A heat dissipation structure of a circuit board for a resonator gyroscope

Abstract

The present application relates to the technical field of circuit board heat dissipation, and particularly relates to a heat dissipation structure of a circuit board for a resonant gyroscope, which comprises a heat dissipation circuit board, further comprises a heat dissipation base, which is located below the heat dissipation circuit board, a heat insulation plate is fixedly installed in the middle of the heat dissipation base, the top of the heat insulation plate can be fixedly installed at the bottom of the heat dissipation circuit board, a heat dissipation shell is fixedly installed on the heat dissipation base, the heat dissipation shell is circularly arranged below the heat dissipation circuit board, a driving adjustment shaft is rotatably and slidably installed at the bottom of the heat dissipation base, a heat conduction round plate is fixedly installed at the top of the driving adjustment shaft, and a heat dissipation fin group is fixedly installed at the bottom of the heat conduction round plate, the heat dissipation base and the heat dissipation shell are arranged at the bottom of the heat dissipation circuit board, the heat conduction round plate and the heat dissipation fin group are used, high-heat elements and low-heat elements on the heat dissipation circuit board are precisely and efficiently rapidly heat-dissipated, and the heat dissipation structure is suitable for circuit boards with various element distributions.

Description

Technical Field

[0001] This invention relates to the field of circuit board heat dissipation technology, and in particular to a heat dissipation structure for a circuit board used in a resonant gyroscope. Background Technology

[0002] As a high-precision inertial measurement device, the resonant gyroscope is widely used in complex dynamic scenarios such as airborne, vehicle-mounted, and shipborne applications. Its measurement accuracy directly depends on the frequency stability of the resonator. The heat generated by the circuit board during operation is one of the core factors causing frequency drift of the resonator and affecting measurement accuracy. With the miniaturization and high integration of resonant gyroscopes, the component density of the circuit board has increased significantly. High-heat areas (such as driver chips and amplifier circuits) and low-heat areas (such as logic control components) are regionally distributed. Heat tends to accumulate in high-heat areas. If it cannot be quickly dissipated, it will lead to excessively high local junction temperatures on the circuit board. This will not only reduce the lifespan of components but also damage the matching characteristics between the resonator and the circuit, seriously affecting the measurement accuracy and long-term stability of the gyroscope.

[0003] Currently, the commonly used heat dissipation structures for resonant heat dissipation circuit boards mainly include fixed-fin heat sinks and simple airflow heat sinks. Among them, fixed-fin heat sinks use an integrated fin layout, which cannot adapt to the differentiated heat dissipation needs of high and low heat zones on the circuit board. When long fins correspond to low heat zones and short fins correspond to high heat zones, it will result in insufficient heat dissipation area and heat accumulation in high heat zones, while redundant fins in low heat zones will lead to wasted space. Overall, the heat dissipation efficiency is low and it cannot achieve rapid heat dissipation. Simple airflow heat sinks mostly use a symmetrical air inlet and outlet design, lacking directional airflow and precise adaptation structure. The airflow is prone to forming vortices inside the heat sink and cannot deliver cooling airflow to high heat zones in a targeted manner. The heat exchange is insufficient, and the heat dissipation rate of high heat zones is slow, making it difficult to meet the requirements of rapid heat dissipation.

[0004] Therefore, in the existing technology, different models of resonant heat dissipation circuit boards, such as airborne, automotive, high-precision, or ordinary types, have different distribution angles and ranges of high and low heat zones due to differences in functional integration. Currently, in order to ensure heat dissipation efficiency, it is necessary to design a dedicated heat sink for each model to match the heat distribution of that model. This not only results in a long design cycle and a complicated production process, but also requires separate mold making and debugging for multiple heat sink models. Furthermore, the fin layout of the dedicated heat sink may not match the actual heat distribution with sufficient precision, leading to poor heat dissipation path and heat accumulation, making it impossible to achieve fast and efficient heat dissipation. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the present invention provides a heat dissipation structure for a circuit board for a resonant gyroscope.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] A heat dissipation structure for a resonant gyroscope circuit board includes a heat dissipation circuit board and further includes:

[0008] A heat dissipation base is located below a heat dissipation circuit board. A heat insulation plate is fixedly installed in the middle of the heat dissipation base. The top of the heat insulation plate can be fixedly installed at the bottom of the heat dissipation circuit board. A heat sink shell is fixedly installed on the heat dissipation base. The heat sink shell is circular and located below the heat dissipation circuit board. A drive adjustment shaft is rotatably and slidably installed at the bottom of the heat dissipation base. A heat-conducting circular plate is fixedly installed at the top of the drive adjustment shaft. A heat dissipation fin assembly is fixedly installed at the bottom of the heat-conducting circular plate. The fin height of the heat dissipation fin assembly is continuously stepped from a highest point to a lowest point along the circumference of the heat-conducting circular plate. The stepped distribution can achieve a rapid heat dissipation effect for high-heat and low-heat components.

[0009] Furthermore, the heat dissipation base is divided into two heat dissipation zones, left and right, by a heat insulation plate. Each zone has a heat dissipation fin group fixedly installed at the bottom of the heat-conducting circular plate, achieving the effect of independent and precise control of each zone.

[0010] Furthermore, copper heat-conducting tape is fixedly installed on the heat dissipation fins of the heat dissipation fin assembly to enhance heat conduction efficiency.

[0011] Furthermore, an adjustment rotating rod is fixedly installed at the bottom of the drive adjustment shaft, and a slot is provided at the bottom of the heat dissipation base for easy installation and adjustment.

[0012] Furthermore, the card slots are arranged in a circular pattern on the bottom of the heat dissipation base, and the outermost end of the adjusting rotating rod is set to a cylindrical shape that can fit the card slots, facilitating contact and reducing wear.

[0013] Furthermore, a rotating cylinder is rotatably mounted on the top of the heat dissipation base. The rotating cylinder is hollow and sleeved outside the drive adjustment shaft. An elastic element is provided between the rotating cylinder and the drive adjustment shaft. One end of the elastic element is located on the inner side wall of the rotating cylinder, and the other end is located on the outer side wall of the drive adjustment shaft. The elastic force provides reset and ensures that the heat-conducting circular plate is tightly attached to the bottom of the heat dissipation circuit board.

[0014] Furthermore, the heat dissipation base has an air inlet, which is arc-shaped and circumferentially distributed on the heat dissipation base. The top of the heat dissipation shell has an air outlet, which, like the air inlet, is arc-shaped and circumferentially distributed on the top of the heat dissipation shell, so that airflow is formed inside the heat dissipation shell to ensure heat dissipation efficiency.

[0015] Furthermore, a connecting plate is fixedly installed on the outer side wall of the bottom of the rotating cylinder, and an arc-shaped baffle is fixedly installed on the outside of the connecting plate. The arc-shaped baffle is slidably installed on the top of the heat dissipation base to restrict the air intake area of ​​the air inlet and avoid turbulent airflow.

[0016] Furthermore, a pull rod is fixedly installed on the top of the arc-shaped baffle, and an air outlet baffle is fixedly installed on the top of the pull rod. The air outlet baffle is slidably installed on the top of the inner side wall of the radiator shell to restrict the air outlet area and avoid turbulent airflow.

[0017] Furthermore, the length of the arc-shaped baffle covers three-quarters of the air inlet, and the length of the air outlet baffle covers three-quarters of the air outlet, achieving a precise control effect.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. This invention adapts to the rotation adjustment requirements of the heat-conducting circular plate by using a stepped layout of the heat dissipation fins. The long fins are for heat dissipation of high-heat components, and the short fins are for heat dissipation of low-heat components. The copper heat-conducting tape enhances heat transfer, thereby improving the differentiated heat dissipation efficiency of high and low power consumption areas and achieving a high-efficiency and fast heat dissipation effect.

[0020] 2. In this invention, the heat dissipation base is divided into two heat dissipation zones, left and right, by a heat insulation plate to perform heat dissipation operation on the heat dissipation circuit board. This achieves independent and precise control of the zone and isolates the heat interference between the left and right zones, making the heat dissipation operation more efficient. Furthermore, due to the rotatable and adjustable setting of the heat-conducting circular plate, it can be adapted to heat dissipation circuit boards with different distributions of high-heat and low-heat components, thereby improving the adaptability of this invention.

[0021] 3. This invention, through the design of the air inlet and outlet, forms a complete loop of "bottom air intake, long fin heat exchange, short fin heat exchange, and side outlet flow". The complete airflow loop forces cold air to flow through the high-heat zone and low-heat zone fins, forming directional convection, accelerating the removal of heat from the fin surface, greatly improving the heat convection efficiency, and achieving rapid heat dissipation.

[0022] 4. The present invention, through the design of the elastic element between the rotating cylinder and the drive adjustment shaft, provides lifting and resetting force for the drive adjustment shaft, ensuring that the heat-conducting circular plate is tightly attached to the bottom of the heat dissipation circuit board after adjustment, eliminating contact thermal resistance, and also buffering vibration impact, avoiding loosening of the fit, ensuring continuous and efficient heat conduction, and adapting to the airborne anti-vibration requirements.

[0023] 5. This invention improves the adaptability of the heat sink fin assembly to high and low heat component areas, enabling mass production of this solution to be compatible with multiple gyroscope models. This avoids the workload of designers repeatedly developing dedicated heat dissipation structures, simplifies the production process, eliminates the need to maintain molds and inventory for multiple heat sink models, and reduces R&D and production costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2This is a top-view three-dimensional schematic diagram of the heat dissipation base of the present invention;

[0026] Figure 3 This is a three-dimensional bottom view of the heat dissipation base of the present invention;

[0027] Figure 4 This is a three-dimensional schematic diagram of the interior of the heat sink housing of the present invention;

[0028] Figure 5 This is a three-dimensional bottom view of the heat-conducting circular plate of the present invention;

[0029] Figure 6 This is a three-dimensional schematic diagram of the heat dissipation fin assembly of the present invention.

[0030] Attached diagram labels: 1-Heat dissipation circuit board, 2-Heat dissipation base, 3-Heat insulation plate, 4-Heat radiator shell, 5-Drive adjustment shaft, 6-Heat-conducting circular plate, 7-Heat dissipation fin assembly, 8-Adjustment rotating rod, 9-Slot, 10-Rotating cylinder, 11-Connecting plate, 12-Arc-shaped baffle, 13-Pull rod, 14-Air outlet baffle, 15-Air inlet, 16-Air outlet, 17-Copper heat conduction tape. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0032] Example 1, as Figure 1-6 As shown, the present invention discloses a heat dissipation structure for a resonant gyroscope circuit board, including a heat dissipation circuit board 1, and further comprising:

[0033] A heat dissipation base 2 is located below the heat dissipation circuit board 1. A heat insulation plate 3 is fixedly installed in the middle of the heat dissipation base 2. The top of the heat insulation plate 3 can be fixedly installed at the bottom of the heat dissipation circuit board 1. A heat sink shell 4 is fixedly installed on the heat dissipation base 2. The heat sink shell 4 is circular and located below the heat dissipation circuit board 1. A drive adjustment shaft 5 is rotatably and slidably installed at the bottom of the heat dissipation base 2. A heat-conducting circular plate 6 is fixedly installed at the top of the drive adjustment shaft 5. A heat dissipation fin assembly 7 is fixedly installed at the bottom of the heat-conducting circular plate 6. The fin height of the heat dissipation fin assembly 7 is distributed in a continuous stepped manner from a highest point to a lowest point along the circumference of the heat-conducting circular plate 6. The heat dissipation base 2 is divided into two heat dissipation zones, left and right, by the heat insulation plate 3. The bottom of the heat-conducting circular plate 6 within the partition is fixedly equipped with a heat dissipation fin group 7. The height of the fins decreases from one end (corresponding to the high-heat element) to the other end (corresponding to the low-heat element), forming a "long fin to short fin" layout. Copper heat conduction tape 17 is fixedly installed on the heat dissipation fins of the heat dissipation fin group 7 to enhance heat conduction efficiency. Due to the continuous coverage of the stepped fins, the long fins and short fins form a complete gradient range from high-heat area to low-heat area. When the heat-conducting circular plate 6 is rotated by driving the adjustment shaft 5, the long fins can be precisely aligned with the high-heat area at any angle on different circuit boards, and the short fins can be aligned with the corresponding low-heat area simultaneously. Universal adaptation can be achieved without redesigning the heat dissipation structure.

[0034] In Embodiment Two, based on Embodiment One, an adjusting rotating rod 8 is fixedly installed at the bottom of the drive adjusting shaft 5. A slot 9 is provided at the bottom of the heat dissipation base 2, with the slots 9 arranged in a circular pattern around the bottom of the heat dissipation base 2. The distance between adjacent slots is no greater than 15°, ensuring that the heat-conducting circular plate 6 can achieve precise angle adjustment to adapt to high-heat element areas in different locations. The outermost end of the adjusting rotating rod 8 is set as a cylinder that can fit into the slot 9, allowing the adjusting rotating rod 8 to achieve a limiting operation with the slot 9. A rotating cylinder 10 is rotatably installed on the top of the heat dissipation base 2. The rotating cylinder 10 is hollow and sleeved outside the drive adjusting shaft 5. An elastic element is provided between the rotating cylinder 10 and the drive adjusting shaft 5, with one end of the elastic element located on the inner wall of the rotating cylinder 10. The other end is located on the outer wall of the drive adjustment shaft 5. The elastic element here is a spring sheet, which provides elastic restoring force to the drive adjustment shaft 5 when it rotates and moves up and down. After the drive adjustment shaft 5 is adjusted, the spring sheet's elastic force returns the drive adjustment shaft 5 to its initial position. The elastic force also ensures that the heat-conducting circular plate 6 is always in close contact with the bottom of the heat dissipation circuit board 1, improving stability. The elastic restoring force provided by the elastic element ensures that the heat-conducting circular plate 6 is always in close contact with the bottom of the heat dissipation circuit board 1 after rotation adjustment, eliminating contact gaps caused by rotation and ensuring heat conduction efficiency. At the same time, it buffers the vibration and impact of airborne and vehicle-mounted scenarios, preventing loosening of the fit and ensuring that circuit boards with different distributions can stably dissipate heat in dynamic environments.

[0035] In Example 3, based on Example 2, the heat dissipation base 2 has an air inlet 15, which is arc-shaped and circumferentially distributed on the heat dissipation base 2. The top of the heat sink shell 4 has an air outlet 16, which, like the air inlet 15, is arc-shaped and circumferentially distributed on the top of the heat sink shell 4. A connecting plate 11 is fixedly installed on the outer wall of the bottom of the rotating cylinder 10. An arc-shaped baffle 12 is fixedly installed on the outside of the connecting plate 11. The arc-shaped baffle 12 is slidably installed on the top of the heat dissipation base 2. The length of the arc-shaped baffle 12 covers three-quarters of the air inlet 15, thus creating a space where only one-quarter of the air inlet 15 is used for air intake. Three-quarters of the air inlet 15 is blocked by the arc-shaped baffle 12. The usable quarter air inlet 15 is located below the long fins of the heat dissipation fin assembly 7. A pull rod 13 is fixedly installed on the top of the arc-shaped baffle 12, and an air outlet baffle 14 is fixedly installed on the top of the pull rod 13. The air outlet baffle 14 is slidably installed on the top of the inner side wall of the heat dissipation shell 4. The length of the air outlet baffle 14 covers three-quarters of the air outlet 16, so that the air outlet baffle 14 can slide against the air outlet 16, forming a situation where only one-quarter of the air outlet 16 is used for air outlet operation, while three-quarters of the air outlet 16 is blocked by the air outlet baffle 14. The usable quarter air outlet 16 is located outside the short fins of the heat dissipation fin assembly 7.

[0036] The specific implementation principle and process are as follows:

[0037] During installation, pull the adjusting rod 8 downwards to separate it from the slot 9. The adjusting rod 8 will then drive the adjusting shaft 5 downwards, causing the heat-conducting disc 6 to separate from the bottom of the heat dissipation circuit board 1. Then, according to the component distribution on the heat dissipation circuit board 1, rotate the adjusting shaft 5 so that the long fins in the heat dissipation fin group 7 on the heat-conducting disc 6 move below the corresponding high-heat components, while the short fins move below the low-heat components. Then, release the adjusting rod 8. Due to the elastic element between the adjusting shaft 5 and the rotating cylinder 10, the adjusting shaft 5 will move upwards due to the elastic restoring force. The adjusting shaft 5 will then cause the heat-conducting disc 6 to adhere tightly to the bottom of the heat dissipation circuit board 1 using elastic force, and the adjusting rod 8 will follow the driving shaft. 5. The device moves into the slot 9 and is limited, preventing it from rotating. The installation is now complete. While the rotating rod 8 drives the drive adjusting shaft 5 to rotate, the drive adjusting shaft 5 also drives the rotating cylinder 10 to rotate through the elastic element. The rotating cylinder 10 then drives the arc-shaped baffle 12 to slide through the connecting plate 11. The arc-shaped baffle 12 can then drive the air outlet baffle 14 to slide through the pull rod 13. This ensures that the arc-shaped baffle 12 and the air outlet baffle 14 rotate synchronously with the drive adjusting shaft 5, so that the usable air inlet 15 is always below the long fins of the heat dissipation fin group 7, while the usable air outlet 16 is always outside the short fins of the heat dissipation fin group 7. This ensures that the positions of the air inlet and outlet remain relatively unchanged as the heat-conducting circular plate 6 is adjusted.

[0038] This invention is not intended for reuse after replacing a circuit board. Rather, it addresses the issue of different functions and precision levels within the same series of resonant heat dissipation circuit boards, where the circumferential distribution of high-heat and low-heat components differs. For example, when the high-heat area of ​​type one circuit board is located at 0°, rotating the heat-conducting circular plate aligns the long fins with 0°. When the high-heat area of ​​type two circuit board is located at 180°, during installation, simply pull down the adjusting lever 8, rotate it 180°, and release it. The long fins will then align with the high-heat area at 180°, and the short fins with the corresponding low-heat area, eliminating the need for additional adjustments. This type of design allows for rapid circuit board adaptation, achieving efficient and fast heat dissipation. It ensures universal compatibility with different models without sacrificing the heat dissipation efficiency of any particular model. In fact, by precisely matching high and low heat zones, it solves the problem of inefficient heat dissipation caused by matching deviations in traditional dedicated heat dissipation structures. Therefore, it naturally enables mass production of this heat dissipation structure to adapt to multiple gyroscope models. This avoids the workload of designers repeatedly developing dedicated heat dissipation structures, simplifies the production process, eliminates the need to maintain molds and inventory for multiple heat dissipation structures, and reduces R&D and production costs.

[0039] In this invention, the heat dissipation base 2 is divided into left and right heat dissipation zones by the heat insulation plate 3 to dissipate heat from the heat dissipation circuit board 1. This achieves independent and precise control of the zones and isolates heat interference between the left and right zones, making the heat dissipation operation more efficient. The stepped layout of the heat dissipation fin group 7 adapts to the rotation adjustment requirements of the heat-conducting circular plate 6. Long fins are used for heat dissipation of high-heat components, and short fins are used for heat dissipation of low-heat components. The copper heat-conducting tape enhances heat transfer, improving the differentiated heat dissipation efficiency of high and low power consumption zones, achieving a highly efficient and rapid heat dissipation effect. Furthermore, due to the rotatable and adjustable setting of the heat-conducting circular plate 6, it can adapt to heat dissipation circuit boards 1 with different distributions of high-heat and low-heat components, thereby improving the adaptability of this invention. Through the design of the air inlet 15 and the air outlet 16, regardless of the distribution of the heat-conducting circular plate 6, the heat dissipation circuit board 1 can be adapted to different distributions of high-heat and low-heat components. Regardless of rotation, the usable air inlet 15 is always located below the long fins (drawing in cold air), and the usable air outlet 16 is always located outside the short fins (expelling hot air), forming a complete loop of "bottom air intake, long fin heat exchange, short fin heat exchange, and side outlet flow". The complete airflow loop forces cold air to flow through the high-heat and low-heat fins, forming directional convection, accelerating the removal of heat from the fin surface, greatly improving heat convection efficiency, and achieving rapid heat dissipation. Through the design of the elastic element between the rotating cylinder 10 and the drive adjustment shaft 5, it provides lifting and resetting force for the drive adjustment shaft 5, ensuring that the heat-conducting circular plate 6 is tightly attached to the bottom of the heat dissipation circuit board 1 after adjustment, eliminating contact thermal resistance, and buffering vibration impact to avoid loosening of the attachment, ensuring continuous and efficient heat conduction, and adapting to airborne vibration resistance requirements.

[0040] In summary, by setting a heat sink base 2 and a heat sink shell 4 at the bottom of the heat dissipation circuit board 1, and using an optional heat-conducting circular plate 6 and heat dissipation fin group 7, the high-heat and low-heat components on the heat dissipation circuit board 1 can be cooled quickly and efficiently, while adapting to circuit boards with various component distributions.

[0041] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A heat dissipation structure for a circuit board used in a resonant gyroscope, comprising a heat dissipation circuit board, characterized in that, Also includes: A heat dissipation base is located below a heat dissipation circuit board. A heat insulation plate is fixedly installed in the middle of the heat dissipation base. The top of the heat insulation plate can be fixedly installed at the bottom of the heat dissipation circuit board. A heat sink shell is fixedly installed on the heat dissipation base. The heat sink shell is circular and located below the heat dissipation circuit board. A drive adjustment shaft is rotatably and slidably installed at the bottom of the heat dissipation base. A heat conduction circular plate is fixedly installed at the top of the drive adjustment shaft. A heat dissipation fin assembly is fixedly installed at the bottom of the heat conduction circular plate. The height of each fin in the heat dissipation fin assembly decreases from high to low along the circumference of the heat conduction circular plate, and the whole assembly is distributed in a stepped shape. A rotating cylinder is rotatably mounted on the top of the heat dissipation base. An elastic element is provided between the rotating cylinder and the drive adjustment shaft. One end of the elastic element is located on the inner side wall of the rotating cylinder, and the other end is located on the outer side wall of the drive adjustment shaft. The rotating cylinder is hollow and is sleeved on the outside of the drive adjustment shaft.

2. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 1, characterized in that: The heat dissipation base is divided into two heat dissipation zones, left and right, by a heat insulation plate. Each zone has a heat dissipation fin group fixedly installed at the bottom of the heat-conducting circular plate, and the heat-conducting circular plates of the two zones can be rotated and adjusted independently.

3. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 1, characterized in that: A copper heat-conducting cable is fixedly installed on the heat dissipation fins of the heat dissipation fin assembly.

4. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 1, characterized in that: An adjustment rotating rod is fixedly installed at the bottom of the drive adjustment shaft, and a slot is provided at the bottom of the heat dissipation base.

5. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 4, characterized in that: The card slots are arranged in a circular pattern on the bottom of the heat dissipation base, and the outermost end of the adjustment rotating rod is set as a cylinder that can be adapted to the card slots.

6. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 5, characterized in that: The distance between adjacent slots is no greater than 15°.

7. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 1, characterized in that: The heat dissipation base has an air inlet, which is arc-shaped and distributed around the circumference of the heat dissipation base. The top of the heat sink shell has an air outlet, which, like the air inlet, is arc-shaped and distributed around the circumference of the top of the heat sink shell.

8. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 7, characterized in that: A connecting plate is fixedly installed on the outer wall of the bottom of the rotating cylinder, and an arc-shaped baffle is fixedly installed on the outside of the connecting plate. The arc-shaped baffle is slidably installed on the top of the heat dissipation base.

9. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 8, characterized in that: A pull rod is fixedly installed on the top of the arc-shaped baffle, and an air outlet baffle is fixedly installed on the top of the pull rod. The air outlet baffle is slidably installed on the top of the inner side wall of the radiator shell.

10. The heat dissipation structure of a circuit board for a resonant gyroscope according to claim 9, characterized in that: The length of the arc-shaped baffle covers three-quarters of the air inlet, and the length of the air outlet baffle covers three-quarters of the air outlet.

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