High-voltage attenuation assembly and high-voltage probe

Abstract

The embodiment of the invention provides a high-voltage attenuation assembly and a high-voltage probe, the high-voltage attenuation assembly is applied to the high-voltage probe, the high-voltage attenuation assembly comprises a shell, a metal shielding shell, a high-voltage attenuation circuit board, a first conductive connector and a first insulating part, the shell comprises a first end wall and a second end wall which are oppositely arranged, and the first end wall is provided with a first lead-out hole; the second end wall is provided with a second lead-out hole for the probe to pass through. The metal shielding shell is arranged in the shell; the high-voltage attenuation circuit board is accommodated in the metal shielding shell, and the probe is electrically connected with the high-voltage attenuation circuit board; the first conductive connector is electrically connected with the high-voltage attenuation circuit board and penetrates through the first lead-out hole, and the first conductive connector is used for being connected with a second conductive connector of the transmission line. According to the technical scheme provided by the invention, a space radiation path of high-frequency harmonic waves can be effectively suppressed, and the accuracy of a detection result is improved.

Description

Technical Field

[0001] This application relates to the field of electrical equipment technology, specifically to a high-voltage attenuation component and a high-voltage probe. Background Technology

[0002] A high-voltage differential probe is an electronic instrument that converts a high-voltage differential signal into a low-voltage signal recognizable by an oscilloscope using floating-ground measurement technology. It is primarily used for the safe and accurate measurement of the voltage difference between two test points, both of which may be at very high voltages to ground.

[0003] In related technologies, high-frequency harmonics from the high-voltage side circuit can easily couple directly to the analog circuit on the low-voltage side through spatial radiation, affecting the accuracy of the test results. Summary of the Invention

[0004] This application provides a high-voltage attenuation component and a high-voltage probe, which can effectively suppress the spatial radiation path of high-frequency harmonics and improve the accuracy of detection results.

[0005] This application is achieved through the following technical solution: In a first aspect, embodiments of this application provide a high-voltage attenuation component, which includes a housing, a metal shielding shell, a high-voltage attenuation circuit board, a first conductive connector, and a first insulating member. The housing includes a first end wall and a second end wall disposed opposite to each other. The first end wall is provided with a first lead-out hole, and the second end wall is provided with a second lead-out hole for a probe to pass through. The metal shielding shell is disposed inside the housing. The high-voltage attenuation circuit board is housed inside the metal shielding shell, and the probe is used to electrically connect to the high-voltage attenuation circuit board. The first conductive connector is electrically connected to the high-voltage attenuation circuit board and passes through the first lead-out hole. The first conductive connector is used to plug into and cooperate with the second conductive connector of the transmission line. The first insulating member is disposed between the high-voltage attenuation circuit board and the metal shielding shell.

[0006] In the technical solution of this application embodiment, the flow channel module is an integral structure, with the outer shell providing an overall structural framework and external protection. The first end wall and the second end wall are arranged opposite each other to form a closed space. The first lead-out hole and the second lead-out hole are respectively used for the safe lead-out of the signal line and the passage of the probe, ensuring the integrity of the signal transmission path while limiting the intrusion of external interference. A metal shielding shell is disposed inside the outer shell to form an electromagnetic barrier. The high-voltage attenuation circuit board is tightly housed within the metal shielding shell. The metal shielding shell can effectively absorb and reflect high-frequency harmonics, block the propagation path of high-frequency harmonics, and limit the leakage of high-frequency harmonics generated when the high-voltage attenuation circuit board is working, thereby reducing interference to the low-voltage side analog circuit. The first conductive connector is connected to the transmission line through the first lead-out hole. While ensuring the continuity of signal transmission, the through-hole structure of the first conductive connector can reduce shielding interruptions and maintain the radiation isolation effect. A first insulating component is disposed between the high-voltage attenuation circuit board and the metal shielding shell, providing reliable electrical insulation and preventing short circuits between the high-voltage attenuation circuit board and the metal shielding shell, thereby ensuring the integrity and shielding effectiveness of the metal shielding shell.

[0007] The aforementioned technical features work synergistically to form a dual protection system with the outer shell and the metal shielding shell. The first insulating component ensures the electrical independence of the shielding layer, while the first lead-out hole and the first conductive connector optimize the signal lead-out path and jointly eliminate the coupling channel of high-frequency harmonics through spatial radiation, thereby ensuring the accuracy of signal measurement.

[0008] Secondly, this application also provides a high-voltage probe, which includes a transmission line and a high-voltage attenuation component as described in the first aspect. The transmission line includes a second conductive connector and a third conductive connector. The second conductive connector is plugged into the first conductive connector, and the third conductive connector is plugged into a signal acquisition device.

[0009] In the technical solution of this application embodiment, by applying the above-mentioned high voltage attenuation component and combining the high voltage attenuation component with the transmission line in a plug-in manner, the spatial radiation path of high frequency harmonics in the high voltage side circuit is effectively blocked, the risk of high frequency harmonics in the high voltage side circuit coupling to the low voltage side analog circuit is reduced, and the accuracy of the detection results is improved. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of a high-voltage attenuation component provided in some embodiments of this application; Figure 2 This is a schematic diagram showing the disassembled structure of a high-voltage attenuation component provided in some embodiments of this application; Figure 3 This is a schematic diagram of the circuit principle of a high-voltage attenuation component provided in some embodiments of this application; Figure 4 This is a schematic diagram of the structure of a high-voltage attenuation circuit board provided in some embodiments of this application; Figure 5 This is a schematic diagram of the structure of a high-voltage attenuation circuit board provided in other embodiments of this application; Figure 6 A disassembled structural diagram of a high-voltage attenuation component provided in other embodiments of this application; Figure 7 A cross-sectional structural schematic diagram of a high-voltage attenuation component provided in some embodiments of this application; Figure 8 A schematic diagram of the circuit principle of a high-voltage probe provided in some embodiments of this application; Figure 9 The circuit diagram of the transmission line provided in some embodiments of this application is shown.

[0012] Figure label: 1000 - High-voltage probe; 100 - High-voltage attenuation component; 110 - Housing; 111 - First end wall; 1111 - First lead-out hole; 112 - Second end wall; 1121 - Second lead-out hole; 113 - First side wall; 120 - Metal shielding shell; 121 - Second side wall; 122 - Third end wall; 1221 - Third lead-out hole; 130 - High-voltage attenuation circuit board; 131 - Substrate; 132 - Current-limiting resistor; 133 - RC step-down network; 1331 - High-voltage resistor; 1332 - Capacitor ; 140 - First conductive connector; 150 - First insulating component; 160 - Second insulating component; 170 - Connecting plate; 200 - Transmission line; 210 - Second conductive connector; 211 - First conductive part; 212 - Second conductive part; 220 - Third conductive connector; 221 - Third conductive part; 222 - Fourth conductive part; 230 - Signal processing circuit; 231 - First impedance resistor; 232 - Waveform compensation network; 233 - Second impedance resistor; 234 - Voltage divider resistor; 235 - Voltage clamping. Detailed Implementation

[0013] To make this application clearer, specific embodiments are described below with reference to the accompanying drawings: This application proposes a high-voltage attenuation component, such as... Figures 1 to 3As shown, the high-voltage attenuation assembly 100 includes a housing 110, a metal shielding shell 120, a high-voltage attenuation circuit board 130, a first conductive connector 140, and a first insulating member 150. The housing 110 includes a first end wall 111 and a second end wall 112 disposed opposite to each other. The first end wall 111 is provided with a first lead-out hole 1111, and the second end wall 112 is provided with a second lead-out hole 1121 for the probe to pass through. The metal shielding shell 120 is disposed inside the housing 110. The high-voltage attenuation circuit board 130 is housed inside the metal shielding shell 120, and the probe is used to electrically connect to the high-voltage attenuation circuit board 130. The first conductive connector 140 is electrically connected to the high-voltage attenuation circuit board 130 and passes through the first lead-out hole 1111. The first conductive connector 140 is used to plug into and cooperate with the second conductive connector 210 of the transmission line 200. The first insulating member 150 is disposed between the high-voltage attenuation circuit board 130 and the metal shielding shell 120.

[0014] The housing 110 serves as the external support framework for the entire high-voltage attenuation assembly 100, providing physical protection and structural support for the structures housed within it. The housing 110 can be made of metal, engineering plastics, or other materials with sufficient strength and stability, such as aluminum alloy, stainless steel, or high-strength composite materials, to protect the components housed within it. The housing 110 can be designed as a closed, enclosed structure to protect the internal high-voltage attenuation circuit board 130 from environmental influences. A first end wall 111 and a second end wall 112 are located at opposite ends of the housing 110 along its length. The first end wall 111 has a first lead-out hole 1111, and the second end wall 112 has a second lead-out hole 1121. These two lead-out holes provide passageways for the first conductive connector 140 and the probe, respectively.

[0015] The metal shielding shell 120 is a shell-like structure disposed within the internal space of the outer shell 110. The interior of the metal shielding shell 120 forms a shielding cavity, preventing the electromagnetic radiation generated by the high-voltage attenuation circuit board 130 during operation from diffusing outwards. Simultaneously, it isolates electromagnetic interference from the external environment, improving the accuracy of the high-voltage attenuation circuit board 130 in receiving and processing high-voltage signals. Furthermore, it provides secondary structural protection for the internal high-voltage attenuation circuit board 130, reducing the impact of external vibrations on the core circuit. The metal shielding shell 120 can adopt a single-layer or multi-layer structure design. The material of the metal shielding shell 120 can be selected from metals with good conductivity, such as copper and aluminum, or the shielding effect can be enhanced through surface plating processes. The shape of the metal shielding shell 120 can be designed as rectangular, cylindrical, or other closed geometric structures to adapt to the installation requirements of different scenarios; this application does not limit this.

[0016] The high-voltage attenuation circuit board 130 is housed within the receiving cavity of the metal shielding shell 120. The high-voltage attenuation circuit board 130 integrates a high-voltage attenuation circuit, which attenuates the high-amplitude high-voltage signal input from the probe to a safe amplitude that subsequent equipment, such as signal acquisition devices and transmission lines 200, can withstand. For example, the high-voltage attenuation circuit board 130 can be a multilayer printed circuit board. Surface mount technology or through-hole mounting technology can be used to fix electronic components such as resistors and capacitors 1332 on the surface or inside the high-voltage attenuation circuit board 130 to complete the signal attenuation process. The high-voltage attenuation circuit board 130 can have pre-reserved electrical connection interfaces with the probe and the first conductive connector 140, such as solder pads or pins.

[0017] The first conductive connector 140 serves as the signal transmission interface between the high-voltage attenuation component 100 and the transmission line 200, enabling the output of the attenuated signal. The first conductive connector 140 is a pluggable connector, facilitating quick connection and disconnection between the first conductive structure and the transmission line 200. One end of the first conductive connector 140 is electrically connected to the high-voltage attenuation circuit board 130, which can be achieved through welding, plugging, spring clip clamping, threaded connection, or other methods. The other end of the first conductive structure passes through the first lead-out hole 1111 of the housing 110 and is exposed, adapting to the insertion dimensions of the second conductive structure on the transmission line 200.

[0018] The first insulating element 150 is an insulating structure disposed between the high-voltage attenuation circuit board 130 and the metal shielding shell 120. The first insulating element 150 can be made of ceramic, polytetrafluoroethylene, or other materials with high insulating properties. The thickness and shape of the first insulating element 150 can be adjusted according to actual electrical isolation requirements. The first insulating element 150 enables electrical isolation between the high-voltage attenuation circuit board 130 and the metal shielding shell 120, preventing short circuits or leakage caused by direct contact between the high-voltage attenuation circuit board 130 and the metal shielding shell 120, thus ensuring the safe operation of the high-voltage circuit. The first insulating element 150 can be a flexible material, buffering the mechanical structure between the high-voltage attenuation circuit board 130 and the shielding shell, reducing wear caused by external vibrations.

[0019] The probe passes through the second lead-out hole 1121 of the housing 110. One end is electrically connected to the high voltage attenuation circuit board 130, and the other end is used to connect to the external high voltage signal. It is the medium for the high voltage signal input component.

[0020] The technical solution of this application effectively blocks the spatial radiation path of high-frequency harmonics on the high-voltage side through a multi-layer shielding structure and insulation isolation mechanism, preventing high-frequency harmonics on the high-voltage side from coupling to the analog circuit on the low-voltage side, thereby ensuring the accuracy of signal measurement.

[0021] In this application's technical solution, the outer casing 110 provides an overall structural frame and external protection. The first end wall 111 and the second end wall 112 are arranged opposite to each other, forming a closed space. The first lead-out hole 1111 and the second lead-out hole 1121 are respectively used for the safe lead-out of signal lines and the passage of probes, ensuring the integrity of the signal transmission path while limiting the intrusion of external interference. A metal shielding shell 120 is disposed inside the outer casing 110, forming an electromagnetic barrier. The high-voltage attenuation circuit board 130 is tightly housed within the metal shielding shell 120. The metal shielding shell 120 can effectively absorb and reflect high-frequency harmonics, block the propagation path of high-frequency harmonics, and limit the leakage of high-frequency harmonics generated when the high-voltage attenuation circuit board 130 is working, thereby reducing interference to the low-voltage side analog circuit.

[0022] The first conductive connector 140 is plugged into the transmission line 200 through the first lead-out hole 1111. While ensuring the continuity of signal transmission, the through-hole structure of the first conductive connector 140 can reduce shielding interruptions and maintain radiation isolation effect. The first insulating element 150 is disposed between the high-voltage attenuation circuit board 130 and the metal shielding shell 120, providing reliable electrical insulation and preventing short circuits between the high-voltage attenuation circuit board 130 and the metal shielding shell 120, thereby ensuring the integrity and shielding effectiveness of the metal shielding shell 120.

[0023] The aforementioned technical features work together to form a dual protection system with the outer shell 110 and the metal shielding shell 120. The first insulating component 150 ensures the electrical independence of the shielding layer, and the first lead-out hole 1111 and the first conductive connector 140 optimize the signal lead-out path, jointly eliminating the coupling channel of high-frequency harmonics through spatial radiation, thereby ensuring the accuracy of signal measurement.

[0024] The metal shielding shell 120 can be grounded. It is connected to the system grounding terminal via conductive connections, such as grounding pins or a metal bracket, making it a conductor at the same potential as the earth. When blocking internal electromagnetic radiation or external interference, the surface of the metal shielding shell 120 will induced charge. Grounding allows these charges to be directly conducted to the earth, preventing charge accumulation and the formation of secondary electric fields, and eliminating the risk of the shielding shell itself becoming a source of interference.

[0025] In some embodiments, the first conductive connector 140 can be a coaxial cable connector. The first conductive structure has an inner conductor and an outer conductor that are insulated from each other. The inner conductor is made of a highly conductive material, such as a gold-plated copper core. The inner conductor is directly electrically connected to the signal output terminal of the high-voltage attenuation circuit board 130, such as the low-voltage side of the RC step-down network 133, and is responsible for transmitting the attenuated accurate signal. The outer conductor is a ring-shaped metal structure, such as a brass jacket. The outer conductor and the inner conductor are isolated by an insulating medium, such as polytetrafluoroethylene. At the same time, the outer conductor is fixed to the metal shielding shell 120 and conductively connected, such as by threading, welding, etc. Finally, it is grounded through the shielding layer of the back-end transmission line 200 or the test equipment, so that the internal shielding system naturally extends to the external transmission link through the interface, avoiding shielding interruption at the interface and reducing the interference leakage or intrusion of high-frequency harmonics at the connection between the first conductive connector 140 and the metal shielding shell 120.

[0026] According to some embodiments of this application, please refer to Figure 2 and Figure 3 The high-voltage attenuation circuit board 130 includes a substrate 131, a current-limiting resistor 132, and an RC step-down network 133. The RC step-down network 133 is connected in series between the current-limiting resistor 132 and the first conductive connector 140. The RC step-down network 133 includes a high-voltage resistor 1331 and multiple capacitors 1332. The current-limiting resistor 132, the high-voltage resistor 1331, and the multiple capacitors 1332 are all disposed on the substrate 131. The first end wall 111 and the second end wall 112 are disposed opposite to each other along a first direction, and the substrate 131 is parallel to the first direction.

[0027] The substrate 131 is an insulating substrate with integrated conductive circuitry, serving as the foundation for all circuit components. Electrical connections between components are achieved through pre-defined conductive circuits, ensuring the accuracy of the circuit topology. The substrate 131 can be a ceramic substrate 131 or an FR-4 high-voltage substrate 131. The substrate 131 is arranged parallel to a first direction, and mounting pads or holes for current-limiting resistors 132, high-voltage resistors 1331, and capacitors 1332 are pre-drilled on the surface of the substrate 131.

[0028] The current-limiting resistor 132 is a high-voltage adaptable resistor, which can be a metal film high-voltage resistor 1331, a wire-wound resistor, etc. The current-limiting resistor 132 is soldered and fixed to the substrate 131. It is connected in series between the probe input terminal and the RC step-down network 133, forming the first stage of the signal input / output circuit. The current-limiting resistor 132 limits the instantaneous current of the input high-voltage signal, preventing surge current from impacting the subsequent RC step-down network 133 and transmission line 200, thus protecting the safety of the entire circuit; it also initially suppresses signal spikes, laying the foundation for subsequent precise attenuation.

[0029] The RC step-down network 133 consists of a high-voltage resistor 1331 and multiple capacitors connected in series, which are connected in series between the current-limiting resistor 132 and the first conductive connector 140. Multiple capacitors 1332 are connected in series to form a capacitor bank, and the high-voltage resistor 1331 is connected in parallel with this capacitor bank. All components are soldered to corresponding pads on the substrate 131. The high-voltage resistor 1331 performs the main voltage division and attenuation function, working with the capacitor bank to reduce the current-limited high-voltage signal to a safe amplitude according to a preset ratio, adapting to the input requirements of the transmission line 200 and subsequent equipment. The series connection of multiple capacitors 1332 increases the overall withstand voltage to adapt to high-voltage scenarios, and also forms an RC filter circuit with the high-voltage resistor 1331 to filter out high-frequency noise in the signal, ensuring the stability of the attenuated signal.

[0030] The current-limiting resistor 132 can be a 40kV high-voltage flat-volume high-voltage resistor 1331, and the capacitor 1332 can be a 3kV ceramic capacitor 1332.

[0031] After the signal is received by the probe, it first passes through the current-limiting resistor 132 to suppress the current and perform preliminary wave stabilization, and then enters the RC step-down network 133. The signal amplitude is reduced by the voltage division effect of the high-voltage resistor 1331, while the capacitor bank filters noise and increases the withstand voltage. Finally, it is output to the transmission line 200 through the first conductive connector 140, realizing the complete functions of safe current limiting → precise attenuation → filtering and wave stabilization.

[0032] By designing the substrate 131 in a layout parallel to the first direction—that is, the substrate 131 can be a long strip-shaped plate structure, rather than a plate structure parallel to the first end wall 111 and horizontally arranged within the metal shielding shell 120—the axial space within the metal shielding shell 120 is fully utilized. Furthermore, the long strip-shaped substrate 131 can reserve sufficient mounting positions along the axial direction, providing a mounting foundation for the orderly axial arrangement of components such as the current-limiting resistor 132 and the RC step-down network 133, eliminating the need for stacking or compact compression. In addition, the signal transmission path extends in a straight line along the axial direction, minimizing the path from the probe access end to the first conductive connector 140, thus reducing signal transmission loss and delay on the substrate 131.

[0033] According to some embodiments of this application, please refer to Figure 2 and Figure 3 The inner wall of the metal shielding shell 120 is set as a cylindrical surface, and the substrate 131 passes through the central axis of the cylindrical surface.

[0034] The inner wall of the metal shielding shell 120 is set as a cylindrical surface. This can be understood as the metal shielding shell 120 forming a cylindrical shielding cavity inside, or as the metal shielding shell 120 as a cylindrical structure closed at one end and open at the other end. This application does not limit this interpretation. The electric and magnetic fields of the cylindrical surface are naturally symmetrically distributed, without any dead angles caused by sharp corners or abrupt changes in the plane. This allows for all-around envelopment of the internal circuitry, improving the consistency of electromagnetic shielding.

[0035] The substrate 131 passes through the central axis of the cylindrical surface, and part of the structure of the substrate 131 is located at the center of the internal space of the metal shielding shell 120. The substrate 131 can be fixed in the shielding shell by means of positioning brackets, slots or bolts to prevent the substrate 131 from shifting.

[0036] The insulating component can be formed by curing insulating adhesive that fills the internal space of the metal shielding shell 120, thereby fixing the substrate 131 in the internal space of the metal shielding shell 120.

[0037] By designing the inner wall of the metal shielding shell 120 as a cylindrical surface, and with the substrate 131 passing through the central axis of the cylindrical surface, the internal electric field diffuses uniformly in the radial direction. The substrate 131 is arranged in the central region with the smallest electric field gradient, thereby ensuring that components such as the current-limiting resistor 132, the high-voltage resistor 1331, and multiple capacitors 1332 are close to the path with the most uniform electric field distribution. This avoids the electric field concentration phenomenon caused by sharp corners or edges in traditional planar structures, prevents the breakdown of the first insulating component 150 due to local electric field concentration, reduces the radiation intensity of high-frequency harmonics in local areas, improves the overall shielding effectiveness of the metal shielding shell 120 against spatial radiation, and prevents high-frequency interference signals from penetrating into the low-voltage side circuit.

[0038] Based on the above embodiments, the current-limiting resistor 132, the high-voltage resistor 1331, and the plurality of capacitors 1332 can be disposed on the same side of the substrate 131 along its thickness direction; or, the current-limiting resistor 132, the high-voltage resistor 1331, and the plurality of capacitors 1332 can be disposed on two sides of the substrate 131 along its thickness direction, and this application does not limit this.

[0039] With the current-limiting resistor 132, the high-voltage resistor 1331 and multiple capacitors 1332 located on the same side of the substrate 131 along its thickness direction, the electrical connection paths of all components are concentrated on the same side of the substrate 131, reducing the number of wires across the thickness direction of the substrate 131 and lowering the risk of signal cross-interference.

[0040] With the current-limiting resistor 132, high-voltage resistor 1331 and multiple capacitors 1332 respectively disposed on both sides of the substrate 131 along its thickness direction, more components can be accommodated on the long strip substrate 131 of the same length, which is suitable for scenarios where the RC step-down network 133 requires multiple capacitors 1332 to be connected in series and the number of components is large.

[0041] According to some embodiments of this application, please refer to Figures 2 to 4 The substrate 131 passes through the central axis of the cylindrical surface. Along the thickness direction of the substrate 131, a current-limiting resistor 132 and multiple capacitors 1332 are disposed on one side of the substrate 131, and a high-voltage resistor 1331 is disposed on the other side of the substrate 131.

[0042] The substrate 131 continues to extend along the central axis of the cylindrical surface, with the thickness direction corresponding to the radial direction of the shielding shell, forming a centrally symmetrical base.

[0043] The current-limiting resistor 132 and multiple capacitors 1332 are concentrated on one side of the substrate 131, arranged in an orderly manner at intervals along a direction parallel to the central axis. The current-limiting resistor 132 and multiple capacitors 1332 are connected in series according to circuit requirements. The high-voltage resistor 1331 is arranged separately on the other side of the substrate 131, symmetrically distributed with the current-limiting resistor 132 and capacitors 1332 on the opposite side. Its position is offset or corresponds to the components on the opposite side along the axial direction, which helps to keep the radial distance of all components to the inner wall of the cylinder tending to be consistent. It conforms to the distribution law of a uniform electric field, without local abrupt changes in field strength.

[0044] Furthermore, the high-voltage resistor 1331 is electrically connected to the current-limiting resistor 132 on the opposite side and multiple capacitors 1332 through the via inside the substrate 131, which precisely matches the circuit topology requirements of the high-voltage resistor 1331 and the capacitor bank in parallel, reduces component cross wiring, and reduces signal interference and short circuit risk.

[0045] By symmetrically distributing the current-limiting resistor 132, capacitor 1332, and high-voltage resistor 1331, the electric field is placed in the radial region where the electric field is most uniform, avoiding sudden changes in local field strength, better adapting to the uniform electric field characteristics of the cylindrical shielding shell, and reducing the risk of breakdown of the first insulating component 150.

[0046] Furthermore, the current-limiting resistor 132 and the capacitor 1332 need to be connected in series and arranged axially on the same side to minimize the electrical connection path between them and avoid intersections, resulting in low signal loss. The high-voltage resistor 1331 needs to be connected in parallel with the capacitor bank. The cross-substrate connection can be achieved through vias on the substrate by arranging them on opposite sides, eliminating the need for complex wiring and fully matching the circuit functional requirements.

[0047] According to some embodiments of this application, such as Figure 5 As shown, along the thickness direction of the substrate 131, the current limiting resistor 132, the high voltage resistor 1331 and multiple capacitors 1332 are disposed on the same side of the substrate 131; the inner wall of the metal shielding shell 120 is configured as a cylindrical surface, and the current limiting resistor 132, the high voltage resistor 1331 and multiple capacitors 1332 are arranged at intervals along the central axis of the cylindrical surface and pass through the central axis of the cylindrical surface.

[0048] The inner wall of the metal shielding shell 120 is set as a cylindrical surface, which provides a uniform electromagnetic confinement environment, so that the electric field energy is confined within the cylindrical symmetrical structure.

[0049] The current-limiting resistor 132, the high-voltage resistor 1331, and multiple capacitors 1332 are arranged at intervals along the central axis of the cylindrical surface and pass through the central axis of the cylindrical surface. This can be understood as all electronic components being arranged at intervals along a direction parallel to the central axis of the cylindrical surface, and the connection lines of the electronic components coinciding with the central axis of the cylindrical surface.

[0050] By placing the current-limiting resistor 132, the high-voltage resistor 1331, and multiple capacitors 1332 on the same side of the substrate 131 along its thickness, the electric field distribution becomes more symmetrical and concentrated, avoiding electric field distortion caused by components distributed on both sides of the substrate 131 and effectively reducing outward radiation paths. The inner wall of the metal shielding shell 120 is set as a cylindrical surface, providing a uniform electromagnetic confinement environment, limiting the electric field energy within the cylindrical symmetrical structure. The current-limiting resistor 132, the high-voltage resistor 1331, and multiple capacitors 1332 are arranged at intervals along the central axis of the cylindrical surface and pass through the central axis, ensuring that the components are uniformly distributed on the cylindrical symmetry axis, forming a symmetrical radiation mode of the electric field along the central axis, minimizing the possibility of electric field leakage, thereby preventing high-frequency harmonics from coupling to the low-voltage side circuit through spatial radiation, and ensuring the accuracy of signal measurement. In addition, the above-mentioned high-voltage attenuation component 100, through optimized component layout and shielding structure design, forms a complete technical system, effectively solving the problem of asymmetrical electric field distribution caused by components distributed on both sides of the substrate 131, and improving overall performance.

[0051] Regardless of whether the current-limiting resistor 132, the high-voltage resistor 1331, and multiple capacitors 1332 are placed on the same side of the substrate 131 along the thickness direction or placed on both sides, the core commonality of the two layouts is to minimize the radial space occupation by concentrating the components in the central axis area, while meeting the insulation requirements, and ultimately achieving a compact component size without sacrificing electric field uniformity and core performance.

[0052] According to some embodiments of this application, please refer to Figure 2 and Figure 3 The outer casing 110 also includes a first sidewall 113, which has openings at opposite ends. The first endwall 111 and the second endwall 112 are both detachably connected to the first sidewall 113. The first endwall 111 closes one opening, and the second endwall 112 closes the other opening.

[0053] The outer casing 110 includes a first sidewall 113, a first endwall 111, and a second endwall 112. The first sidewall 113 is cylindrical, matching the shape of the inner cylindrical metal shielding shell 120. Both ends of the first sidewall 113 are open openings, providing mounting channels for internal structures such as the metal shielding shell 120 and the high-voltage attenuation circuit board 130.

[0054] The first end wall 111 and the second end wall 112 are independent cover plate structures, which are detachably connected to both ends of the first side wall 113. After connection, the first end wall 111 closes one end opening of the first side wall 113, and the second end wall 112 closes the other end opening, forming a complete closed containment space that encloses all components such as the internal metal shielding shell 120 and the substrate 131.

[0055] Both the first end wall 111 and the second end wall 112 are detachably connected to the first side wall 113. This means that the first end wall 111 and the second end wall 112 are connected to the first side wall 113 by means of threaded connection, snap-fit ​​connection, or pin connection, which enables quick assembly and disassembly of the first end wall 111 and the second end wall 112, improving maintenance efficiency. In practical applications, the opening design can be circular, rectangular, or polygonal, and the specific shape is determined according to the layout requirements of the internal components.

[0056] Sealing gaskets are provided at the connection points of the first end wall 111 and the second end wall 112 with the first side wall 113 to ensure the dustproof, waterproof and foreign object intrusion prevention effect after the outer shell 110 is sealed.

[0057] By designing the first sidewall 113 as a cylindrical structure with openings at both ends, it conforms to the shape of the internal cylindrical shielding shell, maximizing the use of internal space and providing uniform external support for the shielding shell, thereby enhancing the overall structural rigidity. Furthermore, the detachable design of the first endwall 111 and the second endwall 112 echoes the axially arranged substrate 131, allowing internal components to be installed or removed axially, avoiding assembly difficulties caused by the elongated structure of the substrate 131.

[0058] According to some embodiments of this application, please refer to Figure 2 and Figure 3 The outer casing 110 is made of metal.

[0059] The outer casing 110 is an external structure that houses and protects the internal components. The outer casing 110 can be made of a metal material with good electrical conductivity, such as aluminum alloy, stainless steel, or copper alloy. That is, the first sidewall 113, the first endwall 111, and the second endwall 112 are all made of metal. The metal outer casing 110 can effectively block external electromagnetic interference from entering the internal circuit and also prevent electromagnetic waves generated internally from radiating outward.

[0060] The outer shell 110 is made of metal and has a cylindrical closed structure, completely enclosing the inner metal shielding shell 120, forming a double-layer nested layout. The metal shielding shell 120 houses the core circuit board, while the outer shell 110 serves as an outer layer of protection and supplementary shielding, with a reasonable gap between the two.

[0061] The metal outer shell 110 forms a continuous electromagnetic shielding layer. Its conductivity effectively reflects and absorbs electromagnetic waves, blocking the propagation path of high-frequency harmonics through spatial radiation. The use of metal for the outer shell 110, together with the internal metal shielding shell 120, forms a complete double-layer shielding system, preventing harmonic energy generated by the high-voltage attenuation circuit board 130 from leaking into the external environment or external interference from intruding into the internal circuitry. Considering the characteristics of high-frequency signals in high-voltage differential measurement scenarios, the double-layer shielding system further reduces the electromagnetic interference affecting the signal during transmission, thereby maintaining the accuracy of voltage conversion.

[0062] The choice of material for the housing 110 directly enhances the overall shielding integrity, resolving the weak points in shielding caused by the non-metallic material and ensuring the stability of low-voltage side signal processing. Simultaneously, the metallic housing 110 also possesses excellent mechanical strength and heat dissipation performance, providing reliable physical protection and thermal management support for internal components.

[0063] Understandably, in other embodiments, the outer shell 110 may also be made of materials such as plastic or composite materials. In this case, the outer shell 110 is only used to provide physical protection for the internal structure. In this case, the outer shell 110 may be in direct contact with the metal shielding shell 120, or a buffer layer may be provided between the outer shell 110 and the metal shielding shell 120. This application does not limit this.

[0064] According to some embodiments of this application, please refer to Figure 6 and Figure 7 The high voltage attenuation component 100 also includes a second insulating member 160, which is disposed between the outer side wall of the metal shielding shell 120 and the inner side wall of the outer shell 110.

[0065] The second insulating member 160 is an annular insulating layer sandwiched between the outer sidewall of the metal shielding shell 120 and the inner sidewall of the outer shell 110. Along the axial direction of the metal shielding shell 120, both ends of the second insulating member 160 extend beyond both ends of the metal shielding shell 120, blocking the radial conductive path between the metal shielding shell 120 and the outer shell 110. Alternatively, a portion of the structure of the second insulating member 160 may cover both ends of the metal shielding shell 120, preventing both ends of the metal shielding shell 120 from contacting the first end wall 111 or the second end wall 112, thus blocking the radial and axial conductive paths between the metal shielding shell 120 and the outer shell 110. This application does not limit this aspect.

[0066] The second insulating element 160 is disposed between the outer wall of the metal shielding shell 120 and the inner wall of the outer shell 110, achieving electrical isolation between the metal outer shell 110 and the metal shielding shell 120. This prevents short circuits or safety hazards caused by conductive contact in the double-layer metal structure and is compatible with the overall design of the aforementioned double-layer shielding system. Simultaneously, the second insulating element 160 forms an elastic buffer or rigid limit between the outer wall of the metal shielding shell 120 and the outer shell 110, reducing the impact of vibration and impact during transportation and use on the internal shielding shell and circuit board, and preventing frictional wear between metal components.

[0067] The material of the second insulating component 160 can be ceramic, polytetrafluoroethylene, high-temperature resistant epoxy resin, etc.

[0068] By setting a second insulating element 160, the physical contact between the metal shielding shell 120 and the metal outer shell 110 is isolated. This not only ensures effective isolation of external electromagnetic interference, but also avoids the possibility of internal high-frequency harmonics coupling to the outer shell 110 through the conduction path, thereby significantly improving the accuracy of the detection signal and the reliability of the measurement.

[0069] According to some embodiments of this application, please refer to Figure 6 and Figure 7 The first end wall 111 and the second end wall 112 are arranged opposite to each other along the first direction. The metal shielding shell 120 includes a second side wall 121 and a third end wall 122. The third end wall 122 is connected to one end of the second side wall 121 along the first direction. The third end wall 122 is provided with a third lead hole 1221. The first conductive connector 140 passes through the third lead hole 1221 and is installed on the third end wall 122.

[0070] The second sidewall 121 is the main structure of the metal shielding shell 120. The second sidewall 121 can be designed as a cylindrical structure extending along the first direction, with its inner sidewall forming a cylindrical surface. Thus, the second sidewall 121 is coaxially adapted to the first sidewall 113 of the outer shell 110.

[0071] The third end wall 122 is a circular metal end plate, which is fixedly connected to one end of the second side wall 121 along the first direction. The third end wall 122 and the second side wall 121 enclose a semi-closed cavity with one end closed and the other end open.

[0072] The third lead-out hole 1221 is located at the center of the third end wall 122, and its diameter is adapted to the outer diameter of the first conductive connector 140, allowing the connector to pass through and be fixed. The third lead-out hole 1221 provides a precise mounting reference for the first conductive connector 140, ensuring that the inner conductor of the connector is coaxially aligned with the signal output terminal of the substrate 131, reducing eccentric loss and contact resistance in signal transmission, and ensuring signal integrity.

[0073] In the technical solution of this application, the second sidewall 121 and the third endwall 122 form a semi-closed cavity with one end open. The open end of the semi-closed cavity allows the high voltage attenuation circuit board 130 to be directly installed along the axial direction. The first conductive connector 140 can be pre-installed on the third endwall 122 and then electrically connected to the substrate 131, avoiding positional interference caused by installing the substrate 131 first and then inserting the connector, thus improving assembly efficiency.

[0074] When the first conductive connector 140 adopts a coaxial cable-specific connector, the third end wall 122 is electrically connected to the outer conductor of the first conductive connector 140. The second side wall 121, the third end wall 122, and the outer conductor of the first conductive connector 140 form a shielded link, eliminating the need for additional conductive connectors and simplifying the interface protection design.

[0075] Based on the above embodiments, the third end wall 122 and the second side wall 121 can be connected by welding, integral molding, or other methods to construct a conductive structure without splicing breaks. Combined with the semi-enclosed cavity design, this completely encloses the high-voltage attenuation circuit board 130, blocking internal high-frequency harmonic leakage and external electromagnetic interference intrusion. Furthermore, the welding or integral molding connection method allows the second side wall 121 and the third end wall 122 to form a rigid whole, ensuring the structural strength of the shielding cavity and preventing loosening of the connection due to vibration, indirectly protecting the internal circuitry from mechanical impact.

[0076] According to some embodiments of this application, please refer to Figure 6 and Figure 7 The high voltage attenuation component 100 also includes a connecting plate 170, which is located between the third end wall 122 and the first end wall 111 along the first direction. The connecting plate 170 connects the third end wall 122 and the outer shell 110.

[0077] The connecting plate 170 is a structural component used to bridge and fix the metal shielding shell 120 and the outer shell 110. The connecting plate 170 can directly bridge the third end wall 122 of the metal shielding shell 120 and the first end wall 111 of the outer shell 110, forming an axial support path and preventing mechanical loosening due to component gaps. The connecting plate 170 can be radially divided into a first connecting region and a second connecting region. The second connecting region is located radially outside the first connecting region. The first connecting region is connected to the metal shielding shell 120, and the second connecting region is connected to the outer shell 110, forming a radial support path and preventing mechanical loosening due to component gaps. This application does not limit the specific bridging position of the connecting plate 170.

[0078] The connecting plate 170 may be made of metal sheet, composite material plate or insulating material plate, and this application does not limit it.

[0079] The connecting plate 170 can be an annular structure with a clearance hole in the middle, through which the first conductive connector 140 passes. In some embodiments, the first conductive connector 140 has a flange portion, and the flange portion, the connecting plate 170, and the third sidewall are stacked along the thickness direction and locked together by fasteners. Of course, the connecting plate 170 and the third sidewall can also adopt other connection methods, which are not limited in this application.

[0080] In some embodiments, please refer to Figure 6 and Figure 7 The connecting plate 170 has a protruding connecting portion on its outer periphery. The portion of the first sidewall 113 near the first endwall 111 forms a stepped portion with two stepped surfaces. The connecting portion is connected to the first stepped surface of the stepped portion by fasteners, and the first endwall 111 is connected to the second stepped surface of the stepped portion by fasteners. Of course, the connecting plate 170 and the first sidewall 113 can be connected in other ways, and the connecting plate 170 can also be connected to the first endplate. This application does not limit this.

[0081] By connecting the outer shell 110 and the metal shielding shell 120 with the connecting plate 170, the shielding shell is ensured to remain stable under vibration or external stress, thereby maintaining the continuity of shielding and preventing high-frequency harmonics from leaking through gaps.

[0082] When the metal shielding cavity adopts a separate design of the second sidewall 121 and the third endwall 122, during the processing of the high-voltage attenuation component 100, the first conductive connector 140, the third endwall 122, and the connecting plate 170 can be pre-assembled as a whole. Then, the first conductive connector 140 and the high-voltage attenuation circuit board 130 are connected and conductive outside the second sidewall 121. Specifically, the first conductive connector 140 and the high-voltage attenuation circuit board 130 can be fixed and made conductive by welding. Afterward, the high-voltage attenuation circuit board 130 is extended from the end of the second sidewall 121 into the interior of the second sidewall 121, and the end of the second sidewall 121 is welded to the third endwall 122. This avoids the connection operation of the attenuation circuit board and the first conductive connector 140 inside the metal shielding shell 120, simplifies the installation operation, and improves the reliability of the connection between the high-voltage attenuation circuit board 130 and the first conductive connector 140.

[0083] According to some embodiments of this application, please refer to Figure 6 and Figure 7 The connecting plate 170 is made of insulating material.

[0084] The connecting plate 170 is a mechanical support component that connects the third end wall 122 and the outer shell 110. The connecting plate 170 can be made of ceramic, plastic or other materials with excellent insulation properties.

[0085] Since the connecting plate 170 is disposed between the first end wall 111 and the third end wall 122, the connecting plate 170 can block the axial conductive path between the metal shielding shell 120 and the outer shell 110. In conjunction with the second insulating member 160, a three-dimensional insulating protection is formed between the metal shielding shell 120 and the outer shell 110, avoiding the risk of contact conductivity between the metal shielding shell 120 and the outer shell 110.

[0086] By designing the connecting plate 170 as an insulating structure, mechanical support and axial positioning are achieved while strengthening the electrical isolation between the metal shielding shell 120 and the outer shell 110, avoiding the formation of abnormal conductive circuits or potential interference, and adapting to the insulation requirements of the double-layer shielding design. Furthermore, the connecting plate 170 integrates insulation and support functions, which can reduce the number of components in the high-voltage attenuation component 100 and simplify the overall structure of the high-voltage attenuation component 100.

[0087] This application also provides a high-voltage probe. Please refer to some embodiments of this application. Figure 8 and Figure 9 The high-voltage probe 1000 includes a transmission line 200 and the aforementioned high-voltage attenuation component 100. The transmission line 200 includes a second conductive connector 210 and a third conductive connector 220. The second conductive connector 210 is plugged into the first conductive connector 140 of the high-voltage attenuation component 100, and the third conductive connector 220 is used to plug into the signal acquisition device.

[0088] The second conductive connector 210 is a connection structure adapted to the first conductive connector 140 of the high voltage attenuation component 100. The second conductive connector 210 serves as the signal input from the high voltage attenuation component 100 to the transmission line 200.

[0089] The second conductive connector 210 can be a dedicated coaxial cable connector, which precisely matches the first conductive connector 140 via a plug-in method, achieving a stable connection without soldering and facilitating disassembly and maintenance. The inner conductor of the second conductive connector 210 receives the attenuated low-voltage signal transmitted by the first conductive connector 140, ensuring that the signal is transmitted to the inner conductor of the transmission line 200 without distortion. The outer conductor of the second conductive connector 210 is in close conductive contact with the outer conductor of the first conductive connector 140, continuing the full-link shielding of the shielding shell, the outer layer of the first connector, the outer layer of the second connector, and the transmission line 200, preventing signal leakage or external interference. The inner and outer conductors of the second conductive connector 210 are isolated by an insulating medium.

[0090] The third conductive connector 220 is a connection structure for the signal input terminal of the signal acquisition device. The third conductive connector 220 serves as the transmission line 200 to the signal output of the signal acquisition device. The signal acquisition device can be a signal acquisition module or an oscilloscope.

[0091] The third conductive connector 220 can be a dedicated coaxial cable connector, which seamlessly connects to the signal input terminal of the acquisition device via a plug-in method, achieving a stable connection without soldering and facilitating disassembly and maintenance. The third conductive connector 220 accurately inputs the pure signal transmitted by the transmission line 200 into the signal acquisition device, ensuring that the acquired signal data truly reflects the characteristics of the original high-voltage signal. The outer conductor of the third conductive connector 220 is conductive to the grounding terminal of the acquisition device, continuing the grounding closed loop of the full-link shielding, and conducting away the induced charge on the metal shielding shell 120 to avoid secondary interference. The inner and outer conductors of the third conductive connector 220 are isolated by an insulating medium.

[0092] By applying the high-voltage attenuation component 100 and combining it with the transmission line 200 in a plug-in manner, the spatial radiation path of high-frequency harmonics in the high-voltage side circuit is effectively blocked, reducing the risk of high-frequency harmonics in the high-voltage side circuit coupling to the low-voltage side analog circuit and improving the accuracy of the detection results.

[0093] The transmission line 200, adapted to the first conductive connector 140 and the second conductive connector 210, can be a coaxial cable. The inner conductor of the transmission line 200 receives the precise low-voltage signal output by the high-voltage attenuation component 100, while the outer conductor of the transmission line 200 is conductive to the outer conductor of the first conductive connector 140, maintaining full-link shielding. Specifically, the transmission line 200 can be a 50Ω low-resistance, high-insulation single-core metal wire braided shielded cable.

[0094] According to some embodiments of this application, please refer to Figure 8 and Figure 9 The second conductive connector 210 includes a first conductive portion 211 and a second conductive portion 212, and the third conductive connector 220 includes a third conductive portion 221 and a fourth conductive portion 222. The transmission line 200 also includes a signal processing circuit 230, which includes a first impedance resistor 231, a waveform compensation network 232, a second impedance resistor 233, a voltage divider resistor 234, and a voltage clamp 235. The first impedance resistor 231 and the second impedance resistor 233 are connected in series between the first conductive portion 211 and the third conductive portion. Between 221; one end of waveform compensation network 232 is electrically connected between the first impedance resistor 231 and the second impedance resistor 233, and the other end of waveform compensation network 232 is electrically connected to the second conductive part 212 and the fourth conductive part 222; one end of voltage divider resistor 234 and one end of voltage clamp 235 are both electrically connected between the second impedance resistor 233 and the third conductive connector 220, and the other end of voltage divider resistor 234 and the other end of voltage clamp 235 are both electrically connected to the second conductive part 212 and the fourth conductive part 222.

[0095] The first conductive part 211 of the second conductive connector 210 is the inner conductor of the coaxial cable connector, the second conductive part 212 of the second conductive connector 210 is the outer conductor of the coaxial cable connector, the third conductive part 221 of the third conductive connector 220 is the inner conductor of the coaxial cable connector, and the fourth conductive part 222 of the third conductive connector 220 is the outer conductor of the coaxial cable connector.

[0096] The first impedance resistor 231 is connected in series in the main signal path between the first conductive part 211 and the third conductive part 221, and together with the second impedance resistor 233, it achieves characteristic impedance matching of the transmission line 200. A stable resistance value ensures that the signal is not reflected during transmission, laying the foundation for subsequent waveform correction and amplitude adjustment.

[0097] The waveform compensation network 232 is an RC network consisting of a fixed capacitor, an adjustable capacitor, and a trimming resistor. The fixed capacitor provides the basic high-frequency path; the adjustable capacitor can be an air variable capacitor or a film variable capacitor, used for fine adjustment of the high-frequency compensation amount; the trimming resistor works with the capacitor to adjust the phase characteristics. Through the capacitive reactance adjustment and impedance adjustment of the waveform compensation network 232, high-frequency losses and phase shifts generated during signal attenuation and transmission are compensated.

[0098] For example, when the high-frequency components of a signal attenuate too quickly, an adjustable capacitor can increase the capacitive reactance of the high-frequency path, making it easier for the high-frequency signal to pass through and restoring the steepness of the rising and falling edges of the waveform; an adjustable resistor can adjust the phase to compensate for the phase lag in signal transmission and ensure that the output waveform is in phase with the original high-voltage signal.

[0099] The second impedance resistor 233 is connected in series with the first impedance resistor 231 to achieve fine impedance calibration. At the factory, the second impedance resistor 233 is fine-tuned to compensate for component tolerances and impedance fluctuations of the transmission line 200, ensuring the total resistance perfectly matches the characteristic impedance of the transmission line 200. In the field, R3 can be fine-tuned according to the impedance characteristics of different transmission lines 200 or acquisition devices to adapt to dynamic scenarios and improve the probe's versatility.

[0100] The voltage divider resistor 234 and the second impedance resistor 233 form a voltage divider circuit, which precisely adjusts the output signal amplitude to match the range of the acquisition device. The high-precision resistor ensures the accuracy of the voltage division ratio, so that the signal received by the acquisition device is within the optimal range, avoiding overload or underamplitude distortion.

[0101] The voltage clamp 235 can be a bidirectional transient suppression diode. When an abnormal high voltage passes through the transmission line 200, the voltage clamp 235 diode quickly turns on, clamping the output voltage within a safe threshold to prevent the signal acquisition device from being damaged by overvoltage, while not affecting the transmission of normal signals.

[0102] Effective suppression of high-frequency harmonics is achieved through specific connections between the components. The first impedance resistor 231 and the second impedance resistor 233 are connected in series between the first conductive part 211 and the third conductive part 221. Based on the impedance matching principle, this reduces signal reflection and the generation of high-frequency harmonics, thereby avoiding noise amplification problems caused by impedance discontinuities. One end of the waveform compensation network 232 is connected between the first impedance resistor 231 and the second impedance resistor 233, and the other end is connected to the second conductive part 212 and the fourth conductive part 222. This topology effectively extracts the signal characteristics of the voltage divider point, specifically compensates for high-frequency distortion, and guides high-frequency noise to the reference ground or a low-impedance path, blocking its propagation to the low-voltage side analog circuit. One end of the voltage divider resistor 234 and the voltage clamp 235 are connected between the second impedance resistor 233 and the third conductive connector 220, and the other end is connected to the second conductive part 212 and the fourth conductive part 222. This connection method realizes the signal voltage attenuation and overvoltage protection functions based on the dynamic characteristics of the output end, while bypassing residual high-frequency noise to the ground wire to prevent it from coupling to the signal acquisition device. Overall, the connection positions and topology of each component form a multi-level filtering and shielding mechanism, which suppresses the generation of high-frequency harmonics at the source and cuts off their coupling path, thereby ensuring the purity of low-voltage side signal processing.

[0103] The above examples illustrate the principles and implementation methods of the present invention. These embodiments are merely illustrative and intended to aid in understanding the method and core concepts of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A high-voltage attenuation component (100), characterized in that, include: The outer casing (110) includes a first end wall (111) and a second end wall (112) disposed opposite to each other. The first end wall (111) is provided with a first lead-out hole (1111), and the second end wall (112) is provided with a second lead-out hole (1121) for the probe to pass through. A metal shielding shell (120) is disposed inside the outer shell (110); A high-voltage attenuation circuit board (130) is housed within the metal shielding shell (120), and the probe is used to electrically connect to the high-voltage attenuation circuit board (130). The first conductive connector (140) is electrically connected to the high voltage attenuation circuit board (130) and passes through the first lead-out hole (1111). The first conductive connector (140) is used to plug into the second conductive connector (210) of the transmission line (200). The first insulating element (150) is disposed between the high voltage attenuation circuit board (130) and the metal shielding shell (120).

2. The high-voltage attenuation component (100) according to claim 1, characterized in that, The high-voltage attenuation circuit board (130) includes a substrate (131), a current-limiting resistor (132), and an RC step-down network (133). The RC step-down network (133) is connected in series between the current-limiting resistor (132) and the first conductive connector (140). The RC step-down network (133) includes a high-voltage resistor (1331) and multiple capacitors (1332). The current-limiting resistor (132), the high-voltage resistor (1331), and the multiple capacitors (1332) are all disposed on the substrate (131). The first end wall (111) and the second end wall (112) are disposed opposite each other along a first direction, and the substrate (131) is parallel to the first direction.

3. The high-voltage attenuation component (100) according to claim 2, characterized in that, The inner wall of the metal shielding shell (120) is set as a cylindrical surface, and the substrate (131) passes through the central axis (1) of the cylindrical surface. Preferably, along the thickness direction of the substrate (131), the current-limiting resistor (132) and the plurality of capacitors (1332) are disposed on one side of the substrate (131), and the high-voltage resistor (1331) is disposed on the other side of the substrate (131).

4. The high-voltage attenuation component (100) according to claim 2, characterized in that, Along the thickness direction of the substrate (131), the current-limiting resistor (132), the high-voltage resistor (1331), and the plurality of capacitors (1332) are disposed on the same side of the substrate (131). The inner wall of the metal shielding shell (120) is set as a cylindrical surface. The current limiting resistor (132), the high voltage resistor (1331) and the plurality of capacitors (1332) are arranged at intervals along the central axis (1) of the cylindrical surface and pass through the central axis (1) of the cylindrical surface.

5. The high-voltage attenuation component (100) according to any one of claims 1 to 4, characterized in that, The outer casing (110) also includes a first sidewall (113) having openings at opposite ends. The first endwall (111) and the second endwall (112) are detachably connected to the first sidewall (113). The first endwall (111) closes one of the openings, and the second endwall (112) closes the other opening.

6. The high-voltage attenuation component (100) according to any one of claims 1 to 4, characterized in that, The outer shell (110) is made of metal; Preferably, the high voltage attenuation component (100) further includes a second insulating member (160), which is disposed between the outer sidewall of the metal shield (120) and the inner sidewall of the outer shell (110).

7. The high-voltage attenuation component (100) according to any one of claims 1 to 4, characterized in that, The first end wall (111) and the second end wall (112) are arranged opposite to each other along the first direction. The metal shielding shell (120) includes a second side wall (121) and a third end wall (122). The third end wall (122) is connected to one end of the second side wall (121) along the first direction. The third end wall (122) is provided with a third lead-out hole (1221). The first conductive connector (140) passes through the third lead-out hole (1221) and is installed on the third end wall (122).

8. The high-voltage attenuation component (100) according to claim 7, characterized in that, The high voltage attenuation component (100) further includes a connecting plate (170) located between the third end wall (122) and the first end wall (111) along the first direction, and the connecting plate (170) connects the third end wall (122) and the outer shell (110). Preferably, the connecting plate (170) is made of insulating material.

9. A high-voltage probe (1000), characterized in that, include: The transmission line (200) includes a second conductive connector (210) and a third conductive connector (220), the third conductive connector (220) being used for plugging into a signal acquisition device; According to any one of claims 1 to 8, the high voltage attenuation component (100) is configured to be plugged into the first conductive connector (140) and the second conductive connector (210).

10. The high-voltage probe (1000) according to claim 9, characterized in that, The second conductive connector (210) includes a first conductive part (211) and a second conductive part (212), and the third conductive connector (220) includes a third conductive part (221) and a fourth conductive part (222). The transmission line (200) also includes a signal processing circuit (230), which includes a first impedance resistor (231), a waveform compensation network (232), a second impedance resistor (233), a voltage divider resistor (234), and a voltage clamp (235). The first impedance resistor (231) and the second impedance resistor (233) are connected in series between the first conductive part (211) and the third conductive part (221); One end of the waveform compensation network (232) is electrically connected between the first impedance resistor (231) and the second impedance resistor (233), and the other end of the waveform compensation network (232) is electrically connected to the second conductive part (212) and the fourth conductive part (222). One end of the voltage divider resistor (234) and one end of the voltage clamp (235) are electrically connected between the second impedance resistor (233) and the third conductive connector (220). The other end of the voltage divider resistor (234) and the other end of the voltage clamp (235) are electrically connected to the second conductive part (212) and the fourth conductive part (222).

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