Test assembly

Abstract

The invention provides a testing assembly, and relates to the technical field of testing. The test assembly comprises at least one detection module and a circuit board, each detection module is detachably arranged at a detection point on the to-be-tested product, and each detection module is used for at least testing one working parameter of the to-be-tested product. The circuit board comprises at least one connector and a connecting circuit, the connecting circuit is distributed in a grid shape and forms at least one intersection part, the part, located between the adjacent intersection parts, of the connecting circuit is a connecting section, the connecting section has a plurality of stretching states, and the distance between the two corresponding intersection parts is changed by switching the stretching states of the connecting section, so that the connecting circuit is connected with the connector. At least one intersection part is moved to be close to the detection point position, the intersection parts are detachably connected with the to-be-detected product, and the detection modules are electrically connected with the corresponding intersection parts. The device can integrate a temperature and / or vibration measurement function, and is suitable for the interior of small electronic equipment or an installation scene with a narrow structural gap.

Description

Technical Field

[0001] This application relates to the field of testing technology, and more particularly to a testing component. Background Technology

[0002] As the performance of small consumer electronics products continues to improve, their power consumption and heat generation have increased significantly. To ensure stable operation within safe temperatures, active cooling with built-in fans is typically employed. In this process, thermal management is coupled with vibration and noise issues, creating complex testing challenges: the heat generated during device operation continuously accumulates, requiring fan cooling to control the temperature of critical components; simultaneously, fan operation introduces mechanical vibration, which, transmitted through the structure, can not only affect device reliability but also generate additional noise. Therefore, during product testing, synchronously and accurately monitoring the temperature and vibration of key points of the product under active fan cooling conditions becomes a crucial task for evaluating its overall performance and quality.

[0003] Currently, the industry commonly uses discrete devices to measure relevant parameters, but this approach has significant shortcomings in practical applications. For example, vibration measurement often uses accelerometers or vibration testers, but these sensors are typically large and difficult to adapt to installation scenarios inside small equipment or in structures with narrow gaps. Temperature measurement can use infrared thermal imagers or thermocouples, but the former has limited accuracy in controlled environments such as constant temperature chambers, while the latter requires laying wires, which are susceptible to physical pulling interference and have complex wiring, making it difficult to meet the needs of miniaturized and portable testing. Summary of the Invention

[0004] In view of this, the purpose of this application is to overcome the shortcomings of the prior art and provide a test component that can integrate temperature and / or vibration measurement functions and adapt to installation scenarios with small internal or structural gaps in small electronic devices, so as to achieve accurate and stable parameter monitoring.

[0005] This application provides the following technical solution: This application embodiment provides a test component, the test component comprising: At least one detection module, each detection module being detachably disposed at a detection point on the product under test, and each detection module being used to test at least one working parameter of the product under test; The circuit board includes at least one connector and connecting lines. The connecting lines are distributed in a grid pattern and form at least one junction. The portion of the connecting lines between adjacent junctions is a connecting segment. The connecting segment has multiple extension states. By switching the extension states of the connecting segment, the spacing between two corresponding junctions is changed, causing at least one junction to move closer to the detection point. The junction and the product under test are detachably connected. The detection module is electrically connected to the corresponding junction.

[0006] In some embodiments, the number of detection modules is multiple, and each detection module is used to test different operating parameters of the product under test.

[0007] In some embodiments, at least one of the detection modules is a temperature detection module, which is used to detect the temperature parameters of the product under test; and / or, at least one of the detection modules is a vibration detection module, which is used to detect the vibration parameters of the product under test.

[0008] In some embodiments, if the detection module is a temperature detection module, the temperature detection module is a temperature sensor array.

[0009] In some embodiments, the test assembly further includes a power module detachably connected to the product under test, the power module being electrically connected to one of the junctions to supply power to the circuit board.

[0010] In some embodiments, the power module includes a battery and a thermoelectric generator, the thermoelectric generator being electrically connected to the battery, the thermoelectric generator module being used to convert the heat energy generated by the product under test during operation into electrical energy to charge the battery, and the battery being electrically connected to one of the junctions to supply power to the circuit board.

[0011] In some embodiments, the circuit board further includes a controller electrically connected to the connection line, and the controller is also wirelessly connected to the terminal.

[0012] In some embodiments, the detection module and the corresponding junction are detachably electrically connected.

[0013] In some embodiments, the connecting segment is an elastic structure and is wound around the same plane multiple times in a folded manner to form a ring structure from the innermost ring to the outermost ring, with gaps between adjacent rings.

[0014] In some embodiments, each loop of the connecting segment includes two straight segments and two arc segments, the straight segments and the arc segments are alternately arranged, and the arc segments on the same side of each loop are coaxially arranged.

[0015] The embodiments of this application have the following advantages: This application provides a testing assembly comprising at least one independent detection module. Each module can be configured according to testing requirements (such as temperature measurement, vibration measurement, or a combination thereof) and is detachably mounted on key detection points on the surface of the product under test (such as a small consumer electronics product), allowing the sensor to be directly close to a heat source or vibration source, ensuring the directness and accuracy of the sensed signal. All detection modules are powered and transmit signals via a single circuit board. The circuit board's connecting lines are distributed in a grid pattern, with intersections forming multiple junctions. The key innovation lies in the fact that the connecting segments between adjacent junctions have multiple extension states (e.g., achieved through serpentine routing, flexible materials, or stretchable structures). During installation, the distance between any two junctions can be flexibly changed by manually or using tools to switch the extension states of these connecting segments (e.g., stretching or contracting). This allows the operator to move and align one or more junctions on the circuit board with the corresponding detection module mounting location. Subsequently, the junction is mechanically secured to the surface of the product under test (e.g., via Velcro, micro-clips, or low-tack pads) while simultaneously establishing an electrical connection with the corresponding detection module (e.g., via a micro-interface or contact point). Ultimately, the circuit board itself forms a stable sensor network support structure capable of adapting to the product's shape and internal spatial layout.

[0016] Compared to existing technologies that use discrete and bulky equipment for measurement, this testing component achieves miniaturized integration and unified deployment of multiple sensors, including temperature and vibration sensors. All detection modules are powered and communicate through the same grid circuit system, fundamentally ensuring the time synchronization of multi-point parameter data acquisition. This provides an accurate and correlated data foundation for analyzing multi-physics coupling problems such as thermal-vibration-noise. The grid-like circuit and its extendable connecting sections give the entire component extremely high deformation freedom, easily conforming to irregular product surfaces and fitting into narrow gaps within equipment or PCB boards, solving the problems of traditional rigid sensors and wiring harnesses being unable to accommodate or route wires. The miniaturized detection modules can be directly mounted, reducing the impact of sensor quality on the product's vibration characteristics. The robust, detachable connection avoids the poor contact or signal noise caused by the pulling and displacement of traditional thermocouple wires. Compared to infrared thermal imagers, direct contact temperature measurement is unaffected by the testing environment, resulting in higher accuracy and stability.

[0017] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This illustration shows a schematic diagram of the structure of a test component provided in an embodiment of this application from one perspective; Figure 2 This illustration shows a structural schematic diagram of a test component provided by an embodiment of this application from another perspective; Figure 3 This illustration shows a structural schematic diagram of a test component provided by an embodiment of this application from yet another perspective; Figure 4 This illustration shows a structural schematic diagram from another perspective of a test component provided by an embodiment of this application.

[0020] Explanation of key component symbols: 100 - Circuit board; 110 - Connecting section; 111 - Arc section; 112 - Straight section; 120 - Intersection; 200 - Product under test; 300 - Temperature detection module; 400 - Power supply module; 500 - Vibration detection module; 600 - Connector. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0022] It should be noted that when an element is said to be "fixed" to another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly" on another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the template description is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] In related technologies, with the continuous improvement of the performance of small consumer electronics products, their power consumption and heat generation have increased significantly. To ensure stable operation of the devices at safe temperatures, active cooling with built-in fans is usually adopted. In this process, thermal management is coupled with vibration and noise issues, constituting a complex testing challenge: the heat generated by the device operation continuously accumulates, requiring fan cooling to control the temperature of critical components; at the same time, fan operation introduces mechanical vibration, which, transmitted through the structure, may not only affect the reliability of the device but also generate additional noise. Therefore, during the product testing phase, how to synchronously and accurately monitor the temperature and vibration of key points of the product under active fan cooling has become an important task for evaluating its comprehensive performance and quality. Currently, the industry generally uses discrete devices to measure relevant parameters separately, but this has significant shortcomings in practical applications. For example, vibration measurement often uses accelerometers or vibration testers, which are usually large in size and difficult to adapt to installation scenarios inside small devices or in structures with narrow gaps. Temperature measurement can be performed using an infrared thermal imager or a thermocouple. The former has limited accuracy in controlled environments such as constant temperature chambers, while the latter requires the laying of wires, and the connection is easily affected by physical pulling interference. In addition, the wiring is complicated and cannot meet the needs of miniaturized and portable testing.

[0027] As shown in Figure 1 and Figure 2As shown, to solve the above-mentioned technical problems, this application provides a testing component, which includes at least one detection module and a circuit board 100. Each detection module is detachably disposed at a detection point on the product under test 200, and each detection module is used to test at least one working parameter of the product under test 200. The circuit board 100 includes at least one connector 600 and connecting lines. The connecting lines are distributed in a grid pattern and form at least one junction 120. The portion of the connecting lines located between adjacent junctions 120 is a connecting segment 110. The connecting segment 110 has multiple extension states. By switching the extension states of the connecting segment 110, the spacing between two corresponding junctions 120 is changed, so that at least one junction 120 moves closer to the detection point. The junction 120 and the product under test 200 are detachably connected, and the detection module is electrically connected to the corresponding junction 120.

[0028] This embodiment provides a test component for simultaneously monitoring temperature and / or vibration parameters at key points during reliability or thermal management testing of small consumer electronics products.

[0029] Each testing module is configured to be detachably mounted on the product under test 200 at preset testing points. The testing modules can integrate different types of sensors according to testing requirements. If temperature measurement is required, a built-in miniature thermistor or digital temperature sensor, such as the SHT45, is used, which integrates temperature and humidity sensing.

[0030] If vibration measurement is required, a built-in MEMS accelerometer, such as the ADI ADXL355, is available.

[0031] Temperature and vibration sensors can also be integrated to form a composite detection module.

[0032] Each testing module has a magnetic structure, removable adhesive, or micro-clip at the bottom, which allows it to be quickly, securely, and without damage attached to the surface or internal structure of the product under test 200, facilitating reuse and position adjustment.

[0033] The flexible circuit board 100 is made of polyimide substrate, possessing high flexibility, high temperature resistance, and good electrical insulation. The circuit board 100 includes: Multiple connectors 600 are used for communication with external data acquisition devices.

[0034] The connecting lines are distributed in a grid pattern, exhibiting an orthogonal or honeycomb topology.

[0035] Multiple junctions 120, i.e., cross nodes connecting the lines, each junction 120 is provided with a pad or socket interface for electrical connection to the corresponding detection module.

[0036] The connecting segment 110 between adjacent junctions 120 has multiple extended states. For example, the connecting segment 110 can be designed as follows: The serpentine routing method changes the 120mm spacing between the two intersections by stretching or compressing the serpentine section. Alternatively, it can incorporate a micro-folding hinge structure, allowing for localized bending.

[0037] By manually or with the aid of tools, adjusting the extension state of the connecting section 110 (such as straightening, curling, or folding), the junction 120 can be moved to a position close to the target detection point, thereby accurately deploying the detection module into a narrow or irregular space.

[0038] The junction 120 and the product under test 200 can be detachably connected by a micro magnet, a vacuum adsorption pad or a temporary adhesive to ensure that the circuit board 100 is stably positioned during the test and to prevent the circuit from becoming loose due to fan vibration.

[0039] The detection module is electrically connected to the corresponding junction 120 via plug-in, welding or Z-axis conductive adhesive. The signal is collected by the grid line to the connector 600 and output to the external analysis system to realize the synchronous and real-time acquisition of temperature and vibration parameters.

[0040] In this embodiment, the connecting segment 110 adopts a multi-level serpentine routing structure. Each serpentine routing segment contains 3 to 5 U-shaped bends, and naturally appears compactly curled. When it is necessary to increase the distance between the two intersections 120, the two ends are gently pulled horizontally, and the serpentine portion gradually unfolds.

[0041] In addition, the surface of the connecting section 110 is covered with an elastic protective layer (such as a silicone coating) to prevent bending fatigue fracture and improve anti-interference ability.

[0042] In this embodiment, a detection module integrates a digital temperature sensor, a three-axis MEMS accelerometer, and a micro signal conditioning circuit.

[0043] The module connects to the junction 120 via a multi-pin flexible ribbon cable, supporting multiplexed transmission of multiple signals. The controller (integrated on the circuit board 100) can switch the sampling frequency as needed and achieve data synchronization through timestamp alignment.

[0044] Furthermore, the workflow of this application is as follows: First, the detection modules are positioned at key points on the product according to the test plan. Second, the grid circuit board 100 is placed over the product, and the extension of the connecting sections 110 is adjusted to align and bring the junctions 120 close to their respective detection modules. Next, the junctions 120 are fixed and the electrical connection is established. Finally, the test is initiated, and the detection modules simultaneously collect signals such as temperature and vibration, transmitting them through the grid-like connection lines to a unified processing terminal for analysis.

[0045] In some embodiments, there are multiple detection modules, each of which is used to test different operating parameters of the product under test 200.

[0046] In this embodiment, the testing component is configured with multiple testing modules, the number of which can be flexibly set according to the complexity of the product under test 200, with a typical configuration of 2 to 6. Each testing module is deployed at different key points on the product under test 200 and is used to test different types of operating parameters, thereby achieving a comprehensive evaluation of the product's thermal-vibration coupling behavior.

[0047] The detection module is installed on the surface of the CPU heat sink and has a built-in high-precision digital temperature sensor, such as MAX31875, for real-time monitoring of the temperature rise in the chip area.

[0048] The detection module is fixed to the fan motor housing and integrates a triaxial MEMS accelerometer, such as ST LIS2DH12, to collect mechanical vibrations caused by the operation of the fan.

[0049] The detection module is placed in a weak area of ​​the equipment housing (such as near the shaft) and integrates a temperature sensor and a single-axis accelerometer to assess the risk of structural thermal deformation and resonance.

[0050] The detection modules are electrically connected to their nearest junctions 120 via grid connection lines on the flexible circuit board 100. Because the connecting section 110 has an adjustable extension state, even if the spatial distribution of each detection point is irregular, the corresponding junctions 120 can be precisely aligned by local stretching or folding, ensuring reliable access for each module.

[0051] The external data acquisition system synchronously reads the output signals of each module through the unified connector 600 and aligns multi-dimensional data such as temperature and vibration based on timestamps.

[0052] In some embodiments, at least one detection module is a temperature detection module 300, which is used to detect the temperature parameters of the product under test 200; and / or, at least one detection module is a vibration detection module 500, which is used to detect the vibration parameters of the product under test 200.

[0053] In this embodiment, the multiple detection modules in the testing assembly can be flexibly configured as a temperature detection module 300, a vibration detection module 500, or a composite detection module, depending on the testing objective. The following describes three typical configuration modes: Case containing only temperature detection module 300 In some thermal management tests, only temperature distribution needs to be monitored. In this case, all detection modules are temperature detection modules 300. For example: Each temperature sensing module 300 incorporates a built-in NTC thermistor, soldered onto a flexible substrate. The bottom of each temperature sensing module 300 is coated with high thermal conductivity silicone to ensure good thermal contact with the surface being measured. Temperature signals from each point are transmitted to the data acquisition terminal via a grid of lines on the flexible circuit board 100.

[0054] Case containing only vibration detection module 500 In structural reliability verification, only the vibration detection module 500 needs to be deployed. For example: Each vibration detection module 500 integrates a low-noise MEMS accelerometer, such as the Bosch BMA456. The vibration detection module 500 employs a rigid miniature housing to avoid self-resonance interference. It is secured to easily vibrating components such as fan brackets, hinges, or screen bezels via a magnetic base.

[0055] The coexistence of temperature and vibration detection modules 500 In a comprehensive performance evaluation scenario, the test component includes at least one temperature detection module 300 and at least one vibration detection module 500. For example, the temperature detection module 300 is deployed on the surface of the heat-generating chip, and the vibration detection module 500 is mounted on the housing of an adjacent fan motor. The two are connected to the same data link through different junctions 120 on the flexible circuit board 100.

[0056] In some embodiments, if the detection module is a temperature detection module 300, the temperature detection module 300 is a temperature sensor array.

[0057] In this embodiment, when the detection module is configured as a temperature detection module 300, it does not contain only a single temperature sensing unit, but adopts a miniaturized temperature sensor array structure to achieve precise capture of the temperature gradient in a local area.

[0058] Specifically, the temperature sensor array is integrated onto a flexible substrate, on which multiple temperature sensing units, such as 4, 9, or 16, are arranged in a regular grid. Each temperature sensing unit can be a miniature digital temperature sensor chip, an ultra-thin film thermopile, or a high-sensitivity thermistor.

[0059] Each sensing unit is electrically connected to the corresponding junction 120 on the flexible circuit board 100 via an independent signal line or a multiplexed bus.

[0060] This temperature sensor array can be installed as a whole as a detection module in the critical hot zone of the product under test 200. Due to the good fit of the flexible carrier plate, even if there is slight curvature or unevenness on the surface to be measured, the array can still maintain good thermal contact between each sensing unit and the surface being measured.

[0061] In some embodiments, the test assembly also includes a power module 400, which is detachably connected to the product under test 200 and electrically connected to one of the junctions 120 to supply power to the circuit board 100.

[0062] In this embodiment, the test assembly further includes a power module 400 for providing a stable operating power supply to the flexible circuit board 100 and the test module connected thereto, which is particularly suitable for the following scenarios: The product under test 200 is in a mobile state, the test environment restricts external cables, and electromagnetic interference or wiring complexity caused by external power supply must be avoided.

[0063] For example, the power module 400 is a miniature rechargeable battery unit. The entire power module 400 is encapsulated in a lightweight polymer housing and can be attached to a non-critical surface of the product under test 200 without affecting its normal operation.

[0064] The power module 400 is detachably connected to the product under test 200 in any of the following ways: Magnetic fixation: A miniature neodymium magnet is embedded at the bottom, which is attracted to the metal structure of the product.

[0065] Removable adhesive: High-temperature removable adhesive is used, and no residue is left after testing.

[0066] Meanwhile, the output of the power module 400 is electrically connected to any junction 120 on the flexible circuit board 100 via a flexible ribbon cable or direct contact. This junction 120 is dedicated to power supply, and its grid connection lines distribute the power signal to the area where each detection module is located.

[0067] Because the connecting section 110 has an adjustable extension state, even if the power module 400 is installed far from the main detection area, the power supply junction 120 can be brought closer to the power module 400 by stretching the corresponding connecting section 110, thus ensuring reliable electrical contact.

[0068] In some embodiments, the power module 400 includes a battery and a thermoelectric generator, the thermoelectric generator and the battery being electrically connected, the thermoelectric generator module being used to convert the heat energy generated by the product under test 200 during operation into electrical energy to charge the battery, the battery being electrically connected to one of the junctions 120 to supply power to the circuit board 100.

[0069] In this embodiment, the power module 400 of the test component adopts a hybrid power supply architecture, including a micro rechargeable battery, a thermoelectric generator, and a power management unit. The three work together to achieve a closed-loop energy cycle of ambient thermal energy, electrical energy, energy storage, and power supply.

[0070] Thermoelectric generators are based on the Seebeck effect and are composed of multiple pairs of pn-type thermoelectric materials encapsulated in series.

[0071] One side (hot end) of the thermoelectric generator is tightly attached to the heat-generating area of ​​the product under test 200 using a highly thermally conductive interface material (such as thermal grease or graphene film). The other side (cold end) is exposed to air or has a micro heat sink attached to it to maintain an effective temperature difference.

[0072] The output of the thermoelectric generator is connected in parallel with a miniature lithium polymer battery after passing through a boost DC-DC converter. When the output voltage of the thermoelectric generator exceeds the start-up threshold, the boost circuit is automatically activated. The low-voltage, high-internal-resistance electrical energy generated by the thermoelectric generator is boosted to trickle charge the battery. When the product under test shuts down or the temperature difference disappears, it automatically switches to battery power mode.

[0073] The battery's output terminal is electrically connected to a dedicated power supply junction 120 on the flexible circuit board 100 via flexible leads, thereby providing a stable power supply to all detection modules and signal conditioning circuits through a grid-like connection line.

[0074] The entire power module 400 is detachably connected to the product under test 200. The TEG hot end face is directly attached to the heat source. The module edge is provided with micro magnetic points or removable adhesive areas to ensure stability and not affect heat conduction.

[0075] Thanks to the adjustable connection section 110 of the flexible circuit board 100, even if the installation position of the power module 400 is limited (such as only being able to be close to a heat-generating chip), the power supply junction section 120 can be precisely connected to the power output terminal by stretching the corresponding connection section 110, thus avoiding stress from rigid wiring.

[0076] In some embodiments, the circuit board 100 also includes a controller electrically connected to a connection line, and the controller is also wirelessly connected to a terminal.

[0077] In this embodiment, a micro controller is further integrated on the flexible circuit board 100 to coordinate the data acquisition, signal processing, and communication scheduling of each detection module. The controller is electrically connected to each junction 120 through the mesh-like connection lines and establishes a wireless connection with external terminal devices (such as smartphones, tablets, or PCs) through a built-in wireless module to achieve remote monitoring and configuration.

[0078] For example, the controller uses a low-power system-on-a-chip, with typical options including Nordic nRF52840 or ESP32-PICO-V3.

[0079] The controller is soldered or bonded to a specific area of ​​the flexible circuit board 100 and connected to various junctions 120 via dedicated signal lines in the mesh connection circuit. For example, the temperature detection module 300 is connected to the controller via an I²C bus. The vibration detection module 500 is connected via an SPI bus. The power supply module 400 is supplied with operating voltage through the power supply junction 120. Thanks to the scalability of the connection section 110, even if the controller position is fixed, the wiring layout can be adjusted to accommodate different module distributions.

[0080] The controller has a built-in wireless communication module that supports at least one of the following protocols: Bluetooth Low Energy, Wi-Fi, Zigbee / NB-IoT.

[0081] In some embodiments, the detection module and the corresponding junction 120 are detachably electrically connected.

[0082] In this embodiment, the detection modules and their corresponding junctions 120 are not fixed by welding or permanent bonding, but by a detachable electrical connection, which allows users to quickly replace, reconfigure or repair the detection modules according to testing needs without replacing the entire flexible circuit board 100.

[0083] Option 1: Miniature magnetic contact connection Gold-plated magnetic contacts are embedded on the surface of the junction 120, and a ferromagnetic conductive pad is provided at the corresponding position on the bottom of the detection module. When the module approaches, the magnetic force automatically attracts and aligns it, realizing a reliable electrical connection of multiple signals and power.

[0084] Option 2: Flexible socket-plug structure The junction section 120 integrates a miniature FPC socket, with a flexible ribbon cable plug leading out from the tail of the detection module. After insertion, it is locked by a flip cover to achieve high-density signal transmission.

[0085] In some embodiments, the middle part of the connecting segment 110 is folded and wrapped around multiple times in the same plane, the connecting segment 110 has an innermost ring and an outermost ring, and the connecting segment 110 is configured as an elastic structure.

[0086] In this embodiment, the connecting segment 110 located between adjacent junctions 120 in the flexible circuit board 100 is designed as a compact elastic telescopic structure, specifically constructed as follows: The conductive lines of connecting segment 110 are not straight or simply serpentine, but rather: first, they are folded together along the center line, that is, the lines are folded from the middle to form a double-layered parallel path. Then, the folded double-line structure is wound around concentrically multiple times to form a planar spiral similar to a mosquito coil.

[0087] For example, the number of wrapping turns is 2 to 5. The innermost turn is close to the geometric center, and the outermost turn is connected to the junction 120. The connecting section 110 is generally flat and disc-shaped.

[0088] When the structure is not under stress, it is in a compressed state. When it is necessary to increase the 120mm gap between the two intersecting parts, the two ends are gently pulled radially, and the spiral structure gradually unfolds, with the outermost ring extending outward to achieve length adjustment.

[0089] To ensure reliability under repeated expansion and contraction, the substrate of the connecting section 110 is made of modified polyimide or thermoplastic polyurethane with high elastic modulus. The conductor of the connecting section 110 is a non-solid copper strip to improve fatigue resistance. The surface of the connecting section 110 is covered with an elastic protective layer to prevent bending cracking. Rounded transitions are provided at each corner to avoid stress concentration.

[0090] Meanwhile, the multi-coil structure provides a buffering effect, effectively absorbing the mechanical impact transmitted from the fan vibration to the circuit board 100, and improving signal stability.

[0091] like Figure 3 As shown, in some embodiments, each loop of the connecting segment 110 includes two straight segments 112 and two arc segments 111, the straight segments 112 and the arc segments 111 are alternately arranged, and the arc segments 111 on the same side of each loop are coaxially arranged.

[0092] In this embodiment, the single-loop structure of the connecting segment 110 consists of alternating straight segments 112 and arc segments 111. That is, each loop of the connecting segment 110 is formed by connecting two straight segments 112 and two arc segments 111 end to end in sequence, forming a loop that approximates a racetrack shape.

[0093] Smooth transition fillets are used between each segment to avoid etching breakage or current concentration.

[0094] like Figure 3 As shown, all the arc segments 111 on the same side share the same center of rotation. Specifically, the centers of curvature of all the left arc segments 111 coincide with the first axis; the centers of curvature of all the right arc segments 111 coincide with the second axis. The distance between the first and second axes is the length of the straight segment 112, which determines the height of each ring. This double-center coaxial nesting design ensures that when the entire connecting segment 110 is stretched, each ring unfolds radially synchronously with a consistent trajectory, avoiding local stress concentration caused by continuous curvature changes in traditional Archimedean spirals. The expansion and contraction process is smooth, without jamming or twisting.

[0095] It should be noted that the connecting section 110 forms a stretchable structure in three axial directions. The flexible circuit board 100 itself has a certain degree of flexibility and can achieve basic bending deformation. However, relying solely on its flexibility cannot meet the requirements for conforming to complex curved surfaces. The zigzag structure of the connecting section 110 has a three-dimensional expandability with two different axes that can be adjusted. The principle is that by expanding the size in the Y-axis direction, it has a greater stretching rate in the X-axis and out-of-plane directions. Therefore, the in-plane X-axis and the out-of-plane direction are the two main stretching directions. Through the zigzag connection structure, the spatial expansion of its flexibility is achieved, and its size and in-plane stretching rate can be adjusted by formulas. It can achieve stretching deformation in three axial directions, so as to achieve a good fit with the complex curved surface of the measured product.

[0096] Such as Figure 4 The effect of the test component conforming to the cylindrical surface is shown. First, when there are usage scenarios with large curvatures, large stretching rates or other three-dimensional direction deformations between adjacent test points, additional connecting sections 110 can be added between adjacent connectors 600, making the main stretching direction of the zigzag of the connecting section 110 parallel to the direction with a larger stretching rate, so as to achieve a better fit with the measured product. Second, for measured products 200 of different sizes, compatibility can be achieved by arranging the connecting sections 110 with zigzag structures in the compatible direction. Among them, the stretching rates of the zigzag connection structure in two in-plane directions can be adjusted by the parameters height H, initial radius R, width D, and number of turns n. The specific adjustment formulas are as follows, so as to achieve specific sizes and stretching effects.

[0097]

[0098]

[0099] Among them, D is determined by the wiring and number of layers of its connecting section 110. If the maximum number of wirings of one layer of the board is x, then D ≥ (2x 1)×0.15mm, R is determined by the size requirements of the actual measured product 200. Generally, 0.05mm ≤ R ≤ D; n and H are adjustable items. Generally, 0.5 ≤ n ≤ 5. The stretching rate of the system can be adjusted by adjusting n, but an increase in n will cause signal attenuation, and reasonable values need to be taken according to the actual product size. Generally, 0 ≤ H ≤ the size of the detection module. When H = 2R + D, the stretching rates of the X-axis and Y-axis are basically the same, and the stretching rate distribution of the x and y axes can be adjusted by H.

[0100] Exemplarily, four connecting sections 110 are connected at intervals around the periphery of each intersection part 120, and are divided into odd-numbered groups and even-numbered groups in sequence. The number of connecting sections 110 in both the odd-numbered group and the even-numbered group is two, and the connecting sections 110 in the odd-numbered group and the even-numbered group are alternately arranged along the circumference of the intersection part 120, and the straight line segments 112 of the connecting sections 110 in the odd-numbered group and the even-numbered group are perpendicularly arranged.

[0101] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0102] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A test component, characterized in that, The test components include: At least one detection module, each detection module being detachably disposed at a detection point on the product under test, and each detection module being used to test at least one working parameter of the product under test; The circuit board includes at least one connector and connecting lines. The connecting lines are distributed in a grid pattern and form at least one junction. The portion of the connecting lines between adjacent junctions is a connecting segment. The connecting segment has multiple extension states. By switching the extension states of the connecting segment, the spacing between two corresponding junctions is changed, causing at least one junction to move closer to the detection point. The junction and the product under test are detachably connected. The detection module is electrically connected to the corresponding junction.

2. The test component according to claim 1, characterized in that, The number of detection modules is multiple, and each detection module is used to test different operating parameters of the product under test.

3. The test component according to claim 2, characterized in that, In each of the detection modules, at least one of the detection modules is a temperature detection module, which is used to detect the temperature parameters of the product under test; and / or, at least one of the detection modules is a vibration detection module, which is used to detect the vibration parameters of the product under test.

4. The test component according to claim 2, characterized in that, If the detection module is a temperature detection module, then the temperature detection module is a temperature sensor array.

5. The test component according to claim 1, characterized in that, The test assembly also includes a power module that is detachably connected to the product under test. The power module is electrically connected to one of the junctions to supply power to the circuit board.

6. The test component according to claim 5, characterized in that, The power module includes a battery and a thermoelectric generator, which is electrically connected to the battery. The thermoelectric generator is used to convert the heat energy generated by the product under test during operation into electrical energy to charge the battery. The battery is electrically connected to one of the junctions to supply power to the circuit board.

7. The test component according to claim 1, characterized in that, The circuit board also includes a controller, which is electrically connected to the connection line and is also wirelessly connected to the terminal.

8. The test component according to claim 1, characterized in that, The detection module and the corresponding junction are detachably electrically connected.

9. The test component according to claim 1, characterized in that, The connecting segment is an elastic structure and is folded in half and wound around the same plane multiple times to form a ring structure from the innermost ring to the outermost ring, with gaps between adjacent rings.

10. The test component according to claim 9, characterized in that, Each ring of the connecting segment includes two straight segments and two arc segments, with the straight segments and arc segments arranged alternately, and the arc segments on the same side of each ring arranged coaxially.

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