Water cooling assembly and electronic equipment

Abstract

The invention discloses a water cooling assembly and electronic equipment, the water cooling assembly comprises a first part used for exchanging heat with a heating component, a first cavity of the first part is provided with a plurality of heat dissipation channels for heat dissipation media to flow, first inlets and first outlets of the heat dissipation channels are arranged along a first direction, and second inlets and second outlets of the heat dissipation channels are arranged along a second direction; the first inlets of the plurality of heat dissipation channels are arranged along a second direction; the second part is provided with a second cavity used for communicating the heat dissipation medium inlet with the first cavity; the heat dissipation medium enters the second cavity from the heat dissipation medium inlet, can flow in the second direction, enters the first cavity in the first direction after meeting the dispersion condition, and is shunted by the plurality of first inlets to enter different heat dissipation channels; under the condition that the heat dissipation medium in the second cavity meets the dispersion condition, the amount of the heat dissipation medium contained in different parts of the second cavity in the second direction meets the same condition, and the different parts correspond to the first inlets of the different heat dissipation channels in the first direction.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a water-cooling component and electronic equipment. Background Technology

[0002] As the performance of electronic devices increases, their heat dissipation requirements also increase. Summary of the Invention

[0003] In view of this, this application provides a water-cooling component and an electronic device.

[0004] A water-cooled component, comprising:

[0005] The first part is used for heat exchange with the heat-generating component. The first cavity of the first part has a plurality of heat dissipation channels for the flow of heat dissipation medium. The first inlet and the first outlet of the heat dissipation channel are arranged along a first direction, and the first inlets of the plurality of heat dissipation channels are arranged along a second direction.

[0006] The second part has a second cavity for connecting the heat dissipation medium inlet to the first cavity;

[0007] in,

[0008] The heat dissipation medium enters the second cavity through the heat dissipation medium inlet and can flow along the second direction. After meeting the dispersion conditions, it enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets.

[0009] When the dispersion condition is met, the amount of heat dissipation medium contained in different parts of the second cavity along the second direction meets the same condition, and the different parts along the first direction correspond to the first inlet of different heat dissipation channels.

[0010] Optionally, in the above-mentioned water-cooling assembly, the second cavity has a first region and a second region, and the heat dissipation medium entering the second cavity from the heat dissipation medium inlet passes through the first region and the second region in sequence;

[0011] in,

[0012] In the first region, the heat dissipation medium flows along the second direction to satisfy the dispersion condition;

[0013] In the second region, the heat dissipation medium enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets.

[0014] Optionally, in the above-mentioned water-cooling assembly, the height of the first region is lower than the height of the second region and / or the bottom surface of the first cavity;

[0015] And / or, the first region, the second region, and the first cavity are arranged along the first direction.

[0016] Optionally, in the above-mentioned water-cooling assembly, the first region has a plurality of first plates;

[0017] The first plate has at least one surface that is in heat exchange contact with the heat dissipation medium;

[0018] And / or, a plurality of the first plates are arranged along the first direction and the first plates extend along the second direction, the surfaces of two adjacent first plates and the cavity wall of the second cavity form a first fluid channel, the first fluid channel having a first opening toward the second region, so that the heat dissipation medium in the first fluid channel can flow into the second region through the first opening.

[0019] Optionally, in the above-mentioned water-cooling assembly, the first region has a mixing zone that connects the heat dissipation medium inlet and the first fluid tank, so that the heat dissipation medium entering the mixing zone from the heat dissipation medium inlet flows into the first fluid tank;

[0020] Along the arrangement direction of the first region and the second region, the projection of the mixing region at least partially overlaps with the projection of the second region;

[0021] The second cavity has a first partition located between the mixing zone and the second region, and the first partition and the first opening are coplanar.

[0022] Optionally, the above-mentioned water-cooling component includes a third part, wherein the third part and the second part are respectively located on both sides of the first part, the third part has a third cavity that connects the heat dissipation medium outlet of the water-cooling component with the first cavity, and the flow rate of the heat dissipation medium outlet is greater than or equal to the total flow rate of the plurality of heat dissipation channels.

[0023] The first outlet of the plurality of heat dissipation channels is connected to the third cavity, so that the heat dissipation medium in the different heat dissipation channels flows into the third cavity.

[0024] Optionally, in the above-mentioned water-cooling assembly, the third cavity has a third region and a fourth region, and the heat dissipation medium flowing from the heat dissipation channel to the heat dissipation medium outlet passes through the third region and the fourth region in sequence.

[0025] in,

[0026] In the third region, the heat dissipation medium flows in from the first outlet of the plurality of heat dissipation channels and flows into the fourth region;

[0027] In the fourth region, the heat dissipation medium flows in the same direction so that the heat dissipation medium converges and flows out from the heat dissipation medium outlet.

[0028] Optionally, in the above-mentioned water-cooling assembly, the height of the fourth region is lower than that of the third region and / or the bottom surface of the first cavity;

[0029] And / or, the first cavity, the third region, and the fourth region are arranged along the first direction.

[0030] Optionally, in the above-mentioned water-cooling assembly, the fourth region has a plurality of second plates;

[0031] The second plate has at least one surface that is in heat exchange contact with the heat dissipation medium;

[0032] And / or, the surfaces of two adjacent second plates and the cavity wall of the third cavity form a second fluid channel, the second fluid channel being able to guide the heat dissipation medium to converge to the heat dissipation medium outlet, the second fluid channel having a second opening facing the third region, so that the heat dissipation medium in the third region can flow into the second fluid channel through the second opening.

[0033] Optionally, in the above-mentioned water-cooling assembly, the fourth region has a converging area that connects the heat dissipation medium outlet and the second fluid tank, so that the heat dissipation medium in the second fluid tank converges to the converging area and then flows out from the heat dissipation medium outlet.

[0034] Optionally, in the above-mentioned water-cooling assembly, along the arrangement direction of the third region and the fourth region, the projection of the convergence area at least partially overlaps with the projection of the third region;

[0035] The third cavity has a second partition located between the convergence area and the third region, and the second partition and the second opening are coplanar.

[0036] Optionally, in the above-mentioned water-cooling assembly, the heat dissipation medium inlet is located on the bottom or side of the second cavity.

[0037] Optionally, in the above-mentioned water-cooling assembly, the water-cooling assembly includes a first component and a second component, the first component and the second component forming a main cavity including the first cavity and the second cavity;

[0038] The first component includes a first base plate corresponding to the first cavity, a second base plate corresponding to the second cavity, and a side plate connecting the first base plate and the second base plate. The first base plate and the second base plate have a distance between them along the second direction.

[0039] The surfaces of the first base plate, the side plate, and the second base plate facing away from the second component form a space for accommodating the heating component; and / or,

[0040] The second base plate has a fixing connection for fixing the water-cooling assembly; and / or,

[0041] The first cavity has a plurality of heat dissipation plates arranged along the second direction, and two adjacent heat dissipation plates and the cavity wall of the first cavity form the heat dissipation channel.

[0042] This application also provides a cooling structure, including:

[0043] Thermally conductive components;

[0044] A water-cooled assembly, wherein the water-cooled assembly is capable of heat exchange with the heat-generating component through the heat-conducting component, the water-cooled assembly comprising:

[0045] The first part is used for heat exchange with the heat-conducting component. The first cavity of the first part has a plurality of heat dissipation channels for the flow of heat dissipation medium. The first inlet and the first outlet of the heat dissipation channel are arranged along a first direction, and the first inlets of the plurality of heat dissipation channels are arranged along a second direction.

[0046] The second part is arranged along the first direction with the first part, and the second part has a second cavity for communicating a heat dissipation medium inlet with the first cavity;

[0047] in,

[0048] The heat dissipation medium enters the second cavity through the heat dissipation medium inlet and can flow along the second direction. After meeting the dispersion conditions, it enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets.

[0049] When the dispersion condition is met, the amount of heat dissipation medium contained in different parts of the second cavity along the second direction meets the same condition, and the different parts along the first direction correspond to the first inlet of different heat dissipation channels.

[0050] Optionally, in the above cooling structure, the heat-conducting component is a phase-conducting heat-conducting component;

[0051] And / or, the heat-conducting component has a first position for contacting the heat-generating component and a second position for contacting the water-cooling assembly, wherein the first position and the second position satisfy an adjacent condition.

[0052] This application also provides an electronic device, including:

[0053] Heating components;

[0054] Thermally conductive components;

[0055] A water-cooled assembly, which is capable of exchanging heat with a heat-generating component through a heat-conducting component, and the water-cooled assembly is located on the side of the heat-conducting component that faces away from the heat-generating component;

[0056] The water-cooling assembly includes:

[0057] The first part is used for heat exchange with the heat-conducting component. The first cavity of the first part has a plurality of heat dissipation channels for the flow of heat dissipation medium. The first inlet and the first outlet of the heat dissipation channel are arranged along a first direction, and the first inlets of the plurality of heat dissipation channels are arranged along a second direction.

[0058] The second part has a second cavity for connecting the heat dissipation medium inlet to the first cavity;

[0059] in,

[0060] The heat dissipation medium enters the second cavity through the heat dissipation medium inlet and can flow along the second direction. After meeting the dispersion conditions, it enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets.

[0061] When the dispersion condition is met, the amount of heat dissipation medium contained in different parts of the second cavity along the second direction meets the same condition, and the different parts along the first direction correspond to the first inlet of different heat dissipation channels.

[0062] Optionally, in the above-mentioned electronic device, the electronic device has a support surface for contacting the support platform;

[0063] The arrangement direction of the plurality of heat dissipation channels satisfies the condition of parallelism with the support surface. Attached Figure Description

[0064] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0065] Figure 1 This is a schematic diagram of the structure of the water-cooling assembly and heat-conducting component provided in the embodiments of this application;

[0066] Figure 2 A perspective view of the water-cooling assembly and heat-conducting component provided in the embodiments of this application;

[0067] Figure 3 This is a schematic diagram of the internal structure of the water-cooling assembly provided in the embodiments of this application;

[0068] Figure 4 This is a first structural schematic diagram of the water-cooling assembly provided in an embodiment of this application;

[0069] Figure 5 This is a schematic diagram of the structure of the water-cooling assembly provided in the embodiments of this application, with the second component removed.

[0070] Figure 6 A cross-sectional view of the water-cooling assembly provided in an embodiment of this application;

[0071] Figure 7 A schematic diagram of the principle structure of the water-cooling component provided in the embodiments of this application;

[0072] Figure 8 This is a schematic diagram of the second structure of the water-cooling assembly provided in an embodiment of this application.

[0073] in,

[0074] Thermal conductive components-100;

[0075] Water-cooled assembly - 200, heat dissipation medium inlet - 201, heat dissipation medium outlet - 202, first component - 203, first base plate - 2031, second base plate - 2032, third base plate - 2033, side plate - 2034, fixed connection part - 2035, second component - 204, first part - 210, first cavity - 211, heat dissipation channel - 212, first inlet - 2121, first outlet - 2122, heat dissipation plate - 213 Part 2-220, Second cavity-221, First region-2211, Second region-2212, First plate-222, First fluid tank-223, Mixing zone-224, Part 3-230, Third cavity-231, Third region-2311, Fourth region-2312, Second plate-232, Second fluid tank-233, Convergence zone-234, First direction-X, Second direction-Y, Dispersion condition region-K. Detailed Implementation

[0076] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0077] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0078] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0079] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0080] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0081] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0082] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0083] The inventors discovered that current cooling methods, including air cooling and water cooling, are limited by noise and space constraints, resulting in limited improvement in heat dissipation. Conventional water-cooled plates employ a manifold-like microchannel system, with multiple microchannels containing flowing heat dissipation fluid (such as coolant). The uniformity of the heat dissipation fluid flow within these microchannels significantly impacts the water-cooled plate's cooling performance. Due to the structural limitations of the inlet manifold design in conventional water-cooled plates, the heat dissipation fluid is split from the inlet manifold to the multiple microchannels, easily leading to uneven flow within each microchannel and reducing the flow stability of the heat dissipation fluid, thus affecting the water-cooled plate's cooling effect.

[0084] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown in the figure, this application embodiment provides a water-cooling component 200, including a first part 210 and a second part 220. The first part 210 is used for heat exchange with a heat-generating component. The heat-generating component can directly or indirectly exchange heat with the first part 210. The first cavity 211 of the first part 210 has multiple heat dissipation channels 212 for the flow of heat dissipation medium. The heat dissipation channels 212 can be microchannels or conventional channels (non-microchannels). The first inlet 2121 and the first outlet 2122 of the heat dissipation channels 212 are arranged along a first direction X, and the first inlets 2121 of the multiple heat dissipation channels 212 are arranged along a second direction Y. The second part 220 and the first part 210 can be arranged along the first direction X, or they can be arranged along other directions. The second part 220 has a second cavity 221 for connecting the heat dissipation medium inlet 201 and the first cavity 211.

[0085] The heat dissipation medium enters the second cavity 221 through the heat dissipation medium inlet 201 and flows along the second direction Y. After meeting the dispersion conditions, it enters the first cavity 211 along the first direction X and is then diverted into different heat dissipation channels 212 by multiple first inlets 2121. The dispersion conditions may include the uniformity of dispersion, the amount of dispersion, and the stability of the heat dissipation medium along the second direction Y in the second cavity 221. When the heat dissipation medium in the second cavity 221 meets the dispersion conditions, different parts of the second cavity 221 along the second direction Y (e.g., ...) Figure 6 and Figure 7 As shown, the portion of the first inlet 2121 corresponding to different heat dissipation channels 212 along the first direction X; and / or, the amount of heat dissipation medium contained along the first inlet 2121 of different heat dissipation channels 212 that meets the coplanar condition meets the same condition (such as being the same or substantially the same). That is, the heat dissipation medium that meets the dispersion condition in the second cavity 221 can be located in the dispersion condition region K, so that the heat dissipation medium in the second cavity 221 can flow uniformly or nearly uniformly to the first inlet 2121 of the multiple heat dissipation channels 212 after entering the first cavity 211 along the first direction X, thereby improving the uniformity of the heat dissipation fluid in the multiple heat dissipation channels 212; and, since the first inlet 2121 of the multiple heat dissipation channels 212 is arranged along the second direction Y, the flow of the heat dissipation medium into the second cavity 221 along the second direction Y can make different diverted fluids (flowing to the first inlet 2121 of different heat dissipation channels 212 respectively) enter the first inlet 2121 of different heat dissipation channels 212 at different positions along the second direction Y, avoiding mutual interference between different diverted fluids during the diversion of heat dissipation fluid, thus improving the flow stability of the heat dissipation fluid, improving the heat exchange effect between the first part 210 and the heat-generating component, and improving the heat dissipation effect on the heat-generating component.

[0086] By setting a second cavity 221 between the heat dissipation medium inlet 201 and the first cavity 211, the second cavity 221 serves as a transition cavity before the heat dissipation medium flows into the first cavity 211. This allows the heat dissipation medium to flow synchronously into multiple heat dissipation channels 212, avoiding problems such as the order of flow and mutual interference between the flow media when the heat dissipation medium flows directly from one heat dissipation medium inlet 201 to multiple heat dissipation channels 212. This effectively improves the uniformity of the flow of the heat dissipation medium into multiple heat dissipation channels 212 and avoids the flow stability being affected by mutual interference between the flow media.

[0087] The second part 220 and the first part 210 can be arranged along the first direction X, which makes the second cavity 221 and the first cavity 211 arranged along the first direction X. That is, after the heat dissipation medium flows along the second direction Y in the second cavity 221 and meets the dispersion condition, it can flow into the multiple heat dissipation channels of the first cavity 211 along the first direction X. The width edge of the second cavity 221 can be made to coincide with the width edge of the first cavity 211 (such as coinciding or approximately coinciding), where the width edge is the dimension of the cavity along the second direction Y, so that the heat dissipation medium in the second cavity 221 can flow along the first direction X to the first cavity 211 during the process of flowing along the first direction X.

[0088] The first direction X and the second direction Y can be perpendicular to each other, or they can be at other angles (such as 30°, 60° or 80°).

[0089] In some embodiments, the second cavity 221 has a first region 2211 and a second region 2212. The heat dissipation medium entering the second cavity 221 through the heat dissipation medium inlet 201 passes through the first region 2211 and the second region 2212 in sequence. That is, the second cavity 221 is divided into the first region 2211 and the second region 2212, which allows the heat dissipation medium inlet 201 to communicate with the first region 2211, and the first inlet 2121 of the multiple heat dissipation channels 212 to communicate with the second region 2212. The first region 2211 and the second region 2212 can be distinguished based on the physical structure of the second cavity 221 or the second part 220, or the first region 2211 and the second region 2212 can be regions located at different positions in the second cavity 221.

[0090] The principle of fluid flow is that, under the constraints of the laws of conservation of mass, momentum, and energy, the fluid is driven by pressure, gravity, and viscous forces. That is, the factors affecting the flow of the heat dissipation medium can include pressure and gravity, with pressure playing a dominant role. The flow channel structure (including the first cavity 211, the second cavity 221, and the heat dissipation channel 212) can be adjusted so that the heat dissipation medium passes through the first region before passing through the second region.

[0091] For example, the flow area of ​​the second cavity 221 is larger than the flow area of ​​a single heat dissipation channel 212. Under pressure, the fluid (heat dissipation medium) first flows into a relatively open area (such as the second cavity 221) and then flows into the heat dissipation channel 212 of the first cavity 211. Through the arrangement of the flow channel structure, the fluid, as the heat dissipation medium, passes through the second cavity 221 and the first cavity 211 in sequence, and the flow order of the fluid is less dependent on gravity.

[0092] This also avoids the limitation that the water-cooled component 200 must be used at a specific angle (such as in a horizontal position). The direction of fluid flow is not constrained by the direction of gravity, but is dominated by stronger driving forces such as pressure difference, flowing in any desired direction.

[0093] In the first region 2211, the heat dissipation medium flows along the second direction Y so that the heat dissipation medium meets the dispersion condition; that is, the heat dissipation medium in the first region 2211 flows along the second direction Y so that the amount (such as flow rate or mass) of the heat dissipation medium at different positions along the second direction Y in the first region 2211 meets the same condition.

[0094] In the second region 2212, the heat dissipation medium enters the first cavity 211 along the first direction X and is diverted into different heat dissipation channels 212 by multiple first inlets 2121. The second region 2212 can connect the first region 2211 and the first cavity 211, so that the heat dissipation medium that meets the dispersion conditions in the first region 2211 can flow into the first cavity 211 along the first direction X through the second region 2212, so that the heat dissipation medium can be evenly or nearly evenly diverted into the multiple heat dissipation channels 212 after flowing into the first cavity 211.

[0095] The height of the first region 2211 can be lower than the height of the second region 2212. That is, as the amount of heat dissipation medium entering the first region 2211 increases, the liquid level of the heat dissipation medium can rise, allowing it to enter the second region 2212 and flow from the second region 2212 into the first cavity 211. Alternatively, the height of the first region 2211 can be lower than the bottom surface of the first cavity 211. As the amount of heat dissipation medium entering the first region 2211 increases, the liquid level of the heat dissipation medium can rise, allowing it to enter the second region 2212 and then flow through the second region 2212 into the first cavity 211. Finally, the height of the first region 2211 can be no lower than the height of the second region 2212. For example, if the height of the first region 2211 is equal to the height of the second region 2212, the heat dissipation medium enters the first region 2211, passes through the second region 2212, and then enters the first cavity 211.

[0096] In other embodiments, the first region 2211, the second region 2212, and the first cavity 211 can be arranged along the first direction X. That is, the heat dissipation medium can enter the first region 2211 and flow along the second direction Y. Under the condition that the heat dissipation medium meets the dispersion conditions, it passes through the second region 2212 and enters the first cavity 211 along the first direction X. Wherein, the first region 2211, the second region 2212, and the first cavity 211 are arranged along the first direction X, so that the overall flow direction of the heat dissipation medium is the first direction X. After entering the first region 2211, it will flow along the second direction Y. That is, by adjusting the flow channel structure, the fluid (heat dissipation medium) can flow from the first region 2211 through the second region 2212 into the first cavity 211 under pressure and other factors.

[0097] The first direction X can be at a certain angle to the height direction (such as being perpendicular to each other or forming an angle of 30°, 60° or 85°). Since the first region 2211, the second region 2212 and the first cavity 211 are arranged along the first direction X, the height of the first region 2211 can be the same as or different from the height of the second region 2212, and the bottom surface of the first cavity 211 can also be higher than, equal to or lower than the height of the aforementioned region (first region 2211 or second region 2212).

[0098] To improve heat exchange efficiency, the first region 2211 can have multiple first plates 222; each first plate 222 has at least one surface in heat exchange contact with the heat dissipation medium. The first plate 222 can be a heat dissipation fin or other component capable of heat exchange contact with the heat dissipation medium. Figure 5 As shown, the heat dissipation medium flows in the direction indicated by the hollow arrow. Figure 6As shown, the first plate 222 has a surface facing the first direction X, and there may be a heat dissipation medium between two adjacent first plates 222. When the surface of the first plate 222 is in heat exchange contact with the heat dissipation medium, the heat exchange contact area between the second cavity 221 and the heat dissipation medium is effectively increased, thereby improving the heat exchange effect between the second part 220 and the heat dissipation medium.

[0099] In some embodiments, multiple first plates 222 can be arranged along a first direction X and extend along a second direction Y. The surfaces of two adjacent first plates 222 and the cavity wall of the second cavity 221 form a first fluid channel 223. The first fluid channel 223 has a first opening facing the second region 2212, so that the heat dissipation medium in the first fluid channel 223 can flow into the second region 2212 through the first opening. That is, the first plates 222 do not affect the flow of the heat dissipation medium along the second direction Y, and under the restriction effect of the first plates 222 on the heat dissipation medium, the first fluid channel 223 can guide the flow of the heat dissipation medium along the second direction Y, thereby improving the dispersion effect of the heat dissipation medium along the second direction Y.

[0100] The first region 2211 can have a mixing zone 224 connecting the heat dissipation medium inlet 201 and the first fluid tank 223, so that the heat dissipation medium entering the mixing zone 224 from the heat dissipation medium inlet 201 flows into the first fluid tank 223. The mixing zone 224 can be the portion of the first region 2211 where the first plate 222 is not located. It is understood that the mixing zone 224 can be an empty area; the heat dissipation medium entering the mixing zone 224 from the heat dissipation medium inlet 201 can mitigate the impact force of the heat dissipation medium, allowing it to flow uniformly or nearly uniformly into the different first fluid tanks 223.

[0101] Along the arrangement direction of the first region 2211 and the second region 2212, the projection of the mixing region 224 can at least partially coincide with the projection of the second region 2212. In an embodiment where the first region 2211 and the second region 2212 are arranged along the height direction, the second region 2212 can be positioned above the mixing region 224. To prevent the heat dissipation medium entering the mixing region 224 from directly flowing into the second region 2212, the second cavity 221 has a first partition (not shown) located between the mixing region 224 and the second region 2212, and the first partition and the first opening satisfy the coplanar condition. That is, after the heat dissipation medium enters the first fluid channel 223 from the mixing zone 224 and flows along the second direction Y, it can flow from the first opening of the first fluid channel 223 to the second region 2212. Since the first partition and the first opening satisfy the coplanar condition, the heat dissipation medium flowing out of the first opening can diffuse to the side of the first partition facing away from the mixing zone 224, thereby improving the uniformity of the distribution of the heat dissipation medium in the second region 2212 and further improving the uniformity of the heat dissipation medium entering different heat dissipation channels 212. Furthermore, it increases the flow rate of the heat dissipation medium passing through the first fluid channel 223, that is, it increases the flow rate of the heat dissipation medium in heat exchange contact with the first plate, thereby improving the heat dissipation effect of the second part 220.

[0102] In some embodiments, the water-cooling assembly 200 may include a third portion 230, which is located on both sides of the first portion 210, along with the second portion 220. The third portion 230 and the second portion 220 may be arranged symmetrically with respect to the first portion 210, or they may be arranged asymmetrically.

[0103] The third part 230 may have a third cavity 231 connecting the heat dissipation medium outlet 202 of the water-cooling component 200 and the first cavity 211. That is, the heat dissipation medium passes sequentially through the heat dissipation medium inlet 201, the second cavity 221, the first cavity 211, the third cavity 231, and the heat dissipation medium outlet 202. The flow rate of the heat dissipation medium outlet 202 may be greater than or equal to the total flow rate of the multiple heat dissipation channels 212. The first outlet 2122 of the multiple heat dissipation channels 212 may be connected to the third cavity 231, so that the heat dissipation medium in different heat dissipation channels 212 converges in the third cavity 231. With the above configuration, the heat dissipation medium in the multiple heat dissipation channels 212 converges in the third cavity 231 and flows out through the heat dissipation medium outlet 202. Since the flow rate of the heat dissipation medium outlet 202 can be greater than or equal to the total flow rate of the multiple heat dissipation channels 212, the accumulation of heat dissipation medium in the third cavity 231 is avoided. This ensures that the heat dissipation medium is not restricted by the structure of the heat dissipation medium outlet 202 or the third cavity 231 during its flow in the multiple heat dissipation channels 212, allowing the heat dissipation medium in the multiple heat dissipation channels 212 to flow smoothly.

[0104] The third part 230 can be made to have the same structure as the second part 220 and be symmetrically arranged with respect to the first part 210. That is, the solid structure of the third part 230 and the second part 220 can be the same or symmetrical.

[0105] In some embodiments, the third cavity 231 has a third region 2311 and a fourth region 2312, and the heat dissipation medium flowing from the heat dissipation channel 212 to the heat dissipation medium outlet 202 passes through the third region 2311 and the fourth region 2312 in sequence.

[0106] In the third region 2311, the heat dissipation medium flows into the fourth region 2312 through the first outlet 2122 of the multiple heat dissipation channels 212; the third region 2311 can be an empty structure without a solid structure, so as to avoid obstruction of the heat dissipation medium flowing out through the first outlet 2122 of the multiple heat dissipation channels 212.

[0107] Within the fourth region 2312, the heat dissipation medium flows in the same direction so that the heat dissipation medium converges and flows out from the heat dissipation medium outlet 202. A guiding structure may be provided within the fourth region 2312 to enable the heat dissipation medium to converge and flow towards the heat dissipation medium outlet 202.

[0108] This allows the height of the fourth region 2312 to be lower than that of the third region 2311. This means that the heat dissipation medium flowing into the third region 2311 can enter the fourth region 2312 under gravity and flow towards the heat dissipation medium outlet 202. When the channel formed by the fourth region 2312 and the third region 2311 satisfies the microchannel requirement, the influence of gravity is relatively small. As the amount of heat dissipation medium entering the third region 2311 increases, the heat dissipation medium can enter the fourth region 2312 and flow from the fourth region 2312 towards the heat dissipation medium outlet 202.

[0109] It is also possible to make the height of the fourth region 2312 lower than the bottom surface of the first cavity 211, so that the heat dissipation medium in the first cavity 211 (heat dissipation channel 212) can enter the fourth region 2312 under the action of gravity.

[0110] In other embodiments, the first cavity 211, the third region 2311, and the fourth region 2312 can be arranged along the first direction X. That is, by adjusting the flow channel structure, the fluid (heat dissipation medium) can flow from the first cavity 211 through the third region 2311 and into the fourth region 2312 under pressure or other factors. The arrangement of the first cavity 211, the third region 2311, and the fourth region 2312 along the first direction X ensures that the overall flow direction of the heat dissipation medium is the first direction X. After entering the fourth region 2312, the heat dissipation medium will flow in the same direction (e.g., along the second direction Y).

[0111] To improve heat exchange efficiency, the fourth region 2312 can have multiple second plates 232; each second plate 232 has at least one surface in heat exchange contact with the heat dissipation medium. The second plate 232 can be a heat dissipation fin or other component capable of contacting the heat dissipation medium. With the surface of the second plate 232 in heat exchange contact with the heat dissipation medium, the contact area between the third cavity 231 and the heat dissipation medium is effectively increased, thereby improving the heat exchange efficiency between the third part 230 and the heat dissipation medium.

[0112] In some embodiments, the surfaces of two adjacent second plates 232 and the cavity wall of the third cavity 231 can form a second fluid channel 233. The second fluid channel 233 can guide the heat dissipation medium to converge to the heat dissipation medium outlet 202. The second fluid channel 233 has a second opening facing the third region 2311 so that the heat dissipation medium in the third region 2311 can flow into the second fluid channel 233 through the second opening.

[0113] Taking the example that the heat dissipation medium flows along the second direction Y after entering the fourth region 2312, multiple second plates 232 can be arranged along the first direction X and extend along the second direction Y. The surfaces of two adjacent second plates 232 and the cavity wall of the third cavity 231 form a second fluid channel 233. The second fluid channel 233 has a second opening facing the second region 2212 so that the heat dissipation medium in the third region 2311 can flow into the second fluid channel 233 through the second opening. That is, the second plates 232 do not affect the flow of the heat dissipation medium along the second direction Y, and under the restriction effect of the second plates 232 on the heat dissipation medium, the second fluid channel 233 can guide the flow of the heat dissipation medium along the second direction Y, thereby improving the confluence effect of the heat dissipation medium along the second direction Y.

[0114] The fourth region 2312 may have a converging area 234 connecting the heat dissipation medium outlet 202 and the second fluid tank 233, so that the heat dissipation medium in the second fluid tank 233 converges to the converging area 234 and then flows out from the heat dissipation medium outlet 202. The converging area 234 may be the portion of the fourth region 2312 where the second plate 232 is not located. It is understood that the converging area 234 can be an empty area, allowing heat dissipation media from different second fluid tanks 233 to converge to the converging area 234, so that the converged heat dissipation media can flow out from the heat dissipation medium outlet 202.

[0115] Along the arrangement direction of the third region 2311 and the fourth region 2312, the projection of the convergence area 234 may at least partially coincide with the projection of the third region 2311. In an embodiment where the third region 2311 and the fourth region 2312 are arranged along the height direction, the third region 2311 may be positioned above the convergence area 234.

[0116] To prevent the heat dissipation medium in the third region 2311 from directly entering the converging region 234, the third cavity 231 has a second partition (not shown) located between the converging region 234 and the third region 2311. The second partition and the second opening are coplanar. That is, when the heat dissipation medium enters the third region 2311, the portion of the heat dissipation medium corresponding to the converging region 234 can be blocked by the side of the second partition facing away from the converging region 234. This allows the medium to flow from the third region 2311 into the second fluid channel 233 of the fourth region 2312 and flow in the same direction (such as the second direction Y) before converging into the converging region 234 and flowing out from the heat dissipation medium outlet 202. Since the second partition and the second opening are coplanar, the heat dissipation medium can flow along the side of the second partition facing away from the converging region 234 towards the second opening of the second fluid channel 233, increasing the flow rate of the heat dissipation medium through the second fluid channel 233, which in turn increases the flow rate of the heat dissipation medium in heat exchange contact with the second plate, thereby improving the heat dissipation effect of the third part 230.

[0117] The heat dissipation medium inlet 201 can be located on the bottom or side of the second cavity 221. The projection of the heat dissipation medium inlet 201 along the first direction X can be relatively independent of the projection of the first cavity 211; that is, even if the heat dissipation medium enters the second cavity 221 at a high flow rate, it cannot enter the first cavity 211 due to inertia.

[0118] like Figure 4 As shown, in some embodiments, the water-cooling assembly 200 includes a first component 203 and a second component 204, which together form a main cavity including a first cavity 211 and a second cavity 221. The heat dissipation medium inlet 201 and the heat dissipation medium outlet 202 are both connected to the first component 203, and the second component 204 can serve as a cover plate structure. The first component 203 may have a fixed connection portion 2035 to facilitate connection with the main body of the electronic device on which the water-cooling assembly 200 is mounted.

[0119] like Figure 5 and Figure 8 As shown, to further improve the heat exchange effect, the first component 203 includes a first base plate 2031 corresponding to the first cavity 211, a second base plate 2032 corresponding to the second cavity 221, and a side plate 2034 connecting the first base plate 2031 and the second base plate 2032. The first base plate 2031 and the second base plate 2032 are spaced apart along the second direction Y. The surfaces of the first base plate 2031, the side plate 2034, and the second base plate 2032 facing away from the second component 204 form a space for accommodating the heat-generating component. That is, the water-cooling assembly 200 forms a structure that encloses the heat-generating component, thereby effectively improving the heat exchange effect. Figure 1 and Figure 2As shown, the first cavity 211 of the water-cooling assembly 200 can be located on one side of the heat-generating component (such as the heat-conducting component 100 or a chip (not shown in the figure) shielded by the heat-conducting component 100), and the second cavity 221 and the third cavity 231 are located on both sides of the heat-generating component, so that the water-cooling assembly 200 partially encloses the heat-generating component.

[0120] The heat-generating component can be a chip or other directly heat-generating component, or a heat-conducting component 100 such as a heat pipe or vapor chamber (VC). The water-cooling assembly 200 can be connected (locked) to the motherboard or die-cast component of the electronic device, with the heat pipe or VC directly contacting the chip or other directly heat-generating component, using two phases to remove heat from the component.

[0121] The second base plate 2032 can have a fixing connection portion 2035 for fixing the water-cooling assembly 200. The structure of the fixing connection portion 2035 can be determined according to the structure of the heat-generating component, allowing the fixing connection portion 2035 to connect to other structures of the electronic device (such as the motherboard, housing, or die-cast parts) without the heat-generating component being connected. The fixing connection portion 2035 can be a through hole or a threaded hole to facilitate connection using screws or bolts.

[0122] The first cavity 211 has a plurality of heat dissipation plates 213 arranged along the second direction Y, and two adjacent heat dissipation plates 213 and the cavity wall of the first cavity 211 form a heat dissipation channel 212. The heat dissipation plates 213 may be heat dissipation fins or other components that can exchange heat with the heat dissipation medium.

[0123] The first component 203 also includes a third base plate 2033 corresponding to the third cavity 231. The third base plate 2033 is connected to the first base plate 2031 through a side plate 2034. The third base plate 2033 and the second base plate 2032 can be symmetrically arranged on both sides of the first base plate 2031. The second base plate 2032, one side plate 2034, the first base plate 2031, the other side plate 2034 and the third base plate 2033 form a groove structure on the side facing away from the second component 204, which forms a space to accommodate the heating component.

[0124] The third base plate 2033 may also have a fixing connection part 2035 for fixing the water-cooling assembly 200.

[0125] This application also discloses a cooling structure, including a heat-conducting component 100 and a water-cooling assembly 200. The heat-conducting component 100 can be a heat pipe or a VC, etc., and the heat-generating component can be a chip or other components. The water-cooling assembly 200 can exchange heat with the heat-generating component through the heat-conducting component 100.

[0126] The water-cooling assembly 200 includes a first part 210 and a second part 220. The first part 210 is used for heat exchange with the heat-conducting component 100. The first cavity 211 of the first part 210 has at least two heat dissipation channels 212 for the flow of heat dissipation medium. The first inlet 2121 and the first outlet 2122 of the heat dissipation channels 212 are arranged along a first direction X, and the first inlets 2121 of the multiple heat dissipation channels 212 are arranged along a second direction Y. The second part 220 is arranged with the first part 210 along the first direction X. The second part 220 has a second cavity 221 that connects the heat dissipation medium inlet 201 of the water-cooling assembly 200 with the first cavity 211.

[0127] The heat dissipation medium enters the second cavity 221 through the heat dissipation medium inlet 201 and can flow along the second direction Y. After meeting the dispersion condition, it enters the first cavity 211 along the first direction X and is diverted into different heat dissipation channels 212 by multiple first inlets 2121.

[0128] Wherein, under the condition that the heat dissipation medium in the second cavity 221 meets the dispersion condition, the amount of heat dissipation medium contained in different parts of the second cavity 221 along the second direction Y meets the same condition (same or basically the same), and the different parts along the first direction X correspond to the first inlet 2121 of different heat dissipation channels 212.

[0129] With the above configuration, the heat dissipation medium in the second cavity 221 can flow uniformly or nearly uniformly to the first inlet 2121 of the multiple heat dissipation channels 212 after entering the first cavity 211 along the first direction X, thereby improving the uniformity of the heat dissipation fluid in the multiple heat dissipation channels 212. Furthermore, since the first inlets 2121 of the multiple heat dissipation channels 212 are arranged along the second direction Y, the flow of the heat dissipation medium into the second cavity 221 along the second direction Y allows different diverted fluids (flowing to the first inlet 2121 of different heat dissipation channels 212) to enter the first inlet 2121 of different heat dissipation channels 212 at different positions along the second direction Y. This avoids mutual interference between different diverted fluids during the diversion process, effectively improves the flow stability of the heat dissipation fluid, improves the heat exchange effect between the first part 210 and the heat-conducting component 100, and thus improves the heat dissipation effect on the heat-generating component.

[0130] The heat-conducting component 100 can be a variable-phase heat-conducting component. Alternatively, the heat-conducting component 100 can be a non-variable-phase heat-conducting component.

[0131] To further improve heat dissipation, the heat-conducting component 100 has a first position for contacting the heat-generating component and a second position for contacting the water-cooling assembly 200, wherein the first and second positions satisfy the condition of being adjacent. That is, the water-cooling assembly 200 is placed as close as possible to the area where heat is concentrated (the heat-generating component) in order to facilitate the removal of heat from the heat-generating component.

[0132] This application also provides an electronic device, which may include a heat-generating component, a heat-conducting component 100, and a water-cooling assembly 200. The heat-generating component can be disposed on the substrate of the electronic device (such as a motherboard or other board with components). The water-cooling assembly 200 can exchange heat with the heat-generating component through the heat-conducting component 100. The water-cooling assembly 200 can be located on the side of the heat-conducting component 100 away from the heat-generating component (e.g., the side of the heat-conducting component 100 away from the substrate). The water-cooling assembly 200 can be connected to the substrate on which the heat-generating component is disposed.

[0133] Among them, electronic devices can be laptops, mobile phones, game consoles, etc., and heat-generating components can be components that generate heat when the electronic device is in operation, such as chips or capacitors.

[0134] The water-cooling assembly 200 may include a first part 210 and a second part 220. The first part 210 is used for heat exchange with the heat-conducting component 100. The first cavity 211 of the first part 210 has at least two heat dissipation channels 212 for the flow of heat dissipation medium. The first inlet 2121 and the first outlet 2122 of the heat dissipation channels 212 are arranged along a first direction X, and the first inlets 2121 of the plurality of heat dissipation channels 212 are arranged along a second direction Y. The second part 220 is arranged with the first part 210 along the first direction X. The second part 220 has a second cavity 221 that connects the heat dissipation medium inlet 201 of the water-cooling assembly 200 with the first cavity 211.

[0135] in,

[0136] The heat dissipation medium enters the second cavity 221 through the heat dissipation medium inlet 201 and can flow along the second direction Y. After meeting the dispersion condition, it enters the first cavity 211 along the first direction X and is diverted into different heat dissipation channels 212 by multiple first inlets 2121.

[0137] Wherein, under the condition that the heat dissipation medium in the second cavity 221 meets the dispersion condition, the amount of heat dissipation medium contained in different parts of the second cavity 221 along the second direction Y meets the same condition (same or basically the same), and the different parts along the first direction X correspond to the first inlet 2121 of different heat dissipation channels 212.

[0138] With the above configuration, the heat dissipation medium in the second cavity 221 can flow uniformly or nearly uniformly to the first inlet 2121 of the multiple heat dissipation channels 212 after entering the first cavity 211 along the first direction X, thereby improving the uniformity of the heat dissipation fluid in the multiple heat dissipation channels 212. Furthermore, since the first inlets 2121 of the multiple heat dissipation channels 212 are arranged along the second direction Y, the flow of the heat dissipation medium into the second cavity 221 along the second direction Y allows different diverted fluids (flowing to the first inlet 2121 of different heat dissipation channels 212) to enter the first inlet 2121 of different heat dissipation channels 212 at different positions along the second direction Y. This avoids mutual interference between different diverted fluids during the diversion process, effectively improves the flow stability of the heat dissipation fluid, improves the heat exchange effect between the first part 210 and the heat-conducting component 100, and thus improves the heat dissipation effect on the heat-generating component.

[0139] In some embodiments, the electronic device has a support surface for contacting a support platform; the arrangement direction of the plurality of heat dissipation channels 212 satisfies the condition of parallelism with the support surface, that is, the arrangement direction of the plurality of heat dissipation channels 212 is parallel or approximately parallel to the support surface. Alternatively, the arrangement direction of the plurality of heat dissipation channels 212 may be set at a certain angle to the support surface, such as an angle of 30°, 60°, or 90° between the arrangement direction of the plurality of heat dissipation channels 212 and the support surface.

[0140] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0141] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A water-cooled assembly, comprising: The first part is used for heat exchange with the heat-generating component. The first cavity of the first part has a plurality of heat dissipation channels for the flow of heat dissipation medium. The first inlet and the first outlet of the heat dissipation channel are arranged along a first direction, and the first inlets of the plurality of heat dissipation channels are arranged along a second direction. The second part has a second cavity for connecting the heat dissipation medium inlet to the first cavity; in, The heat dissipation medium enters the second cavity through the heat dissipation medium inlet and can flow along the second direction. After meeting the dispersion conditions, it enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets. When the dispersion condition is met, the amount of heat dissipation medium contained in different parts of the second cavity along the second direction meets the same condition, and the different parts along the first direction correspond to the first inlet of different heat dissipation channels.

2. The water-cooling assembly as claimed in claim 1, wherein the second cavity has a first region and a second region, and the heat dissipation medium entering the second cavity from the heat dissipation medium inlet passes sequentially through the first region and the second region; in, In the first region, the heat dissipation medium flows along the second direction to satisfy the dispersion condition; In the second region, the heat dissipation medium enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets.

3. The water-cooling assembly as described in claim 2, wherein the height of the first region is lower than the height of the second region and / or the bottom surface of the first cavity; And / or, the first region, the second region, and the first cavity are arranged along the first direction.

4. The water-cooling assembly as described in claim 2, wherein the first region has a plurality of first plates; The first plate has at least one surface that is in heat exchange contact with the heat dissipation medium; And / or, a plurality of the first plates are arranged along the first direction and the first plates extend along the second direction, the surfaces of two adjacent first plates and the cavity wall of the second cavity form a first fluid channel, the first fluid channel having a first opening toward the second region, so that the heat dissipation medium in the first fluid channel can flow into the second region through the first opening.

5. The water-cooling assembly of claim 4, wherein the first region has a mixing zone connecting the heat dissipation medium inlet and the first fluid tank, so that the heat dissipation medium entering the mixing zone from the heat dissipation medium inlet flows into the first fluid tank; Along the arrangement direction of the first region and the second region, the projection of the mixing region at least partially overlaps with the projection of the second region; The second cavity has a first partition located between the mixing zone and the second region, and the first partition and the first opening are coplanar.

6. The water-cooling assembly as claimed in claim 1, comprising a third part, wherein the third part and the second part are respectively located on both sides of the first part, the third part having a third cavity communicating with the heat dissipation medium outlet of the water-cooling assembly and the first cavity, wherein the flow rate of the heat dissipation medium outlet is greater than or equal to the total flow rate of the plurality of heat dissipation channels; The first outlet of the plurality of heat dissipation channels is connected to the third cavity, so that the heat dissipation medium in the different heat dissipation channels flows into the third cavity.

7. The water-cooling assembly as claimed in claim 6, wherein the third cavity has a third region and a fourth region, and the heat dissipation medium flowing from the heat dissipation channel to the heat dissipation medium outlet passes sequentially through the third region and the fourth region; in, In the third region, the heat dissipation medium flows in from the first outlet of the plurality of heat dissipation channels and flows into the fourth region; In the fourth region, the heat dissipation medium flows in the same direction so that the heat dissipation medium converges and flows out from the heat dissipation medium outlet.

8. The water-cooling assembly as claimed in claim 7, wherein the fourth region has a plurality of second plates; The second plate has at least one surface that is in heat exchange contact with the heat dissipation medium; And / or, the surfaces of two adjacent second plates and the cavity wall of the third cavity form a second fluid channel, the second fluid channel being able to guide the heat dissipation medium to converge to the heat dissipation medium outlet, the second fluid channel having a second opening facing the third region, so that the heat dissipation medium in the third region can flow into the second fluid channel through the second opening.

9. The water-cooling assembly according to any one of claims 1-8, wherein the water-cooling assembly comprises a first component and a second component, the first component and the second component forming a main cavity including the first cavity and the second cavity; The first component includes a first base plate corresponding to the first cavity, a second base plate corresponding to the second cavity, and a side plate connecting the first base plate and the second base plate. The first base plate and the second base plate have a distance between them along the second direction. The surfaces of the first base plate, the side plate, and the second base plate facing away from the second component form a space for accommodating the heating component; and / or, The second base plate has a fixing connection for fixing the water-cooling assembly; and / or, The first cavity has a plurality of heat dissipation plates arranged along the second direction, and two adjacent heat dissipation plates and the cavity wall of the first cavity form the heat dissipation channel.

10. An electronic device, comprising: Heating components; Thermally conductive components; A water-cooled assembly, which is capable of exchanging heat with a heat-generating component through a heat-conducting component, and the water-cooled assembly is located on the side of the heat-conducting component that faces away from the heat-generating component; The water-cooling assembly includes: The first part is used for heat exchange with the heat-conducting component. The first cavity of the first part has a plurality of heat dissipation channels for the flow of heat dissipation medium. The first inlet and the first outlet of the heat dissipation channel are arranged along a first direction, and the first inlets of the plurality of heat dissipation channels are arranged along a second direction. The second part has a second cavity for connecting the heat dissipation medium inlet to the first cavity; in, The heat dissipation medium enters the second cavity through the heat dissipation medium inlet and can flow along the second direction. After meeting the dispersion conditions, it enters the first cavity along the first direction and is diverted into different heat dissipation channels by multiple first inlets. When the dispersion condition is met, the amount of heat dissipation medium contained in different parts of the second cavity along the second direction meets the same condition, and the different parts along the first direction correspond to the first inlet of different heat dissipation channels.

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