Liquid cooling module for heat dissipation of processor

Abstract

The invention relates to the technical field of heat dissipation of electronic components, in particular to a liquid cooling module for heat dissipation of a processor, the liquid cooling module comprises a heat conducting plate, a cover plate, a cooling cavity, a liquid inlet and a liquid outlet, the heat conducting plate is attached to a heating surface of the processor, the cooling cavity is defined by the heat conducting plate and the cover plate, and the liquid inlet is communicated with the liquid outlet. The liquid inlet and the liquid outlet are communicated with the two ends of the cooling cavity respectively, the liquid cooling module further comprises a partition plate, an upper heat dissipation area is formed between the partition plate and the cover plate, a lower heat dissipation area is formed between the partition plate and the heat conduction plate, and a first flow channel and a second flow channel which are independent of each other are arranged in the cooling cavity. The first flow channel comprises a front section flow channel and a rear section flow channel. According to the liquid cooling module, partition and distribution of the sub-runners of the cooling cavity are achieved through the partition plates, temperature gradient complementation is formed by cooling liquid in the upper heat dissipation area and the lower heat dissipation area, the front-section runner and the cooling section cooperatively cover the whole heat exchange area of the lower heat dissipation area, and the defect that an existing liquid cooling module is free of orientation and partition is overcome.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for electronic components, and in particular to a liquid cooling module for processor heat dissipation. Background Technology

[0002] With the rapid development of fields such as artificial intelligence, cloud computing, e-sports and data centers, the computing performance and integration of processors continue to break through, and the power density has also increased significantly. For example, the power consumption of high-end GPU processors has generally exceeded 300W, and the power consumption of professional-grade GPU processors has reached more than 500W. The heat dissipation requirements of processors are becoming increasingly severe.

[0003] Processor cooling methods mainly include air cooling and liquid cooling. Air cooling is limited by the low thermal conductivity of air, complex airflow organization, and high noise, making it difficult to meet the temperature control requirements of high power density scenarios. Therefore, in actual production, liquid cooling solutions are mostly used. The liquid cooling module has a cooling chamber inside, and one side of the liquid cooling module is directly attached to the processor. The heat generated by the processor is quickly transferred to the coolant in the cooling chamber through heat conduction. The cooling chamber has an inlet and an outlet to form a closed-loop flow path. It adopts a non-directional and non-zoned uniform design, which cannot perform differentiated and directional heat exchange for different temperature areas of the processor. This results in insufficient heat dissipation in the processor core area (high heat density area), which is prone to overheating, stuttering, performance degradation and other problems, making it difficult to adapt to the refined heat dissipation requirements of high power processors. Summary of the Invention

[0004] In order to achieve differentiated heat exchange for different temperature zones of the processor and to realize the directional flow and precise distribution of coolant, this application provides a liquid cooling module for processor heat dissipation.

[0005] This application provides a liquid cooling module for processor heat dissipation, which adopts the following technical solution: A liquid cooling module for processor heat dissipation includes a heat-conducting plate, a cover plate, a cooling cavity, a liquid inlet, and a liquid outlet. The heat-conducting plate is in contact with the heat-generating surface of the processor. The cooling cavity is formed by the heat-conducting plate and the cover plate. The liquid inlet and the liquid outlet are respectively connected to both ends of the cooling cavity. The liquid cooling module also includes a partition plate. An upper heat dissipation area is formed between the partition plate and the cover plate, and a lower heat dissipation area is formed between the partition plate and the heat-conducting plate. The cooling cavity has independent first and second flow channels. The first flow channel includes a front flow channel and a rear flow channel, and the front flow channel is located in the lower flow channel. The hot zone is located on the side near the liquid inlet to exchange heat with the front section of the heat-conducting plate. The end of the front section flow channel away from the liquid inlet bends upward and connects to the rear section flow channel. The rear section flow channel is located on the side of the upper heat dissipation area near the liquid outlet to discharge the heated coolant. The second flow channel includes a supply section and a cooling section connected end to end. The supply section is located on the side of the upper heat dissipation area near the liquid inlet to introduce coolant. The cooling section is located on the side of the lower heat dissipation area near the liquid outlet to exchange heat with the rear section of the heat-conducting plate. The outlet end of the cooling section is connected to the liquid outlet.

[0006] By adopting the above technical solution, the coolant enters the cooling chamber through the inlet. Under the separation of the baffle, half of the coolant enters the upper heat dissipation zone, and the other half enters the lower heat dissipation zone. Because the heat-conducting plate is in contact with the processor's heat-generating surface, it directly absorbs the processor's heat. Therefore, the temperature in the lower heat dissipation zone is much higher than that in the upper heat dissipation zone. In the lower heat dissipation zone, the low-temperature coolant first enters through the inlet, completes heat exchange, and then exits through the outlet. Therefore, the temperature on the side of the lower heat dissipation zone near the outlet is much higher than the temperature on the side near the inlet. The coolant in the lower heat dissipation zone first enters the front flow channel, where it undergoes efficient heat exchange with the front area of ​​the heat-conducting plate. After heat exchange, the heated coolant bends upward through the front flow channel and enters the rear flow channel of the upper heat dissipation zone. The rear flow channel is connected to the outlet, and the coolant flows directly from the upper heat dissipation zone... The coolant near the outlet is discharged from the outlet. The coolant entering the upper heat dissipation zone first enters the supply section. Due to the obstruction of the baffle, the supply section does not directly participate in heat exchange. The coolant temperature in the supply section is much lower than that in the lower heat dissipation zone. The low-temperature coolant in the supply section then flows into the cooling section of the lower heat dissipation zone, where it exchanges heat efficiently with the rear section of the heat conduction plate. After heat exchange, it is discharged from the outlet. Compared with the existing technology, this solution uses baffles to achieve a partitioned and channeled layout of the cooling cavity, so that the coolant forms a complementary temperature gradient in the upper and lower heat dissipation zones. The front channel and the cooling section work together to cover the entire heat exchange area of ​​the lower heat dissipation zone. This solves the shortcomings of the existing liquid cooling module's non-directional, non-partitioned, and uniform design, improves the heat dissipation targeting, and adapts to the refined heat dissipation requirements of high-power processors.

[0007] Optionally, the lower heat dissipation zone is provided with a spiral pipe, the inlet of which is connected to the outlet of the liquid supply section, and the outlet of which is connected to the outlet of the front flow channel. The spiral pipe is located in the central area of ​​the heat-conducting plate to enhance the heat dissipation efficiency of the central area of ​​the heat-conducting plate.

[0008] By adopting the above technical solution, a spiral pipe is set in the lower heat dissipation area to introduce part of the low-temperature coolant from the liquid supply section into the spiral pipe. When the coolant flows in the spiral pipe, it fully contacts and exchanges heat with the central area of ​​the heat-conducting plate. After heat exchange, the coolant flows into the outlet of the front flow channel through the spiral pipe outlet, merges with the coolant in the front flow channel, and flows to the rear flow channel. Finally, it is discharged from the rear flow channel to the outlet. The spiral pipe is located in the central area of ​​the heat-conducting plate. The coolant inside the spiral pipe and the coolant in the front flow channel form a dual cooling path, which significantly enhances the heat exchange intensity of the high heat density area in the center of the heat-conducting plate and further improves the heat dissipation capability of the liquid cooling module for high-power processors.

[0009] Optionally, the lower heat dissipation area is equipped with fins, and a flow guiding gap is formed between the upper surface of the fins and the lower surface of the partition plate in the front flow channel. The flow guiding gap is used to accelerate the flow of the heated coolant in the front flow channel to the rear flow channel.

[0010] By adopting the above technical solution, fins are installed in the lower heat dissipation area. The fins can increase the contact area between the coolant and the heat conduction plate, thereby improving the heat exchange efficiency of the lower heat dissipation area. At the same time, a flow guiding gap is formed between the upper surface of the fins and the lower surface of the baffle in the front flow channel. While ensuring the heat dissipation function of the fins, a low-resistance channel is provided for the heated coolant, guiding it to quickly enter the rear flow channel, thereby optimizing the coolant flow direction and temperature distribution in the overall flow channel.

[0011] Optionally, an annular guide groove is formed between the spiral pipes, a flow-dividing channel is formed between the fins, and the spiral pipe has a groove for connecting the annular guide groove and the flow-dividing channel.

[0012] By adopting the above technical solution, an annular guide groove is formed between the spiral pipes, and a flow distribution channel is formed between the fins. The groove on the spiral pipe connects the annular guide groove and the flow distribution channel, so that the coolant in the front flow channel is interconnected between the flow distribution channel and the annular guide groove, forming a multi-directional flow path. This allows the coolant to be more evenly distributed and more fully heat-exchanged in the lower heat dissipation area, and the heat in the central area of ​​the heat conduction plate can be carried away more evenly and quickly, further enhancing the heat dissipation effect in the central area.

[0013] Optionally, the fins extend along the flow direction of the coolant, and the two ends of the fins are respectively provided with an inlet confluence area and an outlet confluence area on the inner wall of the two ends of the cooling cavity. The inlet confluence area is connected to the inlet port, and the outlet confluence area is connected to the outlet port.

[0014] By adopting the above technical solution, the liquid inlet and liquid outlet junction areas reserved between the two ends of the fins and the inner walls of the two ends of the cooling chamber can ensure that the low-temperature coolant introduced by the liquid inlet is evenly distributed in the liquid inlet junction area and flows into the distribution channel between the fins. At the same time, the coolant after heat exchange is collected in the liquid outlet junction area and discharged through the liquid outlet, thus ensuring the uniform distribution of coolant when it enters and the smooth collection when it exits.

[0015] Optionally, the baffle extends along the coolant flow direction, the end profile of the baffle near the inlet is adapted to the end profile of the fin near the inlet, and the end profile of the baffle near the outlet is adapted to the end profile of the fin near the outlet.

[0016] By adopting the above technical solution, the baffle ensures the effective separation of the upper heat dissipation area and the lower heat dissipation area. After the coolant flows in from the inlet, it flows smoothly into the upper heat dissipation area and the lower heat dissipation area along the matching contour of the baffle and the fins. After completing the heat exchange, it flows into the outlet confluence area without obstruction and is discharged from the outlet, further optimizing the effect of directional zoned heat dissipation.

[0017] Optionally, the spiral pipe is positioned at a height higher than the fins within the front flow channel, and the outer diameter of the spiral pipe is smaller than the width of the lower heat dissipation zone.

[0018] By adopting the above technical solution, a reasonable spatial layout is formed between the spiral pipe and the fins in the front flow channel. This avoids the spiral pipe from obstructing the normal flow of coolant in the front flow channel, while ensuring that the spiral pipe itself can stably achieve enhanced heat exchange in the central area of ​​the heat-conducting plate. This allows the enhanced heat dissipation in the center and the conventional heat dissipation in the front area to work together without interfering with each other, further improving the overall stability and uniformity of heat dissipation of the liquid cooling module.

[0019] Optionally, the partition plate has a first through hole and a second through hole. The first through hole is used to connect the front flow channel and the rear flow channel, and the second through hole is used to connect the liquid supply section and the cooling section. The first through hole is obliquely upward along the flow direction of the coolant, and the second through hole is obliquely downward along the flow direction of the coolant.

[0020] By adopting the above technical solution, the setting of the first through hole and the second through hole allows the cooled liquid that has been heated in the front flow channel to flow smoothly into the rear flow channel through the first through hole, and the low-temperature coolant in the supply section to flow smoothly to the cooling section through the second through hole. The inclined setting conforms to the flow direction of the coolant, reduces the flow resistance of the coolant, ensures the smoothness of directional heat exchange and flow guidance in the dual flow channels, and further improves the heat dissipation efficiency.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. This solution uses partitions to divide the cooling chamber into zones and flow channels, so that the coolant forms a complementary temperature gradient in the upper and lower heat dissipation zones. The front flow channel and the cooling section work together to cover the entire heat exchange area of ​​the lower heat dissipation zone, which solves the shortcomings of the existing liquid cooling module's non-directional, non-zoned, and uniform design, improves the heat dissipation targeting, and adapts to the refined heat dissipation requirements of high-power processors. 2. A portion of the low-temperature coolant in the supply section is introduced into the spiral pipe. When the coolant flows in the spiral pipe, it fully contacts and exchanges heat with the central area of ​​the heat-conducting plate. After heat exchange, the coolant flows into the outlet of the front flow channel through the spiral pipe outlet. After merging with the coolant in the front flow channel, it flows to the rear flow channel and is finally discharged to the outlet through the rear flow channel. The spiral pipe is located in the central area of ​​the heat-conducting plate, which can specifically enhance the heat dissipation efficiency of the central area of ​​the heat-conducting plate and further improve the heat dissipation capability of the liquid cooling module for high-power processors. 3. An annular guide groove is formed between the spiral pipes, and a flow distribution channel is formed between the fins. The grooves on the spiral pipes connect the annular guide groove and the flow distribution channel, so that the coolant in the front flow channel is interconnected between the flow distribution channel and the annular guide groove, forming a multi-directional flow path. This allows the coolant to be more evenly distributed and more fully heat-exchanged in the lower heat dissipation area, and the heat in the central area of ​​the heat conduction plate can be carried away more evenly and quickly, further enhancing the heat dissipation effect in the central area. Attached Figure Description

[0022] Figure 1 This is a structural schematic diagram of an embodiment of the present application, used to illustrate the overall structure of the liquid cooling module; Figure 2 This is an exploded view of an embodiment of this application, used to illustrate the internal structure of the liquid cooling module; Figure 3 This is a cross-sectional view of an embodiment of this application, used to show the location of the cooling chamber; Figure 4 This is a partial cross-sectional view of an embodiment of this application, used to show the arrangement positions of the first flow channel and the second flow channel; Figure 5 This is a partial structural diagram of an embodiment of this application. Figure 1 This is used to show the location of the spiral pipe; Figure 6 This is a partial structural diagram of an embodiment of this application. Figure 2 This is used to show the location of the first and second through holes.

[0023] Reference numerals: 1. Mounting frame; 2. Heat-conducting plate; 3. Cover plate; 4. Cooling chamber; 411. Liquid inlet; 421. Liquid outlet; 431. First flow channel; 4311. Front flow channel; 4312. Rear flow channel; 441. Second flow channel; 4411. Liquid supply section; 4412. Cooling section; 451. Liquid inlet confluence area; 461. Liquid outlet confluence area; 5. Baffle; 511. First through hole; 521. Second through hole; 531. Third through hole; 541. Upper baffle; 551. Lower baffle; 6. Fin; 7. Spiral pipe; 711. Annular guide groove; 712. Groove. Detailed Implementation

[0024] The following is in conjunction with the appendix Figures 1-6 This application will be described in further detail.

[0025] Example: A liquid cooling module for processor heat dissipation, reference Figure 1 and Figure 2 The system includes a mounting frame 1, a heat-conducting plate 2, and a cover plate 3. The mounting frame 1 has a rectangular frame structure with bolts at the four corners for a secure connection to the processor to be cooled. The heat-conducting plate 2 is fixedly mounted on the cover plate 3. The heat-conducting plate 2 and the cover plate 3 together form a sealed cooling chamber 4. The cooling chamber 4 has an inlet 411 and an outlet 421 at its two ends. Coolant flows into the cooling chamber 4 through the inlet 411, exchanges heat within the cooling chamber 4, and then exits through the outlet 421, forming a continuous circulation. A partition 5 is fixedly installed inside the cooling chamber 4, dividing the cooling chamber 4 into upper and lower sections. The upper and lower heat dissipation zones create independent yet coordinated flow paths for the coolant within each zone. The upper heat dissipation zone is the space between the upper surface of the partition 5 and the cover plate 3, while the lower heat dissipation zone is the space between the lower surface of the partition 5 and the heat-conducting plate 2. Since the heat-conducting plate 2 is in direct contact with the processor's heat-generating surface, heat is rapidly conducted to the coolant in the lower heat dissipation zone. Therefore, the temperature in the lower heat dissipation zone is significantly higher than that in the upper heat dissipation zone. For the coolant in the lower heat dissipation zone, the temperature is lower on the side near the inlet 411 and higher on the side near the outlet 421. Furthermore... Figure 4The cooling chamber 4 is provided with a first flow channel 431 and a second flow channel 441. The first flow channel 431 and the second flow channel 441 are independent of each other. The first flow channel 431 is bent in shape and includes a front flow channel 4311 and a rear flow channel 4312. The front flow channel 4311 is located on the side of the lower heat dissipation area near the liquid inlet 411. The end of the front flow channel 4311 away from the liquid inlet 411 is bent upward and connected to the rear flow channel 4312. The rear flow channel 4312 is located in the upper heat dissipation area near the liquid outlet. On one side of the inlet 421; the second flow channel 441 is also bent in shape. The second flow channel 441 includes a liquid supply section 4411 and a cooling section 4412 connected end to end. The liquid supply section 4411 is located on the side of the upper heat dissipation area near the liquid inlet 411, while the cooling section 4412 extends to the rear section of the lower heat dissipation area. The cooling section 4412 is located on the side of the lower heat dissipation area near the liquid outlet 421. The end of the cooling section 4412 is connected to the liquid outlet 421. The coolant that has completed heat exchange in the second flow channel 441 is discharged through the liquid outlet 421.

[0026] refer to Figure 3 and Figure 4 The front section of the first flow channel 4311 is distributed in the area of ​​the lower heat dissipation zone near the liquid inlet 411. After the coolant enters the front section of the flow channel 4311, it directly exchanges heat with the front section of the heat conduction plate 2. After the coolant absorbs heat, its temperature rises. The end of the front section of the flow channel 4311 away from the liquid inlet 411 bends upward and extends to the upper heat dissipation zone, connecting with the rear section of the flow channel 4312. The heated coolant enters the rear section of the upper heat dissipation zone from the front section of the lower heat dissipation zone and is discharged from the rear section of the flow channel 4312 toward the liquid outlet 421.

[0027] refer to Figure 3 and Figure 4 The liquid supply section 4411 of the second flow channel 441 is distributed in the area of ​​the upper heat dissipation zone near the liquid inlet 411. The coolant enters the upper heat dissipation zone through the liquid supply section 4411. The end of the liquid supply section 4411 away from the liquid inlet 411 bends downward and extends to the lower heat dissipation zone, communicating with the cooling section 4412. The cooling section 4412 extends along the rear section of the heat conduction plate 2 to exchange heat with the high-temperature area of ​​the rear section of the heat conduction plate 2 that continuously absorbs heat, so that the front and rear sections of the lower heat dissipation zone can be stably and fully cooled, and the overall temperature distribution of the heat conduction plate 2 can be balanced. After the coolant in the cooling section 4412 completes the heat exchange, it is discharged from the liquid outlet 421. The first flow channel 431 and the second flow channel 441 work together to achieve gradient temperature control in two paths and multiple areas.

[0028] refer to Figure 3 and Figure 4The upper heat dissipation area does not have fins 6, which allows the coolant to flow freely and maintain a low flow resistance. The lower heat dissipation area is equipped with fins 6, which extend along the flow direction of the coolant to increase the heat exchange area and improve the heat exchange efficiency. A flow guide gap is formed between the upper surface of the fins 6 in the front flow channel 4311 and the lower surface of the baffle 5. This not only ensures the basic heat dissipation function of the fins 6, but also reduces the flow resistance of the coolant when it bends upward from the front flow channel 4311 into the rear flow channel 4312. This allows the coolant to complete the flow direction change more smoothly after heat exchange, reducing flow resistance and heat retention.

[0029] refer to Figure 3 and Figure 4 The fins 6 located in the cooling section 4412 are connected to the lower surface of the baffle 5 to increase the contact area with the coolant. The two ends of the fins 6 are separated from the inner walls of the two ends of the cooling cavity 4 by gaps, which are the inlet confluence area 451 and the outlet confluence area 461, respectively. After the coolant enters through the inlet port 411, it is first diverted through the inlet confluence area 451 to the supply section 4411 of the upper heat dissipation area and the front section flow channel 4311 of the lower heat dissipation area. The inlet confluence area 451 is not obstructed by the fins 6, which speeds up the flow of the coolant. Similarly, the outlet confluence area 461 is also not blocked by the fins 6, which facilitates the convergence of the rear section flow channel 4312 of the upper heat dissipation area and the cooling section 4412 of the lower heat dissipation area, and finally discharged efficiently through the outlet port 421.

[0030] refer to Figure 2 and Figure 3 The baffle 5 extends along the coolant flow direction. The end profile of the baffle 5 near the inlet 411 is adapted to the end profile of the fin 6 near the inlet 411. The end profile of the baffle 5 near the outlet 421 is adapted to the end profile of the fin 6 near the outlet 421. The design of the two end profiles of the baffle 5 matches the flow channels of the inlet confluence area 451 and the outlet confluence area 461 to ensure stable distribution and convergence of coolant.

[0031] refer to Figure 5 and Figure 6 The partition 5 has a first through hole 511 and a second through hole 521, which are then combined with Figure 4The first through hole 511 connects the front flow channel 4311 and the rear flow channel 4312. The inner wall of the first through hole 511 is inclined upward to guide the heated coolant in the front flow channel 4311 to smoothly transition to the rear flow channel 4312. The second through hole 521 connects the supply section 4411 and the cooling section 4412. The inner wall of the second through hole 521 is inclined downward to guide the low-temperature coolant in the supply section 4411 to flow rapidly into the cooling section 4412. An upper baffle 541 is installed on the upper surface of the partition 5 to block the coolant in the supply section 4411. The coolant flows to the rear flow channel 4312, ensuring that the coolant in the supply section 4411 can only enter the cooling section 4412 obliquely downward through the second through hole 521. Similarly, the lower surface of the partition 5 is provided with a lower baffle 551 to prevent the coolant in the front flow channel 4311 from entering the cooling section 4412 after it has been heated. This ensures that the coolant in the front flow channel 4311 can only flow into the rear flow channel 4312 obliquely upward through the first through hole 511, ensuring that the coolant in the first flow channel 431 and the second flow channel 441 flows independently and does not interfere with each other, thereby achieving precise gradient temperature control.

[0032] refer to Figure 4 and Figure 5 The length of the front flow channel 4311 is greater than that of the rear flow channel 4312. The front flow channel 4311 covers the central area of ​​the heat-conducting plate 2 and bears the main heat load. The longer path of the front flow channel 4311 extends the residence time of the coolant. The front flow channel 4311 is equipped with a spiral pipe 7. The inlet of the spiral pipe 7 is connected to the liquid supply section 4411, and the outlet is connected to the outlet of the front flow channel 4311. Figure 6 A third through hole 531 is provided on the partition plate 5, connecting the spiral pipe 7 and the liquid supply section 4411. Part of the coolant in the liquid supply section 4411 enters the spiral pipe 7, and then, after fully absorbing heat through the spiral path, it flows into the front flow channel 4311. The spiral pipe 7 is located in the central area of ​​the heat-conducting plate 2. An annular guide groove 711 is formed between adjacent pipes of the spiral pipe 7, and a flow distribution channel is formed between the fins 6. A groove 712 is provided on the spiral pipe 7, which connects the annular guide groove 711 and the flow distribution channel, so that the coolant in the front flow channel 4311 can flow between the flow distribution channel and the annular guide groove 711. The flow channels 711 are interconnected, improving the uniformity of coolant distribution and heat exchange, and further enhancing the heat dissipation effect in the central area. The spiral pipe 7 is set at a higher height than the fins 6 in the front flow channel 4311, increasing the flow cross-sectional area inside the spiral pipe 7. The outer diameter of the spiral pipe 7 is smaller than the width of the lower heat dissipation area, avoiding the spiral pipe 7 from obstructing the flow of coolant in the front flow channel 4311. This ensures that the flow of coolant in the branch channels between the fins 6 and the flow in the spiral pipe 7 are independent and do not interfere with each other, thereby strengthening the directional heat dissipation of the central area of ​​the heat conduction plate 2.

[0033] In this embodiment, both the heat-conducting plate 2 and the partition 5 are made of thermally conductive metal. The edge of the heat-conducting plate 2 is fixed to the bottom of the cover plate 3 by welding. The peripheral edge of the cover plate 3 is fixed to the mounting frame 1 by bolts. The mounting surface of the mounting frame 1 facing the processor is flush with the surface of the heat-conducting plate 2, ensuring that the heat-conducting plate 2 is in close contact with the surface of the processor. In this embodiment, the coolant can be a cooling medium with excellent thermal conductivity (such as deionized water). The coolant that absorbs heat enters the external cooling system through the outlet 421 for cooling. After cooling, it flows back to the inlet 411 to complete the cycle, thereby achieving stable and efficient heat dissipation for the GPU processor.

[0034] The implementation principle of this application embodiment is as follows: After the coolant enters the cooling chamber 4 from the inlet 411, it is divided into two paths: one path enters the front section of the first flow channel 4311, exchanges heat with the front section of the heat-conducting plate 2, and after being heated, enters the rear section of the flow channel 4312 through the first through hole 511; the other path enters the supply section 4411 of the second flow channel 441, and is supplied as low-temperature coolant to the spiral pipe 7 and the cooling section 4412 respectively, so as to enhance the heat exchange between the central area and the rear section of the heat-conducting plate 2. All the coolant that has completed the heat exchange finally flows into the outlet confluence area 461, and is discharged uniformly from the outlet 421, enters the external cooling system for cooling, and after cooling, flows back to the inlet 411 to complete the cycle.

[0035] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made to the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A liquid cooling module for processor heat dissipation, comprising a heat-conducting plate (2), a cover plate (3), a cooling cavity (4), a liquid inlet (411), and a liquid outlet (421), wherein the heat-conducting plate (2) is in contact with the heat-generating surface of the processor, the cooling cavity (4) is formed by the heat-conducting plate (2) and the cover plate (3), and the liquid inlet (411) and the liquid outlet (421) are respectively connected to both ends of the cooling cavity (4), characterized in that: The liquid cooling module also includes a partition (5), an upper heat dissipation area is formed between the partition (5) and the cover plate (3), and a lower heat dissipation area is formed between the partition (5) and the heat-conducting plate (2). The cooling cavity (4) is provided with a first flow channel (431) and a second flow channel (441) that are independent of each other. The first flow channel (431) includes a front flow channel (4311) and a rear flow channel (4312). The front flow channel (4311) is located on the side of the lower heat dissipation area near the liquid inlet (411) to exchange heat with the front area of ​​the heat-conducting plate (2). The end of the front flow channel (4311) away from the liquid inlet (411) is bent upwards. The second flow channel (441) is connected to the rear flow channel (4312), which is located on the side of the upper heat dissipation area near the liquid outlet (421) to discharge the heated coolant. The second flow channel (441) includes a supply section (4411) and a cooling section (4412) connected end to end. The supply section (4411) is located on the side of the upper heat dissipation area near the liquid inlet (411) to introduce coolant. The cooling section (4412) is located on the side of the lower heat dissipation area near the liquid outlet (421) to exchange heat with the rear area of ​​the heat-conducting plate (2). The outlet end of the cooling section (4412) is connected to the liquid outlet (421).

2. The liquid cooling module for processor heat dissipation according to claim 1, characterized in that: The lower heat dissipation area is provided with a spiral pipe (7). The inlet of the spiral pipe (7) is connected to the outlet of the liquid supply section (4411), and the outlet of the spiral pipe (7) is connected to the outlet of the front flow channel (4311). The spiral pipe (7) is located in the central area of ​​the heat-conducting plate (2) to enhance the heat dissipation efficiency of the central area of ​​the heat-conducting plate (2).

3. A liquid cooling module for processor heat dissipation according to claim 2, characterized in that: The lower heat dissipation area is equipped with fins (6). A flow guide gap is formed between the upper surface of the fins (6) in the front flow channel (4311) and the lower surface of the partition (5). The flow guide gap is used to accelerate the flow of the heated coolant in the front flow channel (4311) to the rear flow channel (4312).

4. A liquid cooling module for processor heat dissipation according to claim 3, characterized in that: An annular guide groove (711) is formed between the spiral pipes (7), and a flow-dividing channel is formed between the fins (6). The spiral pipes (7) have grooves (712) for connecting the annular guide grooves (711) and the flow-dividing channels.

5. A liquid cooling module for processor heat dissipation according to claim 3, characterized in that: The fins (6) extend along the flow direction of the coolant. The two ends of the fins (6) are respectively provided with an inlet confluence area (451) and an outlet confluence area (461) on the inner wall of the two ends of the cooling cavity (4). The inlet confluence area (451) is connected to the inlet (411), and the outlet confluence area (461) is connected to the outlet (421).

6. A liquid cooling module for processor heat dissipation according to claim 3, characterized in that: The baffle (5) extends along the flow direction of the coolant. The end profile of the baffle (5) near the inlet (411) is adapted to the end profile of the fin (6) near the inlet (411). The end profile of the baffle (5) near the outlet (421) is adapted to the end profile of the fin (6) near the outlet (421).

7. A liquid cooling module for processor heat dissipation according to claim 3, characterized in that: The spiral pipe (7) is set at a height higher than the fins (6) in the front flow channel (4311), and the outer diameter of the spiral pipe (7) is smaller than the width of the lower heat dissipation area.

8. A liquid cooling module for processor heat dissipation according to claim 2, characterized in that: The partition (5) has a first through hole (511) and a second through hole (521). The first through hole (511) is used to connect the front flow channel (4311) and the rear flow channel (4312). The second through hole (521) is used to connect the liquid supply section (4411) and the cooling section (4412). The first through hole (511) is obliquely upward along the direction of coolant flow, and the second through hole (521) is obliquely downward along the direction of coolant flow.

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