Full-temperature-range dynamic temperature monitoring method and device based on combined sensor

Abstract

The invention discloses a full-temperature-range dynamic temperature monitoring method and equipment based on a combined sensor, and relates to the field of temperature monitoring. Comprising the following steps that S1, two side holes are reserved in a side plate of a heating furnace to be subjected to temperature measurement in a penetrating mode, and two five-point thermocouples are inserted into the two side holes in a penetrating mode correspondingly; s2, a top plate of the heating furnace penetrates through the two top holes, the two infrared thermometers penetrate through the two top holes correspondingly, and the two infrared thermometers detect the temperature of the rotating table; s3, the lower computer collects temperature change data of all monitoring points; s4, a temperature standard value is set, and if the temperature of each monitoring point position is within a first temperature error standard, the state is normal; s5, a temperature error value is set, if the temperature error value is larger than the actual error value, the state is normal, and if the temperature error value is smaller than the actual error value, an alarm is given; and S6, if the state in the step S4 and the state in the step S5 are normal, the temperature in the heating furnace meets the production requirement, and therefore the problem that temperature change data of the same position at different time cannot be reflected in real time is solved.

Description

Technical Field

[0001] This invention relates to the field of temperature monitoring, and in particular to a method and device for dynamic temperature monitoring across the entire temperature range based on a combination of sensors. Background Technology

[0002] Chemical vapor deposition (CVD) silicon carbide furnaces are specialized equipment used to prepare silicon carbide materials using CVD technology, playing a crucial supporting role in advanced ceramics, semiconductors, and other fields. As a core process condition for silicon carbide deposition, temperature field uniformity has a vital impact on the density, crystal quality, and performance of silicon carbide products. However, existing methods for monitoring the temperature field of CVD silicon carbide furnaces involve placing a high-temperature temperature-sensing ring, maintaining the temperature for several hours after heating, removing the ring after cooling, and then measuring the ring's change in state with calipers to find the corresponding temperature. This process is complex and prone to errors. Furthermore, the temperature-sensing ring can only represent the highest temperature reached during the entire heating process, failing to provide real-time data on temperature changes at the same location at different times throughout the heating process. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the defect in the prior art that the temperature change data of the same location at different times cannot be reflected in real time, thereby providing a method and device for full-temperature dynamic temperature monitoring based on a combination sensor.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A method for full-temperature-range dynamic temperature monitoring based on a combined sensor includes the following steps: S1, the side plate of the heating furnace to be measured has two through holes, and two five-point thermocouples are inserted into the two side holes respectively. The two five-point thermocouples monitor the real-time temperature of five monitoring points on the inner wall of the heating furnace. S2, the top plate of the heating furnace has two top holes, and two infrared thermometers are inserted into the two top holes respectively, and the two infrared thermometers monitor the temperature of the rotating table; S3, the lower-level computer collects the temperature change data of the ten monitoring points and the temperature change data monitored by the two infrared thermometers, transmits the monitored temperature change data to the upper-level computer for display, and archives the data. S4, set the temperature standard value, the lower computer calculates the temperature of each monitoring point in real time. If the temperature of each monitoring point is within the first temperature standard, the status is normal. If the temperature of each monitoring point is greater than or less than the first temperature standard value, an alarm is issued and the equipment at the corresponding monitoring point is repaired. S5, set the temperature error value. The lower-level machine calculates the actual error value between the maximum and minimum temperatures of each monitoring point in real time. If the temperature error value is greater than the actual error value, the status is normal. If the temperature error value is less than the actual error value, an alarm is issued and the equipment at the corresponding monitoring point is repaired. S6. If both steps S4 and S5 are normal, then the temperature inside the heating furnace meets the production requirements.

[0005] Preferably, in step S1, the two side holes are symmetrically distributed around the central axis of the heating furnace, and the two sets of monitoring points are symmetrically distributed around the central axis of the heating furnace, with each set of monitoring points spaced apart along the axial and circumferential directions of the heating furnace. This allows for the simultaneous capture of temperature changes in at least ten different areas, avoiding data deviations caused by single-point or asymmetrical measurements, and ensuring that the collected temperature data is highly representative and comparable. It can identify subtle temperature gradients and non-uniformities within the furnace, providing solid and reliable data support for the lower-level computer to calculate temperature errors in real time and quickly locate fault areas, thus ensuring the uniformity of the temperature field within the furnace.

[0006] Preferably, the central angles between two adjacent monitoring points are the same along the circumference of the heating furnace, and the distances between two adjacent monitoring points are the same along the axial direction of the heating furnace. This layout ensures that the temperature sampling points have mathematical uniformity and consistency in spatial distribution, thereby ensuring that the temperature data collected by the lower-level computer can reflect the objective state of the entire temperature field most accurately and without distortion. The lower-level computer calculates the actual error value between the highest and lowest temperatures at each monitoring point in real time, avoiding the problem of local temperature changes being over-amplified or ignored due to inconsistent spacing between monitoring points.

[0007] Preferably, in step S2, the two top holes are symmetrically distributed with the center line of the top of the heating furnace as the center, and the two infrared thermometers emit infrared rays toward the rotating platform; the two infrared thermometers are symmetrically installed above the rotating platform, enabling simultaneous monitoring of the temperature at two symmetrical positions on the rotating platform. Since the rotating platform rotates continuously during the process, thermocouples cannot be fixed to the rotating platform, therefore infrared thermometers are selected to monitor the temperature of the rotating platform.

[0008] Preferably, in steps S4 and S5, the equipment is repaired, and the heater is checked for malfunction, the insulation felt is checked for failure, and the heating furnace is checked for air leakage; problems affecting the temperature inside the heating furnace are quickly identified.

[0009] Preferably, if the equipment is repaired twice or more, and the heating furnace experiences a third instance where the actual error value is greater than the temperature error value, or the temperature at each monitoring point is greater than or less than the first temperature standard value for the third time, then the temperature inside the heating furnace does not meet the production requirements; ensuring that the products processed inside the heating furnace meet the production requirements.

[0010] Preferably, in step S1, the two five-point thermocouples are respectively connected to the lower electromechanical unit to eliminate the influence of thermocouple cold junction temperature fluctuations on the measurement results.

[0011] In step S2, the two infrared thermometers are respectively connected to the lower-level machine to prevent signal interference from causing temperature fluctuations.

[0012] In step S3, the lower-level machine is electrically connected to the upper-level machine; the processed temperature change data is transmitted from the lower-level machine to the upper-level machine and displayed on the upper-level machine.

[0013] A full-temperature-range dynamic temperature monitoring device based on a combination of sensors, comprising: The side plate has two symmetrical side holes. A top plate, which is fixed to one end of the side plate along its axial direction, and two top holes are symmetrically provided on the top plate; A rotating platform is located at the other end of the side plate along its axial direction.

[0014] Preferably, the full-temperature-range dynamic temperature monitoring device further includes two five-point thermocouples and two infrared thermometers. The two five-point thermocouples are respectively inserted through the two side holes, and the two infrared thermometers are respectively inserted through the two top holes. By using the two five-point thermocouples and the two infrared thermometers in combination, the two contact and non-contact sensing methods are integrated into a compact frame, forming a temperature monitoring system with a reasonable layout and complementary functions.

[0015] Preferably, the full-temperature-range dynamic temperature monitoring device further includes a host computer and a slave computer. The two five-point thermocouples are electrically connected to the slave computer, the two infrared thermometers are electrically connected to the slave computer, and the slave computer is electrically connected to the host computer. The temperature changes monitored by the five-point thermocouples and infrared thermometers are transmitted to the slave computer, which calculates and processes the temperature changes and transmits them to the host computer for display.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: The aforementioned technical solution provides a full-temperature-range dynamic temperature monitoring method based on combined sensors, achieving real-time monitoring of the heating furnace temperature field across the entire temperature range. This method overcomes the fundamental deficiency of traditional temperature measurement loops, which can only reflect historical maximum temperatures and cannot track dynamic changes in the temperature field in real time. By innovatively combining two five-point thermocouples and two infrared thermometers, it synchronously and in real-time collects temperature data at more than ten points inside the furnace from two key dimensions: the furnace wall and the rotating platform, constructing a three-dimensional dynamic monitoring network covering the entire temperature range and multiple fixed points. The lower-level computer calculates the temperature at each monitoring point and the temperature error between monitoring points in real time. Once the temperature exceeds a preset threshold, an alarm is immediately triggered, and the fault source can be quickly located based on the distribution of monitoring points, such as heater failure, insulation felt failure, or furnace leakage. This achieves a shift from passive post-event detection to active process control, effectively ensuring the uniformity of the temperature field inside the furnace and solving the problem that temperature changes at the same location at different times cannot be reflected in real time. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 An exploded view of a full-temperature-range dynamic temperature monitoring device based on a combined sensor provided in an embodiment of the present invention; Figure 2 This is a top view of the heating furnace provided in an embodiment of the present invention; Figure 3 for Figure 2 A sectional view of the provided heating furnace; Figure 4 This is a schematic diagram of a full-temperature-range dynamic temperature monitoring device based on a combined sensor provided in an embodiment of the present invention; Figure 5 This is a side view of a heating furnace provided in an embodiment of the present invention.

[0019] Explanation of reference numerals in the attached figures: 1. Heating furnace; 11. Side plate; 111. Side hole; 12. Top plate; 121. Top hole; 13. Rotary table; 2. Five-point thermocouple; 3. Infrared thermometer; 4. Compensating wire; 5. Anti-interference wire; 6. Communication line; 7. Host computer; 8. Sub-computer; 9. Monitoring point. Detailed Implementation

[0020] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Please read carefully. Figures 1 to 5 A method for dynamic temperature monitoring across the entire temperature range based on a combined sensor includes the following steps: S1, the side plate 11 of the heating furnace 1 to be measured has two through holes 111, and two five-point thermocouples 2 are inserted through the two side holes 111 respectively. The two five-point thermocouples 2 monitor the real-time temperature of five monitoring points 9 on the inner wall of the heating furnace 1. S2, the top plate 12 of the heating furnace 1 passes through two top holes 121, and two infrared thermometers 3 are inserted into the two top holes 121 respectively, and the two infrared thermometers 3 monitor the temperature of the rotating table 13. S3, the lower computer 8 collects temperature change data from ten monitoring points 9 and temperature change data from two infrared thermometers 3, transmits the monitored temperature change data to the upper computer 7 for display, and archives the data. S4, set the first temperature standard value, the lower computer 8 calculates the temperature of each monitoring point 9 in real time. If the temperature of each monitoring point 9 is within the first temperature standard value, the status is normal. If the temperature of each monitoring point 9 is greater than or less than the first temperature standard value, an alarm is issued and the equipment at the corresponding monitoring point 9 is repaired. S5, set the temperature error value, the lower computer 8 calculates the actual error value between the maximum and minimum temperature of each monitoring point 9 in real time. If the temperature error value is greater than the actual error value, the status is normal. If the temperature error value is less than the actual error value, an alarm is issued and the equipment at the corresponding monitoring point 9 is repaired. S6. If the conditions in steps S4 and S5 are normal, then the temperature inside the heating furnace meets the production requirements.

[0024] The five-point thermocouple 2 is a composite temperature sensor integrating five thermocouples into one unit. Its working principle is based on the thermoelectric effect. Specifically, it consists of two conductors or semiconductors of different compositions connected to form a closed loop. When a temperature difference exists between the two connection points (the measuring end and the reference end), an electromotive force (EMF) is generated in the loop. The magnitude of this EMF is related to the temperatures of the two conductors and the two connection points. By measuring this EMF, the temperature of the measuring end can be calculated. The infrared thermometer 3 receives infrared radiation emitted by the target, converts it into an electrical signal by a detector, and then uses a signal processing system to calculate the temperature using the blackbody radiation law, achieving non-contact temperature measurement. This equipment can be used to monitor real-time dynamic temperature changes in a chemical vapor deposition silicon carbide furnace, and can also be used for real-time dynamic temperature changes in other heating furnaces 1.

[0025] Two five-point thermocouples 2 pass through two side holes 111 of the heating furnace 1 and are distributed in ten areas of the side plate 11. Two infrared thermometers 3 are each inserted through two top holes 121. The top plate 12 is positioned opposite the rotating platform 13. The two infrared thermometers 3 monitor the temperature of the rotating platform 13. The combined sensors enable real-time monitoring of the temperature in at least twelve different areas within the heating furnace 1. Furthermore, the diameter of the heating furnace 1 is larger than the diameter of the rotating platform 13. The lower-level computer 8 can be a programmable logic controller (PLC) or other controllers or systems with programming, calculation, and recording capabilities. The upper-level computer 7 can be a touchscreen with display functionality. The lower-level computer 8 collects and processes the temperature changes of the two five-point thermocouples 2 and the two infrared thermometers 3. The lower-level computer 8 transmits the processed temperature change data to the upper-level computer 7 for display. The upper-level computer 7 can display the temperature changes of all monitoring points 9 and highlight the monitoring points 9 with the highest and lowest temperatures.

[0026] If the first temperature standard is set to 1000℃, with an allowable error range of ±50℃, the lower-level machine 8 calculates the temperature of each monitoring point 9 in real time. If the temperature of each monitoring point 9 is within the first temperature standard, the status is normal. If the temperature of each monitoring point 9 is greater than or less than the first temperature standard, an alarm is issued, and the equipment at the corresponding monitoring point 9 is repaired. If the temperature error is set to 10℃, the lower-level machine 8 calculates the actual error between the highest and lowest temperatures of each monitoring point 9 in real time. If the temperature error is greater than the actual error, the status is normal. If the temperature error is less than the actual error, an alarm is issued, and the equipment is repaired. Before repairing the equipment, the following three aspects should be checked: First, check if the heater is faulty; if the heater is faulty, the temperature in the corresponding area will change. Second, check if the insulation felt is ineffective; if the insulation felt is ineffective, it will cause temperature loss inside the heating furnace 1. Third, check if the heating furnace 1 is leaking air; leaks will allow a large amount of air to enter, affecting the temperature uniformity inside the heating furnace 1. In addition, the number of times the equipment is repaired also needs to be specified. If the number of times the equipment is repaired is greater than or equal to two, and the actual error value of the heating furnace 1 is greater than the temperature error value for the third time, or the temperature of each monitoring point 9 is greater than or less than the first temperature standard value for the third time, then the temperature inside the heating furnace 1 does not meet the production requirements.

[0027] In step S1, the two side holes 111 are symmetrically distributed around the central axis of the heating furnace 1, ensuring that the two five-point thermocouples 2 can be evenly arranged after entering the furnace, laying the foundation for full-area coverage. The two five-point thermocouples 2 can be fixed inside the heating furnace 1 with graphite ropes. The two sets of monitoring points 9 are symmetrically distributed around the central axis of the heating furnace 1. The two sets of monitoring points 9 can monitor the temperature changes of at least ten different areas, and the monitoring points 9 of each set are distributed at intervals along the axial and circumferential directions of the heating furnace 1, constructing a three-dimensional temperature monitoring network. It can simultaneously capture the temperature changes of at least ten different areas, not only avoiding data deviations caused by single-point or asymmetrical measurements, but also making the collected temperature data representative and comparable. It can identify subtle temperature gradients and non-uniformities inside the heating furnace 1, providing solid and reliable data support for the lower-level computer 8 to calculate temperature errors in real time and quickly locate fault areas, ensuring the uniformity of the temperature field inside the heating furnace 1.

[0028] Along the circumference of the heating furnace 1, the central angle between any two adjacent monitoring points 9 is the same, and along the axial direction of the heating furnace 1, the distance between any two adjacent monitoring points 9 is the same. This layout ensures that the temperature sampling points have mathematical uniformity and consistency in spatial distribution, thereby ensuring that the temperature data collected by the lower-level computer 8 can reflect the objective state of the entire temperature field most accurately and without distortion. The lower-level computer 8 calculates the actual error value between the highest and lowest temperatures of each monitoring point 9 in real time, avoiding the problem of excessive amplification or neglect of local temperature changes caused by inconsistent point spacing. This precise gridded monitoring provides data support for establishing a temperature field distribution model, realizing fine-tuning of process parameters, and setting scientific alarm thresholds, thereby improving the scientific nature and reliability of temperature monitoring.

[0029] In step S2, two top holes 121 are symmetrically distributed around the center line of the top of the heating furnace 1. Infrared rays emitted by two infrared thermometers 3 are projected vertically downwards onto the rotating platform 13. The two infrared thermometers 3 are symmetrically mounted above the rotating platform 13, enabling simultaneous monitoring of the temperature at two symmetrical positions on the platform. Since the rotating platform 13 rotates continuously during the process, thermocouples cannot be fixed to it; therefore, infrared thermometers 3 are used to monitor its temperature. While thermocouples primarily monitor the static temperature field of the furnace wall, infrared thermometers 3 focus on the dynamic surface of the rotating platform 13. As a key component supporting the substrate, the temperature of the rotating platform 13 directly affects the uniformity of the vapor deposition process and the final product quality. By monitoring its temperature changes in real time, process engineers can gain a more comprehensive understanding of the dynamic balance of heat exchange within the furnace, providing crucial data support for optimizing process parameters and ensuring the density and consistency of silicon carbide products.

[0030] In step S1, the two five-point thermocouples 2 can be connected to the lower-level computer 8 using compensating wires 4. The temperature measurement principle of the thermocouple is based on the temperature difference between the measuring end and the reference end. The compensating wires 4 are made of a special alloy that matches the thermoelectric characteristics of the thermocouple. Their function is to extend the reference end of the thermocouple from near the high-temperature furnace wall to the lower-level computer 8 terminal where the ambient temperature is relatively stable. This effectively eliminates the measurement error introduced by the temperature fluctuation of the reference end, which is an industry standard practice to ensure the accuracy of thermocouple measurement and ensures that the original signal received by the lower-level computer 8 can accurately reflect the true temperature of the measuring end.

[0031] In step S2, the two infrared thermometers 3 can be connected to the lower-level computer 8 using anti-interference wires 5. The infrared thermometers 3 typically output weak millivolt or milliampere-level current signals, which are highly susceptible to electromagnetic interference generated by the start-up and shutdown of the high-power heating furnace 1. The anti-interference wires 5 are usually twisted-pair or shielded cables. Their principle is to cancel magnetic field induction through twisting and to bypass capacitive coupling noise through grounding of the shielding layer, thereby effectively suppressing crosstalk from external electromagnetic waves. This ensures stable transmission of the infrared temperature measurement signal and prevents temperature reading jumps and false alarms caused by signal fluctuations.

[0032] In step S3, the lower-level computer 8 and the upper-level computer 7 can be connected via communication line 6. The lower-level computer 8 is responsible for high-speed, real-time acquisition, processing, and calculation of the temperature of all monitoring points 9 at the front end, and transmits the processed results to the upper-level computer 7 through a standardized digital communication protocol. Digital signals have strong anti-interference capabilities during transmission, and have high transmission rates and long distances, ensuring that the lower-level computer 8 can focus on stable and reliable real-time control, while allowing the upper-level computer 7 to focus on human-computer interaction, data visualization, and archiving, thus achieving efficient, stable, and intelligent operation of the entire monitoring system.

[0033] A dynamic temperature monitoring device for the entire temperature range based on a combination of sensors includes: a side plate 11, a top plate 12, and a rotating table 13. Specifically, the side plate 11 has at least two symmetrical side holes 111, and two five-point thermocouples 2 are respectively inserted through the two side holes 111 to achieve contact monitoring of the temperature of multiple points on the inner wall of the heating furnace 1. The two five-point thermocouples 2 can be connected to the lower computer 8 through compensating wires 4 to ensure the accuracy of signal transmission. The top plate 12 is fixed to one end of the side plate 11 in the axial direction, and the top plate 12 has at least two symmetrical top holes 121, and two infrared thermometers 3 are respectively inserted through the two top holes 121 to achieve non-contact temperature monitoring of the rotating platform 13 below. The two infrared thermometers 3 can be connected to the lower computer 8 through anti-interference wires 5, and the lower computer 8 can be connected to the upper computer 7 through communication lines 6 to ensure signal stability in complex electromagnetic environments. The rotating platform 13 is located at the other end of the side plate 11 in the axial direction, and the rotating platform 13 is at least partially located inside the heating furnace 1. As a key component that carries the workpiece to be processed, its temperature is one of the important monitoring objects of this monitoring system. This device integrates both contact and non-contact sensing methods into a compact framework, forming a well-structured and functionally complementary temperature monitoring system.

[0034] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A method for full-temperature-range dynamic temperature monitoring based on a combined sensor, characterized in that, Includes the following steps: S1, the side plate (11) of the heating furnace (1) to be measured has two through holes (111), and two five-point thermocouples (2) are inserted into the two side holes (111). The two five-point thermocouples (2) monitor the real-time temperature of five monitoring points (9) on the inner wall of the heating furnace (1). S2, the top plate (12) of the heating furnace (1) has two top holes (121) through it, and two infrared thermometers (3) are inserted into the two top holes (121) respectively. The two infrared thermometers (3) monitor the temperature of the rotating table (13); S3, the lower computer (8) collects the temperature change data of the ten monitoring points (9) and the temperature change data monitored by the two infrared thermometers (3), transmits the monitored temperature change data to the upper computer (7) for display, and archives the data. S4, set the first temperature standard value, the lower computer (8) calculates the temperature of each monitoring point (9) in real time. If the temperature of each monitoring point (9) is within the first temperature standard, the status is normal. If the temperature of each monitoring point (9) is greater than or less than the first temperature standard value, an alarm is issued and the equipment of the corresponding monitoring point (9) is repaired. S5, set the temperature error value, the lower computer (8) calculates the actual error value between the maximum temperature and the minimum temperature of each monitoring point (9) in real time. If the temperature error value is greater than the actual error value, the status is normal. If the temperature error value is less than the actual error value, an alarm is issued and the equipment at the corresponding monitoring point (9) is repaired. S6. If the conditions in steps S4 and S5 are normal, then the temperature inside the heating furnace (1) meets the production requirements.

2. The full-temperature-range dynamic temperature monitoring method according to claim 1, characterized in that, In step S1, the two side holes (111) are symmetrically distributed with the central axis of the heating furnace (1) as the center, and the two sets of monitoring points (9) are symmetrically distributed with the central axis of the heating furnace (1) as the center, and the monitoring points (9) of each set are distributed at intervals along the axial and circumferential directions of the heating furnace (1).

3. The full-temperature-range dynamic temperature monitoring method according to claim 2, characterized in that, Along the circumference of the heating furnace (1), the central angle between two adjacent monitoring points (9) is the same, and along the axial direction of the heating furnace (1), the distance between two adjacent monitoring points (9) is the same.

4. The full-temperature-range dynamic temperature monitoring method according to claim 1, characterized in that, In step S2, the two top holes (121) are symmetrically distributed with the center line of the top of the heating furnace (1) as the center, and the two infrared thermometers (3) emit infrared rays toward the rotating table (13).

5. The full-temperature-range dynamic temperature monitoring method according to claim 1, characterized in that, In steps S4 and S5, the equipment is repaired, and the heater is checked for malfunction, the insulation felt is checked for failure, and the heating furnace (1) is checked for air leakage.

6. The full-temperature-range dynamic temperature monitoring method according to claim 5, characterized in that, If the equipment is repaired twice or more, and the actual error value in the heating furnace (1) is greater than the temperature error value for the third time, or the temperature of each monitoring point (9) is greater than or less than the first temperature standard value for the third time, then the temperature in the heating furnace (1) does not meet the production requirements.

7. The full-temperature-range dynamic temperature monitoring method according to claim 1, characterized in that, In step S1, the two five-point thermocouples (2) are electrically connected to the lower-level machine (8) respectively; In step S2, the two infrared thermometers (3) are electrically connected to the lower-level machine (8) respectively; In step S3, the lower-level machine (8) is electrically connected to the upper-level machine (7).

8. A full-temperature-range dynamic temperature monitoring device based on a combined sensor, employing the full-temperature-range dynamic temperature monitoring method based on a combined sensor as described in any one of claims 1-7, characterized in that, include: Side plate (11), on which two side holes (111) are symmetrically provided. Top plate (12), the top plate (12) is fixed to one end of the side plate (11) in the axial direction, and two top holes (121) are symmetrically provided on the top plate (12). A rotating platform (13) is located at the other end of the side plate (11) along its axial direction.

9. The full-temperature-range dynamic temperature monitoring device according to claim 8, the full-temperature-range dynamic temperature monitoring device further includes two five-point thermocouples (2) and two infrared thermometers (3), the two five-point thermocouples (2) are respectively inserted through the two side holes (111), and the two infrared thermometers (3) are respectively inserted through the two top holes (121).

10. The full-temperature-range dynamic temperature monitoring device according to claim 8, wherein the full-temperature-range dynamic temperature monitoring device further includes a host computer (7) and a slave computer (8), the two five-point thermocouples (2) are electrically connected to the slave computer (8) respectively, the two infrared thermometers (3) are electrically connected to the slave computer (8), and the slave computer (8) is electrically connected to the host computer (7).

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