Circuit board assembly and electronic equipment
By stacking circuit board assemblies in a sandwich or quad arrangement within the bosses of electronic devices, the problem of insufficient boss space utilization is solved, thereby achieving space expansion of the circuit board and improvement of component integration.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2026-04-10
AI Technical Summary
The thickness of the boss in existing electronic devices is relatively large, resulting in a large height of the space corresponding to the boss along the thickness direction. How to effectively utilize this space to improve the space expansion of the circuit board is an urgent problem to be solved.
Design a circuit board assembly that utilizes the space within the boss to stack sub-circuit boards and components in a sandwich or quad arrangement, including capacitor assemblies, SoC components, functional component assemblies, and sub-circuit boards, using an adapter board for support and electrical isolation, thereby increasing the integration of components.
It effectively expands the circuit board space, reduces space waste, increases the integration of components, and maintains the thinness and powerful functionality of electronic devices.
Smart Images
Figure CN121842931A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of electronic devices, and in particular to a circuit board assembly and an electronic device. BACKGROUND
[0002] In order to facilitate the user to hold the electronic device, the end of the back shell of some electronic devices is provided with a boss, and the thickness of the electronic device at the boss is usually greater than the thickness of the electronic device at other positions.
[0003] Due to the greater thickness of the electronic device at the boss, the height of the space corresponding to the boss in the thickness direction of the boss is greater, and therefore, how to utilize the height of the space corresponding to the boss to improve the space expansion of the circuit board is a technical problem to be solved by those skilled in the art. SUMMARY
[0004] The present application provides a circuit board assembly to improve the space expansion of the circuit board.
[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:
[0006] In a first aspect, the present application provides a circuit board assembly for installation in an electronic device, the electronic device having a back shell and a boss, the boss being located on one side of the back shell and connected with the back shell, the direction from the boss to the back shell being a first direction, the long side of the boss extending along a second direction of the electronic device, the first direction and the second direction intersecting and both being perpendicular to the thickness direction of the electronic device, and the height of the boss being greater than the height of the back shell in the thickness direction of the electronic device; the circuit board assembly comprising: a circuit board, a part of the circuit board along the first direction being used to be arranged in a first accommodating space corresponding to the boss, another part of the circuit board along the first direction extending into a second accommodating space corresponding to the back shell, and the first accommodating space and the second accommodating space being communicated; a chip, the chip being arranged on a first surface of the circuit board, and the size of the chip along the first direction being greater than the size of the boss along the first direction; a first component assembly, the first component assembly being arranged on a second surface of the circuit board, the size of the first component assembly in the first direction being greater than the size of the boss in the first direction, the first component assembly being connected with the chip, and the first surface and the second surface of the circuit board being two sides of the circuit board along the thickness direction; a sub-circuit board, the sub-circuit board being located on the second surface of the circuit board and stacked with the first component assembly along the thickness direction, the size of the sub-circuit board in the first direction being not greater than the size of the boss in the first direction, and the size of the sub-circuit board in the second direction being greater than the size of the first component assembly in the second direction, and the side surface of the sub-circuit board along the thickness direction being used to install a second component assembly.
[0007] As can be seen from the above, the projection of the sub-circuit board in the third direction covers a part of the capacitor assembly, realizing the stacking of sub-circuit boards along the third direction of the capacitor assembly, and utilizing the sub-circuit boards to stack the first IC module along the third direction, thereby making full use of the space of the circuit board in the third direction of the boss and reducing space waste.
[0008] In one possible implementation, the circuit board assembly further includes: an adapter plate fixed to the circuit board and including a first insulating frame and a second insulating frame, the first insulating frame and the second insulating frame being distributed on both sides of the first component assembly along a second direction, and the sub-circuit board being arranged and connected to the adapter plate along the thickness direction.
[0009] As can be seen from the above, the adapter plate can be used to support the sub-circuit board, reducing the possibility of deformation of the sub-circuit board.
[0010] In one possible implementation, the adapter board further includes: a connecting segment, which is fixed to the circuit board and located at one end of the circuit board for placement in the first accommodating space; the connecting segment connects the first insulating frame and the second insulating frame, and a clearance space for accommodating the first component assembly is formed between the first insulating frame, the second insulating frame and the connecting segment; the connecting segment is used to support the sub-circuit board.
[0011] As can be seen from the above, by adding a connecting section, the support area of the adapter board for the sub-circuit board can be increased, further reducing the possibility of deformation of the sub-circuit board at the first component assembly.
[0012] In one possible implementation, the first component assembly has an insulating support member on the side near the sub-circuit board for supporting the sub-circuit board.
[0013] As can be seen from the above, by directly setting support components on the first component assembly, the sub-circuit board is supported, thereby reducing the possibility of deformation of the sub-circuit board at the first component assembly.
[0014] In one possible implementation, the support is foam or a rubber pad.
[0015] As can be seen from the above, using foam or rubber pads can achieve insulation, reduce costs, and avoid wear problems caused by hard contact between the first component assembly and the sub-circuit board.
[0016] In one possible implementation, the circuit board assembly further includes a third component disposed within the space enclosed by the first insulating frame, the circuit board, and the sub-circuit board, and within the space enclosed by the second insulating frame, the circuit board, and the sub-circuit board.
[0017] As can be seen from the above, by placing a third component within the space enclosed by the first and second insulating frames on the circuit board, the number of integrated components on the circuit board can be increased; and by using the first and second insulating frames to seal the third component, electrical isolation can be achieved, reducing the need for shielding covers.
[0018] In one possible implementation, the chip includes: a SoC element fixedly connected to a circuit board; and an SoC shielding cover disposed on the outside of the SoC element and fixedly connected to the circuit board in a sealed manner.
[0019] In one possible implementation, the height of the first component assembly decreases along the first direction.
[0020] As can be seen from the above, the height of the first component assembly changes to adapt to the height changes of the boss and the rear shell, so that the first component assembly can extend into the second accommodating space corresponding to the rear shell.
[0021] In one possible implementation, the first component assembly includes: a capacitor, wherein there are multiple capacitors, and the height of the portion of the capacitor disposed in the first accommodating space is greater than the height of the portion of the capacitor disposed in the second accommodating space; and a capacitor shield, which covers the outside of the capacitor and is sealed and fixedly connected to the circuit board.
[0022] As can be seen from the above, multiple capacitors are arranged along the first direction and are opposite to the SoC components, which can provide stable voltage to the SoC components and respond quickly to changes in load current.
[0023] In one possible implementation, the second component assembly includes: a second component fixed to a sub-circuit board; and a second component shielding cover disposed on the outside of the second component and sealed and fixedly connected to the circuit board.
[0024] As can be seen from the above, the second component is sealed and isolated by using a shielding cover, thereby achieving electrical isolation.
[0025] In one possible implementation, multiple second components are arranged along a second direction of the sub-circuit board.
[0026] As can be seen from the above, by setting multiple second components in the second direction of the sub-circuit board, the number of components integrated on the sub-circuit board can be increased, which is beneficial to increasing the functionality of the sub-circuit board.
[0027] In one possible implementation, the second component assembly is disposed on both sides of the sub-circuit board along the thickness direction.
[0028] As can be seen from the above, setting second component assemblies on both sides of the sub-circuit board can increase the number of components stacked in the third direction on the circuit board, further expanding the layout space of components on the circuit board, enabling electronic devices to accommodate more components while maintaining a slim body and powerful functions.
[0029] Secondly, this application provides an electronic device, including: a rear housing; a boss located on one side of the rear housing and connected to the rear housing, the direction from the boss to the rear housing being a first direction, the length direction of the boss being a second direction, the first direction being perpendicular to the second direction, the rear housing and the boss being connected to form a back structure, and in the thickness direction of the electronic device, the height of the boss being greater than the height of the rear housing; a display screen connected to the back structure, forming a first accommodating space between the display screen and the boss, and forming a second accommodating space between the display screen and the rear housing; and a circuit board assembly mounted between the display screen and the back structure, wherein the circuit board assembly is any of the circuit board assemblies described above.
[0030] As can be seen from the above, the electronic device in this application includes the circuit board assembly proposed in the first aspect or any of the possible implementations. Therefore, the electronic device with the circuit board assembly also has all the above-mentioned technical effects, which will not be repeated here.
[0031] In one possible implementation, the first side of the circuit board assembly faces the display screen, and the second side of the circuit board faces away from the display screen.
[0032] As can be seen from the above, by combining the structure of the circuit board assembly, the space on the side of the circuit board away from the display screen on the boss can be utilized.
[0033] In one possible implementation, the electronic device is a foldable screen phone. The back cover of the foldable screen phone is provided with a hinge, and a boss is located on the back cover and on one side of the hinge along a first direction. The extension direction of the hinge is a second direction. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the folded intermediate state of the mobile phone disclosed in the embodiments of this application;
[0035] Figure 2 This is a schematic diagram of the unfolded state of the mobile phone disclosed in the embodiments of this application;
[0036] Figure 3 This is a schematic diagram of the folded state of the mobile phone disclosed in the embodiments of this application;
[0037] Figure 4 This is a split view of the mobile phone with a protruding part disclosed in the embodiments of this application;
[0038] Figure 5This is a top view of the mobile phone with a protruding part disclosed in the embodiments of this application;
[0039] Figure 6 for Figure 5 Sectional view of AA;
[0040] Figure 7 This is a connection diagram of the first structure of the circuit board assembly disclosed in the embodiments of this application;
[0041] Figure 8 This is a top view of a first structure of the circuit board assembly disclosed in the embodiments of this application;
[0042] Figure 9 for Figure 8 A cross-sectional view along the CC direction;
[0043] Figure 10 for Figure 8 A cross-sectional view along the CC direction when the functional component assembly has a different structure;
[0044] Figure 11 for Figure 8 Cross-sectional view along the BB direction;
[0045] Figure 12 This is a connection diagram of the second structure of a mobile phone with a protruding part disclosed in the embodiments of this application;
[0046] Figure 13 This is a connection diagram of the second structure of the circuit board assembly disclosed in the embodiments of this application;
[0047] Figure 14 This is a partial structural connection diagram of the second structure of the circuit board assembly disclosed in the embodiments of this application;
[0048] Figure 15 This is a top view of a second structure of the circuit board assembly disclosed in the embodiments of this application;
[0049] Figure 16 for Figure 15 Cross-sectional view along the EE direction;
[0050] Figure 17 for Figure 15 A cross-sectional view along the EE direction when the functional component assembly is a different structure;
[0051] Among them, 1000 is the mobile phone, 100 is the back cover, 200 is the boss, 300 is the display screen, and 400 is the circuit board assembly;
[0052] 101 is the first main body, 102 is the second main body, 103 is the hinge, 104 is the second accommodating space, 201 is the camera module, and 202 is the first accommodating space;
[0053] 401 is a circuit board, 402 is a capacitor assembly, 403 is a functional component assembly, 404 is a SoC component assembly, and 405 is a sub-circuit board; 4011 is a mounting position, 4021 is a capacitor shield, 4022 is a capacitor, 40211 is the first segment, 40212 is the second segment, 4031 is a device shield, 4032 is the first IC module, 4033 is the second IC module, 4034 is an adapter board, 4035 is the third IC module, 40341 is the first insulating frame, 40342 is a connecting segment, and 40343 is the second insulating frame. Detailed Implementation
[0054] A larger screen area on an electronic device generally results in a better user experience. However, larger screens can also lead to inconvenience in carrying the device, hence the rapid development of foldable electronic devices.
[0055] The electronic devices may include handheld devices, in-vehicle devices, wearable devices, terminal devices, or other processing devices connected to a wireless modem. They may also include cellular phones, smartphones, personal digital assistant (PDA) computers, tablets, laptops, laptop computers, cameras, video recorders, smartwatches, smart wristbands, augmented reality (AR) devices, virtual reality (VR) devices, in-vehicle computers, and other devices. This application does not impose specific limitations on the specific form of the aforementioned electronic devices. For ease of understanding, the following descriptions are combined with... Figures 1 to 3 This section explains the folding methods of electronic devices, using mobile phones as an example. Figure 1 This shows the folded state of the phone 1000. Figure 2 It shows the unfolded state of the phone 1000. Figure 3 It shows the folded state of the phone 1000.
[0056] Figure 1 The mobile phone 1000 shown includes: a back cover 100, a protrusion 200, and a display screen 300.
[0057] The back cover 100 has a protrusion 200 on one side. The back cover 100 and the protrusion 200 can be integrally formed or fixedly connected. The protrusion 200 and the back cover 100 form the back structure of the mobile phone 1000. The display screen 300 is connected to the back structure. It can be understood that the back cover 100 and the protrusion 200 are both arranged opposite to the display screen 300. The protrusion 200 protrudes from the back cover 100 in a direction away from the display screen 300. Because the protrusion 200 protrudes from the back cover 100, it is easier for the operator to hold the mobile phone 1000.
[0058] For example, a camera module 201 can be installed on the protrusion 200 of the mobile phone 1000. Of course, a stylus can also be installed on the protrusion 200. In order to simplify the structure, the structure installed on the protrusion 200 is not shown in some of the accompanying drawings.
[0059] In some embodiments, the back cover 100 can be a metal back cover, a glass back cover, a plastic back cover, or a ceramic back cover. The material of the back cover 100 is not limited in this embodiment. The display screen 300 is an organic light-emitting diode (OLED).
[0060] It should be noted that, Figure 1 The mobile phone 1000 shown is a horizontal outward-folding screen product; the mobile phone 1000 protected in this application can also be a vertically folding product. The following content uses… Figure 2 and Figure 3 Taking the folding screen phone 1000 as an example, we will explain the folding method of the phone 1000. For other folding methods of the phone 1000, please refer to the following explanation.
[0061] Figure 2 The rear shell 100 includes a first body 101, a second body 102, and a hinge 103. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
[0062] The hinge 103 is located between the first body 101 and the second body 102, and the first body 101 and the second body 102 are rotatably connected by the hinge 103, realizing the relative rotation of the first body 101 and the second body 102, and completing the folding and unfolding of the first body 101 and the second body 102. The boss 200 is located on the side of the first body 101 away from the second body 102, and the camera module 201 is mounted on the side of the boss 200 away from the display screen 300. When the display screen 300 is unfolded, the display screen 300 is on the same plane, and the boss 200 protrudes from the back cover 100 in a direction away from the display screen 300.
[0063] In this application, the following are defined: the extension direction of the hinge 103 between the first body 101 and the second body 102 is the second direction; the direction of the line connecting the boss 200 to the first body 101 and the second body 102 is the first direction; and the direction of the line connecting the boss 200 and the display screen 300 is the third direction. The first direction, the second direction, and the third direction are perpendicular to each other. The third direction can be understood as the thickness direction of the mobile phone 1000.
[0064] Figure 3 When the mobile phone 1000 shown is in a folded state, the first main body 101 and the second main body 102 are folded and fastened together, and the display screen 300 is exposed. The first main body 101 and the second main body 102 are located between the display screens 300 on both sides. In some embodiments, based on the above definition, it can be understood that after the mobile phone 1000 is fastened, the dimension of the exposed display screens 300 on both sides of the mobile phone 1000 along a third direction is H1, and the dimension of the protrusion 200 and the opposite display screen 300 along a third direction is H2, and H1 = H2. This can be understood as follows: after the mobile phone 1000 is fastened, the surface of the display screen 300 opposite to the second main body 102 is flush with the surface of the protrusion 200, that is, the dimension of the protrusion 200 and the display screen 300 along a third direction is greater than the dimension of the back cover 100 and the display screen 300 along a third direction. When the above-mentioned dimensional relationships are met, it is beneficial to improve the aesthetics of the appearance of the mobile phone 1000. It should be noted that after the mobile phone 1000 is folded, the protrusion 200 may not be flush with the surface of the display screen 300 opposite to the second body 102. For example, the height of the protrusion 200 and the height of the display screen 300 opposite to the second body 102 have a difference, and the range of the height difference between the two is not limited, so as to accommodate the processing error of the mobile phone 1000.
[0065] Because the thickness of the phone 1000 at the location of the protrusion 200 is relatively large, electronic components can be installed in the internal space formed by the protrusion 200 and the display screen 300. This utilizes the third-dimensional space of the phone 1000 at the protrusion 200, thereby reducing the thickness of the phone 1000 at the back cover 100 and achieving the goal of making the phone 1000 thinner and lighter. The following combines... Figure 4 The method by which electronic components are installed inside the protrusion 200 of mobile phone 1000 is explained, wherein... Figure 4 This demonstrates the disassembled structure of the phone 1000, including the protruding section. It should be noted that the following is attached... Figures 4 to 17 The diagram only shows a portion of the structure of the mobile phone 1000 for illustrative purposes. Content not covered in this application is not shown. The structure of other parts of the mobile phone 1000 is not limited. The mobile phone 1000 may include, but is not limited to, a foldable screen phone.
[0066] like Figure 4As shown, the mobile phone 1000 includes a back cover 100, a protrusion 200, a display screen 300, and a circuit board assembly 400. It should be noted that... Figure 4 The middle and rear shell 100 is the part of the structure of the phone 1000 near the protrusion 200, which can be understood as... Figure 2 Part of the first main body 101.
[0067] In this application, a first accommodating space 202 is formed between the display screen 300 and the protrusion 200, and a second accommodating space 104 is formed between the display screen 300 and the back cover 100. The circuit board assembly 400 is installed within the first accommodating space 202 and the second accommodating space 104, and the first accommodating space 202 and the second accommodating space 104 are connected. The different locations of the internal space of the mobile phone 1000 are distinguished for ease of description only. Since the dimension along a third direction between the protrusion 200 and the display screen 300 is greater than the dimension along a third direction between the back cover 100 and the display screen 300, the dimension along a third direction of the first accommodating space 202 is greater than the dimension along a third direction of the second accommodating space 104. This can be understood as the thickness of the first accommodating space 202 being greater than the thickness of the second accommodating space 104.
[0068] The circuit board assembly 400 includes: a circuit board 401, a capacitor assembly 402, a functional component assembly 403, a system-on-chip (SoC) component assembly 404, and a sub-circuit board 405.
[0069] The SoC component assembly 404 is mounted on the first side of the circuit board 401 along the third direction, and the capacitor assembly 402 and the functional component assembly 403 are both mounted on the second side of the circuit board 401 along the third direction. For example, the functional component assembly 403 consists of two groups and is distributed on both sides of the capacitor assembly 402 along the second direction.
[0070] In this paper, the circuit board 401 has a first side facing the display screen 300 along a third direction, and a second side facing away from the display screen 300. It can be understood that the SoC component assembly 404 is disposed on the side of the circuit board 401 closer to the display screen 300.
[0071] The circuit board 401 in this application can be a printed circuit board (PCB), a flexible circuit board, or an integrated circuit (or chip). In this embodiment, a PCB is used as an example. Depending on the number of components carried on the circuit board 401, it can be a single-sided or double-sided board. A single-sided board refers to a circuit board with components on one side, while a double-sided board refers to a circuit board with components on both sides. Depending on the type of components carried on the circuit board 401, it can be a radio frequency (RF) board or an application processor (AP) board. An RF board can be used to carry radio frequency integrated circuits (RF ICs), radio frequency power amplifiers (RFPAs), wireless fidelity (WIFI) chips, etc. An AP board can, for example, be used to carry system-on-a-chip components, double data rate (DDR) memory, main power management units (PMUs), auxiliary PMUs, etc.
[0072] The SoC component assembly 404, also known as a system-on-a-chip, is an integrated circuit with a specific purpose. It contains a complete system and all embedded software. It is a mobile phone main chip that fully integrates modules such as CPU (Central Processing Unit), GPU (graphics processing unit), and communication. It is the core component of the circuit board assembly 400 and is used to coordinate and control the operation of various functional component assemblies 403 on the circuit board 401.
[0073] The capacitor assembly 402 includes capacitors for the Power Delivery Network (PDN). The PDN is a filtering network used to maintain stable power supply and typically consists of resistors, capacitors, inductors, a power supply unit (PMU), and traces between functional devices requiring power. In this application, the capacitors of the PDN are used to provide a stable and reliable power input to the core modules inside the SoC component assembly 404 when it is operating. In some embodiments, the first component assembly refers to the capacitor assembly 402.
[0074] Functional component assembly 403 includes, but is not limited to, connectors, electronic transformers, relays, laser devices, packaged devices, biometric identification modules, processors, memory (such as DDR memory), RF (radio frequency), sensor modules, near field communication (NFC) modules, or power modules. Functional component assembly 403 can be a single component or a component structure obtained by stacking multiple components.
[0075] The sub-circuit board 405 can be a printed circuit board (PCB), a flexible circuit board, or an integrated circuit (or chip). In this embodiment, a PCB is used as an example for illustration. Depending on the number of components carried on the circuit board 401, it can be a single-sided or double-sided board. A single-sided board refers to a circuit board that carries components on one side, while a double-sided board refers to a circuit board that carries components on both sides. For the method of carrying components when the sub-circuit board 405 is single-sided or double-sided, please refer to the following... Figure 9 and Figure 10 In some embodiments, sub-circuit board 405 is part of circuit board 401 and is distributed along a third direction.
[0076] The above content has explained the basic components of circuit board assembly 400 and their positional relationships. The following section will combine... Figure 5 and Figure 6 The installation requirements for each component of the circuit board assembly 400 are described, including: Figure 5 This is a top view of the phone 1000, including the protruding part. Figure 6 for Figure 5 Sectional view of AA. Figure 5 and Figure 6 The shape of the sidewall of the boss 200 is not specifically limited and can be set according to different needs.
[0077] in, Figure 5 There are two functional component assemblies 403, which are distributed on both sides of the capacitor assembly 402 along the second direction.
[0078] like Figure 6 As shown, the circuit board assembly 400 includes: a circuit board 401, a capacitor assembly 402, a functional component assembly 403, and a SoC component assembly 404. The capacitor assembly 402 includes: a capacitor 4022 and a capacitor shield 4021.
[0079] The SoC component assembly 404 is mounted on the side of the circuit board 401 near the display screen 300, and the side of the SoC component assembly 404 near the second accommodating space 104 along the first direction extends beyond the length of the boss 200 on that side. That is, the side of the SoC component assembly 404 near the second accommodating space 104 extends beyond the first accommodating space 202 and extends into the second accommodating space 104.
[0080] Capacitor assembly 402 is mounted on the side of circuit board 401 away from display screen 300. Capacitor shield 4021 of capacitor assembly 402 covers the outside of capacitor 4022 of capacitor assembly 402 and is connected to circuit board 401, forming a sealed shielded space. Capacitor assembly 402 and SoC component assembly 404 are arranged facing each other in a third-direction orientation, and the dimensions of capacitor assembly 402 along the first direction are approximately the same as the dimensions of SoC component assembly 404. Therefore, the side of capacitor assembly 402 closest to the second accommodating space 104 extends beyond the first accommodating space 202 and into the second accommodating space 104. The dimensions of capacitor assembly 402 and SoC component assembly 404 are approximately the same, or the dimensions of capacitor assembly 402 are smaller than the dimensions of SoC component assembly 404, which allows for a stable voltage supply to SoC component assembly 404 while rapidly responding to changes in load current.
[0081] Specifically, the capacitor shield 4021 includes a first segment 40211 and a second segment 40212.
[0082] In this design, the first segment 40211 of the capacitor shield 4021 is located in the first accommodating space 202, and the second segment 40212 of the capacitor shield 4021 is located at the transition point from the first accommodating space 202 to the second accommodating space 104. The distance between the first segment 40211 and the circuit board 401 in a third direction is greater than the distance between the second segment 40212 and the circuit board 401 in a third direction. This can be understood as the height of the first segment 40211 relative to the circuit board 401 being greater than the height of the second segment 40212 relative to the circuit board 401. Furthermore, the height of the capacitor 4022 within the first segment 40211 is greater than the height of the capacitor 4022 within the second segment 40212. In other words, the height of both the capacitor shield 4021 and the capacitor 4022 gradually decreases along the direction from the first accommodating space 202 to the second accommodating space 104 to accommodate the dimensional changes of the capacitor assembly 402 in the first accommodating space 202 and the second accommodating space 104 in a third direction.
[0083] The dimension of the functional component assembly 403 along the first direction is smaller than the dimension of the boss 200 along the first direction, which can be understood as: the functional component assembly 403 is located within the first accommodating space 202.
[0084] The above describes the installation requirements for each component of the circuit board assembly 400. The following section will combine... Figures 7 to 11 ForFigure 5 and Figure 6 How to achieve the space expansion requirements of circuit board 401 in circuit board assembly 400, given the arrangement requirements of capacitor assembly 402? Figure 7 This is a connection diagram for the first structure of the circuit board assembly 400. Figure 8 This is a top view of the first structure of the circuit board assembly 400. Figure 9 for Figure 8 Cross-sectional view in the CC direction, Figure 10 for Figure 8 A cross-sectional view along the CC direction when the functional component assembly has a different structure. Figure 11 for Figure 8 Cross-sectional view along the BB direction.
[0085] In order to meet the space expansion requirement of the circuit board 401 of the circuit board assembly 400, in the following embodiments, the functional component assemblies 403 on both sides of the capacitor assembly 402 are set as a third-direction sandwich or quad sandwich structure, so as to utilize the space on the side of the circuit board 401 away from the display screen 300, thereby completing the space expansion of the circuit board 401.
[0086] Specifically, Figure 7 The capacitor assembly 402 shown includes a capacitor 4022 and a capacitor shield 4021. The SoC component assembly 404 includes an SoC component 4041 and an SoC shield 4042. The functional component assembly 403 includes:
[0087] The device includes a shielding cover 4031, a first integrated circuit (IC) 4032, a second integrated circuit (IC) 4033, and a frame board (FB) 4034. In the following text, the first integrated circuit 4032 is referred to as the first IC module 4032, and the second integrated circuit 4033 is referred to as the second IC module 4033. In some embodiments, the second component refers to the first IC module 4032, and the third component refers to the second IC module 4033.
[0088] The SoC component 4041 is mounted on one side of the circuit board 401 and is electrically connected to the circuit board 401. The connection method between the SoC component 4041 and the functional component assembly 403 on the circuit board 401 can be set according to different needs, and all are within the protection range.
[0089] The SoC shield 4042 is disposed on the outside of the SoC component 4041 and is fixedly connected to the circuit board 401. The SoC shield 4042 is used to form a sealed shielding space to accommodate the SoC component 4041. The SoC shield 4042 and the circuit board 401 are, but are not limited to, soldered together.
[0090] Capacitor 4022 is mounted on the other side of circuit board 401, opposite to SoC component 4041. Capacitor 4022 is electrically connected to circuit board 401. Capacitor shield 4021 is placed over the outside of capacitor 4022 and fixedly connected to circuit board 401. Capacitor shield 4021 forms a sealed shielding space to accommodate capacitor 4022. The capacitor shield 4021 and circuit board 401 may be soldered, but is not limited to, the following:
[0091] The second IC module 4033 is mounted on the circuit board 401 and is located on the same side of the circuit board 401 as the capacitor 4022. The adapter plate 4034 includes, but is not limited to, a rectangular frame. The adapter plate 4034 in this application can be configured according to different needs; for example, its shape can be modified to accommodate requirements such as antenna spring clips, which is also within the scope of protection. The adapter plate 4034 is fixedly connected to the circuit board 401 and is located on the outer periphery of the second IC module 4033. It is understood that the second IC module 4033 is located inside the space enclosed by the adapter plate 4034. The adapter plate 4034 is an insulating structure and is soldered to both the sub-circuit board 405 and the circuit board 401 to form a sealed shielded space accommodating the second IC module 4033. The sub-circuit board 405 is mounted on the adapter plate 4034. The connection method between the sub-circuit board 405 and the adapter plate 4034 includes, but is not limited to, soldering, bonding, or integral molding. The sub-circuit board 405 includes, but is not limited to, a PCB board. The first IC module 4032 is disposed on the side of the sub-circuit board 405 away from the second IC module 4033. The device shield 4031 is disposed on the outside of the first IC module 4032, and the device shield 4031 and the sub-circuit board 405 are connected by, but is not limited to, soldering. The device shield 4031 forms a sealed shielding space for accommodating the first IC module 4032.
[0092] It should be noted that there are two functional component assemblies 403, which are distributed on both sides of the capacitor assembly 402. The two functional component assemblies 403 are not connected to each other. It can be understood that the two functional component assemblies 403 are separated by the capacitor assembly 402. That is, the adapter board 4034 is two separate frames, and the sub-circuit board 405 is two separate boards distributed on both sides of the capacitor assembly 402. The two sub-circuit boards 405 are not connected above the capacitor assembly 402 (on the side away from the circuit board 401).
[0093] The functions of the first IC module 4032 and the second IC module 4033 in this article can be set according to different needs, and the number of the first IC module 4032 and the second IC module 4033 can be set according to different needs. It should be noted that the first IC module 4032 and the second IC module 4033 are only used to distinguish the components relative to the position of the sub-circuit board 405. Components with different functions located inside the component shield 4031 can all be called the first IC module 4032, and components with different functions located inside the space enclosed by the adapter board 4034 can all be called the second IC module 4033.
[0094] Figure 7 It can be concluded that the circuit board 401 and the sub-circuit board 405 are stacked along the third direction, thereby realizing the utilization of the space of the circuit board 401 along the third direction.
[0095] from Figure 8 It can be deduced that the distance between the side of the functional component assembly 403 along the first direction and the side of the capacitor assembly 402 along the first direction is L. The size of L needs to be set in combination with the size of the SoC component assembly 404 and the size of the boss 200. As long as the functional component assembly 403 is located inside the first accommodating space 202, the space utilization of the circuit board 401 in the third direction can be realized.
[0096] Figure 9 The adapter board 4034 shown is mounted on the circuit board 401. A second IC module 4033 is housed within the space enclosed by the adapter board 4034. A sub-circuit board 405 is stacked on the adapter board 4034 along a third direction. The sub-circuit board 405 is a single-sided board, with the first IC module 4032 located only on the side of the sub-circuit board 405 furthest from the adapter board 4034. This achieves a sandwich arrangement of the circuit board 401 and the functional component assembly 403 in a third direction. This sandwich arrangement expands the component layout space on the circuit board 401, allowing the phone to accommodate more components while maintaining a slim profile and powerful functionality.
[0097] It should be noted that, Figure 9 The second IC module 4033 in the circuit relies on the adapter board 4034 to achieve electrical isolation in order to shield signal interference.
[0098] Figure 10The adapter board 4034 shown is mounted on the circuit board 401. A second IC module 4033 is housed within the space enclosed by the adapter board 4034. A sub-circuit board 405 is stacked on the adapter board 4034 along a third direction. The sub-circuit board 405 is a double-sided board, with a first IC module 4032 and a third IC module 4035 respectively mounted on its two sides. Both the third IC module 4035 and the second IC module 4033 are located within the sealed, shielded space enclosed by the adapter board 4034, achieving a four-sided arrangement of the circuit board 401 and the functional component assembly 403 in a third direction. Compared to the sandwich arrangement, the four-sided arrangement significantly expands the space for component placement on the circuit board 401, allowing the phone to accommodate more components while maintaining a slim profile and powerful functionality.
[0099] It should be noted that, Figure 10 The second IC module 4033 and the third IC module 4035 are electrically isolated by the adapter board 4034.
[0100] The function of the third IC module 4035 in this article can be set according to different needs, and the number of third IC modules 4035 can be set according to different needs. It should be noted that the third IC module 4035 and the second IC module 4033 are only used to distinguish the components on both sides of the sub-circuit board 405. The second component can also refer to the third IC module 4035.
[0101] When choosing between a sandwich arrangement or a quad arrangement for the circuit board assembly 400, it is necessary to consider the height of the circuit board assembly 400 in the third direction within the mobile phone 1000. This can be understood as choosing based on the height of the boss 200 and the heights of the capacitor assembly 402, functional component assembly 403, and SoC component assembly 404 on the circuit board assembly 400.
[0102] Combination Figures 9 to 10 As can be seen from the content shown, the functional component assembly 403 in this application adopts a sandwich or four-sided arrangement to realize the stacking arrangement of components in a third direction, so as to achieve a higher integration of the circuit board 401 and thus meet the requirements of space expansion of the circuit board 401.
[0103] However, by Figure 8 and Figure 11 As can be seen from the content shown, the capacitor assembly 402 in this application does not have any other structures stacked along the third direction. This can be understood as follows: the circuit board 401 only has a capacitor 4022 and a capacitor shield 4021 covering the outside of the capacitor 4022 at the position of the capacitor assembly 402.
[0104] Based on the above arrangement of capacitor assembly 402 on circuit board 401, it can be seen that the circuit board assembly 400 in the above solution only sets up functional component assemblies 403 in a sandwich or quad arrangement on both sides of capacitor assembly 402, while no components are stacked in the third direction of capacitor assembly 402, resulting in wasted space in the third direction of the position of capacitor assembly 402 in boss 200.
[0105] Based on the aforementioned technical issues Figures 12 to 17 The illustrated embodiment also discloses a second structure for the circuit board assembly 400, which fully utilizes the space of the circuit board 401 within the boss 200 in the third-direction upward direction, reducing space waste. Among these, Figure 12 This is a connection diagram for the second structure of mobile phone 1000. Figure 13 This is a connection diagram for the second structure of the circuit board assembly 400. Figure 14 This is a partial structural connection diagram of the second structure of the circuit board assembly 400. Figure 15 This is a top view of the second structure of the circuit board assembly 400. Figure 16 and Figure 17 for Figure 15 The functional component assembly 403 is a cross-sectional view of EE with different structures.
[0106] In specific embodiments, such as Figure 12 As shown, the mobile phone 1000 includes a back cover 100 and a protrusion 200. The back cover 100 is the part of the mobile phone 1000 near the protrusion 200. The shape of the side wall of the protrusion 200 is not specifically limited and can be set according to different needs.
[0107] The boss 200 forms a first accommodating space 202, and the rear cover 100 and the display screen form a second accommodating space 104. The first accommodating space 202 and the second accommodating space 104 are connected. The circuit board assembly 400 includes: a circuit board 401, a capacitor assembly 402, a functional component assembly 403, a SoC component assembly 404, and a sub-circuit board 405.
[0108] The height of the boss 200 along a third direction is greater than the height of the rear shell 100 along a third direction, that is, the height of the first accommodating space 202 is greater than the height of the second accommodating space 104. The connection relationship and dimensional relationship between the boss 200 and the rear shell 100 can be found in the description of the above embodiments, and are not specifically limited here.
[0109] The positional relationships, connection relationships, and functions of circuit board 401, capacitor assembly 402, SoC component assembly 404, and sub-circuit board 405 can be found in [reference needed]. Figure 4 The descriptions in the embodiments described herein will not be repeated here. Figure 12 Circuit board assembly 400 and Figure 4 The difference in the circuit board assembly 400 is as follows:Figure 12 The sub-circuit board 405 is one and is located on the side of the capacitor assembly 402 away from the SoC component assembly 404 along the third direction. The side of the capacitor assembly 402 facing the second accommodating space 104 protrudes from the side of the functional component assembly 403 facing the second accommodating space 104.
[0110] like Figure 13 As shown, the capacitor assembly 402 of the circuit board assembly 400 includes a capacitor 4022 and a capacitor shield 4021. The SoC component assembly 404 includes an SoC component 4041 and an SoC shield 4042. The functional component assembly 403 includes a device shield 4031, a first IC module 4032, a second IC module 4033, and an adapter board 4034.
[0111] The connection and positional relationships of capacitor 4022, capacitor shield 4021, SoC component 4041, and SOC shield 4042 can be found in [reference needed]. Figure 7 The descriptions in the embodiments are not repeated here. In some embodiments, the second component refers to the first IC module 4032, and the third component refers to the second IC module 4033.
[0112] The second IC module 4033 is mounted on the circuit board 401 and is located on the same side of the circuit board 401 as the capacitor 4022. The second IC module 4033 is distributed on both sides of the capacitor assembly 402 along the second direction. The adapter plate 4034 is mounted on the circuit board 401 and extends along the second direction, with its two ends along the second direction located on both sides of the capacitor assembly 402 along the second direction. The adapter plate 4034 is an insulating structure, and its two ends are respectively enclosed by closed-loop shielding spaces. The second IC modules 4033 on both sides of the capacitor assembly 402 are respectively mounted in the shielding spaces at one end of the corresponding adapter plate 4034.
[0113] Sub-circuit board 405 is mounted on adapter board 4034. Sub-circuit board 405 extends along a second direction and is a single board connecting the two ends of adapter board 4034 along the second direction. This can be understood as follows: the two ends of sub-circuit board 405 are respectively connected to the two ends of adapter board 4034, and the projection of sub-circuit board 405 in a third direction at least partially obscures capacitor assembly 402. The connection method between sub-circuit board 405 and adapter board 4034 includes, but is not limited to, soldering, bonding, or integral molding. Sub-circuit board 405 includes, but is not limited to, a PCB board. A first IC module 4032 is disposed on the side of sub-circuit board 405 away from the second IC module 4033. Multiple first IC modules 4032 are disposed along the second direction of sub-circuit board 405, and each first IC module 4032 includes at least a portion opposite to capacitor assembly 402 along a third direction.
[0114] The device shield 4031 is disposed on the outside of the first IC module 4032, and the device shield 4031 and the sub-circuit board 405 are connected by soldering, including but not limited to, the device shield 4031 forming a sealed shielding space for accommodating the first IC module 4032.
[0115] The projection of the sub-circuit board 405 in the third direction covers a portion of the capacitor assembly 402, enabling the sub-circuit board 405 to be stacked along the third direction of the capacitor assembly 402, and the first IC module 4032 to be stacked along the third direction of the sub-circuit board 405, thereby making full use of the space of the circuit board 401 in the third direction within the boss 200 and reducing space waste.
[0116] The second structure of the circuit board assembly 400 has been described above. The following section will combine... Figure 14 The structure of the adapter board 4034 in the second structure of the circuit board assembly 400 will be described.
[0117] Figure 14 The adapter plate 4034 shown includes: a first insulating frame 40341, a connecting section 40342, and a second insulating frame 40343.
[0118] The first insulating frame 40341 is, but is not limited to, a rectangular frame, and the second insulating frame 40343 is, but is not limited to, a rectangular frame. The first insulating frame 40341 and the second insulating frame 40343 enclose the shielding space at both ends of the adapter plate 4034 along the second direction. The connecting segment 40342 is mounted on the mounting position 4011 of the circuit board 401. The mounting position 4011 is located on the circuit board 401 and is located away from the second accommodating space 104 of the capacitor assembly 402. Figure 12 (as shown) on one side. Connecting segment 40342 connects the first insulating frame 40341 and the second insulating frame 40343, and a clearance space for accommodating capacitor assembly 402 is formed between connecting segment 40342, the first insulating frame 40341 and the second insulating frame 40343.
[0119] In some embodiments, the connecting segment 40342, the first insulating frame 40341, and the second insulating frame 40343 are, but are not limited to, integrally formed.
[0120] By setting the connecting segment 40342, the sub-circuit board 405 can be supported above the capacitor assembly 402, increasing the support area of the adapter plate 4034 for the sub-circuit board 405, thus ensuring the strength requirements of the sub-circuit board 405 and preventing deformation of the sub-circuit board 405. The dimension of the connecting segment 40342 along the first direction can be set according to the dimension of the mounting position 4011 along the first direction.
[0121] Combination Figures 12 to 14As can be seen from the content, in the second structure of the circuit board assembly 400, the sub-circuit board 405 has a portion located above the capacitor assembly 402, as described below. Figures 15 to 17 The circuit board assembly 400 in this application will be described using a sandwich or quadruple design with a sub-circuit board 405 located above the capacitor assembly 402.
[0122] Figure 15 The capacitor assembly 402 of the circuit board assembly 400 shown in the figure extends beyond the functional component assembly 403 along the first direction on one side, and the projection of the functional component assembly 403 on the circuit board 401 obscures a portion of the capacitor assembly 402.
[0123] like Figure 16 As shown, a SoC component 4041 is disposed on a first surface of circuit board 401 along a third direction, a capacitor assembly 402 is disposed on a second surface of circuit board 401 along a third direction, a sub-circuit board 45 is disposed above the capacitor assembly 402, a first IC module 4032 is disposed above the sub-circuit board 405, and a device shield 4031 is disposed on the outer side of the first IC module 4032. The first IC module 4032, the capacitor 4022 of the capacitor assembly 402, the SoC component 4041, the sub-circuit board 405, and the circuit board 401 form a sandwich structure, i.e. Figure 16 The circuit board assembly 400 in the embodiment utilizes the upper space of the capacitor assembly 402 in the third direction, further improving the utilization rate of the circuit board 401 in the third direction and reducing the waste of space within the boss 200.
[0124] It should be noted that, Figure 16 The intermediate capacitor 4022 is electrically isolated by the capacitor shield 4021 to shield signal interference, and the connecting section 40342 of the adapter board 4034 is used to support the sub-circuit board 405.
[0125] Figure 17 In the embodiment shown, the first IC module 4032 and the device shield 4031 are provided on both the first and second sides of the sub-circuit board 405 along the third direction. That is, the sub-circuit board 405 is a double-sided board, so as to further utilize the space of the circuit board 401 in the third direction to realize the sandwich structure.
[0126] It should be noted that, Figure 16 The capacitor 4022 is electrically isolated by the capacitor shield 4021 to shield signal interference. The first IC module 4032 on the side of the sub-circuit board 405 near the capacitor 4022 is electrically isolated by the device shield 4031 covering the first IC module 4032 to shield signal interference. The connecting section 40342 of the adapter board 4034 is used to support the sub-circuit board 405.
[0127] The structure of the functional component assembly 403 on both sides of the capacitor assembly 402 on the circuit board 401 along the second direction can be the same, and can be referred to as Figure 9 and Figure 10 As shown, it will not be elaborated upon here.
[0128] When choosing between a sandwich or quad arrangement for the circuit board assembly 400, it's necessary to consider the third-dimensional height of the circuit board assembly 400 within the phone 1000, as well as the heights of the capacitor assembly 402, functional component assembly 403, and SoC component assembly 404 on the circuit board assembly 400. Essentially, the choice should be based on the height of the boss 200. Actual testing revealed that using a sandwich arrangement for the circuit board assembly 400 can increase its height by approximately 210mm. 2 The stacked area will be more beneficial when used for quadrilateral boards.
[0129] The above-described method uses the connecting segment 40342 of the adapter board 4034 to provide third-dimensional support for the sub-circuit board 405. In some embodiments, foam or rubber pads may also be added between the capacitor assembly 402 and the sub-circuit board 405 to provide third-dimensional support for the sub-circuit board 405. The choice of connecting segment 40342, foam, or rubber pads as the support structure for the sub-circuit board 405 can be made according to different needs.
[0130] In some embodiments, if the length of the sub-circuit board 405 along the second direction is large and the length of the capacitor assembly 402 along the second direction is small, and the lack of support for the sub-circuit board 405 at the capacitor assembly 402 will not affect the strength of the sub-circuit board 405, the adapter plate 4034 may be two separate rectangular frames, distributed on both sides of the capacitor assembly 402 along the second direction.
[0131] It is understood that the structure illustrated in the embodiments of the present invention does not constitute a specific limitation on the circuit board assembly 400. In other embodiments of this application, the circuit board assembly 400 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements.
[0132] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.
Claims
1. A circuit board assembly, characterized in that, For installation inside an electronic device, the electronic device has a rear shell and a boss, the boss is located on one side of the rear shell and connected to the rear shell, the direction from the boss to the rear shell is a first direction, the long side of the boss extends along the second direction of the electronic device, the first direction and the second direction intersect and are both perpendicular to the thickness direction of the electronic device, and in the thickness direction of the electronic device, the height of the boss is greater than the height of the rear shell. The circuit board assembly includes: A circuit board, a portion of which is disposed in a first accommodating space corresponding to the boss along a first direction, and another portion of which extends into a second accommodating space corresponding to the rear shell along the first direction, wherein the first accommodating space and the second accommodating space are connected. A chip, wherein the chip is disposed on a first side of the circuit board, and the dimension of the chip along the first direction is greater than the dimension of the boss along the first direction; A first component assembly is disposed on the second side of the circuit board. The dimension of the first component assembly in the first direction is greater than the dimension of the boss in the first direction. The first component assembly is connected to the chip. The first and second sides of the circuit board are the two sides of the circuit board along the thickness direction. A sub-circuit board is located on the second side of the circuit board and is stacked with the first component assembly along the thickness direction. The size of the sub-circuit board in the first direction is not greater than the size of the boss in the first direction, and the size of the sub-circuit board in the second direction is greater than the size of the first component assembly in the second direction. The side of the sub-circuit board along the thickness direction is used to mount the second component assembly.
2. The circuit board assembly according to claim 1, characterized in that, Also includes: An adapter board is fixed to the circuit board and includes a first insulating frame and a second insulating frame. The first insulating frame and the second insulating frame are distributed on both sides of the first component assembly along the second direction. The sub-circuit board is arranged and connected to the adapter board along the thickness direction.
3. The circuit board assembly according to claim 2, characterized in that, The adapter board further includes a connecting segment, which is fixed to the circuit board and located at one end of the circuit board for being disposed in the first accommodating space. The connecting segment connects the first insulating frame and the second insulating frame, and a clearance space for accommodating the first component assembly is formed between the first insulating frame, the second insulating frame and the connecting segment. The connecting segment is used to support the sub-circuit board.
4. The circuit board assembly according to claim 2 or 3, characterized in that, The first component assembly has an insulating support member on the side near the sub-circuit board to support the insulation of the sub-circuit board.
5. The circuit board assembly according to claim 4, characterized in that, The support component is foam or rubber pad.
6. The circuit board assembly according to any one of claims 2 to 5, characterized in that, It also includes a third component disposed within the space enclosed by the first insulating frame, the circuit board and the sub-circuit board, and the space enclosed by the second insulating frame, the circuit board and the sub-circuit board.
7. The circuit board assembly according to any one of claims 1 to 6, characterized in that, The chip includes: A SoC component, wherein the SoC component is fixedly connected to the circuit board; SoC shielding cover, which is placed on the outside of the SoC component and is sealed and fixedly connected to the circuit board.
8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, Along the first direction, the height of the first component assembly decreases.
9. The circuit board assembly according to claim 8, characterized in that, The first component assembly includes: The capacitor, wherein there are multiple capacitors, and the height of the portion of the capacitor used for being disposed in the first accommodating space is greater than the height of the portion of the capacitor used for being disposed in the second accommodating space; A capacitor shield is provided on the outside of the capacitor and is sealed and fixedly connected to the circuit board.
10. The circuit board assembly according to any one of claims 1 to 9, characterized in that, The second component assembly includes: The second component is fixed on the sub-circuit board; The second component shielding cover is disposed on the outside of the second component and is sealed and fixedly connected to the circuit board.
11. The circuit board assembly according to claim 10, characterized in that, Multiple second components are arranged along the second direction of the sub-circuit board.
12. The circuit board assembly according to claim 10, characterized in that, The second component assembly is disposed on both sides of the sub-circuit board along the thickness direction.
13. An electronic device, characterized in that, include: Back cover; A boss is located on one side of the rear shell and connected to the rear shell. The direction from the boss to the rear shell is a first direction, and the length direction of the boss is a second direction. The first direction is perpendicular to the second direction. The connection between the rear shell and the boss forms a back structure, and the height of the boss is greater than the height of the rear shell in the thickness direction of the electronic device. The display screen is connected to the back structure and forms a first accommodating space with the protrusion and a second accommodating space with the rear shell; A circuit board assembly, the circuit board assembly being mounted between the display screen and the rear structure, and the circuit board assembly being the circuit board assembly as described in any one of claims 1 to 12.
14. The electronic device according to claim 13, characterized in that, The first side of the circuit board assembly faces the display screen, and the second side of the circuit board faces away from the display screen.
15. The electronic device according to claim 13 or 14, characterized in that, The electronic device is a foldable screen phone. The back cover of the foldable screen phone is provided with a hinge. The protrusion is located on the back cover and on one side of the hinge along the first direction. The extension direction of the hinge is the second direction.