Foldable multi-pin LED packaging support structure

Abstract

The invention discloses a foldable multi-pin LED packaging support structure, and relates to the technical field of packaging supports, the foldable multi-pin LED packaging support structure comprises a substrate, one side of the substrate is provided with a cup body used for accommodating an LED chip, and the substrate is integrated with a function change-over switch; the pin structure is arranged on one side, back on to the cup body, of the substrate, and the pin structure comprises a common pin, three control pins, a multifunctional pin and a function fixing pin; according to the foldable multi-pin LED packaging support structure, through the collaborative design of introducing the function change-over switch and the multifunctional pins, on the premise that the total number of physical pins is not increased, configurable switching of a single-pin function between LED driving and external function expansion is achieved, flexible function expansion capacity and high design universality are given to LED packaging, and the foldable multi-pin LED packaging support structure is suitable for being used for LED packaging. And the development trend of miniaturization and high-density integration of electronic equipment is met.

Description

Technical Field

[0001] This invention relates to the field of packaging bracket technology, and more specifically to a foldable multi-pin LED packaging bracket structure. Background Technology

[0002] In the field of electronic packaging and microelectronic interconnects, as the trend of product miniaturization and high-density integration becomes increasingly prominent, the requirements for welding processes are also becoming more and more stringent.

[0003] Traditional LED package brackets typically have fixed pin functions. For example, a common pin is used for power input, and control pins (such as R, G, and B pins) are used for color and brightness adjustment. Each pin has a one-to-one fixed connection with the internal circuitry. While this architecture is mature and reliable, it lacks flexibility. When products need to integrate additional functions, such as ambient light sensing, temperature monitoring, or communication interfaces, it is often necessary to add extra dedicated pins. This leads to increased package size, structural complexity, and cost, which contradicts the current trend of miniaturization and high-density integration in electronic products. Therefore, this invention provides a foldable multi-pin LED package bracket structure. Summary of the Invention

[0004] The purpose of this invention is to provide a foldable multi-pin LED package support structure to address the limitations of traditional LED package supports in the prior art, where pin functions are mostly fixed. For example, a common pin is used for power input, and control pins (such as R, G, and B pins) are used for color and brightness adjustment, with each pin forming a one-to-one fixed connection with the internal circuitry. While this architecture is mature and reliable, it lacks flexibility. When products need to integrate additional functions, such as ambient light sensing, temperature monitoring, or communication interfaces, it is often necessary to add extra dedicated pins. This leads to increased package size, structural complexity, and cost, contradicting the current trend of miniaturization and high-density integration in electronic products.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a foldable multi-pin LED packaging bracket structure, comprising:

[0006] A substrate, one side of which is provided with a cup for accommodating LED chips, and a function switch is integrated on the substrate;

[0007] A pin structure is provided on the side of the substrate facing away from the cup body. The pin structure includes a common pin, three control pins, a multi-function pin, and a fixed-function pin.

[0008] The common pin, the three control pins, and the functional fixed pin are all fixedly electrically connected to the inside of the cup body;

[0009] The multi-function pin selectively switches the electrical connection path via the function switching switch:

[0010] In the first switching state, the multi-functional pin is electrically connected to the first driving circuit node inside the cup body to serve as the driving pin for the LED chip.

[0011] In the second switching state, the multi-function pin is electrically connected to an independently provided functional expansion terminal on the substrate to serve as a signal pin for connecting external functional devices.

[0012] Furthermore, all the pin structures are folded, with their ends facing the center of the substrate.

[0013] Furthermore, the function switching switch is a programmable fuse or a memory-based electronic switch, used to switch the electrical path of the multi-function pin through an electrical signal.

[0014] Furthermore, the functional extension end is a metallized pad disposed on the substrate.

[0015] Furthermore, the common pin is L-shaped, with its longitudinal portion corresponding to one side of the cup body on the substrate, and the arrangement direction of the control pin, multi-function pin and function fixed pin is perpendicular to the longitudinal portion of the common pin.

[0016] Furthermore, the substrate has a groove on the side facing away from the cup body for placing the pin structure, so that the folded pin structure is flush with the bottom surface of the substrate.

[0017] Furthermore, the inner wall of the cup is provided with a reflective coating, and the internal cavity of the cup is funnel-shaped.

[0018] Furthermore, external functional devices are mounted on the functional extension terminal.

[0019] Furthermore, the configuration terminal of the function switch is electrically connected to the control pin or the common pin through a trace inside the substrate, and is used to receive configuration signals sent by an external controller.

[0020] Compared with existing technologies, the foldable multi-pin LED package support structure provided by this invention, through the introduction of a function switching switch and the collaborative design of multi-functional pins, enables configurable switching of a single pin function between LED driving and external function expansion without increasing the total number of physical pins. It fundamentally solves the key technical problem of increased package size, structural complexity and cost caused by the need to add dedicated pins when integrating new functions such as ambient light sensing and temperature monitoring in traditional fixed-pin architectures. It endows LED packages with flexible functional expansion capabilities and high design versatility, meeting the development trend of miniaturization and high-density integration of electronic devices. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;

[0023] Figure 2 This invention provides a structural schematic diagram from another perspective for embodiments of the invention;

[0024] Figure 3 A top view provided for an embodiment of the present invention;

[0025] Figure 4 A bottom view provided for an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the pin structure provided in an embodiment of the present invention;

[0027] Figure 6 This is a cross-sectional schematic diagram provided for an embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Base plate; 2. Cup body;

[0030] 3. Pin structure; 301, Common pin; 302, Control pin; 303, Multi-function pin; 304, Fixed-function pin;

[0031] 4. Function switch; 5. Function extension end; 6. Groove; 7. Reflective coating. Detailed Implementation

[0032] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] As attached Figure 1 To be continued Figure 6 As shown:

[0034] Example 1:

[0035] The present invention provides a foldable multi-pin LED packaging bracket structure, including a substrate 1. A cup 2 for accommodating LED chips is provided on one side of the substrate 1. The cup 2 is formed by etching, stamping or injection molding, etc., and its shape and size are designed according to the optical characteristics of the LED chip to optimize the light output efficiency. A function switching switch 4 is integrated on the substrate 1. The switch is an electronically configurable switch based on semiconductor technology.

[0036] The pin structure 3 is disposed on the side of the substrate 1 facing away from the cup body 2. The pin structure 3 includes a common pin 301, three control pins 302, a multi-function pin 303, and a function fixed pin 304.

[0037] The common pin 301, the three control pins 302, and the functional fixed pin 304 are all electrically connected to the inside of the cup body 2. The common pin 301 is typically connected to the common anode or cathode of the LED driver, providing a unified power reference point for all LED color channels. It is directly bonded to the common electrode area inside the cup body 2 through low-impedance metallized traces or lead frames inside the substrate 1. This fixed and direct connection ensures the stability of the power path and the high current carrying capacity, serving as the power reference and main heat dissipation path for the entire LED driver circuit. The three control pins 302 correspond to the red, green, and blue color channels of the LED chip, respectively, and are used to independently receive current or PWM signals provided by the external driver circuit to precisely control the luminous intensity and timing of each channel, thereby achieving full-color mixing, brightness adjustment, and dynamic display effects. Each control pin 302 is directly connected to the common electrode area inside the substrate 1 through an independent conductive line. Dedicated electrodes connected to the corresponding color LED chips inside the cup body 2 ensure that the control signals of each color channel do not interfere with each other, resulting in high signal integrity, which is the foundation for achieving accurate color reproduction and dimming. The fixed function pin 304 is predefined to perform a specific auxiliary function, and it forms a permanent electrical connection with the specific function pins of the integrated circuit or driver chip inside the cup body 2. For example, this pin can be fixed as an overall enable pin to receive external high and low level signals to globally turn the LED on or off; or as a dimming frequency synchronization pin to receive external PWM signals to achieve brightness synchronization control between multiple devices; or as a fault flag output pin to provide a status alarm signal to the external system when the driver circuit detects abnormalities such as over-temperature or over-current. The fixed function design of this pin provides a stable and reliable basic control or status feedback interface for the system, forming an indispensable part of the core functional architecture of the package.

[0038] The multi-function pin 303 selectively switches the electrical connection path via the function switch 4:

[0039] In the first switching state, the multi-function pin 303 is electrically connected to the first driving circuit node inside the cup body 2 to serve as the driving pin for the LED chip.

[0040] In the second switching state, the multi-function pin 303 is electrically connected to the independently provided functional expansion terminal 5 on the substrate 1 to serve as a signal pin for connecting external functional devices.

[0041] Specifically, the function switch 4 controls the physical connection switching of this pin between two preset circuit networks, thereby changing its electrical function and signal transmission target.

[0042] In the first switching state: the multi-function pin 303 is used as a driver pin of the LED chip, enabling it to transmit control signals required for LED driving, such as current or PWM signals, thereby participating in the control of LED light emission. For example, if this node is connected to the driver circuit of a white LED chip, the multi-function pin 303 can be used as the control pin for the white channel, enabling the entire package to have RGBW four-color light emission capability, expanding its color performance or brightness output.

[0043] Second switching state: In this state, the function of multifunction pin 303 is transformed into a signal pin for connecting external functional devices, i.e., a general-purpose input / output interface. This means the pin is no longer connected to the LED driver circuit but serves as a communication channel with external devices. For example, a user can mount a miniature temperature sensor on the functional expansion terminal 5, and multifunction pin 303 can then be used to read the sensor's data signal; if an ambient light sensor is mounted, it can be used to read the ambient brightness signal. Through this switching, the same package structure can be upgraded from a pure light-emitting device to an intelligent module integrating sensing and other additional functions without changing the hardware layout.

[0044] In one embodiment of the present invention, all pin structures 3 are folded, with their ends pointing towards the center of the substrate 1. Specifically, after the lead frame is stamped or during the later stages of the packaging process, each pin is bent from its root, which connects to the side of the substrate 1, using a precision bending process. This causes the main body of the pin, which originally extended outward perpendicular to the plane of the substrate 1, to face downward towards the substrate 1, and the free end (i.e., the soldering end) of the pin to point towards the geometric center of the substrate 1. This centripetal folding layout allows the soldering ends of all pins to be concentrated within the projection area of ​​the bottom surface of the substrate 1, thereby significantly reducing the pad layout area required for the package on the printed circuit board while ensuring electrical connection reliability. This is particularly beneficial for high-density mounting applications, allowing multiple LED packages to be arranged with smaller spacing, increasing the number of devices per unit area. At the same time, the pin ends pointing towards the center also optimizes the symmetry of the signal path, helping to reduce crosstalk between different driving channels.

[0045] In one embodiment of the present invention, a groove 6 for placing the pin structure 3 is also provided on the side of the substrate 1 facing away from the cup body 2, so that the folded pin structure 3 is flush with the bottom surface of the substrate 1. Specifically, the groove 6 is formed in the substrate material by etching, mechanical milling or molding processes, and its depth is precisely calculated to be slightly greater than or equal to the thickness of the folded pin structure 3. When the pin is folded, its main body can be embedded and accommodated in the corresponding groove 6, so that the upper surface of the folded pin structure 3 does not protrude from the bottom surface of the substrate 1, thereby minimizing the overall thickness of the package and forming an ultra-thin package shape. This not only further meets the requirements of thinner and lighter electronic devices, but also allows the bottom surface of the package to fit tightly against the PCB board after mounting, improving mechanical stability and heat dissipation. The groove structure also plays a role in positioning and protecting the folded pins, preventing pin deformation due to collisions during subsequent handling or mounting, and ensuring production yield and long-term reliability.

[0046] In one embodiment of the present invention, the function switching switch 4 is a programmable fuse or a memory-based electronic switch, used to switch the electrical path of the multi-function pin 303 through an electrical signal.

[0047] Specifically, it should be noted that the function switch 4 executes the switching action by receiving an external configuration signal, and its switching mechanism varies depending on the type of switch:

[0048] For programmable fuse solutions: During packaging manufacturing or product assembly, a high-voltage or high-current pulse is applied to a designated configuration port. This pulse permanently melts the fuse element preset on a certain connection path, thus physically disconnecting that path. Simultaneously, the fuse on the other path remains intact or is programmed to be on via an anti-fuse mechanism, thereby completing a one-time, irreversible path selection. For example, if the multi-function pin 303 needs to be configured as a driver pin (first state), the fuse connected to the function extension terminal 5 is melted, while ensuring that the path connected to the first driver circuit node is unobstructed.

[0049] For the memory-based electronic switch solution: the switch integrates a miniature non-volatile memory cell and an electronic switch array controlled by the output of this memory cell. When an external controller writes a digital signal representing the target state (such as logic "0" or "1") to the configuration terminal of the function switching switch 4 via a specific communication protocol or voltage timing, this signal is stored in the memory cell. The output level of the memory cell then controls the on and off states of the electronic switch array, thereby switching the electrical connection of the multi-function pin 303 to the corresponding target path. This solution allows for multiple rewrites via electrical signals, enabling dynamic reconfiguration of the function.

[0050] In one embodiment of the present invention, the configuration terminal of the function switch 4 is electrically connected to the control pin 302 or the common pin 301 through the internal wiring of the substrate 1, for receiving configuration signals sent by an external controller. Specifically, the substrate 1 adopts an embedded wiring process, and a dedicated conductive channel is pre-set inside the substrate 1 from the configuration signal input port (configuration terminal) of the function switch 4 to the selected function pin, such as a specific control pin 302 or common pin 301. This means that the control signal used to switch the function of the multi-function pin 303 is not introduced through an additional dedicated configuration pin, but cleverly reuses an existing pin with signal transmission capability. In actual operation, when the system is powered on and initialized or enters a specific configuration mode, the external controller will send a set of predefined voltage pulse sequences or digital encoded commands to the function switch 4 through this reused pin. After the decoding and control circuit inside the function switch 4 recognizes the command, it executes the corresponding internal switching action, thereby completing the setting of the connection path of the multi-function pin 303. This pin-reuse configuration scheme enables flexible control of the internal function switch 4 without increasing the total number of package pins or the complexity of external connections.

[0051] In one embodiment of the present invention, the functional expansion end 5 is a metallized pad disposed on the substrate 1. Specifically, the metallized pad is connected to the corresponding port of the function switching switch 4 through conductive vias or traces inside the substrate 1. This metallized pad serves as a physical carrier and electrical interface, enabling external functional devices to be directly integrated onto the LED package bracket, providing a standardized hardware expansion platform for realizing composite functional modules such as "LED + sensing".

[0052] In one embodiment of the present invention, the common pin 301 is L-shaped, and its longitudinal portion is disposed on one side of the cup body 2 on the substrate 1. The arrangement direction of the control pin 302, the multi-function pin 303 and the function fixed pin 304 is perpendicular to the longitudinal portion of the common pin 301.

[0053] In one embodiment of the present invention, the inner wall of the cup body 2 is provided with a reflective coating 7, and the internal cavity of the cup body 2 is funnel-shaped. Specifically, the cup body 2 is etched or molded onto the substrate 1, and its internal cavity shape is designed as an flared type with a larger opening at the top and a smaller opening at the bottom, i.e., funnel-shaped. This geometry helps to more effectively reflect and guide the light emitted by the LED chip that points to the side towards the light outlet, while also expanding the light emission angle and making the light spot distribution more uniform. After the cup body structure is formed, a layer of high reflectivity material is uniformly covered on its entire inner wall surface as a reflective coating 7 through processes such as electroplating, vacuum evaporation, or spraying. This reflective coating 7 can efficiently reflect the light emitted by the LED chip that is not directly emitted, thereby significantly improving the light extraction efficiency and reducing the light absorption loss inside the package.

[0054] In one embodiment of the present invention, external functional devices are mounted on the functional expansion terminal 5. Specifically, the external functional devices may include, but are not limited to, temperature sensor chips, digital temperature sensor chips, ambient light sensor chips, and humidity sensor chips. These devices are directly integrated onto the metallized pads of the functional expansion terminal 5 using surface mount technology, and interact with external systems for data exchange or status feedback through multi-functional pins 303, thereby realizing the transformation of traditional LED packaging from a single light-emitting function to an integrated intelligent device of "sensing-communication-light emission".

[0055] Example 2:

[0056] This embodiment is basically the same as the previous embodiment, except that it has been optimized for the specific application scenario of smart home and IoT node lighting.

[0057] In smart home systems, lighting devices not only need to provide basic illumination but are also often required to serve as environmental information sensing nodes and end units for data transmission. For example, smart ceiling lights, downlights, or light strips typically need to integrate functions such as presence sensing (e.g., infrared or millimeter-wave radar sensing), ambient light adaptive dimming, and low-power wireless communication. Using traditional solutions, these functions would require separate sensor and communication modules on the luminaire's PCB board, resulting in a complex, bulky, and costly system with difficulties in signal interference and coordination between modules. Therefore, for such scenarios, the LED light source package itself needs to possess high integration, low power consumption, strong anti-interference capabilities, and standardized expansion interfaces.

[0058] It should be further noted that all standard parts used in this invention can be purchased from the market, and the specific connection methods of each part adopt conventional methods such as bolts and welding that are mature in the prior art. The machinery, parts, and equipment all adopt conventional models in the prior art, and the circuit connections adopt conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification are all prior art known to those skilled in the art.

[0059] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A foldable multi-lead LED package support structure, characterized by, The utility model relates to a kind of LED driver, including: Substrate (1), one side of the substrate (1) is provided with cup (2) for accommodating LED chip, a function switching switch (4) is integrated on the substrate (1); Pin structure (3) is arranged on the side of the substrate (1) away from the cup (2), and the pin structure (3) includes a common pin (301), three control pins (302), a multifunction pin (303) and a function fixed pin (304); Wherein, the common pin (301), three control pins (302) and function fixed pin (304) are all formed with fixed electrical connection inside the cup (2); The multifunction pin (303) realizes selective switching of electrical connection path by the function switching switch (4): In the first switching state, the multifunction pin (303) is electrically connected to the first drive circuit node inside the cup (2) to serve as the drive pin of LED chip; In the second switching state, the multifunction pin (303) is electrically connected to the function expansion end (5) independently arranged on the substrate (1) to serve as the signal pin connected with external functional device.

2. The foldable multi-lead LED package support structure of claim 1, wherein, The pin structure (3) is all in folded state, and its end is towards the center position of substrate (1).

3. The foldable multi-lead LED package support structure of claim 1, wherein, The function switching switch (4) is one of programmable fuse or memory-based electronic switch, for realizing electrical path switching of the multifunction pin (303) by electrical signal.

4. The foldable multi-lead LED package support structure of claim 1, wherein, The function expansion end (5) is a metallized pad arranged on the substrate (1).

5. The foldable multi-lead LED package support structure of claim 1, wherein, The common pin (301) is in "L" shape, and its longitudinal part is arranged on the side of the cup (2) on the substrate (1), and the arrangement direction of the control pin (302), multifunction pin (303) and function fixed pin (304) is perpendicular to the longitudinal part of the common pin (301).

6. The foldable multi-lead LED package support structure of claim 1, wherein, The side of the substrate (1) away from the cup (2) is also provided with recess (6) for placing the pin structure (3), so that the folded pin structure (3) is flush with the bottom surface of the substrate (1).

7. The foldable multi-lead LED package support structure of claim 1, wherein, The inner wall of the cup (2) is provided with reflective coating (7), and the internal cavity of the cup (2) is in horn shape.

8. The foldable multi-lead LED package support structure of claim 1, wherein, External functional device is attached on the function expansion end (5).

9. The foldable multi-lead LED package support structure of claim 1, wherein, The configuration end of the function switching switch (4) is electrically connected with the control pin (302) or the common pin (301) by the wiring inside the substrate (1), for receiving the configuration signal sent by external controller.

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