Vacuum packaging mechanism for electronic components

Abstract

The invention relates to the field of packaging, and particularly discloses an electronic component vacuum packaging mechanism which comprises a supporting frame, a clamping assembly for clamping a bag opening of a packaging bag is arranged on the supporting frame, a driving assembly connected with the clamping assembly is arranged on the supporting frame, a supporting plate is arranged on the supporting frame, and the supporting plate is connected with the clamping assembly. And a vacuumizing assembly is arranged on the supporting plate. According to the packaging bag heat-sealing device, vacuumizing operation and heat-sealing operation on the packaging bag can be achieved, during heat-sealing returning, the heat-sealing assembly and the packaging bag can be cooled firstly, then the packaging bag is pressed downwards, it is guaranteed that the heat-sealing assembly returns smoothly, the adhesion phenomenon of the heat-sealing assembly and the packaging bag is avoided, and the packaging efficiency is improved. The sealing opening of the packaging bag is prevented from being torn or drawn, holes or virtual sealing is avoided at the sealing opening, moisture and oxygen invasion caused by sealing failure is avoided, the packaging quality is improved, electronic components are protected in a moisture-proof mode, the packaging reliability is greatly improved, and follow-up operation of the electronic components is facilitated.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and more particularly to a vacuum packaging mechanism for electronic components. Background Technology

[0002] Electronic components are the basic units that make up electronic circuits and are widely used in various electronic devices and systems. Electronic components include resistors, capacitors, etc. During the production process of electronic components, packaging is required. Electronic components are usually protected by moisture-proof, anti-oxidation, and anti-static packaging. Vacuum or dry air nitrogen environment is used, along with anti-static and moisture-proof materials, to extend the storage life of the components. Vacuum packaging machines are generally used for vacuuming and heat sealing.

[0003] In the vacuum packaging process, electronic components are placed into a moisture-proof bag and then vacuumed. The bag is then sealed by heating and pressurizing with a heat-sealing knife. However, if the heat-sealing blade is not sufficiently cooled before retracting after heat sealing, its high-temperature surface will adhere to the not-yet-fully-cured heat-sealed layer. When the heat-sealing blade is forcibly separated, the packaging bag seal is torn or pulled apart, causing seal failure, holes or incomplete seals at the seal, allowing moisture and oxygen to enter, seriously affecting packaging quality, causing electronic components to lose moisture protection, greatly reducing packaging reliability, and hindering subsequent operations on electronic components. For example, in the existing patent CN218704147U, an electronic component packaging device is disclosed. Through the setting of the material picking and placing structure, the electronic components to be packaged can be picked up by negative pressure adsorption and placed in the groove of the tape. The CCD detection camera can play a positioning detection function to prevent the occurrence of missing items. The rotating motor can quickly change the position of the vacuum suction cup, so that the device can change the packaging mechanism without gaps and achieve the purpose of changing the material tray without stopping the machine. This solution can achieve the effect of vacuum packaging, but it still cannot solve the problem of insufficient cooling before the heat-sealing blade retracts.

[0004] Therefore, how to provide a vacuum packaging mechanism for electronic components is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] One objective of this invention is to provide a vacuum packaging mechanism for electronic components. This mechanism includes a support frame, a clamping assembly for clamping the opening of a packaging bag, a driving assembly connected to the clamping assembly, a support plate, a vacuuming assembly, and a telescopic assembly connected to the vacuuming assembly. A heat-sealing assembly is mounted on the clamping assembly, a pushing assembly is mounted on the heat-sealing assembly, a cooling assembly adapted to the heat-sealing assembly is mounted on the pushing assembly, and an inflation assembly connected to the pushing assembly is mounted on the heat-sealing assembly. A communication assembly connects the inflation assembly and the cooling assembly. After heat sealing, the inflation assembly is connected to the cooling assembly, and cold air is blown onto the heat-sealing assembly to achieve rapid cooling. The inflation assembly is then connected to the pushing assembly, causing the pushing assembly to press down on the packaging bag, thus smoothly separating the heat-sealing assembly from the packaging bag.

[0006] Preferably, the clamping assembly includes a threaded rod connected to the support frame by a bearing, the two ends of the threaded rod are configured with opposite thread structures, and clamping blocks are respectively threaded to the two ends of the threaded rod. The threaded rod is threaded through the clamping blocks, and a guide rod is provided on the support frame, the guide rod passing through the clamping blocks.

[0007] Preferably, the drive assembly includes a drive motor mounted on the support frame, the output shaft of the drive motor is connected to a drive bevel gear, and a driven bevel gear that meshes with the drive bevel gear is fixedly sleeved on the threaded rod.

[0008] Preferably, the vacuum assembly includes a vacuum pump mounted on the support plate, the vacuum pump being connected to an air extraction pipe, and a control valve being installed on the air extraction pipe.

[0009] Preferably, the telescopic assembly includes an electric telescopic rod mounted on the support plate, and the output end of the electric telescopic rod is provided with a connecting plate, which is connected to the front end of the air extraction pipe.

[0010] Preferably, the heat sealing assembly includes an electric push rod disposed on the clamping block, the output end of the electric push rod is provided with a mounting plate, and the mounting plate is provided with a heat sealing knife.

[0011] Preferably, the pushing assembly includes a pushing cylinder disposed on the mounting plate, a pushing piston disposed inside the pushing cylinder, a pushing rod disposed on the pushing piston and passing through the pushing cylinder, and a pushing spring sleeved on the outer ring of the pushing rod disposed between the pushing cylinder and the cooling assembly.

[0012] Preferably, the cooling assembly includes a pressure cooling block disposed on the push rod, the pressure cooling block having an air blowing port, and the free end of the push spring disposed on the pressure cooling block.

[0013] Preferably, the inflation assembly includes an air pump mounted on the mounting plate, the output end of the air pump is connected to an inflation block, the inflation block is provided with an inflation pipe connected to the push cylinder, and a solenoid valve is installed on the inflation pipe.

[0014] Preferably, the connecting component includes a connecting pipe disposed on the inflatable block, a second solenoid valve is installed on the connecting pipe, a horizontal pipe is disposed on the mounting plate communicating with the connecting pipe, and a gas distribution pipe communicating with the downward cooling block is disposed on the horizontal pipe.

[0015] The beneficial effects of this invention are as follows: In use, electronic components are placed into a packaging bag, and the opening of the bag is passed through the heat-sealing assembly and clamping assembly. The telescopic assembly is activated, causing the output end of the vacuum assembly to advance and extend into the packaging bag. The drive assembly is then activated, rotating and causing the clamping assembly to move, bringing it into contact with the packaging bag and clamping the opening. The vacuum assembly is then activated to evacuate the packaging bag until a standard state is reached, completing the vacuuming operation. During heat sealing, the heat-sealing assembly is activated, bringing it close to the packaging bag to be heat-sealed. Simultaneously, the heat-sealing assembly drives the pushing assembly, cooling assembly, and filling assembly. The air assembly moves synchronously, bringing the cooling assembly closer to both sides of the packaging bag to be heat-sealed until the heat-sealing assembly performs the heat-sealing operation, thus sealing the bag. During the retraction, because the heat-sealing assembly does not cool down quickly, its temperature remains high, making it prone to sticking to the assembly. At this point, the air inflation assembly connects with the connecting assembly, activating the inflation assembly. The inflation assembly rapidly introduces gas into the connecting assembly, which then guides the cool air into the cooling assembly. The cooling assembly then directs the cool air to the heat-sealing assembly, rapidly cooling both the heat-sealing assembly and the packaging bag, preventing sticking. Then, the air inflation assembly... The component connects to the pushing component, forcing the pushing component to inflate. This forces the pushing component to drive the cooling component to press down on both sides of the packaging bag to be heat-sealed, further preventing the packaging bag from sticking to the heat-sealing component. The heat-sealing component is then activated in reverse. As the packaging bag is pressed down, the heat-sealing component gradually and smoothly separates and retracts, effectively protecting the packaging bag. When removing the vacuum component, the vacuum component is stopped, and the telescopic component is used to remove the vacuum component from the packaging bag. The driving component is then activated in reverse, forcing the clamping components to move away from each other, thus separating the clamping components from the packaging bag. At this time, the heat-sealing components moving away from each other also cause the cooling components to move away from each other, forcing the cooling component, heat-sealing component, and clamping components to separate. All components are separated from the packaging bag, completing the packaging operation. In summary, the electronic component vacuum packaging mechanism of this application can realize the vacuuming and heat sealing operations of the packaging bag. During the heat sealing retraction, the heat sealing components and packaging bag are cooled first, and then the packaging bag is pressed down to ensure the smooth retraction of the heat sealing components. This avoids the heat sealing components from sticking to the packaging bag, prevents the packaging bag seal from being torn or pulled apart, and prevents holes or incomplete sealing at the seal. It also prevents the seal from failing and causing moisture and oxygen to enter, improving packaging quality, providing moisture protection for electronic components, greatly improving packaging reliability, and facilitating subsequent operations on electronic components. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural entity diagram of the present invention from another perspective; Figure 3 For the present invention Figure 2 Side view; Figure 4 This is a structural entity diagram of the driving component of the present invention; Figure 5 This is a structural schematic diagram of the vacuum pumping assembly of the present invention; Figure 6 This is a partial structural diagram of the present invention; Figure 7 For the present invention Figure 6 Exploded view; Figure 8 For the present invention Figure 7 Partial structural entity diagram; Figure 9 For the present invention Figure 8 Exploded view; Figure 10 This is a diagram showing the connection relationship between the inflatable component and the connecting component of the present invention.

[0017] In the diagram: 1. Support frame; 2. Clamping assembly; 201. Threaded rod; 202. Clamping block; 203. Guide rod; 3. Drive assembly; 301. Drive motor; 302. Driving bevel gear; 303. Driven bevel gear; 4. Support plate; 5. Vacuum assembly; 501. Vacuum pump; 502. Evacuation pipe; 503. Control valve; 6. Telescopic assembly; 601. Electric telescopic rod; 602. Connecting plate; 7. Heat sealing assembly; 701. Electric push rod; 702. Mounting plate; 703. Heat sealing knife; 8. Pushing assembly; 801. Pushing cylinder; 802. Pushing piston; 803. Pushing rod; 804. Pushing spring; 9. Cooling assembly; 901. Pressing cooling block; 902. Air inlet; 10. Inflation assembly; 1001. Inflation pump; 1002. Inflation block; 1003. Inflation pipe; 1004. Solenoid valve one; 11. Connecting assembly; 1101. Connecting pipe; 1102. Solenoid valve two; 1103. Horizontal pipe; 1104. Air distribution pipe. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the invention, and therefore only show the components relevant to the invention.

[0019] Example 1: As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, a vacuum packaging mechanism for electronic components according to the present invention includes a support frame 1 with a notch for sealing the opening of a packaging bag. A clamping assembly 2 is provided on the support frame 1 to clamp the opening of the packaging bag, achieving a seal. A driving assembly 3 connected to the clamping assembly 2 is provided on the support frame 1; the driving assembly 3 is a power component. A support plate 4 is provided on the support frame 1, providing support. A vacuuming assembly 5 is provided on the support plate 4, performing a vacuuming operation on the packaging bag. A telescopic assembly 6 connected to the vacuuming assembly 5 is provided on the support plate 4, controlling the extension and retraction of the vacuuming assembly 5. A heat-sealing assembly 7 is provided on the clamping assembly 2. 7. A heat-sealing operation is performed on the opening of the packaging bag. The heat-sealing component 7 is equipped with a pushing component 8, and the pushing component 8 is equipped with a cooling component 9 adapted to the heat-sealing component 7. The cooling component 9 quickly cools the heat-sealing component 7 and the packaging bag. The heat-sealing component 7 is equipped with an inflation component 10 connected to the pushing component 8. The inflation component 10 provides multi-directional control. A connecting component 11 is provided between the inflation component 10 and the cooling component 9. The connecting component 11 has an air guiding function. Specifically, after heat sealing, the inflation component 10 is connected to the cooling component 9, and cold air is blown onto the heat-sealing component 7 to achieve rapid cooling of the heat-sealing component 7. The inflation component 10 is connected to the pushing component 8, so that the pushing component 8 presses down on the packaging bag, so that the heat-sealing component 7 is smoothly separated from the packaging bag.

[0020] Working principle: In use, electronic components are placed into a packaging bag, and the opening of the bag passes through the heat-sealing assembly 7 and clamping assembly 2. The telescopic assembly 6 is activated, causing the output end of the vacuum assembly 5 to advance and extend into the packaging bag. The drive assembly 3 is activated, rotating and causing the clamping assembly 2 to move, making it fit snugly against the packaging bag and clamping the opening. The vacuum assembly 5 is then activated to vacuum the inside of the packaging bag until a standard state is reached, completing the vacuuming operation. During heat sealing, the heat-sealing assembly 7 is activated, bringing it close to the packaging bag to be heat-sealed. Simultaneously, the heat-sealing assembly 7 drives the pushing assembly 8, cooling assembly 9, and... The inflation component 10 moves synchronously, bringing the cooling component 9 closer to both sides of the packaging bag to be heat-sealed, until the heat-sealing component 7 performs the heat-sealing operation, thus sealing the packaging bag. During the retraction, because the heat-sealing component 7 does not cool down quickly, its temperature remains high, making it easy for the packaging bag to stick to it. At this point, the inflation component 10 connects with the connecting component 11, activating the inflation component 10. The inflation component 10 quickly introduces gas into the connecting component 11, which then guides the cold air into the cooling component 9. The cooling component 9 then directs the cold air to the heat-sealing component 7, rapidly cooling both the heat-sealing component 7 and the packaging bag, preventing them from sticking together. The phenomenon is observed, and then the inflation component 10 is connected to the pushing component 8, forcing the pushing component 8 to inflate. This forces the pushing component 8 to drive the cooling component 9 to press down on both sides of the packaging bag to be heat-sealed, further preventing the packaging bag from sticking to the heat-sealing component 7. The heat-sealing component 7 is then started in reverse. As the packaging bag is pressed down, the heat-sealing component 7 gradually and smoothly separates and retracts, effectively protecting the packaging bag. When removing the vacuum component 5, the vacuum component 5 is stopped, and the telescopic component 6 is used to remove the vacuum component 5 from the packaging bag. The driving component 3 is then started in reverse, forcing the clamping components 2 to move away from each other, forcing the clamping components 2 to separate from the packaging bag. At this time, the heat-sealing components 7 move away from each other, causing the cooling components 9 to move away from each other, forcing the cooling components 9 to retract. Component 9, heat-sealing component 7, and clamping component 2 are all separated from the packaging bag, completing the packaging operation. In summary, the electronic component vacuum packaging mechanism of this application can realize the vacuuming and heat-sealing operations of the packaging bag. Moreover, during the heat-sealing retraction, the heat-sealing component 7 and the packaging bag are cooled first, and then the packaging bag is pressed down to ensure the smooth retraction of the heat-sealing component 7. This avoids the heat-sealing component 7 from sticking to the packaging bag, prevents the packaging bag seal from being torn or pulled apart, and prevents holes or incomplete sealing at the seal. It also prevents the seal from failing and causing moisture and oxygen to enter, improving the packaging quality, providing moisture protection for the electronic components, greatly improving the packaging reliability, and facilitating subsequent operations on the electronic components.

[0021] Example 2: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, a vacuum packaging mechanism for electronic components according to the present invention includes a clamping assembly 2 comprising a threaded rod 201 connected to a support frame 1 by a bearing. The two ends of the threaded rod 201 are configured with opposite thread structures, and clamping blocks 202 are threadedly connected to the two ends of the threaded rod 201 respectively. The clamping blocks 202 achieve a sealing effect on the opening of the packaging bag by tightly fitting together. The threaded rod 201 is threaded through the clamping blocks 202. A guide rod 203 is provided on the support frame 1, which has a guiding function and passes through the clamping blocks 202.

[0022] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The drive assembly 3 includes a drive motor 301 mounted on a support frame 1. The drive motor 301 provides power. The output shaft of the drive motor 301 is connected to a drive bevel gear 302. A driven bevel gear 303 that meshes with the drive bevel gear 302 is fixedly sleeved on the threaded rod 201. The diameters of the drive bevel gear 302 and the driven bevel gear 303 are designed according to requirements.

[0023] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The vacuum assembly 5 includes a vacuum pump 501 mounted on a support plate 4. The vacuum pump 501 is a prior art technology. The vacuum pump 501 is connected to a suction pipe 502, which is composed of a flexible tube and a rigid tube. A control valve 503 is installed on the suction pipe 502, and the control valve 503 controls the opening and closing of the rigid tube portion of the suction pipe 502.

[0024] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7, Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The telescopic component 6 includes an electric telescopic rod 601 mounted on a support plate 4. The electric telescopic rod 601 is a prior art technology. The output end of the electric telescopic rod 601 is provided with a connecting plate 602, which is connected to the front end of the suction pipe 502.

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The heat sealing assembly 7 includes an electric push rod 701 disposed on a clamping block 202. The electric push rod 701 is a prior art technology. The output end of the electric push rod 701 is provided with a mounting plate 702. The mounting plate 702 is designed along the width direction of the support frame 1. A heat sealing knife 703 is disposed on the mounting plate 702. The heat sealing knife 703 is a prior art technology. By heating with electricity, it melts the inner layer of plastic at the opening of the packaging bag and achieves heat sealing by its own adhesion and pressing.

[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, a vacuum packaging mechanism for electronic components according to the present invention includes a pushing assembly 8 comprising a pushing cylinder 801 disposed on a mounting plate 702. The pushing cylinder 801 is vertically disposed, and a pushing piston 802 is disposed inside the pushing cylinder 801. The pushing piston 802 is adapted to the pushing cylinder 801, and a pushing rod 803 is disposed on the pushing piston 802, passing through the pushing cylinder 801. The pushing rod 803 is disposed along the length direction of the pushing cylinder 801, and a pushing spring 804 sleeved on the outer ring of the pushing rod 803 is disposed between the pushing cylinder 801 and the cooling assembly 9.

[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10As shown, a vacuum packaging mechanism for electronic components according to the present invention includes a cooling assembly 9 comprising a pressing cooling block 901 disposed on a push rod 803. The pressing cooling block 901 is disposed along the length direction of the mounting plate 702. An air blowing port 902 is provided on the pressing cooling block 901, which is aligned with the heat sealing knife 703. The free end of the push spring 804 is disposed on the pressing cooling block 901.

[0028] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The inflation assembly 10 includes an inflation pump 1001 mounted on a mounting plate 702. The inflation pump 1001 is a prior art technology. The output end of the inflation pump 1001 is connected to an inflation block 1002. The inflation block 1002 acts as a transfer unit to facilitate adjustment of the gas input direction. An inflation pipe 1003 connected to a push cylinder 801 is provided on the inflation block 1002. A solenoid valve 1004 is installed on the inflation pipe 1003. The solenoid valve 1004 is a prior art technology.

[0029] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the present invention provides a vacuum packaging mechanism for electronic components. The connecting component 11 includes a connecting pipe 1101 disposed on the gas-filling block 1002. A second solenoid valve 1102 is installed on the connecting pipe 1101. The second solenoid valve 1102 is a prior art technology. A horizontal pipe 1103 is disposed on the mounting plate 702 and communicates with the connecting pipe 1101. A gas distribution pipe 1104 is disposed on the horizontal pipe 1103 and communicates with the lower cooling block 901. The gas distribution pipe 1104 facilitates the delivery of gas to different positions of the lower cooling block 901, thereby achieving a uniform cooling effect.

[0030] Working principle: In use, electronic components are placed into a packaging bag, and the opening of the packaging bag is passed through the heat-sealing knife 703 and clamping block 202. The electric telescopic rod 601 is activated, and the output end of the electric telescopic rod 601 drives the connecting plate 602 to move, causing the connecting plate 602 to drive the suction pipe 502 forward, forcing the suction pipe 502 into the packaging bag. The drive motor 301 is activated, and the output shaft of the drive motor 301 rotates, driving the active bevel gear 302 to rotate. The rotation of the active bevel gear 302 drives the driven bevel gear... When gear 303 rotates, driven bevel gear 303 rotates, driving threaded rod 201 to rotate. Under the guidance of guide rod 203, the two clamping blocks 202 move closer to each other until the clamping blocks 202 are in contact with the packaging bag, clamping the opening of the packaging bag and clamping the air extraction pipe 502. The vacuum pump 501 is started, the control valve 503 is opened, and the air inside the packaging bag is extracted through the air extraction pipe 502 to perform vacuuming treatment inside the packaging bag until the standard required state is reached, thus completing the vacuuming operation. During heat sealing, the electric push rod 701 is activated. The output end of the electric push rod 701 drives the mounting plate 702 and the heat sealing knife 703 to approach the position of the packaging bag to be heat sealed. At the same time, the mounting plate 702 drives the push cylinder 801, push piston 802, push rod 803, push spring 804, pressure cooling block 901, air pump 1001, air block 1002 and air pipe 1003 to move synchronously, so that the pressure cooling block 901 approaches the two sides of the packaging bag to be heat sealed until the heat sealing knife 703 performs the heat sealing operation on the packaging bag, so that the packaging bag is sealed. During the retraction, because the heat-sealing blade 703 does not cool down quickly, its temperature remains high, making it easy for the packaging bag to stick to it. At this point, open solenoid valve 1102 to connect the connecting pipe 1101 to the inflation block 1002, disconnect solenoid valve 1004, and start the inflation pump 1001. Gas from the inflation pump 1001 enters the inflation block 1002, is introduced through the connecting pipe 1101 into the horizontal pipe 1103, and then through the horizontal pipe 1103 into the gas distribution pipe 1104, allowing the gas to enter the lower cooling block 901. The gas is then blown onto the heat-sealing blade 703 and the packaging bag through the air outlet 902, rapidly cooling both and preventing the packaging bag from sticking to the heat-sealing blade 703. Then, open solenoid valve 1004. 04. Disconnect solenoid valve 1102 and connect inflation pipe 1003 to push cylinder 801. This forces inflation pump 1001 to introduce gas into push cylinder 801 through inflation block 1002 and inflation pipe 1003, increasing the gas volume inside push cylinder 801. This causes push piston 802 to extend push rod 803, which in turn causes push rod 803 to press down cooling block 901 against the two sides of the packaging bag to be heat-sealed. This further prevents the packaging bag from sticking to heat-sealing knife 703. Reverse start electric push rod 701, causing the output end of electric push rod 701 to drive mounting plate 702 and heat-sealing knife 703 to retract. As the packaging bag is pressed down, heat-sealing knife 703 gradually and smoothly separates and retracts, effectively protecting the packaging bag. When the suction pipe 502 is removed, the vacuum pump 501 is stopped, and the electric telescopic rod 601 is started. The output end of the electric telescopic rod 601 drives the connecting plate 602 to move. The connecting plate 602 drives the suction pipe 502 to retract, so that the suction pipe 502 is removed from the packaging bag. The drive motor 301 is started in reverse. Under the action of the driving bevel gear 302 and the driven bevel gear 303, the threaded rod 201 rotates, forcing the two clamping blocks 202 to move away from each other and forcing the clamping blocks 202 to separate from the packaging bag. At this time, the heat sealing knives 703 move away from each other, so that the mounting plate 702 drives the pressing cooling block 901 to move away from each other, forcing the pressing cooling block 901, the heat sealing knife 703 and the clamping block 202 to separate from the packaging bag, thus completing the packaging operation.

[0031] This solution enables vacuuming and heat sealing of packaging bags. During heat sealing retraction, the heat sealing blade 703 and the packaging bag are cooled before the bag is pressed down, ensuring smooth retraction of the heat sealing blade 703. This prevents the heat sealing blade 703 from sticking to the packaging bag, avoids tearing or stringing of the bag seal, and prevents holes or incomplete sealing at the seal point. It also prevents moisture and oxygen intrusion due to seal failure, improving packaging quality, providing moisture protection for electronic components, significantly enhancing packaging reliability, and facilitating subsequent operations on electronic components.

[0032] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A vacuum packaging mechanism for electronic components, characterized in that, The package includes a support frame (1), on which a clamping assembly (2) is provided to clamp the opening of the packaging bag; a driving assembly (3) connected to the clamping assembly (2) is provided on the support frame (1); a support plate (4) is provided on the support frame (1); a vacuum assembly (5) is provided on the support plate (4); a telescopic assembly (6) connected to the vacuum assembly (5) is provided on the support plate (4); a heat sealing assembly (7) is provided on the clamping assembly (2); a pushing assembly (8) is provided on the heat sealing assembly (7); and a connecting element connected to the heat sealing assembly (7) is provided on the pushing assembly (8). A matching cooling component (9) is provided on the heat sealing component (7) and an inflation component (10) is provided that communicates with the pushing component (8). A communication component (11) is provided between the inflation component (10) and the cooling component (9). After heat sealing is completed, the inflation component (10) is connected to the cooling component (9) and cold air is blown onto the heat sealing component (7) to achieve rapid cooling of the heat sealing component (7). The inflation component (10) is connected to the pushing component (8) so that the pushing component (8) presses down on the packaging bag so that the heat sealing component (7) is successfully separated from the packaging bag.

2. The vacuum packaging mechanism for electronic components according to claim 1, characterized in that, The clamping assembly (2) includes a threaded rod (201) connected to the support frame (1) by a bearing. The two ends of the threaded rod (201) are configured with opposite thread structures. The two ends of the threaded rod (201) are respectively threaded to clamping blocks (202). The threaded rod (201) is threaded through the clamping blocks (202). The support frame (1) is provided with a guide rod (203), which passes through the clamping blocks (202).

3. The vacuum packaging mechanism for electronic components according to claim 2, characterized in that, The drive assembly (3) includes a drive motor (301) mounted on the support frame (1), the output shaft of the drive motor (301) is connected to a drive bevel gear (302), and a driven bevel gear (303) that meshes with the drive bevel gear (302) is fixedly sleeved on the threaded rod (201).

4. The vacuum packaging mechanism for electronic components according to claim 3, characterized in that, The vacuum assembly (5) includes a vacuum pump (501) mounted on the support plate (4), a suction pipe (502) connected to the vacuum pump (501), and a control valve (503) mounted on the suction pipe (502).

5. The vacuum packaging mechanism for electronic components according to claim 4, characterized in that, The telescopic assembly (6) includes an electric telescopic rod (601) mounted on the support plate (4), and a connecting plate (602) is provided at the output end of the electric telescopic rod (601), and the connecting plate (602) is connected to the front end of the air extraction pipe (502).

6. The vacuum packaging mechanism for electronic components according to claim 5, characterized in that, The heat sealing assembly (7) includes an electric push rod (701) disposed on the clamping block (202), the output end of the electric push rod (701) is provided with a mounting plate (702), and a heat sealing knife (703) is disposed on the mounting plate (702).

7. The vacuum packaging mechanism for electronic components according to claim 6, characterized in that, The pushing assembly (8) includes a pushing cylinder (801) disposed on the mounting plate (702), a pushing piston (802) disposed inside the pushing cylinder (801), a pushing rod (803) disposed on the pushing piston (802) and passing through the pushing cylinder (801), and a pushing spring (804) sleeved on the outer ring of the pushing rod (803) is disposed between the pushing cylinder (801) and the cooling assembly (9).

8. The vacuum packaging mechanism for electronic components according to claim 7, characterized in that, The cooling assembly (9) includes a pressure cooling block (901) disposed on the push rod (803), the pressure cooling block (901) having an air blowing port (902), and the free end of the push spring (804) disposed on the pressure cooling block (901).

9. A vacuum packaging mechanism for electronic components according to claim 8, characterized in that, The inflation assembly (10) includes an inflation pump (1001) disposed on the mounting plate (702), the output end of the inflation pump (1001) is connected to an inflation block (1002), the inflation block (1002) is provided with an inflation pipe (1003) connected to the push cylinder (801), and a solenoid valve (1004) is installed on the inflation pipe (1003).

10. A vacuum packaging mechanism for electronic components according to claim 9, characterized in that, The connecting component (11) includes a connecting pipe (1101) disposed on the air-filling block (1002), a solenoid valve (1102) is installed on the connecting pipe (1101), a horizontal pipe (1103) is disposed on the mounting plate (702) and communicates with the connecting pipe (1101), and a gas distribution pipe (1104) is disposed on the horizontal pipe (1103) and communicates with the pressure cooling block (901).

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