Polyimide adhesive composition for semiconductor packaging and preparation method and application thereof

Abstract

The invention discloses a polyimide adhesive composition for semiconductor packaging as well as a preparation method and application thereof, and relates to the field of semiconductor packaging materials, and the polyimide adhesive composition for semiconductor packaging comprises the following components in parts by weight: 60-95 parts of alkyl silylated polyamide acid resin, 1-5 parts of an amino silane auxiliary agent, 5-40 parts of a diluent and 0.05-5 parts of an anti-foaming agent. Compared with the prior art, the high-performance adhesive successfully solves the long-standing core contradiction that'high adhesive force ', 'high insulation reliability' and'low-viscosity processability 'are difficult to consider in the field of high-performance adhesives mainly through an innovative molecular structure and formula design; powerful material support is provided for miniaturization, light weight and high-frequency and high-speed application of semiconductor devices, and the application prospect is wide.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging materials, and more particularly to a polyimide adhesive composition for semiconductor packaging, its preparation method, and its application. Background Technology

[0002] Key new materials for semiconductor packaging are a fundamental link supporting the entire industry chain. They are not only the core driving force for continuous innovation in advanced semiconductor technology, but also directly determine the reliability, stability, and overall performance of the final product. These materials play a crucial role in protecting devices from external environmental factors such as physical damage, chemical corrosion, and thermal stress. They are an important foundation for ensuring the full performance and long-term stable operation of semiconductor devices, and are especially regarded as one of the core elements for exploring the ultimate performance of power semiconductor devices. Polyimide, as a typical high-performance "core" material, is recognized as one of the most ideal packaging and coating materials in the current semiconductor and microelectronics fields due to its excellent thermal stability, chemical corrosion resistance, high adhesion strength, excellent mechanical stability, material uniformity, and low metal impurity content. However, the polyimide material system has extremely high technical barriers and belongs to the cutting-edge direction of materials technology with extremely high requirements and great difficulty in overcoming challenges. Achieving its independent research and development and industrial application is of great significance. Summary of the Invention

[0003] To overcome the problems in the prior art, the present invention provides a polyimide adhesive composition for semiconductor packaging, its preparation method and application. The prepared polyimide adhesive composition has high adhesion and high electrical strength, which can improve the performance and ensure the reliability of semiconductor devices.

[0004] In a first aspect, the present invention provides a polyimide adhesive composition for semiconductor packaging, the polyimide adhesive composition for semiconductor packaging comprising the following components in parts by weight: The mixture contains 60-95 parts of alkylsilylated polyamic acid resin, 1-5 parts of aminosilane additive, 5-40 parts of diluent, and 0.05-5 parts of antifoaming agent.

[0005] Furthermore, the solid content of the polyimide adhesive composition for semiconductor packaging is 5-20 wt%. And / or, the viscosity of the polyimide adhesive composition for semiconductor packaging is 100~1000 cP.

[0006] Furthermore, the alkylsilylated polyamic acid resin is formed by polycondensation of alkylsilyl diamine, aromatic diamine, aromatic dianhydride and silane end-capping agent; The general chemical structural formula of the alkyl-containing silanediamine is shown below: or ; Wherein, R1 is selected from any of the following structures: , , , , , ; R2, R3, and R4 are each independently selected from any of the following structures: CH3-, CH3CH2-, CH3CH2CH2-, (CH3)2CH-, CH3O-, CH3CH2O-, (CH3)2CHO-; The aromatic diamine includes at least one selected from 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 4,4'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 1,3-bis(4-aminophenoxy)benzene, 4,4'-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 9,9-bis(4-aminophenyl)fluorene, 1,4-bis(4-aminophenoxy)benzene, and 4,4'-diaminodiphenyl sulfone; The aromatic dianhydride includes at least one of pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'-(hexafluoroisopropene)phthalic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)phenyl dianhydride, diphenyl sulfone tetracarboxylic dianhydride, and 4,4'-oxobisphthalic anhydride; The silane-based end-capping agent includes silane-based end-capping anhydrides, which include at least one of 3-(triethoxysilyl)propyl succinic anhydride, 1,2-bis(triethoxysilyl)ethane dianhydride, and bis(anhydride propyl)polydimethylsiloxane.

[0007] Further, the molar ratio of the alkyl-containing silane diamine to the aromatic diamine is 1:(4~19), the molar ratio of the total molar amount of the alkyl-containing silane diamine and the aromatic diamine to the molar ratio of the aromatic dianhydride is 1:(0.9~1:1), and the molar ratio of the silane-based end-capping agent to the aromatic dianhydride is (0.01~0.2):1; The alkyl-containing silanol diamine is selected from any of the following compounds: , , , , , .

[0008] Further, the aminosilane auxiliaries include at least one of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and N-(vinylphenyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, preferably N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, and 3-aminopropyltriethoxysilane.

[0009] Furthermore, the diluent includes at least one selected from methyl isobutyl ketone, isophorone, n-butyl acetate, ethyl acetate, n-butyl acetate, benzene, toluene, acetone, ethanol, and butanol; And / or, the antifoaming agent comprises at least one of polydimethylsiloxane and its derivatives, block copolymers of ethylene oxide and propylene oxide, polyether-modified silicone and mineral oil, preferably one of BASF Foamaster® MO 2150, Tego 825 / Tego Airex 900 / Tego Foamex 810 / Tego Antifoam 2050, Wacker SD670, and Dow DOWSIL™ SH 5500.

[0010] Secondly, based on the same inventive concept, the present invention provides a method for preparing the polyimide adhesive composition for semiconductor packaging described in the first aspect, the method comprising the following steps: Preparation of alkylsilylated polyamic acid resin; Under an inert gas atmosphere, an aminosilane additive and an antifoaming agent are added to the alkylsilylated polyamic acid resin, followed by the addition of a diluent to obtain the polyimide adhesive composition for semiconductor packaging.

[0011] Furthermore, the steps for preparing alkylsilylated polyamic acid resin include the following processes: Under an inert gas atmosphere and at -20 to 20°C, the alkyl-containing silane diamine and the aromatic diamine are dissolved in an organic solvent to obtain a first mixed solution; The aromatic dianhydride was added to the first mixed solution at 10~60℃ and in an inert gas atmosphere and reacted for 3~5 hours to obtain the second mixed solution. The silane-based end-capping agent is added to the second mixed solution at 10~30℃ and in an inert gas atmosphere and reacted for 3~5 hours to obtain the alkylsilylated polyamic acid resin. The organic solvent includes at least one of dimethylformamide, dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

[0012] Further, the step of adding an aminosilane additive and an antifoaming agent to the alkylsilylated polyamic acid resin under an inert gas atmosphere, followed by the addition of a diluent, to obtain the polyimide adhesive composition for semiconductor packaging includes the following process: Under an inert gas atmosphere and at -10~20℃, the aminosilane additive and the antifoaming agent are added to the alkylsilylated polyamic acid resin and stirred for 3~5 hours to obtain a third mixed solution. Under an inert gas atmosphere, the diluent is added to the third mixed solution and stirred for 1-3 hours to obtain the polyimide adhesive composition for semiconductor packaging.

[0013] Thirdly, based on the same inventive concept, this invention provides the application of the polyimide adhesive composition for semiconductor packaging described in the first aspect, or the polyimide adhesive composition for semiconductor packaging prepared by the method described in the second aspect, in the preparation of semiconductor packaging materials and semiconductor devices. In specific applications, the polyimide adhesive composition is applied via dispensing, spin coating, spraying, etc., to encapsulate the semiconductor substrate. The substrate is then heated to 100–150°C and held for 30–60 minutes; then heated to 200–250°C and held for 60–90 minutes; finally, it is allowed to cool naturally to form a semiconductor insulating coating.

[0014] The technical solutions provided in the embodiments of the present invention have at least the following advantages compared with the prior art: (1) This invention provides a novel polyimide adhesive composition, which, through innovative molecular structure and formulation design, successfully solves the core contradiction in the field of high-performance adhesives that has long existed: the difficulty in simultaneously achieving "high adhesion", "high insulation reliability" and "low viscosity processability", providing strong material support for the miniaturization, lightweighting and high-frequency and high-speed applications of semiconductor devices.

[0015] (2) The polyimide adhesive composition designed in this invention is an alkylsilylated polyamic acid resin that is a novel polyimide structure after imidization. While introducing alkylsilyl groups into the main chain, silane-based end capping anhydrides are used for end capping, achieving full-chain silyl alkyl coverage of the ends and middle of the polyimide molecular chain. By utilizing the strong physical adsorption and mechanical interlocking effect of silicon groups on semiconductors such as SiN, AlN, SiC and metal bonding lines, high adhesion between polyimide and power semiconductor devices can be achieved, ensuring long-term reliability. At the same time, the introduction of alkyl groups can significantly reduce the glass transition temperature of polyimide, thereby achieving a low imidization curing temperature and ensuring use below 250°C.

[0016] (3) The aminosilane additive introduced into the polyimide adhesive composition of the present invention has a unique amphiphilic structure (one end contains an organic functional group that is compatible with the polyimide system, and the other end contains a hydrolyzable group) that can form a strong -Si-OM- covalent bond (M is a substrate atom) with the hydroxyl group on the surface of the inorganic substrate at the interface, thereby building a solid "molecular bridge" between the organic adhesive layer and the inorganic substrate, achieving a super strong and durable thermomechanical reliability that far exceeds physical adsorption.

[0017] (4) The defoamer and diluent introduced in this invention ensure that the material has low viscosity, high leveling and no defects, and has excellent process adaptability and coating quality, providing a dense, uniform and defect-free high-quality coating for semiconductor insulating packaging.

[0018] (5) The preparation method of the present invention is simple and easy to industrialize. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 Infrared spectrum of the polyimide adhesive composition for semiconductor packaging provided in an embodiment of the present invention. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Unless otherwise specified, all raw materials, reagents, instruments, and equipment used in this invention can be purchased commercially or prepared using existing methods. Furthermore, unless otherwise specified or detailed, the steps and parameters involved can be performed according to the preparation process steps and parameters of the polyimide adhesive composition for semiconductor packaging disclosed in the prior art, or directly using existing equipment according to the instruction manual. These will not be elaborated upon further in this invention document.

[0024] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. Experimental methods in the following embodiments, unless otherwise specified, are generally performed according to national standards. If no corresponding national standard exists, then generally accepted international standards, conventional conditions, or conditions recommended by the manufacturer are followed.

[0025] Example 1 This example provides a polyimide adhesive composition for semiconductor packaging, comprising the following steps: In a 250 ml three-necked flask under an inert gas atmosphere, 30 g of N-methylpyrrolidone was added, along with 0.0005 mol of alkyl silyl diamine EAS-1 and 0.0095 mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane. After complete dissolution, the mixture was cooled to 0 °C, and 0.0099 mol of 4,4'-benzophenone tetracarboxylic dianhydride was slowly added in batches. The temperature was controlled at 40 °C, and the mixture was stirred for 4 h. The mixture was then cooled to 10 °C, and 0.0002 mol of 3-(triethoxysilyl)propylsuccinic anhydride was added. The mixture was stirred for another 3 h, followed by 3 g of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane and 1 g of Foamaster® MO2150. The mixture was stirred for another 2 h, followed by 10 g of isophorone. The mixture was stirred for another 2 h to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 800 cP.

[0026] Example 2 The only difference between this embodiment and Embodiment 1 is that: (1) Except for replacing EAS-1 containing alkyl silane diamine with EAS-3, the other processes are kept the same to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 500 cP.

[0027] Example 3 The only difference between this embodiment and Embodiment 1 is that: (1) Except for replacing EAS-1 containing alkyl silane diamine with EAS-5, the other processes are kept the same to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 300 cP.

[0028] Example 4 The only difference between this embodiment and Embodiment 1 is that: (1) Except for replacing 3g N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane and 1g Foamaster® MO2150 with 3g 3-aminopropyltriethoxysilane and 1g Tego Airex 900 2150, the other processes were kept the same to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 750cP.

[0029] Example 5 The only difference between this embodiment and Embodiment 1 is that: (1) Except for replacing 0.0095 mol of 4,4'-diaminodiphenylmethane with 0.0095 mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, the other processes were kept the same to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 920 cP.

[0030] Comparative Example 1 This example provides a polyimide adhesive composition for semiconductor packaging, comprising the following steps: In a 250 ml three-necked flask under an inert gas atmosphere, 30 g of N-methylpyrrolidone was added, followed by 0.01 mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane. After complete dissolution, the mixture was cooled to 0 °C, and 0.0099 mol of 4,4'-benzophenone tetracarboxylic dianhydride was slowly added in batches. The temperature was controlled at 40 °C, and the mixture was stirred for 4 h. The mixture was then cooled to 10 °C, and 0.0002 mol of 3-(triethoxysilyl)propylsuccinic anhydride was added. The mixture was stirred for another 3 h, and 10 g of isophorone was added. The mixture was stirred for 2 h to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 1100 P.

[0031] Comparative Example 2 This example provides a polyimide adhesive composition for semiconductor packaging, comprising the following steps: In a 250 ml three-necked flask under an inert gas atmosphere, 30 g of N-methylpyrrolidone was added, along with 0.0005 mol of alkylsilyl diamine EAS-1 and 0.0095 mol of 2,2-bis[4-(4-aminophenoxy)phenyl]propane. After complete dissolution, the mixture was cooled to 0 °C, and 0.0099 mol of 4,4'-benzophenone tetracarboxylic dianhydride was slowly added in batches. The temperature was controlled at 40 °C, and the mixture was stirred for 4 h. The mixture was then cooled to 10 °C, and 0.0002 mol of 3-(triethoxysilyl)propylsuccinic anhydride was added. The mixture was stirred for another 3 h, and 10 g of isophorone was added. The mixture was stirred for 2 h to obtain a polyimide adhesive composition for semiconductor packaging with a viscosity of 900 P.

[0032] Test case In this example, the polyimide adhesive composition for semiconductor packaging obtained in the above embodiments and comparative examples was dispensed onto the semiconductor substrate packaging position, and then heated in a nitrogen atmosphere oven at 150°C for 30 min; then the temperature was increased to 250°C and held for 60 min; finally, it was allowed to cool naturally to form a semiconductor insulating coating. The performance of the obtained semiconductor insulating coating was tested, and the test results are shown in Table 1.

[0033] Table 1 As shown in Table 1, the innovative method of this patent demonstrates that Examples 1-5 exhibit higher adhesion and lower glass transition temperature, enabling low-temperature curing, which better meets the requirements of semiconductor device packaging. Furthermore, it boasts superior processing performance, eliminates defect points, and demonstrates excellent process adaptability and coating quality.

[0034] In summary, the embodiments of the present invention provide a polyimide adhesive composition for semiconductor packaging, its preparation method, and its application. Compared with the prior art, the present invention mainly solves the core contradiction in the field of high-performance adhesives—the difficulty in simultaneously achieving "high adhesion," "high insulation reliability," and "low viscosity processability"—through innovative molecular structure and formulation design. This provides strong material support for the miniaturization, lightweighting, and high-frequency and high-speed applications of semiconductor devices, and has broad application prospects.

[0035] Various embodiments of the present invention may exist in the form of a range; it should be understood that the description in the form of a range is merely for convenience and brevity and should not be construed as a hard limitation on the scope of the invention; therefore, it should be considered that the range description has specifically disclosed all possible subranges and single numerical values ​​within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed subranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, regardless of the range. Furthermore, whenever a numerical range is referred to herein, it means including any referenced number (fraction or integer) within the range referred to.

[0036] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A polyimide adhesive composition for semiconductor packaging, characterized in that, The components include the following parts by weight: The mixture contains 60-95 parts of alkylsilylated polyamic acid resin, 1-5 parts of aminosilane additive, 5-40 parts of diluent, and 0.05-5 parts of antifoaming agent.

2. The polyimide adhesive composition for semiconductor packaging according to claim 1, characterized in that, The solid content of the polyimide adhesive composition for semiconductor packaging is 5-20 wt%. And / or, the viscosity of the polyimide adhesive composition for semiconductor packaging is 100~1000 cP.

3. The polyimide adhesive composition for semiconductor packaging according to claim 1, characterized in that, The alkylsilylated polyamic acid resin is formed by polycondensation of alkylsilyl diamine, aromatic diamine, aromatic dianhydride and silane end-capping agent; The general chemical structural formula of the alkyl-silyl diamine is shown below: or ; Wherein, R1 is selected from any of the following structures: 、 、 、 、 、 ； R2, R3, and R4 are each independently selected from any of the following structures: CH3-, CH3CH2-, CH3CH2CH2-, (CH3)2CH-, CH3O-, CH3CH2O-, (CH3)2CHO-; The aromatic diamine includes at least one selected from 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, 4,4'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 1,3-bis(4-aminophenoxy)benzene, 4,4'-diaminodiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 9,9-bis(4-aminophenyl)fluorene, 1,4-bis(4-aminophenoxy)benzene, and 4,4'-diaminodiphenyl sulfone; The aromatic dianhydride includes at least one of pyromellitic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'-(hexafluoroisopropene)phthalic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, diphenyl ether tetracarboxylic dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)phenyl dianhydride, diphenyl sulfone tetracarboxylic dianhydride, and 4,4'-oxobisphthalic anhydride; The silane-based end-capping agent includes silane-based end-capping anhydrides, which include at least one of 3-(triethoxysilyl)propyl succinic anhydride, 1,2-bis(triethoxysilyl)ethane dianhydride, and bis(anhydride propyl)polydimethylsiloxane.

4. The polyimide adhesive composition for semiconductor packaging according to claim 3, characterized in that, The molar ratio of the alkyl-containing silane diamine to the aromatic diamine is 1:(4~19), the molar ratio of the total molar amount of the alkyl-containing silane diamine and the aromatic diamine to the molar ratio of the aromatic dianhydride is 1:(0.9~1:1), and the molar ratio of the silane end-capping agent to the aromatic dianhydride is (0.01~0.2):1; The alkyl-containing silanol diamine is selected from any of the following compounds: 、 、 、 、 、 。 5. The polyimide adhesive composition for semiconductor packaging according to claim 1, characterized in that, The aminosilane auxiliaries include at least one of N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and N-(vinylphenyl)-2-aminoethyl-3-aminopropyltrimethoxysilane.

6. The polyimide adhesive composition for semiconductor packaging according to claim 1, characterized in that, The diluent includes at least one selected from methyl isobutyl ketone, isophorone, n-butyl acetate, ethyl acetate, n-butyl acetate, benzene, toluene, acetone, ethanol, and butanol; And / or, the antifoaming agent includes at least one of polydimethylsiloxane and its derivatives, block copolymers of ethylene oxide and propylene oxide, polyether-modified silicone, and mineral oil.

7. A method for preparing a polyimide adhesive composition for semiconductor packaging according to any one of claims 1 to 6, characterized in that, Includes the following steps: Preparation of alkylsilylated polyamic acid resin; Under an inert gas atmosphere, an aminosilane additive and an antifoaming agent are added to the alkylsilylated polyamic acid resin, followed by the addition of a diluent to obtain the polyimide adhesive composition for semiconductor packaging.

8. The method for preparing the polyimide adhesive composition for semiconductor packaging according to claim 7, characterized in that, The steps for preparing alkylsilylated polyamic acid resins include the following processes: Under an inert gas atmosphere and at -20 to 20°C, the alkyl-containing silane diamine and the aromatic diamine are dissolved in an organic solvent to obtain a first mixed solution; The aromatic dianhydride was added to the first mixed solution at 10~60℃ and in an inert gas atmosphere and reacted for 3~5 hours to obtain the second mixed solution. The silane-based end-capping agent is added to the second mixed solution at 10~30℃ and in an inert gas atmosphere and reacted for 3~5 hours to obtain the alkylsilylated polyamic acid resin. The organic solvent includes at least one of dimethylformamide, dimethylacetamide, N-methylpyrrolidone, and dimethyl sulfoxide.

9. The method for preparing the polyimide adhesive composition for semiconductor packaging according to claim 8, characterized in that, The steps of adding an aminosilane additive and an antifoaming agent to the alkylsilylated polyamic acid resin under an inert gas atmosphere, followed by the addition of a diluent, to obtain the polyimide adhesive composition for semiconductor packaging include the following processes: Under an inert gas atmosphere and at -10~20℃, the aminosilane additive and the antifoaming agent are added to the alkylsilylated polyamic acid resin and stirred for 3~5 hours to obtain a third mixed solution. Under an inert gas atmosphere, the diluent is added to the third mixed solution and stirred for 1-3 hours to obtain the polyimide adhesive composition for semiconductor packaging.

10. The use of a polyimide adhesive composition for semiconductor packaging according to any one of claims 1 to 6, or a polyimide adhesive composition for semiconductor packaging prepared by the method of any one of claims 7 to 9, in the preparation of semiconductor packaging materials and semiconductor devices.

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