Integrated circuit chip mounter head based on integrated glue dispensing, chip mounting and welding

Abstract

The invention relates to the technical field of integrated circuit manufacturing, and discloses an integrated circuit chip mounter head based on adhesive dispensing, chip mounting and welding integration, which comprises a guide rail, the inner wall of the guide rail is provided with a channel, and the inner wall of the channel is slidably connected with an abutting plate; the upper end of the channel is fixedly connected with a fixing block for fixing the upper end of the dispensing module, the lower end of the dispensing module is fixedly connected with a sliding block fixedly connected with the lower end of the dispensing module, and the sliding block is slidably connected with the inner wall of the channel. The limiting piece is arranged, rigid supporting of the blade at the limiting position provides a stable foundation for clamping of the clamping plate and the positioning rod, and clamping gaps caused by flexible supporting are avoided; meanwhile, due to the structural design of the S-shaped clamping plate, clamping pressure can be dispersed, local abrasion can be reduced, generation of clamping gaps can be delayed, the hidden danger of loosening of the clamping structure is effectively avoided, the service life of a clamping component is prolonged, and long-term stability of positioning precision is ensured.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and specifically to an integrated circuit chip mounting head based on dispensing, chip mounting, and welding integration. Background Technology

[0002] Against the backdrop of the rapid development of integrated circuits towards high density and miniaturization, traditional discrete processes such as dispensing, mounting, and soldering are no longer sufficient to meet the high-precision and high-efficiency manufacturing requirements for the direct construction of conductive patterns on insulating substrates. Current advanced technologies have introduced an integrated process head structure. This process head processes micro-prefabricated conductive units such as sheet-like copper lines and fine metal pillars, achieving active "building" of conductive patterns through collaborative work. First, the dispensing module precisely applies conductive adhesive to designated locations on the insulating substrate, providing a positioning and connection foundation for subsequent assembly. Then, the mounting module precisely picks up the prefabricated conductive components and accurately positions them to the substrate electrodes. Finally, a micro-area soldering unit applies a localized heat source to achieve metallurgical bonding between the prefabricated conductor and the substrate electrodes, ensuring reliable connection.

[0003] In actual production, the frequent starting and stopping of the dispensing valve, the acceleration and deceleration of the placement head, and the downward impact of the soldering head constitute the initial vibration sources. Because these modules are rigidly connected via a shared mounting substrate, the vibration energy generated by each module cannot be effectively isolated. Instead, it is transmitted and superimposed through the substrate structure, creating a resonance effect. This vibration coupling effect directly leads to micron-level relative displacement between the dispensing, placement, and soldering functional modules, disrupting the spatial coordination accuracy between each process step. More seriously, this persistent coordinated vibration can trigger long-term negative effects. High-frequency mechanical impacts exacerbate the microscopic wear of moving parts such as guide rails and ball screws, causing backlash and positioning errors to accumulate and expand continuously, thus forming a vicious cycle of "vibration exacerbating wear, wear amplifying vibration, and software compensation lagging," ultimately causing a continuous deterioration in the dynamic accuracy of the equipment and directly affecting the quality stability of integrated circuit manufacturing. Summary of the Invention

[0004] To address the aforementioned shortcomings of existing technologies, this invention provides an integrated circuit placement head based on dispensing, patching, and welding, which effectively solves the problems of precision loss due to mutual interference from module vibration, equipment wear, and compensation lag in existing technologies.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] This invention provides an integrated circuit placement head based on dispensing, mounting, and soldering, comprising:

[0007] Dispensing module;

[0008] Surface mount module;

[0009] Welding module;

[0010] A fixed frame is provided on one side with a motion platform that limits the movement of the dispensing module, the patch module, and the welding module. The dispensing module, the patch module, and the welding module move along the motion platform to build conductive patterns.

[0011] The motion platform includes a buffer plate disposed on the lower side of the fixed frame. The top of the buffer plate is provided with a guide rail for limiting the dispensing module, patch module and welding module. The inner wall of the guide rail is provided with a channel, and a stop plate is slidably connected to the inner wall of the channel.

[0012] The upper end of the channel is fixedly connected to a fixing block for fixing the upper end of the dispensing module, and the lower end of the dispensing module is fixedly connected to a sliding block for fixing the lower end of the dispensing module. The sliding block is slidably connected to the inner wall of the channel.

[0013] The inner wall of the channel is provided with a movable component that slides to the side of the sliding block.

[0014] Furthermore, the channel is provided with symmetrical side grooves on its side, and a buffer member is provided on the inner wall of the side groove. The buffer member includes a buffer spring that is elastically connected to the inner wall of the side groove, and a connecting block is provided in the middle of the buffer spring.

[0015] Furthermore, a connecting plate is fixedly connected to one end of the connecting block near the channel, and the other end of the connecting plate is fixedly connected to the abutment plate. Both ends of the abutment plate are in contact with the sides of the movable part.

[0016] Furthermore, a limiting component is provided at the other end of the connecting block. The limiting component includes a rotating plate that is rotatably connected to the other end of the connecting block. A clamping plate is fixedly connected to one end of the rotating plate, and the clamping plate adopts an S-shaped design.

[0017] Furthermore, a blade is fixedly connected to one end of the card plate near the connecting block. The blade has an arc-shaped side and the side of the blade fits into the movable part.

[0018] Furthermore, the movable component includes a fixed plate disposed on the inner wall of the channel, a pulley being rotatably connected to one end of the fixed plate near the channel, and a telescopic spring being elastically connected to the other side of the pulley.

[0019] Furthermore, a positioning rod is symmetrically fixed at the end of the side groove away from the channel, the size of the positioning rod is smaller than the size of the groove of the card plate, and a movable groove is opened at the end of the side groove away from the channel, and an eccentric wheel that fits against the side of the rotating plate is fixedly connected to the inner wall of the movable groove.

[0020] The technical solution provided by this invention has the following advantages compared with the prior art:

[0021] This invention incorporates a limiting component. The rigid support of the blade at its extreme position provides a stable foundation for the engagement of the clamping plate and the positioning rod, avoiding engagement gaps caused by flexible support. At the same time, the S-shaped clamping plate's structural design can disperse engagement pressure, reduce local wear, delay the formation of engagement gaps, effectively avoid the hidden danger of loosening of the engagement structure, extend the service life of the engagement components, and ensure the long-term stability of positioning accuracy.

[0022] This invention connects independent sliding blocks to the back plate, and the elastic support of the buffer springs creates flexible isolation between the modules. Vibrations generated by the movement of one module are absorbed by the buffer springs and the flexible support of the blades and will not be significantly transmitted to other modules. At the same time, the independent design of the moving parts ensures that the movement and friction of each module do not affect each other, effectively solving the interference problem between multiple modules and ensuring the accuracy and stability of each module's independent operation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the split structure of the motion platform according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the inner wall structure of the trough assembly according to an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the movable groove structure according to an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the buffer connection structure according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the connection structure of the moving parts according to an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of the limiting component structure according to an embodiment of the present invention.

[0031] The labels in the diagram represent: 1. Dispensing module; 2. Patch module; 3. Welding module; 4. Fixing frame; 5. Motion platform; 51. Guide rail; 52. Channel; 521. Side channel; 522. Movable channel; 523. Positioning rod; 524. Eccentric wheel; 53. Support plate; 531. Connecting plate; 54. Buffer plate; 55. Fixing block; 56. Sliding block; 57. Limiting component; 571. Rotating plate; 572. Clamping plate; 573. Blade; 58. Movable component; 581. Fixing plate; 582. Pulley; 583. Telescopic spring; 59. Buffer component; 591. Buffer spring; 592. Connecting block. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] The present invention will be further described below with reference to embodiments.

[0034] Example:

[0035] Please see Figures 1-7 The present invention provides a technical solution:

[0036] refer to Figure 1 and Figure 2 The overall structure is supported by a fixed frame 4. The integrated motion platform 5 on one side is the core carrier for the precise movement of the three functional modules. The dispensing module 1, the patch module 2, and the welding module 3 all rely on the motion platform 5 to move along a set trajectory, thereby achieving the orderly construction of conductive patterns. A buffer plate 54 is installed at the bottom of the motion platform 5, serving as the bottom buffer foundation for the entire motion system. This reduces vibration transmitted from the equipment frame at the source, providing initial vibration reduction for the stable operation of the upper guide rail 51 and each module. The guide rail 51, as the core guiding structure for module movement, has a channel 52 on its inner wall providing precise space for the movement of the sliding block 56 and the abutment plate 53. The fixing block 55 on the upper section of the channel 52 limits and fixes the upper section of each module, ensuring the vertical positioning stability of the module and preventing upper section offset during movement.

[0037] refer to Figure 2 and Figure 3The sliding block 56 is fixedly connected to the lower end of the dispensing module 1, and its lower surface is in close contact with the upper surface of the abutment plate 53. The sides of the abutment plate 53 and the sliding block 56 together form a contact engagement with the movable part 58 on the inner wall of the channel 52. This double contact structure not only ensures the guiding accuracy of the module movement, but also reduces frictional loss during the movement process through the special design of the movable part 58.

[0038] refer to Figure 6 and Figure 7 The movable part 58 consists of a fixed plate 581, a pulley 582 and a telescopic spring 583. The fixed plate 581 is fixed to the inner wall of the channel 52. The pulley 582 is rotatably connected to one end of the fixed plate 581 facing the channel 52, which can convert the sliding friction of the sliding block 56 and the abutment plate 53 into rolling friction. The telescopic spring 583, which is elastically connected to the other side of the pulley 582, can adaptively extend and retract according to the change of contact pressure, always keeping the pulley 582 in close contact with the sliding block 56 and the abutment plate 53, while buffering the pressure fluctuation caused by local vibration.

[0039] refer to Figure 4 and Figure 5 The symmetrically arranged side grooves 521 on both sides of the channel 52 are key structures for achieving the linkage between buffering and limiting. The buffer element 59 and the limiting element 57 inside them work together to cope with the impact and vibration during the movement of the module. The buffer spring 591 of the buffer element 59 is elastically connected to the channel wall along the length of the side groove 521. The connecting block 592 in the middle serves as the force fulcrum of the buffer spring 591 and is also fixedly connected to the abutment plate 53 through the connecting plate 531. This allows the movement of the abutment plate 53 to synchronously drive the extension and contraction of the buffer spring 591, thereby absorbing the impact energy generated by the movement of the module through the elastic deformation of the spring. The rotating plate 571 of the limiting element 57 is rotatably connected to the end of the connecting block 592 away from the connecting plate 531. The S-shaped locking plate 572 fixed at one end of the limiting element 571 forms a matching and engaging structure with the positioning rod 523 in the side groove 521. The blade 573 fixed at the end of the locking plate 572 near the connecting block 592 is one of the core innovations of this design.

[0040] refer to Figure 7The blade 573 features an arc-shaped side design with a gradually changing thickness, closely fitting the side of the pulley 582 of the movable component 58 to form a rotational linkage. The thickness change of the blade 573 follows a specific logic; it gradually thins from one end to the other. When the abutment plate 53 drives the connecting block 592 to move along the side groove 521, the contact position between the blade 573 and the fixed plate 581 changes with rotation, thereby switching the support mode. Specifically, when the abutment plate 53 is at the uppermost or lowermost extreme position of the groove 52, the part where the blade 573 contacts the fixed plate 581 is exactly at its thickest point; while when the abutment plate 53 is in motion, the contact area between the blade 573 and the fixed plate 581 gradually transitions to its narrowest point. This inclined thickness design allows the support mode of the fixed plate 581 to dynamically switch with the module position, changing from flexible support during movement to rigid support at the extreme position.

[0041] refer to Figure 5 An eccentric wheel 524 is fixed in the movable groove 522 at the end of the side groove 521 away from the channel 52. Its side is in close contact with the outer side of the rotating plate 571. When the abutment plate 53 drives the connecting block 592 to move along the side groove 521, the rotating plate 571 will rotate under the friction of the eccentric wheel 524, thereby driving the clamping plate 572 and the blade 573 to rotate synchronously. The positioning rod 523 is symmetrically distributed at the end of the side groove 521. Its specifications are adapted to the groove of the clamping plate 572, and it can form a stable engagement with the clamping plate 572 when the module moves to the limit position. The connecting plate provided on the inner wall of the connecting block 592 is linked with the rotating plate 571. The rotation of the rotating plate 571 will drive the blade 573 to rotate synchronously through the connecting plate, ensuring that the blade 573 always keeps in contact with the pulley 582, while precisely controlling the thickness change and the contact position with the fixed plate 581, so as to achieve a smooth switching of the support mode.

[0042] The inclined thickness design of blade 573 enables dynamic switching between "flexible support during movement and rigid support at extreme positions," perfectly resolving the core contradiction between "positioning accuracy" and "vibration damping" in the integrated head. When the module is in motion, the thinner portion of blade 573 is in contact with the fixed plate 581, providing lower support stiffness and forming flexible support. This effectively absorbs vibration energy generated during module acceleration, deceleration, and start-stop, preventing vibration transmission and accumulation. When the module reaches its upper or lower extreme working or reset positions, the thickest portion of blade 573 is in contact with the fixed plate 581, maximizing support stiffness and forming rigid support. This provides a stable positioning foundation for the module, preventing minor swaying during operation. This dynamic switching requires no additional control mechanism; it is achieved solely through the mechanical rotation of the rotating plate 571, ensuring both operational accuracy and enhanced vibration damping—a core advantage of this design.

[0043] This design constructs a multi-level vibration reduction system consisting of "bottom isolation + elastic buffer + rigid damping + flexible support," achieving a vibration suppression effect far exceeding that of traditional single-buffer structures. The bottom buffer plate 54 isolates external vibrations transmitted from the frame; the buffer spring 591 of the buffer component 59 absorbs the macroscopic impact energy of the module's movement through elastic deformation; the flexible support of the blade 573 specifically weakens high-frequency micro-vibrations, forming a synergistic vibration reduction with the buffer spring 591 to prevent the accumulation of vibration energy within the system; and the frictional rotation process between the rotating plate 571 and the eccentric wheel 524 creates a damping effect, further dissipating vibration energy. This multi-level vibration reduction structure cuts off the vibration transmission path at its source, effectively suppressing the vibration coupling and resonance effects generated by the high-frequency start / stop of the dispensing module 1, the acceleration / deceleration of the patch module 2, and the downward impact of the welding module 3, providing a stable environment for the coordinated operation of all modules.

[0044] This design reduces wear on moving parts and extends equipment lifespan through multi-dimensional optimization of friction types and improvement of contact conditions. The pulley 582 of the moving part 58 transforms the sliding friction between the sliding block 56, the abutment plate 53, and the channel 52 into rolling friction, significantly reducing the coefficient of friction. The elastic support of the telescopic spring 583 ensures that the pulley 582 maintains uniform contact with the sliding block 56 and the abutment plate 53, preventing abnormal wear caused by localized pressure concentration. The arc-shaped design and gradually varying thickness of the blade 573 make its contact with the pulley 582 smoother, reducing frictional losses from relative rotation. Rigid support at extreme positions prevents mechanical damage caused by hard collisions between modules. This multi-faceted wear reduction design breaks the vicious cycle of "vibration exacerbating wear, and wear amplifying vibration," significantly extending the service life of core components such as the guide rail 51, sliding block 56, pulley 582, and blade 573, and reducing equipment maintenance costs.

[0045] This design employs a multi-positioning and linkage structure to ensure high precision and stability of module movement. The dual positioning of the fixed block 55 and the sliding block 56 limits the module's vertical position, preventing vertical offset. The precise fit between the guide rail 51 and the channel 52 limits the module's trajectory, ensuring straightness in horizontal movement. The engaging structure of the locking plate 572 and the positioning rod 523 of the limiting component 57 achieves precise positioning at extreme positions. The rigid support at the extreme positions of the blade 573 further enhances positioning stability, forming a "dual rigid positioning" with the engaging structure to ensure the coordinated accuracy of dispensing, patching, and welding positions. Simultaneously, the gradual change in thickness of the blade 573 leads to a progressive switching of support stiffness, avoiding impacts caused by abrupt changes in support methods. This makes module movement smoother and more stable, reducing swaying and wobble during start-up, acceleration, and deceleration, further improving motion stability.

[0046] All buffer, limiting, and friction-reducing components are integrated into the grooves 52 and side grooves 521 of the motion platform 5, resulting in a compact and rationally laid-out structure that requires no additional space and perfectly meets the integration requirements of the integrated machine head. All components are mechanically connected, eliminating complex electrical control components, reducing potential failure points, and providing intuitive linkage relationships. This facilitates disassembly, inspection, and replacement by operators, reducing maintenance costs and downtime during production. Furthermore, this structural design offers excellent adaptability to different specifications of miniature prefabricated conductive units. By adjusting the specifications of the sliding block 56, the abutment 53, the position of the positioning rod 523, or the thickness gradient angle of the blade 573, the manufacturing requirements of integrated circuits of different sizes and pitches can be met, demonstrating wide adaptability and reducing the cost of changing lines for multi-variety production.

[0047] The operation of this pick-and-place machine head revolves around the coordinated movement of three main modules: dispensing, placement, and soldering. Each component operates in an orderly manner according to a preset mechanical linkage logic. Before the equipment starts, the dispensing module 1, placement module 2, and soldering module 3 are all in their initial reset positions at the top of the motion platform 5. At this time, the abutment plate 53 is located at the top of the channel 52, tightly fitted with the sliding block 56. The upper section of the sliding block 56 forms a limiting and fixing position with the fixed block 55, ensuring the accuracy of the module's initial position. The buffer spring 591 of the buffer component 59 is in a naturally extended / retracted state, and the connecting block 592 drives the connecting plate 531 to remain stable with the abutment plate 53.

[0048] The rotating plate 571 and the locking plate 572 of the limiting component 57 are both parallel to the side groove 521. The groove of the S-shaped locking plate 572 and the positioning rod 523 on the upper part of the side groove 521 form a stable engagement. Since the specifications of the positioning rod 523 are compatible with the groove of the locking plate 572, the engagement structure not only avoids the module being subjected to external impact in the initial position, but also reduces the vibration interference between the fixed block 55 and the module through the elastic support of the buffer spring 591. At this time, under the drive of the connecting plate, the thickest part of the blade 573 is exactly in contact with the fixed plate 581 of the moving part 58, forming a rigid support, which further enhances the positioning stability of the initial position. The telescopic spring 583 is in a moderately compressed state, ensuring stable contact between the pulley 582 and the sliding block 56 and the abutment plate 53. At the same time, the arc-shaped side of the blade 573 is in close contact with the pulley 582, preparing for subsequent rotation.

[0049] Upon receiving the work instruction, the dispensing module 1, the patch module 2, and the welding module 3 move downwards along the guide rail 51 of the motion platform 5 sequentially or synchronously according to a preset program. This causes the sliding block 56 to slide downwards along the channel 52, and the sliding block 56 simultaneously pushes the abutment plate 53 downwards. The abutment plate 53, through the connecting plate 531, causes the connecting block 592 to move downwards along the side groove 521. The movement of the connecting block 592 compresses the buffer spring 591, gradually accumulating elastic potential energy and beginning to absorb the impact energy generated by the downward movement of the modules, thus achieving the first layer of buffering.

[0050] As the connecting block 592 moves downward, the rotating plate 571, which is rotatably connected to it, begins to rotate under the friction of the eccentric wheel 524 in the movable groove 522. In the initial stage, the rotating plate 571 gradually changes from being parallel to the side groove 521 to being inclined, and then transitions to being perpendicular to the side groove 521. The locking plate 572 rotates synchronously and gradually disengages from the upper positioning rod 523. During this process, the rotating plate 571 drives the blade 573 to rotate synchronously through the connecting plate. The position where the blade 573 contacts the fixed plate 581 gradually transitions from the thickest part to the thinner part, and the support method gradually changes from rigid to flexible. The curved side of blade 573 always keeps in contact with pulley 582, pushing pulley 582 to rotate slightly along fixed plate 581. At the same time, extension spring 583 adapts to the thrust of blade 573 and the downward pressure of module, which not only ensures the stability of the contact between blade 573 and pulley 582, but also reduces the friction loss of blade 573 during rotation through the rolling of pulley 582.

[0051] As the sliding block 56 and the abutment plate 53 move downwards, their sides remain in contact with the pulley 582, causing the pulley 582 to roll and convert sliding friction into rolling friction, significantly reducing movement resistance and wear. At this time, the flexible support of the blade 573 and the elastic buffer of the buffer spring 591 work together to reduce vibration. The thinner part of the blade 573 absorbs high-frequency micro-vibrations through its own deformation, while the buffer spring 591 absorbs macroscopic impact energy, effectively suppressing vibration transmission during the module's downward movement and preventing positional deviations caused by vibration during dispensing and mounting.

[0052] When the module descends to the lowest point of the channel 52, the abutment plate 53 drives the connecting block 592 to the bottom limit position of the side channel 521. At this time, the rotating plate 571 completes a 180-degree rotation under the continuous friction with the eccentric wheel 524, changing from an initial state parallel to the side channel 521, through a vertical state, and then back to being parallel to the side channel 521. The groove of the S-shaped clamping plate 572 precisely engages with the positioning rod 523 at the lower end of the side channel 521, achieving stable positioning of the module at the lower limit position.

[0053] During the engagement process, the buffer spring 591 is in its maximum compression state, forming a second layer of buffer through elastic rebound force to prevent hard collision between the module and the bottom of the channel 52. At the same time, the S-shaped structure of the clamping plate 572 can disperse the contact pressure, further improving the buffering effect. Meanwhile, the blade 573 completes synchronous rotation under the drive of the connecting plate, and its thickest part is once again in contact with the fixing plate 581. The support method switches from flexible to rigid, forming a "double rigid positioning" with the engagement structure of the clamping plate 572. This provides a stable support foundation for the operation process, effectively resists the vibration generated by the downward impact of the welding module 3, and prevents the module from slightly shifting in the working position.

[0054] After the module is stably positioned at the bottom, it performs operations according to a preset program: the dispensing module 1 precisely applies conductive adhesive to the designated position on the insulating substrate; then the patch module 2 picks up the prefabricated conductive component and precisely positions it at the substrate electrode; finally, the welding module 3 applies a local heat source to achieve metallurgical bonding between the prefabricated conductor and the substrate electrode. During this operation, the rigid support of the blade 573 and the multi-level buffer structure work together to effectively suppress the vibration generated by each module's operation, ensuring the spatial coordination accuracy of each process step; the rolling friction design of the moving part 58 reduces vibration feedback when the module is stationary, further improving the operation accuracy.

[0055] After a single dispensing, patching, and soldering operation is completed, the module moves upward and resets according to a preset program. The sliding block 56 and the abutment plate 53 slide upward, and the connecting block 592 moves upward along the side groove 521 under the elastic rebound force of the buffer spring 591. The buffer spring 591 gradually returns to its natural extension and contraction state, releasing the accumulated elastic potential energy and providing buffering for the upward movement.

[0056] The rotating plate 571 rotates in the opposite direction due to the friction between the upward movement of the connecting block 592 and the eccentric wheel 524. It gradually changes from a lower position parallel to the side groove 521 to a vertical position, and then returns to its upper position parallel to the side groove 521. During this process, the blade 573 rotates in the opposite direction with the rotating plate 571, and the position where it contacts the fixed plate 581 transitions from its thickest point to a thinner point. The support method changes from rigid to flexible, working in conjunction with the buffer spring 591 to absorb vibration energy during the upward movement, preventing the transmission of vibration caused by inertial impact when the module moves upward.

[0057] The locking plate 572 rotates in the opposite direction with the rotating plate 571, gradually disengaging from the lower positioning rod 523, and finally re-engaging with the upper positioning rod 523. The arc-shaped side of the blade 573 always remains in contact with the pulley 582, causing the pulley 582 to roll synchronously in the opposite direction. The telescopic spring 583 returns to its initial compressed state. The sliding block 56 and the abutment plate 53 maintain rolling contact through the pulley 582 during the upward movement, reducing wear and resistance.

[0058] When the module moves to the initial reset position, the thickest part of blade 573 re-engages with the fixing plate 581, and the support method switches back to rigidity. This, along with the limiting fixation of the fixing block 55 and the engaging structure of the locking plate 572, forms a triple positioning guarantee, ensuring the accuracy of the module's initial position. All components return to their initial state, ready for the next operating cycle. Throughout the entire operation, all components move in an orderly manner according to the mechanical linkage logic. The support method of blade 573 dynamically switches with the module position, achieving coordinated protection of buffering and vibration reduction, wear reduction, and precise positioning without the intervention of intelligent components.

[0059] The core problem with existing integrated machine heads lies in the vibrations generated by the high-frequency start / stop of the dispensing module 1, the acceleration / deceleration of the patch module 2, and the downward impact of the welding module 3. These vibrations are transmitted and amplified through the rigid substrate, creating a resonance effect that leads to relative displacement between the modules and compromises their coordinated precision. This design addresses this by dynamically switching between a multi-level mechanical vibration damping structure and support method to cut off the vibration transmission path at its source.

[0060] The first layer is the bottom isolation of the buffer plate 54, which effectively weakens the transmission of frame vibration to the guide rail 51 and reduces external vibration interference. The second layer is the elastic buffer of the buffer component 59. The buffer spring 591 absorbs the macroscopic impact vibration generated by the module movement through compression deformation, avoiding the accumulation of vibration energy in the channel 52. The third layer is the flexible support and vibration reduction of the blade 573. During the module movement, the thinner part of the blade 573 is in contact with the fixed plate 581. It absorbs high-frequency micro-vibrations through its own deformation, forming a synergy with the buffer spring 591 to specifically suppress vibrations of different frequencies. The fourth layer is the friction damping of the rotating plate 571 and the eccentric wheel 524. During the rotation, some vibration energy is consumed, further weakening the vibration transmission.

[0061] Furthermore, each module is connected to the back plate 53 via an independent sliding block 56. The elastic support of the buffer spring 591 creates flexible isolation between the modules, avoiding the superposition of vibrations caused by rigid connections. The rigid structure design of the guide rail 51 and the channel 52 increases the natural frequency of the motion system, keeping it away from the vibration frequency range during module operation, thus structurally preventing resonance effects. The rigid support of the blade 573 at its extreme position effectively resists the vibration impact generated during operation, preventing vibration from causing module movement and completely breaking the vicious cycle of "vibration transmission - superposition resonance - decreased accuracy".

[0062] The existing integrated head suffers from severe wear due to high-frequency acceleration and deceleration motion, resulting in sliding friction between the guide rail 51 and the slider. This leads to increased positioning errors and creates a vicious cycle of "wear - decreased accuracy - increased vibration - amplified wear". This design fundamentally reduces wear on the moving parts by optimizing friction types, improving contact conditions, and providing impact protection.

[0063] First, the contact between the pulley 582 of the moving part 58 and the sliding block 56 and the abutment plate 53 transforms the friction type during module movement from sliding friction to rolling friction. The coefficient of rolling friction is much lower than that of sliding friction, significantly reducing wear and tear on the moving parts. Second, the elastic support of the telescopic spring 583 ensures that the pulley 582 always maintains uniform contact with the sliding block 56 and the abutment plate 53, avoiding abnormal wear caused by localized pressure concentration. Third, the arc-shaped design and gradually varying thickness of the blade 573 make its contact with the pulley 582 smoother, reducing frictional losses caused by relative rotation. At the same time, the flexible support of the blade 573 can absorb vibration, avoiding contact pressure fluctuations caused by vibration, further reducing wear. Finally, the buffer structure of the buffer spring 591 and the clamping plate 572, combined with the rigid support of the blade 573 at its limit position, reduces hard collisions of the module at its limit position, avoids mechanical damage caused by impact, slows down the wear rate of core components such as the guide rail 51 and the sliding block 56, and reduces the accumulation of backlash and positioning errors.

[0064] Existing integrated head units suffer from relative displacement between modules due to vibration and wear, compromising the spatial coordination accuracy of the three processes: dispensing, component placement, and welding. This results in problems such as dispensing misalignment, component misalignment, and incomplete welding. This design optimizes the collaborative positioning accuracy through multiple positioning and support methods.

[0065] The dual positioning of the fixed block 55 and the sliding block 56 limits the vertical position of the module, preventing vertical offset; the precise cooperation between the guide rail 51 and the channel 52 limits the movement trajectory of the module, ensuring the straightness of horizontal movement; the locking structure of the clamping plate 572 of the limiting member 57 and the positioning rod 523 realizes the precise positioning of the module at the extreme position; and the rigid support of the blade 573 at the extreme position further enhances the positioning stability, forming a "double rigid positioning" with the locking structure, effectively resisting vibration and impact during operation and preventing the module from slight movement in the working position.

[0066] Meanwhile, the vibration damping structure effectively suppresses the relative displacement caused by vibration, and the linkage buffering of the buffer spring 591 and the blade 573 reduces the vibration offset during the module movement; the rolling friction design of the moving part 58 reduces the accumulation of positioning errors caused by wear, ensures the positional coordination of the three process links of dispensing, patching and welding, avoids the misalignment of "dispensing position - patching position - welding area", and ensures the accuracy of conductive pattern construction and the reliability of welding connection.

[0067] Through the above structural design and problem-solving mechanism, the chip mounter head has demonstrated many significant benefits in actual production. It not only addresses the core issues of existing integrated machine heads, but also comprehensively improves the quality, efficiency, and economy of integrated circuit manufacturing, especially in high-precision, large-scale production scenarios.

[0068] The multi-level vibration damping structure and the rigid support and positioning of the blade 573 work together to effectively suppress vibration coupling and resonance effects. The relative displacement between modules is controlled within an extremely low range, and the positional coordination accuracy of dispensing, patching, and welding is greatly improved. The dispensing position deviation of dispensing module 1 is significantly reduced, the prefabricated conductive components picked up by patching module 2 can accurately align with the substrate electrodes, and the metallurgical bonding position of welding module 3 is accurate, avoiding problems such as dispensing offset, patch misalignment, and poor welding caused by vibration.

[0069] The rolling friction design and wear suppression structure reduce wear on moving parts, effectively controlling the accumulation of positioning errors and ensuring precise docking between the miniature prefabricated conductive units and the electrodes on the insulating substrate. The accuracy of the conductive pattern construction fully meets the manufacturing requirements of high-density, miniaturized integrated circuits. In actual production, the soldering yield and the consistency of the conductive patterns are significantly improved, and the defect rate is greatly reduced. It is particularly suitable for integrated circuit manufacturing scenarios with small pin pitch and high integration, bringing direct economic benefits to enterprises.

[0070] The rolling friction design of the kinematic pairs, the flexible support and vibration reduction of blade 573, and the rigid protection at extreme positions significantly reduce the wear rate and impact damage of core components such as guide rail 51, sliding block 56, pulley 582, and blade 573, extending the replacement cycle of these components. The design of switching between buffer structure and support method avoids hard collisions during module movement, reducing the equipment failure rate and significantly extending the equipment maintenance cycle.

[0071] During maintenance, because the equipment adopts a purely mechanical structure without complex intelligent components and electronic control systems, only routine inspections, cleaning, and replacements of mechanical parts are required. The maintenance process is simple, time-saving, and significantly reduces maintenance costs. The extended lifespan of core components reduces the frequency and cost of spare parts replacement, while also reducing downtime caused by equipment failures, improving production efficiency, indirectly reducing the manufacturing cost per unit product, and enhancing the company's market competitiveness.

[0072] This design achieves coordinated protection of buffering, vibration reduction, wear reduction, and support mode switching through a purely mechanical structure, without relying on real-time control of intelligent components. This avoids operational instability caused by electrical control system failures and significantly enhances the equipment's anti-interference capabilities. The linkage structure of each component is rationally designed with clear action logic. The support mode switching of blade 573 is precisely synchronized with the module movement, enabling it to adapt to high-frequency acceleration and deceleration movements and continuous operation requirements.

[0073] During prolonged, high-intensity production processes, the equipment maintains stable operation and precision levels, preventing significant drops in accuracy due to accumulated vibration or component wear, thus fully meeting the efficiency requirements of large-scale integrated circuit manufacturing. Simultaneously, the stable operation of the equipment reduces abnormal downtime and product rework during production, further improving production efficiency and product quality stability.

[0074] All functional optimizations of this placement head are achieved through mechanical structure, resulting in a compact and rationally laid-out design. It lacks complex electronic control modules and sensing systems, minimizing potential failure points and ensuring high reliability. It can adapt to production environments with varying temperatures, humidity levels, and dust concentrations, exhibiting strong environmental adaptability. Furthermore, this structural design offers excellent compatibility with different specifications of micro-prefabricated conductive units, such as chip copper circuits and micro-metal pillars. By adjusting the specifications of the sliding block 56 and the abutment 53, the position of the positioning rod 523, or the thickness gradient angle of the blade 573, the manufacturing requirements for integrated circuits of different sizes and pitches can be met without significant modifications to the overall structure.

[0075] This broad adaptability reduces the changeover costs and time associated with multi-variety production, enabling the equipment to quickly switch production tasks and adapt to small-batch, multi-variety production models, thereby improving the overall utilization rate of the equipment and the production flexibility of enterprises. Furthermore, the equipment is easy to install and debug, requiring no specialized electrical control technicians; deployment can be completed simply by adjusting the fit of mechanical components, reducing deployment costs and time.

[0076] In existing integrated head systems, even when modules are positioned, the downward impact of welding module 3 and the high-frequency vibration of dispensing module 1 can still cause slight movement of the modules during operation, affecting operational accuracy. In this design, the rigid support of blade 573 at its extreme positions and the engaging structure of clamping plate 572 form a "double rigid positioning," effectively resisting vibration and impact during operation. This provides a stable support foundation for the modules, preventing slight movement in the working position and ensuring that the positional accuracy of dispensing, patching, and welding remains within the set range, further improving product quality stability.

[0077] During start-up, shutdown, acceleration, and deceleration, the module is prone to sudden impacts due to inertia, leading to increased vibration and affecting motion stability. In this design, the gradually varying thickness of blade 573 ensures a "gradual switching" of support stiffness, rather than an abrupt change. When transitioning from a rigid working position to a flexible motion, the thickness of blade 573 gradually decreases, and the stiffness slowly reduces; conversely, when transitioning from the motion to the other working position, the thickness gradually increases, and the stiffness slowly increases. This gradual switching avoids the impacts caused by abrupt changes in support methods, resulting in smoother module movement, reduced swaying and wobble during start-up, shutdown, acceleration, and deceleration, and further ensuring the precision of process coordination.

[0078] The existing integrated head's locking and positioning structure is prone to loosening after long-term use due to vibration and impact, leading to increased locking gaps and affecting positioning accuracy. In this design, the rigid support of the blade 573 at its extreme position provides a stable foundation for the locking of the clamping plate 572 and the positioning rod 523, avoiding locking gaps caused by flexible supports. At the same time, the S-shaped clamping plate 572's structural design can distribute locking pressure, reduce local wear, delay the formation of locking gaps, effectively avoid the hidden danger of loosening of the locking structure, extend the service life of the locking components, and ensure the long-term stability of positioning accuracy.

[0079] In existing integrated machine heads, the dispensing, patching, and welding components are prone to mutual interference due to rigid connections. Vibrations generated by one module's operation can be transmitted to other modules, affecting the independent operating accuracy of each module. In this design, each module is connected to the back plate 53 via an independent sliding block 56. The elastic support of the buffer spring 591 creates flexible isolation between the modules. Vibrations generated by the movement of one module are absorbed by the buffer spring 591 and the flexible support of the blade 573, and are not significantly transmitted to other modules. At the same time, the independent design of the moving part 58 ensures that the movement friction of each module does not affect each other, effectively solving the interference problem between multiple modules and ensuring the accuracy and stability of each module's independent operation.

[0080] Complex intelligent components and electrical control systems increase the difficulty of equipment installation and debugging, and prolong equipment deployment time. This design adopts a purely mechanical structure, and the connection relationship between each component is intuitive. The installation process does not require complex electrical control debugging. Only the position of the positioning rod 523, the preload of the buffer spring 591, the contact state between the blade 573 and the fixed plate 581, and the rolling flexibility of the pulley 582 need to be adjusted to complete the debugging. The components are highly versatile and easy to replace, effectively solving the problems of complex and time-consuming installation and debugging of existing equipment, reducing the deployment cost and time cost of the equipment, and enabling the equipment to be put into production quickly.

[0081] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated circuit chip mounter head based on dispensing, mounting, and soldering integration, characterized in that, include: Dispensing module (1); Patch module (2); Welding module (3); A fixed frame (4) is provided on one side of which a motion platform (5) is provided to limit the dispensing module (1), the patch module (2) and the welding module (3). The dispensing module (1), the patch module (2) and the welding module (3) move along the motion platform (5) to build a conductive pattern. The motion platform (5) includes a buffer plate (54) disposed on the lower side of the fixed frame (4). The top of the buffer plate (54) is provided with a guide rail (51) for limiting the dispensing module (1), the patch module (2) and the welding module (3). The inner wall of the guide rail (51) is provided with a channel (52), and a stop plate (53) is slidably connected to the inner wall of the channel (52). The upper end of the channel (52) is fixedly connected to a fixing block (55) for fixing the upper end of the dispensing module (1), and the lower end of the dispensing module (1) is fixedly connected to a sliding block (56) for fixing the lower end of the dispensing module (1). The sliding block (56) is slidably connected to the inner wall of the channel (52). The inner wall of the channel (52) is provided with a movable part (58) that is slidably connected to the side of the sliding block (56).

2. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 1, characterized in that: The channel (52) has symmetrically provided side grooves (521) on its side. The inner wall of the side groove (521) is provided with a buffer member (59). The buffer member (59) includes a buffer spring (591) that is elastically connected to the inner wall of the side groove (521). A connecting block (592) is provided in the middle of the buffer spring (591).

3. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 2, characterized in that: The connecting block (592) is fixedly connected to a connecting plate (531) at one end near the channel (52), and the other end of the connecting plate (531) is fixedly connected to the abutment plate (53). The two ends of the abutment plate (53) are attached to the side of the movable part (58).

4. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 2, characterized in that: The other end of the connecting block (592) is provided with a limiting member (57), the limiting member (57) includes a rotating plate (571) rotatably connected to the other end of the connecting block (592), and a card plate (572) is fixedly connected to one end of the rotating plate (571), the card plate (572) adopts an S-shaped design.

5. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 4, characterized in that: The card plate (572) is fixedly connected to a blade (573) at one end near the connecting block (592). The blade (573) has an arc-shaped side and the side of the blade (573) fits against the movable part (58).

6. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 5, characterized in that: The movable part (58) includes a fixed plate (581) disposed on the inner wall of the channel (52). A pulley (582) is rotatably connected to one end of the fixed plate (581) near the channel (52), and a telescopic spring (583) is elastically connected to the other side of the pulley (582).

7. The integrated circuit placement head based on dispensing, patching, and welding as described in claim 2, characterized in that: The side groove (521) is symmetrically fixed with positioning rods (523) at one end away from the channel (52). The size of the positioning rods (523) is smaller than the size of the groove of the card plate (572). The side groove (521) is provided with a movable groove (522) at one end away from the channel (52). An eccentric wheel (524) that fits against the side of the rotating plate (571) is fixedly connected to the inner wall of the movable groove (522).

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