[0008] In one embodiment of this application, each branch manifold is a wedge-shaped manifold with a starting end width greater than the ending end width, and each merge manifold is a wedge-shaped manifold with a starting end width less than the ending end width.

[0009] In one embodiment of this application, the ratio of the width at the beginning end to the width at the end of each branch manifold is 1-5.

[0010] In one embodiment of this application, the manifold channel heat exchange area includes: a plurality of parallel heat exchange channels disposed on the upper surface of the lower substrate, the plurality of heat exchange channels communicating with each branch manifold and each merge manifold; a plurality of heat exchange components are fixedly disposed on the sidewall of each heat exchange channel, each set of heat exchange components including two oppositely disposed heat exchange units, each heat exchange unit including a plurality of heat exchange protrusions; a first gap is left between the two oppositely disposed heat exchange units, the first gap having a corresponding branch manifold; a second gap is left between the two sets of heat exchange components, the second gap having a corresponding merge manifold.

[0011] In one embodiment of this application, the arrangement direction of the plurality of heat exchange channels is perpendicular to the arrangement direction of the plurality of branch manifolds, and the arrangement direction of the plurality of heat exchange channels is perpendicular to the arrangement direction of the plurality of manifolds.

[0012] In one embodiment of this application, the needle-rib composite heat exchange structure includes: a plurality of needle-rib heat exchange zones, each needle-rib heat exchange zone being provided with a plurality of cylindrical needle ribs, and the plurality of cylindrical needle ribs being fixedly disposed on the upper surface of the lower substrate.

[0013] In one embodiment of this application, the diameter of each cylindrical needle rib ranges from 1.9mm to 2.1mm, the height of each cylindrical needle rib ranges from 4.7mm to 4.9mm, and the distance between the centers of adjacent cylindrical needle ribs is 3mm to 7mm.

[0014] In one embodiment of this application, the cooling medium inlet is located at one end of the lower substrate, the cooling medium outlet is located at the other end of the lower substrate, an inlet reservoir is located at the end of the lower substrate near the cooling medium inlet, the cooling medium inlet is connected to the inlet reservoir, an outlet reservoir is located at the end of the lower substrate near the cooling medium outlet, the cooling medium outlet is connected to the outlet reservoir, and both the inlet reservoir and the outlet reservoir are connected to the flow channel.

[0015] The beneficial effects of this application are as follows: This application includes an upper cover plate and a lower substrate. The lower substrate supports electronic devices and receives heat conducted by the electronic devices. The upper cover plate and the lower substrate are sealed together to form a sealed structure. The sealed structure contains a flow channel for cooling medium, a manifold distribution and convergence structure for cooling medium diversion and convergence, a manifold channel heat exchange area for heat exchange between the cooling medium and the lower substrate, and a pin-rib composite heat exchange structure. The manifold distribution and convergence structure is positioned opposite the manifold channel heat exchange area. One end of the sealed structure has a cooling medium inlet, and the other end has a cooling medium outlet. The cooling medium inlet is connected to the flow channel, and the flow channel is connected to the cooling medium outlet. The manifold channel heat exchange area is positioned opposite the electronic devices. During the operation of the electronic devices, the cooling medium flows into the flow channel from the cooling medium inlet. While flowing within the flow channel, the cooling medium is diverted by the manifold distribution and convergence structure, accelerating the uniform downward flow of the cooling medium to the manifold channel heat exchange area. In the manifold channel, after heat exchange between the cooling medium and the heat exchange area, the cooled medium is then channeled through a manifold branching and converging structure. This channeled cooling medium then flows through a pin-rib composite heat exchange structure, where it exchanges heat again. After this second heat exchange, the cooled medium exits through the cooling medium outlet, thus carrying away heat transferred from the electronic components to the lower substrate. This improves heat dissipation for the electronic components and reduces the probability of low reliability and poor energy efficiency due to excessively high temperatures. Simultaneously, the manifold branching and converging structure enhances the uniformity of cooling medium flow within the manifold channel heat exchange area, improving the uniformity of heat dissipation and reducing temperature differences between different areas of the electronic components. Furthermore, the lower substrate and upper cover are sealed together to prevent leakage of the cooling medium between them.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings: Figure 1 This is a schematic diagram of the structure of a heat dissipation device with an integrated manifold channel and pin-rib composite structure, as shown in an exemplary embodiment of this application. Figure 2 This is a schematic diagram of a manifold splitting and merging structure shown in an exemplary embodiment of this application; Figure 3 This is a schematic diagram of the structure of the heat exchange region of the manifold channel, as shown in an exemplary embodiment of this application; Figure 4 This is a schematic diagram illustrating the flow direction of the cooling medium between the manifold branching and confluence structure and the heat exchange area of ​​the manifold channel, as shown in an exemplary embodiment of this application. Figure 5 This is a schematic diagram of the cylindrical needle rib structure shown in an exemplary embodiment of this application.

[0018] Figure label: 1-Top cover plate; 2-Protrusion; 3-Flow channel; 4-Cooling medium outlet; 5-Outlet reservoir; 6-Cylindrical rib; 7-Lower substrate; 8-Heat exchange channel; 9-Heat exchange protrusion; 10-Inlet reservoir; 11-Cooling medium inlet; 12-Electronic components; 21-Branch manifold; 22-Combination manifold; 81-First gap; 82-Second gap; 83-Third gap. Detailed Implementation

[0019] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0020] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0021] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present application. However, it will be apparent to those skilled in the art that embodiments of the present application may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present application.

[0022] The implementation details of the technical solutions in the embodiments of this application are described in detail below: Reference Figures 1-5 As shown, the heat dissipation device includes: an upper cover plate 1 and a lower substrate 7. The lower substrate 7 is used to support the electronic device 12 and receive the heat conducted by the electronic device 12. The upper cover plate 1 and the lower substrate 7 are sealed together to form a sealed structure. The sealed structure is provided with a flow channel 3 for the flow of cooling medium, a manifold diversion and convergence structure for the diversion and convergence of cooling medium, a manifold channel heat exchange area for the exchange of heat between the cooling medium and the lower substrate 7, and a pin-rib composite heat exchange structure. The manifold diversion and convergence structure is arranged opposite to the manifold channel heat exchange area. A cooling medium inlet 11 is opened at one end of the sealed structure, and a cooling medium outlet 4 is opened at the other end of the sealed structure. The cooling medium inlet 11 is connected to the flow channel 3, and the flow channel 3 is connected to the cooling medium outlet 4.

[0023] In one embodiment of this application, an upper cover plate 1 and a lower substrate 7 are provided. The lower substrate 7 is used to support the electronic device 12 and receive the heat conducted by the electronic device 12. The upper cover plate 1 and the lower substrate 7 are sealed together to form a sealed structure. The sealed structure is provided with a flow channel 3 for the flow of cooling medium, a manifold diversion and convergence structure for the diversion and convergence of cooling medium, a manifold channel heat exchange area for the exchange of heat between the cooling medium and the lower substrate 7, and a pin-rib composite heat exchange structure. The manifold diversion and convergence structure is arranged opposite to the manifold channel heat exchange area. A cooling medium inlet 11 is opened at one end of the sealed structure, and a cooling medium outlet 4 is opened at the other end of the sealed structure. The cooling medium inlet 11 is connected to the flow channel 3, and the flow channel 3 is connected to the cooling medium outlet 4. The manifold channel heat exchange area is arranged opposite to the electronic device 12. During the operation of the electronic device 12, the cooling medium flows into the flow channel 3 from the cooling medium inlet 11. During the flow in the flow channel 3, the cooling medium is diverted by the manifold diversion and convergence structure and the cooling medium is accelerated to flow evenly downward to the manifold channel. In the heat exchange area, after the cooling medium exchanges heat with the manifold channel heat exchange area, the cooled medium is converged through the manifold branching and converging structure. The converged cooling medium then flows through the pin-rib composite heat exchange structure, where it exchanges heat again. After this second heat exchange, the cooled medium flows out from the cooling medium outlet 4, thus carrying away the heat conducted from the electronic device 12 to the lower substrate 7. This improves the heat dissipation effect on the electronic device 12 and reduces the probability of low reliability and poor energy efficiency caused by excessively high temperatures in the electronic device 12. Simultaneously, the manifold branching and converging structure helps improve the uniformity of the cooling medium flow within the manifold channel heat exchange area, thereby improving the uniformity of heat dissipation for the electronic device 12 and reducing the temperature difference between different areas of the electronic device 12. Furthermore, the lower substrate 7 is sealed and fixed to the upper cover plate 1 to prevent leakage of the cooling medium between the upper cover plate 1 and the lower substrate 7. The cooling medium is a 50% ethylene glycol aqueous solution.

[0024] In one embodiment of this application, the flow channel 3 is a U-shaped groove, which is formed on the lower surface of the upper cover plate 1. The U-shaped groove is connected to the cooling medium inlet 11 and the cooling medium outlet 4.

[0025] In one embodiment of this application, during the operation of the electronic device 12, the cooling medium flows into the U-shaped groove from the cooling medium inlet 11. During its flow within the U-shaped groove, the cooling medium is diverted by the manifold diversion and convergence structure, accelerating its uniform downward flow to the manifold channel heat exchange area. After heat exchange between the cooling medium and the manifold channel heat exchange area, the cooled medium is converged by the manifold diversion and convergence structure. The converged cooling medium then flows through the needle-rib composite heat exchange structure, where it again exchanges heat with the needle-rib composite heat exchange structure. After the heat in the heat exchange structure is exchanged again, the cooling medium after the second heat exchange flows out from the cooling medium outlet 4 along the U-shaped groove, thereby carrying away the heat conducted from the electronic device 12 to the lower substrate 7, improving the heat dissipation effect of the electronic device 12, and reducing the probability of low reliability and poor energy efficiency of the electronic device 12 due to excessive temperature. At the same time, the setting of the manifold diversion and convergence structure helps to improve the uniformity of the cooling medium flow in the heat exchange area of ​​the manifold channel, thereby improving the uniformity of heat dissipation of the electronic device 12 and reducing the temperature difference between different areas of the electronic device 12.

[0026] In one embodiment of this application, the manifold branching and merging structure includes: a protrusion 2, the lower surface of which contacts the upper surface of the lower substrate 7; a plurality of branching manifolds 21 and a plurality of merging manifolds 22 are formed on the lower surface of the protrusion 2, the plurality of branching manifolds 21 and the plurality of merging manifolds 22 are arranged alternately; each branching manifold 21 is connected to the heat exchange area of ​​the manifold channel, each branching manifold 21 is connected to the flow channel 3, each merging manifold 22 is connected to the heat exchange area of ​​the manifold channel, and each merging manifold 22 is connected to the flow channel 3.

[0027] In one embodiment of this application, during the operation of the electronic device 12, the cooling medium flows into the U-shaped groove from the cooling medium inlet 11. During the flow within the U-shaped groove, the cooling medium first flows into each branch manifold 21. The uniform arrangement of multiple branch manifolds 21 serves to uniformly distribute the cooling medium, allowing the distributed cooling medium to flow evenly into the heat exchange area of ​​the manifold channel. As the distributed cooling medium diffuses within the heat exchange area of ​​the manifold channel, the diffused cooling medium flows to the position of the manifold 22. The manifold 22 collects the diffused cooling medium, allowing the collected cooling medium to flow out of the heat exchange area of ​​the manifold channel, thereby uniformly removing the heat from the heat exchange area of ​​the manifold channel.

[0028] In one embodiment of this application, the cooling medium inlet 11 is also equipped with an inlet pipe and an inlet pump, and the cooling medium outlet 4 is also equipped with an outlet pipe and an outlet pump. The inlet pump can accelerate the speed at which the cooling medium enters the flow channel 3, and the outlet pump can accelerate the speed at which the collected cooling medium flows out of the manifold channel heat exchange area, the speed at which the collected cooling medium flows through the pin-rib composite heat exchange structure, and the speed at which the collected cooling medium flows out of the flow channel 3. It also reduces the amount of cooling medium that has been heat-exchanged in the manifold channel heat exchange area, the pin-rib composite heat exchange structure, and the flow channel 3, thereby improving the heat exchange efficiency between the cooling medium and the lower substrate 7, and thus improving the heat dissipation effect on the electronic device 12.

[0029] In one embodiment of this application, each branch manifold 21 is a wedge-shaped manifold with a starting end width greater than the ending end width, and each merge manifold 22 is a wedge-shaped manifold with a starting end width less than the ending end width.

[0030] In one embodiment of this application, the area where the manifold branching and converging structure is located is larger than the manifold channel heat exchange area, and the area where the manifold branching and converging structure is located covers the manifold channel heat exchange area. That is, the starting end of each branching manifold 21 is located in front of the manifold channel heat exchange area, the ending end of each branching manifold 21 is located inside the manifold channel heat exchange area, the starting end of each converging manifold 22 is located inside the manifold channel heat exchange area, and the ending end of each converging manifold 22 is located behind the manifold channel heat exchange area.

[0031] In one embodiment of this application, each branch manifold 21 is configured as a wedge-shaped manifold. During the flow of the cooling medium into the heat exchange area of ​​the manifold channel, each branch manifold 21 can perform preliminary rectification and acceleration of the cooling medium, ensuring that the cooling medium can be delivered more uniformly to the heat exchange area of ​​the manifold channel, and effectively reducing the flow dead zone and non-uniformity of the cooling medium. Each confluence manifold 22 is configured as a wedge-shaped manifold, which helps to reduce the resistance of the diffused cooling medium flowing into each confluence manifold 22, improves the confluence effect of the diffused cooling medium, accelerates the flow velocity of the cooling medium in the heat exchange area of ​​the manifold channel, thereby improving the heat exchange effect between the cooling medium and the heat exchange area of ​​the manifold channel.

[0032] In one embodiment of this application, the ratio of the width at the beginning end to the width at the end of each manifold 21 is 1-5. Each manifold 21 can perform preliminary rectification and acceleration of the cooling medium, ensuring that the cooling medium can be delivered more evenly to the heat exchange area of ​​the manifold channel, and effectively reducing the flow dead zone and non-uniformity of the cooling medium.

[0033] In one embodiment of this application, the manifold channel heat exchange area includes: a plurality of parallel heat exchange channels 8, which are disposed on the upper surface of the lower substrate 7, and are connected to each branch manifold 21 and each confluence manifold 22; a plurality of heat exchange components are fixedly disposed on the sidewall of each heat exchange channel 8, each heat exchange component including two oppositely disposed heat exchange units, each heat exchange unit including a plurality of heat exchange protrusions 9; a first gap 81 is left between the two oppositely disposed heat exchange units, and the first gap 81 has a corresponding branch manifold 21; a second gap 82 is left between the two sets of heat exchange components, and the second gap 82 has a corresponding confluence manifold 22.

[0034] In one embodiment of this application, a second gap 82 is also left between the heat exchange component and the side edge of the heat exchange channel 8, and a third gap 83 is left between the heat exchange component and the bottom of the heat exchange channel 8. Under the rectification and acceleration effect of each branch manifold 21, the cooling medium flows downward through the first gap 81 to the heat exchange channel 8, and diffuses laterally in the heat exchange channel 8 through the third gap 83. Then, it flows upward into the manifold 22 through the second gap 82, so as to realize the collection function of the manifold 22 on the diffused cooling medium.

[0035] In one embodiment of this application, the heat exchange region of the manifold channel corresponds to the electronic device 12 with a high heat flux density. The arrangement of the heat exchange channel 8 and the heat exchange components increases the convective heat transfer area and heat transfer rate between the cooling medium and the heat exchange region of the manifold channel. Furthermore, the heat exchange unit induces strong local accelerated flow, aggregation effect, and secondary eddies in the cooling medium during diffusion, drastically disrupting the thermal boundary layer and increasing the local heat transfer coefficient. This efficiently removes the large amount of heat received by the electronic device 12 in the heat exchange region of the manifold channel, achieving high heat flux density... The electronic device 12 dissipates heat, and the diffused cooling medium enters the manifold 22 upward through the second gap 82 and flows into the flow channel 3 along the outlet of the manifold 22, completing the heat dissipation process of the high heat flux density electronic device 12. The above process achieves a 0.25K reduction in temperature difference and a 14-fold reduction in pump power consumption under a heat load of 600W for the high heat flux density electronic device 12. Under high temperature environment (50℃) and 565W heat load conditions, the maximum heat treatment capacity is increased by 32%.

[0036] In one embodiment of this application, the width-to-height ratio of the heat exchange channel 8 ranges from 0.36 to 1.14. The height, size, and shape of the heat exchange protrusions 9 in the heat exchange assembly are set using preset parameters. For example, the preset parameters are obtained by solving a density-based topology optimization method, using the average temperature of the design domain and the inlet / outlet pressure drop as the optimization objective and constraint conditions, respectively.

[0037] In one embodiment of this application, the arrangement direction of the plurality of heat exchange channels 8 is perpendicular to the arrangement direction of the plurality of branch manifolds 21, and the arrangement direction of the plurality of heat exchange channels 8 is perpendicular to the arrangement direction of the plurality of manifolds 22.

[0038] In one embodiment of this application, if each heat exchange channel 8 is arranged longitudinally and the arrangement direction of multiple heat exchange channels 8 is transverse, each branch manifold 21 is arranged transversely and the arrangement direction of multiple branch manifolds 21 is longitudinal, and each manifold 22 is arranged transversely and the arrangement direction of multiple manifolds 22 is longitudinal; or if each heat exchange channel 8 is arranged transversely and the arrangement direction of multiple heat exchange channels 8 is longitudinal, each branch manifold 21 is arranged longitudinally and the arrangement direction of multiple branch manifolds 21 is transverse, and each manifold 22 is arranged longitudinally and the arrangement direction of multiple manifolds 22 is transverse, the above arrangement facilitates the flow of cooling medium into each heat exchange channel 8 under the rectification and acceleration effect of the branch manifold 21, and while diffusing within each heat exchange channel 8, it is also convenient to collect the diffused cooling medium through each manifold 22. Moreover, the wedge-shaped design of the branch manifold 21 can optimize the uniformity of cooling medium flow distribution, ensuring that each heat exchange channel 8 obtains a uniform coolant flow.

[0039] In one embodiment of this application, the needle-rib composite heat exchange structure includes: multiple needle-rib heat exchange zones, each needle-rib heat exchange zone being provided with multiple cylindrical needle ribs 6, and the multiple cylindrical needle ribs 6 being fixedly disposed on the upper surface of the lower substrate 7.

[0040] In one embodiment of this application, the pin-rib heat exchange zone corresponds to a low heat flux density electronic device 12. The low heat flux density electronic device 12 is fixedly mounted on the upper surface of the lower substrate 7. The cooling medium after converging flows through each pin-rib heat exchange zone in sequence and exchanges heat with the low heat flux density electronic device 12 in each pin-rib heat exchange zone, thereby achieving heat dissipation for each low heat flux density electronic device 12. The pin-rib composite heat exchange structure enhances heat exchange by increasing the disturbance of the cooling medium and destroying the flow boundary layer. The cooling medium after heat exchange merges into the cooling medium outlet 4.

[0041] In one embodiment of this application, the number of cylindrical needle ribs 6 provided in each needle rib heat exchange zone is set according to the actual situation. For example, the needle rib heat exchange zone corresponding to the electronic device 12 with a higher heat flux density is provided with a larger number of cylindrical needle ribs 6, while the needle rib heat exchange zone corresponding to the electronic device 12 with a lower heat flux density is provided with a smaller number of cylindrical needle ribs 6.

[0042] In one embodiment of this application, the diameter of each cylindrical needle rib 6 ranges from 1.9mm to 2.1mm, the height of each cylindrical needle rib 6 ranges from 4.7mm to 4.9mm, and the distance between the centers of adjacent cylindrical needle ribs 6 is 3mm to 7mm.

[0043] In one embodiment of this application, the diameter of each cylindrical needle rib 6 is set to be in the range of 1.9mm-2.1mm, the height of each cylindrical needle rib 6 is set to be in the range of 4.7mm-4.9mm, and the distance between the centers of adjacent cylindrical needle ribs 6 is set to be 3mm-7mm. This ensures that the cooling medium after convergence can pass smoothly through the heat exchange zone of each needle rib and fully exchange heat with the cylindrical needle ribs 6 in the heat exchange zone of each needle rib.

[0044] In one embodiment of this application, a cooling medium inlet 11 is opened at one end of the lower substrate 7, and a cooling medium outlet 4 is opened at the other end of the lower substrate 7. An inlet reservoir 10 is opened at the end of the lower substrate 7 near the cooling medium inlet 11, and the cooling medium inlet 11 is connected to the inlet reservoir 10. An outlet reservoir 5 is opened at the end of the lower substrate 7 near the cooling medium outlet 4, and the cooling medium outlet 4 is connected to the outlet reservoir 5. Both the inlet reservoir 10 and the outlet reservoir 5 are connected to the flow channel 3.

[0045] In one embodiment of this application, during the operation of the electronic device 12, the cooling medium flows from the cooling medium inlet 11 into the inlet reservoir 10 and then into the flow channel 3. During its flow within the flow channel 3, the cooling medium is diverted by the manifold diversion and convergence structure, accelerating its uniform downward flow to the manifold channel heat exchange area. After heat exchange between the cooling medium and the manifold channel heat exchange area, the cooled medium is converged by the manifold diversion and convergence structure. The converged cooling medium then flows through the pin-rib composite heat exchange structure, where it again exchanges heat with the heat in the pin-rib composite heat exchange structure. This process of heat exchange between the converged cooling medium and the heat in the pin-rib composite heat exchange structure is repeated once more. After the heat exchange, the cooling medium, having undergone another heat exchange, flows into the outlet reservoir 5 and then out through the cooling medium outlet 4, thereby carrying away the heat conducted from the electronic device 12 to the lower substrate 7. This improves the heat dissipation effect on the electronic device 12 and reduces the probability of low reliability and poor energy efficiency caused by excessively high temperatures in the electronic device 12. At the same time, the manifold branching and converging structure helps to improve the uniformity of the cooling medium flow in the heat exchange area of ​​the manifold channel, thereby improving the uniformity of heat dissipation on the electronic device 12 and reducing the temperature difference between different areas of the electronic device 12. In addition, the lower substrate 7 is sealed and fixed to the upper cover plate 1 to prevent the cooling medium from leaking between the upper cover plate 1 and the lower substrate 7.

[0046] In one embodiment of this application, after the cooling medium undergoes heat exchange again, it flows out of the cooling medium outlet 4 and enters the external circulation system for cooling. It then enters the flow channel 3 again from the cooling medium inlet 11 to circulate and cool the electronic device 12.

[0047] In one embodiment of this application, the cooling medium inlet 11 is designed to ensure that the cooling medium can flow smoothly into the inlet storage tank 10. The inlet storage tank 10 serves as a buffer area to control the pressure and flow rate of the cooling medium, preparing it for subsequent entry into the sealing structure. The outlet storage tank 5 is used to collect the cooling medium after heat exchange and guide the collected cooling medium to flow smoothly out of the sealing structure through the cooling medium outlet 4.

[0048] Compared with the flow channel structure of the Pin-fin cold plate in related technologies, the heat dissipation device (Opt_Top_MMC cold plate, i.e., the optimized topology manifold microchannel) in this application achieves graded flow distribution of the cooling medium through the setting of manifold diversion and convergence structure, manifold channel heat exchange area, and pin-fin composite heat exchange structure. This allows for precise matching of cooling capacity and heat dissipation distribution. Actual measurements show that when the Opt_Top_MMC cold plate dissipates heat from the main chip under a 600W heat load, the temperature difference of the main chip is reduced by 0.25K compared to when the Pin-fin cold plate dissipates heat from the main chip under a 600W heat load. This alleviates the problem of poor reliability of electronic devices 12 caused by uneven temperature in multi-heat source scenarios.

[0049] This application, through the configuration of the manifold diversion and convergence structure, the manifold channel heat exchange area, and the pin-fin composite heat exchange structure, makes the shape of the flow channel 3 conform to the laws of fluid dynamics, significantly reducing unnecessary local resistance losses during the flow of the cooling medium. Under the same heat dissipation requirements and flow rate, the power consumption of the Opt_Top_MMC cold plate pump is reduced to 1 / 14 of that of the Pin-fin cold plate, thereby greatly reducing the operating cost of the cooling system and improving the energy efficiency ratio of the heat dissipation device.

[0050] This application sets up a manifold channel heat exchange area at the location of the high heat flux density electronic device 12, which greatly enhances the heat exchange effect on the high heat flux density electronic device 12. A pin-fin composite heat exchange structure is set at the location of the low heat flux density electronic device 12. This structural setting makes the overall heat transfer coefficient of the Opt_Top_MMC cold plate significantly higher than that of the Pin-fin cold plate in related technologies, and can withstand a higher critical heat flux density. Under high temperature environment (50℃) and 565W heat load conditions, the maximum heat treatment capacity of the Opt_Top_MMC cold plate is increased by 32%.

[0051] The structural design in this application has the synergistic advantages of "high-efficiency heat dissipation" and "low flow resistance", achieving a leap in performance. The overall energy efficiency ratio (COP) of the Opt_Top_MMC cold plate is 11 times higher than that of the Pin-fin cold plate in related technologies. This means that more heat can be removed while consuming the same pump power, or less pump power is consumed while dissipating the same amount of heat, which is particularly in line with the stringent energy consumption requirements of automotive systems.

[0052] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A heat dissipation device integrating a manifold channel and a pin-fin composite structure, characterized in that, The heat dissipation device includes: The upper cover plate and the lower substrate plate are used to support electronic devices and receive heat conducted by the electronic devices. The upper cover plate and the lower substrate are sealed together to form a sealed structure. The sealed structure is provided with a flow channel for the cooling medium to flow, a manifold diversion and convergence structure for the cooling medium to divert and converge, a manifold channel heat exchange area for the cooling medium to exchange heat with the lower substrate, and a pin-rib composite heat exchange structure. The manifold diversion and convergence structure is arranged opposite to the manifold channel heat exchange area. The sealing structure has a cooling medium inlet at one end and a cooling medium outlet at the other end. The cooling medium inlet is connected to the flow channel, and the flow channel is connected to the cooling medium outlet.

2. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 1, characterized in that, The flow channel is a U-shaped groove, which is formed on the lower surface of the upper cover plate. The U-shaped groove is connected to the cooling medium inlet and the cooling medium outlet.

3. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 1, characterized in that, The manifold branching and merging structure includes: The bump has its lower surface in contact with the upper surface of the lower substrate. The lower surface of the bump is provided with multiple branch manifolds and multiple convergent manifolds, which are arranged alternately. Each branch manifold is connected to the heat exchange area of ​​the manifold channel, and each branch manifold is connected to the flow channel.

4. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 3, characterized in that, Each branch manifold is a wedge-shaped manifold with a starting end width greater than the ending end width, and each merge manifold is a wedge-shaped manifold with a starting end width less than the ending end width.

5. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 4, characterized in that, The ratio of the width at the beginning to the width at the end of each branch manifold is 1-5.

6. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 3, characterized in that, The heat exchange area of ​​the manifold channel includes: Multiple heat exchange channels are arranged in parallel, and multiple heat exchange channels are disposed on the upper surface of the lower substrate. Multiple heat exchange channels are connected to each branch manifold and multiple heat exchange channels are connected to each junction manifold. Multiple sets of heat exchange components are fixedly installed on the side wall of each heat exchange channel. Each set of heat exchange components includes two heat exchange units arranged opposite each other. Each heat exchange unit includes multiple heat exchange protrusions. A first gap is provided between two heat exchange units arranged opposite each other, and the first gap has a corresponding branch manifold; a second gap is provided between two sets of heat exchange components, and the second gap has a corresponding merge manifold.

7. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 6, characterized in that, The arrangement direction of multiple heat exchange channels is perpendicular to the arrangement direction of multiple branch manifolds, and the arrangement direction of multiple heat exchange channels is perpendicular to the arrangement direction of multiple manifolds.

8. The heat dissipation device with an integrated manifold channel and pin-rib composite structure according to any one of claims 1-7, characterized in that, The needle-rib composite heat exchange structure includes: multiple needle-rib heat exchange zones, each needle-rib heat exchange zone is provided with multiple cylindrical needle ribs, and the multiple cylindrical needle ribs are fixedly disposed on the upper surface of the lower substrate.

9. The heat dissipation device with integrated manifold channel and pin-rib composite structure according to claim 8, characterized in that, The diameter of each cylindrical needle rib ranges from 1.9mm to 2.1mm, the height of each cylindrical needle rib ranges from 4.7mm to 4.9mm, and the distance between the centers of adjacent cylindrical needle ribs ranges from 3mm to 7mm.

10. The heat dissipation device with an integrated manifold channel and pin-rib composite structure according to any one of claims 1-7, characterized in that, The cooling medium inlet is located at one end of the lower substrate, and the cooling medium outlet is located at the other end of the lower substrate. An inlet reservoir is provided at the end of the lower substrate near the cooling medium inlet, and the cooling medium inlet is connected to the inlet reservoir. An outlet reservoir is provided at the end of the lower substrate near the cooling medium outlet, and the cooling medium outlet is connected to the outlet reservoir. Both the inlet reservoir and the outlet reservoir are connected to the flow channel.

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