Organic light-emitting element and manufacturing method thereof

Abstract

An organic light-emitting element comprises a substrate, a first bottom electrode, a first organic light-emitting layer, a second organic light-emitting layer, a first top electrode, a second top electrode, a first covering layer and a second covering layer. The first organic light-emitting layer and the second organic light-emitting layer are located on the first bottom electrode. The first top electrode and the second top electrode are located on the first organic light-emitting layer and the second organic light-emitting layer respectively, and the extending direction of the first top electrode and the extending direction of the second top electrode are substantially perpendicular to the extending direction of the first bottom electrode. The first covering layer and the second covering layer are located on the first top electrode and the second top electrode respectively, and the first covering layer and the second covering layer are separated from each other.

Description

Technical Field

[0001] This disclosure relates to an organic light-emitting element and a method for fabricating the same, particularly to an organic light-emitting element comprising an organic light-emitting diode (OLED) structure and a method for fabricating the same. Background Technology

[0002] Currently, the fine metal mask (FMM) is commonly used for the coating of the light-emitting layer of organic light-emitting elements, or a white light source with a color filter is used in the process. However, the pixel sharpness or resolution produced by the above processes is not good. Summary of the Invention

[0003] In this disclosure, an organic light-emitting element includes a substrate, a first bottom electrode, a first organic light-emitting layer, a second organic light-emitting layer, a first top electrode, a second top electrode, a first capping layer, and a second capping layer. The first and second organic light-emitting layers are located on the first bottom electrode. The first and second top electrodes are located on the first and second organic light-emitting layers, respectively, with the extension directions of the first and second top electrodes being substantially perpendicular to the extension direction of the first bottom electrode. The first and second capping layers are located on the first and second top electrodes, respectively, and are separated from each other.

[0004] In this disclosure, a method for fabricating an organic light-emitting element includes: providing a substrate; disposing a first bottom electrode on the substrate; forming an organic light-emitting layer structure on the first bottom electrode; forming a top electrode material layer on the organic light-emitting layer structure; forming a cover material layer on the top electrode material layer; and performing a separation step to separate the cover material layer into a first cover layer and a second cover layer that are separated from each other.

[0005] In some embodiments, the organic light-emitting element further includes a top encapsulation layer that extends continuously over the first cover layer and the second cover layer.

[0006] In some embodiments, the organic light-emitting element further includes an insulating bump located on the substrate and partially covering the first bottom electrode, wherein a portion of the top encapsulation layer extends between the first and second cover layers and contacts the insulating bump.

[0007] In some embodiments, the first organic light-emitting layer and the second organic light-emitting layer are in contact with the top encapsulation layer and are separated from each other through the top encapsulation layer.

[0008] In some embodiments, the first cover layer and the second cover layer are separated from each other by a top encapsulation layer.

[0009] In some embodiments, the first cover layer includes a first capping layer and a first encapsulation layer located on the first capping layer, the second cover layer includes a second capping layer and a second encapsulation layer located on the second capping layer, and the first encapsulation layer and the second encapsulation layer contact the top encapsulation layer and are separated from each other through the top encapsulation layer.

[0010] In some embodiments, the first top electrode and the second top electrode are in contact with the top encapsulation layer and are separated from each other through the top encapsulation layer.

[0011] In some embodiments, the organic light-emitting element further includes an insulating bump located on the substrate and partially covering the first bottom electrode, wherein the first cover layer and the second cover layer are spaced apart from each other, and a portion of the insulating bump is exposed from the space.

[0012] In some embodiments, the insulating bump has a groove that communicates with space.

[0013] In some embodiments, the organic light-emitting element further includes a top encapsulation layer that extends continuously over the first and second cover layers and into the space and trench.

[0014] In some embodiments, the sidewalls of the trench are recessed relative to the sidewalls of the first organic light-emitting layer.

[0015] In some embodiments, the sidewalls of the first organic light-emitting layer are recessed relative to the sidewalls of the trench.

[0016] In some embodiments, the sidewalls of the first organic light-emitting layer are recessed relative to the sidewalls of the first cover layer.

[0017] In some embodiments, the sidewalls of the first organic light-emitting layer are recessed relative to the sidewalls of the first top electrode.

[0018] In some embodiments, the method of fabricating an organic light-emitting element further includes forming a top encapsulation layer that extends continuously over a first cover layer and a second cover layer.

[0019] In some embodiments, the method of fabricating an organic light-emitting element further includes: separating the top electrode material layer into a first top electrode and a second top electrode that are separated from each other by a separation step before forming the top encapsulation layer.

[0020] In some embodiments, the method of fabricating an organic light-emitting element further includes: separating the organic light-emitting layer structure into a first organic light-emitting layer and a second organic light-emitting layer that are separated from each other by a separation step before forming the top encapsulation layer.

[0021] In some embodiments, the method for fabricating an organic light-emitting element further includes: before performing a separation step, setting a patterned photosensitive layer on a cover material layer; and after performing a separation step, removing the patterned photosensitive layer by a wet etching step, wherein the wet etching step further removes a portion of the first organic light-emitting layer and a portion of the second organic light-emitting layer, such that the sidewalls of the first organic light-emitting layer and the sidewalls of the second organic light-emitting layer are recessed relative to the sidewalls of the first cover layer.

[0022] In some embodiments, the method of fabricating an organic light-emitting element further includes: forming insulating bumps on a substrate and partially covering a first bottom electrode, wherein a separation step further removes a portion of the insulating bumps. Attached Figure Description

[0023] Figure 1 This is a top view illustrating the intermediate products of an organic light-emitting element.

[0024] Figure 2A Here is a cross-sectional view of an organic light-emitting element.

[0025] Figure 2B Here is a cross-sectional view of an organic light-emitting element.

[0026] Figure 2C Here is a cross-sectional view of an organic light-emitting element.

[0027] Figure 2D Here is a cross-sectional view of an organic light-emitting element.

[0028] Figure 2E Here is a cross-sectional view of an organic light-emitting element.

[0029] Figures 3A to 3E The illustration depicts a method for fabricating an organic light-emitting element according to some embodiments. Detailed Implementation

[0030] Figure 1 This is a top view illustrating an intermediate product of an organic light-emitting element 10. The organic light-emitting element 10 may include a light-emitting layer 20 and a cover structure 40A located above the light-emitting layer 20. For the light-emitting layer 20, a spacer structure 30 may be designed to provide an array of recesses for accommodating an array of light-emitting pixels. In some embodiments, the spacer structure 30 serves as a pixel-defined layer (PDL). In some embodiments, the spacer structure 30 may include bumps 310. In some embodiments, the bumps 310 define pixel regions. In some embodiments, the spacer structure 30 may include a photosensitizing material.

[0031] like Figure 1As shown, the organic light-emitting element 10 may further include an electrode 215 (or bottom electrode) and an electrode 216 (or top electrode). In some embodiments, electrode 215 is an anode, and electrode 216 is an anode. In some embodiments, the organic light-emitting element 10 may include a plurality of electrodes 215 and a plurality of electrodes 216, such as electrodes 215a, 215b and electrodes 216a, 216b. In some embodiments, the extending direction DR2 of electrode 215 is substantially perpendicular to the extending direction DR1 of electrode 216.

[0032] Figure 2A A cross-sectional view of an organic light-emitting element 10A is shown as an example. In some embodiments, Figure 2A For example, along Figure 1 A cross-sectional view of line A-A' in some embodiments. Figure 2A For example, along Figure 1 The diagram shows a cross-sectional view along line A-A', illustrating only the light-emitting area. The spacer structure 30 has several protrusions 310 to define the light-emitting pixel pattern. Recesses are located between two adjacent protrusions 310 and provide space to accommodate the light-emitting pixels. Those skilled in the art will understand from... Figure 2A From the cross-sectional view, protrusion 310 is drawn as a broken section, but from... Figure 1 As can be seen from the top view, they can be connected to each other via other parts of the spacer structure 30.

[0033] like Figure 2A As shown, in some embodiments, the organic light-emitting element 10 is, for example, a light-emitting element comprising an organic light-emitting diode (OLED) structure. In some embodiments, the organic light-emitting element 10 comprises a plurality of organic light-emitting units (or light-emitting pixels), for example, comprising at least organic light-emitting unit 101 (or first organic light-emitting unit) and organic light-emitting unit 102 (or second organic light-emitting unit). In some embodiments, organic light-emitting units 101 and 102 are located between bumps 310 and above substrate 100. Organic light-emitting units 101 and 102 may emit light of the same wavelength or light of different wavelengths.

[0034] In some embodiments, the organic light-emitting element 10 includes a substrate 100, an electrode 215a (or a first bottom electrode), an electrode 216a (or a first top electrode), an electrode 216b (or a second top electrode), a light-emitting layer 20, a spacer structure 30 (or a pixel definition layer), and a cover structure 40A.

[0035] In some embodiments, substrate 100 may include a transistor array configured to correspond to light-emitting pixels in light-emitting layer 20. Substrate 100 may include a plurality of capacitors. In some embodiments, more than one transistor is configured to form a circuit with a capacitor and a light-emitting pixel. In some embodiments, substrate 100 may include glass.

[0036] In some embodiments, the light-emitting layer 20 is located on the electrode 215. In some embodiments, the light-emitting layer 20 includes an organic light-emitting layer 260A (or a first organic light-emitting layer) and an organic light-emitting layer 260B (or a second organic light-emitting layer).

[0037] In some embodiments, electrode 215a is located on substrate 100. In some embodiments, electrode 215a is an anode. In some embodiments, electrode 215a comprises a metallic material, such as Ag, Al, Mg, Au, AlCu alloy, AgMo alloy, etc. In some embodiments, electrode 215a comprises indium tin oxide (ITO), indium zinc oxide (IZO), or other suitable materials. In some embodiments, organic light-emitting layer 260A and organic light-emitting layer 260B are located on electrode 215a.

[0038] In some embodiments, electrodes 216a and 216b are located on the light-emitting layer 20. In some embodiments, electrode 216a is located on the organic light-emitting layer 260A, and electrode 216b is located on the organic light-emitting layer 260B. In some embodiments, electrode 216a is in contact with the organic light-emitting layer 260A, and electrode 216b is in contact with the organic light-emitting layer 260B. In some embodiments, electrodes 216a and 216b may be further located on the spacer structure 30 (or pixel definition layer). In some embodiments, electrodes 216a and 216b are separated by space S1. In some embodiments, electrodes 216a and 216b comprise a metallic material, such as Ag, Al, Mg, Au, AlCu alloy, AgMo alloy, etc. In some embodiments, electrodes 216a and 216b comprise ITO, IZO, or other suitable materials.

[0039] In some embodiments, organic light-emitting layer 260A is located between electrode 215a and electrode 216a, and organic light-emitting layer 260B is located between electrode 215a and electrode 216b. In some embodiments, organic light-emitting layer 260A and organic light-emitting layer 260B are separated by space S1. In some embodiments, organic light-emitting layers 260A and 260B emit light of the same or different colors. In some embodiments, the emission wavelength of organic light-emitting layer 260A is the same as that of organic light-emitting layer 260B. In some embodiments, the emission wavelength of organic light-emitting layer 260B is greater than that of organic light-emitting layer 260A.

[0040] In some embodiments, organic light-emitting layers 260A and 260B comprise organic materials, which may be disposed in either material layer of organic light-emitting layers 260A and 260B according to different implementations. In some embodiments, the organic material has an absorption rate of greater than or equal to 50% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 60% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 70% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 80% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 90% for a specific wavelength. In some embodiments, the organic material has an absorption rate of greater than or equal to 95% for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0041] like Figure 2A As shown, in some embodiments, organic light-emitting layers 260A and 260B each comprise multiple material layers, such as a hole injection layer (HIL) 261, a hole transport layer (HTL) 262, an electron blocking layer (EBL) 263, an organic emission layer (EM) 264, an electron transport layer (ETL) 265, and an electron injection layer (EIL) 266. In some embodiments, organic light-emitting unit 101 comprises an electrode 215a (or a first bottom electrode), organic light-emitting layer 260A, and electrode 216a (or a first top electrode). In some embodiments, organic light-emitting unit 102 comprises an electrode 215a (or a first bottom electrode), organic light-emitting layer 260B, and electrode 216b (or a second top electrode).

[0042] In some embodiments, the spacer structure 30 is located on the substrate 100 and partially covers the electrode 215a. In some embodiments, the spacer structure 30 is located between organic light-emitting layers 260A and 260B. In some embodiments, the spacer structure 30 is located between electrodes 216a and 216b. In some embodiments, the pattern of the spacer structure 30 is designed according to a pixel arrangement. In some embodiments, the spacer structure 30 serves as a pixel defined layer (PDL). In some embodiments, the spacer structure 30 may include bumps 310. In some embodiments, the bumps 310 define pixel regions. In some embodiments, the bumps 310 are located on the substrate 100 and partially cover the electrode 215a. In some embodiments, the thickness of the spacer structure 30 is equal to or greater than 0.5 μm, for example, 0.5 μm to 2 μm or 0.6 μm to 1 μm.

[0043] In some embodiments, the spacer structure 30 (or pixel definition layer) comprises an organic insulating material. In some embodiments, the bump 310 may comprise, or be referred to as, an insulating bump. In some embodiments, the spacer structure 30 comprises a photosensitive material. In some embodiments, the spacer structure 30 may further comprise quantum dots, which have excellent light absorption performance. In some embodiments, the spacer structure 30 may further comprise a carbon black material, such as carbon black nanoparticles, carbon black-containing conductive fibers, or the like. In some embodiments, the spacer structure 30 may further comprise a blackbody material having an absorption rate of 90%, 95%, 99%, 99.5%, or 99.9% or higher for visible light.

[0044] In some embodiments, the spacer structure 30 has an absorption rate of 50% or greater than or equal to 50% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 60% or greater than or equal to 60% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 70% or greater than or equal to 70% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 80% or greater than or equal to 80% for a specific wavelength. In some embodiments, the spacer structure 30 has an absorption rate of 90% or greater than or equal to 95% for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm. In some embodiments, the specific wavelength is not greater than 350 nm. In some embodiments, the specific wavelength is not greater than 300 nm. In some embodiments, the specific wavelength is not greater than 250 nm. In some embodiments, the specific wavelength is not greater than 200 nm. In some embodiments, the specific wavelength is not greater than 150 nm. In some embodiments, the specific wavelength is not greater than 100 nm.

[0045] In some embodiments, the cover structure 40A includes cover layers 40 and 40' and an encapsulation layer 42 (or top encapsulation layer). In some embodiments, cover layer 40 is located on electrode 216a, cover layer 40' is located on electrode 216b, and cover layers 40 and 40' are separated from each other. In some embodiments, cover layers 40 and 40' are separated by a space S1. In some embodiments, the thickness of cover layer 40 is greater than the thickness of organic light-emitting layer 260A. In some embodiments, the thickness of cover layer 40 is more than 5 times the thickness of organic light-emitting layer 260A, for example, 5 to 20 times. In some embodiments, the thickness of cover layer 40' is greater than the thickness of organic light-emitting layer 260B. In some embodiments, the thickness of cover layer 40' is more than 5 times the thickness of organic light-emitting layer 260B, for example, 5 to 20 times. In some embodiments, the thickness of cover layer 40 is greater than the thickness of electrode 216a. In some embodiments, the thickness of cover layer 40 is more than 5 times the thickness of electrode 216a, for example, 5 to 30 times. In some embodiments, the thickness of the capping layer 40' is greater than the thickness of the electrode 216b. In some embodiments, the thickness of the capping layer 40' is more than 5 times the thickness of the electrode 216b, for example, 5 to 30 times.

[0046] In some embodiments, the cover layer 40 includes a capping layer 410 and an encapsulation layer 420, and the cover layer 40' includes a capping layer 410' and an encapsulation layer 420'. In some embodiments, the thickness of the encapsulation layer 420 is greater than the thickness of the capping layer 410. In some embodiments, the thickness of the encapsulation layer 420 is more than 5 times the thickness of the capping layer 410, for example, 5 to 50 times. In some embodiments, the thickness of the encapsulation layer 420' is greater than the thickness of the capping layer 410'. In some embodiments, the thickness of the encapsulation layer 420' is more than 5 times the thickness of the capping layer 410', for example, 5 to 50 times.

[0047] In some embodiments, capping layer 410 is disposed on electrode 216a and substantially conforms to the non-planar upper surface of electrode 216a. In some embodiments, capping layer 410' is disposed on electrode 216b and substantially conforms to the non-planar upper surface of electrode 216b. Capping layers 410 and 410' may comprise a dielectric material or an inorganic insulating material, such as silicon oxide. In some embodiments, capping layers 410 and 410' may comprise a hole transport layer material for extracting light lost within the organic light-emitting element to increase luminous efficiency. Capping layers 410 and 410' may also be referred to as light extraction layers.

[0048] In some embodiments, encapsulation layer 420 is disposed on capping layer 410 and substantially conformally to the non-planar upper surface of capping layer 410. In some embodiments, encapsulation layer 420' is disposed on capping layer 410' and substantially conformally to the non-planar upper surface of capping layer 410'. In some embodiments, encapsulation layer 420 has a recess corresponding to organic light-emitting layer 260A, substantially conformally to the non-planar upper surface of capping layer 410'. In some embodiments, encapsulation layer 420' has a recess corresponding to organic light-emitting layer 260B, substantially conformally to the non-planar upper surface of capping layer 410'. Encapsulation layers 420 and 420' may comprise oxides, such as silicon oxide. Encapsulation layers 420 and 420' may comprise polymeric organic materials, such as epoxy-based materials.

[0049] In some embodiments, the encapsulation layer 42 extends continuously over the cover layer 40 and the cover layer 40'. In some embodiments, the encapsulation layer 42 is disposed on the cover layer 40 and the cover layer 40' and is substantially conformal to the non-planar upper surface formed by the capping layer 40, the capping layer 40', and the spacer structure 30 (or pixel definition layer). In some embodiments, the organic light-emitting layer 260A and the organic light-emitting layer 260B contact the encapsulation layer 42 and are separated from each other through the encapsulation layer 42. In some embodiments, the cover layer 40 and the cover layer 40' contact the encapsulation layer 42 and are separated from each other through the encapsulation layer 42. In some embodiments, the capping layer 410 and the capping layer 410' contact the encapsulation layer 42 and are separated from each other through the encapsulation layer 42. In some embodiments, the encapsulation layer 420 and the encapsulation layer 420' contact the encapsulation layer 42 and are separated from each other through the encapsulation layer 42. In some embodiments, the electrode 216a and the electrode 216b contact the encapsulation layer 42 and are separated from each other through the encapsulation layer 42.

[0050] In some embodiments, the thickness of the encapsulation layer 42 is greater than the thickness of the organic light-emitting layer 260A. In some embodiments, the thickness of the encapsulation layer 42 is more than 5 times the thickness of the organic light-emitting layer 260A, for example, 5 to 20 times. In some embodiments, the thickness of the encapsulation layer 42 is greater than the thickness of the organic light-emitting layer 260B. In some embodiments, the thickness of the encapsulation layer 42 is more than 5 times the thickness of the organic light-emitting layer 260B, for example, 5 to 20 times. In some embodiments, the thickness of the encapsulation layer 42 is greater than the thickness of the electrode 216a. In some embodiments, the thickness of the encapsulation layer 42 is more than 5 times the thickness of the electrode 216a, for example, 5 to 30 times. In some embodiments, the thickness of the encapsulation layer 42 is greater than the thickness of the electrode 216b. In some embodiments, the thickness of the encapsulation layer 42 is more than 5 times the thickness of the electrode 216b, for example, 5 to 30 times.

[0051] In some embodiments, a space S1 is defined by a partial surface of the spacer structure 30 (or pixel definition layer), the sidewalls of the organic light-emitting layers 260A and 260B, the ends of the electrodes 216a and 216b, and the sidewalls of the capping layer 410 and 410'. In some embodiments, a portion of the bump 310 is exposed through the space S1. In some embodiments, the organic light-emitting layers 260A and 260B are spaced apart from each other through the space S1. In some embodiments, the electrodes 216a and 216b are spaced apart from each other through the space S1. In some embodiments, the cover layer 40 and the cover layer 40' are spaced apart from each other through the space S1. In some embodiments, the encapsulation layer 42 is located in or filled into the space S1. In some embodiments, the organic light-emitting layers 260A and 260B are spaced apart from each other through the encapsulation layer 42 in the space S1. In some embodiments, the electrodes 216a and 216b are spaced apart from each other through the encapsulation layer 42 in the space S1. In some embodiments, cover layer 40 and cover layer 40' are separated from each other by encapsulation layer 42 in space S1. In some embodiments, a portion of encapsulation layer 42 extends into space S1 between cover layer 40 and cover layer 40' and contacts bump 310.

[0052] According to some embodiments disclosed herein, multiple electrodes 216 are separated from each other by a space S1 and intersect the multiple electrodes 215 perpendicularly in multiple light-emitting units (or light-emitting pixels). This allows for individual control of the illumination of multiple light-emitting units (or light-emitting pixels), enabling the organic light-emitting element 10 to display various predetermined light-emitting patterns. For example, when the organic light-emitting element 10A is applied in a aiming device, it can be designed according to ballistics to present a multi-point display image.

[0053] Furthermore, according to some embodiments disclosed herein, the multiple electrodes 216 are physically separated from each other through the encapsulation layer 42. Therefore, not only can the multiple electrodes 216 be effectively electrically isolated from each other, but the encapsulation material of the encapsulation layer 42 can also provide protection for the electrodes 216, preventing the electrodes 216 from being damaged by the external environment, thereby improving the reliability and process yield of the organic light-emitting element 10A.

[0054] Furthermore, according to some embodiments disclosed herein, organic light-emitting layers 260A and 260B are also separated by encapsulation layer 42. This eliminates the need for additional patterning photolithography etching processes to pattern the organic light-emitting material to form multiple separated organic light-emitting layers. Therefore, the manufacturing process for the organic light-emitting layers can be simplified.

[0055] Figure 2B A cross-sectional view of an organic light-emitting element 10B is shown as an example. In some embodiments, Figure 2B For example Figure 1 A cross-sectional view of the organic light-emitting element 10. In some embodiments, Figure 2B For example, along Figure 1 A cross-sectional view of line A-A' in some embodiments. Figure 2B For example, along Figure 1 The cross-sectional view of line A-A' is shown, and only the luminescent area is illustrated. Figure 2B Structure and Figure 2A The structures are similar, but the differences are as follows.

[0056] In some embodiments, the bump 310 has a groove 310R that communicates with the space S1. In some embodiments, the encapsulation layer 42 extends continuously over the cover layer 40 and the cover layer 40' and extends into the space S1 and the groove 310R. In some embodiments, the sidewalls of the groove 310R are recessed relative to the sidewalls of the organic light-emitting layer 260A.

[0057] In some embodiments, the sidewall of organic light-emitting layer 260A is recessed relative to the sidewall of electrode 216a, and the sidewall of organic light-emitting layer 260B is recessed relative to the sidewall of electrode 216b. In some embodiments, the sidewall of organic light-emitting layer 260A is recessed relative to the sidewall of capping layer 40, and the sidewall of organic light-emitting layer 260B is recessed relative to the sidewall of capping layer 40'. In some embodiments, the sidewall of capping layer 410 is recessed relative to the sidewall of encapsulation layer 420, and the sidewall of capping layer 410 is also recessed relative to the sidewall of electrode 216a.

[0058] In some embodiments, the encapsulation layer 42 extends into the space S1. In some embodiments, the encapsulation layer 42 fills the recess formed by the sidewall of the trench 310R and the lower surface of the organic light-emitting layer 260A. In some embodiments, the encapsulation layer 42 fills the recess formed by the lower surface of the encapsulation layer 420, the upper surface of the electrode 216a, and the sidewall of the capping layer 410.

[0059] According to some embodiments disclosed herein, multiple electrodes 216 are physically separated from each other by an encapsulation layer 42, and the encapsulation layer 42 is further filled into multiple recesses. Therefore, not only can the multiple electrodes 216 be effectively electrically isolated from each other, effectively avoiding the problem of single-point lighting failure caused by short circuits between adjacent light-emitting units (or light-emitting pixels), but the bonding force between the encapsulation layer 42 and the stacked structure of the organic light-emitting unit can be improved through the engagement between the encapsulation layer 42 and the recesses, thereby improving the reliability and process yield of the organic light-emitting element 10B.

[0060] Figure 2C A cross-sectional view of an organic light-emitting element 10C is shown as an example. In some embodiments, Figure 2C For example Figure 1A cross-sectional view of the organic light-emitting element 10. In some embodiments, Figure 2C For example, along Figure 1 A cross-sectional view of line A-A' in some embodiments. Figure 2C For example, along Figure 1 The cross-sectional view of line A-A' is shown, and only the luminescent area is illustrated. Figure 2C Structure and Figure 2A The structures are similar, but the differences are as follows.

[0061] In some embodiments, the sidewall of organic light-emitting layer 260A is recessed relative to the sidewall of electrode 216a, and the sidewall of organic light-emitting layer 260B is recessed relative to the sidewall of electrode 216b. In some embodiments, the sidewall of electrode 216a is recessed relative to the sidewall of capping layer 40, and the sidewall of electrode 216b is recessed relative to the sidewall of capping layer 40'. In some embodiments, the sidewall of electrode 216a is recessed relative to the sidewall of cover layer 410, and the sidewall of electrode 216b is recessed relative to the sidewall of cover layer 410'.

[0062] In some embodiments, encapsulation layer 420 and encapsulation layer 42 are made of or comprised of the same material, and therefore there is no observable interface between encapsulation layer 420 and encapsulation layer 42. In some embodiments, encapsulation layer 420' and encapsulation layer 42 are made of or comprised of the same material, and therefore there is no observable interface between encapsulation layer 420' and encapsulation layer 42.

[0063] According to some embodiments disclosed herein, multiple electrodes 216 are physically separated from each other by an encapsulation layer 42, and the encapsulation layer 42 is further filled into multiple recesses. Therefore, not only can the multiple electrodes 216 be effectively electrically isolated from each other, effectively avoiding the problem of single-point lighting failure caused by short circuits between adjacent light-emitting units (or light-emitting pixels), but the bonding force between the encapsulation layer 42 and the stacked layer structure of the organic light-emitting unit can be improved through the engagement between the encapsulation layer 42 and the recesses, thereby improving the reliability and process yield of the organic light-emitting element 10C.

[0064] Furthermore, according to some embodiments disclosed herein, encapsulation layers 420 and 420' are made of or comprise the same material as encapsulation layer 42, thereby further improving the bonding strength between encapsulation layers 420 and 420' and encapsulation layer 42, thereby improving the reliability and process yield of organic light-emitting element 10C.

[0065] Figure 2D A cross-sectional view of an organic light-emitting element 10D is shown as an example. In some embodiments, Figure 2D For example Figure 1 A cross-sectional view of the organic light-emitting element 10. In some embodiments, Figure 2D For example, along Figure 1A cross-sectional view of line A-A' in some embodiments. Figure 2D For example, along Figure 1 The cross-sectional view of line A-A' is shown, and only the luminescent area is illustrated. Figure 2D Structure and Figure 2A The structures are similar, but the differences are as follows.

[0066] In some embodiments, the sidewall of organic light-emitting layer 260A is recessed relative to the sidewall of trench 310R, and the sidewall of organic light-emitting layer 260B is recessed relative to the sidewall of trench 310R. In some embodiments, the sidewall of organic light-emitting layer 260A is recessed relative to the sidewall of electrode 216a, and the sidewall of organic light-emitting layer 260B is recessed relative to the sidewall of electrode 216b.

[0067] According to some embodiments disclosed herein, multiple electrodes 216 are physically separated from each other by an encapsulation layer 42, and the encapsulation layer 42 is further filled into multiple recesses. Therefore, not only can the multiple electrodes 216 be effectively electrically isolated from each other, effectively avoiding the problem of single-point lighting failure caused by short circuits between adjacent light-emitting units (or light-emitting pixels), but the engagement between the encapsulation layer 42 and the recesses can also improve the bonding force between the encapsulation layer 42 and the stacked structure of the organic light-emitting unit, thereby improving the reliability and process yield of the organic light-emitting element 10D.

[0068] Figure 2E A cross-sectional view of an organic light-emitting element 10 is shown as an example. In some embodiments, Figure 2E For example, along Figure 1 A cross-sectional view of line E-E' in some embodiments. Figure 2E For example, along Figure 1 The cross-sectional view of line E-E' is shown, and only the luminescent area is illustrated.

[0069] In some embodiments, electrodes 215a and 215b are spaced apart from each other through spacer structure 30 (or pixel definition layer). In some embodiments, electrodes 215a and 215b are spaced apart from each other through intercalation bump 310 (or insulating bump). In some embodiments, encapsulation layer 42 is located on and contacts bump 310.

[0070] Figures 3A to 3E A method for fabricating an organic light-emitting element 10A according to some embodiments is illustrated.

[0071] like Figure 3A As shown, in some embodiments, a substrate 100 is provided, on which electrodes 215a are disposed, and a plurality of bumps 310 (or spacer structures 30) are formed on the electrodes 215a. In some embodiments, a plurality of electrodes 215 are disposed on the substrate 100 (see Figure 100). Figure 1The spacer structure 30 is formed on the plurality of electrodes 215. The plurality of electrodes 215 can be fabricated by a photolithography etching process. In some embodiments, bumps 310 (or insulating bumps) are formed on the substrate 100 and partially cover the electrodes 215.

[0072] like Figure 3B As shown, in some embodiments, an organic light-emitting layer structure 260, an electrode material layer 216A, and a cover material layer 400A are formed on the spacer structure 30 and the electrode 215a.

[0073] In some embodiments, an organic light-emitting material layer 260 is formed over the entire surface of the spacer structure 30 and the electrode 215a by evaporation. In some embodiments, an electrode material layer 216A is formed over the entire surface of the organic light-emitting material layer 260 by evaporation. Thus, organic light-emitting units 101 and 102 are formed. Next, in some embodiments, a cover material layer 400A is formed over the entire surface of the electrode material layer 216A by evaporation. In some embodiments, a cover material layer 410A is formed over the entire surface of the electrode material layer 216A by evaporation, and an encapsulation material layer 420A is formed over the entire surface of the cover material layer 410A by evaporation.

[0074] In some embodiments, a full-surface hole injection layer (HIL) 261 is formed on the surface of the spacer structure 30 and the electrode 215a, a full-surface hole transport layer (HTL) 262 is formed on the hole injection layer (HIL) 261, a full-surface electron blocking layer (EBL) 263 is formed on the hole transport layer (HTL) 262, a full-surface organic emission layer (EM) 264 is formed on the electron blocking layer (EBL) 263, a full-surface electron transport layer (ETL) 265 is formed on the organic emission layer (EM) 264, and a full-surface electron injection layer (EIL) 266 is formed on the electron transport layer (ETL) 265. In some embodiments, a hole injection layer (HIL) 261, a hole transport layer (HTL) 262, an electron blocking layer (EBL) 263, an organic emission layer (EM) 264, an electron transport layer (ETL) 265, and an electron injection layer (EIL) 266 are formed by evaporation.

[0075] like Figure 3C As shown, in some embodiments, a patterned photosensitive layer 810 is provided on the cover material layer 400A. In some embodiments, the photosensitive layer is formed by coating. Then, in some embodiments, the photosensitive layer is patterned by a photolithography process to form the patterned photosensitive layer 810, so that a portion of the cover material layer 400A is exposed through the groove 820.

[0076] like Figure 3DAs shown, in some embodiments, a separation step is performed to separate the cover material layer 400A into a cover layer 40 and a cover layer 40' that are separated from each other. In some embodiments, the electrode material layer 216 is separated into electrodes 216a and 216b that are separated from each other through a separation step. In some embodiments, the organic light-emitting layer structure 260 is separated into organic light-emitting layers 260A and 260B that are separated from each other through a separation step.

[0077] In some embodiments, the separation step is performed through one or more dry etching processes. In some embodiments, a portion of the organic light-emitting layer structure 260, a portion of the electrode material layer 216, and a portion of the cover material layer 400A are removed through one or more dry etching processes to form a space S1. In some embodiments, a portion of the upper surface of the bump 310 (or insulating bump) is exposed from the space S1. In some embodiments, the organic light-emitting layer 260A and the organic light-emitting layer 260B are separated from each other through the space S1. In some embodiments, the electrodes 216a and 216b are separated from each other through the space S1. In some embodiments, the cover layer 40 and the cover layer 40' are separated from each other through the space S1.

[0078] like Figure 3E As shown, in some embodiments, the encapsulation layer 42 is formed to continuously extend over the cover layer 40 and the cover layer 40'. In some embodiments, the encapsulation layer 42 is formed by evaporation. In some embodiments, the encapsulation layer 42 is formed in space S1 and contacts the sidewalls of the organic light-emitting layer 260A, the organic light-emitting layer 260B, the sidewalls of the electrode 216a, the sidewalls of the electrode 216b, the sidewalls of the cover layer 40, and the sidewalls of the cover layer 40'. Thus, as shown... Figure 2A The organic light-emitting element 10A is shown.

[0079] In some embodiments, refer to Figure 2B and Figure 3D The separation step further removes a portion of the bumps 310 (or insulating bumps). In some embodiments, a portion of the bumps 310 (or insulating bumps) is removed through an etching process to form a trench 310R. In some embodiments, a portion of the organic light-emitting structure 260 and a portion of the bumps 310 are removed through different etching processes, such that the sidewalls of the trench 310R have an undercut structure. In some embodiments, an etching process for removing a portion of the electrode material layer 216 or an etching process for removing a portion of the cover material layer 400A also removes a portion of the bumps 310 (or insulating bumps), such that the sidewalls of the trench 310R have an undercut structure.

[0080] In some embodiments, refer to Figure 2B and Figure 3DThe patterned photosensitive layer 810 is removed through a wet etching step. In some embodiments, the wet etching step for removing the patterned photosensitive layer 810 further removes a portion of the organic light-emitting layer 260A and a portion of the organic light-emitting layer 260B, such that the sidewalls of the organic light-emitting layer 260A are recessed relative to the sidewalls of the capping layer 40, and the sidewalls of the organic light-emitting layer 260B are recessed relative to the sidewalls of the capping layer 40'. Next, referring to... Figure 3E The steps of forming the encapsulation layer 42 can form such as Figure 2B The organic light-emitting element 10B is shown.

[0081] In some embodiments, refer to Figure 2C and Figure 3D A trench 310R is formed by removing a portion of the organic light-emitting layer structure 260 and a portion of the bumps 310 (or insulating bumps) through a single etching process, such that the sidewalls of the trench 310R are substantially aligned with the sidewalls of the organic light-emitting layers 260A and 260B. In some embodiments, the trench 310R is formed by removing a portion of the organic light-emitting layer structure 260 and a portion of the bumps 310 (or insulating bumps) through a single dry etching process. Next, refer to... Figure 3E The steps of forming the encapsulation layer 42 can form such as Figure 2C The organic light-emitting element 10C is shown.

[0082] In some embodiments, refer to Figure 2D and Figure 3D The patterned photosensitive layer 810 is removed through a wet etching step. In some embodiments, the wet etching step for removing the patterned photosensitive layer 810 further removes a portion of the organic light-emitting layer 260A and a portion of the organic light-emitting layer 260B, such that the sidewalls of the organic light-emitting layer 260A and the sidewalls of the organic light-emitting layer 260B are recessed relative to the sidewalls of the overlay trench 310R. Next, referring to... Figure 3E The steps of forming the encapsulation layer 42 can form such as Figure 2D The organic light-emitting element 10D is shown.

[0083] The foregoing outlines some features of the embodiments, thus enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or the same advantages as the embodiments described in this application. Those skilled in the art should also understand that this equivalent architecture does not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this disclosure.

[0084] Symbol Explanation

[0085] 10 Organic light-emitting elements

[0086] 10A Organic Light Emitting Device

[0087] 10B Organic Light Emitting Device

[0088] 10C Organic Light Emitting Device

[0089] 10D Organic Light Emitting Device

[0090] 20 Light-emitting layers

[0091] 30 Spacer Structure

[0092] 40 Covering layer

[0093] 40' Cover Layer

[0094] 40A Coverage Structure

[0095] 42 Encapsulation layer

[0096] 100 substrates

[0097] 101 Organic Light Emitting Unit

[0098] 102 Organic Light Emitting Units

[0099] 215 electrode

[0100] 215a electrode

[0101] 215b electrode

[0102] 216 electrode

[0103] 216a electrode

[0104] 216b electrode

[0105] 260A Organic Light Emitting Layer

[0106] 260B Organic Light Emitting Layer

[0107] 261 Hole Injection Layer

[0108] 262 Hole Transport Layer

[0109] 263 Electron blocking layer

[0110] 264 Organic Emitting Layer

[0111] 265 Electron Transport Layer

[0112] 266 Electron Injection Layer

[0113] 310 bump

[0114] 310R Groove

[0115] 410 cap layer

[0116] 410' cap layer

[0117] 420 encapsulation layer

[0118] 420' encapsulation layer

[0119] A-A' line

[0120] E-E' line

[0121] DR1 extension direction

[0122] DR2 extension direction

[0123] S1 space.

Claims

1. An organic light-emitting element, comprising: substrate; A first bottom electrode is located on the substrate; The first organic light-emitting layer and the second organic light-emitting layer are located on the first bottom electrode; A first top electrode and a second top electrode are respectively located on the first organic light-emitting layer and the second organic light-emitting layer, wherein the extending direction of the first top electrode and the extending direction of the second top electrode are substantially perpendicular to the extending direction of the first bottom electrode. as well as A first cover layer and a second cover layer are respectively located on the first top electrode and the second top electrode, and the first cover layer and the second cover layer are separated from each other.

2. The organic light-emitting element as claimed in claim 1, further comprising: A top encapsulation layer that extends continuously over the first cover layer and the second cover layer.

3. The organic light-emitting element as described in claim 2, further comprising: An insulating bump is located on the substrate and partially covers the first bottom electrode, wherein a portion of the top encapsulation layer extends between the first cover layer and the second cover layer and contacts the insulating bump.

4. The organic light-emitting element of claim 2, wherein the first organic light-emitting layer and the second organic light-emitting layer are in contact with the top encapsulation layer and are separated from each other through the top encapsulation layer.

5. The organic light-emitting element of claim 2, wherein the first cover layer and the second cover layer are separated from each other through the top encapsulation layer.

6. The organic light-emitting element of claim 5, wherein the first cover layer includes a first capping layer and a first encapsulation layer located on the first capping layer, the second cover layer includes a second capping layer and a second encapsulation layer located on the second capping layer, and the first encapsulation layer and the second encapsulation layer are in contact with the top encapsulation layer and are separated from each other through the top encapsulation layer.

7. The organic light-emitting element of claim 2, wherein the first top electrode and the second top electrode are in contact with the top encapsulation layer and are separated from each other through the top encapsulation layer.

8. The organic light-emitting element as claimed in claim 1, further comprising: An insulating bump is located on the substrate and partially covers the first bottom electrode, wherein the first cover layer and the second cover layer are separated from each other by a space, and a portion of the insulating bump is exposed from the space.

9. The organic light-emitting element of claim 8, wherein the insulating bump has a groove, and the groove communicates with the space.

10. The organic light-emitting element of claim 9, further comprising: A top encapsulation layer that extends continuously over the first cover layer and the second cover layer and into the space and the trench.

11. The organic light-emitting element of claim 9, wherein the sidewall of the trench is recessed relative to the sidewall of the first organic light-emitting layer.

12. The organic light-emitting element of claim 9, wherein the sidewall of the first organic light-emitting layer is recessed relative to the sidewall of the trench.

13. The organic light-emitting element of claim 1, wherein the sidewall of the first organic light-emitting layer is recessed relative to the sidewall of the first cover layer.

14. The organic light-emitting element of claim 1, wherein the sidewall of the first organic light-emitting layer is recessed relative to the sidewall of the first top electrode.

15. A method for fabricating an organic light-emitting element, comprising: Provide substrate; A first bottom electrode is disposed on the substrate; An organic light-emitting layer structure is formed on the first bottom electrode; A top electrode material layer is formed on the organic light-emitting layer structure; A covering material layer is formed on the top electrode material layer; as well as A separation step is performed to separate the covering material layer into a first covering layer and a second covering layer that are separated from each other.

16. The manufacturing method as described in claim 15, further comprising: The top encapsulation layer is formed to extend continuously over the first cover layer and the second cover layer.

17. The manufacturing method as described in claim 16, further comprising: Before the top encapsulation layer is formed, the top electrode material layer is separated into a first top electrode and a second top electrode that are separated from each other through the separation step.

18. The manufacturing method as described in claim 16, further comprising: Before forming the top encapsulation layer, the organic light-emitting layer structure is separated into a first organic light-emitting layer and a second organic light-emitting layer that are separated from each other through the separation step.

19. The manufacturing method as described in claim 18, further comprising: Prior to the separation step, a patterned photosensitive layer is applied to the cover material layer; as well as After the separation step, the patterned photosensitive layer is removed by a wet etching step, wherein the wet etching step further removes a portion of the first organic light-emitting layer and a portion of the second organic light-emitting layer, such that the sidewalls of the first organic light-emitting layer and the sidewalls of the second organic light-emitting layer are recessed relative to the sidewalls of the first cover layer.

20. The manufacturing method as described in claim 16, further comprising: An insulating bump is formed on the substrate and partially covers the first bottom electrode, wherein the separation step further removes a portion of the insulating bump.

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