Glue solution supply device and method with vacuum defoaming function

Abstract

The invention provides a glue solution supply device with a vacuum defoaming function and a method. The glue solution supply device comprises a pressure tank with a sealable cavity, an open container removably accommodated in the cavity, a glue supply pipeline and a gas control unit communicated with the cavity, and the gas control unit is configured to communicate the cavity with a vacuum source for decompression defoaming in a first operation mode. And in the second operation mode, the cavity is communicated with a pressurized gas source so as to extrude out the glue solution. According to the technical scheme, the defoaming process and the supply process of the glue solution are integrated in the same closed container, in-situ defoaming is achieved, the problems of secondary pollution and bubble reintroduction generated in the transferring process of the glue solution can be effectively solved, and the quality and stability of the subsequent coating process are guaranteed. And the defoaming operation is fused in the process of the glue supply operation and does not occupy extra process takt time, so that the operation efficiency of the subsequent coating operation is not influenced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of fluid supply equipment, in particular to a glue solution supply device with vacuum defoaming function and a method thereof. BACKGROUND

[0002] With the development of high-precision manufacturing fields such as domestic semiconductors, advanced packaging and flat panel displays, the production capacity of major manufacturers is also increasing. In order to adapt to the expanding production scale, the coating process such as glue uniformity and dispensing becomes the core link. The purity and uniformity of the glue solution used in these processes have a decisive influence on the performance and yield of the final product.

[0003] The existence of micro-bubbles in the glue solution is a long-standing technical problem. The source of these bubbles is that the dissolved gas in the glue solution during production and storage may precipitate in the subsequent process, and the other, which is more important, is that when the glue solution is transferred from the original packaging to the glue supply system, air is easily entrained into the glue solution to form bubbles due to pouring and fluid impact.

[0004] The bubbles in the glue solution can cause serious harm to the subsequent coating process. For example, in the spin coating of photoresist, bubbles can cause defects such as pinholes and comet-like tails in the coating. In the dispensing process, bubbles can cause inconsistent glue point volume and voids, affecting the bonding strength of the chip. These microscopic defects not only lead to a decrease in yield in the subsequent process flow, but also can cause the electrical performance of the entire device to fail, and can also cause more serious problems.

[0005] In the prior art, one method is to let the glue solution stand, but the effect is poor for high-viscosity glue solution and the time is long. Another method is offline defoaming, that is, the glue solution is treated in a vacuum cavity and then transferred to the final glue supply container. This offline treatment method is cumbersome, and in the second transfer process, there is a risk of secondary contamination of the glue solution and the re-introduction of bubbles, which is unacceptable for semiconductor-grade chemicals with extremely high cleanliness requirements. SUMMARY

[0006] In order to solve the problems of secondary contamination and bubble re-introduction of the glue solution during transfer and supply, the present application provides a glue solution supply device with vacuum defoaming function and a method thereof.

[0007] The technical scheme of the present application provides a glue solution supply device with a vacuum defoaming function, comprising a pressure tank with a sealable cavity; an open container configured to be removably accommodated in the cavity of the pressure tank for containing glue solution; a glue supply pipeline having an inlet end and an outlet end, the inlet end extending into the open container to extract the glue solution, and the outlet end being arranged outside the pressure tank; and a gas control unit in communication with the cavity of the pressure tank, and the gas control unit is configured to: in a first operation mode, communicate the cavity with a vacuum source to perform pressure reduction and defoaming on the glue solution in the open container; and in a second operation mode, communicate the cavity with a pressurized gas source to press the defoamed glue solution out of the open container through the glue supply pipeline by applying gas pressure to the liquid surface of the glue solution.

[0008] Preferably, the gas control unit is further configured to communicate the cavity with the atmosphere for pressure relief in a third operation mode.

[0009] Preferably, the gas control unit includes interlocking logic for preventing the cavity from being simultaneously communicated to the vacuum source and the pressurized gas source.

[0010] Preferably, the gas control unit communicates with the cavity through a single gas interface on the pressure tank.

[0011] Preferably, the gas control unit includes at least one switching valve for switching between the first operation mode, the second operation mode and the third operation mode.

[0012] Preferably, the gas control unit includes at least two three-way switching valves for switching the communication of the cavity with the vacuum source, the pressurized gas source and the atmosphere.

[0013] Preferably, the pressure tank is provided with a structure for limiting the open container to prevent the open container from sliding or tilting.

[0014] Preferably, the limiting structure is a groove or a protrusion arranged at the bottom of the pressure tank.

[0015] Preferably, the inlet end of the glue supply pipeline is arranged adjacent to the bottom of the open container.

[0016] The technical scheme of the present application provides a glue solution defoaming supply method, comprising the following steps: placing an open container containing glue solution in a cavity of a pressure tank, and sealing the pressure tank; communicating the cavity of the pressure tank with a vacuum source, vacuumizing the cavity to make bubbles in the glue solution escape, thereby defoaming the glue solution; after the defoaming treatment is completed, disconnecting the communication between the cavity and the vacuum source, and communicating the cavity with a pressurized gas source, and introducing pressurized gas into the cavity; and using the pressure formed by the pressurized gas in the cavity to press the glue solution out of the open container through a glue supply pipeline.

[0017] Preferably, the step of introducing pressurized gas into the cavity comprises gradually increasing the pressure in the cavity to a target working pressure according to a preset pressure curve.

[0018] Preferably, after the defoaming treatment is completed and before the cavity is communicated with the pressurized gas source, the method further comprises a step of releasing the pressure in the cavity to atmospheric pressure.

[0019] Preferably, the method further comprises a step of loading glue solution into the open container, which comprises slowly flowing the glue solution along the inner wall of the open container to reduce the introduction of bubbles.

[0020] Preferably, the step of vacuumizing the cavity has a vacuumizing duration that is preset according to the volume, viscosity or gas solubility of the glue solution.

[0021] Preferably, before the pressure tank needs to be opened, the method further comprises a step of completely releasing the pressure in the cavity to atmospheric pressure.

[0022] The technical scheme of the present application mainly integrates the defoaming and supply processes of glue solution in the same closed container, realizing in-situ defoaming. By vacuumizing the entire cavity of the pressure tank before pressurized glue supply, the glue solution can be thoroughly and efficiently defoamed in-situ, effectively avoiding secondary pollution and re-introduction of bubbles during the transfer process. The above defoaming operation is integrated into the process of the glue supply operation, and the defoaming operation can be directly completed during the glue supply preparation stage, without occupying additional process cycle time, thus not affecting the running efficiency of the subsequent coating operation. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 An internal structure diagram of a glue solution supply device with a vacuum defoaming function provided for an embodiment of the present application.

[0024] Figure 2 An overall structure diagram of a glue solution supply device with a vacuum defoaming function provided for an embodiment of the present application.

[0025] Figure 3 A schematic diagram of a pipeline of an embodiment of the present application.

[0026] In the figure:

[0027] 100: pressure tank; 110: tank cover; 120: cavity; 130: limiting structure; 140: single gas interface; 200: open container; 300: glue supply pipeline; 310: inlet end; 320: outlet end; 400: gas control unit; 410: three-way switch valve; 420: three-way switch valve; 500: vacuum source; 600: pressurized gas source. DETAILED DESCRIPTION

[0028] The present patent type is described in detail below in combination with the drawings and specific embodiments. In the present specification, the sizes of the drawings do not represent actual size ratios, and the drawings are only used to reflect the relative positional relationships and connection relationships between the components. Components with the same name or the same reference number represent similar or identical structures, and are limited to the purpose of illustration.

[0029] Figure 1 A schematic diagram of the internal structure of a glue solution supply device of an embodiment of the present application, Figure 2 A schematic diagram of the overall structure of the device. The device aims to solve the problem in the prior art that air bubbles are easily introduced into the glue solution during transfer and supply, thereby affecting the quality of subsequent gluing processes. By integrating an in-situ vacuum degassing step before pressurized glue supply, the device can significantly improve the quality of the glue solution.

[0030] As shown in Figure 1 and Figure 2 , the glue solution supply device includes a pressure tank 100. The pressure tank 100 is the main structure of the entire device, usually made of metal materials resistant to pressure and corrosion, and has an internal cavity 120 that can be sealed. In order to facilitate operation, the pressure tank 100 is provided with a tank cover 110 that can be quickly opened and closed. The tank cover 110 and the tank body of the pressure tank 100 are provided with a sealing element, and the reliable sealing of the cavity 120 can be achieved by fastening elements such as clamps or bolts, so as to withstand subsequent vacuum and pressurization operations.

[0031] An open container 200 is placed inside the cavity 120 of the pressure tank 100. The open container 200 is configured to be removably accommodated in the cavity 120 for directly containing the target glue solution. Since the open container 200 is independent and removable, the operator can conveniently take it out for glue solution filling and cleaning, improving the operation flexibility. The presence of the open container 200 avoids direct contact of the glue solution with the metal inner wall of the pressure tank 100, thereby preventing potential metal ion contamination. The open container 200 can be a beaker made of a chemically stable material, such as glass, polytetrafluoroethylene, etc., which has excellent chemical corrosion resistance.

[0032] To ensure the stable position of the open container 200 in the cavity 120, the bottom of the pressure tank 100 is optionally provided with a limiting structure 130 for limiting the open container 200. Specifically, the limiting structure 130 can be a groove with a size matching the bottom of the open container 200, or several surrounding protrusions, to prevent the open container 200 from sliding or toppling.

[0033] The device further includes a glue supply pipeline 300 for transporting the processed glue solution out of the open container 200. The glue supply pipeline 300 has an inlet end 310 and an outlet end 320. The pipeline can pass through the tank cover 110 or the tank body sidewall of the pressure tank 100 and be sealed. The inlet end 310 of the pipeline extends into the interior of the open container 200 for pumping the glue solution. Preferably, the inlet end 310 is arranged adjacent to the bottom of the open container 200, and the distance between the end and the bottom is accurately controlled to ensure maximum pumping of the glue solution without sucking in gas. The outlet end 320 of the glue supply pipeline 300 is arranged outside the pressure tank 100 for connecting subsequent glue using equipment.

[0034] Figure 3 A schematic diagram of the pipeline of the embodiment of the present application. One of the core parts of the device is a gas control unit 400. The gas control unit 400 communicates with the cavity 120 of the pressure tank 100 for controlling the gas environment in the cavity 120. Considering the need for reasonable layout and reducing potential leakage points, the gas control unit 400 preferably communicates with the cavity 120 through a single gas interface 140 on the pressure tank 100.

[0035] The gas control unit 400 is configured to work in at least two operating modes.

[0036] In the first mode of operation, i.e. the degassing mode, the gas control unit 400 connects the chamber 120 to an external vacuum source 500. When the vacuum source 500 is activated, the air inside the chamber 120 is extracted and the pressure is reduced. Due to the pressure reduction, the dissolved gases in the glue and the air trapped during the glue filling process will form bubbles and expand, and finally escape from the glue surface. This process achieves the degassing of the glue under reduced pressure.

[0037] In the second mode of operation, i.e. the glue supply mode, the gas control unit 400 connects the chamber 120 to an external pressurized gas source 600. The pressurized gas source 600 usually provides clean compressed gas, such as nitrogen. When the pressurized gas is introduced into the chamber 120, the gas pressure will be evenly applied to the liquid surface of the glue in the open container 200. This gas pressure will push the glue, forcing it to enter the inlet end 310 of the glue supply line 300, and finally be pressed out of the outlet end 320 for use in subsequent processes.

[0038] Based on the above embodiment, the gas control unit 400 can be preferably configured to work in the third mode of operation, i.e. connecting the chamber 120 to the atmosphere. This mode is mainly used for pressure relief. For example, after degassing is completed, in order to protect the vacuum source 500, the chamber 120 can be restored to atmospheric pressure through this mode before switching to the pressurized mode. In addition, before the tank cover 110 needs to be opened, the residual pressure in the chamber 120 must also be completely released through this mode.

[0039] In order to realize the switching of the above three modes, the gas control unit 400 can include at least one switching valve. In the embodiment shown, the gas control unit 400 includes at least two three-way switching valves, i.e. three-way switching valve 410 and three-way switching valve 420. Through logical control of these two or more valves, the switching of the vacuum extraction, pressurization and pressure relief functions can be easily realized. Figure 3

[0040] In the improved scheme, the gas control unit 400 also integrates interlocking logic. The interlocking logic can be realized through electrical control such as programmable logic controller, and its core purpose is to prevent dangerous or improper operation, mainly to solve the problem that the chamber 120 is connected to the vacuum source 500 and the pressurized gas source 600 at the same time. If this happens, the high-pressure gas from the pressurized gas source 600 will directly rush into the vacuum source 500, which may cause damage to the vacuum pump. The interlocking logic ensures that the valve leading to the vacuum source 500 must be closed before the valve leading to the pressurized gas source 600 is opened, thereby also prolonging the service life of the equipment.

[0041] Corresponding to the above glue supply device, the degassing and supply method thereof can be based on Figures 1 to 3 ​Description. That is, by performing vacuum degassing and pressure feeding successively in the same closed container, in-situ treatment of the glue solution is achieved.

[0042] The degassing feeding method first is a preparation step. The operator fills the glue solution into the open container 200. In order to reduce the introduction of air bubbles from the source, the recommended operation mode is to make the glue solution flow slowly along the inner wall of the open container 200. After filling the glue solution, the open container 200 is placed in the cavity 120 of the pressure tank 100, and then the tank cover 110 is covered and the pressure tank 100 is sealed.

[0043] Next, the degassing treatment step is entered. By operating the gas control unit 400, the cavity 120 of the pressure tank 100 is connected with the vacuum source 500, and the cavity 120 is vacuumized. As the pressure in the cavity 120 decreases, the dissolved gas and the tiny bubbles in the glue solution will expand and escape from the liquid surface due to the pressure difference, achieving the degassing treatment of the glue solution. The duration of vacuumization can be preset according to the volume, viscosity or gas solubility of the glue solution to be treated.

[0044] After the degassing treatment is completed, the glue feeding step is entered. First, the cavity 120 is disconnected from the vacuum source 500 by the gas control unit 400. In a preferred operation process, before connecting the pressurized gas, there is also a step of releasing the pressure in the cavity to atmospheric pressure. This step can be used as a protective measure to prevent the subsequent high-pressure gas from flowing back into the vacuum pipeline.

[0045] After the pressure relief is completed, the cavity 120 is connected with the pressurized gas source 600, and the pressurized gas is introduced into the cavity 120. In order to achieve more stable glue feeding, the step of introducing pressurized gas into the cavity 120 can gradually increase the pressure in the cavity to a target working pressure according to a preset pressure curve. This gradual pressurization helps to avoid the impact on the glue flow caused by sudden pressure changes. By using the stable gas pressure formed in the cavity 120, the clean glue solution after degassing is stably pressed out of the open container 200 through the glue feeding pipeline 300.

[0046] In further technical solutions, safety operation procedures are also involved. Specifically, before opening the pressure tank 100, for example, at the end of the entire process or during the replacement of the glue solution, a safety step must be performed, that is, the pressure in the cavity 120 is completely released to atmospheric pressure. Only after confirming that the pressure inside and outside the cavity is balanced, the tank cover 110 can be safely opened to prevent the tank cover from being popped open or chemicals from splashing due to the pressure difference between the inside and outside.

[0047] The application integrates the steps of glue loading, defoaming and glue supplying together by the device and method. The open beaker is used as the glue container, which facilitates the glue loading operation, reduces the initial introduction of bubbles and ensures the purity of the glue. More importantly, the in-situ defoaming of the glue is realized by vacuumizing the whole pressure tank cavity before the glue is supplied under pressure, which fundamentally solves the coating defect problem caused by the bubbles in the glue. Compared with the traditional process of offline defoaming and then transferring, the integrated solution provided by the application avoids the secondary pollution and the risk of bubble re-introduction of the glue during the transferring process.

[0048] The above merely describes the preferred embodiments of the present patent type, and does not limit the scope of the present patent type. Without departing from the design spirit of the present patent type, various modifications and improvements of the technical solutions of the present patent type made by those skilled in the art shall fall within the protection scope determined by the claims of the present patent type.

Claims

1. A glue supply device with vacuum degassing function, characterized in that, Comprising: a pressure tank having a sealable cavity; an open container configured to be removably received in the cavity of the pressure tank for containing glue solution; a glue supply line having an inlet end and an outlet end, the inlet end being extended into the open container for drawing the glue solution, the outlet end being disposed outside the pressure tank; and a gas control unit in communication with the cavity of the pressure tank, the gas control unit being configured to: in a first operation mode, communicate the cavity with a vacuum source for deaerating the glue solution in the open container by decompression; in a second operation mode, communicate the cavity with a pressurized gas source for pressing the deaerated glue solution out of the open container via the glue supply line by applying gas pressure to the liquid surface of the glue solution. The gas control unit is further configured to communicate the cavity with the atmosphere for pressure relief in a third operation mode. The gas control unit comprises interlocking logic for preventing the cavity from being simultaneously communicated with the vacuum source and the pressurized gas source.

2. The glue solution supply device with a vacuum defoaming function according to claim 1, wherein The gas control unit communicates with the cavity through a single gas interface on the pressure tank.

3. The glue solution supply device with a vacuum defoaming function according to claim 2, wherein The gas control unit comprises at least one switching valve for switching between the first, second and third operation modes.

4. The glue solution supply device with a vacuum defoaming function according to claim 1, wherein The gas control unit comprises at least two three-way switching valves for switching the communication of the cavity with the vacuum source, the pressurized gas source and the atmosphere.

5. The glue solution supply apparatus having a vacuum defoaming function according to claim 2, wherein The pressure tank is provided with a structure for limiting the open container to prevent the open container from sliding or toppling.

6. The glue solution supply device with a vacuum defoaming function according to claim 5, wherein The limiting structure is a groove or a protrusion disposed at the bottom of the pressure tank.

7. The glue solution supply apparatus having a vacuum defoaming function according to claim 1, wherein The inlet end of the glue supply line is disposed adjacent to the bottom of the open container.

8. The glue solution supply device with a vacuum defoaming function according to claim 7, wherein The method comprises the following steps:

9. The glue solution supply device with a vacuum defoaming function according to claim 1, wherein placing an open container containing glue solution in the cavity of a pressure tank and sealing the pressure tank; 10. A method of defoaming supply of a glue solution, characterized by, communicating the cavity of the pressure tank with a vacuum source to evacuate the cavity and cause the gas bubbles in the glue solution to escape, thereby deaerating the glue solution; after the deaerating process is completed, disconnecting the communication of the cavity with the vacuum source and communicating the cavity with a pressurized gas source to introduce pressurized gas into the cavity; and pressing the glue solution out of the open container via a glue supply line using the pressure formed in the cavity by the pressurized gas. The step of introducing pressurized gas into the cavity comprises gradually increasing the pressure in the cavity to a target working pressure according to a preset pressure curve. After the deaerating process is completed and before the cavity is communicated with the pressurized gas source, the method further comprises a step of releasing the pressure in the cavity to atmospheric pressure. The method further comprises a step of filling the open container with glue solution, which comprises causing the glue solution to flow slowly along the inner wall of the open container to reduce the introduction of gas bubbles.

11. The method of claim 10, wherein the adhesive solution is supplied in a state of being defoamed. The step of evacuating the cavity has a duration that is predetermined according to the volume, viscosity or gas solubility of the glue solution.

12. The defoaming supply method of the glue solution according to any one of claims 10 or 11, characterized by, ​ 13. The method of claim 10, wherein the adhesive solution is supplied in a state of being defoamed. ​ 14. The method of claim 10, wherein the adhesive solution is supplied in a state of being defoamed. ​ 15. The method of claim 10, wherein the adhesive solution is supplied in a state of being defoamed. Further comprising the step of completely releasing the pressure within the cavity to atmospheric pressure before the pressure vessel is required to be opened. Further comprising the step of completely releasing the pressure within the cavity to atmospheric pressure before the pressure vessel is required to be opened.

Images