Integrated air-cooled PTC heater mechanism

Abstract

The invention discloses an integrated air-cooled PTC heater mechanism, and relates to the technical field of new energy automobile heating systems, and the integrated air-cooled PTC heater mechanism comprises a plastic housing which comprises a lower housing and an upper housing and wraps a PCBA assembly and an IGBT chip assembly at the same time to form a physical integrated structure; the metal radiating fins are embedded in the air inlet side of the plastic shell and are integrally formed with the shell in an injection molding manner; and the glue pouring sealing area is arranged among the PCBA assembly, the IGBT chip assembly and the plastic shell, and the whole machine is sealed through a single glue pouring process. According to the air-cooled PTC controller, an air-cooled PTC controller shell is omitted, a control part and a core body part are integrated together, the space occupied by the air-cooled PTC controller is reduced, meanwhile, IGBT cooling fins are close to an air inlet, heat dissipation of the cooling fins is facilitated, the cooling fins and a plastic shell are integrally produced in an injection molding mode, and the high-voltage wire harness and the low-voltage wire harness are in external wire throwing design, so that the reliability of the air-cooled PTC controller is improved. And a high-voltage connector and a low-voltage connector are omitted, so that the occupied space of the product is further reduced.

Description

Technical Field

[0001] This invention relates to the field of heating system technology for new energy vehicles, specifically an integrated air-cooled PTC heater mechanism. Background Technology

[0002] Current new energy vehicle air conditioning and battery thermal management systems consist of heating and cooling systems. The heating system comprises an air-cooled PTC heater and a water-cooled heater; the air conditioning and battery cooling systems are handled by a compressor-based refrigeration system. The heating of the air conditioning unit is regulated by an air-cooled PTC heater controller, while the battery thermal management system is regulated by a water-cooled heater.

[0003] In existing new energy vehicles, the control part and core part of the air-cooled PTC are designed separately. The controller is designed with an independent control box, and the core is designed with an independent plastic shell. Therefore, the product occupies a large space, which is not conducive to the design layout of various products in the whole vehicle. The existing technical solution uses more materials and has more production processes, resulting in higher production and manufacturing costs. Summary of the Invention

[0004] The purpose of this invention is to integrate the controller and core of an air-cooled PTC. This is achieved by designing the housing structure, heat dissipation fin structure, high-voltage and low-voltage wiring harness structure, temperature sensor structure, shielding layer structure, potting process structure, and core and housing assembly structure. This integrated design of the control and core components results in a smaller footprint, simplified production process, and reduced manufacturing costs.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated air-cooled PTC heater mechanism, comprising: The plastic housing simultaneously encapsulates both the PCBA assembly and the IGBT chip assembly, forming a physically integrated structure. Metal heat dissipation fins are embedded in the air inlet side of the plastic shell and are integrally injection molded with the shell; The potting sealing area, between the PCBA assembly, the IGBT chip assembly and the plastic housing, achieves overall sealing through a single potting process.

[0006] Preferably, the interior of the plastic housing is provided with: PCB mounting slots are used to mount the printed circuit boards of the PCBA assembly; Core fixing ribs are used to lock the IGBT chip assembly into the plastic housing; Furthermore, through the PCB mounting slot and the core fixing rib, the PCBA assembly and the IGBT chip assembly are arranged in a three-dimensional spatial misalignment within the plastic housing.

[0007] Preferably, the plastic housing is further provided with: High-voltage wiring harness assembly, low-voltage wiring harness assembly, and grounding assembly; The plastic housing has a wire harness hole on its side wall, through which the high-voltage wire harness assembly and the low-voltage wire harness assembly directly pass through the plastic housing.

[0008] In the high-voltage harness assembly, the high-voltage harness shielding layer is connected to the metal heat sink fins by screws, and one end of the high-voltage harness is directly soldered to the power terminal of the PCBA assembly. The grounding assembly secures the grounding terminal to the metal heat sink fins with screws. The low-voltage wiring harness assembly has a plug-in design at one end to the PCB end socket, and a wire clamp in the middle to prevent the low-voltage wiring harness from moving.

[0009] Preferably, a terminal and a fixing frame module are provided between the high-voltage wire harness and the connection end of the PCBA assembly. The PCBA assembly terminal is pressed into the frame module. The module is designed with a high-voltage wire harness terminal and a shielding ground layer isolation baffle. The module is designed with a shielding wire terminal mounting base. The module is designed with two screw mounting holes for connection with metal fin screws.

[0010] Preferably, an annular sealing block is provided at the wire harness hole of the plastic housing.

[0011] An annular sealing block is provided at the outlet of the high-voltage wire harness and the low-voltage wire harness, and the gap between the outlet of the high-voltage wire harness and the plastic housing is ≤0.2mm.

[0012] Preferably, the metal heat sink fins include: Fin-shaped heat dissipation teeth perpendicular to the air intake direction, with a tooth spacing of 2-3mm; The anchoring end, embedded in the plastic shell, has an anti-detachment groove on its surface.

[0013] Preferably, the heat dissipation teeth extend 3-5mm to the front end of the air inlet, forming a preferential contact area for airflow. The airflow first passes through the heat dissipation teeth and then flows through the IGBT chip assembly.

[0014] Preferably, the potting sealing area includes: A sealant block is installed at the wire harness outlet to form a physical barrier. The U-shaped potting groove is formed by the inner wall of the plastic shell, and its depth covers the PCB board of the PCBA assembly and the electrode connection area of ​​the IGBT chip assembly.

[0015] Preferably, the inner wall of the plastic shell is fitted or interlayered with a shielding metal film to form an electromagnetic shielding cavity surrounding the PCBA assembly; The shielding metal film includes a lower shielding metal film and an upper shielding metal film, wherein the lower shielding metal film covers the lower shell and the upper shielding metal film covers the upper shell.

[0016] Preferably, it also includes an L-shaped core temperature sensor and a linear IGBT temperature sensor, both of which are directly soldered to the PCB board of the PCBA assembly. The NTC end of the core temperature sensor contacts the core heat sink, and the NTC end of the IGBT temperature sensor is attached to the IGBT heat sink fins.

[0017] Preferably, the core heat sink and IGBT heat sink fins are provided with grooves that match the shape of the NTC end, so as to achieve zero-gap contact between the sensor and the heat sink.

[0018] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, the housing of the air-cooled PTC controller is eliminated, and the control part and the core part are integrated together, reducing the space occupied by the air-cooled PTC. At the same time, in this invention, the IGBT heat sink fins are closer to the air inlet, which is conducive to heat dissipation of the heat sink fins. The heat sink fins and the plastic housing are integrally injection molded. Furthermore, the high-voltage wiring harness and the low-voltage wiring harness are externally wired, eliminating the need for high-voltage connectors and low-voltage connectors, further reducing the space occupied by the product.

[0019] 2. In this invention, the high-voltage wiring harness area and the low-voltage wiring harness area of ​​the shell are designed with adhesive-blocking sealing blocks, the core area is designed with adhesive-blocking sealing gaskets, and the core shell part is designed with a sealing gasket fixing structure. The control part of the product is designed as a closed-around encapsulation concave structure, which can encapsulate the product control part and the core part with AB waterproof glue in one go, achieving the product's IP67 waterproof requirement. This simplifies the multiple encapsulation process for the product's core part and control part, thus reducing the number of encapsulation times and the weight of the encapsulation.

[0020] 3. In this invention, the upper and lower housings of the control unit have a shielding metal film inside their concave structures. The metal film is pasted inside the housing or embedded in the housing interlayer. This structural design helps to reduce the EMC electromagnetic interference of the controller. Compared with the existing controllers with separately designed metal housings and top covers, the weight and space occupied by the technical solution of this invention are negligible, and the manufacturing process is less difficult.

[0021] 4. In this invention, the high-voltage shielding layer is secured to the metal heat sink fins with screws via internal wire routing, or to the outside of the heat sink fins via wire routing. Core grounding is achieved by optimizing the metal heat sink fin structure and designing a screw mounting structure at the contact point with the core, connecting the metal heat sink fins to the core heat sink strips with screws. A grounding terminal screw mounting structure is designed on the outside of the metal heat sink fins to meet the grounding requirements of the high voltage and the core.

[0022] 5. In this invention, the core temperature sensor has an L-shaped structure, and the sensor is inserted and soldered onto the PCB board. The NTC sensor portion directly contacts the core heat sink, enabling core temperature detection through this L-shaped temperature sensor. The IGBT temperature sensor is designed with a straight-line structure, and the sensor is inserted and soldered onto the PCB board. The NTC sensor portion is located near the IGBT heat sink fins, enabling IGBT temperature detection through this straight-line temperature sensor. The L-shaped and straight-line temperature sensors of this invention are soldered onto the PCB board, simplifying the manufacturing process. The NTC sensor directly contacts the core heat sink and IGBT heat sink fins, ensuring stable and reliable temperature detection. Compared to traditional methods that use wired screws for securing the NTC portion and wired connectors on the PCB, this invention simplifies the manufacturing process and improves temperature monitoring stability. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the split structure of an integrated air-cooled PTC heater mechanism according to the present invention; Figure 2 This is a schematic diagram of the external structure of an integrated air-cooled PTC heater mechanism according to the present invention; Figure 3 This is a schematic diagram of the installation structure of the high-voltage wiring harness assembly and the low-voltage wiring harness assembly in an integrated air-cooled PTC heater mechanism of the present invention. Figure 4 This is a schematic diagram of the potting compound structure in an integrated air-cooled PTC heater mechanism according to the present invention; Figure 5 This is a schematic diagram of the ground wire connection structure in an integrated air-cooled PTC heater mechanism according to the present invention; Figure 6 This is a schematic diagram of the shielding metal film in an integrated air-cooled PTC heater mechanism according to the present invention; Figure 7 This is a schematic diagram of the installation structure of the IGBT temperature sensor and the core temperature sensor in an integrated air-cooled PTC heater mechanism of the present invention.

[0024] In the picture: Plastic housing 101, lower housing 1011, upper housing 1012; Metal heat dissipation fins 102, heat dissipation teeth 102a, anchoring end 102b; High voltage wiring harness assembly 103, low voltage wiring harness assembly 104, potting sealant area 105, ground wire assembly 106, skeleton module 107; PCBA assembly 200, PCB mounting slot 201, IGBT temperature sensor 202, core temperature sensor 203; IGBT chip assembly 300, core fixing rib 301, heat dissipation substrate 302; Shielding metal film 400, shielding lower shell metal film 401, shielding upper shell metal film 402; 501, glue-blocking sealing block; 502, U-shaped glue-filling groove; First heat-conducting screw 601, second heat-conducting screw 602, third heat-conducting screw 603. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Example 1, please refer to Figure 1-7 As shown, the present invention provides a technical solution: an integrated air-cooled PTC heater mechanism, comprising: The plastic housing 101 includes a lower housing 1011 and an upper housing 1012, which simultaneously enclose the PCBA assembly 200 and the IGBT chip assembly 300, forming a physical integrated structure.

[0027] Metal heat dissipation fins 102 are embedded in the air inlet side of the plastic housing 101 and are integrally injection molded with the housing.

[0028] The potting sealing area 105, located between the PCBA assembly 200, the IGBT chip assembly 300, and the plastic housing 101, achieves overall sealing through a single potting process.

[0029] In this embodiment, the plastic housing 101 has the following internal features: PCB mounting slot 201 is used to mount the printed circuit board of PCBA assembly 200; The core fixing rib 301 is used to lock the IGBT chip assembly 300 into the plastic housing 101.

[0030] Furthermore, through the PCB mounting slot 201 and the core fixing rib 301, the PCBA assembly 200 and the IGBT chip assembly 300 are arranged in a three-dimensional spatial misalignment within the plastic housing 101.

[0031] An IGBT temperature sensor 202 and a core temperature sensor 203 are respectively installed on the PCB board of PCBA assembly 200.

[0032] Both the IGBT temperature sensor 202 and the core temperature sensor 203 are NTC temperature sensors. The IGBT temperature sensor 202 is a linear structure, through-mounted and soldered onto the PCB board. The NTC sensor portion is designed near the IGBT heatsink fins, enabling temperature monitoring of the IGBT power switch. The core temperature sensor 203 has an L-shaped structure, also through-mounted and soldered onto the PCB board. The NTC sensor portion directly contacts the core (i.e., the PTC heating core) heatsink, enabling core temperature monitoring.

[0033] Meanwhile, the core heat sink and IGBT heat sink fins are equipped with grooves that match the shape of the NTC end, achieving zero-gap contact between the sensor and the heat sink. The L-shaped core temperature sensor 203 has a bending angle of 90°±5°, allowing its NTC end to be inserted into the lateral groove of the core heat sink (2mm deep). The straight length of the I-shaped IGBT temperature sensor 202 matches the height difference of the heat sink fins, ensuring that the NTC end fits against the fin surface without pressure (spacing ≤0.1mm). The two are directly connected to the PCB via solder joints, with impedance fluctuation <1%, and the temperature detection response time shortened to 0.8 seconds.

[0034] In this embodiment, the IGBT temperature sensor 202 and the core temperature sensor 203 are directly soldered to the PCB board, simplifying the manufacturing process. The NTC sensor is in direct contact with the core heat sink and IGBT heat sink fins, ensuring stable and reliable temperature detection. Compared to the traditional method of securing the NTC with screws and installing it with wires in the PCB socket, this invention simplifies the manufacturing process, reduces production costs, and improves temperature detection stability.

[0035] In this embodiment, the plastic housing 101 is further provided with: High-voltage wiring harness assembly 103, low-voltage wiring harness assembly 104 and ground wire assembly 106; The plastic housing 101 has a wire harness hole on its side wall, through which the high voltage wire harness assembly 103 and the low voltage wire harness assembly 104 directly pass out of the plastic housing 101.

[0036] In the high-voltage harness assembly 103, the high-voltage harness shielding layer is connected to the metal heat sink 102 via the first heat-conducting screw 601, and one end of the high-voltage harness is directly soldered to the power terminal of the PCBA assembly 200.

[0037] The grounding assembly 106 secures the grounding terminal to the metal heat sink fins via the second thermally conductive screw 602.

[0038] The contact surface resistance is <10mΩ, meeting the ISO 6469-3:2018 electric vehicle safety standard.

[0039] The low-voltage wiring harness assembly 104 features a socket and plug design at one end to the PCB end, and a wire clamp in the middle to prevent the low-voltage wiring harness from moving.

[0040] In this embodiment, a terminal and fixed frame module 107 is provided between the high voltage harness assembly 103 and the PCBA assembly 200 connection end. The PCBA assembly 200 terminal is pressed into the frame module 107. The module is designed with a high voltage harness terminal and a shielding ground layer isolation baffle. The module is designed with a shielded wire terminal mounting base. The module is designed with two screw mounting holes and metal fin screws for connection.

[0041] In this embodiment, an annular adhesive-blocking sealing block 501 is provided at the wire harness hole of the plastic housing 101.

[0042] An annular sealing block 501 is provided at the outlet of the high voltage wiring harness assembly 103 and the low voltage wiring harness assembly 104, and the gap between the outlet of the high voltage wiring harness assembly and the low voltage wiring harness assembly 104 and the plastic housing 101 is ≤0.2mm.

[0043] In this embodiment, the metal heat sink fins 102 include: The heat dissipation teeth 102a are fin-shaped and perpendicular to the air intake direction, with a tooth spacing of 2-3mm. The anchoring end 102b, which is embedded in the plastic shell, has an anti-detachment groove on its surface.

[0044] The anchoring end 102b of the metal heat sink fin 102 is locked to the heat sink substrate 302 of the IGBT chip assembly 300 by the third thermally conductive screw 603.

[0045] The contact surface between the heat dissipation substrate and the anchoring end 102b is coated with a thermally conductive silicone grease layer with a thermal resistance ≤0.5℃ / W, forming a direct heat conduction path from the IGBT to the heat dissipation fins.

[0046] In this embodiment, the heat dissipation tooth 102a extends to the front end of the air inlet by 3-5mm, forming a preferential contact area for airflow. The airflow first passes through the heat dissipation tooth 102a and then flows through the IGBT chip assembly 300.

[0047] In this embodiment, the glue-sealing area 105 includes: The adhesive-blocking sealing block 501 is installed at the wire harness outlet to form a physical barrier; The U-shaped potting groove 502 is formed by the inner wall of the plastic shell 101 to form a U-shaped groove structure, which deeply covers the PCB board of the PCBA assembly 200 and the electrode connection area of ​​the IGBT chip assembly 300.

[0048] Specifically, special treatment should be applied to the 300 IGBT chip assemblies, with the IGBT pins and PCBA trace areas covered with colloid.

[0049] The potting uses a two-component epoxy resin A:B=3:1 with a viscosity of 500-800cps and a potting volume of 120±10g. After the adhesive fills the U-shaped potting tank 502 and cures, it forms a uniform 3.2mm adhesive layer, achieving IP67 protection.

[0050] In this embodiment, the inner wall of the plastic housing 101 is fitted or interlayered with a shielding metal film 400 to form an electromagnetic shielding cavity surrounding the PCBA assembly 200.

[0051] The shielding metal film 400 includes a lower shielding metal film 401 and an upper shielding metal film 402. The lower shielding metal film 401 covers the lower shell 1011, and the upper shielding metal film 402 covers the upper shell 1012. When the plastic shell 101 is closed, the two form a continuous conductive layer, generating a Faraday cage effect on the PCBA assembly 200. The film thickness is 0.1mm aluminum foil, the surface resistivity is ≤0.1Ω / sq, and the radiation attenuation in the 30-100MHz frequency band is ≥15dB.

[0052] Meanwhile, by filling the gaps in the shielding cavity with colloid, electromagnetic sealing can be enhanced, and the colloid can be used to cover the PCBA board and IGBT electrical components to replace discrete gaskets.

[0053] Example 2: The present invention also provides a heat dissipation-shielding coupling system, which integrates electromagnetic shielding function into heat dissipation fins and utilizes the linkage effect of airflow and electromagnetic field to achieve synergistic improvement of heat dissipation efficiency and electromagnetic compatibility, thereby solving the structural redundancy and performance loss problems caused by the independent heat dissipation and shielding functions in the traditional method.

[0054] Specifically, such as Figure 2 , Figure 6 , Figure 7 As shown, the surface of the metal heat sink fin 102 is laser-etched with an array of microgrooves along the fin extension direction. The microgrooves are 0.1 mm deep, 0.3 mm wide, and 0.5 mm apart. A magnetic nickel layer is electroplated into the grooves using chemical plating, giving the heat sink fins EMI shielding capabilities. The nickel layer attenuates up to 20 dB in the 30-100 MHz frequency band, and the airflow is accelerated by the air guiding design of the heat sink fin extension section, keeping the nickel layer's operating temperature below 150°C and preventing high-temperature demagnetization failure. Compared to the traditional independent heat sink fin + shielding film solution, this improves both heat dissipation efficiency and EMC shielding effectiveness.

[0055] Example 3: This invention provides a potting-sensor linkage system. By adopting a thermally responsive potting material and a sensor self-calibration structure, it solves the problems of difficult sensor maintenance after potting curing and the susceptibility of temperature monitoring accuracy to the shrinkage of the adhesive, thus achieving a dynamic balance between "maintainability" and "monitoring accuracy".

[0056] Specifically, such as Figure 4 , Figure 7 As shown, the U-shaped potting groove 502 is filled with thermoresponsive epoxy resin with a glass transition temperature of 60℃. After curing at room temperature, its hardness is ≥85D, and it softens above 60℃, facilitating localized heating and removal of the resin for IGBT module maintenance. Simultaneously, a miniature thermocouple is embedded in the NTC resistor terminal of the IGBT temperature sensor 202. During the potting curing process, the resin cools and contracts, generating approximately 0.05MPa of pressure, pushing the thermocouple into contact with the NTC resistor and triggering automatic calibration. The calibration data is directly connected to the PCB board for storage via the sensor pins. This design allows for sensor maintenance without damaging the overall potting layer and improves temperature monitoring accuracy.

[0057] Example 4: The present invention provides a wire harness-heat dissipation coupling system. By improving the shielding layer material and connection structure of the high-voltage wire harness, the wire harness is upgraded from a simple signal transmission / shielding component to an active thermal management node, which expands the heat conduction path and reduces system energy consumption.

[0058] Specifically, such as Figure 3 , Figure 5 As shown, the shielding layer of the high-voltage wiring harness assembly uses copper-clad aluminum-magnesium alloy wire, with an outer layer of copper and an inner layer of aluminum-magnesium alloy. It is connected to the grounding terminal of the metal heat sink fins 102 via a crimped terminal. After crimping, the heat generated by the IGBT chip is conducted to the wiring harness shielding layer through the metal heat sink fins 102, further dissipating the chip's heat. Simultaneously, the IGBT temperature sensor 202 monitors the temperature in real time. When the temperature exceeds a preset threshold, the PCB board controls the power module to reduce the wiring harness current, reducing the wiring harness's own heat generation, forming an intelligent closed-loop system of "temperature monitoring - heat dissipation expansion - current regulation," thus reducing the overall system temperature rise.

[0059] Example 5: This invention provides an assembly-sealing pre-linkage system. By pre-embedding adaptive materials in the sealing element and anchoring end, it solves the problems of low precision and yield fluctuation caused by the step-by-step processing of wire harness sealing and shell injection molding, and realizes pre-compensation and self-locking reinforcement in the assembly process.

[0060] In this embodiment, as Figure 1 , Figure 3 As shown, the annular sealing block 501 has a pre-embedded shape memory alloy wire, such as nickel-titanium alloy. During injection molding, the alloy wire shrinks due to heat, causing the sealing block 501 to be pressed against the inner wall of the wire harness hole, automatically compensating and sealing the gap. Simultaneously, the anchoring end 102b and anti-detachment groove of the metal heat dissipation fin 102 are embedded with liquid metal microcapsules, such as indium gallium alloy. The injection pressure causes the microcapsules to rupture, and the liquid metal fills the interface gap between the plastic and the fins, improving the bonding strength. This design changes the assembly process from "post-injection calibration" to "in-injection self-compensation," improving the yield rate.

[0061] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated air-cooled PTC heater mechanism, characterized in that, include: The plastic housing (101) includes a lower housing (1011) and an upper housing (1012), which simultaneously enclose the PCBA assembly (200) and the IGBT chip assembly (300) to form a physical integrated structure; Metal heat dissipation fins (102) are embedded in the air inlet side of the plastic shell (101) and are integrally injection molded with the shell; The potting sealing area (105) is located between the PCBA assembly (200), the IGBT chip assembly (300), and the plastic housing (101), and the entire machine is sealed through a single potting process.

2. The integrated air-cooled PTC heater mechanism according to claim 1, characterized in that: The interior of the plastic housing (101) is provided with: PCB mounting slot (201) for mounting the printed circuit board of the PCBA assembly (200); Core fixing rib (301) is used to lock the IGBT chip assembly (300) into the plastic housing (101); Furthermore, through the PCB mounting slot (201) and the core fixing rib (301), the PCBA assembly (200) and the IGBT chip assembly (300) are arranged in a three-dimensional spatial misalignment within the plastic housing (101).

3. The integrated air-cooled PTC heater mechanism according to claim 1, characterized in that: The plastic housing (101) is also provided with: High voltage wiring harness assembly (103), low voltage wiring harness assembly (104) and ground wire assembly (106); The plastic housing (101) has a wire harness hole on its side wall, through which the high voltage wire harness assembly (103) and the low voltage wire harness assembly (104) directly pass through the plastic housing (101). Among them, the high voltage harness shielding layer of the high voltage harness assembly (103) is connected to the metal heat sink fins (102) by screws, and one end of the high voltage harness is directly soldered to the power terminal of the PCBA assembly (200). The grounding assembly (106) secures the grounding terminal to the metal heat sink fins with screws; One end of the low-voltage wiring harness assembly (104) is connected to the socket plug of the PCBA assembly (200), and a wire clamp is designed in the middle to prevent the low-voltage wiring harness from moving.

4. The integrated air-cooled PTC heater mechanism according to claim 3, characterized in that: A terminal and a frame module (107) are provided between the high voltage wire harness and the connection end of the PCBA assembly (200). The terminal of the PCBA assembly (200) is pressed into the frame module (107). The module is designed with a high voltage wire harness terminal and a shielding ground layer isolation baffle. The module is designed with a shielding wire terminal mounting seat. The module is designed with two screw mounting holes for connection with metal fin screws.

5. The integrated air-cooled PTC heater mechanism according to claim 4, characterized in that: An annular sealant block (501) is provided at the wire harness hole of the plastic housing (101). An annular sealing block (501) is provided at the outlet of the high voltage harness assembly (103) and the low voltage harness, and the gap between the high voltage harness assembly (103) and the outlet of the low voltage harness and the plastic housing (101) is ≤0.2mm.

6. The integrated air-cooled PTC heater mechanism according to claim 1, characterized in that: The metal heat sink fins (102) also have heat dissipation teeth (102a) and anchoring ends (102b). The heat dissipation teeth (102a) are fin-shaped and perpendicular to the air intake direction, with a tooth spacing of 2-3 mm. The anchoring end (102b) is embedded in the plastic shell (101), and the surface is provided with an anti-detachment groove.

7. The integrated air-cooled PTC heater mechanism according to claim 6, characterized in that: The heat dissipation denticle (102a) extends to the front end of the air inlet by 3-5mm, forming a preferential contact area for airflow. The airflow first passes through the heat dissipation denticle (102a) and then flows through the IGBT chip assembly (300) in the airflow path.

8. The integrated air-cooled PTC heater mechanism according to claim 1, characterized in that: The glue-sealing area (105) includes: A sealant block (501) is installed at the wire harness outlet to form a physical barrier; The U-shaped potting groove (502) is formed by the inner wall of the plastic shell (101) to form a U-shaped groove structure, which deeply covers the PCB board of the PCBA assembly (200) and the electrode connection area of ​​the IGBT chip assembly (300).

9. The integrated air-cooled PTC heater mechanism according to claim 6, characterized in that: The inner wall of the plastic housing (101) is fitted or interlayered with a shielding metal film (400) to form an electromagnetic shielding cavity surrounding the PCBA assembly (200). The shielding metal film (400) includes a lower shielding metal film (401) and an upper shielding metal film (402), wherein the lower shielding metal film (401) covers the lower shell (1011) and the upper shielding metal film (402) covers the upper shell (1012).

10. The integrated air-cooled PTC heater mechanism according to claim 6, characterized in that: It also includes an L-shaped core temperature sensor (203) and a line-shaped IGBT temperature sensor (202), both of which are directly soldered to the PCB board of the PCBA assembly (200); The NTC end of the core temperature sensor (203) contacts the core heat sink, and the NTC end of the IGBT temperature sensor (202) is attached to the IGBT heat sink fins. The core heat sink and IGBT heat sink fins are equipped with grooves that match the shape of the NTC end, so as to achieve zero-gap contact between the sensor and the heat sink.

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