Display module and display device

Abstract

The invention discloses a display module and a display device, and belongs to the technical field of display, the display module comprises a display panel, a cover plate, a first binding part, a bonding pad and a heat dissipation assembly, the display panel at least comprises a display part, and the display part is provided with a first opening; the first binding part is arranged on the side, away from the cover plate, of the display part, a second opening is formed in the first binding part, and the second opening and the first opening are communicated to form a hole area; the bonding pad is arranged on one side, far away from the display part, of the first binding part, and is positioned on one side of the second opening; the heat dissipation assembly is arranged between the first binding part and the display part and overlapped with the bonding pad in the thickness direction of the display module, the heat dissipation assembly comprises a heat conduction layer and a heat insulation layer which are sequentially arranged on one side of the bonding pad of the first binding part, and a part of the heat conduction layer is overlapped with the bonding pad and the heat insulation layer in the thickness direction of the display module; the other part of the heat conduction layer extends in the direction away from the hole area, and the heat conductivity coefficient of the heat insulation layer is smaller than that of the heat conduction layer. The display effect can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] In related technologies, to further reduce the overall thickness of the device, the display hole (O-cut hole) originally located near the top side of the display module needs to be moved to the bottom side of the display module. This allows the O-cut hole of the display unit to overlap and align with the bonding holes (COP holes or COF holes) of the bonding unit, forming a hole area. This hole area provides clearance for camera mounting, thus achieving the goal of reducing the overall thickness of the device.

[0003] However, because this design alters the relative positions of the driver chip and the display hole, placing the driver chip closer to the hole, the heat dissipated by the driver chip during operation is transferred to the hole area, causing the ambient temperature at the display hole to rise and significantly increasing the risk of package failure. After the package at the display hole fails, external water and oxygen can enter the display through the failed area, causing black spots to appear at the O-cut hole, affecting the display effect.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this application is to provide a display module and display device that can improve the display effect.

[0006] To solve the above problems, the technical solution of this application is as follows: In a first aspect, this application proposes a display module, comprising: The display panel includes at least a display section, wherein the display section has a first opening in the thickness direction of the display module; A cover plate is provided on the light-emitting side of the display unit; A first binding part is provided on the side of the display part away from the cover plate. The first binding part has a second opening in the thickness direction of the display module. The second opening overlaps with the first opening and communicates to form a hole area. A solder pad is provided on the side of the first bonding portion away from the display portion, and the orthographic projection of the solder pad on the display portion is located on the side of the orthographic projection of the second opening on the display portion; and A heat dissipation component is disposed between the first bonding portion and the display portion, and overlaps with the pad in the thickness direction of the display module. The heat dissipation component includes a heat-conducting layer and a heat-insulating layer disposed sequentially on one side of the pad in the first bonding portion. A portion of the heat-conducting layer overlaps with the pad and the heat-insulating layer in the thickness direction of the display module, and another portion of the heat-conducting layer extends in a direction away from the hole area. The thermal conductivity of the heat-insulating layer is less than that of the heat-conducting layer.

[0007] In one embodiment of this application, the orthographic projection of the solder pad on the first bonding portion is located within the range of the orthographic projection of the thermally conductive layer on the first bonding portion.

[0008] In one embodiment of this application, the orthographic projection of the solder pad on the first bonding portion is located within the range of the orthographic projection of the heat insulation layer on the first bonding portion.

[0009] In one embodiment of this application, the side surface of the heat insulation layer is flush with the side surface of the heat-conducting layer.

[0010] In one embodiment of this application, the heat insulation layer includes: The first segment is located on the side of the thermally conductive layer away from the first bonding portion; and The second sub-segment is located on the side of the thermally conductive layer near the hole area.

[0011] In one embodiment of this application, the heat insulation layer further includes a third segment connected to the side of the second segment away from the first segment, and the orthographic projection of the third segment on the first bonding portion is located between the orthographic projection of the pad on the first bonding portion and the second opening.

[0012] In one embodiment of this application, the first sub-segment, the second sub-segment, and the third sub-segment are integrally connected.

[0013] In one embodiment of this application, the display panel further includes the first binding portion and the bending portion, the bending portion being located between the display portion and the first binding portion, and the bending portion connecting the first binding portion and the display portion; The display part, the bending part, and the first binding part are integrally formed and enclose an installation space, and the heat dissipation component is disposed within the installation space.

[0014] In one embodiment of this application, the display module further includes a first back plate, which is disposed on the side of the first bonding portion near the display portion and located within the mounting space; The heat dissipation component is disposed between the first back plate and the first bonding part.

[0015] In one embodiment of this application, the display module further includes: A reinforcing layer is provided on the side of the first back panel near the display section; A buffer layer is disposed on the side of the reinforcing layer near the display portion; The second backplate is located on the side of the buffer layer near the display section; A polarizing film is disposed between the display unit and the cover plate; An optical adhesive layer is disposed between the polarizer and the cover plate; and The chip is bonded to the side of the pad away from the first bonding portion.

[0016] In one embodiment of this application, the display panel further includes a bending portion and a second binding portion. The second binding portion is disposed on the side of the display portion away from the cover plate, and the bending portion is located between the display portion and the first binding portion. The bending portion integrally connects the display portion and the second binding portion. The display module further includes a flip-chip film, which includes a first bonding portion, the pads, and a chip. The first bonding portion is bonded to the side of the second bonding portion away from the display portion, and the chip is bonded to the pads on the side away from the first bonding portion. The display part, the bending part, the second binding part, and the first binding part form an installation space, and the heat dissipation component is disposed within the installation space.

[0017] In one embodiment of this application, the heat dissipation component is in direct contact with the side of the first bonding portion near the display portion.

[0018] Secondly, this application proposes an apparatus including a display module, the display module including a display panel, a cover plate, a first bonding portion, a solder pad, and a heat dissipation component; The display panel includes at least a display section, wherein the display section has a first opening in the thickness direction of the display module; A cover plate is provided on the light-emitting side of the display unit; A first binding part is provided on the side of the display part away from the cover plate. The first binding part has a second opening in the thickness direction of the display module. The second opening overlaps with the first opening and communicates to form a hole area. A solder pad is provided on the side of the first bonding portion away from the display portion, and the orthographic projection of the solder pad on the display portion is located on the side of the orthographic projection of the second opening on the display portion; and A heat dissipation component is disposed between the first bonding portion and the display portion, and overlaps with the pad in the thickness direction of the display module. The heat dissipation component includes a heat-conducting layer and a heat-insulating layer disposed sequentially on one side of the pad in the first bonding portion. A portion of the heat-conducting layer overlaps with the pad and the heat-insulating layer in the thickness direction of the display module, and another portion of the heat-conducting layer extends in a direction away from the hole area. The thermal conductivity of the heat-insulating layer is less than that of the heat-conducting layer.

[0019] In this application, the pads on the first bonding portion are used to bond the driver chip. When the driver chip is working, the heat emitted by the driver chip is transferred to the first bonding portion through the pads. The heat dissipation component of this application includes a thermally conductive layer and a thermally insulating layer. Because the thermally insulating layer overlaps with the pads, it can block the heat from being transferred along the thickness direction of the display module towards the first opening of the display portion. A portion of the thermally conductive layer is located between the pads and the thermally insulating layer, and another portion of the thermally conductive layer extends away from the hole area. The thermally conductive layer can transfer the heat transferred from the pads to the thermally conductive layer away from the hole area, guiding the heat to diffuse in a directional manner, reducing the accumulation of heat emitted by the chip in the hole area, lowering the ambient temperature at the hole area, thereby reducing the risk of package failure, reducing the intrusion of external water and oxygen into the display portion, thereby reducing the phenomenon of black spots appearing at the first opening and improving the display effect. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0022] Figure 1 This is a schematic diagram of a display module in related technologies; Figure 2 This is another schematic diagram of a display module in related technologies; Figure 3 This is a schematic diagram of an embodiment of the display module of this application; Figure 4 This is a schematic diagram of a heat dissipation assembly and a first bonding portion according to the first embodiment of this application; Figure 5 This is a schematic diagram of a heat dissipation assembly and a first bonding portion according to a second embodiment of this application; Figure 6This is a schematic diagram of a heat dissipation assembly and a first bonding portion according to a third embodiment of this application; Figure 7 This is a schematic diagram of a display module according to the fourth embodiment of this application; Figure 8 This is another schematic diagram of the display module according to the fourth embodiment of this application; Figure 9 This is a schematic diagram of the display module before it is bent, according to this application; Figure 10 This is a schematic diagram of a display module according to the fifth embodiment of this application.

[0023] Explanation of reference numerals in the attached figures: 100, Display module; Z, Thickness direction; M, Hole area; M1, First opening; M2, Second opening; K, Mounting space; 10. Display panel; 11. Display section; 12. Bending section; 21. Cover plate; 22. Solder pad; 23. First backplate; 24. Reinforcing layer; 25. Buffer layer; 26. Second backplate; 27. Polarizing film; 28. Optical adhesive layer; BD1, First binding part; BD2, Second binding part; 30. Heat dissipation component; 31. Thermal conductive layer; 32. Thermal insulation layer; 321. First sub-segment; 322. Second sub-segment; 323. Third sub-segment; 40. Chip-on-chip film. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0025] In related technologies, in order to further reduce the thickness of the entire machine, it is necessary to reduce the original thickness as follows: Figure 1 The display hole M1a (O-cut hole) near the top side of the display module, as shown, is adjusted to... Figure 2 As shown, on the ground side near the display module, the O-cut hole of the display section 11a overlaps and aligns with the bonding hole M2a (COP hole or COF hole) of the bonding section BDa to form a hole area. The hole area can provide space for camera mounting, thereby reducing the overall thickness of the device.

[0026] However, because this design alters the relative positions of the driver chip 22a and the display hole M1a, bringing the driver chip 22a closer to the display hole M1a, the heat dissipated by the driver chip 22a during operation is transferred to the hole area, causing the ambient temperature at the display hole M1a to rise and significantly increasing the risk of package failure. After package failure at the display hole M1a, external water and oxygen can enter the display unit 11a through the failed area, causing black spots to appear at the O-cut hole and affecting the display effect.

[0027] This application discloses a display device, which can be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0028] Please see Figure 3 This application proposes a display module 100, which includes a display panel 10, a cover plate 21, a first bonding part BD1, a solder pad 22, and a heat dissipation component 30.

[0029] The display panel 10 includes at least a display section 11. The display section 11 has a first opening M1 in the thickness direction Z of the display module 100.

[0030] The cover plate 21 is located on the light-emitting side of the display section 11.

[0031] The first binding part BD1 is provided on the side of the display part 11 away from the cover plate 21. The first binding part BD1 has a second opening M2 in the thickness direction Z of the display module 100. The second opening M2 overlaps with the first opening M1 and communicates to form a hole area M.

[0032] The pad 22 is located on the side of the first bonding portion BD1 away from the display portion 11. The orthographic projection of the pad 22 on the display portion 11 is located on the side of the orthographic projection of the second opening M2 on the display portion 11.

[0033] A heat dissipation assembly 30 is disposed between the first bonding portion BD1 and the display portion 11, and overlaps with the pad 22 in the thickness direction Z of the display module 100. The heat dissipation assembly 30 includes a thermally conductive layer 31 and a thermally insulating layer 32 sequentially disposed on one side of the pad 22 of the first bonding portion BD1. A portion of the thermally conductive layer 31 overlaps with the pad 22 and the thermally insulating layer 32 in the thickness direction Z of the display module 100, and another portion of the thermally conductive layer 31 extends in a direction away from the hole region M. The thermal conductivity of the thermally insulating layer 32 is less than that of the thermally conductive layer 31.

[0034] In this application, the pads 22 on the first bonding portion BD1 are used to bond the driver chip. When the driver chip is working, the heat emitted by the driver chip is transferred to the first bonding portion BD1 through the pads 22. The heat dissipation component 30 of this application includes a thermally conductive layer 31 and a thermally insulating layer 32. Since the thermally insulating layer 32 overlaps with the pads 22, it can block the heat from being transferred along the thickness direction Z of the display module 100 toward the first opening M1 of the display portion 11. A portion of the thermally conductive layer 31 is located between the pads 22 and the thermally insulating layer 32, and another portion of the thermally conductive layer 31 extends away from the hole area M. The thermally conductive layer 31 can transfer the heat transferred from the pads 22 to the thermally conductive layer 31 away from the hole area M, guiding the heat to diffuse in a directional manner, reducing the accumulation of heat emitted by the chip in the hole area M, lowering the ambient temperature at the hole area M, thereby reducing the risk of package failure, reducing the intrusion of external water and oxygen into the display portion 11, thereby reducing the phenomenon of black spots appearing at the first opening M1, and improving the display effect.

[0035] Optionally, the display panel 10 of this application is an organic light-emitting diode (OLED) display panel 10.

[0036] Optionally, the pads 22 are configured to bond chips. In the display module 100 of this application, the pads 22 of the display module 100 can be supplied as a display module 100 containing chips after bonding chips. Alternatively, the pads 22 of the display module 100 can be supplied as a display module 100 without chips without bonding chips. Therefore, in this embodiment, chips are not defined as part of the display module 100.

[0037] In this embodiment, the thermal conductivity of the heat insulation layer 32 is less than that of the heat conduction layer 31. Therefore, when the heat dissipated by the driver chip is transferred to the heat conduction layer 31 located between the heat insulation layer 32 and the pad 22, since the thermal conductivity of the heat conduction layer 31 is greater than that of the heat insulation layer 32, on the one hand, the thermal conductivity of the heat insulation layer 32 is smaller, and most of the heat cannot be transferred through the heat insulation layer 32 along the thickness direction Z of the display module 100 to the first opening M1 of the display section 11. On the other hand, the thermal conductivity of the heat conduction layer 31 is larger, and most of the heat tends to be transferred through the heat conduction layer 31 in a direction away from the hole region M. In this embodiment, on the one hand, by setting a heat insulation layer 32, heat is prevented from being transferred along the thickness direction Z of the display module 100 to the first opening M1 of the display section 11. On the other hand, by setting a heat-conducting layer 31, when heat is transferred to the heat-conducting layer 31, the heat can be quickly transferred away from the hole area M, further reducing the risk of hole area M encapsulation failure, reducing the intrusion of external water and oxygen into the display section 11, thereby reducing the phenomenon of black spots appearing at the first opening M1 and improving the display effect.

[0038] Optionally, the insulation layer 32 is made of aerogel felt (SiO2). The thermal conductivity of the aerogel felt is in the range of 0.013 W / (m·K) to 0.025 W / (m·K). The aerogel felt can provide insulation in an environment of 600 degrees Celsius, has high temperature resistance, and is relatively thin overall, providing good insulation per unit volume, which can further reduce the thickness of the display module 100.

[0039] Optionally, the insulation layer 32 is made of ceramicized foam. The thermal conductivity of the ceramicized foam is in the range of 0.1 W / (m·K) to 0.2 W / (m·K). The ceramicized foam can provide insulation in environments up to 800 degrees Celsius, exhibiting high-temperature resistance. Furthermore, as a flexible material, the ceramicized foam can also cushion the display module 100, improving its impact resistance.

[0040] Optionally, the insulation layer 32 is made of mica sheet. The thermal conductivity of the mica sheet is in the range of 0.2 W / (m·K) to 0.3 W / (m·K). The mica sheet can provide insulation in an environment of 850 degrees Celsius and has high-temperature resistance. The breakdown strength of the mica sheet is greater than 20 kV / mm. It can also resist external static electricity, improving the antistatic performance of the display module 100.

[0041] Optionally, the insulation layer 32 is made of insulating silicone foam. The thermal conductivity of the insulating silicone foam is in the range of 0.05 W / (m·K) to 0.10 W / (m·K). The insulating silicone foam can provide insulation in an environment of 500 degrees Celsius and has high-temperature resistance. The insulating silicone foam has high elasticity and a compression deformation of less than 5%, which acts as a buffer for the display module 100 and improves the impact resistance of the display module 100.

[0042] Optionally, the heat-conducting layer 31 is made of graphite sheet. The thermal conductivity of the graphite sheet is in the range of 600 W / (m·K) to 1500 W / (m·K). The thickness of the graphite sheet is in the range of 10 micrometers to 100 micrometers. Using graphite sheet as the heat-conducting layer 31 can further reduce the thickness of the display module 100. When the heat-conducting layer 31 is made of graphite sheet and the heat insulation layer 32 is made of aerogel felt, the thickness of the heat dissipation component 30 is relatively thin, which can further reduce the thickness of the display module 100.

[0043] Optionally, the thermally conductive layer 31 is made of graphene film. The thermal conductivity of the graphene film is in the range of 1200 W / (m·K) to 2000 W / (m·K). The thickness of the graphene film is in the range of 10 micrometers to 50 micrometers. The thickness of the graphene film is smaller than that of the graphite sheet, which can further reduce the thickness of the display module 100, and the graphene film can be used in the foldable display module 100, and the graphene film can be bent more than 100,000 times.

[0044] Optionally, the thermally conductive layer 31 is made of copper foil. The thermal conductivity of the copper foil is 400 W / (m·K). The thickness of the copper foil is in the range of 12 micrometers to 35 micrometers. The thermally conductive layer 31 can be formed into a double-layer structure of copper foil and graphite. When copper foil and graphite are laminated, the thermally conductive layer 31 can achieve both electromagnetic shielding and thermal conductivity.

[0045] Optionally, the thermally conductive layer 31 is made of thermally conductive silicone or acrylic adhesive. The thermal conductivity of the thermally conductive silicone or acrylic adhesive is in the range of 1 W / (m·K) to 5 W / (m·K). The thickness of the thermally conductive silicone or acrylic adhesive is in the range of 20 micrometers to 50 micrometers. Compared with the previous materials, thermally conductive silicone or acrylic adhesive can fill microscopic gaps and also act as a buffer, improving the impact resistance of the display module 100.

[0046] Please see Figure 3 Optionally, the orthographic projection of the pad 22 on the first bonding portion BD1 is located within the range of the orthographic projection of the thermal conductive layer 31 on the first bonding portion BD1.

[0047] In this embodiment, the pad 22 is used to bond the chip. When the orthographic projection of the pad 22 on the first bonding portion BD1 is within the range of the orthographic projection of the thermal conductive layer 31 on the first bonding portion BD1, the orthographic projection of the chip bonded to the pad 22 on the first bonding portion BD1 is within the range of the orthographic projection of the thermal conductive layer 31 on the first bonding portion BD1. This increases the overlap area between the chip and the thermal conductive layer 31, improves the thermal conductivity of the thermal conductive layer 31, and allows heat to be transferred more quickly away from the hole area M. This guides the directional diffusion of heat, reduces the accumulation of heat emitted by the chip in the hole area M, lowers the ambient temperature at the hole area M, thereby reducing the risk of package failure and reducing the intrusion of external water and oxygen into the display portion 11. This reduces the occurrence of black spots at the first opening M1 and improves the display effect.

[0048] Please see Figure 3 Optionally, the orthographic projection of the pad 22 on the first bonding portion BD1 is located within the range of the orthographic projection of the heat insulation layer 32 on the first bonding portion BD1.

[0049] In this embodiment, the pad 22 is used to bond the chip. When the orthographic projection of the pad 22 on the first bonding portion BD1 is within the range of the orthographic projection of the heat insulation layer 32 on the first bonding portion BD1, the orthographic projection of the chip bonded to the pad 22 on the first bonding portion BD1 is within the range of the orthographic projection of the heat insulation layer 32 on the first bonding portion BD1, thereby increasing the overlap area between the chip and the heat insulation layer 32, further reducing the heat transferred to the display portion 11 along the thickness direction Z of the display module 100, lowering the ambient temperature at the first via of the display portion 11, thereby reducing the risk of encapsulation failure, reducing the intrusion of external water and oxygen into the display portion 11, thereby reducing the phenomenon of black spots appearing at the first opening M1, and improving the display effect.

[0050] In the first embodiment of this application: Please see Figure 4 Optionally, the side of the heat insulation layer 32 is flush with the side of the heat-conducting layer 31.

[0051] In this embodiment, the heat-conducting layer 31 is also covered with a heat-insulating layer 32 on another portion extending away from the hole area M. Since the other portion extending away from the hole area M of the heat-conducting layer 31 overlaps with the display unit 11, when heat is transferred to the display unit 11 along the other portion extending away from the hole area M of the heat-conducting layer 31, it will cause local high temperature in the display area of ​​the display unit 11, which is prone to phenomena such as screen distortion, color deviation, and reduced service life.

[0052] In this embodiment, the side of the heat insulation layer 32 is flush with the side of the heat conduction layer 31, so that the heat conduction layer 31 is also covered with the heat insulation layer 32 on the other part extending away from the hole area M, so as to block the heat of the heat conduction layer 31 from being transferred to the display unit 11, reduce the temperature of the display unit 11, reduce screen distortion and color deviation, improve service life, and improve display effect.

[0053] In the second embodiment of this application: Please see Figure 5 Optionally, the insulation layer 32 includes a first segment 321 and a second segment 322.

[0054] The first sub-segment 321 is located on the side of the heat-conducting layer 31 away from the first bonding part BD1.

[0055] The second sub-segment 322 is located on the side of the heat-conducting layer 31 near the hole region M.

[0056] In this embodiment, the heat dissipated by the chip is transferred to the thermally conductive layer 31 through the pads 22 and the first bonding portion BD1, resulting in three heat transfer paths. The first heat transfer path is along the thickness direction Z of the display module 100 towards the side where the display section 11 is located. The second heat transfer path is along the direction parallel to the cover plate 21 towards the side near the hole area M. The third heat transfer path is along the direction parallel to the cover plate 21 towards the side away from the hole area M. In these three heat transfer paths, the first and second heat transfer paths will cause the ambient temperature at the first opening M1 to rise, leading to encapsulation failure of the display section 11 at the first opening M1. External water and oxygen can then penetrate the display section 11 through the encapsulated failure, causing black spots to appear at the first opening M1 and affecting the display effect.

[0057] Therefore, in this embodiment, a first segment 321 is provided on the side of the thermally conductive layer 31 away from the first bonding portion BD1. The first segment 321 can significantly reduce the heat transferred by the first heat transfer path. In this embodiment, a second segment 322 is also provided on the side of the thermally conductive layer 31 near the hole area M. The second segment 322 can significantly reduce the heat transferred by the second heat transfer path. At this time, the heat dissipated by the chip can only be efficiently transferred through the third heat transfer path in the direction away from the hole area M and the display portion 11, thereby reducing the ambient temperature at the hole area M, reducing the risk of encapsulation failure, reducing the intrusion of external water and oxygen into the display portion 11, thereby reducing the phenomenon of black spots appearing at the first opening M1 and improving the display effect.

[0058] In the third embodiment of this application: To avoid redundancy, the third embodiment of this application only describes the differences from the second embodiment of this application.

[0059] The third embodiment of this application differs from the second embodiment in that: Please see Figure 6 Optionally, the thermal insulation layer 32 further includes a third segment 323. The third segment 323 is connected to the side of the second segment 322 away from the first segment 321. The orthographic projection of the third segment 323 on the first bonding portion BD1 is located between the orthographic projection of the pad 22 on the first bonding portion BD1 and the second opening M2.

[0060] In this embodiment, the third segment 323 is located between the pad 22 and the hole area M, which can block the heat emitted by the chip from being transferred along the thickness direction Z of the display module 100 to the first opening M1. The third segment 323 can further reduce the ambient temperature at the first opening M1, thereby reducing the risk of encapsulation failure at the first opening M1, reducing the intrusion of external water and oxygen into the display section 11, thereby reducing the black spot phenomenon at the first opening M1 and improving the display effect.

[0061] Optionally, the first sub-segment 321, the second sub-segment 322, and the third sub-segment 323 are connected as a single unit.

[0062] In this embodiment, since the first sub-segment 321, the second sub-segment 322, and the third sub-segment 323 are integrally connected, the heat transfer from the gap between the first sub-segment 321 and the second sub-segment 322, as well as from the gap between the second sub-segment 322 and the third sub-segment 323, toward the hole area M and the display unit 11 can be reduced. This further reduces the risk of encapsulation failure at the first opening M1, reduces the intrusion of external water and oxygen into the display unit 11, thereby reducing the black spot phenomenon at the first opening M1 and improving the display effect.

[0063] Optionally, the thermally conductive layer 31 and the thermally insulating layer 32 can be fixed by adhesive tape.

[0064] Optionally, the thermally conductive layer 31 and the thermally insulating layer 32 can be solid films, which are fixed with adhesive to the side of the first bonding portion BD1 away from the pad 22.

[0065] Alternatively, the materials of the thermally conductive layer 31 and the thermal insulation layer 32 may also be liquid or adhesive, which are applied to the side of the first bonding part BD1 away from the solder pad 22 and then cured.

[0066] No restrictions are placed on the materials and fixing methods of the heat-conducting layer 31 and the heat-insulating layer 32.

[0067] In the fourth embodiment of this application: Please see Figure 7 Optionally, the display panel 10 further includes a first binding portion BD1 and a bending portion 12. The bending portion 12 is located between the display portion 11 and the first binding portion BD1. The bending portion 12 connects the first binding portion BD1 and the display portion 11.

[0068] The display part 11, the bending part 12, and the first binding part BD1 are integrally formed and enclose the installation space K. The heat dissipation component 30 is disposed within the installation space K.

[0069] In this embodiment, a portion of the display panel 10 needs to be bent to the back. The display panel 10 includes a display section 11, a bending section 12, and a first binding section BD1. During the manufacturing process of the display module 100, the first binding section BD1 is bent to the backlight side of the display section 11 by the bending section 12, thereby reducing the size of the lower bezel of the display module 100 and realizing the design of a narrow bezel display module 100.

[0070] Before bending the display panel 10, a first opening M1 and a second opening M2 are simultaneously formed on the display part 11 and the mounting part. After bending the display panel 10, the first opening M1 and the second opening M2 are overlapped to form a first through hole. The first through hole is used to mount a camera or sensor. The sensor can be an infrared sensor, a distance sensor, etc. During the subsequent mounting of the camera or sensor module, at least a portion of the camera or at least a portion of the sensor is inserted into the first through hole from the side where the second opening M2 is located to achieve mounting. This reduces the thickness of the display module 100.

[0071] Please see Figure 8 Optionally, the display module 100 also includes a first back plate 23. The first back plate 23 is disposed on the side of the first mounting portion BD1 near the display portion 11 and is located within the mounting space K.

[0072] The heat dissipation component 30 is located between the first backplate 23 and the first bonding part BD1.

[0073] In this embodiment, the heat dissipation component 30 is disposed between the first back plate 23 and the first binding part BD1. There are two specific ways to install the heat dissipation component 30.

[0074] The first installation method involves sequentially setting a heat insulation layer 32 and a heat dissipation layer at corresponding positions on the side of the first back plate 23 away from the display section 11 before the display panel 10 is bent. After the display panel 10 is bent, the first opening M1 and the second opening M2 overlap, and the pad 22 overlaps with the heat dissipation component 30. This first installation method is relatively simple, requiring only the heat insulation layer 32 and the heat dissipation layer to be set at corresponding positions on the first back plate 23. However, the installation accuracy of this method is low because after bending, not only do the first opening M1 and the second opening M2 need to overlap, but the heat dissipation component 30 and the pad 22 also need to overlap simultaneously. If there is a deviation in the position of the first opening M1 or the second opening M2, or a deviation in the setting position of the heat dissipation component 30 and the pad 22, the first opening M1 and the second opening M2 may not overlap, or the heat dissipation component 30 and the pad 22 may not overlap. This first installation method is suitable for display modules 100 with lower installation accuracy requirements.

[0075] Please see Figure 9The second installation method involves sequentially installing a heat dissipation layer and a heat insulation layer 32 on the corresponding positions of the first bonding portion BD1 away from the solder pad 22 before bending the display panel 10. After bending the display panel 10, the first opening M1 overlaps with the second opening M2. In this second installation method, the solder pad 22 and heat dissipation assembly 30 can be installed on both sides of the first bonding portion BD1 before bending; after bending, only the overlap of the first opening M1 and the second opening M2 needs to be achieved. Compared to the first installation method, the second installation method offers higher installation precision. This second installation method is suitable for display modules 100 with high installation precision requirements.

[0076] Optionally, the display module 100 also includes a reinforcing layer 24, a buffer layer 25, a second backplate 26, a polarizer 27, an optical adhesive layer 28, and a chip.

[0077] The reinforcing layer 24 is provided on the side of the first back plate 23 near the display section 11.

[0078] The buffer layer 25 is disposed on the side of the reinforcing layer 24 near the display section 11.

[0079] The second backplate 26 is located on the side of the buffer layer 25 near the display section 11.

[0080] The polarizer 27 is disposed between the display section 11 and the cover plate 21.

[0081] The optical adhesive layer 28 is disposed between the polarizer 27 and the cover plate 21.

[0082] The chip is bonded to the side of pad 22 away from the first bonding part BD1.

[0083] In this embodiment, the reinforcing layer 24 (Stiffener, STF) and the buffer layer 25 (Super Clean Foam, SCF) provide support and cushioning for the display module 100. The reinforcing layer 24 can be made of UV-curable adhesive, thermosetting adhesive, or acrylate. The thickness of the reinforcing layer 24 is in the range of 10 micrometers to 50 micrometers. The buffer layer 25 can be made of foam, polyimide, pressure-sensitive adhesive, etc. The first backplate 23 and the second backplate 26 provide support for the display module 100. The polarizer 27 can be a circular polarizer 27, used to reduce the reflection of ambient light by the display panel 10. The optical adhesive layer 28 is used to bond the cover plate 21 to the polarizer 27; the cover plate 21 protects the polarizer 27 and the display panel 10.

[0084] The chip can be a driver chip or other types of chips; no limitation is made here.

[0085] In the fifth embodiment of this application: Please see Figure 10Optionally, the display panel 10 further includes a bending portion 12 and a second binding portion BD2. The second binding portion BD2 is located on the side of the display portion 11 away from the cover plate 21. The bending portion 12 is located between the display portion 11 and the first binding portion BD1. The bending portion 12 integrally connects the display portion 11 and the second binding portion BD2.

[0086] The display module 100 also includes a flip-chip film 40. The flip-chip film 40 includes a first bonding portion BD1, a pad 22, and a chip. The first bonding portion BD1 is bonded to the side of the second bonding portion BD2 away from the display portion 11. The chip is bonded to the side of the pad 22 away from the first bonding portion BD1.

[0087] The display part 11, the bending part 12, the second binding part BD2, and the first binding part BD1 enclose the mounting space K. The heat dissipation assembly 30 is disposed within the mounting space K.

[0088] In this embodiment, the display panel 10 also needs to be bent to the back. However, unlike the fourth embodiment, in the fifth embodiment, the bent portion of the display panel 10 does not have a second opening M2, but rather the second opening M2 is provided on the flip-chip film 40.

[0089] Specifically, the display panel 10 includes an integrally connected display section 11, a bending section 12, and a second bonding section BD2. During the manufacturing process of the display module 100, after the first bonding section BD1 of the flip-chip film 40 is bonded to the second bonding section BD2 of the display panel 10, the first bonding section BD1 is bent to the backlight side of the display section 11 by the bending section 12, thereby reducing the size of the lower bezel of the display module 100 and achieving a narrow bezel design.

[0090] Optionally, the heat dissipation component 30 is in direct contact with the side of the first bonding part BD1 closest to the display part 11.

[0091] In the fifth embodiment, the heat dissipation component 30 can also be installed using a third method.

[0092] Before bonding the flip-chip film 40 to the display panel 10, pads 22 and heat dissipation components 30 are respectively provided on both sides of the thickness direction Z of the flip-chip film 40. At this time, the overlap between the pads 22 and the heat dissipation components 30 can be better achieved, improving the installation accuracy of the heat dissipation components 30. After the display panel 10 is bent, only the overlap between the first opening M1 and the second opening M2 needs to be achieved.

[0093] Compared to the second installation method, which requires installing the heat dissipation component 30 on a relatively large display panel 10, the third installation method allows the heat dissipation component 30 to be installed on a relatively small flip-chip film 40, reducing installation difficulty and production costs.

[0094] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0095] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0096] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0097] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, characterized in that, include: The display panel includes at least a display section, wherein the display section has a first opening in the thickness direction of the display module; A cover plate is provided on the light-emitting side of the display unit; A first binding part is provided on the side of the display part away from the cover plate. The first binding part has a second opening in the thickness direction of the display module. The second opening overlaps with the first opening and communicates to form a hole area. A solder pad is provided on the side of the first bonding portion away from the display portion, and the orthographic projection of the solder pad on the display portion is located on the side of the orthographic projection of the second opening on the display portion; as well as A heat dissipation component is disposed between the first bonding portion and the display portion, and overlaps with the pad in the thickness direction of the display module. The heat dissipation component includes a heat-conducting layer and a heat-insulating layer disposed sequentially on one side of the pad in the first bonding portion. A portion of the heat-conducting layer overlaps with the pad and the heat-insulating layer in the thickness direction of the display module, and another portion of the heat-conducting layer extends in a direction away from the hole area. The thermal conductivity of the heat-insulating layer is less than that of the heat-conducting layer.

2. The display module as described in claim 1, characterized in that, The orthographic projection of the solder pad on the first bonding portion is within the range of the orthographic projection of the thermal conductive layer on the first bonding portion.

3. The display module as described in claim 1, characterized in that, The orthographic projection of the solder pad on the first bonding portion is within the range of the orthographic projection of the heat insulation layer on the first bonding portion.

4. The display module as described in claim 1, characterized in that, The side of the heat insulation layer is flush with the side of the heat-conducting layer.

5. The display module as described in claim 1, characterized in that, The heat insulation layer includes: The first segment is located on the side of the thermally conductive layer away from the first bonding portion; and The second sub-segment is located on the side of the thermally conductive layer near the hole area.

6. The display module as described in claim 5, characterized in that, The heat insulation layer further includes a third segment, which is connected to the side of the second segment away from the first segment, and the orthographic projection of the third segment on the first bonding portion is located between the orthographic projection of the pad on the first bonding portion and the second opening.

7. The display module as described in claim 6, characterized in that, The first sub-segment, the second sub-segment, and the third sub-segment are connected as a whole.

8. The display module as described in any one of claims 1-7, characterized in that, The display panel further includes the first binding part and the bending part, the bending part being located between the display part and the first binding part, and the bending part connecting the first binding part and the display part; The display part, the bending part, and the first binding part are integrally formed and enclose an installation space, and the heat dissipation component is disposed within the installation space.

9. The display module as described in claim 8, characterized in that, The display module further includes a first back plate, which is disposed on the side of the first bonding portion near the display portion and located within the mounting space; The heat dissipation component is disposed between the first back plate and the first bonding part.

10. The display module as described in claim 9, characterized in that, The display module also includes: A reinforcing layer is provided on the side of the first back panel near the display section; A buffer layer is disposed on the side of the reinforcing layer near the display portion; The second backplate is located on the side of the buffer layer near the display section; A polarizing film is disposed between the display unit and the cover plate; An optical adhesive layer is disposed between the polarizer and the cover plate; and The chip is bonded to the side of the pad away from the first bonding portion.

11. The display module as described in any one of claims 1-7, characterized in that, The display panel further includes a bending portion and a second binding portion. The second binding portion is located on the side of the display portion away from the cover plate. The bending portion is located between the display portion and the first binding portion. The bending portion integrally connects the display portion and the second binding portion. The display module further includes a flip-chip film, which includes a first bonding portion, the pads, and a chip. The first bonding portion is bonded to the side of the second bonding portion away from the display portion, and the chip is bonded to the pads on the side away from the first bonding portion. The display part, the bending part, the second binding part, and the first binding part form an installation space, and the heat dissipation component is disposed within the installation space.

12. The display module as described in claim 11, characterized in that, The heat dissipation component is in direct contact with the side of the first bonding part closest to the display part.

13. A display device, characterized in that, Includes the display module as described in any one of claims 1-12.

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