Heat dissipation device for electronic circuit board processing

Abstract

The invention discloses a heat dissipation device for electronic circuit board processing, and relates to the technical field of electronic circuit board processing equipment.The heat dissipation device comprises a supporting mechanism, a synchronous moving mechanism arranged at the top of the supporting mechanism in a sliding mode, a heat absorption mechanism detachably installed at the bottom of the synchronous moving mechanism and a bearing mechanism arranged on the inner side of the supporting mechanism in a sliding mode; the heat absorption mechanism is located above the bearing mechanism, a driving mechanism is fixedly installed on the outer wall of the synchronous moving mechanism, and the driving mechanism is used for conveying heat conduction oil in the heat absorption mechanism. Through the integrated design of synchronous moving, heat absorption and graded temperature control, continuous gradient heat dissipation after lamination of multiple layers of electronic circuit boards is achieved; the cooling process of the substrate from 170-190 DEG C to the room temperature does not need manual transfer, seamless connection with a production line is achieved, the batch production efficiency is greatly improved, meanwhile, graded temperature control logic is matched with evenly-distributed heat absorption pipelines and stable heat conduction oil circulation, the problem of sudden temperature drop is avoided, and the effect of protecting an electronic circuit board is achieved.

Description

Technical Field

[0001] This invention belongs to the technical field of electronic circuit board processing equipment, and specifically relates to a heat dissipation device for electronic circuit board processing. Background Technology

[0002] The lamination and curing of multilayer electronic circuit boards is the core process for achieving interlayer adhesion. After lamination, the substrate temperature reaches as high as 170-190℃. It is necessary to eliminate residual heat through gradient cooling to avoid problems such as incomplete resin curing, substrate warping and deformation, or delamination of copper foil from resin.

[0003] Existing PCB heat dissipation devices have the following technical defects:

[0004] Poor heat dissipation uniformity: Traditional cooling platforms are prone to gaps when bonded to the substrate, resulting in excessive temperature differences between the upper and lower surfaces and edges of the substrate and the center, causing local stress concentration and leading to substrate warping.

[0005] Low level of automation: The cooling platform used in the heat dissipation process is disconnected from the conveying process, requiring manual transfer of the substrate in the later stage, which not only prolongs the production cycle, but may also affect the heat dissipation effect due to sudden temperature changes during the transfer process.

[0006] Unstable heat dissipation speed: The circuit board is first cooled in the laminator and then transferred to a constant temperature cooling platform for uniform heat dissipation. The temperature control is not precise enough in the two cooling processes. During the transfer process, heat leakage is likely to occur. Heat leakage will cause the temperature of the electronic circuit board to drop sharply, and the substrate will eventually have condensation or warping on the surface. Summary of the Invention

[0007] One objective of this invention is to provide a heat dissipation device for electronic circuit board processing, which aims to solve the problems of poor heat dissipation uniformity, low automation, and unstable heat dissipation speed in related technologies.

[0008] According to an embodiment of the present invention, a heat dissipation device for processing electronic circuit boards includes a support mechanism, a synchronous moving mechanism slidably disposed on its top, a heat absorption mechanism detachably installed at the bottom of the synchronous moving mechanism, and a bearing mechanism slidably disposed inside the support mechanism. The heat absorption mechanism is located above the bearing mechanism. A driving mechanism is fixedly installed on the outer wall of the synchronous moving mechanism. The driving mechanism is used to transport heat transfer oil in the heat absorption mechanism.

[0009] The synchronous moving mechanism includes a connecting frame, a connecting frame, and a mounting plate. The connecting frame is specifically a Y-shaped structure. The connecting frame is fixedly installed at the end of the connecting frame and rolls in contact with the support mechanism. The mounting plate is installed at the bottom of the connecting frame by bolts and is specifically an L-shaped structure. The heat absorption mechanism is installed horizontally on the lower surface of the mounting plate.

[0010] In a preferred embodiment, the support mechanism includes two symmetrically arranged support frames, a support plate is provided between the middle sections of the two support frames, a strip groove is provided above the junction of the support frame and the support plate, and a trapezoidal boss is provided on the inner side wall of the strip groove.

[0011] In a preferred embodiment, the supporting mechanism includes a support platform with rollers symmetrically mounted at both ends. The rollers overlap the bottom of the strip groove. A limit plate is provided near the edge of the support platform, and the limit plate is flush with the edge of the trapezoidal boss. A frame-shaped protective plate is provided at the top edge of the support platform.

[0012] In a preferred embodiment, two parallel guide rods are fixedly installed on the top of the support frame. The guide rods are located inside the connecting frame. Positioning wheels are rotatably installed at the four corners of the connecting frame. The positioning wheels roll and fit against the guide rods, and the four positioning wheels are located on the upper and lower sides of the guide rods, respectively.

[0013] In a preferred embodiment, a connecting block is fixedly connected to one side of one of the connecting frames, and an electric cylinder is fixedly connected to one side of the connecting block. The electric cylinder is horizontally fixedly installed on the outside of the support frame, and an extension plate is provided between the connecting frame and the connecting frame.

[0014] In a preferred embodiment, the drive mechanism includes a housing and an electric diaphragm pump. The housing is fixedly mounted on the upper surface of the extension plate, and the electric diaphragm pump is fixedly mounted on the upper surface of the mounting connection plate. The electric diaphragm pump is located below the housing. Both the output and input ends of the electric diaphragm pump are connected to oil pipelines. A plate heat exchanger and an oil storage tank are fixedly installed inside the housing. The plate heat exchanger and the oil storage tank are connected in series through oil pipelines.

[0015] In a preferred embodiment, the heat absorption mechanism includes a heat absorption plate, and a pipe-type electric heater is fixedly installed inside the heat absorption plate and inside the housing. The heating end of the pipe-type electric heater is provided with a sleeve. The sleeve inside the housing is fitted onto the outer wall of the oil pipeline. A heat absorption pipe is provided inside the heat absorption plate. Heat transfer oil is injected into the heat absorption pipe. The heat absorption pipe is connected to the oil pipeline at the output end of the plate heat exchanger. The sleeve inside the heat absorption plate is fitted onto the outer wall of the heat absorption pipe.

[0016] In a preferred embodiment, the upper surface of the heat absorber plate is integrally formed with a connecting rod, and an anti-detachment plate is provided above the heat absorber plate. The anti-detachment plate overlaps the upper surface of the mounting connecting plate, and the connecting rod passes through both the mounting connecting plate and the anti-detachment plate, with the end of the connecting rod extending above the anti-detachment plate.

[0017] In a preferred embodiment, the top of the anti-detachment plate is threaded with a lead screw, the bottom of the connecting frame is provided with a positioning block, the positioning block is welded and fixed to the mounting connecting plate, one end of the lead screw is rotatably installed inside the positioning block, and the end of the lead screw is threaded with a positioning end, which fits against the outer wall of the positioning block.

[0018] In a preferred embodiment, a strip-shaped hole is provided at the junction of the anti-detachment plate and the connecting rod, and an anti-detachment block is provided at one end of the strip-shaped hole. A through hole is provided inside the connecting rod, and the shape of the anti-detachment block is adapted to the through hole.

[0019] The beneficial effects of this invention are:

[0020] This invention achieves continuous gradient heat dissipation after lamination of multilayer electronic circuit boards through an integrated design of "synchronous movement + heat absorption + graded temperature control". The cooling process of the substrate from 170-190°C to room temperature does not require manual transfer and is seamlessly connected with the production line, which greatly improves the efficiency of mass production. At the same time, the graded temperature control logic, combined with the evenly distributed heat absorption pipes and stable heat transfer oil circulation, avoids the problem of sudden temperature drop and protects the electronic circuit boards.

[0021] This invention adopts a modular and detachable heat absorption plate and an adaptable structural design. By adjusting the anti-detachment plate with a screw, heat absorption units of different materials can be quickly replaced. The limit and guide design of the support and bearing mechanisms, the leak-free sealing and pressure protection of the drive mechanism ensure that the equipment operates stably and reliably for a long time, is easy to maintain and has low cost, and is suitable for diverse production needs. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0024] Figure 2 This is a schematic diagram of the support frame, synchronous moving mechanism, bearing mechanism, heat absorption mechanism, driving mechanism, and planar structure of the present invention.

[0025] Figure 3 This is the present invention. Figure 2 Enlarged structural diagram of part A.

[0026] Figure 4 This is a three-dimensional structural diagram of the support mechanism of the present invention.

[0027] Figure 5 This is a schematic diagram of the connecting frame and the electric cylinder of the present invention.

[0028] Figure 6This is a schematic diagram of the assembly structure of the synchronous moving mechanism, heat absorption mechanism and driving mechanism of the present invention.

[0029] Figure 7 This is the present invention. Figure 6 Enlarged structural diagram of section B.

[0030] Figure 8 This is a schematic diagram of the heat absorption mechanism and the driving mechanism of the present invention.

[0031] Figure 9 This is a structurally disassembled schematic diagram of the mounting connection plate and the heat absorption mechanism of the present invention.

[0032] Figure 10 This is a diagram showing the internal heat absorption pipe route of the heat absorption plate of the present invention.

[0033] In the diagram: 1. Tool holder; 2. Cutting section; 3. Position adjustment mechanism; 31. Support rod; 32. Control lever; 33. Indicator dial; 34. Connecting rod; 35. First circular toothed plate; 36. Trapezoidal protrusion; 37. Recess; 4. Locking mechanism; 41. Mounting base; 42. Support frame; 43. Threaded rod; 44. Sleeve; 45. Widened section; 46. Guide tube; 47. Receiving through hole; 48. Limiting block; 49. Cavity; 410. Second circular toothed plate; 411. Connecting rod; 5. Second piston; 6. First piston; 7. Elastic support; 8. Exhaust hole. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0035] refer to Figure 1 and Figure 2 As shown, a heat dissipation device for electronic circuit board processing includes a support mechanism 1, a synchronous moving mechanism 2 slidably disposed on its top, a heat absorption mechanism 4 detachably installed at the bottom of the synchronous moving mechanism 2, and a bearing mechanism 3 slidably disposed inside the support mechanism 1. The heat absorption mechanism 4 is located above the bearing mechanism 3. A drive mechanism 5 is fixedly installed on the outer wall of the synchronous moving mechanism 2. The drive mechanism 5 is used to transport heat transfer oil in the heat absorption mechanism 4.

[0036] The synchronous moving mechanism 2 includes a connecting frame 21, a connecting frame 23, and a mounting connecting plate 27. The connecting frame 21 is specifically a Y-shaped structure. The connecting frame 23 is fixedly installed at the end of the connecting frame 21 and is in rolling contact with the support mechanism 1. The mounting connecting plate 27 is installed at the bottom of the connecting frame 23 by bolts and is specifically an L-shaped structure. The heat absorption mechanism 4 is installed horizontally on the lower surface of the mounting connecting plate 27.

[0037] It should be further explained that the Y-shaped structure design of the connecting frame 21, and its horizontal orientation, can reduce the load on the supporting frame 11 while ensuring the overall structural strength of the synchronous moving mechanism 2. At the same time, it provides a stable installation foundation for the extension plate 22. Meanwhile, the L-shaped mounting connecting plate 27 serves as both a horizontal mounting surface and a vertical connecting surface. The horizontal mounting surface provides a stable installation reference for the heat absorption mechanism 4, while the vertical connecting surface is tightly fixed to the connecting frame 23 with bolts, enhancing the installation stability of the heat absorption mechanism 4 and preventing it from shifting due to vibration during synchronous movement.

[0038] In this embodiment, the specific implementation scenario is as follows: during the process of conveying the board on the electronic circuit board processing line, the support mechanism 1 is fixed to the ground or production line frame through the support frame 11, the installation position of the entire heat dissipation device is clearly defined, and it is ensured that it is aligned with the conveying path of the preceding and following processes (lamination process, subsequent solder resist process). When in use, the electronic circuit board that has just completed lamination and curing at a temperature of 170-190℃ falls directly from the outlet of the laminator onto the bearing mechanism 3 without manual transfer, thus avoiding stress caused by sudden temperature changes during the transfer of the substrate. A chain conveyor or belt conveyor is set at the bottom inside the support mechanism 1. The conveyor drives the bearing mechanism 3 to move at a uniform speed, which is adjusted to 0.5-1m / min according to the heat dissipation requirements.

[0039] While the supporting mechanism 3 moves, the synchronous moving mechanism 2 moves at the same speed and in the same direction as the supporting mechanism 3, so as to achieve relative stillness between the heat absorption mechanism 4 and the PCB substrate, ensuring the continuity and uniformity of the heat dissipation process. During the movement, the heat absorption mechanism 4, together with the driving mechanism 5, continuously delivers heat transfer oil and adopts a segmented gradient cooling method of "high temperature constant temperature - medium temperature rapid heat dissipation - low temperature buffer" to dissipate heat from the electronic circuit board: first, the substrate is cooled from 170-190℃ to 120-130℃ at a cooling rate of 2-3℃ / min; then it is rapidly cooled to 60-80℃ at a cooling rate of 4-5℃ / min, and finally slowly cooled to a temperature difference of less than 5℃ between room temperature and ambient temperature.

[0040] like Figure 2 , Figure 3 and Figure 4As shown, in another embodiment of the present invention, in order to ensure the stability of the bearing mechanism 3 during movement, the support mechanism 1 includes two symmetrically arranged support frames 11, a support plate 12 is provided between the middle sections of the two support frames 11, a strip groove 13 is provided above the junction of the support frame 11 and the support plate 12, a trapezoidal boss 14 is provided on the inner side wall of the strip groove 13, the bearing mechanism 3 includes a support platform 31, rollers 32 are symmetrically and rotatably installed at both ends of the support platform 31, the rollers 32 overlap the bottom of the strip groove 13, a limiting plate 33 is provided near the edge of the support platform 31 of the rollers 32, the limiting plate 33 is flush with the edge of the trapezoidal boss 14, and a frame-shaped protective plate 34 is provided on the top edge of the support platform 31.

[0041] It should be noted that the support frame 11 is made of high-strength aluminum alloy in one piece. The support plate 12 and the support frame 11 are fixed by welding to form a stable portal frame structure. The length of the strip groove 13 is adapted to the conveying stroke of the production line, and its groove width is 0.5-1mm larger than the diameter of the roller 32. The upper surface of the support platform 31 of the bearing mechanism 3 is anodized to form a wear-resistant and high-temperature resistant protective layer to prevent direct contact with the high-temperature substrate and thus prevent surface damage. The inner wall of the protective plate 34 is pasted with a high-temperature resistant silicone pad with a thickness of 0.3-0.5mm. The silicone pad can not only fix the position of the electronic circuit board substrate, but also buffer the stress generated by the thermal expansion of the substrate and avoid damage to the edge of the substrate.

[0042] In this embodiment, the implementation scenario is as follows: the support frame 11 is fixed to the production line ground by the anchor bolts at the bottom, ensuring that the height of the support frame 11 is consistent with the output end of the laminator and the feed end of the subsequent process. The support plate 12 further enhances the lateral stability of the support frame 11. When the laminated and cured electronic circuit board substrate is transferred to the support platform 31 of the bearing mechanism 3, the protective plate 34 quickly completes the semi-encapsulation and heat preservation of the substrate to avoid a sudden drop in temperature. At this time, the chain conveyor mechanism at the bottom of the inner side of the support mechanism 1 is activated. It is connected to the traction block at the bottom of the support platform 31 through the chain, driving the support platform 31 to move at a constant speed along the strip groove 13. During the movement, the roller 32 rolls along the bottom of the strip groove 13. When the roller 32 moves to the trapezoidal boss 14, it moves upward along the inclined surface of the trapezoidal boss 14 until it is in contact with the heat absorption mechanism 4. During the heat absorption process, the protective plate 34 is in close contact with the edge of the heat absorption mechanism 4 to form a closed environment to avoid heat leakage and ensure the normal operation of the segmented gradient cooling.

[0043] like Figure 2 , Figure 4 and Figure 5As shown, in another embodiment of the present invention, two parallel guide rods 15 are fixedly installed on the top of the support frame 11. The guide rods 15 are located inside the connecting frame 23. Positioning wheels 25 are rotatably installed at the four corners of the connecting frame 23. The positioning wheels 25 roll and fit against the guide rods 15. The four positioning wheels 25 are located on the upper and lower sides of the guide rods 15 respectively. A connecting block 26 is fixedly connected to one side of one of the connecting frames 23. An electric cylinder 24 is fixedly connected to one side of the connecting block 26. The electric cylinder 24 is fixedly installed horizontally on the outside of the support frame 11. An extension plate 22 is provided between the connecting frame 21 and the connecting frame 23.

[0044] In this embodiment, the specific implementation scenario is: continuous synchronous heat dissipation process of multilayer PCB production line. The two parallel guide rods 15 at the top of the support frame 11 determine the movement trajectory of the connecting frame 23, ensuring that it is completely consistent with the movement direction of the bearing mechanism 3. When the production line starts, the bearing mechanism 3 moves at a constant speed along the strip groove 13 under the drive of the conveying mechanism. At this time, the production line PLC controller collects the movement speed signal of the bearing mechanism 3 in real time and sends it synchronously to the servo control system of the electric cylinder 24.

[0045] According to the received signal, the electric cylinder 24 applies a smooth thrust to the connecting frame 23 through the connecting block 26, driving the connecting frame 23 to move along the guide rod 15 at the same speed and in the same direction. During the movement, the positioning wheels 25 at the four corners of the connecting frame 23 roll closely against the upper and lower sides of the guide rod 15. At the same time, the "clamping" layout effectively restricts the vertical movement and horizontal displacement of the connecting frame 23, so that the heat absorption mechanism 4 driven by the synchronous moving mechanism 2 always remains relatively stationary with the bearing mechanism 3. The distance error between the two is controlled within ±0.1mm, avoiding the warping and delamination problems caused by inconsistent local heat dissipation time of the PCB substrate due to relative displacement.

[0046] The extension plate 22 between the connecting frame 21 and the connecting frame 23 provides a stable and reasonable installation space for the drive mechanism 5, ensuring that the drive mechanism 5 does not interfere with other components during synchronous movement. At the same time, it shortens the length of the oil pipeline 52, reduces heat loss and pressure loss during the heat transfer oil transportation process, and improves temperature control accuracy and circulation efficiency.

[0047] like Figure 5 , Figure 6 , Figure 8 and Figure 10As shown, in another embodiment of the present invention, the drive mechanism 5 includes a housing 51 and an electric diaphragm pump 53. The housing 51 is fixedly installed on the upper surface of the extension plate 22, and the electric diaphragm pump 53 is fixedly installed on the upper surface of the mounting connecting plate 27. The electric diaphragm pump 53 is located below the housing 51. Both the output end and the input end of the electric diaphragm pump 53 are connected to an oil pipeline 52. A plate heat exchanger and an oil storage tank are fixedly installed inside the housing 51. The plate heat exchanger and the oil storage tank are connected in series through the oil pipeline 52. The heat absorption mechanism 4 includes a heat absorption... A pipe-type electric heater 412 is fixedly installed inside the plate 41, the heat-absorbing plate 41, and the housing 51. The heating end of the pipe-type electric heater 412 is provided with a sleeve 413. The sleeve 413 inside the housing 51 is sleeved on the outer wall of the oil pipeline 52. The heat-absorbing plate 41 is provided with a heat-absorbing pipe 411. The heat-absorbing pipe 411 is filled with heat-conducting oil. The heat-absorbing pipe 411 is connected to the oil pipeline 52 at the output end of the plate heat exchanger. The sleeve 413 inside the heat-absorbing plate 41 is sleeved on the outer wall of the heat-absorbing pipe 411.

[0048] It should be added that temperature sensors are installed at the inlet and outlet of the heat absorption pipe 411, and the data is uploaded to the PLC controller to control the electric diaphragm pump 53, plate heat exchanger and pipe electric heater 412. The selection of heat transfer oil is based on the fact that the heat dissipation after the electronic circuit board lamination needs to cover the entire range from 170-190℃ high temperature to room temperature. The heat transfer oil can maintain a stable liquid state in a wide temperature range of -20℃ to above 200℃, without the risk of solidification or boiling. It can perfectly adapt to the three-stage cooling logic of "high temperature constant temperature - medium temperature rapid heat dissipation - low temperature buffering" to avoid heat dissipation interruption due to changes in the state of the medium.

[0049] Furthermore, the heat transfer oil has a moderate specific heat capacity, which not only provides sufficient heat carrying capacity but also enables precise temperature control by adjusting the flow rate and cooling power. This is highly compatible with the requirement of strictly controlling the cooling rate (2-3℃ / min, 4-5℃ / min) for heat dissipation of electronic circuit boards. It can prevent stress caused by excessively rapid cooling of the substrate or low production efficiency caused by excessively slow cooling. The selected synthetic heat transfer oil has a viscosity of 20-30mm² / s at 20℃ and a thermal conductivity ≥0.15W / (m・K).

[0050] In this embodiment, the specific implementation scenario is: a continuous gradient heat dissipation process after multilayer PCB lamination and curing, in which the drive mechanism 5 and the heat absorption mechanism 4 work together to realize the closed-loop temperature control circulation of the heat transfer oil, adapting to the segmented cooling requirements of the substrate from 170-190℃ to room temperature.

[0051] During the high-temperature constant-temperature stage (170-130℃ for the substrate): The pipe-type electric heater 412 inside the housing 51 and the heat absorber plate 41 is activated, heating the heat transfer oil in the oil delivery pipe 52 through the sleeve 413, stabilizing the oil temperature at 120-130℃; the electric diaphragm pump 53 delivers the heat transfer oil at a low speed, and the heat transfer oil flows into the heat absorption pipe 411 of the heat absorber plate 41 through the oil delivery pipe 52, exchanging heat with the PCB substrate. At this time, the heat transfer oil mainly plays the role of "uniform heat" to avoid local sudden cooling of the substrate, and at the same time assists the resin to cure after completion, improving the interlayer bonding strength; after heat exchange, the temperature of the heat transfer oil rises slightly to ≤135℃, and flows back to the oil storage tank in the housing 51, without the need to start the plate heat exchanger, achieving constant-temperature circulation;

[0052] During the medium-temperature rapid heat dissipation stage (substrate temperature 130-60℃): Based on the signal from the temperature sensor, the PLC shuts off the pipe-type electric heater 412, starts the plate heat exchanger and introduces industrial cold water. The electric diaphragm pump 53 switches to high-speed (1.2-1.5m / s) operation to accelerate the circulation of heat transfer oil. After the heat transfer oil in the heat absorption pipe 411 quickly absorbs the residual heat of the substrate, it flows into the plate heat exchanger to exchange heat with the cold water. The oil temperature drops to 80-90℃ and then flows back to the heat absorption pipe 411 to continue absorbing heat, achieving rapid cooling of the substrate. The cooling rate is stable at 4-5℃ / min, and the surface temperature of the heat absorption plate 41 is uniform, avoiding stress warping of the substrate due to temperature difference.

[0053] Low-temperature buffer stage substrate 60-room temperature: PLC adjusts the cold water flow rate of plate heat exchanger to reduce cooling power and maintain the heat transfer oil temperature at 40-50℃; electric diaphragm pump 53 resumes low-speed (0.5-0.8m / s) operation to reduce the heat exchange rate between heat transfer oil and substrate, so that the substrate is slowly cooled to a temperature difference of <5℃ with the environment, avoiding condensation or interlayer peeling on the substrate surface due to sudden temperature drop.

[0054] like Figure 6 , Figure 7 , Figure 8 and Figure 9As shown, in another embodiment of the present invention, a connecting rod 43 is integrally formed on the upper surface of the heat-absorbing plate 41, and an anti-detachment plate 42 is provided above the heat-absorbing plate 41. The anti-detachment plate 42 overlaps the upper surface of the mounting connecting plate 27. The connecting rod 43 passes through both the mounting connecting plate 27 and the anti-detachment plate 42, and the end of the connecting rod 43 extends above the anti-detachment plate 42. A lead screw 47 is threadedly connected to the top of the anti-detachment plate 42. A positioning block 28 is provided at the bottom of the connecting frame 21. The positioning block 28 is welded and fixed to the mounting connecting plate 27. One end of the lead screw 47 is rotatably installed inside the positioning block 28, and the end of the lead screw 47 is threadedly connected to a positioning end 48. The positioning end 48 fits against the outer wall of the positioning block 28. A strip hole 45 is provided at the junction of the anti-detachment plate 42 and the connecting rod 43. An anti-detachment block 46 is provided at one end of the strip hole 45. A through hole 44 is provided inside the connecting rod 43, and the shape of the anti-detachment block 46 is adapted to the through hole 44.

[0055] It should be noted that the heat absorption plate 41 is formed by splicing two plates together, and there are four connecting rods 43, which are evenly distributed at the four corners of the heat absorption plate 41.

[0056] In this embodiment, the specific implementation scenario is as follows: When installing the heat absorber plate 41, first, the anti-detachment plate 42 is attached to the upper surface of the mounting connecting plate 27. The end of the lead screw 47 is inserted into the interior of the positioning block 28. Then, the positioning end 48 is installed into the end of the lead screw 47 to complete the initial installation. Subsequently, the heat absorber plate 41 is installed from the bottom upwards of the mounting connecting plate 27. The four connecting rods 43 are aligned with the through holes of the mounting connecting plate 27 and passed through the mounting connecting plate 27 from bottom to top, so that the ends of the connecting rods 43 pass through the anti-detachment plate 42. Then, the lead screw 47 is rotated, causing the anti-detachment plate 42 to slide horizontally, so that the anti-detachment block 46 in the strip hole 45 is inserted into the through hole 44 of the connecting rod 43. After final locking, the engaging structure between the anti-detachment block 46 and the through hole 44 effectively prevents the heat absorber plate 41 from falling off during synchronous movement and vibration, ensuring installation reliability. When it is necessary to replace the heat absorber plate 41 with a different material, such as a copper heat absorber plate suitable for a thick substrate or an aluminum alloy + graphite composite heat absorber plate suitable for a thin substrate, rotate the screw 47 to disengage the anti-detachment block 46 from the through hole 44 of the docking rod 43; then pull down the heat absorber plate 41 to disengage the docking rod 43 from the through hole of the mounting connecting plate 27, completing the disassembly of the old heat absorber plate 41; install the new heat absorber plate 41 according to the above installation process and adjust the gap to complete the changeover, greatly improving the changeover efficiency of the production line and adapting to the batch production needs of multi-specification PCBs.

[0057] Working principle:

[0058] The heat dissipation device is fixed in the designated position on the production line by the anchor bolts at the bottom of the support frame 11, ensuring that the height of the support frame 11 is consistent with the output end of the laminator and the feed end of the subsequent process, and that the conveying path is aligned. According to the thickness of the PCB substrate to be processed, aluminum alloy + graphite composite heat absorption plate is selected for thin substrates and copper heat absorption plate is selected for thick substrates. Heat absorption plate 41 is installed. First, the anti-detachment plate 42 is attached to the upper surface of the installation connecting plate 27. The end of the screw 47 is inserted into the positioning block 28. The positioning end 48 is installed to complete the initial fixation. The four connecting rods 43 of the heat absorption plate 41 are inserted from the bottom of the installation connecting plate 27 to the through hole, so that the ends of the rods pass through the anti-detachment plate 42. The screw 47 is rotated to drive the anti-detachment plate 42 to slide, so that the anti-detachment block 46 in the strip hole 45 is inserted into the through hole 44 of the connecting rod 43 to complete the locking.

[0059] Heat transfer oil is added to the oil storage tank containing housing 51, ensuring that the oil volume reaches 1.5-2 times the total circulation volume. The graded temperature control parameters are set through the PLC controller: oil temperature 120-130℃ in the high-temperature constant temperature stage with a cooling rate of 2-3℃ / min; oil temperature 80-90℃ in the medium-temperature rapid heat dissipation stage with a cooling rate of 4-5℃ / min; and oil temperature 40-50℃ in the low-temperature buffer stage. The moving speed of the bearing mechanism 3 is set to 0.5-1m / min according to the substrate specifications, and the accuracy of the temperature sensor data transmission is calibrated.

[0060] After lamination and curing, the PCB substrate with a temperature of 170-190℃ is directly transferred from the laminator outlet to the support platform 31 of the carrier mechanism 3. The protective plate 34 on the top of the support platform 31 partially covers and positions the substrate. The chain conveyor mechanism at the bottom of the inner side of the support mechanism 1 is activated, and the support platform 31 is pulled by the chain to move at a constant speed along the strip groove 13. During the movement, the rollers 32 of the support platform 31 roll along the strip groove 13 and move upward through the inclined surface of the trapezoidal boss 14, so that the heat absorption mechanism 4 and the edge of the protective plate 34 are tightly attached to form a closed environment to prevent heat leakage. At the same time, the electric cylinder 24 pushes the connecting frame 23 through the connecting block 26, and moves along the guide rod 15 at the same speed and in the same direction as the carrier mechanism 3. The clamping layout of the positioning wheel 25 ensures that the heat absorption mechanism 4 and the substrate are relatively stationary.

[0061] The PLC controller starts the pipe-type electric heater 412 inside the housing 51 and the heat absorber plate 41, which heats the heat transfer oil to 120-130℃ through the sleeve 413; the electric diaphragm pump 53 runs at low speed, and the heat transfer oil flows into the heat absorption pipe 411 of the heat absorber plate 41 through the oil delivery pipe 52, where it exchanges heat with the substrate, and is cured after the auxiliary resin is applied. The heat transfer oil after heat exchange flows back to the oil storage tank to achieve constant temperature circulation.

[0062] When the temperature sensor detects that the substrate temperature has dropped to 130℃, the PLC shuts off the pipeline electric heater 412, starts the plate heat exchanger and introduces industrial cold water; the electric diaphragm pump 53 switches to high speed of 1.2-1.5m / s to accelerate the circulation of heat transfer oil. After absorbing the residual heat of the substrate, the heat transfer oil is cooled to 80-90℃ by the plate heat exchanger and then flows back to continue absorbing heat, ensuring that the substrate cools down at a rate of 4-5℃ / min.

[0063] When the substrate temperature drops to 60℃, the PLC adjusts the cold water flow rate of the plate heat exchanger to reduce the cooling power and maintain the heat transfer oil temperature at 40-50℃; the electric diaphragm pump 53 resumes a low speed of 0.5-0.8m / s to reduce the heat exchange rate and allow the substrate to cool slowly to a temperature difference of <5℃ with the environment, thus avoiding condensation or interlayer delamination.

[0064] When the PLC detects that the temperature difference between the substrate and the ambient temperature is less than 5°C, it determines that the heat dissipation is complete. The carrying mechanism 3 moves to the unloading end and transports the cooled PCB substrate to the next process. The electric cylinder 24 drives the synchronous moving mechanism 2 to drive the heat absorption mechanism 4 to reset to the initial position. The driving mechanism 5 stops running, completing a single heat dissipation cycle.

[0065] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation device for electronic circuit board processing, characterized in that, It includes a support mechanism (1), a synchronous moving mechanism (2) that is slidably set on top of it, a heat absorption mechanism (4) that is detachably installed at the bottom of the synchronous moving mechanism (2), and a bearing mechanism (3) that is slidably set inside the support mechanism (1). The heat absorption mechanism (4) is located above the bearing mechanism (3). A drive mechanism (5) is fixedly installed on the outer wall of the synchronous moving mechanism (2). The drive mechanism (5) is used to transport the heat transfer oil in the heat absorption mechanism (4). The synchronous moving mechanism (2) includes a connecting frame (21), a connecting frame (23), and a mounting connecting plate (27). The connecting frame (21) is specifically a Y-shaped structure. The connecting frame (23) is fixedly installed at the end of the connecting frame (21), and the connecting frame (23) is in rolling contact with the support mechanism (1). The mounting connecting plate (27) is installed at the bottom of the connecting frame (23) by bolts, and the mounting connecting plate (27) is specifically an L-shaped structure. The heat absorption mechanism (4) is installed horizontally on the lower surface of the mounting connecting plate (27).

2. The heat dissipation device for electronic circuit board processing according to claim 1, characterized in that, The support mechanism (1) includes two symmetrically arranged support frames (11), a support plate (12) is provided between the middle sections of the two support frames (11), a strip groove (13) is provided above the junction of the support frame (11) and the support plate (12), and a trapezoidal boss (14) is provided on the inner side wall of the strip groove (13).

3. The heat dissipation device for electronic circuit board processing according to claim 1, characterized in that, The bearing mechanism (3) includes a support platform (31), with rollers (32) symmetrically mounted on both ends of the support platform (31). The rollers (32) overlap the bottom of the strip groove (13). A limiting plate (33) is provided near the edge of the support platform (31) of the rollers (32). The limiting plate (33) is flush with the edge of the trapezoidal boss (14). A frame-shaped protective plate (34) is provided on the top edge of the support platform (31).

4. A heat dissipation device for electronic circuit board processing according to claim 2, characterized in that, Two parallel guide rods (15) are fixedly installed on the top of the support frame (11). The guide rods (15) are located inside the connecting frame (23). Positioning wheels (25) are rotatably installed at the four corners of the connecting frame (23). The positioning wheels (25) roll and fit with the guide rods (15), and the four positioning wheels (25) are located on the upper and lower sides of the guide rods (15) respectively.

5. A heat dissipation device for electronic circuit board processing according to claim 1, characterized in that, One of the connecting frames (23) is fixedly connected to a connecting block (26) on one side, and an electric cylinder (24) is fixedly connected to one side of the connecting block (26). The electric cylinder (24) is fixedly installed on the outside of the support frame (11) in a horizontal state, and an extension plate (22) is provided between the connecting frame (21) and the connecting frame (23).

6. A heat dissipation device for electronic circuit board processing according to claim 1, characterized in that, The drive mechanism (5) includes a housing (51) and an electric diaphragm pump (53). The housing (51) is fixedly installed on the upper surface of the extension plate (22), and the electric diaphragm pump (53) is fixedly installed on the upper surface of the mounting connection plate (27). The electric diaphragm pump (53) is located below the housing (51). The output end and input end of the electric diaphragm pump (53) are both connected to the oil pipeline (52). The housing (51) is fixedly installed with a plate heat exchanger and an oil storage tank. The plate heat exchanger and the oil storage tank are connected in series through the oil pipeline (52).

7. A heat dissipation device for electronic circuit board processing according to claim 6, characterized in that, The heat absorption mechanism (4) includes a heat absorption plate (41). A pipe-type electric heater (412) is fixedly installed inside the heat absorption plate (41) and inside the housing (51). The heating end of the pipe-type electric heater (412) is provided with a sleeve (413). The sleeve (413) inside the housing (51) is sleeved on the outer wall of the oil pipeline (52). A heat absorption pipe (411) is provided inside the heat absorption plate (41). Heat transfer oil is injected into the heat absorption pipe (411). The heat absorption pipe (411) is connected to the oil pipeline (52) at the output end of the plate heat exchanger. The sleeve (413) inside the heat absorption plate (41) is sleeved on the outer wall of the heat absorption pipe (411). A temperature sensor is provided at the inlet and outlet of the heat absorption pipe (411). The temperature sensor is electrically connected to the PLC controller.

8. A heat dissipation device for electronic circuit board processing according to claim 7, characterized in that, The upper surface of the heat-absorbing plate (41) is integrally formed with a connecting rod (43), and an anti-detachment plate (42) is provided above the heat-absorbing plate (41). The anti-detachment plate (42) overlaps the upper surface of the mounting connecting plate (27). The connecting rod (43) passes through both the mounting connecting plate (27) and the anti-detachment plate (42), and the end of the connecting rod (43) extends above the anti-detachment plate (42).

9. A heat dissipation device for electronic circuit board processing according to claim 8, characterized in that, The top of the anti-detachment plate (42) is threaded with a lead screw (47), and the bottom of the connecting frame (21) is provided with a positioning block (28). The positioning block (28) is welded and fixed to the mounting connecting plate (27). One end of the lead screw (47) is rotatably installed inside the positioning block (28), and the end of the lead screw (47) is threaded with a positioning end (48). The positioning end (48) is in contact with the outer wall of the positioning block (28).

10. A heat dissipation device for electronic circuit board processing according to claim 9, characterized in that, A strip hole (45) is provided at the junction of the anti-detachment plate (42) and the connecting rod (43). An anti-detachment block (46) is provided at one end of the strip hole (45). A through hole (44) is provided inside the connecting rod (43). The shape of the anti-detachment block (46) is adapted to the through hole (44).

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