Composite phase change liquid cooling radiator

Abstract

The invention belongs to the technical field of radiators, and particularly relates to a composite phase change liquid cooling radiator which comprises a radiator body provided with a liquid inlet and a liquid outlet. The heat conduction assembly is arranged on the radiator body, the bottom face of the heat conduction assembly is used for making contact with a heating source, a first heat dissipation cavity is defined by the radiator body and the heat conduction assembly, and the liquid inlet and the liquid outlet both communicate with the first heat dissipation cavity; the heat conduction assembly comprises an upper plate, a lower plate and a plurality of phase change assemblies; the upper plate is provided with a plurality of holes penetrating through the thickness of the upper plate, and the holes are communicated with the first heat dissipation cavity; the lower plate is formed by a metal powder 3D printing additive manufacturing process and is provided with a capillary structure; each phase change assembly comprises a solid heat conduction column and a ring shell surrounding the heat conduction column, a vacuum cavity is formed between the ring shell and the heat conduction column, and a working medium is packaged in the vacuum cavity; the ring shell is formed by a metal powder 3D printing additive manufacturing process, is provided with a capillary structure, and is connected with the capillary structure of the lower plate to jointly form a liquid backflow channel; and the vacuum cavity forms a steam channel.

Description

Technical Field

[0001] This invention belongs to the field of heat sink technology, and particularly relates to a composite phase change liquid-cooled heat sink. Background Technology

[0002] As the performance of various communication and industrial electronic products improves, chip power is increasing, and heat flux density is also rising, necessitating heat dissipation to ensure the proper functioning of the chips. The higher the chip's performance, the more heat it generates; therefore, heat dissipation devices play a crucial role in electronic products.

[0003] Existing heat sinks use a single-cavity linear liquid cooling structure to remove heat from the chip through water cooling channels to achieve the purpose of cooling. However, this cooling method is not very efficient and can only meet the heat dissipation needs of low-power chips, but cannot meet the heat dissipation needs of high-power chips, thus affecting the normal use of high-power chips. Summary of the Invention

[0004] The purpose of this invention is to provide a composite phase change liquid-cooled heat sink, which aims to solve the problem of low heat dissipation efficiency of the single-cavity linear liquid cooling structure in the prior art.

[0005] To achieve the above objectives, an embodiment of the present invention provides a composite phase change liquid-cooled radiator, comprising a radiator body having a liquid inlet and a liquid outlet; A heat-conducting component is disposed on the heat sink body, and its bottom surface is used to contact the heat source. The heat sink body and the heat-conducting component enclose a first heat dissipation cavity. The liquid inlet and the liquid outlet are both connected to the first heat dissipation cavity. The heat-conducting component includes an upper plate, a lower plate, and multiple phase change components; the upper plate and the lower plate are arranged opposite to each other and jointly support the multiple phase change components; the upper plate has multiple openings that penetrate its thickness and the openings communicate with the first heat dissipation cavity; the lower plate is made by metal powder 3D printing additive manufacturing process and has a capillary structure. Each phase change component includes a solid heat-conducting column and a shell surrounding the heat-conducting column, forming a vacuum cavity between the shell and the heat-conducting column, and encapsulating a working fluid within the vacuum cavity; the shell is manufactured using a metal powder 3D printing additive manufacturing process, has a capillary structure, and is connected to the capillary structure of the lower plate to jointly form a liquid reflux channel; the vacuum cavity forms a vapor channel.

[0006] Optionally, the metal powder includes one of copper powder, titanium powder or aluminum powder, and its porosity is between 40% and 70%.

[0007] Optionally, the heat-conducting pillar is made of a material with high thermal conductivity, and the material of the heat-conducting pillar can be one of pure copper, oxygen-free copper, or nickel-plated copper.

[0008] Optionally, a second heat dissipation cavity is formed between the upper plate and the lower plate. The refrigerant enters from the inlet, circulates through the first heat dissipation cavity and the second heat dissipation cavity, and then flows out from the outlet.

[0009] Optionally, the multiple phase change components divide the second heat dissipation cavity into multiple flow channels, through which coolant can pass to carry away heat from the multiple phase change components.

[0010] Optionally, the side of the radiator body away from the heat-conducting component is further provided with a radiator upper shell. The radiator upper shell is provided with a liquid inlet groove and a liquid outlet groove. A liquid inlet channel and a liquid outlet channel are formed between the radiator upper shell and the radiator body. The radiator upper shell is provided with a liquid inlet hole and a liquid outlet hole. The liquid inlet hole is connected to the liquid inlet channel, and the liquid outlet hole is connected to the liquid outlet channel.

[0011] Optionally, both the inlet channel and the outlet channel are provided with diversion protrusions.

[0012] Optionally, there are two liquid inlets, which are distributed on both sides of the top of the radiator body, and the liquid outlet is distributed in the middle of the top of the radiator body.

[0013] Optionally, one end of the liquid inlet is connected to the first heat dissipation cavity, and the other end is connected to the liquid inlet channel; one end of the liquid outlet is connected to the first heat dissipation cavity, and the other end is connected to the liquid outlet channel.

[0014] Optionally, a snap-fit ​​groove is provided next to the liquid inlet groove and the liquid outlet groove, and a snap-fit ​​protrusion is provided on the top of the radiator body. When the radiator upper shell is connected to the radiator body, the snap-fit ​​groove can be adapted to the snap-fit ​​protrusion for tight connection.

[0015] Compared with the prior art, the composite phase change liquid-cooled heat sink provided in the embodiments of the present invention has at least one of the following technical effects: Rapid temperature equalization and heat dissipation are achieved by incorporating a heat-conducting component. When the bottom of the heat-conducting component contacts the heat source, heat is simultaneously transferred to the solid heat-conducting column and the capillary structure of the lower plate and shell. The working fluid in the capillary structure rapidly absorbs heat and vaporizes, forming vapor in the vacuum cavity (vapor channel), and instantly diffuses to the upper region of the entire phase change assembly. The vapor that diffuses here comes into contact with the cooler cavity wall, releasing its latent heat of vaporization to the coolant flowing in the first heat dissipation cavity, and condenses itself into liquid. Through the strong capillary force generated by the capillary structure (liquid return channel) connecting the shell and the lower plate, it flows back to the high heat source region, preparing for the next vaporization cycle. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the exploded structure of the present invention.

[0019] Figure 3 This is a schematic diagram of the exploded structure of the present invention.

[0020] Figure 4 This is a cross-sectional structural diagram of the present invention.

[0021] Figure 5 for Figure 4 Enlarged structural diagram at point A.

[0022] The following are the labeling elements in the figure: 100. Radiator body; 110. Liquid inlet; 120. Liquid outlet; 130. First heat dissipation chamber; 200, Thermal conductive component; 210, Upper plate; 211, Opening; 220, Lower plate; 230, Phase change component; 231, Thermal conductive pillar; 232, Circular shell; 233, Vacuum cavity; 240, Second heat dissipation cavity; 300, Radiator upper shell; 310, Liquid inlet groove; 320, Liquid outlet groove; 330, Diversion protrusion; 340, Liquid inlet hole; 350, Liquid outlet hole; 360, Snap-fit ​​groove; 370, Snap-fit ​​protrusion. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0024] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0027] In one embodiment of the present invention, according to Figure 1-5 As shown, a composite phase change liquid cooling heat sink is used for heat dissipation of high-power chips. The composite phase change liquid cooling heat sink mainly includes a heat sink upper shell 300, a heat sink body 100 and a heat conduction component 200.

[0028] The heat-conducting component 200 is disposed below the heat sink body 100, and its bottom surface is used to directly contact and press against the heat source, such as the surface of a CPU / GPU chip. The heat sink upper shell 300 covers the heat sink body 100.

[0029] The radiator body 100 is typically made of a metal with good thermal conductivity through CNC machining or casting. It has an internal recessed area that, together with the heat-conducting component 200, encloses a first heat dissipation cavity 130. The radiator body 100 has a liquid inlet 110 and a liquid outlet 120. Both the liquid inlet 110 and the liquid outlet 120 communicate with the first heat dissipation cavity 130, allowing external coolant to flow into and out of the cavity.

[0030] The heat-conducting component 200 is the core part of the present invention, which includes an upper plate 210, a lower plate 220 and multiple phase change components 230.

[0031] The upper plate 210 and the lower plate 220 are plate-shaped structures arranged opposite to each other, and are used together to fix and support multiple phase change components 230. The upper plate 210 is provided with multiple openings 211, which penetrate through the thickness of the upper plate 210, so that the coolant in the first heat dissipation cavity 130 can directly contact the upper part of the phase change component 230 through the openings 211.

[0032] The lower plate 220 is made of metal powder using a 3D printing additive manufacturing process. The metal powder includes one of copper powder, titanium powder, or aluminum powder, with a porosity between 40% and 70%. Copper powder is preferred as it offers superior performance. It possesses a uniform and interconnected microporous structure, thus forming a strong capillary structure. The bottom surface of the lower plate 220 is flat, allowing for direct contact with the chip surface.

[0033] Each phase change assembly 230 includes a solid heat-conducting column 231 and a shell 232. The solid heat-conducting column 231 is a three-period minimal curved surface, and the shell 232 is a slimmed-down arc shape fitted outside the heat-conducting column 231, forming a vacuum cavity 233 in the middle. It can be understood that in the vacuum cavity 233, the heat source only needs to reach 40°C to reach 100°C for vaporization inside. The heat-conducting column 231 heats up, and the working fluid (deionized water) in the capillary structure quickly absorbs heat and vaporizes, forming steam in the vacuum cavity 233 (vapor channel), which instantly diffuses to the upper region of the entire phase change assembly 230.

[0034] The solid heat-conducting pillar 231 is made of a material with high thermal conductivity, which can be pure copper, oxygen-free copper, or nickel-plated copper, preferably oxygen-free copper. It is located at the central axis of the phase change assembly 230, with its upper end face in contact with or very close to the inner surface of the upper plate 210, and its lower end face basically flush with the bottom surface of the lower plate 220, to ensure optimal contact with the chip heat source.

[0035] The ring shell 232 surrounds and encloses the solid heat-conducting pillar 231, maintaining a tiny gap between them to form a sealed vacuum cavity 233. The ring shell 232 is also made of metal powder, such as copper powder, using a 3D printing additive manufacturing process, and has an internal capillary structure. Importantly, the capillary structure of the ring shell 232 and the capillary structure of the lower plate 220 are interconnected and integrated at the joint, together forming a continuous liquid reflux channel.

[0036] The vacuum chamber 233 is evacuated and encapsulated with a suitable amount of working fluid, such as deionized water. This vacuum chamber 233 constitutes a vapor channel for the flow of working fluid vapor.

[0037] Specifically, rapid temperature equalization and rapid heat dissipation are achieved by setting up the heat-conducting component 200. When the bottom of the heat-conducting component 200 contacts the heat source, heat is simultaneously transferred to the solid heat-conducting column 231 and the capillary structure of the lower plate 220 and the shell 232. The working fluid in the capillary structure rapidly absorbs heat and vaporizes, forming vapor in the vacuum cavity 233 (vapor channel), and instantly diffuses to the upper region of the entire phase change component 230. The vapor diffused here comes into contact with the cooler cavity wall, releasing its latent heat of vaporization to the coolant flowing in the first heat dissipation cavity 130, and condenses itself into liquid. Through the strong capillary force generated by the capillary structure (liquid return channel) connecting the shell 232 and the lower plate 220, it flows back to the high heat source region, preparing for the next vaporization cycle.

[0038] This invention utilizes the siphon principle and phase change circulation to achieve rapid, autonomous flow and uniform distribution of the working fluid within the cavity. Upon heating, the liquid vaporizes and expands, driving circulation; upon condensation, it efficiently returns via capillary siphon effect, thus forming a high-speed, uniform heat and mass exchange within the cavity. This process not only instantly balances the cavity temperature and eliminates localized hotspots, but also optimizes the utilization rate of the heat dissipation surface and the overall heat dissipation performance through continuous absorption and release of latent heat from phase change.

[0039] In another embodiment of the invention, such as Figure 4 As shown, a second heat dissipation cavity 240 is formed between the upper plate 210 and the lower plate 220. Refrigerant enters through the inlet 110, circulates through the first heat dissipation cavity 130 and the second heat dissipation cavity 240, and then flows out through the outlet 120. There are two inlets 110, located on either side of the top of the radiator body 100, and the outlet 120 is located in the middle of the top of the radiator body 100. One end of the inlet 110 is connected to the first heat dissipation cavity 130, and the other end is connected to the inlet channel. One end of the outlet 120 is connected to the first heat dissipation cavity 130, and the other end is connected to the outlet channel.

[0040] Specifically, the refrigerant enters the first heat dissipation chamber 130 from both sides of the top of the radiator body 100, and then flows into the second heat dissipation chamber 240 through the opening 211. The multiple phase change components 230 divide the second heat dissipation chamber 240 into multiple flow channels. The refrigerant can pass through the multiple flow channels, carrying away the heat on the multiple phase change components 230, and flows upward into the first heat dissipation chamber 130 in the middle and flows out through the outlet 120 located in the middle of the top of the radiator body 100, thereby completing the continuous circulation of the refrigerant.

[0041] In another embodiment of the invention, such as Figure 2-4As shown, the radiator body 100, on the side away from the heat-conducting component 200, is also provided with a radiator upper shell 300. The radiator upper shell 300 has a liquid inlet groove 310 and a liquid outlet groove 320. A liquid inlet channel and a liquid outlet channel are formed between the radiator upper shell 300 and the radiator body 100. The radiator upper shell 300 has a liquid inlet hole 340 and a liquid outlet hole 350. The liquid inlet hole 340 connects to the liquid inlet channel, and the liquid outlet hole 350 connects to the liquid outlet channel. The liquid inlet channel and the liquid outlet channel act as a buffer and pressure equalization mechanism, allowing the liquid to enter the first heat dissipation chamber 130 smoothly and evenly, avoiding uneven flow distribution caused by direct impact, thereby ensuring the stability of the overall heat dissipation performance.

[0042] In another embodiment of the invention, such as Figure 2 and 3 As shown, both the inlet and outlet channels are equipped with diversion protrusions 330. These protrusions actively guide and distribute the incoming liquid working fluid. Through physical segmentation and guidance, they further optimize the liquid distribution within the flow channel, allowing the liquid to enter or exit the subsequent first heat dissipation chamber 130 more smoothly and evenly, effectively reducing the possibility of local turbulence or dead zones. This not only enhances the buffering and pressure equalization effect of the channels and improves the uniformity and stability of flow distribution within the heat dissipation system, but also helps to fully utilize the heat exchange efficiency of the entire heat dissipation surface, thereby ensuring and enhancing the reliability and consistency of the overall heat dissipation performance of the radiator.

[0043] In another embodiment of the invention, such as Figure 2 and 3 As shown, a snap-fit ​​groove 360 ​​is provided next to the liquid inlet groove 310 and the liquid outlet groove 320, and a snap-fit ​​protrusion 370 is provided on the top of the radiator body 100. When the radiator upper shell 300 is connected to the radiator body 100, the snap-fit ​​groove 360 ​​can be fitted tightly with the snap-fit ​​protrusion 370. The snap-fit ​​groove 360 ​​and the snap-fit ​​protrusion 370 mainly serve to facilitate quick positioning and installation. At the same time, sealant can be filled into the snap-fit ​​groove 360 ​​to create a reliable sealed chamber. This structure ensures that there is no leakage of coolant during the flow of coolant from the external pipeline to the internal channel of the radiator.

[0044] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention and should not be construed as limiting the specific implementation of the invention to these descriptions. For those skilled in the art, the architectural form of this invention can be flexibly varied without departing from its conceptual framework, leading to the derivation of a series of products. Any simple deductions or substitutions should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. A composite phase change liquid cooling radiator applied to heat dissipation of high-power chips, comprising a radiator body having a liquid inlet and a liquid outlet; a heat conduction assembly arranged on the radiator body, a bottom surface of the heat conduction assembly being used to contact a heat source, the radiator body and the heat conduction assembly enclosing a first heat dissipation cavity, the liquid inlet and the liquid outlet being communicated with the first heat dissipation cavity; the heat conduction assembly comprising an upper plate, a lower plate and a plurality of phase change assemblies, the upper plate and the lower plate being oppositely arranged and jointly supporting the plurality of phase change assemblies, the upper plate being provided with a plurality of through holes penetrating through a thickness of the upper plate, the through holes being communicated with the first heat dissipation cavity, and the lower plate being made of a metal powder 3D printing additive manufacturing process and having a capillary structure; each phase change assembly comprising a solid heat conduction column and a ring shell surrounding the heat conduction column, a vacuum cavity being formed between the ring shell and the heat conduction column, and a working medium being encapsulated in the vacuum cavity, the ring shell being made of a metal powder 3D printing additive manufacturing process and having a capillary structure, and the capillary structure of the ring shell being connected with the capillary structure of the lower plate to jointly form a liquid return channel, and the vacuum cavity forming a vapor channel.

2. The composite phase change liquid cooling heat spreader of claim 1, wherein, The metal powder comprises one of copper powder, titanium powder or aluminum powder, and a porosity of the metal powder is between 40% and 70%.

3. The composite phase change liquid cooling heat spreader of claim 1, wherein, The heat conduction column is made of a high-thermal-conductivity material, and a material of the heat conduction column can be one of pure copper, oxygen-free copper or nickel-plated copper.

4. The composite phase change liquid cooling heat spreader of claim 1, wherein, A second heat dissipation cavity is formed between the upper plate and the lower plate, refrigerant liquid enters from the liquid inlet, circulates through the first heat dissipation cavity and the second heat dissipation cavity, and then flows out from the liquid outlet.

5. The composite phase change liquid cooling heat spreader of claim 4, wherein, The plurality of phase change assemblies divide the second heat dissipation cavity into a plurality of flow channels, and cooling liquid can pass through the plurality of flow channels to take away heat from the plurality of phase change assemblies.

6. The composite phase change liquid cooling heat sink of claim 1, wherein, The radiator body further comprises a radiator upper shell arranged on a side of the radiator body away from the heat conduction assembly, the radiator upper shell being provided with a liquid inlet groove and a liquid outlet groove, a liquid inlet channel and a liquid outlet channel being formed between the radiator upper shell and the radiator body, the radiator upper shell being provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole being communicated with the liquid inlet channel, and the liquid outlet hole being communicated with the liquid outlet channel.

7. The composite phase change liquid cooling heat sink of claim 6, wherein, The liquid inlet channel and the liquid outlet channel are each provided with a flow splitting protrusion.

8. The composite phase change liquid cooling heat spreader of claim 7, wherein, The number of the liquid inlets is two, the two liquid inlets being arranged on two sides of a top of the radiator body, and the liquid outlet being arranged in a middle of the top of the radiator body.

9. The composite phase change liquid cooling heat spreader of claim 6, wherein, One end of the liquid inlet is connected with the first heat dissipation cavity, and the other end of the liquid inlet is connected with the liquid inlet channel, one end of the liquid outlet is connected with the first heat dissipation cavity, and the other end of the liquid outlet is connected with the liquid outlet channel.

10. The composite phase change liquid cooling heat sink of claim 6, wherein, The liquid inlet groove and the liquid outlet groove are provided with clamping grooves, the top of the radiator body is provided with a clamping protrusion, and when the radiator upper shell is connected with the radiator body, the clamping grooves can be tightly connected with the clamping protrusion in a matched manner.

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