Liquid cooling heat dissipation internal circulation structure of server
By employing a four-layer series of meandering baffle coil heat exchanger design and a counter-flowing internal and external channel structure in the server, the problem of low heat dissipation efficiency under high server load is solved, achieving efficient and energy-saving heat dissipation and protecting the server's core hardware.
Patent Information
- Application Number
- CN202512036879.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-31
- Publication Date
- 2026-04-10
AI Technical Summary
Existing server cooling systems are inefficient under high loads, prone to heat buildup and noise issues. Traditional liquid cooling solutions suffer from insufficient heat exchange efficiency, uneven coolant temperature distribution, and high energy consumption, making it difficult to meet the cooling requirements of high-density servers.
It adopts a four-layer series of meandering baffle coil heat exchange tube design, combined with the counter-flow of the inner and outer channels and the rectangular array of heat exchange fins, and with the heat absorption fan and heat exchange fan fin mechanism, to form a double-enhanced heat dissipation. The self-heat exchange design of the inner and outer channels reduces the load on external cooling equipment, and the circulation water pump and heat absorption fan work together to reduce energy consumption.
It significantly improves heat dissipation efficiency, reduces energy consumption, ensures uniform temperature inside the server, extends equipment lifespan, meets high-load heat dissipation requirements, and complies with green energy-saving requirements.
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Figure CN121843060A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of liquid cooling heat dissipation internal circulation structure, and particularly relates to a liquid cooling heat dissipation internal circulation structure of a server. BACKGROUND
[0002] With the rapid iteration of technologies such as cloud computing, big data and artificial intelligence, the computing performance of servers is continuously upgraded, and high-density deployment has become a mainstream trend in data centers. In a high-load running state, the CPU, GPU and other core components of the server will generate a large amount of heat, and if the heat cannot be dissipated in time, the device running temperature will rise, which will not only reduce the computing efficiency and prolong the response time, but also may cause hardware failure, shorten the service life, and even cause data loss and other serious consequences. Therefore, an efficient and stable heat dissipation system has become a key link for guaranteeing the core performance of the server.
[0003] The traditional server heat dissipation adopts air cooling technology, and the heat dissipation is forced by a heat dissipation fan and a heat dissipation fin, but this method has obvious limitations: on the one hand, the air cooling heat dissipation efficiency is greatly affected by the ambient temperature, and in the high-density deployment scene, heat accumulation phenomenon is easy to occur, and the heat dissipation capacity is difficult to match the heat dissipation demand of the high-power server; on the other hand, the high-speed operation of the fan will produce a large noise, and after a long time of operation, dust is easy to accumulate, which affects the heat dissipation effect and the stability of the device.
[0004] To solve the bottleneck of the air cooling technology, liquid cooling heat dissipation technology gradually arises. The existing liquid cooling scheme mostly adopts single flow channel circulation or simple multi-layer arrangement design, and has problems of insufficient heat exchange efficiency, uneven temperature distribution of the cooling liquid, high energy consumption and the like. In some schemes, the cooling liquid is easy to appear local overheating phenomenon in the circulation process, and the cold and heat exchange lacks collaborative design, which leads to low overall energy efficiency of the heat dissipation system; at the same time, the installation adaptability of the traditional liquid cooling structure is poor, and it is difficult to realize efficient integration with the server box, which limits its popularization and application in high-density servers. SUMMARY
[0005] The present application aims to provide a liquid cooling heat dissipation internal circulation structure of a server, which improves the heat dissipation efficiency, running stability, space utilization, energy consumption control, temperature distribution uniformity and maintenance convenience of the liquid cooling heat dissipation internal circulation structure by installing the liquid cooling heat dissipation internal circulation mechanism and the server, so as to solve the technical problems proposed in the above background technology.
[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: A liquid cooling heat dissipation internal circulation structure of a server, comprising a server, wherein the liquid cooling heat dissipation internal circulation mechanism is installed on the server; The liquid cooling heat dissipation inner circulation mechanism comprises heat exchange pipes arranged in a meandering and zigzag coil type and arranged in four layers in series in an up-down manner.
[0007] As a further technical scheme of the present application, transition connecting pipes are connected between each layer of the coil type heat exchange pipes, the transition connecting pipes are also designed as double channels, and the transition connecting pipes are integrally arranged with the heat exchange pipes; the lower end of the lowermost coil type heat exchange pipe is fixedly connected with the cooling box.
[0008] As a further technical scheme of the present application, the cooling box is internally connected with the rear lower end of the server box body; the inner flow channel and the outer flow channel of the end portion of the uppermost coil type heat exchange pipe pass through the rear upper end of the server box body and respectively branch into a hot flow pipe and a cold flow pipe.
[0009] As a further technical scheme of the present application, the hot flow pipe is connected with the cooling liquid inlet of the heat exchange fan fin mechanism, the cooling liquid outlet of the heat exchange fan fin mechanism is connected with a return flow pipe, and the other end of the return flow pipe is connected with the cooling liquid inlet of the circulating water pump.
[0010] As a further technical scheme of the present application, the cooling liquid outlet of the circulating water pump is connected with one end of the cold flow pipe; the heat exchange fan fin mechanism and the circulating water pump are connected with the outer surface of the left upper end of the server box body.
[0011] As a further technical scheme of the present application, the rear side of the server box body is arranged in an up-down manner with four groups of heat dissipation grilles, each group of heat dissipation grille is provided with a heat absorbing fan at the rear side, the heat absorbing fan is fixedly connected with the outer surface of the rear side of the server box body; each group of heat dissipation grille is provided with a coil type heat exchange pipe at the front side, and the coil type heat exchange pipe is connected with the inner part of the rear side of the server box body through the symmetrically arranged mounting seats.
[0012] Compared with the prior art, the present application has the following advantages: In the present application, the heat exchange pipes are arranged in four layers in series in a coil type, and the heat exchange fins are arranged in a rectangular array, so that the heat exchange area is greatly increased; the inner flow channel and the outer flow channel flow in opposite directions to form cooperative heat exchange, and the heat absorbing fan and the heat exchange fan fin mechanism are double-strengthened, so that the heat dissipation efficiency is improved compared with the traditional air cooling and single liquid cooling scheme, and the high load heat dissipation requirement of the server is fully met. In the present application, the self-heat exchange design of the inner flow channel and the outer flow channel reduces the load of the external cooling equipment, and the circulating water pump and the heat absorbing fan are matched, so that the overall energy consumption is reduced compared with the traditional liquid cooling system, the green energy-saving requirement of the data center is met, and the long-term operation cost of the server is reduced. The reverse double-channel design of the inner flow channel and the outer flow channel, in cooperation with the preliminary cooling effect of the cooling box, avoids local overheating of the cooling liquid, controls the temperature difference of each area in the server box body within 5 DEG C, effectively protects the server core hardware from temperature fluctuations, and prolongs the service life of the equipment. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 is a three-dimensional structure schematic diagram of the present application.
[0014] Figure 2 is a top view of the present application Figure 1 .
[0015] Figure 3 is a split structure schematic diagram of the present application Figure 1 .
[0016] Figure 4 is a split structure schematic diagram of the present application Figure 3 .
[0017] Figure 5 is a top view of the present application Figure 4 .
[0018] Figure 6 is a front view of the present application Figure 5 .
[0019] Figure 7 is an A-A sectional view of the present application Figure 6 .
[0020] Figure 8 is a local enlarged schematic diagram of the present application Figure 2 .
[0021] Figure 9 is a local enlarged schematic diagram of the present application Figure 4 .
[0022] Figure 10 is a local enlarged schematic diagram of the present application Figure 7 . in the figure: 1-server, 2-liquid cooling heat dissipation internal circulation mechanism; 11-server box body, 12-heat dissipation grid, 13-heat absorption fan; 21-heat exchange pipe, 22-inner flow channel, 23-outer flow channel, 24-heat exchange fin, 25-mounting seat, 26-transition connecting pipe, 27-cooling box, 28-heat flow pipe, 29-heat exchange fan fin mechanism, 210-backflow pipe, 211-circulating water pump, 212-cold flow pipe. DETAILED DESCRIPTION
[0023] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.
[0024] Please refer to Figures 1-10 In the embodiments of the present application, a liquid cooling heat dissipation inner circulation structure of a server comprises a server 1, and a liquid cooling heat dissipation inner circulation mechanism 2 is installed on the server 1. The liquid cooling heat dissipation inner circulation mechanism 2 comprises heat exchange pipes 21 arranged in a meandering and zigzag coil type and arranged in four layers in series in an up-down manner. The heat exchange pipes 21 are provided with double channels of inner flow channels 22 and outer flow channels 23, and the inner flow channels 22 are arranged inside the outer flow channels 23. The heat exchange pipes 21 in each layer are arranged in a rectangular matrix and provided with heat exchange fins 24, and the heat exchange pipes 21 in each layer are symmetrically provided with mounting seats 25 at both ends. The heat exchange pipes 21 in each layer are connected with transition connecting pipes 26, the transition connecting pipes 26 are also designed in a double channel type, and the transition connecting pipes 26 are integrally arranged with the heat exchange pipes 21. The lower end of the heat exchange pipes 21 in the lowermost layer is fixedly connected with a cooling box 27. The cooling box 27 is connected with the inside of the lower end of the rear side of a server box body 11. The inner flow channels 22 and the outer flow channels 23 at the end of the heat exchange pipes 21 in the uppermost layer pass through the upper end of the rear side of the server box body 11 and are respectively divided into a hot flow pipe 28 and a cold flow pipe 212. The hot flow pipe 28 is connected with a cooling liquid inlet of a heat exchange fan fin mechanism 29, the cooling liquid outlet of the heat exchange fan fin mechanism 29 is connected with a return flow pipe 210, and the other end of the return flow pipe 210 is connected with a cooling liquid inlet of a circulating water pump 211.
[0025] By adopting the above technical solution, the self-heat exchange design of the inner flow channels 22 and the outer flow channels 23 reduces the load of external cooling equipment. The circulating water pump 211 cooperates with the heat absorbing fan 13, and the overall energy consumption is lower than that of a traditional liquid cooling system, which meets the green energy-saving demand of a data center and reduces the long-term operation cost of the server 1. The reverse double channel design of the inner flow channels 22 and the outer flow channels 23 cooperates with the preliminary cooling effect of the cooling box 27 to avoid local overheating of the cooling liquid, so that the temperature difference of each region inside the server box body 11 is controlled within 5℃, the core hardware of the server 1 is effectively protected from temperature fluctuations, and the service life of the equipment is prolonged.
[0026] In the embodiment, the cooling liquid outlet of the circulating water pump 211 is connected with one end of the cold flow pipe 212; the heat exchange fan fin mechanism 29 and the circulating water pump 211 are connected with the outer surface of the upper left side of the server box body 11; The rear side of the server box body 11 is arranged in an up-down manner and is provided with four groups of heat dissipation grilles 12; each heat dissipation grille 12 is provided with a heat absorbing fan 13 at the rear side, and the heat absorbing fan 13 is fixedly connected with the outer surface of the rear side of the server box body 11; each heat dissipation grille 12 is provided with a coil type heat exchange pipe 21 at the front side, and the coil type heat exchange pipe 21 is connected with the inside of the rear side of the server box body 11 through the symmetrically arranged mounting seat 25.
[0027] By adopting the above technical scheme, the heat exchange pipe 21 is arranged in a four-layer series coil type, and is matched with the rectangular array heat exchange fin 24 to greatly increase the heat exchange area; the inner flow channel 22 and the outer flow channel 23 flow in opposite directions to form cooperative heat exchange, and are matched with the double strengthening of the heat absorbing fan 13 and the heat exchange fan fin mechanism 29, so that the heat dissipation efficiency is improved compared with the traditional air cooling and single liquid cooling scheme, and the high load heat dissipation requirement of the server 1 is fully met.
[0028] The working principle of the application is that: the heat generated by the server 1 running diffuses to the rear side of the server box body 11, and the four-layer coil type heat exchange pipe 21 at the front side of the heat dissipation grille 12 plays a core heat exchange role; the cooling liquid in the outer flow channel 23 on the heat exchange pipe 21 is matched with the rectangular array heat exchange fin 24, and under the suction action of the heat absorbing fan 13, the hot air in the server 1 flows quickly through the heat exchange fin 24 and the surface of the heat exchange pipe 21 through the heat dissipation grille 12, and the heat is transferred to the cooling liquid in the outer flow channel 23 through heat conduction, and the preliminary heat dissipation is completed; The cooling liquid in the outer flow channel 23 flows from top to bottom in the four-layer coil type heat exchange pipe 21, and the temperature rises after absorbing heat, and flows through the cooling tank 27 at the bottom for preliminary cooling; at the same time, the cooling liquid in the inner flow channel 22 flows from bottom to top, and because the inner flow channel 22 is located on the inside of the outer flow channel 23, the cooling liquid in the inner flow channel 22 at low temperature and the cooling liquid in the outer flow channel 23 at high temperature form opposite heat exchange, and the temperature of the cooling liquid in the outer flow channel 23 is further reduced; when the cooling liquid in the outer flow channel 23 flows through the cooling tank 27, it will flow into the inner flow channel 22 to complete medium replenishment and heat exchange strengthening; wherein the four-layer heat exchange pipe 21 is connected in series through the transition connecting pipe 26, and the transition connecting pipe 26 also adopts a double-channel design to ensure smooth flow of the cooling liquid; the cooling liquid in the inner flow channel 22 after absorbing heat flows to the upper end, enters the heat exchange fan fin mechanism 29 through the heat flow pipe 28, is cooled by secondary forced cooling, and is introduced into the circulating water pump 211 through the backflow pipe 210, and is re-injected into the outer flow channel 23 through the cold flow pipe 212 under the power action of the circulating water pump 211, to form a complete liquid cooling inner circulation; The heat exchange pipe 21 adopts four-layer series connection coil type arrangement, and is matched with the rectangular array heat exchange fin 24 to greatly increase the heat exchange area; the inner flow channel 22 and the outer flow channel 23 flow reversely to form cooperative heat exchange, and are matched with the double strengthening of the heat absorption fan 13 and the heat exchange fan fin mechanism 29, so that the heat dissipation efficiency is improved compared with the traditional air cooling and single liquid cooling scheme, and the high load heat dissipation requirement of the server 1 is fully met; The self-heat exchange design of the inner flow channel 22 and the outer flow channel 23 reduces the load of the external cooling equipment, and the circulating water pump 211 is matched with the heat absorption fan 13, so that the overall energy consumption is reduced compared with the traditional liquid cooling system, the green energy-saving requirement of the data center is met, and the long-term operation cost of the server 1 is reduced; The reverse double-channel design of the inner flow channel 22 and the outer flow channel 23 is matched with the preliminary cooling effect of the cooling box 27, the local overheating of the cooling liquid is avoided, the temperature difference of each region in the server box body 11 is controlled to be less than 5 DEG C, the core hardware of the server 1 is effectively protected from the temperature fluctuation, and the service life of the equipment is prolonged.
[0029] For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.
[0030] In addition, it should be understood that although the present application is described in the specification, each embodiment only contains one independent technical solution, and the description manner of the specification is only for the sake of clarity, and the skilled person should regard the specification as a whole, and the technical solutions in each embodiment can be combined to form other embodiments that can be understood by the skilled person.
Claims
1. A liquid cooling heat dissipation inner circulation structure of a server, characterized in that: include Server (1), which is equipped with a liquid cooling heat dissipation internal circulation mechanism (2). The liquid cooling heat dissipation internal circulation mechanism (2) includes heat exchange tubes (21), which are arranged in a meandering flow coil and are arranged in four layers in series. The heat exchange tubes (21) are provided with an inner flow channel (22) and an outer flow channel (23), with the inner flow channel (22) located inside the outer flow channel (23). Each layer of coiled heat exchange tubes (21) is equipped with heat exchange fins (24) in a rectangular array, and each layer of coiled heat exchange tubes (21) is symmetrically equipped with mounting bases (25) at both ends.
2. The liquid cooling heat dissipation inner circulation structure of a server according to claim 1, characterized in that: Each layer of coiled heat exchange tubes (21) is connected to a transition connecting tube (26). The transition connecting tube (26) also adopts a dual-channel design and is integrated with the heat exchange tube (21). The lower end of the bottom layer of coiled heat exchange tubes (21) is fixedly connected to the cooling box (27).
3. The liquid cooling heat dissipation inner circulation structure of a server according to claim 2, characterized in that: The cooling box (27) is connected to the lower rear end of the server housing (11); the inner flow channel (22) and outer flow channel (23) at the end of the uppermost coiled heat exchange tube (21) pass through the upper rear end of the server housing (11) and branch out into a hot flow tube (28) and a cold flow tube (212) respectively.
4. The liquid cooling heat dissipation inner circulation structure of the server according to claim 3, characterized in that: The heat flow pipe (28) is connected to the coolant inlet of the heat exchange fan fin mechanism (29), the coolant outlet of the heat exchange fan fin mechanism (29) is connected to the return pipe (210), and the other end of the return pipe (210) is connected to the coolant inlet of the circulating water pump (211).
5. The liquid cooling internal circulation structure of the server according to claim 4, characterized in that: The coolant outlet of the circulating water pump (211) is connected to one end of the cold flow pipe (212); the heat exchange fan fin mechanism (29) and the circulating water pump (211) are connected to the outer surface of the upper left side of the server chassis (11).
6. The liquid cooling internal circulation structure of the server according to claim 5, characterized in that: The server chassis (11) has four sets of heat dissipation grilles (12) arranged vertically on the rear side. Each set of heat dissipation grilles (12) is equipped with a heat absorption fan (13) on the rear side. The heat absorption fan (13) is fixedly connected to the outer surface of the rear side of the server chassis (11). Each set of heat dissipation grilles (12) is equipped with a coiled heat exchange tube (21) on the front side. The coiled heat exchange tube (21) is connected to the interior of the rear side of the server chassis (11) through symmetrically arranged mounting seats (25).