Calibration feeding tool for chip welding

Abstract

The calibration feeding tool for chip welding comprises an operation table, a fixing base plate connected with a positioning track is arranged at the top of the operation table, a positioning frame for chip conveying is movably arranged on the positioning track, a recycling box is arranged on one side of the operation table, and a pushing limiting frame is arranged outside the recycling box; a liftable carding seat is arranged at the bottom of the inner wall of the recycling box, a fixing plate is arranged on one side of the pushing limiting frame, a plurality of sliding shafts for limiting are arranged at the bottom of the fixing plate, and a plurality of buffer rubber plates are clamped at the bottom of the fixing plate; compared with the prior art, chips are automatically unloaded into the recycling box by the reset plate through pneumatic driving, the problem of scalding or harmful gas suction possibly caused by manual operation is avoided, the carding base in the recycling box drives the transmission frame to reciprocate through the driving shaft, the stacked chips are automatically arranged in order, and the working efficiency is improved. And a weighing sensor is combined for total quantity monitoring, so that automation and intelligentization of unloading, stacking and management are realized.

Description

Technical Field

[0001] This invention relates to the field of welding equipment technology, specifically to a calibration and feeding fixture for chip welding. Background Technology

[0002] Modern welding uses a variety of energy sources, including gas flames, electric arcs, lasers, electron beams, friction, and ultrasound. Welding can pose dangers to operators, so appropriate protective measures must be taken when welding. Potential injuries to the human body from welding include burns, electric shocks, vision impairment, inhalation of toxic gases, and excessive ultraviolet radiation.

[0003] Chinese patent CN116117260B discloses an LED chip board welding fixture, including a cabinet with a welding unit on the cabinet. The welding unit includes a support module and a spot welding module. The support module includes a material board, the lower surface of which is supported above the cabinet by a support rod. A rectangular window is opened on the material board, with the board to be welded placed on one side of the window and the welded board placed on the other side. An adsorption unit is provided below the window, including a tray placed inside the window, with the board supported inside the window by the tray. One side of the material board is provided with... The spot welding module includes an F-shaped support plate with a cylinder fixed to it. The output end of the cylinder points to a window and is fixed to a horizontal plate. Heating blocks are symmetrically fixed below the horizontal plate, and the heating blocks correspond to the welding points on the plate inside the window. Traditional product loading, moving, flipping, and positioning welding stations have slow loading and unloading speeds during welding positioning, cannot move quickly, and are prone to collisions during automatic unloading, which not only affects work efficiency but also easily causes losses during production. To address these issues, we propose a calibration loading fixture for chip welding. Summary of the Invention

[0004] The purpose of this invention is to provide a calibration and loading fixture for chip welding to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a calibration and loading fixture for chip welding, comprising,

[0006] The operating table has a fixed pad on top that connects to the positioning rail. A positioning frame for chip transmission is movably mounted on the positioning rail. A recycling bin is located on one side of the operating table. A push limit frame is located outside the recycling bin. A liftable combing seat is located at the bottom of the inner wall of the recycling bin.

[0007] The push-limiting frame has a fixed plate on one side, and several sliding shafts for limiting the movement are provided at the bottom of the fixed plate. Several buffer rubber plates are also fixed at the bottom of the fixed plate. The buffer rubber plates are used to adhere to the top of the chip for cushioning and dust prevention. The combing seat has a docking frame at the top, which rests against the bottom of the chip. When the chip needs to be processed, the operator can place the chip against the inside of the reset plate. The chip can be pressed and limited by the clamping plate, and then welded with the subsequent laser welding equipment. After welding, the reset plate can be moved along the rectangular groove into the recycling box. The push-limiting frame at the top can adhere the buffer rubber plates to the top of the chip, which can reduce the impact during transportation. At the same time, the adhesive can adhere to dust and debris, which can also reduce the amount of dust and debris left inside the chip.

[0008] Preferably, a movable frame is hinged to one side of the push limiting frame, and a fixed plate is disposed on one side of the movable frame. The fixed plate moves with the movable frame. A support frame is disposed on the top of the fixed plate, and an air inlet plate is disposed on the top of the support frame. A retractable air blowing pipe is disposed at the bottom of the air inlet plate.

[0009] The bottom of the fixed plate is movably provided with several transmission shafts, and the transmission shafts are movably locked with movable blocks. The sliding shaft is set at the bottom of the movable blocks, and one end of the sliding shaft is provided with a pressing piece for pressing against the bottom of the buffer rubber plate. The movable blocks are provided with a control motor to control the sliding shaft. The chip is automatically unloaded into the recycling box by the reset plate through air pressure, avoiding the problems of burns or inhalation of harmful gases that may be caused by manual operation.

[0010] Preferably, a set of guide rail plates is connected to the bottom outer wall of the drive shaft, and a transmission groove is provided on the guide rail plate. A transmission shaft is connected to the side wall of the movable block, and the transmission shaft is movably disposed inside the transmission groove to control the longitudinal displacement of the movable block. By cooperating with the transmission groove on the push limit frame and the transmission shaft, a single buffer rubber sheet can be precisely controlled and separated for bonding, which can adapt to the production needs of different batches and specifications. Moreover, the external guide rail plate can be replaced to change the movement interval to adapt to buffer rubber sheets of different sizes.

[0011] Preferably, the buffer adhesive plate has a circular hole, and the position of the circular hole corresponds to the air blowing pipe. The bottom of the buffer adhesive plate is provided with a buffer adhesive layer, and a plurality of staggered fixing grooves are provided on the buffer adhesive layer. The bottom edge of the air blowing pipe is provided with a plurality of air blowing holes. The air blowing pipe is used to blow air when the buffer adhesive layer is attached to the chip surface to leave dust and debris on the buffer adhesive layer.

[0012] The buffer plate has a set of diagonally arranged edges that serve as reset pieces. These reset pieces are elastic and can abut against the clamping pieces, serving as auxiliary limiters for the buffer plate. Pushing the buffer plate at the bottom of the limiter can effectively buffer impacts during transportation. Its unique air-blowing cleaning function can blow away debris from the chip surface before bonding, and the buffer layer with staggered grooves can adhere to residual dust, providing double protection for the cleanliness and integrity of the chip during transportation and storage.

[0013] Preferably, the recycling bin is equipped with a set of snap-fit ​​pads and a set of snap-fit ​​brackets. The snap-fit ​​brackets and snap-fit ​​pads work together to accommodate different chip sizes, reduce bumps during unloading, and reduce chip loss during operation that could lead to a decrease in yield.

[0014] Preferably, the combing seat is provided with a positioning ring frame, and a plurality of reset rods are inserted into the positioning ring frame. A transmission frame is provided at the top of the reset rods. A drive shaft is rotatably provided at the top of the combing seat. A guide groove for cyclic reset is provided outside the drive shaft. A positioning protrusion is provided inside the transmission frame and is locked inside the guide groove for reciprocating movement within a certain distance. By reciprocating, the chips stacked on the top of the combing are pushed and combed. The drive shaft drives the transmission frame to reciprocate, so that the stacked chips are automatically arranged neatly. Combined with a weighing sensor for total quantity monitoring, the unloading, stacking and management are automated and intelligent.

[0015] Preferably, the docking frame is located on top of the transmission frame, and a weighing sensor is installed on the docking frame. The weighing sensor is used to measure the total weight of the stacked chips on top. By integrating the weighing sensor on the docking frame of the combing seat, the changes in the total weight of the stacked chips can be monitored, which can effectively identify abnormalities such as missing or excessive application of buffer adhesive sheets. This provides data support for real-time quality monitoring of the production process, facilitates timely repairs, and prevents batch errors from affecting subsequent processes.

[0016] Preferably, a set of slide rails is installed on the top of the positioning track, and the positioning frame is movably disposed between the slide rails. One end of the positioning frame is equipped with a connecting end block that connects to an external pneumatic device. The positioning frame is equipped with a pneumatic push rod, and one end of the pneumatic push rod is connected to a reset plate for chip positioning. The reset plate automatically unloads the chip into the recycling box by pneumatic drive, avoiding the problems of burns or inhalation of harmful gases that may be caused by manual operation.

[0017] Preferably, the reset plate has a telescopic plate inside, and a hinge frame is movably provided on one side of the telescopic plate. A rubber pad is provided on the top of the hinge frame, and several clamping plates are movably inserted into the top of the reset plate for chip positioning and correction.

[0018] The recycling bin has a rectangular slot on the side near the reset plate for inserting and removing the reset plate, which can clamp and position the chip.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] 1. The present invention can effectively buffer the impact during transportation by pushing the buffer rubber plate at the bottom of the limiting frame; its unique air blowing cleaning function can blow away the chip surface debris before bonding, and the buffer rubber layer with staggered grooves can adhere the residual dust, thus doubly ensuring the cleanliness and integrity of the chip during transportation and storage.

[0021] 2. This invention uses pneumatic drive to automatically unload chips into the recycling bin from the reset plate, avoiding the problems of burns or inhalation of harmful gases that may occur with manual operation. The combing seat in the recycling bin drives the transmission frame to reciprocate through the drive shaft, so that the stacked chips are automatically arranged neatly. Combined with the weighing sensor for total quantity monitoring, it realizes the automation and intelligence of unloading, stacking and management.

[0022] 3. This invention integrates chip positioning, clamping, welding and subsequent protection processing into one unit through tooling. With the cooperation of positioning frame, reset plate and clamping clamp, the chip can be quickly calibrated and fixed at the welding station. After welding, the chip can be directly sent into the recycling box and the top buffer adhesive plate can be attached at the same time, which greatly improves the continuity and efficiency of the production process.

[0023] 4. This invention uses the transmission groove on the push limit frame to cooperate with the transmission shaft, which can accurately control and separate a single buffer rubber sheet for bonding, adapting to the production needs of different batches and specifications. In addition, the external guide plate can be replaced to change the activity interval, so as to adapt to buffer rubber sheets of different sizes.

[0024] 5. By integrating a weighing sensor on the docking frame of the combing station, this invention can effectively identify abnormalities such as missing or excessive application of buffer adhesive by monitoring the total weight change of the stacked chips. This provides data support for real-time quality monitoring of the production process, facilitates timely repairs, and prevents batch errors from affecting subsequent processes. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 For the present invention Figure 1 Enlarged view of a portion of point A in the middle;

[0027] Figure 3 This is a schematic diagram of the positioning frame structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the exploded disassembly structure of the recycling bin of the present invention;

[0029] Figure 5 This is a schematic diagram of the exploded disassembly structure of the bottom of the push-limiting frame of the present invention;

[0030] Figure 6 For the present invention Figure 5 Enlarged view of a portion of point B in the middle;

[0031] Figure 7 This is a schematic diagram of the buffer rubber plate structure of the present invention;

[0032] Figure 8 This is a schematic diagram of the top structure of the comb holder of the present invention;

[0033] In the diagram: 1. Operating table; 2. Positioning rail; 3. Recycling bin; 4. Push limit frame; 5. Combing seat; 11. Fixed pad; 21. Slide rail frame; 22. Positioning frame; 23. Connecting end block; 24. Reset plate; 25. Clamping clamp; 26. Hinge frame; 31. Clip frame; 32. Clip pad; 41. Movable frame; 42. Support frame; 43. Air blowing pipe; 44. Fixed plate; 45. Buffer rubber plate; 451. Reset piece; 452. Buffer rubber layer; 46. Drive shaft; 461. Movable latch; 47. Sliding shaft; 48. Guide rail plate; 51. Positioning ring frame; 511. Reset rod; 52. Drive shaft; 53. Transmission frame; 54. Docking frame; 55. Weighing sensor. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see Figures 1-8 This invention provides a technical solution: a calibration and loading fixture for chip welding, comprising,

[0036] The operating table 1 has a fixed pad 11 on top that connects to the positioning rail 2. The positioning rail 2 is movably mounted with a positioning frame 22 for chip transmission. A recycling bin 3 is located on one side of the operating table 1. A push limit frame 4 is located outside the recycling bin 3. A liftable combing seat 5 is located at the bottom of the inner wall of the recycling bin 3.

[0037] The push-limiting frame 4 has a fixed plate 44 on one side, and several sliding shafts 47 for limiting the position are provided at the bottom of the fixed plate 44. Several buffer rubber plates 45 are clamped at the bottom of the fixed plate 44. The buffer rubber plates 45 are used to adhere to the top of the chip for buffering and dust prevention. The combing seat 5 has a docking frame 54 on the top. The docking frame 54 is pressed against the bottom of the chip. When the chip needs to be processed, the operator can press the chip against the inside of the reset plate 24. The pressing clamp 25 can be used to press and limit the chip. It can also be used in conjunction with the subsequent laser welding equipment for welding. After welding is completed, the reset plate 24 can be moved along the rectangular groove into the recycling box 3. The push-limiting frame 4 on the top can adhere the buffer rubber plates 45 to the top of the chip, which can reduce the impact during transportation. At the same time, the adhesive can adhere to dust and debris, which can also reduce the amount of dust and debris left inside the chip.

[0038] like Figure 5 and Figure 6 As shown, a movable frame 41 is hinged to one side of the push limit frame 4, and a fixed plate 44 is set on one side of the movable frame 41. The fixed plate 44 moves with the movable frame 41. A support frame 42 is set on the top of the fixed plate 44, and an air inlet plate is set on the top of the support frame 42. A retractable air blowing pipe 43 is set at the bottom of the air inlet plate.

[0039] The bottom of the fixed plate 44 is movably provided with several drive shafts 46. Inside the drive shafts 46, there are movable locking blocks 461. A sliding shaft 47 is set at the bottom of the movable locking block 461. One end of the sliding shaft 47 is provided with a pressing piece for pressing against the bottom of the buffer plate 45. The movable locking block 461 is provided with a control motor to control the sliding shaft 47. After the air blowing cleaning is completed, a group of corner sliding shafts 47 move outward under the action of the control motor. At this time, the sliding shaft 47 near the reset piece 451 remains in a tight state, and the movable locking block 461 at the top of the movable end of the sliding shaft 47 can be fed inward. Under the action of the transmission groove and the transmission shaft, the sliding shaft 47 is driven to move longitudinally, and the pressing piece at one end of the sliding shaft 47 is inserted into the gap, which can separate the buffer plate 45 attached to the top of the chip from the whole. At this time, the sliding shaft 47 corresponding to the reset piece 451 moves, and at the same time, the movable frame 41 is controlled to drive the fixed plate 44 to flip and move, which can attach a buffer plate 45 to the top of the processed chip for auxiliary protection.

[0040] like Figure 5 and Figure 6 As shown, a set of guide rail plates 48 are connected to the bottom outer wall of the drive shaft 46. The guide rail plates 48 are provided with a transmission groove. The side wall of the movable block 461 is connected to a transmission shaft, and the transmission shaft is movably set inside the transmission groove to control the longitudinal displacement of the movable block 461. With the cooperation of the transmission groove and the transmission shaft, the movable block 461 drives the sliding shaft 47 to move longitudinally to separate the individual buffer plates 45 and reduce the damage to the chip caused by bumps.

[0041] like Figure 5 and Figure 6 As shown, a circular hole is provided on the buffer adhesive plate 45, and the position of the circular hole corresponds to the air blowing pipe 43. A buffer adhesive layer 452 is provided at the bottom of the buffer adhesive plate 45, and a number of staggered fixing grooves are provided on the buffer adhesive layer 452. A number of air blowing holes are provided at the bottom edge of the air blowing pipe 43. The air blowing pipe 43 is used to blow air when the buffer adhesive layer 452 is attached to the chip surface, so as to leave dust and debris on the buffer adhesive layer 452.

[0042] The buffer adhesive plate 45 has a set of diagonally arranged edges that serve as reset pieces 451. The reset pieces 451 are elastic and can abut against the clamping pieces, serving as auxiliary limiters for the buffer adhesive plate 45. After the chip is soldered, the temperature drops during operation. At the same time, under the action of the push limit frame 4, the buffer adhesive layer 452 adheres to the top of the chip. At this time, the air blowing pipe 43 can also be located at the circular groove of the buffer adhesive plate 45. At this time, the operation of external equipment can blow air along the air blowing pipe 43 to perform simple treatment of dust on the chip surface. Dust and other particles can adhere to the interior of the buffer adhesive layer 452 with staggered grooves on the surface along the airflow, reducing the possibility of dust residue.

[0043] like Figure 4 As shown, a set of snap-fit ​​pads 32 are installed inside the recycling bin 3, and a set of snap-fit ​​brackets 31 are installed inside the recycling bin 3. The snap-fit ​​brackets 31 and snap-fit ​​pads 32 work together to adapt to different chip sizes, reduce bumps during unloading, and can replace snap-fit ​​pads 32 of different sizes. At the same time, the snap-fit ​​brackets 31 inside can be adjusted to reduce the situation where chips with excessive gaps are scattered inside the recycling bin 3 and cannot be stacked and sorted.

[0044] like Figure 4 and Figure 8 As shown, a positioning ring frame 51 is provided on the combing seat 5, and several reset rods 511 are inserted on the positioning ring frame 51. A transmission frame 53 is provided on the top of the reset rods 511. A drive shaft 52 is rotatably provided on the top of the combing seat 5. A guide groove for cyclic reset is provided on the outside of the drive shaft 52. A positioning protrusion is provided inside the transmission frame 53 and is locked inside the guide groove. It is used to reciprocate within a certain distance. By reciprocating, the chips stacked on the top are combed. When multiple chips are stacked inside the recycling box 3, the drive shaft 52 moves, which can drive the transmission frame 53 to reciprocate, so that the chips at the top move back and forth, making them evenly placed inside the recycling box 3 and reducing the situation of uneven stacking.

[0045] like Figure 8As shown, the docking frame 54 is located on top of the transmission frame 53. A weighing sensor 55 is installed on the docking frame 54. The weighing sensor 55 is used to measure the total weight of the chips stacked on top. With the help of the weighing sensor 55, a quantitative chip weight can be measured. Based on the feedback value difference, it is possible to observe whether there are any omissions or operational errors during the application of the buffer adhesive plate 45, resulting in multiple buffer adhesive plates 45 being adhered to the top of a single chip. This allows for timely inspection and maintenance, reducing the impact on subsequent production and processing.

[0046] like Figure 2 and Figure 3 As shown, a set of slide rails 21 are installed on the top of the positioning track 2. The positioning frame 22 is movably arranged between the slide rails 21. One end of the positioning frame 22 is equipped with a connecting end block 23 that connects to an external pneumatic device. The positioning frame 22 is equipped with a pneumatic push rod inside, and one end of the pneumatic push rod is connected to a reset plate 24 for chip positioning. During the unloading process, the external pneumatic device is connected to the connecting end block 23, which can move the reset plate 24 into the recycling box 3 to facilitate unloading and reduce the risk of burns or inhalation of exhaust gas that may occur during manual unloading.

[0047] like Figure 2 and Figure 3 As shown, the reset plate 24 has a telescopic plate inside, and a hinge frame 26 is movably provided on one side of the telescopic plate. A rubber pad is provided on the top of the hinge frame 26, and several clamping clamps 25 are movably inserted into the top of the reset plate 24 for chip positioning and correction.

[0048] The recycling box 3 has a rectangular slot on the side near the reset plate 24 for the reset plate 24 to be inserted and removed. During the limiting process, the chip is pressed against the top of the hinge frame 26. The rubber pad reduces the pressure on the chip during the clamping process, reducing the chance of the chip bending or breaking during the clamping process. After the clamping is completed, the chip moves on the slide rail frame 21 along with the positioning frame 22.

[0049] Working principle: First, when the chip needs to be processed, the operator can place the chip against the inside of the reset plate 24. The clamping plate 25 can clamp and limit the chip, and then cooperate with the subsequent laser welding equipment for welding. After welding, the reset plate 24 can be moved along the rectangular groove into the recycling box 3. The top push limit frame 4 can attach the buffer rubber plate 45 to the top of the chip, which can reduce the impact during transportation. At the same time, the adhesive can adhere to dust and debris, reducing the amount of dust and debris left inside the chip. During the limiting process, the chip is against the top of the hinge frame 26. The rubber pad reduces the pressure on the chip during clamping, reducing the chance of the chip bending or breaking. After clamping, the chip moves on the slide rail frame 21 with the positioning frame 22. With the help of the external pneumatic equipment and the connecting end block 23, the reset plate 24 can be moved into the recycling box 3 for easy unloading, reducing the risk of burns or inhalation of exhaust fumes that may occur during manual unloading.

[0050] Then, after the chip is soldered, the temperature drops during operation. Simultaneously, under the action of the push-limiting bracket 4, the buffer adhesive layer 452 adheres to the top of the chip. At this time, the air blowing pipe 43 is also positioned at the circular groove of the buffer adhesive plate 45. External equipment can then blow air along the air blowing pipe 43 to simply remove dust from the chip surface. Dust can adhere to the buffer adhesive layer 452, which has staggered grooves on its surface, reducing dust residue. Furthermore, the buffer adhesive plate 45 also reduces bumps during subsequent handling. After the air blowing cleaning is completed, a set of angle sliding shafts 47... Under the control of the motor, it moves outward. At this time, the sliding shaft 47 near the reset piece 451 remains in a fine state, and the movable block 461 at the top of the sliding shaft 47 at the movable end can be fed inward. Under the action of the conduction groove and the conduction shaft, the sliding shaft 47 is driven to move longitudinally, and the clamping piece at one end of the sliding shaft 47 is inserted into the gap, which can separate a buffer plate 45 attached to the top of the chip from the whole. At this time, the sliding shaft 47 corresponding to the reset piece 451 moves, and at the same time, the movable frame 41 is controlled to drive the fixed plate 44 to flip and move, which can attach a buffer plate 45 to the top of the chip after processing for auxiliary protection.

[0051] Finally, when multiple chips are stacked inside the recycling bin 3, the drive shaft 52 moves, which drives the transmission frame 53 to reciprocate, thus causing the top chips to move back and forth, making them evenly placed inside the recycling bin 3, reducing the possibility of uneven stacking. Furthermore, the weighing sensor 55 can measure the weight of a specific chip. Based on the feedback value difference, it can observe whether there are any omissions or operational errors during the application of the buffer adhesive 45, resulting in multiple buffer adhesive 45s being adhered to the top of a single chip. This allows for timely inspection and maintenance, reducing the impact on subsequent production processes. The weighing sensor 55 collects the total weight data of the stacked chips in real time and transmits it to the control system. The system calculates the theoretical increment of each chip after application based on the preset standard weight of the chip and buffer adhesive. If the actual increment exceeds the allowable error range, it is determined to be an application abnormality (such as over-application or omission). The system immediately issues an audible and visual alarm and records the abnormal location, facilitating timely troubleshooting and repair by operators, ensuring controllable production quality. This tooling can improve overall production efficiency by more than 30%, increase the yield rate by 10%-15%, and significantly reduce manpower requirements and production risks.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A calibration and loading fixture for chip soldering, characterized in that: include, The operating table (1) is provided with a fixed pad (11) on the top of the operating table (1) for connecting the positioning rail (2). The positioning rail (2) is movably provided with a positioning frame (22) for chip transmission. A recycling bin (3) is provided on one side of the operating table (1). A push limit frame (4) is provided on the outside of the recycling bin (3). A liftable combing seat (5) is provided at the bottom of the inner wall of the recycling bin (3). The push limiting frame (4) has a fixed plate (44) on one side, and the bottom of the fixed plate (44) has several sliding shafts (47) for limiting. The bottom of the fixed plate (44) is fitted with several buffer rubber plates (45). The buffer rubber plates (45) are used to adhere to the top of the chip for buffering and dust prevention. The combing seat (5) has a docking frame (54) on the top, and the docking frame (54) abuts against the bottom of the chip.

2. The calibration and loading fixture for chip welding according to claim 1, characterized in that: The push limit frame (4) is hinged to a movable frame (41) on one side. The fixed plate (44) is set on one side of the movable frame (41). The fixed plate (44) moves with the movable frame (41). The top of the fixed plate (44) is provided with a support frame (42). The top of the support frame (42) is provided with an air inlet plate, and the bottom of the air inlet plate is provided with a retractable air blowing pipe (43). The bottom of the fixed plate (44) is provided with several transmission shafts (46), and the transmission shafts (46) are provided with movable locking blocks (461). The sliding shaft (47) is located at the bottom of the movable locking block (461). One end of the sliding shaft (47) is provided with a pressing piece for pressing against the bottom of the buffer rubber plate (45). The movable locking block (461) is provided with a control motor for controlling the sliding shaft (47).

3. The calibration and loading fixture for chip welding according to claim 2, characterized in that: A set of guide rails (48) are connected to the bottom outer wall of the drive shaft (46). The guide rails (48) are provided with a transmission groove. The movable block (461) is connected to a transmission shaft on its side wall. The transmission shaft is movably disposed inside the transmission groove to control the longitudinal displacement of the movable block (461).

4. The calibration and loading fixture for chip welding according to claim 1, characterized in that: The buffer adhesive plate (45) has a circular hole, and the position of the circular hole corresponds to the air blowing pipe (43). The bottom of the buffer adhesive plate (45) is provided with a buffer adhesive layer (452). The buffer adhesive layer (452) has several staggered fixing grooves. The bottom edge of the air blowing pipe (43) is provided with several air blowing holes. The air blowing pipe (43) is used to blow air when the buffer adhesive layer (452) is attached to the chip surface, so as to leave dust and debris on the buffer adhesive layer (452). The buffer rubber plate (45) has a set of diagonally arranged edges that are reset pieces (451). The reset pieces (451) are elastic and can abut against the pressing pieces, and are used to assist in limiting the buffer rubber plate (45).

5. The calibration and loading fixture for chip welding according to claim 1, characterized in that: The recycling bin (3) is equipped with a set of snap-fit ​​pads (32) inside, and a set of snap-fit ​​brackets (31) is provided inside the recycling bin (3). The snap-fit ​​brackets (31) and snap-fit ​​pads (32) are used to adapt to different chip sizes and reduce bumps during unloading.

6. The calibration and loading fixture for chip welding according to claim 1, characterized in that: The combing seat (5) is provided with a positioning ring frame (51), and a number of reset rods (511) are inserted on the positioning ring frame (51). A transmission frame (53) is provided on the top of the reset rods (511). A drive shaft (52) is rotatably provided on the top of the combing seat (5). A guide groove for cyclic reset is provided on the outside of the drive shaft (52). A positioning protrusion is provided inside the transmission frame (53) and is used to reciprocate within a certain distance to push the chips stacked on the top of the combing seat.

7. The calibration and loading fixture for chip welding according to claim 1, characterized in that: The docking frame (54) is located on top of the transmission frame (53), and a weighing sensor (55) is provided on the docking frame (54). The weighing sensor (55) is used to measure the total weight of the stacked chips on top.

8. The calibration and loading fixture for chip welding according to claim 1, characterized in that: A set of slide rails (21) is installed on the top of the positioning track (2). The positioning frame (22) is movably arranged between the slide rails (21). One end of the positioning frame (22) is equipped with a connecting end block (23) that is connected to an external pneumatic device. The positioning frame (22) is equipped with a pneumatic push rod inside, and one end of the pneumatic push rod is connected to a reset plate (24) for chip positioning.

9. The calibration and loading fixture for chip welding according to claim 8, characterized in that: The reset plate (24) has a telescopic plate inside, and a hinge frame (26) is movably provided on one side of the telescopic plate. A rubber pad is provided on the top of the hinge frame (26), and several clamping clamps (25) are movably inserted on the top of the reset plate (24) for chip positioning and correction. The recycling bin (3) has a rectangular slot on the side near the reset plate (24) for the reset plate (24) to insert for unloading.

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