Circuit board digital one-step forming system

Abstract

The invention discloses a circuit board digital one-time forming system, which relates to the technical field of circuit board processing, and comprises a device body, a cross beam mounted at one end of the top surface of the device body, a spraying platform arranged at the top of the device body, a circuit board placed on the top surface of the spraying platform, and a spraying headstock mounted in the middle of the side surface of the cross beam, the spraying platform is arranged at the top of the spraying headstock, the X-axis driving table and the Y-axis driving table are arranged on the top face of the device machine body in a crossed mode, the X-axis driving table is arranged at the top of the Y-axis driving table, the spraying platform is installed in the middle of the top face of the X-axis driving table, and the Y-axis driving table supports the X-axis driving table through magnetic force; the spraying headstock can enable the circuit board to be formed at a time, the spraying headstock adopts a material stacking technology and a similar 3D printing technology, a processing material reducing process is not needed, through hole drilling does not need to be carried out, and it is guaranteed that the processing process of the circuit board is environmentally friendly and free of solid and dust pollution.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, in particular to a digital one-time forming system for circuit board. BACKGROUND

[0002] The Chinese name of circuit board is printed circuit board, also known as printed wiring board, which is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. Almost every electronic device, from electronic watches and calculators to computers, communication electronic devices, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to achieve electrical interconnection between various components, printed boards are used. Printed wiring board is composed of insulating base plate, connecting wire and solder pad for assembling electronic components, and has the dual role of conductive circuit and insulating base plate. It can replace complex wiring to achieve electrical connection between components in the circuit, not only simplifying the assembly and welding work of electronic products, reducing the wiring workload under the traditional mode, greatly reducing the labor intensity of workers;

[0003] The traditional circuit board production process includes the following steps: double-sided copper clad plate, blanking, stacking, numerical control drilling through hole, deburring and brushing, chemical plating, brushing, screen printing negative circuit pattern, curing, circuit pattern electroplating, electroplating tin, removing printing material, etching copper, cleaning and brushing, screen printing solder mask pattern, drying, screen printing character marking pattern, curing, and profile processing. The process is very complicated, which seriously affects the production efficiency of the circuit board, and drilling, electroplating and cleaning are required, which leads to dust pollution in the production of the circuit board and is not environmentally friendly. SUMMARY

[0004] In order to overcome the above technical problems, the purpose of the present application is to provide a digital one-time forming system for circuit board, so as to solve the problem that the traditional circuit board production process has too many production processes, which seriously affects the production efficiency of the circuit board, and drilling, electroplating and cleaning are required, which leads to dust pollution in the production of the circuit board and is not environmentally friendly.

[0005] The purpose of the present application can be achieved by the following technical solutions:

[0006] The line board digital one-time forming system comprises a device body, a crossbeam is installed at one end of the top surface of the device body, a spraying platform is arranged on the top of the device body, the line board is placed on the top surface of the spraying platform, a Teflon coating is sprayed on the surface of the spraying platform, a spraying vehicle head is installed at the middle position of the side surface of the crossbeam, the spraying platform is arranged on the top of the spraying vehicle head, the spraying vehicle head performs character layer spraying operation, solder mask layer spraying operation, epoxy resin layer spraying operation and line layer spraying operation on the top surface of the spraying platform, an X-axis driving table and a Y-axis driving table are arranged on the top surface of the device body in a cross manner, the X-axis driving table is arranged on the top of the Y-axis driving table, the spraying platform is installed at the middle position of the top surface of the X-axis driving table, the Y-axis driving table supports the X-axis driving table through magnetic force, the X-axis driving table is used for moving horizontally along the top surface of the device body, and the Y-axis driving table is used for moving vertically along the top surface of the device body.

[0007] As a further scheme of the present application, the bottom of the spraying vehicle head is provided with a character layer spraying assembly, which is used for spraying paint on the top surface of the line board to form character symbols.

[0008] As a further scheme of the present application, the bottom of the spraying vehicle head is provided with a solder mask layer spraying assembly, which is used for spraying green oil on the top surface of the line board.

[0009] As a further scheme of the present application, the bottom of the spraying vehicle head is provided with an epoxy resin layer spraying assembly, which is used for spraying an epoxy resin layer on the top surface of the spraying platform to form a line board base layer.

[0010] As a further scheme of the present application, the bottom of the spraying vehicle head is provided with a line layer spraying assembly, which is used for performing line pattern spraying on the top surface of the line board.

[0011] As a further scheme of the present application, the inside of the X-axis driving table is provided with an electromagnetic top plate, which generates S-pole magnetic force on the top surface after being electrified.

[0012] As a further scheme of the present application, the inside of the Y-axis driving table is provided with a plurality of electromagnetic bottom plates, which are distributed in a straight line type, the middle position of each electromagnetic bottom plate is provided with a suction electromagnetic block, and the two ends of each electromagnetic bottom plate are provided with repulsion electromagnetic blocks.

[0013] As a further scheme of the present application, the top surface of the suction electromagnetic block generates N-pole magnetic force after being electrified, the top surface of the repulsion electromagnetic block generates S-pole magnetic force after being electrified, and the repulsion between the two repulsion electromagnetic blocks and the electromagnetic top plate is greater than the suction between the suction electromagnetic block and the electromagnetic top plate.

[0014] The present application has the following beneficial effects:

[0015] The character layer spraying operation, the solder mask layer spraying operation, the epoxy resin layer spraying operation and the circuit layer spraying operation can be performed on the top surface of the spraying platform by the spraying head, so that the top surface of the spraying platform forms a circuit board, the surface of the spraying platform is sprayed with a Teflon coating, the separation of the circuit board from the spraying platform after the circuit is formed is facilitated, the character layer spraying operation, the solder mask layer spraying operation, the epoxy resin layer spraying operation and the circuit layer spraying operation of the circuit board can be performed on the spraying platform by the spraying head, the circuit board can be formed at one time, the spraying head adopts the material accumulation technology, is similar to the 3D printing technology, has no processing and material reduction process, and does not need to perform the via hole drilling, so that the processing process of the circuit board is environmentally friendly, and there is no solid and dust pollution.

[0016] The circuit pattern is sprayed on the top surface of the circuit board by the circuit layer spraying assembly, and the chemical etching is not needed in the spraying process, so that the production process is environmentally friendly and has no pollution.

[0017] The character layer spraying assembly, the solder mask layer spraying assembly, the epoxy resin layer spraying assembly and the circuit layer spraying assembly are matched with each other, so that the circuit board can be formed at one time, the processes of wafer manufacturing and board manufacturing are not needed, the equipment and site investment are greatly reduced, the generation of solid waste and hazardous waste is greatly reduced, and the single product circuit board manufacturing process time can be shortened to several hours. BRIEF DESCRIPTION OF DRAWINGS

[0018] The application will be further described below with reference to the drawings.

[0019] Fig. 1 is a structural schematic diagram of the application;

[0020] Fig. 2 is a structural schematic diagram of the X-axis driving table and the Y-axis driving table in the application;

[0021] Fig. 3 is a structural schematic diagram of the electromagnetic bottom plate in the application.

[0022] In the figure: 1, device body; 2, cross beam; 3, spraying platform; 4, spraying head; 5, X-axis driving table; 51, electromagnetic top plate; 6, Y-axis driving table; 61, electromagnetic bottom plate; 62, suction electromagnetic block; 63, repulsion electromagnetic block; 7, character layer spraying assembly; 8, solder mask layer spraying assembly; 9, epoxy resin layer spraying assembly; 10, circuit layer spraying assembly. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the protection scope of the application.

[0024] like Figs. 1-3 As shown, the circuit board digital one-time molding system includes a device body 1, a crossbeam 2 installed at one end of the top surface of the device body 1, a spraying platform 3 set on the top of the device body 1, a circuit board placed on the top surface of the spraying platform 3, and a Teflon coating sprayed on the surface of the spraying platform 3. A spraying head 4 is installed in the middle of the side of the crossbeam 2, and the spraying platform 3 is set on top of the spraying head 4. The spraying head 4 performs character layer spraying, solder mask spraying, epoxy resin layer spraying, and circuit layer spraying operations on the top surface of the spraying platform 3. An X-axis drive table 5 and a Y-axis drive table 6 are arranged crosswise on the top surface of the device body 1, and the X-axis drive table 5 is set on top of the Y-axis drive table 6. The spraying platform 3 is installed in the middle of the top surface of the X-axis drive table 5. The Y-axis drive table 6 supports the X-axis drive table 5 by magnetic force. The X-axis drive table 5 is used to move horizontally along the top surface of the device body 1, and the Y-axis drive table 6 is used to move vertically along the top surface of the device body 1.

[0025] During operation, the spraying head 4 can perform character layer spraying, solder mask spraying, epoxy resin layer spraying, and circuit layer spraying on the top surface of the spraying platform 3, forming a circuit board on the top surface of the spraying platform 3. The surface of the spraying platform 3 is coated with Teflon, which facilitates the separation of the circuit board from the spraying platform 3 after it is formed. The spraying head 4 can perform character layer spraying, solder mask spraying, epoxy resin layer spraying, and circuit layer spraying on the spraying platform 3, allowing the circuit board to be formed in one step. Furthermore, the spraying head 4 uses material deposition technology, similar to 3D printing technology, without any material reduction process or the need for drilling through holes, ensuring that the circuit board processing is environmentally friendly and free from solid and dust pollution.

[0026] As one embodiment of the present invention:

[0027] The bottom of the spraying head 4 is equipped with a character layer spraying component 7, which is used to spray pigment onto the top surface of the circuit board to form character symbols on the top surface of the circuit board.

[0028] As one embodiment of the present invention:

[0029] The bottom of the spraying head 4 is equipped with a solder resist spraying assembly 8, which is used to spray green paint onto the top surface of the circuit board.

[0030] As one embodiment of the present invention:

[0031] An epoxy resin layer spraying assembly 9 is installed at the bottom of the spraying head 4. The epoxy resin layer spraying assembly 9 is used to spray an epoxy resin layer onto the top surface of the spraying platform 3 to form a circuit board base layer.

[0032] As one embodiment of the present invention:

[0033] The bottom of the spraying head 4 is equipped with a circuit layer spraying component 10, which is used to spray circuit patterns onto the top surface of the circuit board.

[0034] The circuit pattern is sprayed onto the top surface of the circuit board using the circuit layer spraying component 10. No chemical etching is required during the spraying process, making the production process environmentally friendly and pollution-free.

[0035] Through the cooperation of the character layer spraying component 7, the solder mask layer spraying component 8, the epoxy resin layer spraying component 9, and the circuit layer spraying component 10, the circuit board can be formed in one step without the need for wafer fabrication and board fabrication processes, which greatly reduces the investment in equipment and space, greatly reduces the generation of solid waste and hazardous waste, and the process time for a single circuit board can be shortened to a few hours.

[0036] As one embodiment of the present invention:

[0037] The X-axis drive stage 5 is equipped with an electromagnetic top plate 51. When the electromagnetic top plate 51 is energized, the top surface of the electromagnetic top plate 51 generates an S-pole magnetic force. The Y-axis drive stage 6 is equipped with several electromagnetic bottom plates 61. The electromagnetic bottom plates 61 are evenly distributed in a straight line. An attractive electromagnetic block 62 is provided in the middle of the electromagnetic bottom plate 61, and a repulsive electromagnetic block 63 is provided at both ends of the electromagnetic bottom plate 61. When the attractive electromagnetic block 62 is energized, the top surface of the attractive electromagnetic block 62 generates an N-pole magnetic force, and when the repulsive electromagnetic block 63 is energized, the top surface of the repulsive electromagnetic block 63 generates an S-pole magnetic force. The repulsive force between the two repulsive electromagnetic blocks 63 and the electromagnetic top plate 51 is greater than the attractive force between the attractive electromagnetic block 62 and the electromagnetic top plate 51.

[0038] During operation, the electromagnetic top plate 51 in the X-axis drive stage 5 and the electromagnetic base plate 61 in the Y-axis drive stage 6 can be energized sequentially. After energization, the top surface of the electromagnetic top plate 51 generates an S-pole magnetic force. Since the electromagnetic base plate 61 has an attractive electromagnetic block 62 in the middle and repulsive electromagnetic blocks 63 at both ends, the attractive electromagnetic block 62 generates an N-pole magnetic force on its top surface after energization, and the repulsive electromagnetic block 63 generates an S-pole magnetic force. Therefore, the magnetic poles of the attractive electromagnetic block 62 and the electromagnetic top plate 51 are opposite, generating... The magnetic poles of the electromagnetic blocks 63 and the electromagnetic top plate 51 are the same, generating a repulsive force. Since the repulsive force between the two repulsive electromagnetic blocks 63 and the electromagnetic top plate 51 is greater than the attractive force between the attractive electromagnetic blocks 62 and the electromagnetic top plate 51, the X-axis drive stage 5 can be suspended on the top of the Y-axis drive stage 6. The attractive force generated between the attractive electromagnetic blocks 62 and the electromagnetic top plate 51 can ensure that the X-axis drive stage 5 is stable on the top surface of the Y-axis drive stage 6, and also ensure that the X-axis drive stage 5 moves more smoothly along the direction of the Y-axis drive stage 6.

[0039] The X-axis drive platform 5 and the Y-axis drive platform 6 can be driven by electric push rods, hydraulic push rods, or pneumatic push rods to achieve the lateral movement of the X-axis drive platform 5 along the top surface of the device body 1 and the longitudinal movement of the Y-axis drive platform 6 along the top surface of the device body 1. Since the spraying platform 3 is installed at the center of the top surface of the X-axis drive platform 5, the movement of the X-axis drive platform 5 and the Y-axis drive platform 6 can drive the spraying platform 3, enabling the spraying platform 3 to move laterally and longitudinally along the top surface of the device body 1. This ensures that the spraying head 4 can perform character layer spraying, solder mask layer spraying, epoxy resin layer spraying, and circuit layer spraying operations on the top surface of the spraying platform 3.

[0040] The working principle of this invention is as follows: First, the spraying platform 3 is moved to the bottom surface of the epoxy resin layer spraying assembly 9 by the X-axis drive stage 5 and the Y-axis drive stage 6. The epoxy resin layer spraying assembly 9 is used to spray an epoxy resin layer onto the top surface of the spraying platform 3 to form the circuit board base layer. During this process, the X-axis drive stage 5 and the Y-axis drive stage 6 drive the spraying platform 3 to make the circuit board base layer formed on the top surface of the spraying platform 3 uniform in thickness and shape. Then, the solder resist layer spraying assembly 8 is used to spray green oil onto the top surface of the circuit board base layer. After the green oil solder resist layer is sprayed, the circuit layer spraying assembly 10 is used to spray circuit patterns onto the top surface of the circuit board. Finally, the character layer spraying assembly 7 is used to spray pigment onto the top surface of the circuit board to form character symbols on the top surface of the circuit board, thus completing the production of the circuit board.

[0041] During operation, the electromagnetic top plate 51 in the X-axis drive stage 5 and the electromagnetic base plate 61 in the Y-axis drive stage 6 can be energized sequentially. After energization, the top surface of the electromagnetic top plate 51 generates an S-pole magnetic force. Since the electromagnetic base plate 61 has an attractive electromagnetic block 62 in the middle and repulsive electromagnetic blocks 63 at both ends, the attractive electromagnetic block 62 generates an N-pole magnetic force on its top surface after energization, and the repulsive electromagnetic block 63 generates an S-pole magnetic force. Therefore, the magnetic poles of the attractive electromagnetic block 62 and the electromagnetic top plate 51 are opposite, generating... The magnetic poles of the electromagnetic blocks 63 and the electromagnetic top plate 51 are the same, generating a repulsive force. Since the repulsive force between the two repulsive electromagnetic blocks 63 and the electromagnetic top plate 51 is greater than the attractive force between the attractive electromagnetic blocks 62 and the electromagnetic top plate 51, the X-axis drive stage 5 can be suspended on the top of the Y-axis drive stage 6. The attractive force generated between the attractive electromagnetic blocks 62 and the electromagnetic top plate 51 can ensure that the X-axis drive stage 5 is stable on the top surface of the Y-axis drive stage 6, and also ensure that the X-axis drive stage 5 moves more smoothly along the direction of the Y-axis drive stage 6.

[0042] The X-axis drive platform 5 and the Y-axis drive platform 6 can be driven by electric push rods, hydraulic push rods, or pneumatic push rods to achieve the lateral movement of the X-axis drive platform 5 along the top surface of the device body 1 and the longitudinal movement of the Y-axis drive platform 6 along the top surface of the device body 1. Since the spraying platform 3 is installed at the center of the top surface of the X-axis drive platform 5, the movement of the X-axis drive platform 5 and the Y-axis drive platform 6 can drive the spraying platform 3, enabling the spraying platform 3 to move laterally and longitudinally along the top surface of the device body 1. This ensures that the spraying head 4 can perform character layer spraying, solder mask layer spraying, epoxy resin layer spraying, and circuit layer spraying operations on the top surface of the spraying platform 3.

[0043] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A circuit board digital one-step molding system, characterized in that, include: Device body (1); A crossbeam (2) is installed on one end of the top surface of the device body (1); Spraying platform (3), the spraying platform (3) is set on the top of the device body (1), the top surface of the spraying platform (3) is covered with a circuit board, and the surface of the spraying platform (3) is coated with a Teflon coating. The spraying head (4) is installed in the middle of the side of the crossbeam (2), and the spraying platform (3) is set on the top of the spraying head (4). The spraying head (4) performs character layer spraying operation, solder resist layer spraying operation, epoxy resin layer spraying operation and circuit layer spraying operation on the top surface of the spraying platform (3). The X-axis drive stage (5) and the Y-axis drive stage (6) are arranged crosswise on the top surface of the device body (1), with the X-axis drive stage (5) positioned on top of the Y-axis drive stage (6). The spraying platform (3) is installed in the middle of the top surface of the X-axis drive stage (5). The Y-axis drive stage (6) supports the X-axis drive stage (5) magnetically. The X-axis drive stage (5) is used to move horizontally along the top surface of the device body (1), and the Y-axis drive stage (6) is used to move vertically along the top surface of the device body (1).

2. The circuit board digital one-step forming system according to claim 1, characterized in that, The bottom of the spraying head (4) is equipped with a character layer spraying component (7), which is used to spray pigment onto the top surface of the circuit board to form character symbols on the top surface of the circuit board.

3. The circuit board digital one-step forming system according to claim 1, characterized in that, The bottom of the spraying head (4) is equipped with a solder resist spraying assembly (8), which is used to spray green oil onto the top surface of the circuit board.

4. The circuit board digital one-step forming system according to claim 1, characterized in that, An epoxy resin layer spraying assembly (9) is installed at the bottom of the spraying head (4). The epoxy resin layer spraying assembly (9) is used to spray an epoxy resin layer onto the top surface of the spraying platform (3) to form a circuit board base layer.

5. The circuit board digital one-step forming system according to claim 1, characterized in that, The bottom of the spraying head (4) is equipped with a line layer spraying component (10), which is used to spray line patterns onto the top surface of the circuit board.

6. The circuit board digital one-step forming system according to claim 1, characterized in that, The X-axis drive stage (5) is equipped with an electromagnetic top plate (51) inside, and the top surface of the electromagnetic top plate (51) generates an S-pole magnetic force after being energized.

7. The circuit board digital one-step forming system according to claim 6, characterized in that, The Y-axis drive stage (6) is provided with several electromagnetic base plates (61) inside. The electromagnetic base plates (61) are evenly distributed in a straight line. An attractive electromagnetic block (62) is provided in the middle of the electromagnetic base plate (61), and a repulsive electromagnetic block (63) is provided at both ends of the electromagnetic base plate (61).

8. The circuit board digital one-step forming system according to claim 7, characterized in that, The magnetic attraction block (62) generates an N-pole magnetic force on its top surface after being energized, and the magnetic repulsion block (63) generates an S-pole magnetic force on its top surface after being energized. The repulsive force between the two magnetic repulsion blocks (63) and the electromagnetic top plate (51) is greater than the attractive force between the magnetic attraction block (62) and the electromagnetic top plate (51).

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