Substrate carrier and motor vehicle

Abstract

The invention relates to a substrate carrier (10) for mounting an electronic component (110), comprising a base body (12), at least one conductor path (20) and at least one electronic component (110), the at least one electronic component (110) being electrically conductively connected to the at least one conductor path (20) by means of at least one solder joint (30). The main body (12) has at least one pressure relief through-hole (40), the pressure relief through-hole (40) being designed to reduce thermal expansion of the solder joint (30) due to thermal expansion of the main body (12). The invention also relates to a motor vehicle (100) having at least one substrate carrier (10).

Description

Technical Field

[0001] This invention relates to a substrate carrier for assembling electronic components, particularly suitable for motor vehicles. Furthermore, this invention also relates to a motor vehicle having at least one substrate carrier. Background Technology

[0002] Printed circuit boards (PCBs) known in the prior art are made from a variety of different material combinations. For heat-sensitive electronic components and / or electronic components in mounting environments with high heat loads, various cooling solutions exist. One known cooling solution involves heat dissipation at least partially through the PCB itself. For this purpose, the PCB is made of a material with excellent thermal conductivity.

[0003] The drawback of known solutions is that electronic components and printed circuit boards typically have different thermal expansion characteristics, which can cause stress and / or cracks in electronic components and / or connection points (especially solder joints of electronic components), thereby reducing the reliability and / or lifespan of the device. Summary of the Invention

[0004] Therefore, the object of the present invention is to overcome, or at least partially overcome, the aforementioned disadvantages of the prior art. In particular, the object of the present invention is to provide a substrate carrier by which the assembly of electronic components and reliable conductive connections between the electronic components can be achieved particularly easily. Furthermore, the object of the present invention is also particularly to provide a motor vehicle having at least one substrate carrier.

[0005] The above objective is achieved by the claims. In particular, this objective is achieved by a substrate carrier having the features of independent claim 1. Furthermore, this objective is achieved by a motor vehicle having the features of independent claim 15.

[0006] Other advantages and details of the invention will be set forth in the dependent claims, the specification, and the drawings. Features relating to the substrate carrier described herein are also applicable to the motor vehicle described herein, and vice versa; therefore, the disclosures regarding various aspects of the invention are always mutually referenced or can be mutually referenced.

[0007] According to a first aspect of the invention, the above-mentioned objective is achieved by a substrate carrier for assembling electronic components. The substrate carrier includes a substrate, at least one printed conductor, and at least one electronic component, wherein the at least one electronic component is electrically connected to the at least one printed conductor via at least one solder joint. The substrate has at least one pressure relief via, wherein the at least one pressure relief via is designed to reduce thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate.

[0008] The substrate carrier is preferably understood as a circuit board for assembling electronic components. The electronic components are preferably understood as electronic and / or electrical parts, especially surface mount devices (SMDs), which are arranged and / or fixed on and / or at least partially arranged and / or fixed in the substrate. The electronic components are preferably arranged on the upper and / or lower sides of the substrate. The substrate is preferably designed as a plate and / or has a main extending plane. The substrate preferably has a thickness perpendicular to the main extending plane.

[0009] The substrate carrier includes at least one printed conductor, preferably multiple printed conductors, for conductive connections of various electronic components. The electronic components are conductively connected to the printed conductor via solder joints. The at least one printed conductor is preferably designed to pass around and / or beside the at least one pressure relief via. The at least one printed conductor is preferably located on and / or on the substrate. Therefore, the at least one printed conductor is preferably not located inside the substrate.

[0010] The substrate preferably includes multiple pressure relief through holes. Particularly preferably, the substrate provides at least one pressure relief through hole for each solder joint, and in particular, at least two or more solder joints have at least one shared pressure relief through hole.

[0011] The core advantage of this invention lies in reducing or even avoiding thermal expansion of solder joints and / or electronic components due to thermal expansion of the substrate. This reduction or even avoidance of load and / or expansion is achieved through at least one pressure relief via in the substrate of the substrate carrier described in this invention. Therefore, the at least one pressure relief via can reduce or avoid cracking in the solder joints during the service life of the substrate carrier.

[0012] Figuratively and exemplarily, the at least one stress-relief via enables at least partial decoupling between the thermal expansion of the substrate and the expansion of the solder joints and / or the thermal expansion of the electronic components, or at least reduces the synergistic effect between the two. The at least one stress-relief via is preferably a material notch and / or a space where substrate material has been removed. The at least one stress-relief via is preferably opened before the at least one electronic component is assembled on the substrate carrier to avoid damage to the at least one electronic component.

[0013] Within the scope of this invention, thermal stretching is preferably understood both as the expansion and contraction of the substrate, electronic components, and / or solder joints. In other words, thermal stretching preferably also includes thermal compression. Thermal stretching is preferably caused by an increase or decrease in the temperature of the corresponding device, wherein the temperature change can be actively caused by the device itself or passively caused by other devices and / or the environment.

[0014] The geometry of the at least one pressure relief through-hole is preferably customizable according to the type and / or location of the electronic components and / or solder joints, for example, based on computational fluid dynamics (CFD) and / or finite element method (FEM) simulations.

[0015] This substrate carrier design has particular advantages because it allows for easy assembly of electronic components through the at least one pressure relief through-hole, and enables a particularly simple and reliable conductive connection between the at least one electronic component and the at least one printed wire through at least one solder joint.

[0016] According to a preferred embodiment of the invention, the substrate carrier is designed as an aluminum circuit board and / or an insulated metal substrate (IMS) circuit board, particularly wherein the substrate is at least partially, and particularly entirely, made of aluminum. Designing the substrate carrier as an aluminum circuit board and / or an IMS circuit board advantageously enables heat dissipation from at least one electronic component through the substrate carrier itself. Therefore, it advantageously saves on the mounting space, materials, and costs required for additional cooling solutions. For example, for high-power LED technology and high-heat-generating electronic devices, aluminum circuit boards and / or IMS circuit boards are ideal for dissipating heat from electronic components. The substrate is at least partially, and particularly entirely, made of aluminum. The aluminum substrate carrier preferably does not have an inner layer for printed conductors. This design of the substrate carrier has particular advantages because, especially through the design of the substrate, it allows for convenient mounting of electronic components, while enabling particularly simple and reliable conductive connections between the at least one electronic component and the at least one printed conductor via at least one solder joint.

[0017] According to a preferred embodiment of the invention, the at least one pressure relief via in the substrate carrier may be designed as a through-hole extending from the upper side to the lower side of the substrate. The upper and lower sides of the substrate are preferably understood as surfaces arranged opposite each other on the substrate. The at least one pressure relief via is preferably designed as a through-hole in the substrate. This design of the at least one pressure relief via enables low-cost manufacturing and effectively reduces thermal expansion of solder joints and / or the at least one electronic component due to thermal expansion of the substrate. The substrate notch and / or substrate material removal for the at least one pressure relief via preferably advantageously alters the direction of thermal expansion of the substrate, thereby advantageously reducing or even avoiding thermal expansion of solder joints and / or the at least one electronic component. The design of the at least one pressure relief via advantageously reduces the risk of cracking in solder joints and / or damage to electronic components.

[0018] According to a preferred embodiment of the present invention, in the substrate carrier, the main extension of the at least one pressure relief via may be specified to be transverse to the main extension of the at least one electronic component and / or parallel to the main extension of the at least one solder joint.

[0019] The main extension of a device should be understood as its maximum geometric extension. Figuratively and exemplarily, for an electronic component that is significantly longer than its width and height, its length is its main extension direction.

[0020] The advantageous arrangement and / or orientation of the at least one pressure relief via can particularly effectively reduce thermal stretching of solder joints and / or the at least one electronic component due to thermal stretching of the substrate. The main extension of the at least one pressure relief via is preferably transverse to the main extension arrangement of the at least one electronic component. Alternatively or additionally, the main extension of the at least one pressure relief via is parallel to the main extension arrangement of the at least one solder joint. Figuratively speaking, the at least one pressure relief via is preferably parallel to an elongated solder joint arrangement and / or transverse to an elongated electronic component arrangement, thereby advantageously reducing thermal stretching of solder joints and / or the at least one electronic component due to thermal stretching of the substrate.

[0021] This substrate carrier design has particular advantages because, especially through the design of the at least one pressure relief through-hole, the substrate carrier can be conveniently assembled with electronic components, and the conductive connection between the at least one electronic component and the at least one printed wire can be achieved particularly easily and reliably through at least one solder joint.

[0022] According to a preferred embodiment of the invention, in the substrate carrier, the main extension of the at least one pressure relief via may be specified as a multiple of 1.0 to 2.0, particularly 1.2 to 1.5, relative to the main extension of the at least one electronic component and / or the at least one solder joint. The width of the at least one pressure relief via is preferably at least the same as the width of the at least one electronic component and / or the at least one solder joint, and particularly preferably greater than the width of the at least one electronic component and / or the at least one solder joint. This design of the pressure relief via advantageously reduces or even avoids thermal stretching of the solder joint and / or at least one electronic component due to thermal stretching of the substrate. In particular, in conjunction with the orientation and / or arrangement of the at least one pressure relief via relative to the at least one electronic component and / or at least one solder joint described above, the substrate carrier of the invention achieves advantageous operation and enables a particularly reliable conductive connection between the at least one electronic component and the at least one printed conductor via at least one solder joint. The wider the design of the at least one pressure relief via and / or the greater the multiple of the main extension of the at least one pressure relief via relative to the main extension of the at least one electronic component and / or the main extension of the at least one solder joint, the more effectively the at least one electronic component and / or the at least one solder joint can be isolated from the thermal stretching of the substrate.

[0023] According to a preferred embodiment of the invention, in the substrate carrier, the at least one pressure relief via may be designed to be adjacent to and / or at least partially surrounding the at least one solder joint, the at least one printed conductor, and / or the at least one electronic component. Figuratively and exemplaryly, the at least one pressure relief via is arranged at at least one end face of an elongated electronic component and its solder joint. Within the scope of the invention, the arrangement of the at least one pressure relief via adjacent to and / or at least partially surrounding the at least one solder joint, the at least one printed conductor, and / or the at least one electronic component is preferably understood as the at least one pressure relief via being directly adjacent to the at least one solder joint, the at least one printed conductor, and / or the at least one electronic component. The at least one pressure relief via is preferably designed to extend at least partially along the at least one solder joint, the at least one printed conductor, and / or the at least one electronic component. The at least one solder joint and the at least one pressure relief via preferably do not spatially overlap to avoid the solder joint being adversely affected by the pressure relief via, and vice versa. This substrate carrier design has particular advantages because, especially through the arrangement of the at least one pressure relief through-hole, the substrate carrier can be conveniently assembled with electronic components, and the conductive connection between the at least one electronic component and the at least one printed wire can be achieved particularly easily and reliably through at least one solder joint.

[0024] According to a preferred embodiment of the invention, the at least one pressure relief via may be configured in the substrate carrier to be at least partially disposed below the at least one electronic component. Distributing the at least one pressure relief via at least partially below the at least one electronic component advantageously reduces and / or avoids thermal expansion of the at least one electronic component due to thermal expansion of the substrate. This design and / or arrangement of the at least one pressure relief via is particularly advantageous for electronic components with low heat dissipation requirements through the substrate, reducing thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate. The substrate carrier designed in this way has particular advantages because, especially by designing and / or arranging the at least one pressure relief via at least partially below the at least one electronic component, the substrate carrier facilitates the assembly of electronic components. Furthermore, the substrate carrier preferably enables particularly simple and reliable conductive connection between the at least one electronic component and the at least one printed conductor via at least one solder joint.

[0025] According to a preferred embodiment of the invention, the substrate carrier may be specified to have a thickness of at least 0.8 mm, particularly at least 1.1 mm, 1.3 mm, or 1.5 mm. The substrate carrier is preferably a plate-like structure. The substrate preferably has a main extending plane, wherein the thickness is preferably understood as a dimension perpendicular to the main extending plane. Setting the substrate thickness to at least 0.8 mm, particularly at least 1.1 mm, 1.3 mm, or 1.5 mm, advantageously ensures that the substrate carrier remains as flat as possible even under heat influence, while also saving materials and costs. Furthermore, such a substrate design provides favorable heat dissipation for electronic components and / or solder joints. The at least one pressure relief via is preferably provided and / or opened along the thickness direction through the substrate.

[0026] According to a preferred embodiment of the invention, the substrate carrier may include at least one heat conduction device designed to dissipate heat from the substrate and / or at least one electronic component. The at least one heat conduction device is preferably designed as an active and / or passive heat conduction device. The heat conduction device is preferably at least partially integrated into the substrate and / or thermally connected to the substrate. Exemplarily, the heat conduction device may be designed as a heat sink, heat fin, heat pipe, and / or heat accumulator. A substrate carrier designed in this way can particularly advantageously regulate the temperature of the at least one electronic component and / or the at least one solder joint. The heat conduction device is preferably capable of dissipating heat to reduce thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate. Therefore, the heat conduction device advantageously assists the function of the at least one pressure relief via, thereby enabling advantageous operation of the substrate carrier and / or the at least one electronic component.

[0027] According to a preferred embodiment of the invention, the substrate carrier may be provided with at least two pressure relief through-holes, wherein at least one heat transfer tab is disposed between the at least two pressure relief through-holes. The heat transfer tab disposed between the two pressure relief through-holes preferably enables controllable heat transfer, thereby achieving a favorable temperature balance within the substrate while reducing thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate. Furthermore, the at least one heat transfer tab preferably allows for convenient placement of at least one printed conductor above it, thereby achieving advantageous space utilization. The at least one heat transfer tab is preferably integrally formed with and / or a component of the substrate. This design of the substrate carrier has particular advantages because, through the at least one heat transfer tab, the substrate carrier can easily assemble electronic components, while enabling particularly simple and reliable conductive connection of the at least one electronic component to the at least one printed conductor via at least one solder joint.

[0028] According to a preferred embodiment of the invention, the substrate carrier may be provided with a substrate comprising at least one solder mask for the at least one solder joint, particularly wherein the at least one pressure relief via is designed to be adjacent to and / or at least partially surrounding the at least one solder mask. The solder mask preferably limits the maximum extension range of the solder joint. Arranging the at least one pressure relief via adjacent to and / or at least partially surrounding the at least one solder mask advantageously brings it as close as possible to the solder joint and / or effectively reduces thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate. Furthermore, arranging the at least one pressure relief via adjacent to and / or at least partially surrounding the at least one solder mask also avoids spatial overlap between the at least one pressure relief via and the at least one solder joint. The substrate carrier designed in this way has particular advantages because, through the at least one solder mask, the substrate carrier can easily mount electronic components, while enabling particularly simple and reliable conductive connection of the at least one electronic component to the at least one printed conductor via the at least one solder joint.

[0029] According to a preferred embodiment of the invention, the at least one pressure relief via may be specified in the substrate carrier to have a rectangular or substantially rectangular shape and / or an elongated hole shape. Within the scope of the invention, the expression "X or substantially X" should be understood to imply minor deviations, such as those due to manufacturing tolerances, material and / or process characteristics, but which do not alter the basic intended function of the feature. For manufacturing purposes, the corners of the at least one pressure relief via are preferably at least partially rounded. The design of the rectangular or substantially rectangular shape and / or elongated hole shape enables low-cost manufacturing of the pressure relief via, while particularly effectively reducing thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate.

[0030] According to a preferred embodiment of the present invention, the at least one pressure relief through-hole may be formed in the substrate by punching, cutting, milling, and / or laser processing. Manufacturing the at least one pressure relief through-hole using the above-described at least one manufacturing step enables low-cost manufacturing of the at least one pressure relief through-hole, while also effectively reducing thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate.

[0031] According to a preferred embodiment of the invention, the at least one electronic component in the substrate carrier may be designed as a ceramic component, particularly a ceramic capacitor. The substrate carrier described in this invention enables particularly advantageous and reliable operation for ceramic components. Ceramic components have a low thermal expansion ratio, thus posing a higher risk of problems such as solder joint cracking due to thermal expansion of the substrate. Arranging the ceramic electronic component on the substrate carrier having at least one pressure relief via according to this invention advantageously reduces the thermal expansion of the at least one solder joint and / or the at least one electronic component due to thermal expansion of the substrate.

[0032] According to a second aspect of the invention, the above-mentioned objective is achieved by a motor vehicle having at least one substrate carrier according to the first aspect. The motor vehicle of the invention possesses all the advantages of the substrate carrier described in the first aspect. Attached Figure Description

[0033] The substrate carrier and motor vehicle described in this invention will now be described in detail with reference to the accompanying drawings. The drawings are shown schematically as follows:

[0034] Figure 1 A top view of a substrate carrier is shown, which has an electronic component and two pressure relief through holes;

[0035] Figure 2 A top view of a substrate carrier is shown, which has multiple electronic components and five pressure relief vias; and

[0036] Figure 3 A top view of a motor vehicle is shown, which has a base plate carrier. Detailed Implementation

[0037] exist Figures 1 to 3 In this context, components with the same function and operating principle are represented by the same reference numerals.

[0038] Figure 1A schematic top view of a substrate carrier 10 is shown, which has an electronic component 110 and two pressure relief vias 40. The substrate carrier 10 includes a substrate 12, two printed conductors 20, and the electronic component 110. The electronic component 110 is electrically connected to the two printed conductors 20 via two solder joints 30. The substrate 12 has two pressure relief vias 40, which are designed to reduce thermal expansion of the two solder joints 30 and the electronic component 110 due to thermal expansion of the substrate 12. The substrate carrier 10 is designed as an aluminum circuit board, wherein the substrate 12 is partially made of aluminum. The two pressure relief vias 40 are designed as through-holes extending from the upper side to the lower side of the substrate 12. The main extensions 42 of the two pressure relief vias 40 are perpendicular to the main extension 112 of the electronic component 110 and parallel to the main extensions 32 of the two solder joints 30. The substrate 12 includes a heat conduction device 14, which is designed to dissipate heat from the substrate 12 and the electronic components 110. The two pressure relief through-holes 40 are rectangular in shape. The two pressure relief through-holes 40 are formed in the substrate 12 by milling.

[0039] Figure 2 A schematic top view of a substrate carrier 10 is shown, which has multiple electronic components 110 and five pressure relief vias 40. The substrate carrier 10 includes a substrate 12, multiple printed conductors 20 (only two of which are shown), and three electronic components 110. Each electronic component 110 is electrically connected to a corresponding printed conductor 20 via two solder joints 30. The substrate 12 has five pressure relief vias 40, which are designed to reduce thermal expansion of the two solder joints 30 and the electronic components 110 due to thermal expansion of the substrate 12. One pressure relief via 40 is partially located below the left-hand electronic component 110. The middle and right-hand electronic components 110 share two common pressure relief vias 40. The substrate 12 has heat transfer tabs 18 between the pressure relief vias 40. The substrate 12 includes multiple solder resist films 16 for the solder joints 30 (only one is shown). The pressure relief through-hole 40 is designed adjacent to the solder mask 16.

[0040] Figure 3 A top view of a motor vehicle 100, which has a base plate carrier 10, is shown in schematic form.

[0041] List of reference numerals in the attached diagram:

[0042] 10 substrate carrier

[0043] 12 matrix

[0044] 14 Heat transfer device

[0045] 16 solder mask

[0046] 18 heat transfer connectors

[0047] 20 Printed Conductors

[0048] 30 solder joints

[0049] 32 main extensions

[0050] 40 pressure relief through hole

[0051] 42 Main extension of pressure relief through hole

[0052] 100 motor vehicles

[0053] 110 electronic components

[0054] 112 The main extension of electronic components.

Claims

1. A substrate carrier (10) for assembling electronic components (110), the substrate carrier (10) comprising a substrate (12), at least one printed wire (20), and at least one electronic component (110), wherein, The at least one electronic component (110) is electrically connected to the at least one printed conductor (20) via at least one solder joint (30). Its features are, The substrate (12) has at least one pressure relief through hole (40), wherein the at least one pressure relief through hole (40) is designed to reduce the thermal stretching of the at least one solder joint (30) and / or the at least one electronic component (110) due to thermal stretching of the substrate (12).

2. The substrate carrier (10) according to claim 1, characterized in that, The substrate carrier (10) is designed as an aluminum circuit board and / or an insulated metal substrate circuit board, and in particular the substrate (12) is at least partially, and especially entirely, made of aluminum.

3. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one pressure relief through hole (40) is designed as a through pressure relief through hole (40) extending from the upper side of the substrate (12) to the lower side of the substrate (12).

4. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The main extension (42) of the at least one pressure relief through hole (40) is transverse to the main extension (112) of the at least one electronic component (110) and / or parallel to the main extension (32) of the at least one solder joint (30).

5. The substrate carrier (10) according to claim 4, characterized in that, The main extension (42) of the at least one pressure relief through hole (40) is a multiple of 1.0 to 2.0, especially 1.2 to 1.5, relative to the main extension (112) of the at least one electronic component (110) and / or the main extension (32) of the at least one solder joint (30).

6. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one pressure relief via (40) is designed to be adjacent to and / or at least partially surrounding the at least one solder joint (30), the at least one printed conductor (20), and / or the at least one electronic component (110).

7. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one pressure relief through-hole (40) is at least partially disposed below the at least one electronic component (110).

8. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The thickness of the substrate (12) is at least 0.8 mm, and in particular at least 1.1 mm, 1.3 mm or 1.5 mm.

9. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The substrate (12) includes at least one heat conduction device (14), wherein the at least one heat conduction device (14) is designed to conduct heat from the substrate (12) and / or the at least one electronic component (110).

10. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The substrate (12) has at least two pressure relief through holes (40), wherein at least one heat transfer tab (18) is provided between the at least two pressure relief through holes (40).

11. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The substrate (12) includes at least one solder mask (16) for the at least one solder joint (30), and in particular the at least one pressure relief via (40) is designed to be adjacent to and / or at least partially surrounding the at least one solder mask (16).

12. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one pressure relief through hole (40) has a rectangular or approximately rectangular shape and / or an elongated shape.

13. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one pressure relief through hole (40) is formed in the substrate (12) by means of stamping, cutting, milling and / or laser processing.

14. The substrate carrier (10) according to any one of the preceding claims, characterized in that, The at least one electronic component (110) is designed as a ceramic component, particularly a ceramic capacitor.

15. A motor vehicle (100) having at least one substrate carrier (10) according to any one of the preceding claims.

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