Laser solder paste scanning welding process

Abstract

The invention relates to the technical field of mainboard welding, in particular to a laser solder paste scanning welding process which comprises the steps that a layer of solder paste is brushed in an area with a bonding pad, the thickness of the solder paste is determined according to the size of the bonding pad and the amount of tin needed on the bonding pad, and when the solder paste is brushed, the solder paste can be brushed in the positions with the bonding pad and without the bonding pad; only the mark of image positioning needs not to be covered; after the image is positioned, laser is directly scanned at the position with the bonding pad to solidify the solder paste; cleaning the uncured solder paste; if the surface or the shape of the ball manufactured by the method is not good, the ball can be remelted once after uncured solder paste is cleaned.

Description

Technical Field

[0001] This invention relates to the field of motherboard soldering technology, specifically a laser solder paste scanning soldering process. Background Technology

[0002] BGA stands for "ball g rid arra y The Chinese name is "Ball Grid Array Packaging". It involves using a ball-mounting board to apply solder balls to the CPU contacts with a hot air gun, and then heating the board to solder them onto the motherboard PCB. This method is currently widely used in laptops and integrated motherboards with embedded CPUs.

[0003] The appropriate amount of solder paste applied for ball formation requires increasing the stencil thickness and slightly enlarging the stencil opening size during stencil fabrication, allowing the solder paste to be directly printed onto the BGA pads. Due to surface tension, solder balls will form after reflow soldering.

[0004] Existing solder ball placement methods are limited by size and speed. Laser soldering for BGAs is slow, and the smallest solder balls currently available are only around 40 micrometers in size. Another method involves applying flux first and then using a chuck to place the balls onto the entire board. While this is more efficient than solder ball soldering, the solder balls are generally larger than 0.2mm, making smaller balls unusable. Furthermore, applying solder paste is mostly done manually, followed by soldering and inspection under an electron microscope. The entire process involves constantly moving the motherboard and handling it with extreme care, impacting processing speed. Summary of the Invention

[0005] In order to overcome the deficiencies in the prior art, the present invention aims to provide a laser solder paste scanning soldering process to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides a laser solder paste scanning soldering process, comprising using a scanning laser head to emit a laser beam to solidify the solder paste, and using an electron microscope to inspect the overall solder paste soldering process, including the following steps:

[0007] S1. First, align the electron microscope directly above and in front of the processing disk. Then, align the paste brush assembly directly above and behind the processing disk. Next, adjust the scanning laser head to be directly above and to the right of the processing disk.

[0008] S2. Next, solder paste is squeezed into the solder paste box, and the electric motor is started to drive the paste roller to squeeze the solder paste into contact with the processing tray;

[0009] S3. Start the servo motor in the motor box to drive the processing disk to rotate 60 degrees each time;

[0010] S4. Then place the motherboard on the mounting plate of the motherboard mold that has been unfolded in the left area of ​​the processing tray;

[0011] S5. As the processing tray rotates, before the motherboard moves to the bottom of the solder paste box, the pressing plate is guided by the lever and directional bar on the left side of the linkage ring and closes with the placing plate. The solder paste is brushed onto the fine holes on the top surface of the pressing plate and seeps down, and then the motherboard contacts are coated with solder paste.

[0012] S6. When the motherboard and motherboard mold from step S5 are rotated to the underside of the scanning laser head, the laser beam is activated to solidify the solder paste on the motherboard.

[0013] S7. Before the motherboard to be soldered is placed under the electron microscope, the pressure plate is flipped up and opened by the reset force of the spring plate, so that the motherboard can be fully inspected.

[0014] S8. When the motherboard after inspection is turned to the unloading port on the left side of the processing tray, the plate is flipped open by the reset force of the spring plate, and the motherboard inside is pushed out by the top plate and removed, ready to be placed again.

[0015] S9. When performing step S5, the motherboard can be placed again on the platen of the motherboard mold that has been unfolded in the left area of ​​the processing tray, in order to batch solder the motherboard contacts.

[0016] As a further improvement to this technical solution, a processing disk with a circular disc structure is used to place several main boards. Several processing ports are opened in a ring at equal intervals on the top surface of the processing disk. The processing ports penetrate the inner ring wall of the processing disk. A motor box is set below the center of the processing disk. A servo motor is installed in the motor box. The output shaft of the servo motor passes through the top center of the motor box and is coaxially connected to the processing disk.

[0017] As a further improvement to this technical solution, a motherboard mold is snapped into the processing port. The motherboard mold includes a pressing plate and a placing plate that are pressed together vertically. The ends of the placing plate and the pressing plate facing the inner ring of the processing disk are rotatably connected to the side wall of the processing port. The bottom surface of the rotating end of the placing plate is embedded with a spring plate that drives it to flip down, and the top surface of the rotating end of the pressing plate is provided with a spring plate that drives it to flip up.

[0018] As a further improvement to this technical solution, a linkage ring is fixedly suspended in the inner ring hole of the processing disc. The outer wall of the linkage ring is provided with a disc guide ring for limiting the pressure plate to maintain a horizontal state and a plate guide ring for limiting the placement plate to maintain a horizontal state. The disc guide ring has a symmetrically arranged adjustment port on its top surface and on a diagonal line 60 degrees clockwise away from the electron microscope. The plate guide ring has a discharging port on its top surface and at a position 60 degrees counterclockwise away from the electron microscope. The right end of the adjustment port on the same side as the discharging port is provided with an adjustment bar to guide the pressure plate to flip. An inclined top plate is provided directly below the discharging port.

[0019] As a further improvement to this technical solution, a solder paste application assembly is provided on the processing tray and opposite to the electron microscope. The solder paste application assembly includes a solder paste box suspended on the top surface of the processing tray, a solder paste pressing roller embedded in the solder paste box, and an electric motor coaxially connected to the solder paste pressing roller. The bottom end of the solder paste box slides in contact with the top surface of the processing tray.

[0020] As a further improvement to this technical solution, a motherboard module for placing the motherboard is embedded in the center of the top surface of the mounting plate. A spring plate opening is provided in the center of the motherboard module. A protrusion that fits into the spring plate opening is provided vertically at the lower end of the top plate. A solder pad is embedded in the center of the top surface of the pressure plate. Several through holes for loading solder paste are provided on the top surface of the solder pad. A protrusion that is rotatably connected to the processing port is provided on one side of the pressure plate. A roller is fitted in the center of the outer side of the protrusion. A lever for pushing the roller into the lever is provided at the outer end of the directional bar.

[0021] As a further improvement to this technical solution, the two inner sides of the spring plate opening are provided with guide slopes. Both the spring plate and the spring disc are made of spring steel and have a thin sheet structure. One side of the spring plate is integrally formed with an arc plate. One side of the plate is provided with a protrusion that is rotatably connected to the processing port. The arc plate is engaged with the protrusion of the plate and both ends of the arc plate are inserted into the inner wall of the processing port. One side of the spring disc is integrally formed with a fixing plate. The fixing plate is arranged parallel to the spring disc and is bonded to the inner wall of the processing disc.

[0022] As a further improvement to this technical solution, the solder paste box has openings at the top and bottom and a support frame is connected to the top. The surface of the solder paste roller is radially provided with a paste filling port, and a scraper is fitted inside the bottom of the solder paste box.

[0023] As a further improvement to this technical solution, the scraper is U-shaped with its opening facing the direction of the directional bar. A groove is provided on the outer side of the solder paste box near the bottom. A slider that is movably engaged with the groove is bonded to the middle of the outer side of the scraper. The top surface of the slider that extends out of the solder paste box contacts a spring strip. The spring strip is V-shaped and its two ends are bonded to the outer side of the solder paste box.

[0024] As a further improvement to this technical solution, a support ring is connected directly below the linkage ring, the support ring is tightly fitted to the top of the motor housing, and a guide plate surface is provided near the unloading port of the plate guide ring.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] 1. This laser solder paste scanning welding process uses a rotating processing tray to place several motherboards. The motherboards are then held by a motherboard mold and sequentially passed through the paste application area, the laser head welding area, and the electron microscope inspection area. The motherboards are then coated with solder paste, welded, cured, and inspected. The entire process only requires placing the motherboards, and it proceeds in an orderly manner, saving time.

[0027] 2. This laser solder paste scanning welding process, through a set linkage ring, rotates with the processing tray. Before the motherboard reaches the bottom of the solder paste box, the pressure plate is guided by the lever and directional bar on the left side of the linkage ring to close with the placement plate. Before the soldered motherboard reaches the electron microscope, the pressure plate flips up and opens under the reset force of the spring plate, allowing for a comprehensive inspection of the motherboard. When the inspected motherboard reaches the unloading port on the left side of the processing tray, the placement plate flips down and opens under the reset force of the spring plate, and the motherboard inside is pushed out and removed by the top plate for re-placement. The entire process of applying solder paste, soldering, inspection, and unloading is automated, with strong functionality and improved processing speed.

[0028] 3. This laser solder paste scanning soldering process involves setting up a paste brushing group, using a solder paste box to load solder paste and bring it into contact with the processing tray; the surface of the paste pressing roller inside the solder paste box has radial openings for paste filling, which is used to allow solder paste to seep out, and then the arc surface of the paste pressing roller is used to squeeze the solder paste into contact with the processing tray; a scraper is installed inside the bottom of the solder paste box to scrape off the solder paste on the processing tray, automatically scraping the solder paste onto the pads of the pressure plate, and also preventing the solder paste from leaving the solder paste box and being wasted. Attached Figure Description

[0029] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of the invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely illustrative to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, guided by the teachings of this invention, can select various possible shapes and proportions to implement the invention according to specific circumstances.

[0030] Figure 1 This is a schematic diagram of the overall assembly structure of the present invention;

[0031] Figure 2 This is one of the structural schematic diagrams of several motherboard molds in different states according to the present invention;

[0032] Figure 3 This is a second schematic diagram of the structure of several motherboard molds in different states according to the present invention;

[0033] Figure 4 This is a top view of the entire invention;

[0034] Figure 5 For the present invention Figure 2 Top view;

[0035] Figure 6 For the present invention Figure 3 Top view;

[0036] Figure 7 This is one of the structural schematic diagrams of the mainboard mold in the mold-closed state according to the present invention;

[0037] Figure 8 This is the second structural schematic diagram of the mainboard mold in the mold-closed state of the present invention;

[0038] Figure 9 This is one of the schematic diagrams of the unfolded structure of the pressing plate of the motherboard mold of the present invention;

[0039] Figure 10 This is the second schematic diagram of the unfolded structure of the pressing plate of the motherboard mold of the present invention;

[0040] Figure 11 This is a schematic diagram of the overall unfolded state of the motherboard mold of the present invention;

[0041] Figure 12 For the present invention Figure 6 Sectional view of section AA;

[0042] Figure 13 For the present invention Figure 6 BB section sectional view;

[0043] Figure 14 This is a schematic diagram of the linkage ring structure of the present invention;

[0044] Figure 15 This is a top view of the linkage ring of the present invention;

[0045] Figure 16 This is a schematic diagram of the spring plate structure of the present invention;

[0046] Figure 17 This is a schematic diagram of the spring disc structure of the present invention;

[0047] Figure 18 This is a breakdown diagram of the brush assembly of the present invention.

[0048] The meanings of the labels in the diagram are as follows:

[0049] 100. Scanning laser head; 200. Electron microscope;

[0050] 300. Machining disc; 301. Machining port; 310. Motor housing; 330. Linkage ring; 331. Disc guide ring; 3311. Adjustment port; 3312. Adjustment bar; 332. Plate guide ring; 3321. Unloading port; 3322. Guide plate surface; 333. Pulley; 340. Top plate component; 350. Support ring;

[0051] 400. Mainboard mold; 410. Placing plate; 411. Mainboard module; 4111. Spring plate opening; 4112. Guide slope; 412. Spring plate piece; 4121. Arc piece; 420. Pressure plate; 421. Solder pad; 422. Spring plate piece; 4221. Fixing piece; 423. Roller;

[0052] 500. Solder paste applicator; 510. Solder paste holder; 511. Slide groove; 520. Scraper; 521. Slider; 522. Spring; 530. Pressing roller; 531. Refill nozzle; 540. Electric motor; 550. Support frame. Detailed Implementation

[0053] The details of the present invention can be more clearly understood by referring to the accompanying drawings and the description of specific embodiments. However, the specific embodiments of the present invention described herein are for illustrative purposes only and should not be construed as limiting the invention in any way. Under the teachings of this invention, those skilled in the art can conceive of any possible modifications based on the invention, and these should all be considered to fall within the scope of the invention. The terms "installation" and "connection" should be interpreted broadly, referring to direct connection or indirect connection through an intermediate medium.

[0054] The terms "central axis," "vertical," "horizontal," "front," "rear," "upper," "lower," "left," "right," "top," "bottom," "inner," and "outer" used herein to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, in the description of the invention, "a number" means two or more, unless otherwise explicitly specified.

[0055] Please see Figures 1-18 As shown, this invention provides a laser solder paste scanning welding process, including using a scanning laser head 100 to emit a laser beam to solidify the solder paste, and using an electron microscope 200 to inspect the overall solder paste welding process; the ball grid array packaging on the motherboard works by first using a hot air gun to blow solder balls onto the CPU contacts through a ball-mounting board, and then heating it against the motherboard PCB for welding. This method is currently widely used in laptops and integrated motherboards with embedded CPUs; the scanning laser welding process of this invention mainly includes the following steps:

[0056] S1. First, align the electron microscope 200 directly above and in front of the processing tray 300. Then, align the solder paste application assembly 500 directly above and behind the processing tray 300, that is, place the electron microscope 200 and the solder paste application assembly 500 opposite each other in front and behind the processing tray 300. Next, adjust the scanning laser head 100 to the area directly above and to the right of the processing tray 300, that is, between the electron microscope 200 and the solder paste application assembly 500, so that after the solder paste is applied, the scanning laser head 100 can be used to solidify the solder paste and solder it to the motherboard contacts.

[0057] S2. Next, solder paste is squeezed into the solder paste box 510, and the electric motor 540 is started to drive the paste pressing roller 530 to squeeze the solder paste to contact the processing tray 300. The paste pressing roller 530 continuously stirs the solder paste to contact the processing tray 300, thereby realizing the automatic paste application on the motherboard on the processing tray 300.

[0058] S3. The servo motor in the starter motor box 310 drives the processing disk 300 to rotate 60 degrees each time. The servo motor itself has the function of emitting pulses and mainly relies on pulses for positioning. Each time it emits a pulse, it will drive the output shaft to rotate by the angle corresponding to one pulse.

[0059] S4. Then place the motherboard on the mounting plate 410 of the motherboard mold 400, which has been unfolded, in the left area of ​​the processing tray 300.

[0060] S5. As the processing tray 300 rotates in a cycle, before the motherboard moves to the bottom of the solder paste box 510, the pressing plate 420 is guided by the lever 333 and the directional bar 3312 on the left side of the linkage ring 330 and closes with the placing plate 410 to cover the motherboard. Solder paste is brushed onto the fine holes on the top surface of the pressing plate 420 and seeps down, so that the motherboard contacts are coated with solder paste.

[0061] S6. Once the motherboard and motherboard mold 400 from step S5 are rotated to a position below the scanning laser head 100, the laser head is activated to emit a laser beam to solidify the solder paste on the motherboard, thus soldering the solder paste onto the motherboard contacts. After image positioning, the solder paste is directly solidified at the locations where it is present. The laser intensity, spot size, scanning density, and time are determined based on the product and the solder paste. Currently, laser scanning precision is very high, and the laser beam can be made very small. The pads currently required for ball bonding or soldering are only tens of micrometers in size, which fully meets the requirements.

[0062] S7. Before the motherboard to be soldered is moved under the electron microscope 200, the pressure plate 420 is flipped up and opened by the reset force of the spring plate 422, so that the motherboard can be fully inspected.

[0063] S8. When the motherboard after inspection is moved to the unloading port 3321 on the left side of the processing tray 300, the placement plate 410 is flipped open by the reset force of the spring plate 412, and the motherboard inside is pushed out by the top plate 340 and removed, ready to be placed again. There is no need to manually remove it; you can simply put the motherboard in throughout the process.

[0064] S9. When performing step S5, the motherboard can be placed again on the placement plate 410 of the motherboard mold 400 in the left area of ​​the processing plate 300, in order to batch solder the motherboard contacts. In other words, this process makes full use of time and reduces labor intensity.

[0065] The above steps utilize a processing tray 300 with a circular disc structure to hold several motherboards, eliminating the need for manual handling, paste application, and inspection. The top surface of the processing tray 300 has several equally spaced processing openings 301, which penetrate the inner ring wall of the processing tray 300. A motor housing 310 is located below the center of the processing tray 300, housing a servo motor. The output shaft of the servo motor passes through the top center of the motor housing 310 and is coaxially connected to the processing tray 300, driving the processing tray 300 to rotate and transport the motherboards for sequential paste application, welding, inspection, and unloading. This process can then be reused to process other motherboards.

[0066] Specifically, a main board mold 400 is snapped into the processing port 301. The main board mold 400 includes a pressing plate 420 and a placing plate 410 that are pressed together vertically. The ends of the placing plate 410 and the pressing plate 420 facing the inner ring of the processing plate 300 are rotatably connected to the side wall of the processing port 301. The bottom surface of the rotating end of the placing plate 410 is provided with a spring plate 412 that drives it to flip down. The top surface of the rotating end of the pressing plate 420 is provided with a spring plate 422 that drives it to flip up. That is, the placing plate 410 and the pressing plate 420 switch between the mold closing state and the unfolded state.

[0067] Furthermore, such as Figures 12-15 As shown, a linkage ring 330 is fixedly suspended in the inner ring hole of the processing disc 300, that is, the linkage ring 330 is stationary, and the processing disc 300 rotates outside the linkage ring 330; the outer wall of the linkage ring 330 is provided with a disc guide ring 331 for limiting the pressure plate 420 to keep it in a horizontal state and a plate guide ring 332 for limiting the placement plate 410 to keep it in a horizontal state; a support ring 350 is connected directly below the linkage ring 330, and the support ring 350 is tightly sleeved with the top of the motor housing 310, so that the linkage ring 330 is stably suspended.

[0068] A symmetrical adjustment port 3311 is provided on the top surface of the guide ring 331, 60 degrees clockwise from the electron microscope 200, to avoid the pressure plate 420 from switching from a horizontal to a vertical state, that is, to unfold and expose the main board on the placement plate 410; a plate removal port 3321 is provided on the top surface of the guide ring 332, 60 degrees counterclockwise from the electron microscope 200, to avoid the placement plate 410 from flipping down and unfolding; the right end of the adjustment port 3311 on the same side as the removal port 3321 is provided with an adjustment bar 3312 to guide the pressure plate 420 to flip, that is, to switch the pressure plate 420 from a vertical state to a horizontal state, and prepare to close the mold with the placement plate 410 which has been flipped to a horizontal state, and at the same time, the main board can be placed in before closing the mold.

[0069] An inclined top plate 340 is provided directly below the unloading port 3321. When the plate 410 rotates with the processing plate 300 to the unloading port 3321, the plate 410 is bounced down by the spring plate 412, and the main plate inside is pushed out by the top plate 340 and automatically unloaded. The plate guide ring 332 is provided with a guide plate surface 3322 near the unloading port 3321 to guide the bottom surface of the plate 410 to slide with it, so as to ensure that the plate 410 is smoothly flipped up to the horizontal.

[0070] Specifically, such as Figures 7-11 As shown, a motherboard module 411 for placing the motherboard is embedded in the center of the top surface of the mounting plate 410. The motherboard module 411 is detachable and can be used according to the size of the motherboard. A spring plate opening 4111 is opened in the center of the motherboard module 411. A protrusion that fits into the spring plate opening 4111 is vertically provided at the lower end of the top plate 340, so that the motherboard is pushed out by the protrusion.

[0071] A solder pad 421 is embedded in the center of the top surface of the pressure plate 420. The top surface of the solder pad 421 has several through holes for receiving solder paste, allowing the solder paste to contact the contacts on the motherboard through these through holes for soldering and curing. One side of the pressure plate 420 has a protrusion that rotatably connects to the processing port 301, and a roller 423 is fitted around the center of the outer side of the protrusion. Figure 14 and 15 As shown, the outer end of the directional bar 3312 is provided with a push bar 333 for pushing the roller 423 into the directional bar 3312; the push bar 333 is made of PP plastic, which has flexibility and wear resistance; since the pressure plate 420 can rotate at the processing port 301, when the processing disc 300 and the linkage ring 330 rotate relative to each other, the processing port 301 will push the push bar 333 to contact the roller 423 and push it into the directional bar 3312. Therefore, as the processing disc 300 continues to rotate, the roller 423 slides along the directional bar 3312 into the disc guide ring 331, and then the roller 423 and the pressure plate 420 turn into a horizontal state.

[0072] Furthermore, the two inner sides of the spring plate opening 4111 are provided with guide slopes 4112 so that the top plate 340 can slide away from the guide slopes 4112; both the spring plate 412 and the spring disc 422 are made of spring steel in thin sheet structure, wherein one side of the spring plate 412 is integrally formed with an arc plate 4121, and one side of the plate 410 is provided with a protrusion that is rotatably connected to the processing opening 301. The arc plate 4121 is engaged with the protrusion of the plate 410, and both ends of the arc plate 4121 are inserted into the inner wall of the processing opening 301, such as... Figure 16 As shown, the spring plate 412 is in its naturally unfolded state; a fixing piece 4221 is integrally formed on one side of the spring disc 422, the fixing piece 4221 is arranged parallel to the spring disc 422 and is bonded to the inner wall of the processing disc 300, as shown. Figure 17 As shown, the spring plate 422 is in its naturally closed state.

[0073] Specifically, a solder paste application assembly 500 is provided on the processing tray 300 and opposite the electron microscope 200. The solder paste application assembly 500 includes a solder paste container 510 suspended on the top surface of the processing tray 300, a solder paste pressing roller 530 embedded in the solder paste container 510, and an electric motor 540 coaxially connected to the solder paste pressing roller 530. The electric motor 540 is fixedly connected to the outer wall of the solder paste container 510 by bolts. The bottom end of the solder paste container 510 slides in contact with the top surface of the processing tray 300 so that the processing tray 300 is brushed with solder paste from the solder paste container 510 as it passes under the area below the solder paste container 510.

[0074] The solder paste container 510 has openings at the top and bottom and is connected to a support frame 550 at the top for suspending the solder paste container 510; the surface of the solder paste roller 530 has radially opened paste filling ports 531 for leaking solder paste, and the arc surface of the solder paste roller 530 is used to squeeze the solder paste to contact the processing tray 300; the bottom of the solder paste container 510 is fitted with a scraper 520 for scraping off the solder paste on the processing tray 300 to prevent the solder paste from leaving the solder paste container 510 and being wasted.

[0075] Furthermore, the scraper 520 is U-shaped with its opening facing the direction of the directional bar 3312. A groove 511 is provided on the outer side of the solder paste box 510 near the bottom. A slider 521 is attached to the middle of the outer side of the scraper 520 and is movably engaged with the groove 511. The top surface of the slider 521 extends out of the solder paste box 510 and contacts a spring strip 522. The spring strip 522 is V-shaped and its two ends are attached to the outer side of the solder paste box 510. The spring strip 522 applies pressure to the scraper 520 to contact the processing pad 300 so as to automatically scrape solder paste onto the pad 421 of the pressure plate 420.

[0076] It should be noted that the above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A laser solder paste scanning soldering process, comprising using a scanning laser head (100) to emit a laser beam to solidify solder paste, and using an electron microscope (200) to inspect the overall solder paste soldering process, characterized in that: Includes the following steps: S1. First, align the electron microscope (200) directly above and in front of the processing disk (300). Then, align the paste brush assembly (500) directly above and behind the processing disk (300). Next, adjust the scanning laser head (100) to the area directly above and to the right of the processing disk (300). S2. Next, solder paste is squeezed into the solder paste box (510), and the electric motor (540) is started to drive the paste roller (530) to squeeze the solder paste to contact the processing tray (300); S3. Start the servo motor in the motor box (310) to drive the processing disk (300) to rotate 60 degrees each time; S4. Then place the motherboard on the placement plate (410) of the motherboard mold (400) on the left side of the processing tray (300). S5. As the processing tray (300) rotates in a cycle, before the main board moves to the bottom of the solder paste box (510), the pressing plate (420) is guided by the lever (333) and the directional bar (3312) on the left side of the linkage ring (330) and closes with the placing plate (410). The solder paste is brushed onto the fine holes on the top surface of the pressing plate (420) and seeps down, and then the main board contacts are coated with solder paste. S6. When the motherboard and motherboard mold (400) in step S5 are rotated to the underside of the scanning laser head (100), the laser head is activated to emit a laser beam to solidify the solder paste on the motherboard. S7. Before the motherboard to be soldered is placed under the electron microscope (200), the pressure plate (420) is flipped up and opened by the reset force of the spring plate (422), so that the motherboard can be fully inspected. S8. When the motherboard to be inspected is moved to the unloading port (3321) on the left side of the processing tray (300), the placement plate (410) is flipped open by the reset force of the spring plate (412), and the motherboard inside is pushed out by the top plate (340) and removed, so that the motherboard can be placed again. S9. When performing step S5, the motherboard can be placed again on the placement plate (410) of the motherboard mold (400) in the left area of ​​the processing tray (300) and the unfolded motherboard mold (400) for batch soldering of motherboard contacts.

2. The laser solder paste scanning soldering process according to claim 1, characterized in that: The device includes a processing disk (300) with a circular disc structure on which several main boards are placed. Several processing ports (301) are opened in a ring at equal intervals on the top surface of the processing disk (300). The processing ports (301) penetrate the inner ring wall of the processing disk (300). A motor housing (310) is arranged below the center of the processing disk (300). A servo motor is installed in the motor housing (310). The output shaft of the servo motor passes through the top center of the motor housing (310) and is coaxially connected to the processing disk (300).

3. The laser solder paste scanning soldering process according to claim 2, characterized in that: The processing port (301) is fitted with a main board mold (400). The main board mold (400) includes a pressing plate (420) and a placing plate (410) that are pressed together vertically. The ends of the placing plate (410) and the pressing plate (420) facing the inner ring of the processing disk (300) are rotatably connected to the side wall of the processing port (301). The bottom surface of the rotating end of the placing plate (410) is provided with a spring plate (412) that drives it to flip down. The top surface of the rotating end of the pressing plate (420) is provided with a spring plate (422) that drives it to flip up.

4. The laser solder paste scanning soldering process according to claim 3, characterized in that: A linkage ring (330) is fixedly suspended in the inner ring hole of the processing disc (300). The outer wall of the linkage ring (330) is provided with a disc guide ring (331) for limiting the pressure plate (420) to maintain a horizontal state and a plate guide ring (332) for limiting the placement plate (410) to maintain a horizontal state. A reversing port (3311) is symmetrically opened on the top surface of the disc guide ring (331) and on the diagonal line 60 degrees clockwise away from the electron microscope (200). A plate unloading port (3321) is opened on the top surface of the plate guide ring (332) and on the counterclockwise side away from the electron microscope (200). A reversing bar (3312) for guiding the pressure plate (420) to flip is provided at the right end of the reversing port (3311) on the same side as the plate unloading port (3321). An inclined top plate (340) is provided directly below the plate unloading port (3321).

5. The laser solder paste scanning soldering process according to claim 4, characterized in that: A solder paste assembly (500) is provided on the processing tray (300) and opposite to the electron microscope (200). The solder paste assembly (500) includes a solder paste box (510) suspended on the top surface of the processing tray (300), a solder paste roller (530) embedded in the solder paste box (510), and an electric motor (540) coaxially connected to the solder paste roller (530). The bottom end of the solder paste box (510) is in sliding contact with the top surface of the processing tray (300).

6. The laser solder paste scanning soldering process according to claim 5, characterized in that: The top surface of the mounting plate (410) is embedded with a motherboard module (411) for placing the motherboard. The motherboard module (411) has a spring plate opening (4111) in the center. The lower end of the top plate (340) is vertically provided with a protrusion that fits into the spring plate opening (4111). The top surface of the pressure plate (420) is embedded with a solder pad (421). The top surface of the solder pad (421) is provided with several through holes for loading solder paste. One side of the pressure plate (420) is provided with a protrusion that is rotatably connected to the processing port (301). A roller (423) is fitted on the outer center of the protrusion. The outer end of the directional bar (3312) is provided with a lever (333) for pushing the roller (423) into the directional bar (3312).

7. The laser solder paste scanning soldering process according to claim 6, characterized in that: The spring plate opening (4111) has guide slopes (4112) on both inner sides. The spring plate (412) and the spring disc (422) are both made of spring steel and have a thin sheet structure. One side of the spring plate (412) is integrally formed with an arc plate (4121). One side of the placement plate (410) is provided with a protrusion that is rotatably connected to the processing port (301). The arc plate (4121) is engaged with the protrusion of the placement plate (410), and the two ends of the arc plate (4121) are inserted into the inner wall of the processing port (301). One side of the spring disc (422) is integrally formed with a fixing plate (4221). The fixing plate (4221) is arranged parallel to the spring disc (422) and is bonded to the inner wall of the processing disc (300).

8. The laser solder paste scanning soldering process according to claim 7, characterized in that: The solder paste box (510) has openings at the top and bottom and is connected to a support frame (550) at the top. The surface of the paste roller (530) is radially provided with a paste filling port (531). The bottom of the solder paste box (510) is fitted with a scraper (520).

9. The laser solder paste scanning soldering process according to claim 8, characterized in that: The scraper (520) is U-shaped and its opening faces the location of the directional bar (3312). The outer side of the solder paste box (510) and near the bottom is provided with a groove (511). The outer middle of the scraper (520) is bonded with a slider (521) that is movably engaged with the groove (511). The top surface of the slider (521) extending out of the solder paste box (510) contacts a spring strip (522). The spring strip (522) is V-shaped and its two ends are bonded to the outer side of the solder paste box (510).

10. The laser solder paste scanning soldering process according to claim 9, characterized in that: A support ring (350) is connected directly below the linkage ring (330). The support ring (350) is tightly fitted to the top of the motor housing (310). The plate guide ring (332) has a guide plate surface (3322) near the unloading port (3321).

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