Solder nozzle replacement system, welding device and method for replacing solder nozzle

Abstract

The invention relates to a solder nozzle replacement system (10) for replacing a solder nozzle (12) on a soldering device (14), the solder nozzle replacement system (10) comprising: a nozzle magazine (20) having a magazine compartment (62) for providing the solder nozzle (12); a nozzle holder (22) having a holder receptacle (68) extending along a nozzle axis (67) for holding the solder nozzle (12); a pivot drive (24) for pivoting the nozzle holder (22) about a pivot axis (26) between a receiving position for receiving the solder nozzle (12) from the nozzle magazine (20) and a transfer position for transferring the solder nozzle (12) to a solder tank (16) of the soldering device (14); a linear drive (28) for displacing the nozzle holder (22) along a linear axis (30) between a receiving point assigned to the nozzle magazine (20) and a transfer point assigned to the solder pot (16); and a bunker drive (32) for rotating the nozzle bunker (20) about the bunker axis (34) such that at least one of the bunker compartments (62) is rotatable to the providing compartment.

Description

Technical Field

[0001] This invention relates to a solder nozzle replacement system for a welding equipment, a welding equipment, and a method for replacing a solder nozzle. Background Technology

[0002] In the field of contacting electronic structural components, such as those secured from the top of a printed circuit board via through-holes (THT) in the printed circuit board, it is known to contact these structural components from the bottom of the printed circuit board. So-called selective wave soldering is well-known for contacting individual pins or pin arrays by soldering, in which the standing wave of the liquid solder is positioned directly below the component or pin to be contacted.

[0003] Depending on the component to be welded, it may be necessary to configure solder nozzles with different nozzle openings. Here, the nozzle openings can have different diameters and / or different profiles. Furthermore, solder nozzles are subject to wear during operation, especially due to the formation of undesirable oxide layers on the surface of the solder nozzles, which lead to undesirable deformation of the weld wave.

[0004] According to existing technology, it is known to manually replace worn solder nozzles using relevant tools. This replacement requires special protective measures due to the liquid solder located in the solder tank and is time-consuming.

[0005] US2022 / 0016724A1 discloses a welding system having a solder canister and a solder nozzle changing device, in which multiple solder nozzles can be stored. During nozzle changing, a robot moves the solder canister and solder nozzles together to the changing device, where the nozzles can be replaced.

[0006] DE102016121160A1 discloses a welding apparatus with a handling device that enables the placement of solder nozzles on a solder container and the removal of solder nozzles from the solder container, thereby enabling automated nozzle replacement.

[0007] An automated solder nozzle replacement is disclosed in DE102020124111A1, wherein a solder canister is movable together with a nozzle hopper. A gripper removes the nozzle from the nozzle hopper by movement in the z-direction. The solder canister is then positioned below the gripper, and the gripper places a new nozzle onto the solder canister by movement in the opposite z-direction. Summary of the Invention

[0008] The purpose of this invention is to provide a compact solder nozzle replacement system that improves the efficiency of welding equipment while still ensuring reliable operation.

[0009] This objective is achieved by a solder nozzle changing system having the features of claim 1 for changing solder nozzles on welding equipment, particularly on selective welding equipment. The solder nozzle changing system comprises: a nozzle hopper having hopper compartments for providing, in particular, identical or different solder nozzles; and a nozzle holder having a clamping receiver extending along the nozzle axis for clamping the solder nozzle. The solder nozzle is preferably guided into the clamping receiver along the nozzle axis. In the clamped state, the solder nozzle preferably extends along the nozzle axis.

[0010] Furthermore, the solder nozzle changing system includes a pivot drive, a linear drive, and a hopper drive. The pivot drive is used to pivot the nozzle holder about a pivot axis, wherein the nozzle holder can pivot between a receiving position and a transferring position. In the receiving position, the receiving receiver is oriented towards the nozzle hopper, and the nozzle holder can remove the solder nozzle from the nozzle hopper. In the transferring position, the receiving receiver is oriented, for example, towards the solder canister of the soldering equipment, and the nozzle holder can transfer the solder nozzle to the solder canister. In the transferring position, the nozzle holder can also remove the solder nozzle from the solder canister. Preferably, the nozzle holder pivots 180° by means of a pivot unit to pivot the nozzle holder from the receiving position to the transferring position, and vice versa, from the transferring position to the receiving position.

[0011] A linear actuator is used to displace a nozzle holder along a linear axis, wherein the nozzle holder can be displaced between a receiving point and a transfer point. At the receiving point, the nozzle holder is positioned on the nozzle hopper so that the solder nozzle can be fed into the holding receiver. Upon displacement from the receiving point to the transfer point, the nozzle holder moves away from the nozzle hopper. At the transfer point, and particularly only at the transfer point, the nozzle holder can pivot about a pivot axis. Once the nozzle holder has pivoted to the transfer position and displaced to the transfer point, the held solder nozzle can be received by the solder can.

[0012] Alternatively or additionally, a linear actuator is used to displace the nozzle hopper along a linear axis, wherein the nozzle hopper can be displaced between a rest position and a receiving position. At the rest position, the solder nozzle is spaced apart from the nozzle holder within the nozzle hopper, such that the nozzle holder can pivot about a pivot axis. As the nozzle hopper displaces from the rest position to the receiving position, the nozzle hopper and the nozzle holder move toward each other, wherein, preferably, the nozzle holder is positioned at the receiving position. At the receiving position, the nozzle hopper is positioned on the nozzle holder, such that the solder nozzle can be guided into the receiving container. Once the nozzle hopper is back at the rest position, the nozzle holder can pivot to a transfer position, wherein the held solder nozzle can be received by the solder canister.

[0013] It is conceivable that a first linear drive for the nozzle holder and a linear drive for the nozzle hopper are provided. In this case, the linear movements of the nozzle holder and the nozzle hopper can overlap during the transfer of the solder nozzle.

[0014] The linear actuator is preferably configured as a pneumatic cylinder.

[0015] The hopper driver is used to rotate the nozzle hopper about the hopper axis, such that at least one of the hopper compartments can rotate within the supply compartment. It is conceivable that the remaining hopper compartments not located in the supply compartment can be manually or automatically loaded into the loading position.

[0016] The separate configuration of the drive allows for a particularly simple and compact solder nozzle changing system, which is also efficiently configured through simultaneous control of the drive. Furthermore, the rotation of the nozzle hopper ensures that the solder nozzle is safely and reliably available at the supply compartment, thus enabling a short transport path to the nozzle holder and solder can. In addition, the separate configuration of the solder can and the solder nozzle changing system provides greater flexibility.

[0017] Advantageously, the pivot drive and the hopper drive are configured such that the pivot axis and the hopper axis extend parallel to each other. This results in the advantage that the nozzle holder can easily and securely remove the solder nozzle from the nozzle hopper.

[0018] Another advantage is that the pivot drive and / or hopper drive are configured such that the pivot axis and / or hopper axis extend horizontally. This also provides the benefit that the nozzle holder can easily and securely transfer the solder nozzle, for example, to the solder canister.

[0019] In the context of this invention, the term "horizontal" can be understood as a force direction perpendicular to Earth's gravity. Similarly, the term "vertical" can be understood as a force direction parallel to Earth's gravity. Earth's gravity is significant for selective wave soldering because it greatly influences the formation of the solder wave after it leaves the solder nozzle.

[0020] Furthermore, the linear drive and pivot drive are configured such that the linear axis extends perpendicular to the pivot axis. Similarly, the linear drive and hopper drive are configured such that the linear axis extends perpendicular to the hopper axis. Moving the nozzle holder closer to the nozzle hopper can therefore be achieved with a simple stroke. Moreover, pivoting from the receiving position to the transfer position is sufficient to position the solder nozzle in a suitable orientation for reception by the solder canister.

[0021] Preferably, the nozzle hopper is configured as cylindrical and / or disc-shaped. Therefore, the nozzle hopper has a simple and compact configuration.

[0022] An advantageous improvement specifies that the nozzle hopper has: a hopper front side extending perpendicular to the pivot axis and facing the linear actuator; a hopper rear side extending perpendicular to the pivot axis and facing away from the linear actuator; and a hopper sleeve surface extending parallel to the pivot axis and circumferentially disposed between the hopper front and rear sides. The hopper compartments are arranged on the hopper sleeve surface. Therefore, despite the flat structure, a large number of solder nozzles can be accommodated in the nozzle hopper. Here, the hopper compartments lie within a system plane, which preferably extends perpendicular to the pivot axis and / or perpendicular to the hopper axis, and / or particularly centrally between the hopper front and rear sides. The solder nozzles provided in the hopper compartments preferably extend perpendicular to the hopper axis and / or intersect the system plane. The system plane is preferably held by the axis of symmetry of the hopper compartments and / or by the solder nozzles provided in the hopper compartments.

[0023] In the surface of the hopper sheath, each hopper compartment is provided with a centering retainer, particularly configured as a canister, for centering the solder nozzle, and / or particularly arranged in the centering retainer for holding the solder nozzle. Therefore, the solder nozzle can be easily and precisely positioned in the hopper compartment and removed from the hopper compartment by a nozzle holder.

[0024] Another advantageous improvement specifies that the nozzle holder is arranged such that the nozzle axis, especially the receiving receiver, and preferably the axis of symmetry of the receiving receiver, i.e., the nozzle axis, is arranged not only in the receiving position but also in the transfer position within the system plane. This results in easier transfer of the solder nozzle between the nozzle hopper and the nozzle holder.

[0025] Preferably, the solder nozzle changing system has a carrier in which a nozzle hopper and / or a linear actuator are arranged. It is conceivable that the nozzle hopper is rotatably supported in the carrier. It is also conceivable that the linear actuator is movably supported on the carrier along a linear axis. Therefore, it can be ensured that the nozzle hopper and the nozzle holder are positioned precisely relative to each other with respect to the system plane.

[0026] Preferably, the carrier is displaceable on the equipment housing of the welding equipment along a first mounting axis. Preferably, the solder nozzle replacement system and / or the carrier are telescopically configured and therefore displaceable along a second mounting axis. The first and second mounting axes preferably extend perpendicularly to each other. The second mounting axis preferably extends parallel to the pivot axis and the hopper axis. By displacing the carrier along the first and / or second mounting axes, the solder nozzle replacement system and the solder canister can be spatially separated from each other to provide space for the operator to maintain and repair the solder nozzle replacement system and / or the solder canister. Here, the solder nozzle replacement system and / or the carrier can be displaced between a working position and a maintenance position along the first and / or second mounting axes. In the working position, the solder canister can be equipped with the solder nozzle replacement system. In the maintenance position, the solder nozzle replacement system and / or the solder canister can be maintained and / or repaired. To secure the solder nozzle replacement system and / or the carrier along the first and / or second mounting axes, each can be provided with at least one locking bolt. The solder nozzle changing system and / or carrier are preferably manually and / or automatically movable between a working position and a maintenance position. Furthermore, adjusting screws, particularly threaded screws, can be provided on the equipment housing and / or on the solder nozzle changing system and / or on the carrier to adjust the solder nozzle changing system and / or carrier along a linear axis and / or a first mounting axis and / or a second mounting axis, particularly to adjust the end point position. Therefore, it can be ensured that the solder nozzle changing system, particularly the solder nozzle, is oriented towards the solder canister in a precisely positioned manner. Additionally, adjusting screws on the nozzle hopper and / or on the nozzle holder are also conceivable for fine adjustment of the end point position along a linear axis and / or about a pivot axis and / or about the hopper axis.

[0027] Advantageously, the nozzle holder has clamping jaws that can be displaced between an inner position and an outer position. Here, the clamping jaws are preferably displaced perpendicular to the linear axis in the receiving position and / or transfer position. Advantageously, the nozzle holder for clamping the solder nozzle is configured as an inner holder. Therefore, the solder nozzle can be secured by moving the clamping jaws to the inner position and released by moving the clamping jaws to the outer position.

[0028] Furthermore, each of the clamping jaws has a first clamping surface for clamping the solder nozzle in an inward position and a second clamping surface for clamping the gas ejector cap disposed on the solder can in an outward position. It is also advantageous that the nozzle holder for clamping the gas ejector cap is configured as an external holder. Therefore, both the solder nozzle and the gas ejector cap can be clamped and disposed of using a single clamping jaw. Preferably, the first clamping surface can be configured as a prism. Furthermore, the second clamping surface can preferably be formed by a shoulder on the clamping jaw.

[0029] Another advantageous improvement specifies that the nozzle holder has an upper side facing the nozzle hopper in the receiving position and a lower side facing the solder canister in the receiving position, opposite to the upper side. The nozzle holder has locking hooks on the lower side and / or cantilever for stopping the nozzle holder in the receiving and / or transfer positions, and / or for guiding forces when receiving and / or connecting the solder nozzle. Therefore, it is ensured that the nozzle holder, especially the receiver, is vertically arranged. Furthermore, the forces acting on the nozzle holder upon impact can be derived.

[0030] Furthermore, it is advantageous to provide a locking lug extending parallel to the linear axis and facing the nozzle holder, wherein, in the transfer position, the locking hook of the nozzle holder interacts with the locking lug. The locking lug can be fixedly arranged on the nozzle hopper or fixedly arranged on the carrier. Advantageously, the locking hook has a forked section at its free end. It is also advantageous that the locking lug has a grooved handle and a collar at its free end. In the locked state, the forked section engages in the groove above the collar of the locking lug. Preferably, the nozzle holder can rotate only in a semi-circular manner, such that the locking hook can engage in and be removed from the locking lug. It is conceivable to provide a displacement measuring system for checking the relative position between the locking hook and the locking lug. This displacement measuring system is preferably arranged such that it detects the position of the nozzle holder along the linear axis.

[0031] As an alternative or supplement to the locking hook and / or locking lug, a sensor system can be provided for detecting the position of the nozzle holder when transferring the solder nozzle to the solder can. The sensor system preferably has a sensor, particularly an inductive sensor, that interacts with the nozzle holder, especially with the underside of the holder. If the position of the nozzle holder deviates from the transfer position, for example because the solder can stop abuts against the nozzle holder or the solder nozzle, thus causing a slight displacement of the nozzle holder, the movement of the solder can is stopped and, if necessary, the solder can is displaced away from the nozzle holder. In the event of such a collision, the operator can also be notified via a control unit. The sensor system, particularly the sensor, can be arranged on the nozzle hopper or carrier. To adjust the sensor system, particularly the sensor, parallel to a linear axis, at least one adjusting screw can be provided so that the sensor can reliably detect the position of the nozzle holder.

[0032] Another advantageous improvement specifies that the solder nozzle changing system also includes a control unit for controlling the pivot drive and / or the linear drive and / or the hopper drive. The control unit preferably controls the pivot drive and / or the linear drive such that the supplied solder nozzle can be gripped, displaced, and placed in the solder canister by means of a nozzle holder. The control unit also preferably controls the hopper drive such that the solder nozzle supplied in the hopper compartment can be rotated into the supply compartment. Therefore, the drives can be simultaneously controlled by the control unit, thereby ensuring effective nozzle changing.

[0033] Another advantageous improvement of the invention specifies that the solder nozzle changing system has a sensor device for detecting status and nozzle type. The sensor device may be configured to determine whether solder nozzles are arranged in the supply compartment and / or hopper compartment and / or on the nozzle holder and / or on the solder can. The sensor device may additionally or alternatively be configured to detect the nozzle type, nozzle size, and / or position of the solder nozzles in the supply compartment and / or hopper compartment and / or on the nozzle holder and / or on the solder can. The sensor device may additionally or alternatively be configured to determine whether the solder nozzles have been used and / or worn in the nozzle hopper and / or on the nozzle holder and / or on the solder can. Therefore, for example, the quality of the soldering process and / or the wear of the solder nozzles can be monitored, and a control unit may be available if necessary. The sensor device is preferably configured as a camera, particularly a camera with image recognition, which detects the nozzle hopper, particularly the hopper compartment and / or supply compartment, and / or nozzle holder and / or solder can, particularly the solder nozzles supplied or mounted on the solder can. The sensor device is preferably configured as an additional or alternative RFID system, wherein RFID tags, particularly RFID tags with information about the nozzle type, are arranged on the solder nozzles, and an RFID reader for reading the RFID tags is arranged on the solder nozzle changing system. The sensor device is preferably configured as a code system, wherein barcodes and / or QR codes, particularly barcodes and / or QR codes with information about the nozzle type, are arranged on each solder nozzle, and a code reader for reading the codes is arranged on the solder nozzle changing system. To detect whether a welding device is arranged in the hopper compartment and / or on the nozzle holder and / or on the solder can, the sensor device can be configured as a touch sensor and / or an infrared sensor and / or a magnetic field sensor. Advantageously, such sensors are arranged on the centering retainer and / or magnet of the hopper compartment.

[0034] Information from the sensor device is preferably sent to a control unit and / or, based on this information, the control unit controls the hopper drive and / or the linear drive and / or the pivot drive and / or the solder can drive. It is conceivable that, depending on which hopper compartment the solder nozzle suitable for the next soldering process is positioned in, the hopper drive is controlled such that the hopper compartment rotates toward the supply compartment.

[0035] Preferably, the linear actuator is displaceably guided on the carrier. A pivot actuator is preferably, and particularly directly, arranged on the linear actuator. Therefore, the pivot actuator can be displaced along a linear axis by means of the linear actuator. The pivot actuator preferably has a cantilever, on which a nozzle holder is arranged. This represents an embodiment for vertically arranging the nozzle holder below the nozzle hopper. The nozzle holder is preferably arranged in a pivoting manner on the cantilever. Therefore, the nozzle holder can pivot by means of the pivot actuator, wherein the nozzle holder also compensates for tolerances when receiving solder nozzles from the nozzle hopper and when transferring solder nozzles to the solder can. Furthermore, the nozzle holder can be displaced along a linear axis by means of the linear actuator.

[0036] The nozzle holder is preferably arranged on a pivot drive, particularly on a cantilever, by means of a compensation unit. The compensation unit preferably has a sway bearing and a bearing shaft arranged in the sway bearing to compensate for axial and / or radial and / or angular misalignment of the nozzle holder, particularly the solder nozzle, relative to the solder can, particularly the can receiver. Therefore, it preferably compensates for inaccuracies of 1-2 mm along the x-axis and / or y-axis and angular errors of up to 5°.

[0037] Preferably, the nozzle holder is movably supported on the cantilever by means of a sway bearing. The bearing shaft is preferably connected to the nozzle holder in an anti-movement manner. To center the sway bearing and / or the nozzle holder on the pivot drive, especially on the cantilever, a first elastomeric spring is provided. The first elastomeric spring is arranged around the sway bearing along a first circular ring. The first elastomeric spring pushes the sway bearing into the zero position. If there is a misalignment between the nozzle holder and the solder can, a force acts on the sway bearing, which displaces from the zero position against the force of the first elastomeric spring. Once the misalignment is no longer present, the first elastomeric spring pushes the nozzle holder back to the zero position. Radial misalignment and the reset of the sway bearing can be achieved, in particular, by means of the first elastomeric spring. Furthermore, a second elastomeric spring is provided between the pivot drive, especially the cantilever, and the nozzle holder. The second elastomeric spring is arranged around the bearing shaft along a second circular ring. Radial and angular misalignment between the pivot drive, especially the cantilever, and the nozzle holder can be compensated, in particular, by means of the second elastomeric spring. The first elastomeric spring and / or the second elastomeric spring can be configured as a Sylomer elastomeric spring.

[0038] The objective of this invention is further achieved by a welding apparatus, particularly a selective welding apparatus, having the features of claim 16, for welding components using at least one solder nozzle. This welding apparatus includes the aforementioned solder nozzle changing system. The welding apparatus also includes a solder container with a container receiver for receiving the solder nozzle and, in particular, a gas ejector cap. Furthermore, it is advantageous that the welding apparatus and / or the solder nozzle changing system also include a solder nozzle. Therefore, a welding apparatus with a compact, efficient, and simple solder nozzle changing mechanism is provided.

[0039] To transfer the solder nozzle to the solder can, the solder can is preferably configured to move along a z-axis extending parallel to a linear axis and / or along an xy-plane extending perpendicular to the linear axis. Therefore, the solder nozzle changing system, particularly the nozzle holder, can provide the solder nozzle at the transfer point, and the solder can moves close to the nozzle holder and receives the solder nozzle. The can receiver preferably has a can magnet for holding the solder nozzle. Once the solder nozzle is held by the can magnet, the nozzle holder can be displaced to an outward position and thus release the solder nozzle.

[0040] Advantageously, the carrier of the solder nozzle changing system is arranged on the equipment housing of the solder equipment. This ensures that the solder canister and nozzle holder are accurately positioned relative to each other, thereby guaranteeing the safe transfer of the solder nozzle and / or gas ejection cap.

[0041] The carrier can be displaceably supported on the equipment housing along a first mounting axis. Therefore, the solder nozzle changing system can be manually and / or automatically moved above the solder canister from a working position to a maintenance position by means of the carrier. Preferably, the solder nozzle changing system and / or the carrier are telescopically configured and thus displaceable along a second mounting axis. The first and second mounting axes preferably extend perpendicularly to each other. The first mounting axis preferably extends parallel to the pivot axis. The second mounting axis preferably extends parallel to the hopper axis. By displacing the carrier along the first and / or second mounting axes, the solder nozzle changing system and the solder canister can be spatially separated to provide space for the operator to maintain the solder nozzle changing system and / or the solder canister. Here, the solder nozzle changing system and / or the carrier can be displaced between a working position and a maintenance position along the first and / or second mounting axes. In the working position, the solder canister can be equipped with the solder nozzle changing system. In the maintenance position, the solder nozzle changing system and / or the solder canister can be maintained or repaired. To secure the solder nozzle replacement system and / or carrier along the first and / or second mounting axes, at least one locking bolt may be provided for each. The solder nozzle replacement system and / or carrier are preferably manually and / or automatically movable between a working position and a maintenance position. Furthermore, adjusting screws, particularly threaded screws, may be provided on the equipment housing and / or on the solder nozzle replacement system and / or on the carrier to adjust the solder nozzle replacement system and / or carrier along a linear axis and / or the first and / or second mounting axes. Therefore, it can be ensured that the solder nozzle replacement system, especially the solder nozzle, is oriented towards the solder canister in a precisely positioned manner.

[0042] The objective of this invention is further achieved by a method having the features of claim 20 for replacing the solder nozzle on welding equipment, particularly selective welding equipment, preferably the aforementioned welding equipment. The method includes the following steps:

[0043] a) Provide solder nozzles in the hopper compartment of the nozzle hopper;

[0044] b) Rotate the nozzle hopper so that the solder nozzle provided in the hopper compartment is arranged in the providing compartment;

[0045] c) Move the nozzle holder to the compartment and / or move the nozzle hopper to the nozzle holder;

[0046] d) The provided solder nozzle is held in place by means of a nozzle holder;

[0047] e) Displace the nozzle holder relative to the nozzle hopper along the linear axis from the receiving point to the transfer point and / or displace the nozzle hopper relative to the nozzle holder along the linear axis from the receiving point to the rest point;

[0048] f) Pivot the nozzle holder about the pivot axis from the receiving position to the transferring position;

[0049] g) Displace the solder canister to the solder nozzle; and

[0050] h) Transfer the solder nozzle to the solder container.

[0051] This method ensures that solder nozzles can be replaced quickly, safely, repeatably, and accurately.

[0052] Furthermore, it is advantageous that, in order to transfer the solder nozzle to the solder container according to step h), the solder container first receives the solder nozzle, and then the clamping jaws of the nozzle holder move from the inner position to the outer position to release the solder nozzle. Therefore, it is ensured that the solder nozzle is released using the nozzle holder only when the solder container has safely held the solder nozzle.

[0053] Furthermore, in order to transfer the solder nozzle to the solder can according to step h), a soldering wave is first provided on the solder can and then the solder nozzle is heated by means of the soldering wave, particularly by contacting the soldering wave with the solder nozzle. This heating preferably lasts between 5 and 30 seconds. As a result, the solder nozzle widens and can then be installed, particularly onto the receiving cone of the can, especially only subsequently. It may be necessary to preheat the solder nozzle from room temperature to the operating temperature to comply with tight mounting tolerances on the can receiver, particularly on the receiving cone. Preferably, the solder nozzle is released from the nozzle holder only when the heated solder nozzle is pushed onto the receiving cone. Preferably, after heating the solder nozzle with the soldering wave, the soldering wave is first eliminated to allow the solder nozzle to be installed on the solder can. Once the solder nozzle is installed on the solder can, the soldering wave is reconstructed.

[0054] Furthermore, to replace the solder nozzle and / or to clean the solder can, the gas ejector cap of the solder can is removed using a nozzle holder. For this purpose, the nozzle holder moves to the transfer point and transfer position. Additionally, the clamping jaws of the nozzle holder displace to the inward position. Then, the solder can is moved to the nozzle holder, causing the clamping jaws used for external clamping to displace to the outward position to hold the gas ejector cap. Now, the gas ejector cap can be removed from the solder can using the nozzle holder.

[0055] Another advantage is that the sensor device, especially the camera, is configured such that after the solder nozzle is placed in the solder canister, the sensor device, especially the camera, can be used to check which solder nozzle is being used and / or whether the solder nozzle is being installed correctly.

[0056] Another advantage is that, in order to transfer the solder nozzle from the nozzle hopper to the nozzle holder, the nozzle hopper is first moved close to the nozzle holder, where the solder nozzle arranged in the compartment is introduced into the nozzle holder, and then the nozzle holder clamps the solder nozzle by moving the clamping jaws and subsequently retains the solder nozzle in the nozzle holder as the nozzle hopper moves away from the nozzle holder.

[0057] Further details and advantageous designs of the present invention can be found in the following description, on which embodiments of the present invention are further described and illustrated. Attached Figure Description

[0058] In the attached diagram:

[0059] Figure 1 A perspective view of the solder nozzle replacement system according to the present invention is shown;

[0060] Figure 2 It shows according to Figure 1 Side view of the solder nozzle replacement system;

[0061] Figure 3 A three-dimensional view of the nozzle hopper is shown;

[0062] Figure 4 It shows according to Figure 3 A cross-sectional view of the nozzle hopper;

[0063] Figure 5 It shows according to Figure 3 A detailed view of the nozzle hopper;

[0064] Figure 6 A perspective view of the nozzle holder in the receiving position and the transfer point is shown;

[0065] Figure 7 A perspective view of the nozzle holder in the receiving position and receiving point is shown;

[0066] Figure 8 A perspective view of a nozzle holder with a clamped solder nozzle in the receiving position and transfer point is shown.

[0067] Figure 9 A perspective view of a nozzle holder with a clamped solder nozzle in the transfer position and transfer point is shown.

[0068] Figure 10 The basis for indicating the transfer position and transfer point is shown. Figure 9 Another side view of the nozzle holder with the solder nozzle it holds;

[0069] Figure 11 A perspective view of the nozzle holder is shown when transferring the solder nozzle to the solder can.

[0070] Figure 12 It shows according to Figure 11 A cross-sectional view of the nozzle holder as it transfers the solder nozzle to the solder can;

[0071] Figure 13 A perspective view of a nozzle holder with a locking hook is shown;

[0072] Figure 14 It shows according to Figure 13 A perspective view of the nozzle holder, wherein the locking hook is fixed in the locking lug;

[0073] Figure 15 It shows according to Figure 12 A detailed view of the cross-sectional view of the nozzle holder;

[0074] Figure 16 A cross-sectional view of a can receiver with a solder nozzle is shown;

[0075] Figure 17 A perspective view of the nozzle holder when the gas injection cap is held in the outer clamp is shown;

[0076] Figure 18 A perspective view of the clamping jaws of the nozzle holder is shown;

[0077] Figure 19 A perspective view of the solder nozzle replacement system according to the invention in a welding apparatus according to the invention is shown;

[0078] Figure 20 It shows according to Figure 19 Another perspective view of the solder nozzle replacement system according to the invention in the welding apparatus according to the invention;

[0079] Figure 21 A perspective view of the compensation unit between the pivot actuator and the nozzle holder is shown;

[0080] Figure 22 It shows according to Figure 21 A cross-sectional view of the compensation unit; and

[0081] Figures 23 to 24 An alternative embodiment of the solder nozzle changing system is shown, wherein the nozzle hopper is displaceable along a linear axis and the nozzle holder is immovable. Detailed Implementation

[0082] exist Figure 1 and Figure 2 The diagram illustrates a method for replacing, in particular, a selective welding device according to the invention. Figure 19 and Figure 20The solder nozzle replacement system 10 is shown for the solder nozzle 12 on the welding equipment 14. The welding equipment 14 consists of a solder tank 16 and an equipment housing 18. Figure 1 , Figure 2 , Figure 19 and Figure 20 The Chinese side indicated that...

[0083] according to Figure 2 The solder nozzle changing system 10 includes: a nozzle hopper 20 for providing solder nozzles 12, a nozzle holder 22 for holding solder nozzles 12, a pivot driver 24 for pivoting the nozzle holder 22 about a pivot axis 26, a linear driver 28 for linearly displacing the nozzle holder 22 along a linear axis 30, and a hopper driver 32 for rotating the nozzle hopper 20 about a hopper axis 34.

[0084] exist Figure 23 and Figure 24 An alternative embodiment of the solder nozzle changing system 10 is shown, wherein a linear actuator 28 is configured to linearly displace the nozzle hopper 20 along a linear axis 30 between a resting point arranged away from the nozzle holder 22 and a receiving point arranged close to the nozzle holder 22. Figure 23 and Figure 24 Each of the nozzle hoppers 20 at the receiving point is shown in the diagram.

[0085] The pivot axis 26 and the hopper axis 34 are preferably parallel to each other and / or horizontally oriented. The linear axis 30 is preferably perpendicular to the pivot axis 26 and / or perpendicular to the hopper axis 34 and / or vertically oriented.

[0086] according to Figure 1 and Figure 2 The solder nozzle replacement system 10 also has a carrier 36. According to... Figure 19 and Figure 20 The carrier 36 is movably supported along the first mounting axis 202 by means of a carrier guide 200 disposed on the device housing 18. Figure 19 and Figure 20 In the working position, the carrier 36 and thus the solder nozzle replacement system 10 are arranged. In the working position, the solder nozzle replacement system 10 can replace the solder nozzle 12 on the solder canister 16. The solder nozzle replacement system 10 can be displaced along the first mounting axis 202 from the working position to a maintenance position, allowing for easy performance of maintenance and / or repairs on the solder nozzle replacement system 10 and / or on the solder canister 16. The solder nozzle replacement system 10 can be manually or automatically displaced between the working position and the maintenance position along the first mounting axis 202. At least one first locking bolt 204 is provided to secure the solder nozzle replacement system 10 in the working position.

[0087] according to Figure 20 The carrier guide 200 also preferably has at least one end stop 205, particularly two end stops 205 opposite to each other along the first mounting axis 202, for limiting the degree of freedom of movement of the carrier 36 along the first mounting axis 202. At least one end stop 205 is configured to be finely adjustable.

[0088] Alternatively, the carrier 36 may be connected to the device housing 18 in a movement-resistant manner, particularly by screwing or welding.

[0089] according to Figure 1 , Figure 2 , Figure 19 and Figure 20 The carrier 36 also includes a carrier tube 206 and a carrier shaft 208, wherein the carrier shaft 208 is telescopically arranged within the carrier tube 206. With the telescopic guidance of the carrier 36, the solder nozzle changing system 10 can also be displaced between a working position and a maintenance position along the second mounting axis 210, making maintenance on the solder nozzle changing system 10 and / or on the solder canister 16 easily performed. The solder nozzle changing system 10 can be manually or automatically displaced between the working position and the maintenance position along the second mounting axis 210. At least one second locking bolt 212 is provided to secure the solder nozzle changing system 10 in the working position. Furthermore, adjusting screws 214 can be provided on the equipment housing 18 and / or on the solder nozzle changing system 10 and / or on the carrier 36 to adjust the solder nozzle changing system 10 and / or the carrier 36 along the linear axis 30 and / or the first mounting axis 202 and / or the second mounting axis 210. Therefore, it can be ensured that the solder nozzle replacement system 10, especially the solder nozzle 12, is oriented toward the solder can 16 in a precisely positioned manner. The first mounting axis 202 preferably extends parallel to the x-axis X, and / or the second mounting axis 210 preferably extends parallel to the y-axis Y.

[0090] The nozzle hopper 20 is rotatably supported on the carrier 36, and / or the linear actuator 28 or the nozzle holder 22 is linearly guided. A pivot actuator 24 is arranged on the linear actuator 28, wherein the pivot actuator 24 has a cantilever 38 that carries the nozzle holder 22. Therefore, the nozzle holder 22 can also be displaced by the linear displacement of the pivot actuator 24.

[0091] according to Figure 23 and Figure 24 The pivot actuator 24 and the nozzle holder 22 are arranged directly and / or in a movement-resistant manner on the carrier 36. In this case, the nozzle hopper 30 is arranged on the carrier 36 by means of a linear actuator 28. The nozzle hopper 30 is displaceable relative to the carrier 36.

[0092] The carrier 36 has a first carrier section 40 on which a nozzle hopper 20 is arranged on one side and a hopper driver 32 is arranged on the other side. Here, the nozzle hopper 20 is arranged on the hopper shaft 42 of the hopper driver 32, wherein the hopper shaft 42 passes through the first carrier section 40.

[0093] Furthermore, the carrier 36 has a second carrier section 44 spaced apart from the first carrier section 40, wherein the first carrier section 40 and the second carrier section 44 are connected to each other by a carrier rod 46. The carrier rod 46 may be formed at least segmentally by a carrier shaft 208. The first carrier section 40 and the second carrier section 44 are framed into the nozzle hopper 20 along the hopper axis 34. The first carrier section 40 and / or the second carrier section 44 preferably extend parallel to the linear axis 30 and / or vertically.

[0094] A linear actuator 28 is arranged on the second carrier section 44. The linear actuator 28 includes a linear guide 48, a linear cylinder 50 guided within the linear guide 48, and a linear carriage 52 arranged on the linear cylinder 50. The linear guide 48 is preferably arranged on the carrier 36 in a movingly rigid manner, particularly on the second carrier section 44. Figures 1 to 22 The pivot actuator 24 is arranged on the linear carriage 52. The linear carriage 52 preferably extends in a segmented cantilever configuration, such that the nozzle holder 22 is positioned below the nozzle hopper 20. The pivot actuator 24 has a pivot shaft 54, which is connected to the cantilever 38 in an anti-rotational manner. Figure 21 and Figure 22 The nozzle holder 22 is preferably arranged on the pivot drive 24 by means of a compensation unit 400, especially on the cantilever 38, so as to compensate for the tolerances on the nozzle hopper 20 or the solder can 16.

[0095] according to Figure 23 and Figure 24 The carrier 36 has only one common third carrier section 45, in which, on one hand, the nozzle hopper 20 is arranged with the linear actuator 28, and on the other hand, the hopper actuator 32 and the pivot actuator 24 are arranged. The third carrier section 45 preferably has a groove through which the hopper shaft 42 extends. Thus, a compact system can be provided. On the other hand, the pivot actuator 24 and the nozzle holder 22 are fixedly arranged, in particular, screwed onto the lower end of the third carrier section 45.

[0096] according to Figure 21 and Figure 22The compensation unit 400 preferably has a swing bearing 402 and a bearing shaft 404 arranged in the swing bearing 402 to compensate for axial and / or radial and / or angular misalignment of the nozzle holder 22, in particular the solder nozzle 12, relative to the solder can 16, in particular the can receiver 74. The nozzle holder 22 is movably supported on the cantilever 38 by means of the swing bearing 402. The bearing shaft 404 is connected to the nozzle holder 22 in a movement-resistant manner. To center the swing bearing 402 and / or the nozzle holder 22 on the pivot drive 24, in particular the cantilever 38, a first elastomeric spring 406 is provided. The first elastomeric spring 406 is arranged around the swing bearing 402 along a first circular ring. The first elastomeric spring 406 pushes the swing bearing 402 to a zero position. If there is a misalignment between the nozzle holder 22 and the solder can 16, a force acts on the swing bearing 402, which displaces from the zero position against the force of the first elastomeric spring 406. Once the offset is no longer present, the first elastomeric spring 406 pushes the nozzle holder 22 back to the zero position. The first elastomeric spring 406 can be used to achieve, in particular, the radial offset and the reset of the oscillating bearing 402. Furthermore, a second elastomeric spring 408 is provided between the pivot actuator 24, particularly the cantilever 38, and the nozzle holder 22. The second elastomeric spring 408 is arranged along the second circular ring around the bearing shaft 404. The second elastomeric spring 408 can be used to compensate, in particular, for radial and angular offsets between the pivot actuator 24, particularly the cantilever 38, and the nozzle holder 22. The first elastomeric spring 406 and / or the second elastomeric spring 408 can be configured as Sylomer elastomeric springs.

[0097] according to Figures 1 to 5 The nozzle hopper 20 has a hopper front side 56 facing the first carrier section 40 and a hopper rear side 58 facing the second carrier section 44, and a hopper sheath surface 60 extending parallel to the pivot axis 26 and arranged on the hopper front side 56 and hopper rear side 58. Sixteen hopper compartments 62 are provided in the hopper sheath side 60. According to... Figure 4 and Figure 5 Each hopper compartment 62 has a can-shaped centering retainer 64 for receiving and centering the solder nozzle 12, and a magnet 66 arranged in the centering retainer 64 for holding the solder nozzle 12. Therefore, the solder nozzle 12 can be easily and precisely positioned in the hopper compartment 62 and can be removed from the hopper compartment 62 by the nozzle holder 22. The centering retainer 64 is preferably screwed onto the nozzle hopper 20. The magnet 66 is preferably configured as a circular ring.

[0098] exist Figures 6 to 8 The document discloses how to remove the solder nozzle 12 from the nozzle hopper 20 using the nozzle holder 22. At the starting point, according to... Figure 6The nozzle holder 22 is located at the lower transfer point and receiving position. At the transfer point, the nozzle holder 22 is moved out at its maximum stroke by means of the linear actuator 28 and has the maximum distance from the nozzle hopper 20. In the receiving position, the nozzle holder 22 is pivoted such that the clamping receiver 68 of the nozzle holder 22, which extends along the nozzle axis 67 for clamping the solder nozzle 12, points upward toward the nozzle hopper 20. Furthermore, the solder nozzle 12, provided in the hopper compartment 62, is arranged in the providing compartment 70, which points downward toward the nozzle holder 22. This solder nozzle 12 is then clamped by means of the nozzle holder 22. When the nozzle holder 22 clamps the solder nozzle 12, the solder nozzle 12 extends parallel to the nozzle axis 67.

[0099] Therefore, according to Figure 7 The nozzle holder 22 is displaced from the lower transfer point to the upper receiving point along the linear axis 30 by means of a linear actuator 28. At the receiving point, the solder nozzle 12 is inserted into the clamping receiver 68 and can be clamped by moving the clamping jaws 72 of the nozzle holder 22 from the outer position to the inner position. The nozzle holder 22 is preferably configured as a center holder, especially an inner center and / or outer center holder.

[0100] By displacing the nozzle holder 22 from the receiving point to the transfer point using the linear actuator 28, according to Figure 8 The solder nozzle 12 is removed from the nozzle hopper 20. During removal, the nozzle holder 22 acts against the magnetic force of the magnet 66. The solder nozzle 12 is arranged on the nozzle hopper 20 such that the tip of the solder nozzle 12 points toward the nozzle holder 22 and is thus received by the holder receiver 68.

[0101] according to Figure 9 The nozzle holder 22 then pivots around the pivot axis 26 from the receiving position to the nozzle-connecting position by means of the pivot drive 24. In the receiving position, the receiver 68 is held upward and in the nozzle-connecting position, the receiver 68 is rotated 180° downward. Once the nozzle holder 22 is in the transfer point and transfer position, the solder nozzle 12 can be transferred to the solder can 16.

[0102] according to Figure 23 and Figure 24The implementation of this method involves a changing sequence of movements as the solder nozzle 12 is transferred between the nozzle reservoir 20 and the nozzle holder 22. The nozzle holder 22 is fixed and does not move along the z-axis. At the initial position, the nozzle holder 22 is in a receiving position and the nozzle reservoir 20 is in a stationary position, where the nozzle reservoir 20 has a maximum distance from the nozzle holder 22. In the receiving position, the nozzle holder 22 pivots such that the clamping receiver 68 of the nozzle holder 22, which extends along the nozzle axis 67 for clamping the solder nozzle 12, faces the nozzle reservoir 20, i.e., points upward. Furthermore, the solder nozzle 12, provided in the reservoir compartment 62, is arranged in a providing compartment 70 facing the nozzle holder 22, i.e., pointing downward. This solder nozzle 12 is then clamped by means of the nozzle holder 22. When the nozzle holder 22 clamps the solder nozzle 12, the solder nozzle 12 extends parallel to the nozzle axis 67. For this purpose, the nozzle hopper 20 is displaced from the upper rest point to the lower receiving point along the linear axis 30 by means of a linear actuator 28. At the receiving point, the solder nozzle 12 is introduced into the clamping receiver 68 and can be clamped by moving the clamping jaws 72 from the outer position to the inner position.

[0103] By securing the solder nozzle 12 with the clamping jaws 72 and displacing the nozzle hopper 20 from the receiving point to the resting point with the aid of the linear actuator 28, the solder nozzle 12 is transferred from the nozzle hopper 20 to the nozzle holder 22 or remains in the nozzle holder 22.

[0104] Advantageously, the solder pot 16 is displaceable along the x-axis X, y-axis Y and z-axis Z, wherein the y-axis Y extends parallel to the pivot axis 26, wherein the x-axis X extends perpendicular to the y-axis Y and perpendicular to the linear axis 30, and wherein the z-axis Z extends parallel to the linear axis 30.

[0105] In order to receive the solder nozzle 12, according to Figure 11 and Figure 12 The solder can 16 is displaced to the nozzle holder 22, particularly along the z-axis Z. Here, the solder nozzle 12 is received by the can receiver 74. Preferably, the can receiver 74 is constructed corresponding to the hopper compartment 62, wherein at least one magnet 66 is provided for holding the solder nozzle 12. Once the solder nozzle 12 is held in the can receiver 74 by the magnet 66, the nozzle holder 22 can be released and the solder can 16, together with the solder nozzle, can be moved to a solder position (not shown). Since the solder nozzle 12 is arranged on the nozzle hopper 20, no further orientation of the solder nozzle 12 is required for transferring the solder nozzle 12 to the solder can 16, except by pivoting the nozzle holder 22.

[0106] To ensure accurate positioning of the solder nozzle 12 or nozzle holder 22 during the transfer of the solder nozzle 12, according to Figure 13 and Figure 14 A locking hook 76 may be arranged on the nozzle holder 22 or on the cantilever 38 coupled to the nozzle holder 22. The nozzle holder 22 has a locking hook 76 arranged according to the nozzle holder 22. Figure 6 The receiving position is on the upper side 78 of the gripper facing the nozzle hopper 20 and on the lower side 80 of the gripper facing away from the nozzle hopper 20. The gripper receiver 68 is preferably arranged on the upper side 78 of the gripper, and / or the locking hook 76 is arranged on the lower side 80 of the gripper.

[0107] A locking lug 82 is provided on the nozzle hopper 20 and / or on the carrier 38, particularly the first carrier section 40. When the nozzle holder 22 is positioned at the transfer position and transfer point, the locking lug 82 interacts with the locking hook 76. Here, it is ensured that the nozzle holder 22 is horizontally oriented. Furthermore, the force exerted by the nozzle holder 22 against the magnetic force of the magnet 66 is directed into the carrier 38 and / or the device housing 18.

[0108] according to Figure 13 and Figure 14 The locking hook 76 has a forked section 86 on its free end 84. Advantageously, the locking lug 82 has a handle 88 with a groove 90 and a collar 94 on its free end 92. In the locked state, the forked section 86 engages in the groove 90 above the collar 94 of the locking lug 82. Preferably, the nozzle holder 22 can rotate only in a semi-circular manner, allowing the locking hook 76 to engage with and disengage from the locking lug 82.

[0109] It is also conceivable that, based on Figure 23 and Figure 24 In the embodiment, a locking lug 82 and / or a locking hook 76 are provided. It is conceivable that the locking hook 82 is arranged on the carrier 38, especially on the third carrier section 45.

[0110] As an alternative or additional solution to the locking hook 76 and / or locking lug 82, it can be based on Figures 9 to 12A sensor system 600 is provided for detecting the relative position between the nozzle hopper 20 and the nozzle holder 22, particularly the position of the nozzle holder 22, during the transfer of the solder nozzle 12 to the solder can 16. The sensor system 600 preferably includes a sensor 602, particularly an inductive sensor, which interacts with the nozzle holder 22, particularly with a signal transmitter 603 disposed on the lower side 80 of the holder. If the position of the nozzle holder 22 deviates from the transfer position, for example, because the solder can 16 stop abuts against the nozzle holder 22 or the solder nozzle 16 and thus causes a slight displacement of the nozzle holder 22, the movement of the solder can 16 is stopped and, if necessary, the solder can 16 is displaced away from the nozzle holder 22. In the event of such a collision, the operator can also be notified via a control unit 110. The sensor system 600, particularly the sensor 602, can be disposed on the nozzle hopper 20 or on the carrier 36. To adjust the sensor system 600, especially the sensor 602, parallel to the linear axis 30, at least one adjusting screw 604 can be provided, allowing the sensor 602 to reliably detect the position of the nozzle holder 22. This sensor system 600 can also serve as a basis for... Figure 23 and Figure 24 An additional or alternative embodiment of the locking hook 76 in the implementation is provided, wherein the relative position between the nozzle hopper 20 and the nozzle holder 22 is detected.

[0111] In addition, according to Figure 15 and Figure 16 To center the solder nozzle 12 on the solder can 16, a nozzle base 96 is provided, which has a chamfered portion 98 facing the solder nozzle 12. Furthermore, a chamfered portion 98 is preferably also provided on the underside of the solder nozzle 12. The chamfered portion 98 allows the solder nozzle 12 to be easily mounted on the solder can 16, even if the solder nozzle 12 is not optimally oriented towards the solder can 16.

[0112] according to Figure 11 and Figure 17 The nozzle holder 22 is preferably configured as a central holder, wherein three clamping jaws 72 are provided. The clamping jaws 72 are displaceable between an inner position and an outer position. In the inner position, the solder nozzle 12 can be fixed in the nozzle holder 22. In the outer position, the solder nozzle 12 can be released. Each clamping jaw 72 has a first clamping surface 100 facing the clamping receiver 68 for contacting the solder nozzle 12. Furthermore, according to… Figure 18 The clamping jaws 72 have a second clamping surface 102 facing away from the clamping receiver 68, so as to clamp, remove or replace the required gas ejection cap 104 on the solder can 16 in an external position. Here, the second clamping surface 102 is preferably provided on the shoulder 106 of the clamping jaws 72.

[0113] Due to the vertical arrangement of the nozzle hopper 20 and the nozzle holder 22, the solder nozzle changing system 10 is constructed to be particularly small. Here, the axis of symmetry of the hopper compartment 62 and the axis of symmetry of the holder receiver 68, i.e., the nozzle axis 67, are determined according to... Figure 2 Located within system plane 108, which is vertically arranged and / or extends parallel to linear axis 30, particularly easy, rapid, and positionally precise transfer is achieved between nozzle hopper 20, nozzle holder 22, and solder can 16.

[0114] In addition, according to Figure 1 and Figure 2 A control unit 110 is provided, which controls the pivot drive 24, the linear drive 28, the nozzle holder 22, and the hopper drive 32. The control unit 110 controls the hopper drive 32 such that the solder nozzle 12 provided in the hopper compartment 62 is displaced into the supply compartment 70. Furthermore, the control unit 110 controls the nozzle holder 22, the pivot drive 24, and the linear drive 28 such that the solder nozzle 12 can be removed from the nozzle hopper 20 or transferred from the nozzle hopper 20 to the nozzle holder 22 via the nozzle holder 22, and then transferred to the solder canister 16.

[0115] In addition, according to Figure 2 A sensor device 112 is provided to detect whether and in which hopper compartment 62 solder nozzles 12 are arranged. Furthermore, the sensor device 112 detects whether solder nozzles 12 are arranged on the nozzle holder 22 or on the solder can 16. Additionally, a code (not shown) in the form of a barcode or RFID chip can be affixed to the solder nozzle 12, containing information about the nozzle type. In this case, the sensor device 112 may additionally have a reader for reading the information. The control unit 110 can be configured such that it controls the driver based on the information from the sensor device 112. Therefore, a suitable nozzle type can be provided, for example, for a given soldering task. Moreover, Figure 23 and Figure 24 The sensor device 112 is illustrated in the example. Figures 1 to 22 The sensor device 112 in the middle can be similar to that according to Figure 23 and Figure 24 The sensor device 112 in the embodiment is configured as described above.

Claims

1. A solder nozzle replacement system (10) for replacing solder nozzles (12) on a welding device (14), the solder nozzle replacement system (10) comprising: - Nozzle hopper (20), the nozzle hopper (20) having a hopper compartment (62) for providing solder nozzle (12); - Nozzle holder (22), the nozzle holder (22) having a clamping receiver (68) extending along the nozzle axis (67) for clamping the solder nozzle (12); - Pivot drive (24) for pivoting the nozzle holder (22) about pivot axis (26) between a receiving position for receiving the solder nozzle (12) from the nozzle hopper (20) and a transfer position for transferring the solder nozzle (12) to the solder can (16) of the welding equipment (14); - At least one linear actuator (28) for displacing the nozzle holder (22) along a linear axis (30) between a receiving point assigned to the nozzle hopper (20) and a transfer point assigned to the solder canister (16), and / or for displacing the nozzle hopper (20) along the linear axis (30) between a rest point and a receiving point assigned to the nozzle holder (22); and - A hopper driver (32) for rotating the nozzle hopper (20) about a hopper axis (34) such that at least one of the hopper compartments (62) is rotatable to provide a compartment.

2. The solder nozzle replacement system (10) according to claim 1, wherein, The pivot drive (24) and the hopper drive (32) are configured such that the pivot axis (26) and the hopper axis (34) extend parallel to each other.

3. The solder nozzle replacement system (10) according to claim 1 or 2, wherein, The pivot drive (24) and / or the hopper drive (32) are configured such that the pivot axis (26) and / or the hopper axis (34) extend horizontally.

4. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The linear drive (28), the pivot drive (24), and / or the hopper drive (32) are configured such that the linear axis (30) extends perpendicular to the pivot axis (26) and / or perpendicular to the hopper axis (34).

5. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The nozzle hopper (20) is configured as cylindrical and / or disc-shaped.

6. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The nozzle hopper (20) has a rotating hopper sheath surface (60), wherein the hopper compartment (62) is arranged on the hopper sheath surface (60) along the system plane (108).

7. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, A centering retainer (64) for centering the solder nozzle (12) and / or a magnet (66) for holding the solder nozzle (12) are respectively provided in the hopper compartment (62).

8. The solder nozzle replacement system (10) according to claim 6 or 7, wherein, The nozzle holder (22) is arranged such that the nozzle axis (67) is arranged in the system plane (108) at the receiving position and the transfer position.

9. The solder nozzle replacement system (10) according to any one of the preceding claims further includes a carrier (36), wherein, The nozzle hopper (20) and the linear actuator (28) are arranged on the carrier (36).

10. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The nozzle holder (22) has a clamping jaw (72) that can be displaced between an inner position and an outer position.

11. The solder nozzle replacement system (10) according to claim 10, wherein, Each of the clamping jaws (72) has a first clamping surface (100) for clamping the solder nozzle (12) in the inner position and a second clamping surface (102) for clamping the gas jet cap (104) in the outer position.

12. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The nozzle holder (22) has an upper holder side (78) facing the nozzle hopper (20) in the receiving position and a lower holder side (80) facing the solder canister (16) in the receiving position, wherein the nozzle holder (22) has a locking hook (76) on the lower holder side (80) for stopping the nozzle holder (22) in the receiving position and / or the transfer position, and / or for guiding force when receiving and / or taking over the solder nozzle (12).

13. The solder nozzle replacement system (10) according to claim 12 further includes a locking lug (82), wherein, In the transfer position, the locking hook (76) of the nozzle holder (22) interacts with the locking lug (82).

14. The solder nozzle replacement system (10) according to any one of the preceding claims, wherein, The solder nozzle changing system (10) further includes a control unit (110) for controlling the pivot drive (24) and / or the linear drive (28) and / or the hopper drive (32), wherein the control unit (110) controls the pivot drive (24) and / or the linear drive (28) and / or the hopper drive (32) such that the solder nozzle (12) provided in the hopper compartment (62) can be rotated to the providing compartment (70) and / or the provided solder nozzle (12) can be clamped, displaced and placed in the solder canister (16) by means of the nozzle holder (22).

15. The solder nozzle replacement system (10) according to any one of the preceding claims further includes a sensor device (112) for detecting whether a solder nozzle (12) is arranged in the hopper compartment (62) and / or in the supply compartment (70) and / or on the nozzle holder (22) and / or on the solder can (16), and / or for detecting the nozzle type of the solder nozzle (12) in the hopper compartment (62) and / or in the supply compartment (70) and / or on the nozzle holder (22) and / or on the solder can (16).

16. A welding apparatus (14) for welding components using at least one solder nozzle (12), comprising a solder nozzle replacement system (10) according to any one of claims 1 to 15 and a solder container (16), wherein, The solder can (16) is provided with a can receiver (74) for receiving the solder nozzle (12) and, in particular, the gas jet cap (104).

17. The welding equipment (14) according to claim 16, wherein, The solder canister (16) can move along a z-axis that extends parallel to the linear axis (30) and / or along an xy-plane that extends perpendicular to the linear axis (30).

18. The welding equipment (14) according to claim 16 or 17, further comprising an equipment housing (18), wherein, The carrier (36) is arranged on the equipment housing (18).

19. The welding equipment (14) according to claim 18, wherein, The solder nozzle replacement system (10) is movable along the first mounting axis (202) between a working position for operating the solder nozzle replacement system (10) and a maintenance position for servicing the solder nozzle replacement system (10) and / or the solder can (16).

20. A method for replacing a solder nozzle (12) on a welding apparatus (14) according to any one of claims 16 to 19, comprising the following steps: a) A solder nozzle (12) is provided in the hopper compartment (62) of the nozzle hopper (20); b) Rotate the nozzle hopper (20) so that the solder nozzle (12) provided in the hopper compartment (62) is arranged in the providing compartment (70); c) Move the nozzle holder (22) to the providing compartment (70) and / or move the nozzle hopper (20) to the nozzle holder (22); d) The provided solder nozzle (12) is held by means of the nozzle holder (22); e) Displace the nozzle holder (22) relative to the nozzle hopper (20) along the linear axis (30) from the receiving point to the transfer point and / or displace the nozzle hopper relative to the nozzle holder (22) along the linear axis (30) from the receiving point to the stationary point; f) Pivot the nozzle holder (22) about the pivot axis (26) from the receiving position to the transfer position; g) Displace the solder can (16) to the solder nozzle (12); and h) Transfer the solder nozzle (12) to the solder can (16).

21. The method according to claim 19, wherein, In order to transfer the solder nozzle (12) to the solder can (16) according to step h), firstly, the solder can (16) receives the solder nozzle (12), and then the clamping jaws (72) of the nozzle holder (22) are displaced from the inner position to the outer position to release the solder nozzle (12).

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