Packaging body, electronic component and simulation design method of packaging body

Abstract

The invention relates to a packaging body, an electronic component and a simulation design method of the packaging body, the packaging body comprises a packaging base, connecting glue, a first functional part, fixing glue and a cover, the packaging base comprises a supporting bottom plate, the connecting glue is located at one side of the supporting bottom plate, the first functional part is conductively connected with the supporting bottom plate through the connecting glue, and the fixing glue is located at the other side of the supporting bottom plate. The fixing glue is located on the side, away from the supporting bottom plate, of the first functional part. The cover is at least located on the side, away from the supporting bottom plate, of the surrounding structure and the fixing glue. In the thickness direction of the packaging body, the distance between the cover and the top, away from the supporting bottom plate, of the fixing glue is smaller than or equal to a preset safety distance. The problem that the first functional part falls off can be effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuits, in particular to a package, an electronic component and a simulation design method of the package. BACKGROUND

[0002] At present, the package of an electronic component is mostly packaged by means of dispensing. Specifically, in the packaging process, a functional piece (such as a quartz wafer) is usually mounted on a packaging base by means of conductive glue.

[0003] In order to improve the packaging strength, after the functional piece is mounted on the packaging base, a fixing glue is covered on the top to increase the connection between the functional piece and the packaging base through the fixing glue. Although this method has a certain fixing effect on the functional piece, when facing a greater destructive impact, the functional piece will still be broken away from the conductive glue at the bottom and fall off, thereby causing the failure of the electronic component. SUMMARY

[0004] Based on this, the present application provides a package, an electronic component and a simulation design method of the package, which can improve the problem of the functional piece falling off.

[0005] A package comprises:

[0006] A packaging base comprising a support bottom plate;

[0007] A connecting glue located on one side of the support bottom plate;

[0008] A first functional piece conductively connected to the support bottom plate through the connecting glue;

[0009] A fixing glue located on a side of the first functional piece away from the support bottom plate;

[0010] A cover located at least on a side of the fixing glue away from the support bottom plate; in the thickness direction of the package, the distance between the cover and the top of the fixing glue away from the support bottom plate is less than or equal to a preset safety distance.

[0011] In one of the embodiments, the preset safety distance is 0.001 mm to 0.045 mm, and in the thickness direction of the package, the distance between the cover and the top of the fixing glue away from the support bottom plate is greater than 0.

[0012] In one of the embodiments, the packaging base further comprises an enclosing structure located on one side of the support bottom plate, and the enclosing structure and the support bottom plate enclose a first accommodating cavity, the first functional piece is located in the first accommodating cavity, and the cover covers the first accommodating cavity.

[0013] In one embodiment, the distance between the side of the enclosure structure away from the supporting base plate and the side of the fixing adhesive away from the supporting base plate is less than or equal to a preset safety distance.

[0014] In one embodiment, the enclosure structure includes a first enclosure border and a second enclosure border that are stacked together.

[0015] The second surrounding frame includes a welding frame, and the distance between the side of the welding frame away from the supporting base plate and the side of the fixing adhesive away from the supporting base plate is less than or equal to a preset safety distance.

[0016] In one embodiment, the welding frame includes a Kovar frame.

[0017] In one embodiment,

[0018] The surrounding structure includes a first surrounding frame and a second surrounding frame stacked together, wherein the side of the first surrounding frame facing the first receiving cavity protrudes opposite to the side of the second surrounding frame facing the first receiving cavity.

[0019] The adhesive covers the side of the first functional component away from the supporting base plate, and also covers the side of the first surrounding frame away from the supporting base plate.

[0020] In one embodiment, the fixing adhesive includes a first fixing adhesive and / or a second fixing adhesive, wherein the orthographic projection of the first fixing adhesive on the support base plate overlaps with the orthographic projection of the connecting adhesive on the support base plate, and the orthographic projection of the second fixing adhesive on the support base plate is spaced apart from the orthographic projection of the connecting adhesive on the support base plate.

[0021] In one embodiment, the cover has a groove on the side facing the support base plate, and the orthographic projection of the adhesive on the support base plate lies within the orthographic projection of the groove on the support base plate.

[0022] In the thickness direction of the encapsulation body, the distance between the top of the fixing adhesive away from the supporting base plate and the bottom of the groove is less than or equal to a preset safety distance.

[0023] In one embodiment, the preset safety distance is less than or equal to the thickness of the first functional component.

[0024] In one embodiment, the support base plate includes a support layer and an electrode pad, the electrode pad being located on the side of the support layer closer to the first functional component, and the adhesive being located on the side of the electrode pad away from the support base plate.

[0025] In one embodiment, the supporting base plate includes a plurality of supporting layers that form a second receiving cavity, and the package further includes a second functional component located within the second receiving cavity.

[0026] In one embodiment, the second functional component includes an integrated circuit board.

[0027] The aforementioned encapsulation includes an encapsulation base, connecting adhesive, a first functional component, fixing adhesive, and a cap. The fixing adhesive reinforces and secures the first functional component. Simultaneously, in the thickness direction of the encapsulation, the distance between the cap and the top of the fixing adhesive furthest from the supporting base plate is less than or equal to a preset safety distance. This limits the distance between the top of the cap and the fixing adhesive furthest from the supporting base plate to below the distance at which significant breakage would occur, effectively preventing or reducing the risk of the first functional component detaching.

[0028] An encapsulation comprising:

[0029] Encapsulation base, including support base plate;

[0030] The connecting adhesive is located on one side of the supporting base plate;

[0031] The first functional component is electrically connected to the supporting base plate via the connecting adhesive;

[0032] The cover is located at least on the side of the first functional component away from the supporting base plate; in the thickness direction of the package, the distance between the cover and the first functional component is less than or equal to a preset safety distance.

[0033] In one embodiment, the preset safety distance is 0.001 mm to 0.045 mm.

[0034] In the aforementioned encapsulation, no adhesive is formed between the first functional component and the cover, thereby reducing manufacturing costs and improving process efficiency. Simultaneously, the distance between the cover and the first functional component is less than or equal to a preset safety distance, thus limiting the distance between them to below the level where significant breakage would occur, effectively preventing or reducing the risk of the first functional component detaching.

[0035] An electronic component comprising the aforementioned package.

[0036] A simulation design method for a package includes:

[0037] An initial simulated package is established, the simulated package including a package base, a connecting adhesive, a first functional component, a fixing adhesive, and a cover. The package base includes a supporting base plate. The connecting adhesive is located on one side of the supporting base plate. The first functional component is electrically connected to the supporting base plate through the connecting adhesive. The fixing adhesive is located on the side of the first functional component away from the supporting base plate. The cover is located at least on the side of the fixing adhesive away from the supporting base plate.

[0038] An impact force is applied to the package;

[0039] Obtain the fracture status between the first functional component and the connecting adhesive;

[0040] When the first functional component and the connecting adhesive are not broken, increase the distance between the top of the cover and the top of the fixing adhesive away from the support base plate in the thickness direction of the package body, return to the step of applying impact force to the package body until the first functional component and the connecting adhesive are broken, and record the distance between the top of the fixing adhesive away from the support base plate and the cover in the thickness direction of the package body as the first target distance.

[0041] When the first functional component breaks with the connecting adhesive, reduce the distance between the top of the cover and the top of the fixing adhesive away from the support base plate in the thickness direction of the package, return to the step of applying impact force to the package until the first functional component and the connecting adhesive no longer break, and record the distance between the top of the fixing adhesive away from the support base plate and the cover in the thickness direction of the package as the second target distance. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figures 1 to 7 These are schematic cross-sectional views of partial structures of the package provided in different embodiments;

[0044] Figure 8 This is a flowchart of a simulation design method for a package provided in one embodiment.

[0045] Explanation of reference numerals in the attached figures:

[0046] 100-Packaging base, 110-Support base plate, 111-Support layer, 112-Electrode pad, 113-Solder pad, 115-Through hole structure, 120-Enclosure structure, 121-First enclosure frame, 122-Second enclosure frame, 200-Connecting adhesive, 310-First functional component, 320-Second functional component, 400-Fixing adhesive, 410-First fixing adhesive, 420-Second fixing adhesive, 500-Cap, 500a-Groove. Detailed Implementation

[0047] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0049] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0050] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0051] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0052] In one embodiment, see Figure 1 A package is provided. The package includes a package base 100, a connecting adhesive 200, a first functional component 310, a fixing adhesive 400, and a cover 500. The first functional component 310 may include, but is not limited to, a quartz wafer.

[0053] The packaging base 100 includes a support base plate 110. The support base plate 110 may include a support layer 111. The material of the support layer 111 may include, but is not limited to, ceramic materials.

[0054] For example, the support base plate 110 may further include an electrode pad 112. The electrode pad 112 may be located on the side of the support layer 111 closer to the first functional member 310. The electrode pad 112 may be electrically connected to the first functional member 310.

[0055] For example, the support base plate 110 may also include pads 113. The pads 113 may be located on the side of the support layer 111 away from the first functional member 310.

[0056] The adhesive 200 is a conductive adhesive. For example, the adhesive 200 includes silver paste.

[0057] The adhesive 200 is located on one side of the support base plate 110 and within the first receiving cavity. Exemplarily, the support base plate 110 includes an electrode pad 112, and the first cavity exposes the electrode pad 112. The adhesive 200 may be located on one side of the first conductive pad. The orthographic projection of the adhesive 200 onto the support layer 111 may lie within the orthographic projection of the first conductive pad onto the support layer 111.

[0058] The first functional component 310 is electrically connected to the support base plate 110 via the adhesive 200. Specifically, for example, the first functional component 310 can be electrically connected to the electrode pad 112 of the support base plate 110 via the adhesive 200.

[0059] The fixing adhesive 400 is located on the side of the first functional component 310 away from the supporting base plate 110, and is used to reinforce and fix the first functional component 310. The fixing adhesive 400 can be a conductive adhesive or an insulating adhesive.

[0060] The fixing adhesive 400 may include a first fixing adhesive 410, the orthographic projection of the first fixing adhesive 410 on the support base plate 110 overlapping the orthographic projection of the connecting adhesive 200 on the support base plate 110.

[0061] Alternatively, the fixing adhesive 400 may include a second fixing adhesive 420, the orthographic projection of the second fixing adhesive 420 on the support base plate 110 being spaced apart from the orthographic projection of the connecting adhesive 200 on the support base plate 110.

[0062] Of course, the fixative 400 may also include both the first fixative 410 and the second fixative 420.

[0063] The cap 500 is located at least on the side of the fixing adhesive 400 away from the supporting base plate 110 for sealing the encapsulation.

[0064] Meanwhile, in the thickness direction of the encapsulation, the distance between the cap 500 and the top of the fixing adhesive 400 away from the support base plate 110 (e.g.) Figure 1 H1 in the equation is less than or equal to the preset safety distance.

[0065] The inventors discovered that when the package is subjected to strong external impact and vibration, a significant breakage problem will occur between the first functional component 310 and the connecting adhesive 200 only after the distance between the cover 500 and the fixing adhesive 400 exceeds a certain range in the thickness direction of the package.

[0066] Based on this, in this embodiment, the distance between the cover 500 and the top of the fixing adhesive 400 away from the support base plate 110 in the thickness direction of the encapsulation body is less than or equal to a preset safety distance, thereby effectively preventing the first functional component 310 from breaking with the connecting adhesive 200 or effectively reducing the probability of the first functional component 310 breaking with the connecting adhesive 200.

[0067] The preset safety distance can be determined according to the actual situation, specifically based on product size, product structure type, and customer requirements.

[0068] For example, the preset safety distance is 0.001mm to 0.045mm. For example, the preset safety distance is 0.001mm to 0.03mm. For example, the preset safety distance is 0.001mm to 0.02mm. For example, the preset safety distance is 0.001mm to 0.01mm. Specifically, for example, the preset safety distance is 0.006mm.

[0069] In this embodiment, the encapsulation body includes an encapsulation base 100, a connecting adhesive 200, a first functional component 310, a fixing adhesive 400, and a cover 500. The fixing adhesive 400 can reinforce and fix the first functional component 310. Meanwhile, in this embodiment, in the thickness direction of the encapsulation body, the distance between the top of the cover 500 and the top of the fixing adhesive 400 away from the supporting base plate 110 is less than or equal to a preset safety distance. This limits the distance between the top of the cover 500 and the top of the fixing adhesive 400 away from the supporting base plate 110 to below the distance at which significant breakage occurs, thereby effectively preventing or reducing the problem of the first functional component 310 detaching.

[0070] In one embodiment, the gap between the top of the cover 500 and the top of the adhesive 400 away from the support base 110 is greater than 0, so that the cover 500 and the adhesive 400 do not contact each other. In this case, the connection between the cover 500 and the encapsulation base 100 is not affected by the adhesive 400, thereby improving the sealing effect of the cover 500.

[0071] In one embodiment, please refer to... Figure 1 The encapsulation base 100 also includes an enclosure structure 120.

[0072] The surrounding structure 120 is located on one side of the supporting base plate 110, and the surrounding frame and the supporting base plate 110 form a first receiving cavity. The first functional component 310 is located inside the first receiving cavity, and the cover 500 covers the first receiving cavity.

[0073] The enclosure structure 120 can be a single-layer structure or a multi-layer structure, depending on the actual needs.

[0074] The material surrounding structure 120 may be the same as or different from the material of support layer 111. For example, the material surrounding structure 120 includes ceramic material.

[0075] At this time, the cover 500 can be a flat cover 500. It can be connected to the surrounding structure 120 by welding or other processes, and the cover 500 can be located entirely on the side of the fixing adhesive 400 away from the supporting base plate 110.

[0076] Of course, the form of the 500 lid is not limited to this. For example, please refer to... Figure 2 The cover 500 can also be a cap-shaped cover 500. In this case, the orthographic projection of the surrounding structure 120 on the support base plate 110 can be located inside the orthographic projection of the cover 500 on the support base plate 110. The cover 500 can be located both on the side of the fixing adhesive 400 away from the support base plate 110 and around the surrounding structure 120. The cover 500 can be connected to the support base plate 110 by adhesive bonding or the like. Alternatively, in other embodiments, when the cover 500 is a cap-shaped cover 500, the encapsulation base 100 may not include the surrounding structure 120. This application does not impose any limitations on this.

[0077] In one embodiment, see Figure 3 The distance between the side of the surrounding structure 120 away from the supporting base plate 110 and the side of the fixing adhesive 400 away from the supporting base plate 110 (e.g. Figure 3 H2 in the middle is less than or equal to the preset safety distance.

[0078] Specifically, the side of the surrounding structure 120 furthest from the supporting base plate 110 can be considered the top of the surrounding structure 120, and the side of the fixing adhesive 400 furthest from the supporting base plate 110 can be considered the top of the fixing adhesive 400. Therefore, the distance between the top of the surrounding structure 120 and the top of the fixing adhesive 400 is less than or equal to a preset safety distance.

[0079] For example, the enclosure structure 120 includes a first enclosure border 121 and a second enclosure border 122 that are stacked together.

[0080] The material of the first surrounding frame 121 may include ceramic materials, etc.

[0081] The second surrounding frame 122 includes a welded frame. Exemplarily, the welded frame may include a Kovar frame. Exemplarily, the second surrounding frame 122 may also include a Kovar frame and a plating formed on the side of the Kovar frame away from the support base plate 110. This plating can be used to parallel weld the Kovar frame to the cover 500.

[0082] The distance between the side of the welding frame away from the supporting base plate 110 and the side of the fixing adhesive 400 away from the supporting base plate 110 is less than or equal to the preset safety distance.

[0083] In this embodiment, by limiting the distance between the top of the surrounding structure 120 and the top of the fixing adhesive 400, the distance between the cover 500 and the fixing adhesive 400 can be effectively limited to a preset safe distance range. Simultaneously, since the distance between the cover 500 and the fixing adhesive 400 can be limited to a preset safe distance range, the problem of the first functional component 310 detaching can be prevented or reduced. Therefore, it is not necessary to form excessive amounts of fixing adhesive 400, thereby preventing the fixing adhesive 400 from overflowing into the welding frame during the dispensing process, thus preventing interference with the sealing current, etc.

[0084] In one embodiment, see Figure 4 The enclosure structure 120 includes a first enclosure frame 121 and a second enclosure frame 122 stacked together, with the side of the first enclosure frame 121 facing the first receiving cavity protruding relative to the side of the second enclosure frame 122 facing the first receiving cavity.

[0085] The adhesive 400 covers the side of the first functional component 310 away from the supporting base plate 110, and also covers the side of the first surrounding frame 121 away from the supporting base plate 110.

[0086] Please see Figure 4 At this time, the adhesive 400 simultaneously overlaps the upper surface of the first functional component 310 and the upper surface of the first surrounding frame 121.

[0087] The material of the first surrounding frame 121 is typically a material with good adhesion (such as ceramic material). Therefore, the adhesive 400 overlaps the upper surface of the first surrounding frame 121, thereby increasing the adhesion between the adhesive 400 and the encapsulation base 100, thereby enhancing the fixing effect on the first functional component 310, and further preventing the first functional component 310 from breaking and falling off from the connecting adhesive 200.

[0088] For example, the surface of the first functional member 310 away from the supporting base plate 110 and the surface of the first surrounding frame 121 away from the supporting base plate 110 can be flush or nearly flush, so that the first adhesive 410 can be formed on a relatively flat surface, thereby improving the adhesion of the first adhesive 410.

[0089] Of course, in other embodiments, the adhesive 400 may not cover the side of the first surrounding frame 121 away from the supporting base plate 110. This application does not limit this.

[0090] In one embodiment, see Figure 5The cover 500 has a groove 500a on the side facing the support base plate 110. The orthographic projection of the adhesive 400 on the support base plate 110 lies within the orthographic projection of the groove 500a on the support base plate 110. Exemplarily, the groove 500a can be provided in a one-to-one correspondence with the adhesive 400. Alternatively, one groove 500a can also correspond to two or more adhesives 400.

[0091] In the thickness direction of the encapsulation, the distance between the top of the fixing adhesive 400 away from the supporting base plate 110 and the bottom of the groove 500a (e.g.) Figure 5 The distance between the top of the cover 500 and the top of the fixing adhesive 400 away from the support base plate 110 is less than or equal to the preset safety distance, thereby limiting the distance between them to below the distance at which significant breakage occurs, thus effectively preventing or reducing the problem of the first functional component 310 falling off.

[0092] At the same time, when the first functional piece is subjected to a large impact force and moves toward the cover 500, the fixing adhesive 400 can fall into the groove 500a, so that the groove 500a can also have a certain limiting effect on the fixing adhesive 400, thereby reducing the degree of displacement of the first functional piece due to the impact force, and thus reducing the probability of falling off.

[0093] In one embodiment, the preset safety distance is less than or equal to the thickness of the first functional component.

[0094] At this time, even if the first functional component is subjected to an impact force in the thickness direction of the package, the space in which the first functional component can move is less than the thickness of the first functional component, thereby preventing the first functional component from undergoing excessive displacement due to the impact force, and thus effectively preventing the first functional component from falling off.

[0095] For example, the first functional component is a quartz wafer. The thickness of the first functional component can be determined according to the following formula:

[0096] F n =n*f0=n*K / t

[0097] Among them, f n _n_ is the overtone frequency of the quartz crystal (units can be Hz or MHz, referring to the resonant frequency of the quartz crystal in overtone vibration mode, and is an odd multiple of the fundamental frequency). _n_ is the overtone order (an odd number, such as 3, 5, 7, etc., representing the harmonic order of the vibration mode). _f_0_ is the fundamental frequency of the quartz crystal (units can be Hz or MHz, referring to the inherent resonant frequency of the quartz crystal in its lowest order vibration mode). _K_ is a material constant (determined by the quartz crystal's cut type and material properties; for example, K = 1.67 MHz·mm for an AT cut). _t_ is the thickness of the quartz crystal (units can be mm).

[0098] During the design process of the package, after determining the thickness of the first functional component, the preset safety distance can be determined based on the thickness of the first functional component.

[0099] In one embodiment, see Figure 6 The supporting base plate 110 includes multiple supporting layers 111. The multiple supporting layers 111 enclose a second receiving cavity. "Multiple" can refer to two or more.

[0100] For example, among the multiple support layers 111, except for the lowest support layer 111, the other support layers 111 can be annular support layers 111, thereby enclosing and forming a second receiving cavity. Conductive lines can be provided between adjacent support layers 111. The conductive lines between different support layers 111 can be interconnected through through-hole structures 115.

[0101] The package also includes a second functional element 320, which is located within the second receiving cavity.

[0102] For example, the second functional component 320 may include an integrated circuit board, and the first functional component 310 may include a quartz wafer.

[0103] In this embodiment, the package can effectively achieve integrated packaging of multifunctional components.

[0104] In one embodiment, see Figure 7 The invention also provides a package. The package includes a package base 100, a connecting adhesive 200, a first functional component 310, and a cover 500.

[0105] The encapsulation base 100 includes a support base plate 110. Adhesive 200 is located on one side of the support base plate 110. A first functional element 310 is electrically connected to the support base plate 110 via the adhesive 200. A cover 500 is located at least on the side of the first functional element 310 away from the support base plate 110.

[0106] Meanwhile, in the thickness direction of the package, the distance between the cover 500 and the first functional component 310 (Figure) Figure 7 H4 in the text is less than or equal to the preset safety distance.

[0107] The preset safety distance can be determined according to the actual situation, specifically based on product size, product structure type, and customer requirements.

[0108] For example, the preset safety distance is 0.001mm to 0.045mm. For example, the preset safety distance is 0.001mm to 0.03mm. For example, the preset safety distance is 0.001mm to 0.02mm. For example, the preset safety distance is 0.001mm to 0.01mm. Specifically, for example, the preset safety distance is 0.006mm.

[0109] In this embodiment, no fixing adhesive 400 is formed between the first functional component 310 and the cover 500, thereby reducing process costs and improving process efficiency. Simultaneously, the distance between the cover 500 and the first functional component 310 is less than or equal to a preset safety distance, thus limiting the distance between them to below the distance at which significant breakage would occur, effectively preventing or reducing the risk of the first functional component 310 detaching.

[0110] In one embodiment, an electronic component is also provided, which includes any of the above-described packages. Exemplarily, the electronic component includes a crystal resonator. Exemplarily, the electronic component includes a crystal oscillator.

[0111] In one embodiment, see Figure 8 Furthermore, a simulation design method for a package is provided. This simulation design method includes:

[0112] Step S10: Establish an initial simulated package. The simulated package includes a package base 100, a connecting adhesive 200, a first functional component 310, a fixing adhesive 400, and a cover 500. The package base 100 includes a supporting base plate 110. The connecting adhesive 200 is located on one side of the supporting base plate 110. The first functional component 310 is electrically connected to the supporting base plate 110 through the connecting adhesive 200. The fixing adhesive 400 is located on the side of the first functional component 310 away from the supporting base plate 110. The cover 500 is located at least on the side of the fixing adhesive 400 away from the supporting base plate 110.

[0113] Step S20: Apply an impact force to the package;

[0114] Step S30: Obtain the fracture status between the first functional component 310 and the connecting adhesive 200;

[0115] Step S40: When the first functional component 310 and the connecting adhesive 200 are not broken, increase the distance between the top of the cover 500 and the fixing adhesive 400 away from the support base plate 110 in the thickness direction of the package body, return to the step of applying impact force to the package body until the first functional component 310 and the connecting adhesive 200 are broken, and record the distance between the fixing adhesive 400 and the cover 500 in the thickness direction of the package body as the first target distance.

[0116] In step S50, when the first functional component 310 breaks with the connecting adhesive 200, the distance between the top of the cover 500 and the fixing adhesive 400 away from the support base plate 110 in the thickness direction of the package is reduced, and the step of applying impact force to the package is returned until the first functional component 310 and the connecting adhesive 200 no longer break. The distance between the fixing adhesive 400 and the cover 500 in the thickness direction of the package is recorded as the second target distance.

[0117] In step S10, in the initial simulated package, the top of the cover 500 and the top of the fixing adhesive 400 away from the supporting base plate 110 can be spaced apart.

[0118] For example, the first functional element 310 includes a quartz wafer.

[0119] In step S20, applying an impact force to the package may include applying an impact force to the first functional member 310. When applying an impact force to the first functional member 310, an impact force perpendicular to the first functional member 310 may be applied to the side of the first functional member 310 closest to the package substrate.

[0120] Of course, the way to apply impact force to the package is not limited to this; for example, impact force can also be applied to the bottom of the package substrate.

[0121] In step S30, the fracture status of the first functional component 310 and the connecting adhesive 200 can be obtained by image processing of the structural diagram of the simulated package after the impact force is applied. Alternatively, the fracture status of the first functional component 310 and the connecting adhesive 200 can also be obtained through other methods. For example, the fracture status of the first functional component 310 and the connecting adhesive 200 can be obtained based on the simulation test results after performing a simulation performance test on the simulated package.

[0122] In step S40, when the first functional component 310 and the connecting adhesive 200 are not broken, steps S20, S30 and S40 can be executed repeatedly until the first functional component 310 and the connecting adhesive 200 are broken. The distance between the top of the fixing adhesive 400 away from the support base plate 110 and the cover 500 when the break occurs is recorded as the first target distance.

[0123] Following this, a preset safety distance for the actual package can be set based on the first target distance obtained here. Specifically, the preset safety distance can be smaller than the first target distance.

[0124] In step S50, when the first functional component 310 breaks with the connecting adhesive 200, steps S20, S30 and S50 can be repeated until the first functional component 310 and the connecting adhesive 200 do not break. The distance between the top of the fixing adhesive 400 away from the supporting base plate 110 and the cover 500 when no breakage occurs is recorded as the second target distance.

[0125] Following this, a preset safety distance for the actual package can be set based on the second target distance obtained here. Specifically, the preset safety distance can be less than or equal to the second target distance.

[0126] It should be understood that, although Figure 8 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 8 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0127] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0128] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0129] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A package, characterized in that, include: Encapsulation base, including support base plate; The connecting adhesive is located on one side of the supporting base plate; The first functional component is electrically connected to the supporting base plate via the connecting adhesive; The fixing adhesive is located on the side of the first functional component away from the supporting base plate; The cap is located, at least on the side of the adhesive that is away from the supporting base plate. In the thickness direction of the package, the distance between the cover and the top of the fixing adhesive away from the supporting base plate is less than or equal to a preset safety distance.

2. The package according to claim 1, characterized in that, The preset safety distance is 0.001mm to 0.045mm, and in the thickness direction of the package, the distance between the cover and the top of the fixing adhesive away from the supporting base plate is greater than 0.

3. The package according to claim 1, characterized in that, The packaging base also includes a surrounding structure located on one side of the supporting base plate, and the surrounding frame and the supporting base plate form a first receiving cavity, the first functional component is located in the first receiving cavity, and the cover covers the first receiving cavity.

4. The package according to claim 3, characterized in that, The distance between the side of the enclosure structure away from the supporting base plate and the side of the fixing adhesive away from the supporting base plate is less than or equal to a preset safety distance.

5. The package according to claim 4, characterized in that, The enclosure structure includes a first enclosure border and a second enclosure border that are stacked together. The second surrounding frame includes a welding frame, and the distance between the side of the welding frame away from the supporting base plate and the side of the fixing adhesive away from the supporting base plate is less than or equal to a preset safety distance.

6. The package according to claim 3, characterized in that, The surrounding structure includes a first surrounding frame and a second surrounding frame stacked together, wherein the side of the first surrounding frame facing the first receiving cavity protrudes opposite to the side of the second surrounding frame facing the first receiving cavity. The adhesive covers the side of the first functional component away from the supporting base plate, and also covers the side of the first surrounding frame away from the supporting base plate.

7. The package according to claim 1 or 6, characterized in that, The fixing adhesive includes a first fixing adhesive and / or a second fixing adhesive. The orthographic projection of the first fixing adhesive on the support base plate overlaps with the orthographic projection of the connecting adhesive on the support base plate. The orthographic projection of the second fixing adhesive on the support base plate is spaced apart from the orthographic projection of the connecting adhesive on the support base plate.

8. The package according to claim 1, characterized in that, The cover has a groove on the side facing the support base plate, and the orthographic projection of the fixing adhesive on the support base plate is located within the orthographic projection of the groove on the support base plate. In the thickness direction of the encapsulation body, the distance between the top of the fixing adhesive away from the supporting base plate and the bottom of the groove is less than or equal to a preset safety distance.

9. The package according to claim 1, characterized in that, The preset safety distance is less than or equal to the thickness of the first functional component.

10. The package according to claim 1, characterized in that, The supporting base plate includes a supporting layer and an electrode pad. The electrode pad is located on the side of the supporting layer closer to the first functional component, and the adhesive is located on the side of the electrode pad away from the supporting base plate.

11. The package according to claim 1, characterized in that, The supporting base plate includes multiple supporting layers, which enclose a second receiving cavity. The package also includes a second functional component located within the second receiving cavity.

12. The package according to claim 11, characterized in that, The second functional component includes an integrated circuit board.

13. A package, characterized in that, include: Encapsulation base, including support base plate; The connecting adhesive is located on one side of the supporting base plate; The first functional component is electrically connected to the supporting base plate via the connecting adhesive; The cover is located at least on the side of the first functional component away from the supporting base plate; In the thickness direction of the package, the distance between the cover and the first functional component is less than or equal to a preset safety distance.

14. The package according to claim 13, characterized in that, The preset safety distance is 0.001mm to 0.045mm.

15. An electronic component, characterized in that, Includes the package as described in any one of claims 1-14.

16. A simulation design method for a package, characterized in that, include: An initial simulated package is established, the simulated package including a package base, a connecting adhesive, a first functional component, a fixing adhesive, and a cover. The package base includes a supporting base plate. The connecting adhesive is located on one side of the supporting base plate. The first functional component is electrically connected to the supporting base plate through the connecting adhesive. The fixing adhesive is located on the side of the first functional component away from the supporting base plate. The cover is located at least on the side of the fixing adhesive away from the supporting base plate. An impact force is applied to the package; Obtain the fracture status between the first functional component and the connecting adhesive; When the first functional component and the connecting adhesive are not broken, increase the distance between the top of the cover and the top of the fixing adhesive away from the support base plate in the thickness direction of the package body, return to the step of applying impact force to the package body until the first functional component and the connecting adhesive are broken, and record the distance between the top of the fixing adhesive away from the support base plate and the cover in the thickness direction of the package body as the first target distance. When the first functional component breaks with the connecting adhesive, reduce the distance between the top of the cover and the top of the fixing adhesive away from the support base plate in the thickness direction of the package, return to the step of applying impact force to the package until the first functional component and the connecting adhesive no longer break, and record the distance between the top of the fixing adhesive away from the support base plate and the cover in the thickness direction of the package as the second target distance.

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